CN113166306A - Curable resin composition, cured product, and organic EL display element - Google Patents
Curable resin composition, cured product, and organic EL display element Download PDFInfo
- Publication number
- CN113166306A CN113166306A CN201980077323.1A CN201980077323A CN113166306A CN 113166306 A CN113166306 A CN 113166306A CN 201980077323 A CN201980077323 A CN 201980077323A CN 113166306 A CN113166306 A CN 113166306A
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- CN
- China
- Prior art keywords
- curable resin
- resin composition
- cured product
- organic
- present
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 100
- -1 anthracene compound Chemical class 0.000 claims abstract description 95
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims abstract description 27
- 238000003795 desorption Methods 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Natural products C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 claims abstract description 17
- 238000005259 measurement Methods 0.000 claims abstract description 14
- 150000004056 anthraquinones Chemical class 0.000 claims abstract description 13
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 claims abstract description 13
- 239000003999 initiator Substances 0.000 claims abstract description 13
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000565 sealant Substances 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 19
- 238000007789 sealing Methods 0.000 claims description 16
- 230000007547 defect Effects 0.000 abstract description 7
- 238000010943 off-gassing Methods 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 description 43
- 238000000034 method Methods 0.000 description 35
- 239000003505 polymerization initiator Substances 0.000 description 33
- 238000010538 cationic polymerization reaction Methods 0.000 description 25
- 238000000576 coating method Methods 0.000 description 23
- 239000011248 coating agent Substances 0.000 description 22
- 238000010438 heat treatment Methods 0.000 description 22
- 239000000463 material Substances 0.000 description 21
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 20
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 20
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 19
- 150000001875 compounds Chemical class 0.000 description 14
- 239000003607 modifier Substances 0.000 description 12
- 229910010272 inorganic material Inorganic materials 0.000 description 10
- 239000011147 inorganic material Substances 0.000 description 10
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical class NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 9
- 239000003381 stabilizer Substances 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 238000002834 transmittance Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000006087 Silane Coupling Agent Substances 0.000 description 8
- 238000001723 curing Methods 0.000 description 8
- 238000013007 heat curing Methods 0.000 description 8
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 7
- 239000012298 atmosphere Substances 0.000 description 7
- 230000001678 irradiating effect Effects 0.000 description 7
- 239000007870 radical polymerization initiator Substances 0.000 description 7
- UCBQKJQXUPVHFJ-UHFFFAOYSA-N 1-cyclopenta-2,4-dien-1-yl-2-propan-2-ylbenzene Chemical compound CC(C)C1=CC=CC=C1C1C=CC=C1 UCBQKJQXUPVHFJ-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- 238000012719 thermal polymerization Methods 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 4
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 3
- 150000003863 ammonium salts Chemical class 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- LTYMSROWYAPPGB-UHFFFAOYSA-O diphenylsulfanium Chemical compound C=1C=CC=CC=1[SH+]C1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-O 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 3
- 239000012953 triphenylsulfonium Substances 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 238000007738 vacuum evaporation Methods 0.000 description 3
- 229960000834 vinyl ether Drugs 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- QPCMKVGYDGXROK-UHFFFAOYSA-N (10-octanoyloxyanthracen-9-yl) octanoate Chemical compound C(CCCCCCC)(=O)OC=1C2=CC=CC=C2C(=C2C=CC=CC=12)OC(CCCCCCC)=O QPCMKVGYDGXROK-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2,2'-azo-bis-isobutyronitrile Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- OVSKIKFHRZPJSS-UHFFFAOYSA-N 2,4-D Chemical compound OC(=O)COC1=CC=C(Cl)C=C1Cl OVSKIKFHRZPJSS-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 2
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 2
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 102100033806 Alpha-protein kinase 3 Human genes 0.000 description 2
- 101710082399 Alpha-protein kinase 3 Proteins 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 125000000129 anionic group Chemical group 0.000 description 2
- 150000001450 anions Chemical group 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000012954 diazonium Substances 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- GHLKSLMMWAKNBM-UHFFFAOYSA-N dodecane-1,12-diol Chemical compound OCCCCCCCCCCCCO GHLKSLMMWAKNBM-UHFFFAOYSA-N 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 150000004714 phosphonium salts Chemical class 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- YPESPOJYFDMJPO-UHFFFAOYSA-N (10-nonanoyloxyanthracen-9-yl) nonanoate Chemical compound C(CCCCCCCC)(=O)OC=1C2=CC=CC=C2C(=C2C=CC=CC=12)OC(CCCCCCCC)=O YPESPOJYFDMJPO-UHFFFAOYSA-N 0.000 description 1
- RRGDKSJUYQLNAV-UHFFFAOYSA-N (10-prop-2-enoyloxyanthracen-9-yl) prop-2-enoate Chemical compound C1=CC=C2C(OC(=O)C=C)=C(C=CC=C3)C3=C(OC(=O)C=C)C2=C1 RRGDKSJUYQLNAV-UHFFFAOYSA-N 0.000 description 1
- ZNGSVRYVWHOWLX-KHFUBBAMSA-N (1r,2s)-2-(methylamino)-1-phenylpropan-1-ol;hydrate Chemical compound O.CN[C@@H](C)[C@H](O)C1=CC=CC=C1.CN[C@@H](C)[C@H](O)C1=CC=CC=C1 ZNGSVRYVWHOWLX-KHFUBBAMSA-N 0.000 description 1
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical class CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- NQEJEMZJOBCYOD-UHFFFAOYSA-N (4-methoxyphenyl)methyl-dimethyl-phenylazanium Chemical compound C1=CC(OC)=CC=C1C[N+](C)(C)C1=CC=CC=C1 NQEJEMZJOBCYOD-UHFFFAOYSA-N 0.000 description 1
- QKAIFCSOWIMRJG-UHFFFAOYSA-N (4-methylphenyl)-(4-propan-2-ylphenyl)iodanium Chemical compound C1=CC(C(C)C)=CC=C1[I+]C1=CC=C(C)C=C1 QKAIFCSOWIMRJG-UHFFFAOYSA-N 0.000 description 1
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- HIYIGPVBMDKPCR-UHFFFAOYSA-N 1,1-bis(ethenoxymethyl)cyclohexane Chemical compound C=COCC1(COC=C)CCCCC1 HIYIGPVBMDKPCR-UHFFFAOYSA-N 0.000 description 1
- BEQKKZICTDFVMG-UHFFFAOYSA-N 1,2,3,4,6-pentaoxepane-5,7-dione Chemical compound O=C1OOOOC(=O)O1 BEQKKZICTDFVMG-UHFFFAOYSA-N 0.000 description 1
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- LFKLPJRVSHJZPL-UHFFFAOYSA-N 1,2:7,8-diepoxyoctane Chemical compound C1OC1CCCCC1CO1 LFKLPJRVSHJZPL-UHFFFAOYSA-N 0.000 description 1
- MWZJGRDWJVHRDV-UHFFFAOYSA-N 1,4-bis(ethenoxy)butane Chemical compound C=COCCCCOC=C MWZJGRDWJVHRDV-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- FQJUJAALMJSTOI-UHFFFAOYSA-N 1-(1h-imidazol-2-yl)propylurea Chemical compound NC(=O)NC(CC)C1=NC=CN1 FQJUJAALMJSTOI-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- VSHKLLPSERFSRJ-UHFFFAOYSA-N 1-(naphthalen-1-ylmethyl)pyridin-1-ium-2-carbonitrile Chemical compound N#CC1=CC=CC=[N+]1CC1=CC=CC2=CC=CC=C12 VSHKLLPSERFSRJ-UHFFFAOYSA-N 0.000 description 1
- OBSKXJSZGYXFFB-UHFFFAOYSA-N 1-benzylpyridin-1-ium-2-carbonitrile Chemical compound N#CC1=CC=CC=[N+]1CC1=CC=CC=C1 OBSKXJSZGYXFFB-UHFFFAOYSA-N 0.000 description 1
- SAMJGBVVQUEMGC-UHFFFAOYSA-N 1-ethenoxy-2-(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOC=C SAMJGBVVQUEMGC-UHFFFAOYSA-N 0.000 description 1
- RQJCIXUNHZZFMB-UHFFFAOYSA-N 1-ethenoxy-2-(2-ethenoxypropoxy)propane Chemical compound C=COCC(C)OCC(C)OC=C RQJCIXUNHZZFMB-UHFFFAOYSA-N 0.000 description 1
- FOWNZLLMQHBVQT-UHFFFAOYSA-N 1-ethenoxy-2-[2-(2-ethenoxypropoxy)propoxy]propane Chemical compound C=COCC(C)OCC(C)OCC(C)OC=C FOWNZLLMQHBVQT-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- IVIDDMGBRCPGLJ-UHFFFAOYSA-N 2,3-bis(oxiran-2-ylmethoxy)propan-1-ol Chemical compound C1OC1COC(CO)COCC1CO1 IVIDDMGBRCPGLJ-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- VDAIJDKQXDCJSI-UHFFFAOYSA-N 2-(2-methylimidazol-1-yl)ethylurea Chemical compound CC1=NC=CN1CCNC(N)=O VDAIJDKQXDCJSI-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 1
- RQZUWSJHFBOFPI-UHFFFAOYSA-N 2-[1-[1-(oxiran-2-ylmethoxy)propan-2-yloxy]propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COC(C)COCC1CO1 RQZUWSJHFBOFPI-UHFFFAOYSA-N 0.000 description 1
- FVCHRIQAIOHAIC-UHFFFAOYSA-N 2-[1-[1-[1-(oxiran-2-ylmethoxy)propan-2-yloxy]propan-2-yloxy]propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COC(C)COC(C)COCC1CO1 FVCHRIQAIOHAIC-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- SEFYJVFBMNOLBK-UHFFFAOYSA-N 2-[2-[2-(oxiran-2-ylmethoxy)ethoxy]ethoxymethyl]oxirane Chemical compound C1OC1COCCOCCOCC1CO1 SEFYJVFBMNOLBK-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- UWQPDVZUOZVCBH-UHFFFAOYSA-N 2-diazonio-4-oxo-3h-naphthalen-1-olate Chemical class C1=CC=C2C(=O)C(=[N+]=[N-])CC(=O)C2=C1 UWQPDVZUOZVCBH-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical class OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- PNPLRTWSLDSFET-UHFFFAOYSA-N 2-naphthalen-1-yl-5-phenyl-1,3,4-oxadiazole Chemical compound C1=CC=CC=C1C1=NN=C(C=2C3=CC=CC=C3C=CC=2)O1 PNPLRTWSLDSFET-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- BIDWUUDRRVHZLQ-UHFFFAOYSA-N 3-ethyl-3-(2-ethylhexoxymethyl)oxetane Chemical compound CCCCC(CC)COCC1(CC)COC1 BIDWUUDRRVHZLQ-UHFFFAOYSA-N 0.000 description 1
- LMIOYAVXLAOXJI-UHFFFAOYSA-N 3-ethyl-3-[[4-[(3-ethyloxetan-3-yl)methoxymethyl]phenyl]methoxymethyl]oxetane Chemical compound C=1C=C(COCC2(CC)COC2)C=CC=1COCC1(CC)COC1 LMIOYAVXLAOXJI-UHFFFAOYSA-N 0.000 description 1
- FMGBDYLOANULLW-UHFFFAOYSA-N 3-isocyanatopropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCN=C=O FMGBDYLOANULLW-UHFFFAOYSA-N 0.000 description 1
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- YULXKNUTHNEIGN-UHFFFAOYSA-N 4-(4-morpholin-4-ylphenyl)butanal Chemical compound C1=CC(CCCC=O)=CC=C1N1CCOCC1 YULXKNUTHNEIGN-UHFFFAOYSA-N 0.000 description 1
- CXXSQMDHHYTRKY-UHFFFAOYSA-N 4-amino-2,3,5-tris(oxiran-2-ylmethyl)phenol Chemical compound C1=C(O)C(CC2OC2)=C(CC2OC2)C(N)=C1CC1CO1 CXXSQMDHHYTRKY-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- FABWHQNTABLNLN-UHFFFAOYSA-N C(CCCCCCC)(=O)OC=1C2=CC=CC=C2C=C2C=CC=CC=12 Chemical compound C(CCCCCCC)(=O)OC=1C2=CC=CC=C2C=C2C=CC=CC=12 FABWHQNTABLNLN-UHFFFAOYSA-N 0.000 description 1
- GMXOYEFGMAXIIU-UHFFFAOYSA-N C[N+](CC1=CC(=C(C=C1)C)C)(C1=CC=CC=C1)C Chemical compound C[N+](CC1=CC(=C(C=C1)C)C)(C1=CC=CC=C1)C GMXOYEFGMAXIIU-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- QVHMSMOUDQXMRS-UHFFFAOYSA-N PPG n4 Chemical compound CC(O)COC(C)COC(C)COC(C)CO QVHMSMOUDQXMRS-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- LOCXTTRLSIDGPS-FVDSYPCUSA-N [(z)-[1-oxo-1-(4-phenylsulfanylphenyl)octan-2-ylidene]amino] benzoate Chemical compound C=1C=C(SC=2C=CC=CC=2)C=CC=1C(=O)C(/CCCCCC)=N\OC(=O)C1=CC=CC=C1 LOCXTTRLSIDGPS-FVDSYPCUSA-N 0.000 description 1
- MOOIXEMFUKBQLJ-UHFFFAOYSA-N [1-(ethenoxymethyl)cyclohexyl]methanol Chemical compound C=COCC1(CO)CCCCC1 MOOIXEMFUKBQLJ-UHFFFAOYSA-N 0.000 description 1
- KHEDNBRORNZTNH-UHFFFAOYSA-N [10-(2-ethylhexanoyloxy)anthracen-9-yl] 2-ethylhexanoate Chemical compound C(C)C(C(=O)OC=1C2=CC=CC=C2C(=C2C=CC=CC=12)OC(C(CCCC)CC)=O)CCCC KHEDNBRORNZTNH-UHFFFAOYSA-N 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 description 1
- CIZVQWNPBGYCGK-UHFFFAOYSA-N benzenediazonium Chemical compound N#[N+]C1=CC=CC=C1 CIZVQWNPBGYCGK-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- AENNXXRRACDJAY-UHFFFAOYSA-N bis(2-dodecylphenyl)iodanium Chemical compound CCCCCCCCCCCCC1=CC=CC=C1[I+]C1=CC=CC=C1CCCCCCCCCCCC AENNXXRRACDJAY-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- PESYEWKSBIWTAK-UHFFFAOYSA-N cyclopenta-1,3-diene;titanium(2+) Chemical class [Ti+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 PESYEWKSBIWTAK-UHFFFAOYSA-N 0.000 description 1
- ZWLIYXJBOIDXLL-UHFFFAOYSA-N decanedihydrazide Chemical compound NNC(=O)CCCCCCCCC(=O)NN ZWLIYXJBOIDXLL-UHFFFAOYSA-N 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- HYVNJCOHGOONJK-UHFFFAOYSA-N dibenzyl-methyl-phenylazanium Chemical compound C=1C=CC=CC=1C[N+](C=1C=CC=CC=1)(C)CC1=CC=CC=C1 HYVNJCOHGOONJK-UHFFFAOYSA-N 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- ONRGBXGMVZEZLY-UHFFFAOYSA-N dimethyl-[(4-methylphenyl)methyl]-phenylazanium Chemical compound C1=CC(C)=CC=C1C[N+](C)(C)C1=CC=CC=C1 ONRGBXGMVZEZLY-UHFFFAOYSA-N 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- OWZDULOODZHVCQ-UHFFFAOYSA-N diphenyl-(4-phenylsulfanylphenyl)sulfanium Chemical compound C=1C=C([S+](C=2C=CC=CC=2)C=2C=CC=CC=2)C=CC=1SC1=CC=CC=C1 OWZDULOODZHVCQ-UHFFFAOYSA-N 0.000 description 1
- OZLBDYMWFAHSOQ-UHFFFAOYSA-N diphenyliodanium Chemical compound C=1C=CC=CC=1[I+]C1=CC=CC=C1 OZLBDYMWFAHSOQ-UHFFFAOYSA-N 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- AZDCYKCDXXPQIK-UHFFFAOYSA-N ethenoxymethylbenzene Chemical compound C=COCC1=CC=CC=C1 AZDCYKCDXXPQIK-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 150000002357 guanidines Chemical class 0.000 description 1
- 229940083094 guanine derivative acting on arteriolar smooth muscle Drugs 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000007970 homogeneous dispersion Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- BLGWXSOTAXXXDE-UHFFFAOYSA-N n'-[1-(1h-imidazol-2-yl)propyl]hexanediamide Chemical compound NC(=O)CCCCC(=O)NC(CC)C1=NC=CN1 BLGWXSOTAXXXDE-UHFFFAOYSA-N 0.000 description 1
- RIWRFSMVIUAEBX-UHFFFAOYSA-N n-methyl-1-phenylmethanamine Chemical class CNCC1=CC=CC=C1 RIWRFSMVIUAEBX-UHFFFAOYSA-N 0.000 description 1
- 125000006502 nitrobenzyl group Chemical group 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 150000002921 oxetanes Chemical class 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 150000003458 sulfonic acid derivatives Chemical class 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
- HMKGBOLFVMRQRP-UHFFFAOYSA-N tribenzyl(phenyl)azanium Chemical compound C=1C=CC=CC=1C[N+](C=1C=CC=CC=1)(CC=1C=CC=CC=1)CC1=CC=CC=C1 HMKGBOLFVMRQRP-UHFFFAOYSA-N 0.000 description 1
- GAMLUOSQYHLFCT-UHFFFAOYSA-N triethoxy-[3-[(3-ethyloxetan-3-yl)methoxy]propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1(CC)COC1 GAMLUOSQYHLFCT-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- ULNJZOIDTANZKR-UHFFFAOYSA-N tris[4-(4-acetylphenyl)sulfanylphenyl]sulfanium Chemical compound C1=CC(C(=O)C)=CC=C1SC1=CC=C([S+](C=2C=CC(SC=3C=CC(=CC=3)C(C)=O)=CC=2)C=2C=CC(SC=3C=CC(=CC=3)C(C)=O)=CC=2)C=C1 ULNJZOIDTANZKR-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 230000004584 weight gain Effects 0.000 description 1
- 235000019786 weight gain Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/16—Cyclic ethers having four or more ring atoms
- C08G65/18—Oxetanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0083—Nucleating agents promoting the crystallisation of the polymer matrix
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
- Epoxy Resins (AREA)
- Polymerisation Methods In General (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The purpose of the present invention is to provide a curable resin composition which has excellent curability and low outgassing properties with respect to light having a long wavelength, and which can suppress display defects in an organic EL display device. Further, the present invention aims to provide a cured product of the curable resin composition and an organic EL display element having the cured product. The curable resin composition of the present invention is used as a sealant for an organic EL display element, and comprises a curable resin, a photopolymerization initiator, and a sensitizer, wherein the sensitizer contains an anthracene compound having an ester bond, and the amount of anthraquinone, which is quantified in terms of toluene, is 300ppm or less when a cured product of the curable resin composition is subjected to thermal desorption GC-MS measurement under thermal desorption conditions of 110 ℃ and 30 minutes.
Description
Technical Field
The present invention relates to a curable resin composition which is excellent in curability and low outgassing property with respect to light having a long wavelength and can suppress display defects of an organic EL display device. The present invention also relates to a cured product of the curable resin composition and an organic EL display device having the cured product.
Background
An organic electroluminescence (hereinafter, also referred to as "organic EL") display element has a laminate structure in which an organic light emitting material layer is sandwiched between a pair of electrodes facing each other, and electrons are injected from one electrode into the organic light emitting material layer, and holes are injected from the other electrode into the organic light emitting material layer, whereby the electrons and the holes are combined in the organic light emitting material layer to emit light. Since the organic EL display element emits light in this manner, the organic EL display element has advantages of being excellent in visibility, being thin, and being capable of dc low-voltage driving, as compared with a liquid crystal display element or the like that requires a backlight.
The organic light-emitting material layer and the electrode constituting the organic EL display device have a problem that their characteristics are easily deteriorated by moisture, oxygen, or the like. Therefore, in order to obtain a practical organic EL display element, it is necessary to prolong the life by isolating the organic light-emitting material layer and the electrode from the atmosphere. As a method of isolating the organic light emitting material layer and the electrode from the atmosphere, a method of sealing the organic EL display element with a sealant has been performed (for example, patent document 1). In sealing an organic EL display element with a sealant, in general, in order to sufficiently suppress permeation of moisture, oxygen, or the like, a method is used in which an inorganic film called a passivation film is provided on a laminate having organic light emitting material layers, and the inorganic film is sealed with a sealant.
In recent years, instead of a bottom emission type organic EL display element in which light emitted from an organic light emitting material layer is extracted from the substrate surface side on which a light emitting element is formed, a top emission type organic EL display element in which light is extracted from the upper surface side of an organic light emitting layer has attracted attention. This system has an advantage that the open ratio (Japanese: open ratio) is high, and the system is driven at a low voltage, which is advantageous for a long service life. In such a top emission type organic EL display element, since the upper surface side of the light-emitting layer needs to be transparent, a transparent moisture-proof substrate such as glass is laminated on the upper surface side of the light-emitting element with a transparent sealing layer interposed therebetween, and sealing is performed (for example, patent document 2).
As a method of forming the sealing layer, there is a method of applying a sealing agent on a substrate by an ink jet method and then curing the sealing agent. If such a coating method by an inkjet method is used, the sealing layer can be uniformly formed at high speed. However, when a sealant suitable for application by an ink jet method is used for a top emission type organic EL display element, there is a problem that a display failure such as a dark spot (japanese: ダークスポツト) may occur in the obtained organic EL display element. In particular, even in the case of a bottom emission type, a sealant in which no display failure occurs may be used, and in the case of a top emission type organic EL display element, a display failure may occur.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 2007-115692
Patent document 2: japanese laid-open patent publication No. 2009-051980
Disclosure of Invention
Problems to be solved by the invention
The purpose of the present invention is to provide a curable resin composition which has excellent curability and low outgassing properties with respect to light having a long wavelength, and which can suppress display defects in an organic EL display device. Further, the present invention aims to provide a cured product of the curable resin composition and an organic EL display element having the cured product.
Means for solving the problems
The present invention is a curable resin composition for use as a sealant for an organic EL display element, the curable resin composition containing a curable resin, a photopolymerization initiator, and a sensitizer, the sensitizer containing an anthracene compound having an ester bond, wherein the amount of anthraquinone, as quantified in terms of toluene, is 300ppm or less when a cured product of the curable resin composition is subjected to thermal desorption GC-MS measurement under thermal desorption conditions of 110 ℃ for 30 minutes.
The present invention is described in detail below.
The present inventors have studied, from the viewpoint of reducing damage to an organic EL display element, and the like: a sensitizer is added to a curable resin composition used as a sealing agent for an organic EL display element, and the curable resin composition is cured by light having a wavelength of 395nm or the like. In addition, in order to make the curable resin composition excellent in transparency and curability, it has been studied to use an anthracene compound having an ester bond as the sensitizer. However, the resultant organic EL display device may have display defects such as dark spots. The inventors believe that: the reason why the occurrence of dark spots or the like is poor when an anthracene compound having an ester bond is used as a sensitizer is that an acid derived from the ester bond is generated when the anthracene compound is decomposed. Therefore, the present inventors have studied that the value determined when a cured product is subjected to thermal desorption GC-MS measurement under specific conditions is a specific value or less for anthraquinone which is produced together with an acid when the anthracene compound is decomposed. As a result, they have found that a curable resin composition which is excellent in curability and low outgassing property with respect to light having a long wavelength and can suppress display defects of an organic EL display element can be obtained, and have completed the present invention.
The curable resin composition of the present invention has an anthraquinone content of 300ppm or less as quantified in terms of toluene when a cured product is measured by thermal desorption GC-MS under thermal desorption conditions of 110 ℃ for 30 minutes. By setting the amount of anthraquinone to 300ppm or less, the curable resin composition of the present invention can provide an organic EL display device having excellent display performance. The upper limit of the amount of the above-mentioned anthraquinones is preferably 250ppm, more preferably 200 ppm. The above anthraquinone amount is most preferably 0 ppm.
The measurement of the amount of anthraquinone and the total amount of outgas described below can be performed as follows: the amount of gas component generated when heating was carried out under thermal desorption conditions of 110 ℃ for 30 minutes for 1mg of the cured product using a thermal desorption apparatus and a GC-MS apparatus.
In addition, the measurement of the thermal desorption GC-MS used in the cured product can be achieved by using an LED lamp to the curable resin composition irradiation of 2000mJ/cm2Ultraviolet rays having a wavelength of 395 nm.
In the curable resin composition of the present invention, it is preferable that the total amount of outgas determined in terms of toluene is 6000ppm or less when the cured product is measured by thermal desorption GC-MS under thermal desorption conditions of 110 ℃ for 30 minutes. When the total amount of outgas is 6000ppm or less, the curable resin composition of the present invention has an excellent effect of suppressing the occurrence of dark spots and the like in the obtained organic EL display device. A more preferable upper limit of the total amount of outgas is 4000ppm, and a further more preferable upper limit is 3500 ppm. The above-mentioned total amount of outgas is most preferably 0 ppm.
The amount of anthraquinone and the total amount of outgas can be set to the above ranges by: selection of the kind, combination, and adjustment of the content ratio of each constituent component such as a sensitizer containing an anthracene compound having an ester bond, a curable resin, a photopolymerization initiator, and a stabilizer, which will be described later, are performed.
The curable resin composition of the present invention contains a curable resin.
As the curable resin, a cationically polymerizable compound or a radically polymerizable compound can be used. Among them, a cationically polymerizable compound is preferably contained.
Examples of the cationically polymerizable compound include an oxetane compound, an epoxy compound, and a vinyl ether compound. Among them, the curable resin preferably contains at least 1 selected from an oxetane compound and an epoxy compound.
Examples of the oxetane compound include 3-ethyl-3- (((3-ethyloxetan-3-yl) methoxy) methyl) oxetane, 3-ethyl-3- ((2-ethylhexyloxy) methyl) oxetane, 3-ethyl-3- ((3- (triethoxysilyl) propoxy) methyl) oxetane, phenol novolac oxetane, and 1, 4-bis (((3-ethyl-3-oxetanyl) methoxy) methyl) benzene. Among them, 3-ethyl-3- (((3-ethyloxetan-3-yl) methoxy) methyl) oxetane is preferable.
These oxetane compounds may be used alone, or 2 or more kinds thereof may be used in combination.
Examples of the epoxy compound include 1, 7-octadiene diepoxide, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, diethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, dipropylene glycol diglycidyl ether, tripropylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, 1, 6-hexanediol diglycidyl ether, glycerol diglycidyl ether, trimethylolpropane triglycidyl ether, phenyl glycidyl ether, and phenylene diglycidyl ether. Among them, 1, 6-hexanediol diglycidyl ether is preferable.
These epoxy compounds may be used alone, or 2 or more kinds may be used in combination.
Examples of the vinyl ether compound include benzyl vinyl ether, cyclohexanedimethanol monovinyl ether, dicyclopentadiene vinyl ether, 1, 4-butanediol divinyl ether, cyclohexanedimethanol divinyl ether, diethylene glycol divinyl ether, triethylene glycol divinyl ether, dipropylene glycol divinyl ether, tripropylene glycol divinyl ether, and the like.
These vinyl ether compounds may be used alone, or 2 or more kinds may be used in combination.
The radical polymerizable compound is preferably a (meth) acrylic compound.
In the present specification, "(meth) acrylic acid" means acrylic acid or methacrylic acid, "(meth) acrylic acid-based compound" means a compound having a (meth) acryloyl group, and "(meth) acryloyl group" means an acryloyl group or a methacryloyl group.
Examples of the (meth) acrylic compound include isobornyl (meth) acrylate, 1, 6-hexanediol di (meth) acrylate, 1, 9-nonanediol di (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, dicyclopentanyl (meth) acrylate, benzyl (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, tetrapropylene glycol di (meth) acrylate, polytetramethylene glycol di (meth) acrylate, 1, 12-dodecanediol di (meth) acrylate, lauryl (meth) acrylate, and the like. Among them, isobornyl (meth) acrylate and 1, 6-hexanediol di (meth) acrylate are preferable.
These (meth) acrylic compounds may be used alone or in combination of 2 or more.
In the present specification, the "(meth) acrylate" refers to an acrylate or a methacrylate.
The curable resin composition of the present invention contains a photopolymerization initiator.
As the photopolymerization initiator, a photo cation polymerization initiator or a photo radical polymerization initiator is suitably used depending on the kind of the curable resin used, and the like.
The photo cation polymerization initiator is not particularly limited as long as it generates a protonic acid or a lewis acid by light irradiation, and may be an ionic photo acid generation type or a nonionic photo acid generation type.
Examples of the anionic moiety of the above ionic photoacid generator type photocationic polymerization initiator include BF4 -、PF6 -、SbF6 -、(BX4)-(wherein X represents a phenyl group substituted with at least 2 or more fluorine or trifluoromethyl groups), and the like. Further, as the above-mentioned anion moiety, there may be mentioned PFm(CnF2n+1)6-m -(wherein m is an integer of 0 to 5 inclusive, and n is an integer of 1 to 6 inclusive), and the like.
Examples of the ionic photoacid generator type photo-cationic polymerization initiator include aromatic sulfonium salts, aromatic iodonium salts, aromatic diazonium salts, aromatic ammonium salts, and (2, 4-cyclopentadien-1-yl) ((1-methylethyl) benzene) -Fe salts having the above-mentioned anionic portion.
Examples of the aromatic sulfonium salt include bis (4- (diphenylsulfonium) phenyl) sulfide bishexafluoroantimonate, bis (4- (diphenylsulfonium) phenyl) sulfide bistetrafluoroborate, bis (4- (diphenylsulfonium) phenyl) sulfide tetrakis (pentafluorophenyl) borate, diphenyl-4- (phenylthio) phenylsulfonium hexafluorophosphate, diphenyl-4- (phenylthio) phenylsulfonium hexafluoroantimonate, diphenyl-4- (phenylthio) phenylsulfonium tetrafluoroborate, diphenyl-4- (phenylthio) phenylsulfonium tetrakis (pentafluorophenyl) borate, triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexafluoroantimonate, triphenylsulfonium tetrafluoroborate, triphenylsulfonium tetrakis (pentafluorophenyl) borate, triphenylsulfonium tetrafluoroborate, and triphenylsulfonium tetrakis (pentafluorophenyl) borate, Bis (4- (2-hydroxyethoxy)) phenylsulfone) phenyl) sulfide bishexafluorophosphate, bis (4- (2-hydroxyethoxy)) phenylsulfone) phenyl) sulfide bishexafluoroantimonate, bis (4- (2-hydroxyethoxy)) phenylsulfone) phenyl) sulfide bistetrafluoroborate, bis (4- (2-hydroxyethoxy)) phenylsulfone) phenyl) sulfide tetrakis (pentafluorophenyl) borate, tris (4- (4-acetylphenyl) thiophenyl) sulfonium tetrakis (pentafluorophenyl) borate, and the like. Among them, triarylsulfonium tetrakis (pentafluorophenyl) borate such as triphenylsulfonium tetrakis (pentafluorophenyl) borate is preferable.
Examples of the aromatic iodonium salts include diphenyliodonium hexafluorophosphate, diphenyliodonium hexafluoroantimonate, diphenyliodonium tetrafluoroborate, diphenyliodonium tetrakis (pentafluorophenyl) borate, bis (dodecylphenyl) iodonium hexafluorophosphate, bis (dodecylphenyl) iodonium hexafluoroantimonate, bis (dodecylphenyl) iodonium tetrafluoroborate, bis (dodecylphenyl) iodonium tetrakis (pentafluorophenyl) borate, 4-methylphenyl-4- (1-methylethyl) phenyliodonium hexafluorophosphate, 4-methylphenyl-4- (1-methylethyl) phenyliodonium hexafluoroantimonate, 4-methylphenyl-4- (1-methylethyl) phenyliodonium tetrafluoroborate, 4-methylphenyl-4- (1-methylethyl) phenyliodonium tetrakis (pentafluorophenyl) borate, etc.
Examples of the aromatic diazonium salt include phenyldiazonium hexafluorophosphate, phenyldiazonium hexafluoroantimonate, phenyldiazonium tetrafluoroborate, and phenyldiazonium tetrakis (pentafluorophenyl) borate.
Examples of the aromatic ammonium salt include 1-benzyl-2-cyanopyridinium hexafluorophosphate, 1-benzyl-2-cyanopyridinium hexafluoroantimonate, 1-benzyl-2-cyanopyridinium tetrafluoroborate, 1-benzyl-2-cyanopyridinium tetrakis (pentafluorophenyl) borate, 1- (naphthylmethyl) -2-cyanopyridinium hexafluorophosphate, 1- (naphthylmethyl) -2-cyanopyridinium hexafluoroantimonate, 1- (naphthylmethyl) -2-cyanopyridinium tetrafluoroborate, and 1- (naphthylmethyl) -2-cyanopyridinium tetrakis (pentafluorophenyl) borate.
Examples of the (2, 4-cyclopentadien-1-yl) ((1-methylethyl) benzene) -Fe salt include (2, 4-cyclopentadien-1-yl) ((1-methylethyl) benzene) -Fe (ii) hexafluorophosphate, (2, 4-cyclopentadien-1-yl) ((1-methylethyl) benzene) -Fe (ii) hexafluoroantimonate, (2, 4-cyclopentadien-1-yl) ((1-methylethyl) benzene) -Fe (ii) tetrafluoroborate, and (2, 4-cyclopentadien-1-yl) ((1-methylethyl) benzene) -Fe (ii) tetrakis (pentafluorophenyl) borate.
Examples of the nonionic photoacid-generating type photocationic polymerization initiator include nitrobenzyl esters, sulfonic acid derivatives, phosphate esters, phenolsulfonic acid esters, diazonaphthoquinones, and N-hydroxyimide sulfonic acid esters.
Examples of commercially available products of the photo cation polymerization initiator include a photo cation polymerization initiator manufactured by Midori chemical company, a photo cation polymerization initiator manufactured by Union Carbide company, a photo cation polymerization initiator manufactured by ADEKA company, a photo cation polymerization initiator manufactured by 3M company, a photo cation polymerization initiator manufactured by BASF company, a photo cation polymerization initiator manufactured by Rhodia company, and a photo cation polymerization initiator manufactured by San-Apro company.
Examples of the photo-cationic polymerization initiator manufactured by Midori chemical company include DTS-200.
Examples of the photo-cationic polymerization initiator manufactured by Union Carbide include UVI6990 and UVI 6974.
Examples of the photo cation polymerization initiator manufactured by ADEKA include SP-150 and SP-170.
Examples of the photo cation polymerization initiator manufactured by 3M include FC-508 and FC-512.
Examples of the photo-cationic polymerization initiator manufactured by BASF include IRGACURE261 and IRGACURE 290.
Examples of the photo cation polymerization initiator manufactured by Rhodia include PI 2074.
Examples of the photo-cationic polymerization initiator manufactured by San-Apro include CPI-100P, CPI-200K, CPI-210S and the like.
Examples of the photo radical polymerization initiator include benzophenone compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, oxime ester compounds, benzoin ether compounds, thioxanthone compounds, and the like.
Specific examples of the photo radical polymerization initiator include 1-hydroxycyclohexyl phenyl ketone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone, 1, 2- (dimethylamino) -2- ((4-methylphenyl) methyl) -1- (4- (4-morpholinophenyl) -1-butanone, 2-dimethoxy-1, 2-diphenylethan-1-one, bis (2, 4, 6-trimethylbenzoyl) phenylphosphine oxide, 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropane-1-one, 1- (4- (2-hydroxyethoxy) -phenyl) -2-hydroxy-2-methyl-propan-1-one 1-propan-1-one, 1- (4- (phenylthio) phenyl) -1, 2-octanedione 2- (O-benzoyloxime), 2, 4, 6-trimethylbenzoyldiphenylphosphine oxide, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and the like.
The preferable lower limit of the content of the photopolymerization initiator is 0.01 part by weight and the preferable upper limit is 10 parts by weight with respect to 100 parts by weight of the curable resin. By setting the content of the photopolymerization initiator to 0.01 parts by weight or more, the obtained curable resin composition is more excellent in photocurability. By setting the content of the photopolymerization initiator to 10 parts by weight or less, the curing reaction of the obtained curable resin composition does not become excessively fast, the workability becomes more excellent, and the cured product can be made more uniform. The lower limit of the content of the polymerization initiator is more preferably 0.05 part by weight, and the upper limit is more preferably 5 parts by weight.
The curable resin composition of the present invention may contain a thermal polymerization initiator in an amount not to impair the object of the present invention.
As the thermal polymerization initiator, a thermal cationic polymerization initiator or a thermal radical polymerization initiator is suitably used depending on the kind of the curable resin to be used, and the like.
Examples of the thermal cationic polymerization initiator include: the anion being partly substituted by BF4 -、PF6 -、SbF6 -Or (BX)4)-(wherein X represents a phenyl group substituted with at least 2 or more fluorine groups or trifluoromethyl groups), sulfonium salts, phosphonium salts, ammonium salts, and the like. Among them, sulfonium salts and ammonium salts are preferable.
Examples of the sulfonium salt include triphenylsulfonium tetrafluoroborate and triphenylsulfonium hexafluoroantimonate.
Examples of the phosphonium salt include ethyltriphenylphosphonium hexafluoroantimonate and tetrabutylphosphonium hexafluoroantimonate.
Examples of the above ammonium salts include dimethylphenyl (4-methoxybenzyl) ammonium hexafluorophosphate, dimethylphenyl (4-methoxybenzyl) ammonium hexafluoroantimonate, dimethylphenyl (4-methoxybenzyl) ammonium tetrakis (pentafluorophenyl) borate, dimethylphenyl (4-methylbenzyl) ammonium hexafluorophosphate, dimethylphenyl (4-methylbenzyl) ammonium hexafluoroantimonate, dimethylphenyl (4-methylbenzyl) ammonium hexafluorotetrakis (pentafluorophenyl) borate, methylphenyldibenzylammonium hexafluorophosphate, methylphenyldibenzylammonium hexafluoroantimonate, methylphenyldibenzylammonium tetrakis (pentafluorophenyl) borate, phenyltribenzylammonium tetrakis (pentafluorophenyl) borate, dimethylphenyl (3, 4-dimethylbenzyl) ammonium tetrakis (pentafluorophenyl) borate, N-dimethyl-N-benzylanilinium hexafluoroantimonate, N-dimethyl-N-benzylammonium hexafluoroantimonate, N-methylbenzyl-ammonium hexafluoroantimonate, N-methyl-phenyl salt, N-methylbenzyl-ammonium hexafluoroantimonate, N-salt, N-methyl-benzyl ammonium salt, N-benzylammonium salt, N-ammonium salt, N-benzylammonium salt, N-phosphonium salt, N-benzylammonium salt, N-hexafluoroantimonate, N-benzylammonium salt, N-benzylammonium salt, N, n, N-diethyl-N-benzylanilinium tetrafluoroborate, N-dimethyl-N-benzylpyridinium hexafluoroantimonate, N-diethyl-N-benzylpyridinium trifluoromethanesulfonate and the like.
Examples of commercially available products of the above thermal cationic polymerization initiator include thermal cationic polymerization initiators manufactured by shin chemical Industries, and thermal cationic polymerization initiators manufactured by King Industries.
Examples of the thermal cationic polymerization initiator manufactured by Sanxin chemical industries include San-Aid SI-60, San-Aid SI-80, San-Aid SI-B3, San-Aid SI-B3A, and San-Aid SI-B4.
Examples of the thermal cationic polymerization initiator manufactured by King Industries include CXC-1612 and CXC-1821.
Examples of the thermal radical polymerization initiator include thermal radical polymerization initiators containing azo compounds, organic peroxides, and the like.
Examples of the azo compound include 2, 2' -azobis (2, 4-dimethylvaleronitrile), azobisisobutyronitrile, and the like.
Examples of the organic peroxide include benzoyl peroxide, ketone peroxide, peroxyketal, hydrogen peroxide, dialkyl peroxide, peroxyester, diacyl peroxide, peroxydicarbonate, and the like.
Examples of commercially available products of the thermal radical polymerization initiator include VPE-0201, VPE-0401, VPE-0601, VPS-0501, VPS-1001, and V-501 (all manufactured by Fuji film & Wako pure chemical industries, Ltd.).
The lower limit of the content of the thermal polymerization initiator is preferably 0.01 part by weight and the upper limit is preferably 10 parts by weight with respect to 100 parts by weight of the curable resin. When the content of the thermal polymerization initiator is in this range, the obtained curable resin composition is more excellent in storage stability and thermosetting property. A more preferable lower limit and a more preferable upper limit of the content of the thermal polymerization initiator are 0.05 parts by weight and 5 parts by weight, respectively.
The curable resin composition of the present invention contains a sensitizer.
The sensitizer described above contains an anthracene compound having an ester bond.
The curable resin composition of the present invention has excellent curability and transparency to light of a long wavelength by containing the anthracene compound having an ester bond as the sensitizer.
Examples of the anthracene compound having an ester bond include 9, 10-anthracene derivatives and the like.
Examples of the 9, 10-anthracene derivative include 9, 10-bis (octanoyloxy) anthracene, 9, 10-bis (2-ethylhexanoyloxy) anthracene, 9, 10-bis (n-nonanoyloxy) anthracene, and 9, 10-bis (acryloyloxy) anthracene. Among them, 9, 10-bis (octanoyloxy) anthracene is preferable. Furthermore, monosubstituted anthracene derivatives such as 9-octanoyloxyanthracene may also be used.
The lower limit of the content of the anthracene compound having an ester bond is preferably 0.1 part by weight, and the upper limit is preferably 5 parts by weight, based on 100 parts by weight of the curable resin. The sensitizing effect is further exhibited by setting the content of the anthracene compound having an ester bond to 0.1 part by weight or more. By setting the content of the anthracene compound having an ester bond to 5 parts by weight or less, the obtained liquid crystal display element is more excellent in display performance. A more preferable lower limit of the content of the anthracene compound having an ester bond is 0.3 parts by weight, and a more preferable upper limit is 3 parts by weight.
The curable resin composition of the present invention may contain a thermosetting agent in an amount not to impair the object of the present invention.
Examples of the heat-curing agent include hydrazide compounds, imidazole derivatives, acid anhydrides, dicyandiamide, guanidine derivatives, modified aliphatic polyamines, and addition products of various amines and epoxy resins.
Examples of the hydrazide compound include 1, 3-bis (hydrazinocarbonylethyl (Japanese: ヒドラジノ force ルボノ, USA チル)) -5-isopropylhydantoin, sebacic acid dihydrazide, isophthalic acid dihydrazide, adipic acid dihydrazide and malonic acid dihydrazide.
Examples of the imidazole derivative include 1-cyanoethyl-2-phenylimidazole, N- (2- (2-methyl-1-imidazolyl) ethyl) urea, 2, 4-diamino-6- (2 '-methylimidazolyl- (1')) -ethyl s-triazine, N '-bis (2-methyl-1-imidazolylethyl) urea, N' - (2-methyl-1-imidazolylethyl) -adipamide, 2-phenyl-4-methyl-5-hydroxymethylimidazole, and 2-phenyl-4, 5-dihydroxymethylimidazole.
Examples of the acid anhydride include tetrahydrophthalic anhydride and ethylene glycol bis (anhydrotrimellitate).
These heat-curing agents may be used alone, or 2 or more of them may be used in combination.
Examples of commercially available products of the above heat-curing agents include a heat-curing agent manufactured by Otsuka chemical Co., Ltd and a heat-curing agent manufactured by Ajinomoto Fine-Technio Co., Ltd.
Examples of the heat-curing agent manufactured by Otsuka chemical company include SDH and ADH.
Examples of the heat-curing agent manufactured by Ajinomoto Fine-Technio include AMICURE VDH, AMICURE VDH-J, and AMICURE UDH.
The lower limit of the content of the heat-curing agent is preferably 0.5 parts by weight and the upper limit is preferably 30 parts by weight with respect to 100 parts by weight of the curable resin. When the content of the thermosetting agent is in this range, the obtained curable resin composition has excellent thermosetting properties while maintaining excellent storage stability. The lower limit of the content of the thermosetting agent is more preferably 1 part by weight, and the upper limit is more preferably 15 parts by weight.
The curable resin composition of the present invention preferably contains a stabilizer. By containing the stabilizer, the curable resin composition of the present invention is more excellent in storage stability.
As the stabilizer, an aromatic amine compound is suitably used.
Examples of the aromatic amine compound include benzylamine and aminophenol type epoxy resins.
Examples of the aminophenol type epoxy resin include triglycidyl-p-aminophenol.
Among them, benzylamine is preferable.
These stabilizers may be used alone or in combination of 2 or more.
The lower limit of the content of the stabilizer is preferably 0.001 parts by weight, and the upper limit is preferably 2 parts by weight, based on 100 parts by weight of the curable resin. When the content of the stabilizer is in this range, the obtained curable resin composition has more excellent storage stability while maintaining excellent curability. A more preferable lower limit of the content of the stabilizer is 0.005 parts by weight, and a more preferable upper limit is 1 part by weight.
The curable resin composition of the present invention may contain a silane coupling agent. The silane coupling agent has an effect of improving the adhesion of the curable resin composition of the present invention to a substrate or the like.
Examples of the silane coupling agent include 3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, and 3-isocyanatopropyltrimethoxysilane. These silane coupling agents may be used alone, or 2 or more of them may be used in combination.
The preferable lower limit of the content of the silane coupling agent is 0.1 part by weight, and the preferable upper limit is 10 parts by weight, based on 100 parts by weight of the curable resin. When the content of the silane coupling agent is in this range, bleeding of the excess silane coupling agent is suppressed, and the effect of improving the adhesion is further enhanced. A more preferable lower limit of the content of the silane coupling agent is 0.5 parts by weight, and a more preferable upper limit is 5 parts by weight.
The curable resin composition of the present invention may further contain a surface modifier within a range not to impair the object of the present invention. The surface modifier can improve the flatness of the coating film of the curable resin composition of the present invention.
Examples of the surface modifier include a surfactant and a leveling agent.
Examples of the surface modifier include silicone-based surface modifiers and fluorine-based surface modifiers.
Examples of commercially available surface modifiers include surface modifiers manufactured by BYK-Chemie Japan and surface modifiers manufactured by AGC SEIMI CHEMICAL.
Examples of the surface modifier manufactured by BYK-Chemie Japan include BYK-330, BYK-340 and BYK-345.
Examples of the surface modifier manufactured by AGC SEIMI CHEMICAL include Surflon S-611.
The curable resin composition of the present invention may contain a solvent for the purpose of adjusting viscosity or the like, but since there is a possibility that the organic light-emitting material layer deteriorates or outgas occurs due to the residual solvent, it is preferable that the solvent is not contained or the content of the solvent is 0.05 wt% or less.
The curable resin composition of the present invention may contain, as necessary, various known additives such as reinforcing agents, softening agents, plasticizers, viscosity modifiers, ultraviolet absorbers, and antioxidants.
Examples of the method for producing the curable resin composition of the present invention include a method in which a curable resin, a photopolymerization initiator, a sensitizer, and additives such as a stabilizer and a surface modifier are mixed by using a mixer.
Examples of the mixer include a homomixer, a universal mixer, a planetary mixer, a kneader, and a three-roll mixer.
The curable resin composition of the present invention can be suitably applied by an ink jet method.
In the ink jet method, the curable resin composition of the present invention can be used for coating by a non-heating type ink jet method, and can also be used for coating by a heating type ink jet method.
In the present specification, the "non-heating type ink jet method" is a method of performing ink jet coating at a coating head temperature of less than 28 ℃, and the "heating type ink jet method" is a method of performing ink jet coating at a coating head temperature of 28 ℃ or higher.
In the above-described heating type ink jet method, an ink jet coating head equipped with a heating mechanism is used. By mounting the heating mechanism on the ink jet coating head, viscosity and surface tension can be reduced when the curable resin composition is discharged.
Examples of the ink-jet coating head equipped with the heating mechanism include KM1024 series manufactured by Konica Minolta, and SG1024 series manufactured by FUJIFILM Dimatix.
When the curable resin composition of the present invention is used for coating by the above-described heating inkjet method, the heating temperature of the coating head is preferably in the range of 28 to 80 ℃. By setting the heating temperature of the coating head in this range, the viscosity increase of the curable resin composition with time is further suppressed, and the ejection stability is further improved.
The viscosity of the curable resin composition of the present invention at 25 ℃ is preferably 5 mPas at the lower limit and 50 mPas at the upper limit. When the viscosity at 25 ℃ is in this range, the coating can be appropriately performed by an ink jet method.
In the present specification, the "viscosity" refers to a value measured by using an E-type viscometer at 25 ℃ and 100 rpm. The E-type VISCOMETER includes, for example, a viscoester TV-22 (manufactured by eastern industries), and a CP1 type cone plate can be used.
The viscosity of the curable resin composition of the present invention at 25 ℃ when applied by the non-heating inkjet method has a preferred lower limit of 5mPa · s and a preferred upper limit of 20mPa · s. When the viscosity at 25 ℃ is in this range, the coating can be appropriately performed by a non-heating type inkjet method. A more preferable lower limit of the viscosity at 25 ℃ of the curable resin composition of the present invention when applied by the non-heating inkjet method is 8mPa · s, a more preferable upper limit is 16mPa · s, a further more preferable lower limit is 10mPa · s, and a further more preferable upper limit is 13mPa · s.
On the other hand, the viscosity of the curable resin composition of the present invention used for coating by the above-mentioned heating inkjet method at 25 ℃ preferably has a lower limit of 10mPa · s and an upper limit of 50mPa · s. When the viscosity is in this range, the coating can be appropriately performed by a heating inkjet method. A more preferable lower limit of the viscosity at 25 ℃ of the curable resin composition of the present invention used for coating by the above-described heating inkjet method is 20mPa · s, and a more preferable upper limit is 40mPa · s.
The lower limit of the surface tension of the curable resin composition of the present invention at 25 ℃ is preferably 15mN/m, and the upper limit is preferably 35 mN/m. By setting the surface tension at 25 ℃ to this range, the coating can be appropriately performed by an ink jet method. A more preferable lower limit to the surface tension at 25 ℃ is 20mN/m, a more preferable upper limit is 30mN/m, a further preferable lower limit is 22mN/m, and a further preferable upper limit is 28 mN/m.
The surface tension is a value measured by the Wilhelmy method using a dynamic wettability tester. Examples of the dynamic wettability tester include WET-6100 (manufactured by RHESCA).
The lower limit of the total light transmittance of a cured product of the curable resin composition of the present invention for light having a wavelength of 380nm to 800nm is preferably 80%. By setting the total light transmittance to 80% or more, the optical characteristics of the obtained organic EL display device are more excellent. A more preferable lower limit of the total light transmittance is 85%.
The total light transmittance can be measured, for example, by a spectrometer.
Examples of the spectrometer include AUTOMATIC HAZE METER MODEL TC-III DPK (manufactured by Tokyo electrochrome Co., Ltd.).
The cured product used for the measurement of the total light transmittance may be obtained by irradiating the curable resin composition with 2000mJ/cm using an LED lamp, for example2Ultraviolet ray having a wavelength of 395nmThus obtaining the product.
The curable resin composition of the present invention preferably has a transmittance at 400nm of 85% or more in an optical path length of 20 μm after the cured product is irradiated with ultraviolet light for 100 hours. When the transmittance after 100 hours of irradiation with the ultraviolet ray is 85% or more, the transparency is high, the loss of light emission is small, and the color reproducibility is further excellent. A more preferable lower limit of the transmittance after the irradiation with the ultraviolet ray for 100 hours is 90%, and a further preferable lower limit is 95%.
As the light source for irradiating the ultraviolet ray, a conventionally known light source such as a xenon lamp or a carbon arc lamp can be used.
The cured product used for the measurement of the transmittance after the irradiation with ultraviolet light for 100 hours may be obtained by, for example, irradiating a curable resin composition with an LED lamp at 2000mJ/cm2Ultraviolet rays having a wavelength of 395 nm.
The curable resin composition of the present invention preferably has a moisture permeability of 100 μm at a thickness of 100 μm measured by exposing a cured product to an atmosphere of 85 ℃ and 85% RH for 24 hours in accordance with JIS Z02082The following. By setting the above moisture permeability to 100g/m2As described above, the effect of preventing the occurrence of dark spots due to the moisture from reaching the organic light-emitting material layer is more excellent, and the reliability of the obtained organic EL display element is more excellent.
The cured product used for the measurement of the moisture permeability can be obtained by irradiating 2000mJ/cm of the curable resin composition with an LED lamp2Ultraviolet rays having a wavelength of 395 nm.
In the curable resin composition of the present invention, when the cured product is exposed to an environment of 85 ℃ and 85% RH for 24 hours, the water content of the cured product is preferably less than 0.5%. When the water content of the cured product is less than 0.5%, the effect of preventing the organic light-emitting material layer from being deteriorated by the water content in the cured product is more excellent, and the reliability of the obtained organic EL display device is more excellent. A more preferable upper limit of the water content of the cured product is 0.3%.
Examples of the method for measuring the water content include a method of obtaining the water content by the karl fischer method according to JIS K7251, and a method of obtaining the weight gain after water absorption according to JIS K7209-2.
The cured product used for the measurement of the water content can be obtained by irradiating the curable resin composition with 2000mJ/cm using an LED lamp, for example2Ultraviolet rays having a wavelength of 395 nm.
A cured product of the curable resin composition of the present invention, that is, a cured product of a sealing agent for an organic EL display element, wherein the sealing agent for an organic EL display element contains a curable resin, a photopolymerization initiator, and a sensitizer, the sensitizer contains an anthracene compound having an ester bond, and the amount of anthraquinone, which is quantified in terms of toluene, is 300ppm or less when the cured product is measured by thermal desorption GC-MS under thermal desorption conditions of 110 ℃ and 30 minutes, is also one aspect of the present invention.
The cured product of the present invention can be obtained by irradiating the curable resin composition of the present invention with light.
Specifically, the curable resin composition of the present invention can be produced by irradiating 300mJ/cm2Above 3000mJ/cm2The following light of the accumulated light amount is appropriately cured. The curable resin composition of the present invention can be cured by irradiation with light having a long wavelength such as 395 nm.
Examples of the light source used for the light irradiation include a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, an excimer laser, a chemical lamp, a black light lamp, a microwave-excited mercury lamp, a metal halide lamp, a sodium lamp, a halogen lamp, a xenon lamp, an LED lamp, a fluorescent lamp, sunlight, and an electron beam irradiation device. These light sources may be used alone, or 2 or more kinds may be used in combination.
These light sources may be appropriately selected according to the kinds of the photopolymerization initiator and the sensitizer.
Examples of the irradiation means of light with respect to the curable resin composition of the present invention include simultaneous irradiation with various light sources, sequential irradiation with a time difference, and combined irradiation of simultaneous irradiation and sequential irradiation.
Examples of the method for producing an organic EL display element using the curable resin composition of the present invention include: a method comprising a step of applying the curable resin composition of the present invention to a substrate, and a step of curing the applied curable resin composition.
In the step of applying the curable resin composition of the present invention to a substrate, the curable resin composition of the present invention may be applied to the entire surface of the substrate or may be applied to a part of the substrate. The shape of the sealing portion of the curable resin composition of the present invention formed by coating is not particularly limited as long as it is a shape capable of protecting the laminate having the organic light-emitting material layer from the external gas, and may be a shape completely covering the laminate, a closed pattern may be formed in the peripheral portion of the laminate, or a pattern having a shape in which an opening is partially formed in the peripheral portion of the laminate.
The cured product of the present invention obtained by the step of curing the curable resin composition can be coated with an inorganic material film.
As the inorganic material constituting the inorganic material film, conventionally known inorganic materials can be used, and examples thereof include silicon nitride (SiNx), silicon oxide (SiOx), and the like. The inorganic material film may be formed of 1 layer, or may be formed by laminating a plurality of layers. Alternatively, the laminate may be coated by alternately and repeatedly laminating the inorganic material films and the cured product of the present invention.
The method of manufacturing the organic EL display element may have: a step of bonding a substrate (hereinafter, also referred to as "one substrate") coated with the curable resin composition of the present invention to another substrate.
The substrate (hereinafter, also referred to as "one substrate") to which the curable resin composition of the present invention is applied may be a substrate on which a laminate having an organic light-emitting material layer is formed, or may be a substrate on which the laminate is not formed.
In the case where the one substrate is a substrate on which the laminate is not formed, the curable resin composition of the present invention may be applied to the one substrate so that the laminate can be protected from external air when the other substrate is bonded. That is, the entire surface of the portion to be the position of the laminate when the other substrate is bonded may be coated, or the sealant portion having the closed pattern may be formed in a shape in which the portion to be the position of the laminate when the other substrate is bonded is completely received.
The step of curing the curable resin composition may be performed before the step of bonding the one substrate to the other substrate, or may be performed after the step of bonding the one substrate to the other substrate.
In the case of the step of curing the curable resin composition before the step of bonding the one substrate to the other substrate, the curable resin composition of the present invention preferably has a pot life of 1 minute or more from the time of light irradiation until the curing reaction proceeds and bonding is impossible. By setting the usable time to 1 minute or more, curing does not excessively proceed before the one base material and the other base material are bonded to each other, and a higher adhesive strength can be obtained.
In the step of bonding the one substrate to the other substrate, it is preferable that the one substrate and the other substrate are bonded to each other in a reduced-pressure atmosphere.
The lower limit of the degree of vacuum in the reduced pressure atmosphere is preferably 0.01kPa, and the upper limit is preferably 10 kPa. By setting the degree of vacuum in the reduced-pressure atmosphere to this range, bubbles in the curable resin composition of the present invention at the time of bonding the one substrate to the other substrate can be removed more efficiently without taking a long time to achieve a vacuum state from the viewpoint of airtightness of a vacuum apparatus and the capability of a vacuum pump.
The curable resin composition of the present invention can be used as a sealant for an organic EL display element.
An organic EL display device having the cured product of the present invention is also one aspect of the present invention. The curable resin composition of the present invention is particularly suitable for sealing a top emission type organic EL display element.
The curable resin composition of the present invention is also suitable as an adhesive for lithium ion batteries.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, a curable resin composition which is excellent in curability against light of a long wavelength and low outgassing property and can suppress display defects of an organic EL display element can be provided. Further, the present invention can provide a cured product of the curable resin composition and an organic EL display element having the cured product.
Detailed Description
The present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples.
(examples 1 to 5, comparative examples 1 and 2)
The curable resin compositions of examples 1 to 5 and comparative examples 1 and 2 were prepared by uniformly stirring and mixing the respective materials at a stirring speed of 300rpm using a homogeneous dispersion type stirring mixer in accordance with the mixing ratios described in table 1. As the homo-dispersion type stirring mixer, homo-disperser L type (manufactured by PRIMIX Co., Ltd.) was used.
The obtained curable resin composition was irradiated with an LED lamp at 2000mJ/cm in a dry chamber having a dew point of-50 ℃ or lower2Ultraviolet rays having a wavelength of 395nm, thereby obtaining a cured product. 1mg of each of the obtained cured products was measured for the amount of anthraquinone and the total amount of outgas in terms of toluene when heated under thermal desorption conditions of 110 ℃ for 30 minutes using a thermal desorption apparatus and a GC-MS apparatus. Specific measurement conditions are shown below.
A thermal desorption device: turbo Matrix650(Perkin Elmer Co., Ltd.)
Thermal desorption conditions: 110 ℃ for 30 minutes
Shunting: 15 mL/min at the inlet, 15 mL/min at the outlet and 5.2% of the injection amount
GC-MS apparatus: JMS Q1000 (Japanese electronic official system)
Separating the column: EQUITY-1 (nonpolarity)
0.32mm×60m×0.25μm
GC temperature rise rate: 4 minutes at 40 deg.C → 10 deg.C/min → 10 minutes at 300 deg.C
Carrier gas (flow rate): he (1.5 mL/min)
MS measurement range: 29 to 600amu (scanning 500ms)
Ionization voltage: 70eV
MS temperature: the ion source is 230 ℃, and the interface is 250 DEG C
The results are shown in Table 1.
< evaluation >
The following evaluations were made for each of the curable resin compositions obtained in examples and comparative examples. The results are shown in Table 1.
(1) Viscosity of the oil
The viscosity of each of the curable resin compositions obtained in examples and comparative examples was measured at 25 ℃ and 100rpm using a CP1 type conical plate with an E-type VISCOMETER ("VISCOMETER TV-22" manufactured by Toyobo industries Co., Ltd.).
(2) Surface tension
The surface tension of each of the curable resin compositions obtained in examples and comparative examples was measured at 25 ℃ by a dynamic wettability tester ("WET-6100" manufactured by RHESCA).
(3) Display performance of organic EL display element
The organic EL display devices were obtained by the methods shown in (3-1) to (3-4) below. The display performance of the organic EL display device obtained was evaluated by the following methods (3-5) and (3-6).
(3-1) production of substrate having laminate comprising organic light-emitting Material layer
On glass with the length of 25mm, the width of 25mm and the thickness of 0.7mm to formThe ITO electrode was formed into a film to form a substrate. The substrate was ultrasonically cleaned with acetone, an aqueous alkali solution, ion-exchange water, and isopropyl alcohol for 15 minutes, then cleaned with boiling isopropyl alcohol for 10 minutes, and further pretreated with a UV-ozone cleaner. As the UV-ozone cleaner, NL-UV253 (Japan) was usedlaser electronic metric system).
Next, the pretreated substrate was fixed to a substrate holder of a vacuum deposition apparatus, 200mg of N, N '-di (1-naphthyl) -N, N' -diphenylbenzidine (. alpha. -NPD) was charged into a bisque-fired crucible, and 200mg of tris (8-hydroxyquinoline) aluminum (Alq) was charged into another bisque-fired crucible3) The pressure in the vacuum chamber is reduced to 1 × 10-4Pa. Then, the crucible containing the alpha-NPD is heated to evaporate the alpha-NPD at a vapor deposition rateDeposited on a substrate to form a film having a thicknessThe hole transport layer of (1). Next, adding Alq3Is heated toThe deposition rate of (2) is set to a film thicknessThe organic light emitting material layer of (1). Then, the substrate on which the hole transport layer and the organic light emitting material layer were formed was transferred to another vacuum evaporation apparatus having tungsten resistance heating boats, 200mg of lithium fluoride was added to one of the tungsten resistance heating boats in the vacuum evaporation apparatus, and 1.0g of an aluminum wire was placed in the other tungsten resistance heating boat. Then, the pressure in the evaporator of the vacuum evaporation apparatus was reduced to 2 × 10-4pa, lithium fluoride or lithium fluorideThe deposition rate of (2) isThen, aluminum is addedAt a rate of film formation ofThe inside of the evaporator was returned to normal pressure by nitrogen, and the substrate provided with the laminate having the organic light-emitting material layers of 10mm × 10mm was taken out.
(3-2) coating with an inorganic Material film
A mask having an opening of 13mm × 13mm was provided on the obtained substrate on which the laminate was disposed, and an inorganic material film was formed by a plasma CVD method so as to cover the entire laminate.
The plasma CVD method was performed under the following conditions: using SiH4Gas and nitrogen gas were used as raw material gases, and the respective flow rates were SiH4The gas was changed to 10sccm and the nitrogen gas was changed to 200sccm, the RF power was changed to 10W (frequency: 2.45GHz), the temperature in the chamber was changed to 100 ℃, and the pressure in the chamber was changed to 0.9 Torr.
The thickness of the inorganic material film formed was about 1 μm.
(3-3) formation of cured product
The curable resin compositions obtained in examples and comparative examples were applied to the entire surface of a concave portion of a glass lid separately prepared and having a concave portion of 15mm × 15mm so as to have a thickness of 10 μm using an inkjet ejection apparatus. As the inkjet ejection device, NanoPrinter300 (manufactured by Microjet) was used, and as the inkjet application head, IJH-30 (manufactured by IJT) was used, and inkjet application was performed without heating (application head temperature 25 ℃).
Then, 2000mJ/cm was irradiated with an LED lamp2Ultraviolet rays having a wavelength of 395nm cure the curable resin composition to form a cured product.
(3-4) glass Cap seal
The peripheral edge of the glass cover obtained in the above "(3-3) formation of cured product" was coated with a low moisture-permeable epoxy adhesive, and the substrate obtained in the above "(3-2) coating with an inorganic material film" was covered with the epoxy adhesive, and glass cover sealing was performed, thereby obtaining an organic EL display element for evaluation.
(3-5) measurement of initial dark Point diameter
The organic EL display device obtained was observed by an optical microscope for the light emission state when a voltage of 3V was applied, and the initial dark spot diameter was measured. When there are a plurality of dark spots, the dark spots having a diameter of about 20 μm are observed preferentially.
(3-6) dark spot diameter enlargement Rate
The obtained organic EL display device was heated at 110 ℃ under an atmosphere having a humidity of less than 1% for 30 minutes, and then a voltage of 3V was applied, and the light emission state of the organic EL display device was observed with an optical microscope, and the diameter of the dark spot after 110 ℃ and 30 minutes was measured in the same manner as the above "(3-5) measurement of the initial diameter of the dark spot".
The display performance of the organic EL display element was evaluated by designating "excellent" when the dark spot diameter expansion ratio was 2.5 times or less, designating "o" when the dark spot diameter expansion ratio was more than 2.5 times and 3.0 times or less, designating "Δ" when the dark spot diameter expansion ratio was more than 3.0 times and 3.5 times or less, and designating "x" when the dark spot diameter expansion ratio was more than 3.5 times and 3.5 times or less.
The dark spot diameter enlargement ratio was calculated by the following equation.
Dark spot diameter enlargement rate (110 ℃, dark spot diameter after 30 minutes)/(initial dark spot diameter)
[ Table 1]
Industrial applicability
The present invention can provide a curable resin composition which has excellent curability with respect to light of a long wavelength and low outgassing property, and can suppress display defects of an organic EL display device. Further, the present invention can provide a cured product of the curable resin composition and an organic EL display element having the cured product.
Claims (6)
1. A curable resin composition which is used as a sealing agent for an organic electroluminescent display element,
the curable resin composition contains a curable resin, a photopolymerization initiator and a sensitizer,
the sensitizer comprises an anthracene compound having an ester bond,
when a cured product of the curable resin composition is measured by thermal desorption GC-MS under thermal desorption conditions of 110 ℃ for 30 minutes, the amount of anthraquinone, which is quantified in terms of toluene, is 300ppm or less.
2. The curable resin composition according to claim 1, wherein the total amount of outgas determined in terms of toluene is 6000ppm or less when the cured product is measured by thermal desorption GC-MS under thermal desorption conditions of 110 ℃ for 30 minutes.
3. The curable resin composition according to claim 1 or 2, having a viscosity of 5 mPas or more and 50 mPas or less at 25 ℃.
4. The curable resin composition according to claim 1, 2 or 3, having a surface tension at 25 ℃ of 15mN/m or more and 35mN/m or less.
5. A cured product of a sealing agent for an organic electroluminescent display element,
the sealant for organic electroluminescent display element comprises curable resin, photopolymerization initiator and sensitizer,
the sensitizer comprises an anthracene compound having an ester bond,
when the cured product was subjected to thermal desorption GC-MS measurement under thermal desorption conditions of 110 ℃ for 30 minutes, the amount of anthraquinone quantified in terms of toluene was 300ppm or less.
6. An organic electroluminescent display device comprising the cured product according to claim 5.
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JP2014148662A (en) * | 2013-01-11 | 2014-08-21 | Kawasaki Kasei Chem Ltd | Sensitizer for photocationic polymerization |
WO2015029689A1 (en) * | 2013-08-26 | 2015-03-05 | 積水化学工業株式会社 | Photo-post-curing resin composition |
US20150210905A1 (en) * | 2012-07-26 | 2015-07-30 | Denki Kagaku Kogyo Kabushiki Kaisha | Resin composition |
JP2015199815A (en) * | 2014-04-08 | 2015-11-12 | 川崎化成工業株式会社 | photopolymerizable composition |
JP2018095679A (en) * | 2016-12-08 | 2018-06-21 | 三井化学株式会社 | Sheet-like seal material, display element seal material, surface sealing material for organic el element, organic el device, and method for manufacturing organic el device |
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KR100685845B1 (en) | 2005-10-21 | 2007-02-22 | 삼성에스디아이 주식회사 | Organic eletroluminescence display device and method for fabricating of the same |
JP5044326B2 (en) | 2007-08-28 | 2012-10-10 | パナソニック株式会社 | Epoxy resin composition and resin sealing device |
JP6560985B2 (en) * | 2014-01-23 | 2019-08-14 | デンカ株式会社 | Resin composition |
WO2018074505A1 (en) * | 2016-10-19 | 2018-04-26 | 積水化学工業株式会社 | Sealant for organic el display elements |
JP7199004B2 (en) * | 2017-04-28 | 2023-01-05 | パナソニックIpマネジメント株式会社 | UV curable resin composition and organic EL light emitting device |
JP7262038B2 (en) * | 2018-08-03 | 2023-04-21 | パナソニックIpマネジメント株式会社 | Ultraviolet curable resin composition for encapsulating organic EL element, method for manufacturing organic EL light emitting device, and organic EL light emitting device |
KR102389442B1 (en) * | 2018-08-10 | 2022-04-21 | 미쓰이 가가쿠 가부시키가이샤 | encapsulant |
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US20150210905A1 (en) * | 2012-07-26 | 2015-07-30 | Denki Kagaku Kogyo Kabushiki Kaisha | Resin composition |
JP2014148662A (en) * | 2013-01-11 | 2014-08-21 | Kawasaki Kasei Chem Ltd | Sensitizer for photocationic polymerization |
WO2015029689A1 (en) * | 2013-08-26 | 2015-03-05 | 積水化学工業株式会社 | Photo-post-curing resin composition |
JP2015199815A (en) * | 2014-04-08 | 2015-11-12 | 川崎化成工業株式会社 | photopolymerizable composition |
JP2018095679A (en) * | 2016-12-08 | 2018-06-21 | 三井化学株式会社 | Sheet-like seal material, display element seal material, surface sealing material for organic el element, organic el device, and method for manufacturing organic el device |
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