CN113163580A - Novel compound counterpoint target of figure and HDI board - Google Patents

Novel compound counterpoint target of figure and HDI board Download PDF

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Publication number
CN113163580A
CN113163580A CN202110449807.3A CN202110449807A CN113163580A CN 113163580 A CN113163580 A CN 113163580A CN 202110449807 A CN202110449807 A CN 202110449807A CN 113163580 A CN113163580 A CN 113163580A
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China
Prior art keywords
alignment
target
hole
blind hole
holes
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CN202110449807.3A
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CN113163580B (en
Inventor
孟昭光
赵南清
蔡志浩
曾国权
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Dongguan Wuzhu Technology Co ltd
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Dongguan Wuzhu Technology Co ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0269Marks, test patterns or identification means for visual or optical inspection

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The invention discloses a novel graphic composite alignment target and a HDI board, which comprise annular alignment blind holes, wherein an alignment through hole is formed in the middle of each alignment blind hole, and the alignment through hole and the alignment blind holes share a central point; an annular circuit pattern is formed between the outer boundary of the alignment through hole and the inner boundary of the alignment blind hole, the outer boundary of the circuit pattern is connected with the inner boundary of the alignment blind hole, and the inner boundary of the circuit pattern and the outer boundary of the alignment through hole are etched and removed. The alignment blind holes and the alignment through holes are simultaneously fused in the alignment targets, the annular line patterns are fused, the alignment through holes and the alignment blind holes can be simultaneously grabbed to balance alignment deviation caused by the two hole types, the pattern alignment efficiency is improved, the annular line patterns are further grabbed, and the line patterns are respectively aligned with the alignment through holes and the alignment blind holes to be checked, so that the pattern alignment precision and accuracy are further improved, and the pattern alignment efficiency is improved.

Description

Novel compound counterpoint target of figure and HDI board
Technical Field
The invention belongs to the technical field of PCBs, and particularly relates to a novel graphic composite alignment target and an HDI board.
Background
The Circuit Board is PCB (Printed Circuit Board), and in the PCB manufacture process, the target design is an important auxiliary design, and is mainly used for the processes of mechanical drilling positioning, image transfer alignment and the like, especially in the HDI (High Density interconnect) Board manufacture process, the alignment target is more important, and whether the alignment target design is reasonable or not is directly related to the accuracy of alignment between HDI Board layers.
According to the production and manufacturing process flow of the HDI board, through holes, blind holes and other different types and hole patterns of the process exist in the HDI board, in the manufacturing process of each layer of the HDI board, due to the size expansion and shrinkage of the board, deviation exists during pattern alignment, if the through holes are used as alignment references, the blind holes are prone to deviation, and if the blind holes are used as alignment references, the through holes are prone to deviation.
How to balance the problem that HDI board leads to, the blind hole matches, prior art provides a compound counterpoint target of figure to the counterpoint deviation that two kinds of pass brought is balanced, promotes the figure and counterpoints efficiency. However, the reference unit of the alignment still has only blind holes and through holes, and there is still room for further improvement to improve the alignment accuracy and the alignment efficiency.
Disclosure of Invention
The invention aims to provide a novel graphic composite alignment target and an HDI board, and aims to solve the technical problems.
In order to achieve the purpose, the invention adopts the following technical scheme:
the first aspect provides a novel graphic composite alignment target, which comprises an annular alignment blind hole, wherein an alignment through hole is formed in the middle of the alignment blind hole, and the alignment through hole and the alignment blind hole share a central point;
the outer boundary of counterpoint through-hole with be formed with annular circuit figure between the inner boundary of counterpoint blind hole, the outer boundary of circuit figure with the inner boundary of counterpoint blind hole is connected, the inner boundary of circuit figure with by the etching removal between the outer boundary of counterpoint through-hole.
Optionally, the alignment blind hole and the circuit pattern are both circular rings or square rings, and the alignment through hole is a circular hole or a square hole.
Optionally, the alignment blind hole is formed by arranging a plurality of laser blind holes which are adjacent to each other and have a diameter of 0.1 mm.
Optionally, the alignment through hole is formed by arranging a plurality of laser through holes which are adjacent to each other and have a diameter of 0.1 mm.
In a second aspect, an HDI plate is provided that includes the novel graphical composite alignment target described above.
Optionally, four angles of the HDI board include one respectively the compound counterpoint target of novel figure is first target, second target, third target and fourth target respectively in proper order.
Optionally, a connection line between a center point of the alignment blind hole of the first target and a center point of the alignment blind hole of the second target is perpendicular to a connection line between a center point of the alignment blind hole of the second target and a center point of the alignment blind hole of the third target;
and the distance between the central point of the alignment blind hole of the first target and the central point of the alignment blind hole of the fourth target is smaller than the distance between the central point of the alignment blind hole of the second target and the central point of the alignment blind hole of the third target.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
according to the novel graphic composite alignment target and the HDI board provided by the embodiment of the invention, the alignment blind hole and the alignment through hole are simultaneously fused in the alignment target, and the annular circuit graphic is fused, so that two alignment targets of the alignment through hole and the alignment blind hole can be captured simultaneously firstly to balance alignment deviation brought by two hole types, the graphic alignment efficiency is improved, the annular circuit graphic is further captured, and the graphic alignment precision and accuracy are further improved and the graphic alignment efficiency is improved by respectively carrying out alignment check on the circuit graphic with the alignment through hole and the alignment blind hole.
Therefore, the novel graphic composite alignment target and the HDI board provided by the embodiment of the invention integrate the alignment through hole, the alignment blind hole and the annular circuit graphic, and the alignment precision and accuracy are further improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so that those skilled in the art can understand and read the present invention, and do not limit the conditions for implementing the present invention, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the functions and purposes of the present invention, should still fall within the scope covered by the contents disclosed in the present invention.
Fig. 1 is a structural diagram of a novel graphic composite alignment target according to an embodiment of the present invention;
fig. 2 is a structural diagram of an HDI board according to an embodiment of the present invention.
Illustration of the drawings:
10. HDI board; 11. aligning the blind holes; 12. aligning the through holes; 13. a circuit pattern; 20. a first target; 30. a second target; 40. a third target; 50. a fourth target.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Please refer to fig. 1.
The embodiment provides a novel compound counterpoint target of figure, including annular counterpoint blind hole 11, seted up counterpoint through-hole 12 in the centre of counterpoint blind hole 11, counterpoint through-hole 12 and counterpoint blind hole 11 common central point.
An annular circuit pattern 13 is formed between the outer boundary of the alignment through hole 12 and the inner boundary of the alignment blind hole 11, the outer boundary of the circuit pattern 13 is connected with the inner boundary of the alignment blind hole 11, and the inner boundary of the circuit pattern 13 and the outer boundary of the alignment through hole 12 are etched and removed.
It should be understood that, in the present embodiment, the alignment blind hole 11 and the alignment through hole 12 may also be holes with other regular shapes, for example, the alignment blind hole 11 may also be a blind hole with a square ring shape, and the alignment through hole 12 is a square hole, in this case, the alignment blind hole 11 and the alignment through hole 12 may be replaced by a center of the square ring or the square, and they may also have the same or similar functions or effects, so they are within the protection scope of the present invention.
For example, the alignment blind holes 11 and the circuit patterns 13 are both circular rings or square rings, and the alignment through holes 12 are round holes or square holes. In this embodiment, the alignment blind hole 11 and the circuit pattern 13 are both circular rings, the alignment through hole 12 is a circular hole, and the center point is a circle center.
The alignment inspection method of the embodiment comprises the following steps:
1. firstly, two alignment targets, namely an alignment through hole 12 and an alignment blind hole 11, are simultaneously grabbed to balance alignment deviation caused by the two hole types and improve the pattern alignment efficiency;
2. the annular circuit pattern 13 is further captured, and alignment degree check is performed on the circuit pattern 13 with the alignment through hole 12 and the alignment blind hole 11, for example, the position (center point) deviation between the circuit pattern 13 and the alignment blind hole 11 and the position (center point) deviation between the circuit pattern 13 and the alignment through hole 12. For example, the center of the inner ring of the circuit pattern 13 is checked for alignment with the center of the blind alignment hole 11 or the through alignment hole 12, and the center of the outer ring of the circuit pattern 13 is checked for alignment with the center of the blind alignment hole 11 or the through alignment hole 12. It should be understood that by comprehensively utilizing the shape characteristic parameters of the circuit pattern 13, the blind alignment holes 11 and the through alignment holes 12, there can be more types of parameter combinations for performing the alignment check.
Therefore, the novel graphic composite alignment target provided by the embodiment of the invention integrates the alignment through hole 12, the alignment blind hole 11 and the annular circuit graphic 13, and the alignment precision and accuracy are further improved.
As an optional implementation manner of this embodiment, the alignment blind hole 11 and the alignment through hole 12 are formed by multiple times of drilling with laser by using a laser drilling device, and the diameter of the hole drilled by the laser drilling device at one time may be 0.1 mm. The alignment blind hole 11 is formed by arranging a plurality of laser blind holes which are adjacent to each other and have the diameter of 0.1 mm; the alignment through hole 12 is formed by arranging a plurality of laser through holes which are adjacent to each other and have the diameter of 0.1 mm.
Example two
Please refer to fig. 2.
The present embodiment provides an HDI board 10 that includes the novel graphical composite alignment targets described above. The HDI board 10 provided in this embodiment also has the advantages described above, and combines the alignment through hole 12, the alignment blind hole 11, and the annular circuit pattern 13, so that the alignment precision and accuracy are further improved.
Further, the four corners of the HDI board 10 respectively include a new graphical composite alignment target, counterclockwise being the first target 20, the second target 30, the third target 40 and the fourth target 50 respectively.
Optionally, HDI board 10 is a square board. The HDI board 10 that this embodiment provided still adopts the design of preventing slow-witted to the operation personnel distinguish the orientation of putting of board. Specifically, a connecting line of the center point of the blind alignment hole 11 of the first target 20 and the center point of the blind alignment hole 11 of the second target 30 is perpendicular to a connecting line of the center point of the blind alignment hole 11 of the second target 30 and the center point of the blind alignment hole 11 of the third target 40. The distance between the central point of the blind alignment hole 11 of the first target 20 and the central point of the blind alignment hole 11 of the fourth target 50 is smaller than the distance between the central point of the blind alignment hole 11 of the second target 30 and the central point of the blind alignment hole 11 of the third target 40.
In summary, the novel graphic composite alignment target and the HDI board 10 provided by the embodiment of the present invention integrate the alignment through hole 12, the alignment blind hole 11, and the annular circuit graphic 13, so that the alignment precision and accuracy are further improved.
The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "having" are intended to be inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed and illustrated, unless explicitly indicated as an order of performance. It should also be understood that additional or alternative steps may be employed.
When an element or layer is referred to as being "on" … … "," engaged with "… …", "connected to" or "coupled to" another element or layer, it can be directly on, engaged with, connected to or coupled to the other element or layer, or intervening elements or layers may also be present. In contrast, when an element or layer is referred to as being "directly on … …," "directly engaged with … …," "directly connected to" or "directly coupled to" another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship of elements should be interpreted in a similar manner (e.g., "between … …" and "directly between … …", "adjacent" and "directly adjacent", etc.). As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region or section from another element, component, region or section. Unless clearly indicated by the context, use of terms such as the terms "first," "second," and other numerical values herein does not imply a sequence or order. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
Spatially relative terms, such as "inner," "outer," "below," "… …," "lower," "above," "upper," and the like, may be used herein for ease of description to describe a relationship between one element or feature and one or more other elements or features as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the example term "below … …" can encompass both an orientation of facing upward and downward. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (7)

1. A novel graphic composite alignment target is characterized by comprising an annular alignment blind hole, wherein an alignment through hole is formed in the middle of the alignment blind hole, and the alignment through hole and the alignment blind hole share a central point;
the outer boundary of counterpoint through-hole with be formed with annular circuit figure between the inner boundary of counterpoint blind hole, the outer boundary of circuit figure with the inner boundary of counterpoint blind hole is connected, the inner boundary of circuit figure with by the etching removal between the outer boundary of counterpoint through-hole.
2. The novel graphic composite alignment target according to claim 1, wherein the alignment blind holes and the circuit graphics are both circular or square ring shaped, and the alignment through holes are circular or square holes.
3. The novel graphic composite alignment target according to claim 1, wherein the alignment blind holes are formed by arranging a plurality of laser blind holes adjacent to each other and having a diameter of 0.1 mm.
4. The novel graphic composite alignment target according to claim 1, wherein the alignment through holes are formed by arranging a plurality of laser through holes with a diameter of 0.1mm adjacent to each other.
5. An HDI plate comprising the novel graphical composite alignment target of any of claims 1 to 4.
6. An HDI board according to claim 5, wherein four corners of the HDI board respectively comprise a first target, a second target, a third target and a fourth target of the novel graphical composite alignment target.
7. The HDI board of claim 6, wherein a connecting line of a center point of the alignment blind hole of the first target and a center point of the alignment blind hole of the second target is perpendicular to a connecting line of a center point of the alignment blind hole of the second target and a center point of the alignment blind hole of the third target;
and the distance between the central point of the alignment blind hole of the first target and the central point of the alignment blind hole of the fourth target is smaller than the distance between the central point of the alignment blind hole of the second target and the central point of the alignment blind hole of the third target.
CN202110449807.3A 2021-04-25 2021-04-25 Novel graphic composite alignment target and HDI board Active CN113163580B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113891578A (en) * 2021-09-13 2022-01-04 惠州中京电子科技有限公司 HDI board manufacturing method for local electroplating hole filling and HDI board
CN113923895A (en) * 2021-09-13 2022-01-11 惠州中京电子科技有限公司 HDI board manufacturing method for improving through blind hole matching precision and HDI board

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103635024A (en) * 2013-11-25 2014-03-12 东莞美维电路有限公司 Automatic partitioning board dividing method after lamination of printed wiring board
KR20140099761A (en) * 2013-02-04 2014-08-13 삼성전기주식회사 Multi-layer printed circuit board and alignment method thereof
CN203912365U (en) * 2014-06-11 2014-10-29 深圳华麟电路技术有限公司 Soft and hard multilayer circuit board
CN105764236A (en) * 2015-04-29 2016-07-13 东莞生益电子有限公司 Processing method of PCB, and PCB
CN205946329U (en) * 2016-08-15 2017-02-08 梅州市志浩电子科技有限公司 Printed circuit board
CN107295751A (en) * 2017-08-16 2017-10-24 梅州市志浩电子科技有限公司 A kind of method of the compound contraposition of figure
CN207070445U (en) * 2017-08-16 2018-03-02 梅州市志浩电子科技有限公司 A kind of compound alignment target of figure
CN111315155A (en) * 2020-02-27 2020-06-19 惠州中京电子科技有限公司 Method for improving alignment of outer layer of mini LED PCB
CN111556669A (en) * 2020-04-02 2020-08-18 深圳市景旺电子股份有限公司 Method for manufacturing high-density interconnection board

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140099761A (en) * 2013-02-04 2014-08-13 삼성전기주식회사 Multi-layer printed circuit board and alignment method thereof
CN103635024A (en) * 2013-11-25 2014-03-12 东莞美维电路有限公司 Automatic partitioning board dividing method after lamination of printed wiring board
CN203912365U (en) * 2014-06-11 2014-10-29 深圳华麟电路技术有限公司 Soft and hard multilayer circuit board
CN105764236A (en) * 2015-04-29 2016-07-13 东莞生益电子有限公司 Processing method of PCB, and PCB
CN205946329U (en) * 2016-08-15 2017-02-08 梅州市志浩电子科技有限公司 Printed circuit board
CN107295751A (en) * 2017-08-16 2017-10-24 梅州市志浩电子科技有限公司 A kind of method of the compound contraposition of figure
CN207070445U (en) * 2017-08-16 2018-03-02 梅州市志浩电子科技有限公司 A kind of compound alignment target of figure
CN111315155A (en) * 2020-02-27 2020-06-19 惠州中京电子科技有限公司 Method for improving alignment of outer layer of mini LED PCB
CN111556669A (en) * 2020-04-02 2020-08-18 深圳市景旺电子股份有限公司 Method for manufacturing high-density interconnection board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113891578A (en) * 2021-09-13 2022-01-04 惠州中京电子科技有限公司 HDI board manufacturing method for local electroplating hole filling and HDI board
CN113923895A (en) * 2021-09-13 2022-01-11 惠州中京电子科技有限公司 HDI board manufacturing method for improving through blind hole matching precision and HDI board

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