CN113172119A - Bending part constant temperature control system in die working, control method, terminal and medium - Google Patents

Bending part constant temperature control system in die working, control method, terminal and medium Download PDF

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CN113172119A
CN113172119A CN202110357206.XA CN202110357206A CN113172119A CN 113172119 A CN113172119 A CN 113172119A CN 202110357206 A CN202110357206 A CN 202110357206A CN 113172119 A CN113172119 A CN 113172119A
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temperature
epsilon
die
control
mold
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刘冬
连杰
张鹏伟
刘明昊
李渊
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C51/00—Measuring, gauging, indicating, counting, or marking devices specially adapted for use in the production or manipulation of material in accordance with subclasses B21B - B21F
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D22/00—Shaping without cutting, by stamping, spinning, or deep-drawing
    • B21D22/02—Stamping using rigid devices or tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D37/00—Tools as parts of machines covered by this subclass
    • B21D37/16—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/26—Programme control arrangements

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  • Feedback Control In General (AREA)

Abstract

The invention discloses a bending part constant temperature control system, a control method, a terminal and a medium in die work, and relates to the technical field of die temperature control. Synchronously transmitting data acquired by the sensor to a temperature data monitor of the infrared thermal imager; the temperature data monitor of the infrared thermal imager completes the whole control process, a target temperature value is set on a touch screen of the infrared thermal imager, and the infrared thermal imager controller compares the acquired temperature signal with the target temperature value in real time to obtain a deviation signal; and then the controller performs PID control and the like on the deviation to realize the control of the constant temperature of the work of the die. According to the invention, the infrared thermal imaging instruments are erected around the die, the temperature of the bending part of the die is monitored in real time, and when the temperature reaches a high-temperature threshold value, a signal is sent to the die cooling device through the sensor, so that the purpose of keeping the die working at a constant temperature is achieved. The intelligent control with the threshold value of 1 ℃ is realized.

Description

Bending part constant temperature control system in die working, control method, terminal and medium
Technical Field
The invention relates to the technical field of mold temperature control, in particular to a bending part constant temperature control system, a control method, a terminal and a medium in mold work.
Background
At present, with the high-speed development of the machine tool industry, the market has greater and greater requirements on high-speed and high-precision machine tools, and the requirements on the precision stability of the finished high-end machine tools are very strict; from the application of the traditional casting bed body to the natural marble bed body and then to the application of the mineral casting bed body, the machine tool industry is always seeking a more stable bed body material; the damping characteristic of the existing mineral casting lathe bed is 10 times of that of the traditional cast iron, so that the precision of the existing mineral casting lathe bed is more stable; the mineral casting is also characterized in that the design plasticity of the bed product is strong and the integration capability is good. In the stamping process, due to the physical characteristic of thermal barrier cold contraction, after the die is stamped for N times, strong friction is generated at the bending part of the material sheet, a large amount of heat is accumulated, so that the material sheet expands and becomes thin at high temperature, the necking phenomenon is caused, and the cracking phenomenon is generated in severe cases.
Through the above analysis, the problems and defects of the prior art are as follows: in the prior art, the real-time monitoring effect on the temperature of the bending part of the die is poor, and the constant temperature of the die cannot be realized.
Disclosure of Invention
In order to overcome the problems in the related art, the disclosed embodiment of the invention provides a bending part constant temperature control system, a control method, a terminal and a medium in the mold working. The technical scheme is as follows:
a constant temperature control method for a bending part in die working comprises the following steps:
erecting infrared thermal imagers at the periphery of the mold, and monitoring the temperature of the bent part of the mold in real time, wherein the central value of the temperature of the bent part of the mold is set to be +25 ℃; the threshold is +/-7 ℃;
when the temperature reaches the high temperature threshold value, the temperature of the die is controlled by a signal sent to the die cooling device by the sensor,
the method comprises the following steps that firstly, data collected by a sensor are synchronously transmitted to a temperature data monitor of an infrared thermal imager; the temperature data monitor of the infrared thermal imager completes the whole control process, a target temperature value is set on a touch screen of the infrared thermal imager, and the infrared thermal imager controller compares the acquired temperature signal with the target temperature value in real time to obtain a deviation signal e;
secondly, performing PID control on the deviation by the controller, setting PID parameters on the touch screen in real time according to real-time data comparison and PID parameter adjustment experience, wherein P is proportional control and is proportional to the deviation, and adjusting P to accelerate the voltage and current adjustment speed of a program; i is integral control, I is integral of deviation, and I is adjusted to eliminate steady-state error; d is differential control, which is the differential of the deviation, the differential is used for predicting the variation trend of the deviation, and D is adjusted to reduce the overshoot, so that the temperature adjustment stability is improved;
transmitting the deviation signal to a power supply of the mold cooling device after PID control, wherein the power supply provides stable voltage output, and further heating the mold according to the control requirement of a PC until the temperature is stabilized to a target temperature value; the control deviation e is a difference between a set target temperature value r and an actually measured temperature value y, i.e., e (t) r (t) -y (t), and the control signal output is
Figure BDA0003003873420000021
The control deviation e is that the threshold value is +/-7 ℃; the target temperature value r is the central value of the temperature of the bending part of the die, and is set to be +25 ℃;
fourthly, controlling an upper limit highest temperature threshold and a lower limit lowest temperature threshold of the control deviation e;
step five, establishing a real-time temperature monitoring program of a bending part in the working of the die according to the control result of the step four;
step six, adding an optimal injection signal strategy into the temperature monitoring program in the step five; the constant temperature control of the die work is realized.
Preferably, in step three, the control deviation e is increasedControlling the maximum temperature threshold and the minimum temperature threshold, and if the actual working environment temperature is lower than or equal to the lower limit temperature, taking the voltage correction error epsilon U corresponding to the actual working environment temperature as epsilon U2, the current correction error epsilon I as epsilon I2, the power correction error epsilon P as epsilon P2, and the phase correction error epsilon P
Figure BDA0003003873420000031
Is composed of
Figure BDA0003003873420000032
If the actual working environment temperature is higher than or equal to the upper limit temperature, the voltage correction error epsilon U corresponding to the actual working environment temperature is taken as epsilon U1, the current correction error epsilon I is epsilon I1, the power correction error epsilon P is epsilon P1, and the phase correction error epsilon U is taken as the phase correction error epsilon P corresponding to the actual working environment temperature
Figure BDA0003003873420000033
Is composed of
Figure BDA0003003873420000034
If the actual working environment temperature is lower than the upper limit temperature and higher than the lower limit temperature, the voltage correction error Epsilon U, the current correction error Epsilon I, the power correction error Epsilon P and the phase correction error corresponding to the actual working environment temperature are calculated by the following formula
Figure BDA0003003873420000035
Epsilon U ═ epsilon U1 × (actual operating environment temperature-lower limit temperature)/(upper limit temperature-lower limit temperature) + epsilon U2 × (upper limit temperature-actual operating environment temperature)/(upper limit temperature-lower limit temperature);
epsilon I ═ epsilon I1 × (actual operating environment temperature-lower limit temperature)/(upper limit temperature-lower limit temperature) + epsilon I2 × (upper limit temperature-actual operating environment temperature)/(upper limit temperature-lower limit temperature);
epsilon P ═ epsilon P1 × (actual operating environment temperature-lower limit temperature)/(upper limit temperature-lower limit temperature) + epsilon P2 × (upper limit temperature-actual operating environment temperature)/(upper limit temperature-lower limit temperature);
Figure BDA0003003873420000036
correcting the voltage, the current, the power and the phase measured by the mold cooling device at the actual working environment temperature according to the voltage correction error epsilon U, the current correction error epsilon I, the power correction error epsilon P and the phase correction error corresponding to the actual working environment temperature;
the mold cooling device monitors that the change of the temperature of the working environment exceeds a preset temperature threshold value T, and the process is repeated;
the correction method is as follows:
Ucorrection of＝UMeasuring/(εU+1)；
ICorrection of＝IMeasuring/(εI+1)；
PCorrection of＝PMeasuring/(εP+1)；
Figure BDA0003003873420000037
Preferably, the step four, the controlling the upper maximum temperature threshold of the control deviation e includes:
respectively outputting a set voltage, a set current, a set power and a set phase by using a standard source, simultaneously and respectively measuring the output set voltage, the output set current, the output set power and the output set phase by using a standard meter and a mold cooling device, and monitoring through the standard meter to obtain U set 1, I set 1, P set 1, B set,
Figure BDA0003003873420000041
Measuring voltage Umeasurement 1, I measurement 1, P measurement 1 by using a mold cooling device,
Figure BDA0003003873420000042
Calculating the voltage error epsilon U1, the current error epsilon I1, the power error epsilon P1 and the phase error of the mold cooling device at the upper limit temperature
ε U1 ═ ((U measurement 1 ÷ U set 1) -1) x 100%;
ε I1 ═ ((I measured 1 ÷ I set 1) -1). times.100%;
ε P1 ═ ((P measurement 1 ÷ P set 1) -1). times.100%;
Figure BDA0003003873420000043
controlling the lower maximum temperature threshold of the control deviation e comprises:
respectively outputting a set voltage, a set current, a set power and a set phase by using a standard source, simultaneously and respectively measuring the set voltage, the set current, the set power and the set phase by using a standard meter and a mold cooling device, and monitoring by using the standard meter to obtain U set 2, I set 2, P set 2,
Figure BDA0003003873420000044
Measuring the voltage Umeasurement 2, I measurement 2, P measurement 2 by using a die cooling device,
Figure BDA0003003873420000045
Calculating the voltage error epsilon U2, the current error epsilon I2, the power error epsilon P2 and the phase error epsilon P2 of the mold cooling device at the lower limit temperature,
ε U2 ═ ((U measured 2 ÷ U set 2) -1) x 100%;
ε I2 ═ ((I measured 2 ÷ I set 2) -1). times.100%;
ε P2 ═ ((P measure 2 ÷ P set 2) -1). times.100%;
Figure BDA0003003873420000046
preferably, the establishing process of step five includes:
1) adding vector control on the basis of the existing signal injection method to form a new signal injection method;
2) extracting the direct current component in a new signal injection method;
3) calculating stator resistance and estimating temperature;
4) and obtaining data of real-time temperature observation.
Preferably, the optimal injection signal strategy process of step six includes:
1) analyzing the influence of the die parameters, the load and the physical characteristics of the die on the temperature estimation precision and the output torque ripple;
2) determining the size of an injection signal, namely UDC, according to the parameters of a loading machine mold of the mold;
3) designing a filter according to the parameters of the mold, and determining the signal injection duration, namely delta t;
4) the signal injection period, i.e., Δ T, is determined in conjunction with the mold parameters and the thermal time constant of the mold physical properties.
Preferably, in step 3), the method for calculating the stator resistance and estimating the temperature includes:
assuming Xit is the position of the ith particle at time t, Vit is the velocity of the ith particle at time t, Sit is the optimal position of the ith particle at time t, and Stg is the global position at time t, then
Figure BDA0003003873420000051
The position of particle i at time t +1 is described as
Figure BDA0003003873420000052
Figure BDA0003003873420000053
In the formula:
Figure BDA0003003873420000054
for the degree of the ith particle in the D-dimensional space at time t,
Figure BDA0003003873420000055
for the optimal position of the ith particle in the D-dimensional space at time t,
Figure BDA0003003873420000056
the position of the ith particle in the D-dimensional space at the time t, r1 and r2 are two independent random numbers distributed in a (0, 1) interval; c1 and c2 are learning factors, and w is an inertia weight;
the method of calculating stator resistance and estimating temperature further comprises:
iteratively searching the current optimal solution of each particle, and evaluating the quality degree of the solution by adopting a fitness function; the fitness function of the particle is
Figure BDA0003003873420000061
Figure BDA0003003873420000062
In the formula: zi, j is the jth ideal output value of the ith sample; zi, j is the j actual output value of the ith sample; n is the number of samples; m is 1, 2, …, r and r are particle numbers; the individual extreme point and the global optimal extreme point of the particle and the optimization termination conditions of the P, I, D coefficient value and the temperature deviation value in the PID temperature control model are determined by the fitness of the particle;
taking the error of the particle swarm optimization algorithm as the optimization termination condition of the threshold and the weight of the PID control algorithm, and taking the error when iterating for l times as
Figure BDA0003003873420000063
In step 4), the method for obtaining the data of real-time temperature observation comprises the following steps:
a) and (3) calculating the predicted value of the target contour by using a Sobel operator or a color space clustering method:
Figure BDA0003003873420000064
b) considering the target contour as a set { dli }1, 2, …, N of N unit line segments, for i ═ 1, 2, …, N;
c) finding a position corresponding to dli in C0, and generating an initial particle set according to the tangent line of the corresponding position in C0 as a sampling reference value of dli;
d) guiding the particles to gather towards the known optimal solution direction continuously according to the state transition model, avoiding the degradation method in the standard particle filtering process to realize the state transition of the particles, and calculating the contour point set corresponding to each particle;
e) calculating the weight of the particles according to the established observation model;
f) the parameters dlj (i) ═ (kj (i), bj (i)) obtained in this iteration are calculated as a weighted average of the particle sets.
Another object of the present invention is to provide a bending constant temperature control system in mold operation, which includes:
the infrared thermal imager is carried on the die periphery frame and used for monitoring the temperature of a bending part of the die in real time, and when the temperature reaches a high-temperature threshold value, the infrared thermal imager gives a signal to the die cooling device through a sensor to realize the control of the constant temperature of the die work.
The invention also aims to provide a die, which is provided with the bending part constant temperature control system in the die working and implements the bending part constant temperature control method in the die working.
Another object of the present invention is to provide an information data processing terminal, which includes a memory and a processor, wherein the memory stores a computer program, and the computer program, when executed by the processor, causes the processor to execute the method for controlling the bending constant temperature in the die work.
Another object of the present invention is to provide a computer-readable storage medium, which stores a computer program, and when the computer program is executed by a processor, the processor executes the method for controlling the bending constant temperature in the die work.
The technical scheme provided by the embodiment of the invention has the following beneficial effects:
through erect infrared thermal imager around the mould, real time monitoring mould department temperature of bending, when the temperature reachd the high temperature threshold value, give mould heat sink signal through the sensor, realize the homothermal purpose of mould work.
The intelligent control with the threshold value of +/-7 ℃ is realized.
The experiment of the invention shows that the experimental data are as follows:
Figure BDA0003003873420000071
the experimental data show that the temperature error is less than 7 ℃, and the test requirement is met. Under the control of the temperature control system, the actual precision can be controlled within 1 ℃.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
Fig. 1 is a schematic view of a bending point constant temperature control system in the die working according to an embodiment of the present invention.
Wherein, 1, an infrared thermal imager; 2. a sensor; 3. a mold cooling device.
Fig. 2 is a flowchart of a method for controlling the bending constant temperature during the operation of the mold according to the embodiment of the present invention.
Fig. 3 is a flow chart illustrating that the power supply provided by the embodiment of the present invention transmits the deviation signal to the mold cooling device after PID control, and the power supply provides stable voltage output, so as to heat the mold according to the control requirement of the PC until the temperature is stabilized to the target temperature value.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.
The invention discloses a method for controlling the bending part constant temperature in the die working, which comprises the following steps:
through erect infrared thermal imager 1 around the mould, real time monitoring mould department temperature of bending, when the temperature reachd the high temperature threshold value, give 3 signals of mould heat sink through sensor 2, realize the homothermal purpose of mould work.
The central value of the temperature of the bending part of the die is set to +25 ℃; the threshold is ± 7 ℃.
As shown in fig. 1, the invention discloses a bending constant temperature control system in mold work, comprising:
infrared thermal imaging system 1 carries on the mould week frame for real time monitoring mould department temperature of bending, when the temperature reachd the high temperature threshold value, gives 3 signals of mould heat sink through sensor 2, realizes the homothermal control of mould work.
The technical solution of the present invention will be further described with reference to the following specific examples.
Example 1
As shown in fig. 2, the method for controlling the constant temperature of the bending part during the working of the die specifically comprises the following steps:
s101, synchronously transmitting data acquired by the sensor 2 to a temperature data monitor of the infrared thermal imager 1; the temperature data monitor of the infrared thermal imager 1 completes the whole control process, a target temperature value is set on a touch screen of the infrared thermal imager 1, and a controller of the infrared thermal imager 1 compares the acquired temperature signal with the target temperature value in real time to obtain a deviation signal e;
s102, performing PID control on the deviation by the controller, setting PID parameters on the touch screen in real time according to real-time data comparison and PID parameter adjustment experience, wherein P is proportional control and is proportional to the deviation, and adjusting P to accelerate the voltage and current adjustment speed of a program; i is integral control, I is integral of deviation, and I is adjusted to eliminate steady-state error; d is differential control, which is the differential of the deviation, the differential is used for predicting the variation trend of the deviation, and D is adjusted to reduce the overshoot, so that the temperature adjustment stability is improved;
s103, after PID control, the deviation signal is transmitted to a power supply of the mold cooling device 3, the power supply provides stable voltage output, and then the mold is heated according to the control requirement of a PC until the temperature is stabilized to a target temperature value; the control deviation e is a difference between a set target temperature value r and an actually measured temperature value y, i.e., e (t) r (t) -y (t), and the control signal output is
Figure BDA0003003873420000091
The control deviation e is that the threshold value is +/-7 ℃; the target temperature value r is the central value of the temperature of the bending part of the die, and is set to be +25 ℃; as shown in fig. 3.
S104, controlling an upper limit maximum temperature threshold and a lower limit minimum temperature threshold of the control deviation e;
s105, establishing a real-time temperature monitoring program of a bending part in the working of the die according to the control result of the step S104;
s106, adding an optimal injection signal strategy into the temperature monitoring program in the step S105; the constant temperature control of the die work is realized.
Example 2
The control of the upper limit highest temperature threshold of the control deviation e comprises the following steps:
respectively outputting a set voltage, a set current, a set power and a set phase by using a standard source, simultaneously and respectively measuring the output set voltage, the output set current, the output set power and the output set phase by using a standard meter and a mold cooling device 3, and monitoring through the standard meter to obtain U set 1, I set 1, P set,
Figure BDA0003003873420000101
Measuring the voltage Umeasurement 1, I measurement 1, P measurement 1 by using the mold cooling device 3,
Figure BDA0003003873420000102
Calculating the voltage error epsilon U1, the current error epsilon I1, the power error epsilon P1 and the phase error of the mold cooling device 3 at the upper limit temperature
ε U1 ═ ((U measurement 1 ÷ U set 1) -1) x 100%;
ε I1 ═ ((I measured 1 ÷ I set 1) -1). times.100%;
ε P1 ═ ((P measurement 1 ÷ P set 1) -1). times.100%;
Figure BDA0003003873420000103
controlling the lower maximum temperature threshold of the control deviation e comprises:
the standard source is used for respectively outputting a set voltage, a set current, a set power and a set phase, the standard meter and the mold cooling device 3 simultaneously and respectively measure the set voltage, the set current, the set power and the set phase, and the monitoring of the standard meter is used for obtaining U set 2, I set 2, P set 2,
Figure BDA0003003873420000104
Measuring the voltage Umeasurement 2, I measurement 2, P measurement 2 and the like by using the die cooling device 3,
Figure BDA0003003873420000105
Calculating the voltage error epsilon U2, the current error epsilon I2, the power error epsilon P2 and the phase error epsilon P2 of the mold cooling device 3 at the lower limit temperature,
ε U2 ═ ((U measured 2 ÷ U set 2) -1) x 100%;
ε I2 ═ ((I measured 2 ÷ I set 2) -1). times.100%;
ε P2 ═ ((P measure 2 ÷ P set 2) -1). times.100%;
Figure BDA0003003873420000106
example 3
In the control of the upper limit highest temperature threshold and the lower limit lowest temperature threshold of the control deviation e, if the actual working environment temperature is lower than or equal to the lower limit temperature, the voltage correction error epsilon U corresponding to the actual working environment temperature is epsilon U2, the current correction error epsilon I is epsilon I2, the power correction error epsilon P is epsilon P2, and the phase correction error epsilon P is
Figure BDA0003003873420000111
Is composed of
Figure BDA0003003873420000112
If the actual working environment temperature is higher than or equal to the upper limit temperature, the voltage correction error epsilon U corresponding to the actual working environment temperature is taken as epsilon U1, the current correction error epsilon I is epsilon I1, the power correction error epsilon P is epsilon P1, and the phase correction error epsilon U is taken as the phase correction error epsilon P corresponding to the actual working environment temperature
Figure BDA0003003873420000113
Is composed of
Figure BDA0003003873420000114
If the actual working environment temperature is lower than the upper limit temperature and higher than the lower limit temperature, the voltage correction error Epsilon U, the current correction error Epsilon I, the power correction error Epsilon P and the phase correction error corresponding to the actual working environment temperature are calculated by the following formula
Figure BDA0003003873420000115
Epsilon U ═ epsilon U1 × (actual operating environment temperature-lower limit temperature)/(upper limit temperature-lower limit temperature) + epsilon U2 × (upper limit temperature-actual operating environment temperature)/(upper limit temperature-lower limit temperature);
epsilon I ═ epsilon I1 × (actual operating environment temperature-lower limit temperature)/(upper limit temperature-lower limit temperature) + epsilon I2 × (upper limit temperature-actual operating environment temperature)/(upper limit temperature-lower limit temperature);
epsilon P ═ epsilon P1 × (actual operating environment temperature-lower limit temperature)/(upper limit temperature-lower limit temperature) + epsilon P2 × (upper limit temperature-actual operating environment temperature)/(upper limit temperature-lower limit temperature);
Figure BDA0003003873420000116
correcting the voltage, the current, the power and the phase measured by the mold cooling device 3 at the actual working environment temperature according to the voltage correction error epsilon U, the current correction error epsilon I, the power correction error epsilon P and the phase correction error corresponding to the actual working environment temperature;
the mold cooling device 3 monitors that the change of the temperature of the working environment exceeds a preset temperature threshold value T, and the process is repeated;
the correction method is as follows:
Ucorrection of＝UMeasuring/(εU+1)；
ICorrection of＝IMeasuring/(εI+1)；
PCorrection of＝PMeasuring/(εP+1)；
Figure BDA0003003873420000121
Example 4
The establishing process of the invention comprises the following steps:
1) adding vector control on the basis of the existing signal injection method to form a new signal injection method;
2) extracting the direct current component in a new signal injection method;
3) calculating stator resistance and estimating temperature;
4) obtaining data of real-time temperature observation;
the optimal injection signal strategy process of the step six comprises the following steps:
1) analyzing the influence of the die parameters, the load and the physical characteristics of the die on the temperature estimation precision and the output torque ripple;
2) determining the size of an injection signal, namely UDC, according to the parameters of a loading machine mold of the mold;
3) designing a filter according to the parameters of the mold, and determining the signal injection duration, namely delta t;
4) determining a signal injection period, namely delta T, by combining the parameters of the mold and the thermal time constant of the physical characteristics of the mold;
in step 3), the method for calculating the stator resistance and estimating the temperature comprises the following steps:
assuming Xit is the position of the ith particle at time t, Vit is the velocity of the ith particle at time t, Sit is the optimal position of the ith particle at time t, and Stg is the global position at time t, then
Figure BDA0003003873420000122
The position of particle i at time t +1 is described as
Figure BDA0003003873420000123
Figure BDA0003003873420000124
In the formula:
Figure BDA0003003873420000131
for the degree of the ith particle in the D-dimensional space at time t,
Figure BDA0003003873420000132
for the optimal position of the ith particle in the D-dimensional space at time t,
Figure BDA0003003873420000133
bit of ith particle in D-dimensional space at time tR1 and r2 are two independent random numbers distributed in the interval of (0, 1); c1 and c2 are learning factors, and w is an inertia weight;
the method of calculating stator resistance and estimating temperature further comprises:
iteratively searching the current optimal solution of each particle, and evaluating the quality degree of the solution by adopting a fitness function; the fitness function of the particle is
Figure BDA0003003873420000134
Figure BDA0003003873420000135
In the formula: zi, j is the jth ideal output value of the ith sample; zi, j is the j actual output value of the ith sample; n is the number of samples; m is 1, 2, …, r and r are particle numbers; the individual extreme point and the global optimal extreme point of the particle and the optimization termination conditions of the P, I, D coefficient value and the temperature deviation value in the PID temperature control model are determined by the fitness of the particle;
taking the error of the particle swarm optimization algorithm as the optimization termination condition of the threshold and the weight of the PID control algorithm, and taking the error when iterating for l times as
Figure BDA0003003873420000136
In step 4), the method for obtaining the data of real-time temperature observation comprises the following steps:
a) and (3) calculating the predicted value of the target contour by using a Sobel operator or a color space clustering method:
Figure BDA0003003873420000137
b) considering the target contour as a set { dli }1, 2, …, N of N unit line segments, for i ═ 1, 2, …, N;
c) finding a position corresponding to dli in C0, and generating an initial particle set according to the tangent line of the corresponding position in C0 as a sampling reference value of dli;
d) guiding the particles to gather towards the known optimal solution direction continuously according to the state transition model, avoiding the degradation method in the standard particle filtering process to realize the state transition of the particles, and calculating the contour point set corresponding to each particle;
e) calculating the weight of the particles according to the established observation model;
f) the parameters dlj (i) ═ (kj (i), bj (i)) obtained in this iteration are calculated as a weighted average of the particle sets.
The invention also aims to provide a die, which is provided with the bending part constant temperature control system in the die working and implements the bending part constant temperature control method in the die working.
Another object of the present invention is to provide an information data processing terminal, which includes a memory and a processor, wherein the memory stores a computer program, and the computer program, when executed by the processor, causes the processor to execute the method for controlling the bending constant temperature in the die work.
Another object of the present invention is to provide a computer-readable storage medium, which stores a computer program, and when the computer program is executed by a processor, the processor executes the method for controlling the bending constant temperature in the die work.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure should be limited only by the attached claims.

Claims (10)

1. A method for controlling the constant temperature of a bending part in the working of a die is characterized by comprising the following steps:
erecting infrared thermal imagers at the periphery of the mold, and monitoring the temperature of the bent part of the mold in real time, wherein the central value of the temperature of the bent part of the mold is set to be +25 ℃; the threshold is +/-7 ℃;
when the temperature reaches the high temperature threshold value, the temperature of the die is controlled by a signal sent to the die cooling device by the sensor,
the method comprises the following steps that firstly, data collected by a sensor are synchronously transmitted to a temperature data monitor of an infrared thermal imager; the temperature data monitor of the infrared thermal imager completes the whole control process, a target temperature value is set on a touch screen of the infrared thermal imager, and the infrared thermal imager controller compares the acquired temperature signal with the target temperature value in real time to obtain a deviation signal e;
secondly, performing PID control on the deviation by the controller, setting PID parameters on the touch screen in real time according to real-time data comparison and PID parameter adjustment experience, wherein P is proportional control and is proportional to the deviation, and adjusting P to accelerate the voltage and current adjustment speed of a program; i is integral control, I is integral of deviation, and I is adjusted to eliminate steady-state error; d is differential control, which is the differential of the deviation, the differential is used for predicting the variation trend of the deviation, and D is adjusted to reduce the overshoot, so that the temperature adjustment stability is improved;
transmitting the deviation signal to a power supply of the mold cooling device after PID control, wherein the power supply provides stable voltage output, and further heating the mold according to the control requirement of a PC until the temperature is stabilized to a target temperature value; the control deviation e is a difference between a set target temperature value r and an actually measured temperature value y, i.e., e (t) r (t) -y (t), and the control signal output is
Figure FDA0003003873410000011
The control deviation e is that the threshold value is +/-7 ℃; the target temperature value r is the central value of the temperature of the bending part of the die, and is set to be +25 ℃;
fourthly, controlling an upper limit highest temperature threshold and a lower limit lowest temperature threshold of the control deviation e;
step five, establishing a real-time temperature monitoring program of a bending part in the working of the die according to the control result of the step four;
step six, adding an optimal injection signal strategy into the temperature monitoring program in the step five; the constant temperature control of the die work is realized.
2. The method for controlling the constant temperature of the bending part during the operation of the mold according to claim 1, wherein in the third step, the upper limit highest temperature threshold and the lower limit lowest temperature threshold of the control deviation e are controlled, and if the actual operating environment temperature is lower than or equal to the lower limit temperature, the voltage correction error ε U corresponding to the actual operating environment temperature is set to ε U2, the current correction error ε I is set to ε I2, the power correction error ε P is set to ε P2, and the phase correction error is set to be ε U corresponding to the actual operating environment temperature
Figure FDA0003003873410000021
Is composed of
Figure FDA0003003873410000022
If the actual working environment temperature is higher than or equal to the upper limit temperature, the voltage correction error epsilon U corresponding to the actual working environment temperature is taken as epsilon U1, the current correction error epsilon I is epsilon I1, the power correction error epsilon P is epsilon P1, and the phase correction error epsilon U is taken as the phase correction error epsilon P corresponding to the actual working environment temperature
Figure FDA0003003873410000023
Is composed of
Figure FDA0003003873410000024
If the actual operating environment temperature is lower than the upper limit temperature and higher than the lower limit temperature,calculating the voltage correction error epsilon U, the current correction error epsilon I, the power correction error epsilon P and the phase correction error corresponding to the actual working environment temperature by the following formula
Figure FDA0003003873410000025
Epsilon U ═ epsilon U1 × (actual operating environment temperature-lower limit temperature)/(upper limit temperature-lower limit temperature) + epsilon U2 × (upper limit temperature-actual operating environment temperature)/(upper limit temperature-lower limit temperature);
epsilon I ═ epsilon I1 × (actual operating environment temperature-lower limit temperature)/(upper limit temperature-lower limit temperature) + epsilon I2 × (upper limit temperature-actual operating environment temperature)/(upper limit temperature-lower limit temperature);
epsilon P ═ epsilon P1 × (actual operating environment temperature-lower limit temperature)/(upper limit temperature-lower limit temperature) + epsilon P2 × (upper limit temperature-actual operating environment temperature)/(upper limit temperature-lower limit temperature);
Figure FDA0003003873410000026
correcting the voltage, the current, the power and the phase measured by the mold cooling device at the actual working environment temperature according to the voltage correction error epsilon U, the current correction error epsilon I, the power correction error epsilon P and the phase correction error corresponding to the actual working environment temperature;
the mold cooling device monitors that the change of the temperature of the working environment exceeds a preset temperature threshold value T, and the process is repeated;
the correction method is as follows:
Ucorrection of＝UMeasuring/(εU+1)；
ICorrection of＝IMeasuring/(εI+1):
PCorrection of＝PMeasuring/(εP+1):
Figure FDA0003003873410000031
3. The method for controlling the bending part constant temperature in the mold working according to claim 1, wherein the step four of controlling the upper maximum temperature threshold of the control deviation e comprises:
respectively outputting a set voltage, a set current, a set power and a set phase by using a standard source, simultaneously and respectively measuring the output set voltage, the output set current, the output set power and the output set phase by using a standard meter and a mold cooling device, and monitoring through the standard meter to obtain U set 1, I set 1, P set 1, B set,
Figure FDA0003003873410000032
Measuring voltage Umeasurement 1, I measurement 1, P measurement 1 by using a mold cooling device,
Figure FDA0003003873410000033
Calculating the voltage error epsilon U1, the current error epsilon I1, the power error epsilon P1 and the phase error of the mold cooling device at the upper limit temperature
ε U1 ═ ((U measurement 1 ÷ U set 1) -1) x 100%;
ε I1 ═ ((I measured 1 ÷ I set 1) -1). times.100%;
ε P1 ═ ((P measurement 1 ÷ P set 1) -1). times.100%;
Figure FDA0003003873410000034
controlling the lower maximum temperature threshold of the control deviation e comprises:
respectively outputting a set voltage, a set current, a set power and a set phase by using a standard source, simultaneously and respectively measuring the set voltage, the set current, the set power and the set phase by using a standard meter and a mold cooling device, and monitoring by using the standard meter to obtain U set 2, I set 2, P set 2,
Figure FDA0003003873410000035
Measuring the voltage Umeasurement 2, I measurement 2, P measurement 2 by using a die cooling device,
Figure FDA0003003873410000036
Calculating the voltage error epsilon U2, the current error epsilon I2, the power error epsilon P2 and the phase error epsilon P2 of the mold cooling device at the lower limit temperature,
ε U2 ═ ((U measured 2 ÷ U set 2) -1) x 100%;
ε I2 ═ ((I measured 2 ÷ I set 2) -1). times.100%;
ε P2 ═ ((P measure 2 ÷ P set 2) -1). times.100%;
Figure FDA0003003873410000041
4. the method for controlling the constant temperature of the bending part in the working of the die as claimed in claim 1, wherein the establishing process of the fifth step comprises:
1) adding vector control on the basis of the existing signal injection method to form a new signal injection method;
2) extracting the direct current component in a new signal injection method;
3) calculating stator resistance and estimating temperature;
4) and obtaining data of real-time temperature observation.
5. The method for controlling the constant temperature of the bending part in the working of the die according to claim 1, wherein the optimal injection signal strategy process of the sixth step comprises the following steps:
1) analyzing the influence of the die parameters, the load and the physical characteristics of the die on the temperature estimation precision and the output torque ripple;
2) determining the size of an injection signal, namely UDC, according to the parameters of a loading machine mold of the mold;
3) designing a filter according to the parameters of the mold, and determining the signal injection duration, namely delta t;
4) the signal injection period, i.e., Δ T, is determined in conjunction with the mold parameters and the thermal time constant of the mold physical properties.
6. The method for controlling the bending part constant temperature in the working of the die as claimed in claim 5, wherein in the step 3), the method for calculating the stator resistance and the estimated temperature comprises the following steps:
assuming Xit is the position of the ith particle at time t, Vit is the velocity of the ith particle at time t, Sit is the optimal position of the ith particle at time t, and Stg is the global position at time t, then
Figure FDA0003003873410000042
The position of particle i at time t +1 is described as
Figure FDA0003003873410000051
Figure FDA0003003873410000052
In the formula:
Figure FDA0003003873410000053
for the degree of the ith particle in the D-dimensional space at time t,
Figure FDA0003003873410000054
for the optimal position of the ith particle in the D-dimensional space at time t,
Figure FDA0003003873410000055
the position of the ith particle in the D-dimensional space at the time t, r1 and r2 are two independent random numbers distributed in a (0, 1) interval; c1 and c2 are learning factors, and w is an inertia weight;
the method of calculating stator resistance and estimating temperature further comprises:
iteratively searching the current optimal solution of each particle, and evaluating the quality degree of the solution by adopting a fitness function; the fitness function of the particle is
Figure FDA0003003873410000056
Figure FDA0003003873410000057
In the formula: zi, j is the jth ideal output value of the ith sample; zi, j is the j actual output value of the ith sample; n is the number of samples; m is 1, 2, …, r and r are particle numbers; the individual extreme point and the global optimal extreme point of the particle and the optimization termination conditions of the P, I, D coefficient value and the temperature deviation value in the PID temperature control model are determined by the fitness of the particle;
taking the error of the particle swarm optimization algorithm as the optimization termination condition of the threshold and the weight of the PID control algorithm, and taking the error when iterating for l times as
Figure FDA0003003873410000058
In step 4), the method for obtaining the data of real-time temperature observation comprises the following steps:
a) and (3) calculating the predicted value of the target contour by using a Sobel operator or a color space clustering method:
Figure FDA0003003873410000059
b) considering the target contour as a set { dli }1, 2, …, N of N unit line segments, for i ═ 1, 2, …, N;
c) finding a position corresponding to dli in C0, and generating an initial particle set according to the tangent line of the corresponding position in C0 as a sampling reference value of dli;
d) guiding the particles to gather towards the known optimal solution direction continuously according to the state transition model, avoiding the degradation method in the standard particle filtering process to realize the state transition of the particles, and calculating the contour point set corresponding to each particle;
e) calculating the weight of the particles according to the established observation model;
f) the parameters dlj (i) ═ (kj (i), bj (i)) obtained in this iteration are calculated as a weighted average of the particle sets.
7. The utility model provides a constant temperature control system of department of bending in mould work, its characterized in that, constant temperature control system of department of bending in the mould work includes:
the infrared thermal imager is carried on the die periphery frame and used for monitoring the temperature of a bending part of the die in real time, and when the temperature reaches a high-temperature threshold value, the infrared thermal imager gives a signal to the die cooling device through a sensor to realize the control of the constant temperature of the die work.
8. A mold equipped with the system for controlling the constant temperature of a bend during mold working according to claim 7, wherein the method for controlling the constant temperature of a bend during mold working according to any one of claims 1 to 6 is performed.
9. An information data processing terminal, characterized in that the information data processing terminal comprises a memory and a processor, the memory stores a computer program, and the computer program is executed by the processor, so that the processor executes the bending constant temperature control method in the die work according to any one of claims 1 to 6.
10. A computer-readable storage medium storing a computer program which, when executed by a processor, causes the processor to execute the method for controlling the bending thermostat in a mold work according to any one of claims 1 to 6.
CN202110357206.XA 2021-04-01 2021-04-01 Bending part constant temperature control system in die working, control method, terminal and medium Pending CN113172119A (en)

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