CN113173284A - Management method of semi-finished target backboard - Google Patents
Management method of semi-finished target backboard Download PDFInfo
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- CN113173284A CN113173284A CN202110453035.0A CN202110453035A CN113173284A CN 113173284 A CN113173284 A CN 113173284A CN 202110453035 A CN202110453035 A CN 202110453035A CN 113173284 A CN113173284 A CN 113173284A
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- semi
- finished target
- finished
- drying
- backing plate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B57/00—Automatic control, checking, warning, or safety devices
- B65B57/10—Automatic control, checking, warning, or safety devices responsive to absence, presence, abnormal feed, or misplacement of articles or materials to be packaged
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B31/00—Packaging articles or materials under special atmospheric or gaseous conditions; Adding propellants to aerosol containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B63/00—Auxiliary devices, not otherwise provided for, for operating on articles or materials to be packaged
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B63/00—Auxiliary devices, not otherwise provided for, for operating on articles or materials to be packaged
- B65B63/005—Auxiliary devices, not otherwise provided for, for operating on articles or materials to be packaged for marking or coding articles prior to packaging
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention provides a management method of a semi-finished target backboard, which comprises the following steps: testing the conductivity of the semi-finished target backing plate, and comparing the conductivity with the components of the check ticket; after the comparison is correct, the product number is engraved on the semi-finished target backboard; and sequentially cleaning, drying and packaging the semi-finished target backing plate. The management method can avoid the hidden danger of confusion of the semi-finished target backing plate in the production process and ensure the product quality, is efficient and simple, and does not need to adjust the existing production process.
Description
Technical Field
The invention belongs to the field of target manufacturing, and relates to a management method of a semi-finished target backboard.
Background
Sputtering Target Back Plate (BP): metal sputtering targets are materials used as cathodes in sputter deposition techniques. The cathode material is separated from the cathode in the form of molecules, atoms or ions under the impact of positive charged cations in a sputtering machine and is redeposited on the surface of the anode. Since the metal sputtering target is usually a relatively expensive material such as high-purity aluminum, copper, titanium, nickel, tantalum, and noble metal, a relatively common material is often used as the backing plate in the manufacturing process. The back plate has the functions of supporting the target material, cooling, reducing the cost and the like, and common materials comprise aluminum Alloy (ALBP), copper alloy (CUBP) and the like. In the prior art, the target backing plate has very high requirements on the characteristics of metal materials in the using and mounting processes, products are scrapped when the components of the backing plate and Blank matched welding materials do not meet the requirements before hot isostatic pressing welding, and the target has risks in the using performance and quality of shipment.
CN102203314A discloses a method for storing a target containing a rare earth metal or an oxide thereof, which comprises introducing the same rare earth metal oxide as that of the target containing a rare earth metal or an oxide thereof to be stored as a desiccant into a container or a film-like packing for storing the target, and sealing and storing the container or the film-like packing. The preservation method is designed for a target containing a rare earth metal or an oxide thereof, and provides a technique for suppressing pulverization due to oxidation and hydrogen oxidation of the target caused by air intrusion, thereby enabling long-term preservation.
CN102424134A discloses a vacuum packaging method of target material, comprising: filling the target material into a packaging bag, and vacuumizing the packaging bag for the first time; filling inert gas into the packaging bag; carrying out secondary vacuum pumping on the packaging bag; and sealing the packaging bag. When the first vacuumizing, the second vacuumizing or the inert gas filling is carried out, the opening of the packaging bag is pressed by the pressing plate, and only a hole with the diameter of 2-3 mm is reserved so that an air valve for vacuumizing or inflating can be just inserted conveniently. When the first vacuumizing and the inert gas filling or the inert gas filling and the second vacuumizing are switched, the air valve is closed, so that the packaging bag is sealed. The method can ensure that air which is easy to cause the target material to rust or the surface to be oxidized does not exist in the packaging bag.
However, the prior art has been provided with a method for storing and packaging the target and the backing plate, but a method for reasonably and efficiently managing the target and the backing plate is still lacking.
Disclosure of Invention
In order to solve the technical problems in the prior art, the invention provides a management method of a semi-finished target backboard, which can avoid the hidden danger of confusion of the semi-finished target backboard in the production process and ensure the product quality, is efficient and simple, and does not need to adjust the existing production process.
In order to achieve the technical effect, the invention adopts the following technical scheme:
the invention provides a management method of a semi-finished target backboard, which comprises the following steps:
testing the conductivity of the semi-finished target backing plate, and comparing the conductivity with the components of the check ticket;
after the comparison is correct, the product number is engraved on the semi-finished target backboard;
and sequentially cleaning, drying and packaging the semi-finished target backing plate.
In the invention, aiming at the problems of wrong sticking, confusion or loss of the check and shift ticket, wrong marking of components in the check and shift ticket and falling of a product label which may occur in the production process, before the semi-finished target backboard is packaged, the conductivity of the semi-finished target backboard is detected to confirm the consistency of the target and the check and shift ticket data, and ensure the accuracy of the product number and the components. Meanwhile, the product number is engraved on the semi-finished target backboard to replace a traditional product label, so that the influence of label falling on the production low power is avoided while the subsequent processing of the semi-finished target backboard is not influenced.
As a preferred technical solution of the present invention, the check ticket records the product number and the components of the semi-finished target backing plate.
As a preferred embodiment of the present invention, the method for comparing includes: and comparing the measured conductivity data of the semi-finished target backing plate with the product number and the theoretical conductivity of the components.
In the invention, each product number corresponds to an independent product component in the target production process, so the physical and chemical properties of the product of each product number are fixed, and the conductivity is selected as the detection standard because the conductivity detection method is simple and convenient, has high accuracy and can quickly finish the correspondence of the product and the number. Such as density, quality, mechanical strength, and color, can also be used as a secondary certificate for product number confirmation.
As a preferred technical solution of the present invention, the product number is engraved on an edge of the semi-finished target backing plate.
As a preferable embodiment of the present invention, the cleaning is ultrasonic cleaning.
Preferably, the welding surface of the semi-finished target backing plate faces the ultrasonic equipment during the ultrasonic cleaning.
Preferably, the ultrasonic cleaning time is not less than 10min, such as 15min, 20min, 30min, 45min, 60min, 75min or 90min, but not limited to the recited values, and other values not recited in the range of values are also applicable.
As a preferred technical scheme of the present invention, the semi-finished target backing plate is dried by blowing after the ultrasonic cleaning.
Preferably, the blow-drying sequentially blows the back face, the edge face and the welding face of the semi-finished target back plate.
In a preferred embodiment of the present invention, the drying temperature is 68 to 72 ℃, for example, 68.5 ℃, 69 ℃, 69.5 ℃, 70 ℃, 70.5 ℃, 71 ℃ or 71.5 ℃, but the drying temperature is not limited to the recited values, and other values not recited in the range of the recited values are also applicable.
Preferably, the drying pressure is-0.09 MPa to 0.1MPa, such as-0.08 MPa, -0.06MPa, -0.05MPa, -0.02MPa, -0.01MPa, 0MPa, 0.02MPa, 0.05MPa or 0.08MPa, but not limited to the recited values, and other values not recited in the range of values are equally applicable.
Preferably, the drying time is not less than 60min, such as 65min, 75min, 90min, 105min, 120min, etc., but is not limited to the recited values, and other values not recited within the range of values are equally applicable.
As a preferred embodiment of the present invention, the package comprises at least two layers of packaging films.
Preferably, a desiccant is provided inside the package.
Preferably, the number of times of filling the inside of the package with argon is not less than 3 times.
As a preferred technical scheme of the invention, the semi-finished target back plate is a target subjected to finish machining.
As a preferred technical scheme of the invention, the method comprises the following steps:
testing the conductivity of the finished semi-finished target backboard, and comparing the measured conductivity data of the semi-finished target backboard with the product number and the theoretical conductivity of the components according to the product number and the components of the semi-finished target backboard recorded by the check ticket;
after the comparison is correct, the product number is engraved on the edge of the semi-finished target backboard;
sequentially carrying out ultrasonic cleaning, drying and packaging on the semi-finished target backboard;
the welding surface of the semi-finished target backboard faces to ultrasonic equipment during ultrasonic cleaning, and the time is not less than 10 min; drying the semi-finished target backboard after ultrasonic cleaning, and sequentially drying the back surface, the edge surface and the welding surface of the semi-finished target backboard;
the drying temperature is 68-72 ℃, the pressure is-0.09-0.1 MPa, and the time is not less than 60 min;
the package comprises at least two layers of packaging films, a drying agent is arranged inside the package, and the number of times of filling argon into the package is not less than 3 times.
Compared with the prior art, the invention has at least the following beneficial effects:
the invention provides a management method of a semi-finished target backboard, which can avoid the hidden danger of confusion of the semi-finished target backboard in the production process and ensure the product quality, is efficient and simple, and does not need to adjust the existing production process.
Drawings
Fig. 1 is a schematic flow chart of a management method of a semi-finished target backing plate according to the present invention.
The present invention is described in further detail below. The following examples are merely illustrative of the present invention and do not represent or limit the scope of the claims, which are defined by the claims.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
To better illustrate the invention and to facilitate the understanding of the technical solutions thereof, typical but non-limiting examples of the invention are as follows:
example 1
The present embodiment provides a method for managing a semi-finished target backing plate, a flow of which is shown in fig. 1, the method including:
testing the conductivity of the finished semi-finished target backing plate to obtain the conductivity of 14.8ms/m, and comparing the measured conductivity data of the semi-finished target backing plate with the product number and the theoretical conductivity of the components according to the product number and the components of the semi-finished target backing plate recorded by the check ticket to confirm that the product number is C46300;
after the comparison is correct, the product number C46300 is engraved on the edge of the semi-finished target back plate;
sequentially carrying out ultrasonic cleaning, drying and packaging on the semi-finished target backboard;
during ultrasonic cleaning, the welding surface of the semi-finished target backboard faces to ultrasonic equipment for 15 min; drying the semi-finished target backboard after ultrasonic cleaning, and sequentially drying the back surface, the edge surface and the welding surface of the semi-finished target backboard;
the drying temperature is 68 ℃, the pressure is-0.09 MPa, and the drying time is 60 min;
the package includes two layers of packaging films, the inside drier that is provided with of package, the number of times of filling argon gas inside the package is 3.
Example 2
The embodiment provides a management method of a semi-finished target backing plate, which includes:
testing the conductivity of the finished semi-finished target back plate to obtain the conductivity of 47.2ms/m, comparing the measured conductivity data of the semi-finished target back plate with the product number and the theoretical conductivity of the components according to the product number and the components of the semi-finished target back plate recorded by the check ticket, and confirming that the product number is C181500;
after the comparison is correct, the product number is engraved on the edge of the semi-finished target backboard;
sequentially carrying out ultrasonic cleaning, drying and packaging on the semi-finished target backboard;
during ultrasonic cleaning, the welding surface of the semi-finished target backboard faces to ultrasonic equipment for 20 min; drying the semi-finished target backboard after ultrasonic cleaning, and sequentially drying the back surface, the edge surface and the welding surface of the semi-finished target backboard;
the drying temperature is 72 ℃, the pressure is 0.1MPa, and the time is 120 min;
the package comprises three layers of packaging films, a drying agent is arranged inside the package, and the number of times of filling argon into the package is 3.
Example 3
The embodiment provides a management method of a semi-finished target backing plate, which includes:
testing the conductivity of the finished semi-finished target backing plate to obtain the conductivity of 58.3ms/m, and comparing the measured conductivity data of the semi-finished target backing plate with the product number and the theoretical conductivity of the components according to the product number and the components of the semi-finished target backing plate recorded by the check ticket to confirm that the product number is TU 1;
after the comparison is correct, the product number is engraved on the edge of the semi-finished target backboard;
sequentially carrying out ultrasonic cleaning, drying and packaging on the semi-finished target backboard;
the welding surface of the semi-finished target backboard faces to ultrasonic equipment during ultrasonic cleaning, and the time is not less than 10 min; drying the semi-finished target backboard after ultrasonic cleaning, and sequentially drying the back surface, the edge surface and the welding surface of the semi-finished target backboard;
the drying temperature is 70 ℃, the pressure is-0.05 MPa, and the drying time is 90 min;
the package includes two layers of packaging films, the inside drier that is provided with of package, the number of times of filling argon gas inside the package is 3.
Example 4
The embodiment provides a management method of a semi-finished target backing plate, which includes:
testing the electric conductivity of the finished semi-finished target back plate to obtain the electric conductivity of 15.9ms/m, comparing the measured electric conductivity data of the semi-finished target back plate with the product number and the theoretical electric conductivity of the components according to the product number and the components of the semi-finished target back plate recorded by the check and move ticket, and confirming that the product number is A5083;
after the comparison is correct, the product number is engraved on the edge of the semi-finished target backboard;
sequentially carrying out ultrasonic cleaning, drying and packaging on the semi-finished target backboard;
the welding surface of the semi-finished target backboard faces to ultrasonic equipment during ultrasonic cleaning, and the time is not less than 10 min; drying the semi-finished target backboard after ultrasonic cleaning, and sequentially drying the back surface, the edge surface and the welding surface of the semi-finished target backboard;
the drying temperature is 70 ℃, the pressure is-0.01 MPa, and the drying time is 90 min;
the package includes two layers of packaging films, the inside drier that is provided with of package, the number of times of filling argon gas inside the package is 3.
Example 5
The embodiment provides a management method of a semi-finished target backing plate, which includes:
testing the conductivity of the finished semi-finished target backboard to obtain the conductivity of 27.5ms/m, and comparing the measured conductivity data of the semi-finished target backboard with the product number and the theoretical conductivity of the components according to the product number and the components of the semi-finished target backboard recorded by the check ticket to confirm that the product number is A2024;
after the comparison is correct, the product number is engraved on the edge of the semi-finished target backboard;
sequentially carrying out ultrasonic cleaning, drying and packaging on the semi-finished target backboard;
the welding surface of the semi-finished target backboard faces to ultrasonic equipment during ultrasonic cleaning, and the time is not less than 10 min; drying the semi-finished target backboard after ultrasonic cleaning, and sequentially drying the back surface, the edge surface and the welding surface of the semi-finished target backboard;
the drying temperature is 70 ℃, the pressure is 0.05MPa, and the drying time is 75 min;
the package includes two layers of packaging films, the inside drier that is provided with of package, the number of times of filling argon gas inside the package is 3.
The applicant declares that the present invention illustrates the detailed structural features of the present invention through the above embodiments, but the present invention is not limited to the above detailed structural features, that is, it does not mean that the present invention must be implemented depending on the above detailed structural features. It should be understood by those skilled in the art that any modifications of the present invention, equivalent substitutions of selected components of the present invention, additions of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
The preferred embodiments of the present invention have been described in detail, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (10)
1. A management method of a semi-finished target backing plate is characterized by comprising the following steps:
testing the conductivity of the semi-finished target backing plate, and comparing the conductivity with the components of the check ticket;
after the comparison is correct, the product number is engraved on the semi-finished target backboard;
and sequentially cleaning, drying and packaging the semi-finished target backing plate.
2. The method of claim 1, wherein the check ticket records a product number and a composition of the semi-finished target backing plate.
3. The management method according to claim 1 or 2, characterized in that the method of comparison comprises: and comparing the measured conductivity data of the semi-finished target backing plate with the product number and the theoretical conductivity of the components.
4. The method according to any one of claims 1 to 3, wherein the product number is engraved on an edge of the semi-finished target backing plate.
5. The method for managing according to any one of claims 1 to 4, wherein the cleaning is ultrasonic cleaning;
preferably, the welding surface of the semi-finished target backing plate faces to the ultrasonic equipment during the ultrasonic cleaning;
preferably, the time of ultrasonic cleaning is not less than 10 min.
6. The management method according to claim 5, wherein the semi-finished target backing plate is blow-dried after the ultrasonic cleaning;
preferably, the blow-drying sequentially blows the back face, the edge face and the welding face of the semi-finished target back plate.
7. The method for managing as claimed in any one of claims 1 to 6, wherein the temperature of the drying is 68 to 72 ℃;
preferably, the drying pressure is-0.09-0.1 MPa;
preferably, the drying time is not less than 60 min.
8. The method of managing of any one of claims 1-7, wherein the packaging comprises at least two layers of packaging film;
preferably, a desiccant is arranged inside the package;
preferably, the number of times of filling the inside of the package with argon is not less than 3 times.
9. The method of any of claims 1-8, wherein the semi-finished target backing plate is a finished target.
10. The method for managing according to any of claims 1 to 9, characterized in that it comprises:
testing the conductivity of the finished semi-finished target backboard, and comparing the measured conductivity data of the semi-finished target backboard with the product number and the theoretical conductivity of the components according to the product number and the components of the semi-finished target backboard recorded by the check ticket;
after the comparison is correct, the product number is engraved on the edge of the semi-finished target backboard;
sequentially carrying out ultrasonic cleaning, drying and packaging on the semi-finished target backboard;
the welding surface of the semi-finished target backboard faces to ultrasonic equipment during ultrasonic cleaning, and the time is not less than 10 min; drying the semi-finished target backboard after ultrasonic cleaning, and sequentially drying the back surface, the edge surface and the welding surface of the semi-finished target backboard;
the drying temperature is 68-72 ℃, the pressure is-0.09-0.1 MPa, and the time is not less than 60 min;
the package comprises at least two layers of packaging films, a drying agent is arranged inside the package, and the number of times of filling argon into the package is not less than 3 times.
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| CN202110453035.0A CN113173284B (en) | 2021-04-26 | 2021-04-26 | Management method of semi-finished target backboard |
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| CN202110453035.0A CN113173284B (en) | 2021-04-26 | 2021-04-26 | Management method of semi-finished target backboard |
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| CN113173284B CN113173284B (en) | 2022-07-15 |
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|---|---|---|---|---|
| JPS6083456A (en) * | 1983-10-14 | 1985-05-11 | Nec Corp | Continuity test system for trunk |
| CN101479400A (en) * | 2006-06-29 | 2009-07-08 | 日矿金属株式会社 | Sputtering target/backing plate conjunction element |
| TW201042271A (en) * | 2009-05-22 | 2010-12-01 | Foxconn Advanced Tech Inc | Electrical testing apparatus |
| CN207456685U (en) * | 2017-12-06 | 2018-06-05 | 江苏创源电子有限公司 | One kind is used for intellective dust collector handle test equipment |
| CN108762203A (en) * | 2018-04-20 | 2018-11-06 | 广州中浩控制技术有限公司 | A kind of production executive system and management method based on electronics batch record |
| US20200311363A1 (en) * | 2017-10-19 | 2020-10-01 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Coding and identifying plate-type workpieces |
| CN111945121A (en) * | 2020-08-06 | 2020-11-17 | 宁波江丰电子材料股份有限公司 | Tantalum-aluminum alloy sputtering target and preparation method thereof |
| CN112267099A (en) * | 2020-10-21 | 2021-01-26 | 宁波江丰电子材料股份有限公司 | Method for cleaning surface of target material |
-
2021
- 2021-04-26 CN CN202110453035.0A patent/CN113173284B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6083456A (en) * | 1983-10-14 | 1985-05-11 | Nec Corp | Continuity test system for trunk |
| CN101479400A (en) * | 2006-06-29 | 2009-07-08 | 日矿金属株式会社 | Sputtering target/backing plate conjunction element |
| TW201042271A (en) * | 2009-05-22 | 2010-12-01 | Foxconn Advanced Tech Inc | Electrical testing apparatus |
| US20200311363A1 (en) * | 2017-10-19 | 2020-10-01 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Coding and identifying plate-type workpieces |
| CN207456685U (en) * | 2017-12-06 | 2018-06-05 | 江苏创源电子有限公司 | One kind is used for intellective dust collector handle test equipment |
| CN108762203A (en) * | 2018-04-20 | 2018-11-06 | 广州中浩控制技术有限公司 | A kind of production executive system and management method based on electronics batch record |
| CN111945121A (en) * | 2020-08-06 | 2020-11-17 | 宁波江丰电子材料股份有限公司 | Tantalum-aluminum alloy sputtering target and preparation method thereof |
| CN112267099A (en) * | 2020-10-21 | 2021-01-26 | 宁波江丰电子材料股份有限公司 | Method for cleaning surface of target material |
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| CN113173284B (en) | 2022-07-15 |
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