CN113158130B - Method, equipment and medium for calculating emissivity of shielding part of spindle of double-sided assembly - Google Patents

Method, equipment and medium for calculating emissivity of shielding part of spindle of double-sided assembly Download PDF

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CN113158130B
CN113158130B CN202110255594.0A CN202110255594A CN113158130B CN 113158130 B CN113158130 B CN 113158130B CN 202110255594 A CN202110255594 A CN 202110255594A CN 113158130 B CN113158130 B CN 113158130B
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emissivity
main shaft
calculating
component
spindle
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CN113158130A (en
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吴芳和
王顺波
俞琨
孙长江
曹家兴
黄圭成
田鹏
杨宏毅
王士涛
李彩霞
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PowerChina Huadong Engineering Corp Ltd
Arctech Solar Holding Co Ltd
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PowerChina Huadong Engineering Corp Ltd
Arctech Solar Holding Co Ltd
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    • G06FELECTRIC DIGITAL DATA PROCESSING
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Abstract

The invention discloses a method, equipment and medium for calculating emissivity of a main shaft shielding part of a double-sided assembly, which comprises the following steps: acquiring the component length D1, the spindle width D2, the maximum incidence angle alpha of the back light of the first component and the maximum incidence angle beta of the back light of the second component; according toAnd obtaining the direct emissivity S1 of the main shaft shielding part. The invention has the technical effects that: the method overcomes the defect that the power of the battery irradiated on the battery piece from the two sides of the main shaft accounts for the theoretical radiation quantity of the back surface of the total assembly by calculating the proportion of the power of the battery irradiated on the battery piece from the two sides of the main shaft to the theoretical radiation quantity of the back surface of the total assembly, overcomes the defect that the power of the battery irradiated on the battery piece from the two sides of the main shaft accounts for the theoretical radiation quantity of the back surface of the total assembly simply according to the length of the assembly and the width of the main shaft in the original technical scheme, realizes the estimation of the power influence estimation precision of the main shaft.

Description

Method, equipment and medium for calculating emissivity of shielding part of spindle of double-sided assembly
Technical Field
The invention relates to the field of photovoltaic power generation, in particular to a method, equipment and medium for calculating emissivity of a shielding part of a spindle of a double-sided assembly.
Background
For a double sided assembly mounted vertically on a flat single axis tracker, the central location of the back of the double sided assembly is typically shielded by the spindle, which primarily affects the back radiation near the spindle. In the conventional technical scheme, the common algorithm of the back shielding rate directly designs the back shielding proportion of the double-sided assembly as the shielding rate without considering the height condition of the main shaft from the back of the assembly, but the method can amplify the influence of shielding, and the reason is that although the main shaft blocks part of light and shadows are generated on the battery piece, the shadowed part still can generate power due to the fact that the direction of the light is uncertain, but the effective estimation means is lacked for the influence of the part of power on the original power.
Disclosure of Invention
In order to solve the technical problems, the invention provides a method, equipment and a medium for calculating the emissivity of a main shaft shielding part of a double-sided assembly, which concretely comprises the following technical scheme:
In another aspect, a method for calculating emissivity of a spindle shielding part of a double-sided assembly is provided, including:
Acquiring the component length D1, the spindle width D2, the maximum incidence angle alpha of the back light of the first component and the maximum incidence angle beta of the back light of the second component;
and obtaining the direct emissivity S1 of the main shaft shielding position according to the component length D1, the main shaft width D2, the incidence maximum angle alpha of the first component back light and the incidence maximum angle beta of the second component back light.
In the technical scheme, the defect that the power of the battery irradiated on the battery piece from the two sides of the main shaft accounts for the theoretical radiation quantity of the back surface of the total assembly is overcome by calculating the proportion of the power of the battery irradiated on the battery piece from the two sides of the main shaft to the theoretical radiation quantity of the back surface of the total assembly, which is calculated according to the length of the assembly and the width of the main shaft in the original technical scheme, the estimation of the power of the battery irradiated on the battery piece from the two sides of the main shaft to the theoretical radiation quantity of the back surface of the total assembly is realized, and the estimation precision of the power influence generated by the main shaft is further improved.
Preferably, the method comprises the steps of,
In another aspect, a method for calculating a back radiation shielding rate of a double-sided component is provided, including:
Obtaining the direct emissivity S1 of the main shaft shielding position according to the calculating method of the emissivity of the main shaft shielding position of the double-sided assembly;
Acquiring the emissivity S2 of the non-shielding position on the back;
And obtaining a back coarse emissivity S 'according to the direct emissivity S1 of the main shaft shielding position and the emissivity S2 of the back non-shielding position, wherein the back coarse emissivity S' =S1+S2.
In the technical scheme, the main shaft reflectivity is estimated by calculating the condition that the effective radiation quantity on the front side of the assembly leaks to the back side and is reflected by the main shaft due to the existence of the distance between the assembly junction box and the battery piece, so that the accuracy of estimating the power influence generated by the main shaft is further improved.
It is further preferred that the composition comprises,
Further preferably, the method further comprises:
Acquiring the distance D3 between the junction box of the component and the battery pieces, the effective radiation quantity Leff on the front side of the component, the reflectivity Att of the main beam, the theoretical radiation quantity Ir on the back side of the component, the quantity a of the battery pieces influenced by the shadow of the main beam and the total quantity b of the battery pieces;
And obtaining the main shaft reflection radiation quantity Ir3 according to the distance D3 between the assembly junction box and the battery pieces, the effective radiation quantity Leff on the front surface of the assembly, the main beam reflectivity Att, the theoretical radiation quantity Ir on the back surface of the assembly, the battery piece quantity a influenced by the main beam shadow and the total quantity b of the battery pieces.
It is further preferred that the composition comprises,
Preferably, the method further comprises:
Obtaining a principal axis reflectivity S3 according to S3=Ir3/Ir;
And acquiring the back shielding rate S according to S=1- (S' -S3).
Preferably, the method further comprises: according to Ir1=IrxS1, obtaining an angle radiation quantity Ir1;
Or/and:
according to Ir2=IrxS2, obtaining direct radiation Ir2 of the cell;
obtaining a coarse radiant quantity Ir 'according to Ir' =IrxS1+IrxS2;
Or/and:
according to ir0=ir1+ir2+ir3, a fine radiation dose Ir0 is obtained.
In another aspect, an electronic device is provided, including a processor, a memory, and a computer program stored in the memory and executable on the processor, where the processor is configured to execute the computer program stored in the memory, and implement the method for calculating the emissivity of the spindle shielding position of the double-sided component.
In another aspect, a medium is provided, in which at least one instruction is stored, the instruction being loaded and executed by a processor to implement a method for calculating emissivity at a spindle shade of a duplex assembly.
The invention at least comprises the following technical effects:
(1) The method overcomes the defect that the power of the battery irradiated on the battery piece from the two sides of the main shaft accounts for the theoretical radiation quantity of the back surface of the total assembly by calculating the proportion of the power of the battery irradiated on the battery piece from the two sides of the main shaft to the theoretical radiation quantity of the back surface of the total assembly, overcomes the defect that the power of the battery irradiated on the battery piece from the two sides of the main shaft accounts for the theoretical radiation quantity of the back surface of the total assembly simply according to the length of the assembly and the width of the main shaft in the original technical scheme, realizes the estimation of the power of the battery irradiated on the battery piece from the two sides of the main shaft and further improves the estimation precision of the power influence generated by the main shaft;
(2) By calculating the condition that the effective radiation quantity on the front side of the assembly leaks to the back side and is reflected by the main shaft due to the existence of the spacing between the assembly junction box and the battery piece, the main shaft reflectivity is estimated, and the accuracy of estimating the power influence generated by the main shaft is further improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it will be apparent that the drawings in the following description are only some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic flow chart of embodiment 1 of the present invention;
FIG. 2 is a schematic flow chart of embodiment 2 of the present invention;
fig. 3 is a schematic diagram of an application scenario of the present invention.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, techniques, etc., in order to provide a thorough understanding of the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.
It should be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
For the sake of simplicity of the drawing, the parts relevant to the present invention are shown only schematically in the figures, which do not represent the actual structure thereof as a product. Additionally, in order to facilitate a concise understanding of the drawings, components having the same structure or function in some of the drawings are depicted schematically only one of them, or only one of them is labeled. Herein, "a" means not only "only this one" but also "more than one" case.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
In addition, in the description of the present application, the terms "first," "second," and the like are used merely to distinguish between descriptions and are not to be construed as indicating or implying relative importance.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will explain the specific embodiments of the present invention with reference to the accompanying drawings. It is evident that the drawings in the following description are only examples of the invention, from which other drawings and other embodiments can be obtained by a person skilled in the art without inventive effort.
Example 1:
As shown in fig. 1 and 3, the present embodiment provides a method for calculating emissivity of a spindle shielding part of a double-sided assembly, including:
Step1: acquiring the component length D1, the spindle width D2, the maximum incidence angle alpha of the back light of the first component and the maximum incidence angle beta of the back light of the second component;
Step2: acquiring the direct radiance S1 of a main shaft shielding position according to the component length D1, the main shaft width D2, the maximum incidence angle alpha of the back light of the first component and the maximum incidence angle beta of the back light of the second component; preferably according to And obtaining the direct emissivity S1 of the main shaft shielding part.
In the conventional technology, the influence of the support on the photovoltaic power generation power is generally calculated by comparing the width of the back shield with the width of the upper component, simply by directly passingThe influence of the existence of the shielding object on the power is calculated to judge the influence of the power, but in the actual use process, the method directly designs the back shielding proportion of the double-sided assembly as the shielding rate without considering the height condition of the main shaft from the back of the assembly, so that the influence of shielding can be amplified.
In the present embodiment, therefore, the influence of the height of the spindle from the back of the module on the generated power is determined according to the height of the spindle from the back of the module, specifically, although shadows appear on the back due to the existence of the spindle, it is known that the existence of the spindle shadows does not mean that no light exists at all, that is, the battery at the spindle shadows still generates a certain power, so that it is calculated from D2/D1 how much of the battery is affected due to the existence of the spindle, and then based on the result of the calculationObtaining how much light in the angle range can reach the battery plate due to the existence of the main shaft, and multiplying the two, so as to finally obtain the direct emissivity S1 at the shielding position of the main shaft, namely the retention of the power of the battery plate influenced by the main shaft under the existence of the main shaft, wherein the minimum value of alpha and beta can be expressed by the formulaThe maximum value of alpha+beta can be calculated by the formula/>The calculation result is that, in general, α+β is calculated by a formula to obtain 110 ° to 126 °, ifeff/ir=9.5, a/b=1/12, att=40%, and the back surface shielding rate is calculated to be about 1.5% to 2.1%.
According to the method, the device and the system, the proportion of the power of the battery irradiated onto the battery piece from the two sides of the main shaft to the total theoretical radiation quantity of the back surface of the assembly is calculated, the defect that the power of the battery irradiated onto the battery piece from the two sides of the main shaft is calculated simply according to the length of the assembly and the width of the main shaft in the original technical scheme is overcome, the estimation of the total theoretical radiation quantity of the back surface of the assembly on the power of the battery irradiated onto the battery piece from the two sides of the main shaft is realized, and the estimation precision of the power influence generated by the main shaft is further improved.
Example 2:
As shown in fig. 2 and 3, the present embodiment provides a method for calculating an emissivity of a spindle shielding part of a double-sided assembly, including:
Step1: acquiring the component length D1, the spindle width D2, the maximum incidence angle alpha of the back light of the first component and the maximum incidence angle beta of the back light of the second component;
step2: according to And obtaining the direct emissivity S1 of the main shaft shielding part.
Step3: acquiring the emissivity S2 of the non-shielding position on the back; preferably according toAcquiring the emissivity S2 of the non-shielding position on the back;
step4: and obtaining the coarse emissivity S 'according to S' =S1+S2.
In this embodiment, not only the direct emissivity S1 of the spindle blocked position but also the overall emissivity is evaluated, specifically, the back non-blocked position emissivity, that is, the emissivity of the portion that is not affected by the existence of the spindle is calculated first, and then the direct emissivity S1 of the spindle blocked position and the back non-blocked position emissivity S2 are simply superimposed, so that the coarse emissivity can be obtained.
Preferably, the method further comprises: step5: acquiring the distance D3 between the junction box of the component and the battery pieces, the effective radiation quantity Leff on the front side of the component, the reflectivity Att of the main beam, the theoretical radiation quantity Ir on the back side of the component, the quantity a of the battery pieces influenced by the shadow of the main beam and the total quantity b of the battery pieces;
Step6: according to Obtaining the reflected radiation Ir3 of the main shaft;
Step7: obtaining a principal axis reflectivity S3 according to S3=Ir3/Ir;
Step8: and acquiring the back shielding rate S according to S=1- (S' -S3).
In this embodiment, considering that there is a space between the component junction box and the battery piece, light can pass through the space and then irradiate onto the main shaft, and then reflect from the main shaft to the back of the component to generate power, so that the power leaked to the back due to the space D3 is obtained through D3/D1 xLeff first, then the proportion of the power leaked to the back of the back component can be digested by the back component is calculated according to a/b x Att, and then the two are multiplied to obtain the main shaft reflection radiation amount Ir3, and further the back shielding rate S caused by the existence of the main shaft is obtained.
According to the method, the device and the system, the effective radiation quantity on the front side of the assembly is leaked to the back side and reflected by the main shaft due to the fact that the distance between the assembly junction box and the battery piece is calculated, so that the main shaft reflectivity is estimated, and the accuracy of estimating the power influence generated by the main shaft is further improved.
Further preferably, the method further comprises:
step9: according to Ir1=IrxS1, obtaining an angle radiation quantity Ir1;
step10: according to Ir2=IrxS2, obtaining direct radiation Ir2 of the cell;
step11: obtaining a coarse radiant quantity Ir 'according to Ir' =Ir1+Ir2 or Ir '=IrxS';
step12: the fine radiation amount Ir0 is obtained from ir0=ir' +ir3 or from ir0=ir1+ir2+ir3.
In this embodiment, in addition to calculating the occlusion rate, further calculations of the radiation dose should be performed to provide guidance for subsequent production scheduling.
Example 3
The present embodiment provides an electronic device, including a processor, a memory, and a computer program stored in the memory and capable of running on the processor, where the processor is configured to execute the computer program stored in the memory, to implement the method for calculating the emissivity of the spindle shielding position of the double-sided component according to embodiment 1 or 2.
The device can be desktop computer, notebook computer, palm computer, tablet computer, mobile phone, man-machine interaction screen and other devices. The device may include, but is not limited to, a processor, a memory. Those skilled in the art will appreciate that the device is merely an example of a device and is not limiting of the device, and may include more or fewer components than shown, or certain components in combination, or different components, illustrative: the devices may also include input/output interfaces, display devices, network access devices, communication buses, communication interfaces, and the like. The communication interface and the communication bus may further comprise an input/output interface, wherein the processor, the memory, the input/output interface and the communication interface complete communication with each other through the communication bus. The memory stores a computer program, and the processor is configured to execute the computer program stored in the memory to implement the method in the above embodiment.
The processor may be a central processing unit (Central Processing Unit, CPU), but may also be other general purpose processors, digital signal processors (DIGITAL SIGNAL processor, DSP), application SPECIFIC INTEGRATED Circuit (ASIC), field-programmable gate array (field-programmable GATE ARRAY, FPGA) or other programmable logic device, discrete gate or transistor logic device, discrete hardware components, or the like. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The memory may be an internal storage unit of the device, exemplary: a hard disk or a memory of the device. The memory may also be an external storage device of the device, exemplary: a plug-in hard disk, a smart memory card (SMART MEDIA CARD, SMC), a Secure Digital (SD) card, a flash memory card (FLASH CARD) and the like which are provided on the device. Further, the memory may also include both internal storage units and external storage devices of the device. The memory is used for storing the computer program and other programs and data required by the device. The memory may also be used to temporarily store data that has been output or is to be output.
A communication bus is a circuit that connects the elements described and enables transmission between these elements. The processor receives commands from other elements via the communication bus, decrypts the received commands, and performs calculations or data processing based on the decrypted commands, as examples. The memory may include program modules, illustratively, kernel (kernel), middleware (middleware), application programming interfaces (Application Programming Interface, apis), and applications. The program modules may be comprised of software, firmware, or hardware, or at least two of them. The input/output interface forwards commands or data entered by a user through the input/output interface (e.g., sensor, keyboard, touch screen). The communication interface connects the device with other network devices, user devices, networks. The communication interface may be connected to the network by wire or wirelessly to connect to external other network devices or user devices, for example. The wireless communication may include at least one of: wireless fidelity (WiFi), bluetooth (BT), near field wireless communication technology (NFC), global Positioning System (GPS) and cellular communications, among others. The wired communication may include at least one of: universal Serial Bus (USB), high Definition Multimedia Interface (HDMI), asynchronous transfer standard interface (RS-232), and the like. The network may be a telecommunications network or a communication network. The communication network may be a computer network, the internet of things, a telephone network. The device may be connected to the network through a communication interface and protocols used by the device to communicate with other network devices may be supported by at least one of an application, an Application Programming Interface (API), middleware, a kernel, and a communication interface.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus/device and method may be implemented in other manners. The above-described apparatus/device embodiments are exemplary only, and the modules or elements are exemplary only, and are merely a logical functional division, as may be implemented in additional ways, and exemplary, multiple elements or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection via interfaces, devices or units, which may be in electrical, mechanical or other forms.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in the embodiments of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.
The integrated modules/units may be stored in a medium if implemented in the form of software functional units and sold or used as stand-alone products. Based on this understanding, the present application may implement all or part of the flow of the method of the above embodiment, or may be implemented by sending an instruction to related hardware by a computer program, where the computer program may be stored in a medium, and the computer program may implement the steps of each method embodiment described above when executed by a processor. Wherein the computer program may be in source code form, object code form, executable file or some intermediate form, etc. The medium may include: any entity or device capable of carrying the computer program, a recording medium, a USB flash disk, a removable hard disk, a magnetic disk, an optical disk, a computer memory, a read-only memory (ROM), a random access memory (RAM, random Access Memory), an electrical carrier signal, a telecommunications signal, a software distribution medium, and so forth. It should be noted that the content of the medium may be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction, and examples are: in some jurisdictions, computer-readable media does not include electrical carrier signals and telecommunications signals in accordance with legislation and patent practice. It will be apparent to those skilled in the art that the above-described program modules are only illustrated in the division of the above-described program modules for convenience and brevity, and that in practical applications, the above-described functional allocation may be performed by different program modules, i.e., the internal structure of the apparatus is divided into different program units or modules, to perform all or part of the above-described functions. The program modules in the embodiments may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one processing unit, where the integrated units may be implemented in a form of hardware or in a form of a software program unit. In addition, the specific names of the program modules are also only for distinguishing from each other, and are not used to limit the protection scope of the present application.
Example 4:
The present embodiment provides a medium having at least one instruction stored therein, where the instruction is loaded and executed by a processor to implement a method for calculating an emissivity of a spindle shielding position of a double sided assembly according to embodiment 1 or 2.
Example 5:
the embodiment provides a calculation method of emissivity of a main shaft shielding part of a double-sided assembly, which comprises the following steps:
Step 1: the radiation receiving area of the back of the assembly is calculated, firstly, the part which is not influenced by shielding, secondly, the part which is influenced by shielding of the main shaft, and thirdly, the junction box position in the middle of the back of the assembly usually enlarges the spacing between the battery pieces, and then a part of light rays are reflected from the main shaft to the back of the assembly after passing through the glass of the assembly.
Step 2: the portions that are not affected by the occlusion are calculated,This partial calculation is readily understood as the non-occluded dimension versus the length of the back of the double sided assembly.
Step 3: the portion of the direct occlusion is calculated,The part calculates the maximum incidence angles alpha and beta of the back light rays of the key value assembly, which represents that a certain range of acceptable angles exist due to a certain distance between the assembly and the back support.
Step 4: calculating the gap between the battery pieces in the assembly, reflecting the light rays to the battery pieces after the light rays penetrate through the glass from the gap to reach the main shaft,The calculation key value of the part is the increase of the reflectivity of the back support material.
Step 5: synthesizing the back radiation calculation results of the sub-areas, comparing the back radiation calculation results with the back radiation receiving quantity of the double-sided assembly when the back is not shielded,And obtaining the back shielding rate of the double-sided assembly.
According to the embodiment, the accuracy of estimating the power influence generated by the main shaft is further improved by calculating the condition that the effective radiation quantity on the front surface of the assembly leaks to the back surface and is reflected by the main shaft due to the existence of the spacing between the assembly junction box and the battery piece and calculating the proportion of the power of the battery irradiated onto the battery piece from the two sides of the main shaft to the theoretical radiation quantity on the back surface of the total assembly.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims (9)

1. The method for calculating the emissivity of the main shaft shielding position is characterized by comprising the following steps of:
Acquiring the component length D1, the spindle width D2, the maximum incidence angle alpha of the back light of the first component and the maximum incidence angle beta of the back light of the second component;
Acquiring the radiance S1 of a main shaft shielding position according to the component length D1, the main shaft width D2, the maximum incidence angle alpha of the back light of the first component and the maximum incidence angle beta of the back light of the second component;
emissivity of the main shaft shielding part
2. The method for calculating the back shielding rate is characterized by comprising the following steps of:
A method for calculating the emissivity of a spindle shielding place according to claim 1, wherein the emissivity S1 of the spindle shielding place is obtained;
Acquiring the emissivity S2 of the non-shielding position on the back;
and acquiring a back coarse emissivity S 'according to the emissivity S1 of the main shaft shielding position and the emissivity S2 of the back non-shielding position, wherein the back coarse emissivity S' =S1+S2.
3. The method of claim 2, wherein the emissivity of the non-back-blocked area
4. The method for calculating a backside occlusion rate according to claim 2, further comprising:
Acquiring the distance D3 between the junction box of the component and the battery pieces, the effective radiation quantity Leff on the front side of the component, the reflectivity Att of the main beam, the theoretical radiation quantity Ir on the back side of the component, the quantity a of the battery pieces influenced by the shadow of the main beam and the total quantity b of the battery pieces;
and obtaining the main shaft reflection radiation quantity Ir3 according to the distance D3 between the assembly junction box and the battery pieces, the effective radiation quantity Leff on the front face of the assembly, the main beam reflectivity Att, the quantity a of the battery pieces influenced by the main beam shadow and the total quantity b of the battery pieces.
5. The method of claim 4, wherein the principal axis reflects the amount of radiationThe D1 is the component length D1.
6. The method for calculating a backside occlusion rate of claim 4, further comprising:
Obtaining a principal axis reflectivity S3 according to S3=Ir3/Ir;
and acquiring the back shielding rate S according to S=1- (S' -S3).
7. The method for calculating a backside occlusion rate of claim 4, further comprising:
According to Ir1=IrxS1, obtaining an angle radiation quantity Ir1;
Or/and:
According to Ir2=IrxS2, obtaining direct radiation Ir2 of the cell;
Obtaining a coarse radiant quantity Ir 'according to Ir' =IrxS1+IrxS2;
Or/and:
according to Ir0=Ir1+Ir2+Ir3, the fine radiation Ir0 is obtained, and Ir2 is the direct radiation Ir2 of the cell.
8. An apparatus comprising a processor, a memory, and a computer program stored in the memory and executable on the processor, the processor being configured to execute the computer program stored on the memory to implement a method of calculating emissivity at a spindle shade as claimed in claim 1 and a method of calculating a backside shade as claimed in claims 2-7.
9. A medium having stored therein at least one instruction loaded and executed by a processor to implement a method of calculating emissivity at spindle obscuration as claimed in claim 1 and a method of calculating backside obscuration as claimed in claims 2 to 7.
CN202110255594.0A 2021-03-09 2021-03-09 Method, equipment and medium for calculating emissivity of shielding part of spindle of double-sided assembly Active CN113158130B (en)

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