CN113146473A - Method for detecting state of cutting tool - Google Patents

Method for detecting state of cutting tool Download PDF

Info

Publication number
CN113146473A
CN113146473A CN202110006655.XA CN202110006655A CN113146473A CN 113146473 A CN113146473 A CN 113146473A CN 202110006655 A CN202110006655 A CN 202110006655A CN 113146473 A CN113146473 A CN 113146473A
Authority
CN
China
Prior art keywords
cutting
unit
voltage
cutting tool
cutting edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202110006655.XA
Other languages
Chinese (zh)
Other versions
CN113146473B (en
Inventor
笠井刚史
小池彩子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN113146473A publication Critical patent/CN113146473A/en
Application granted granted Critical
Publication of CN113146473B publication Critical patent/CN113146473B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/005Devices for the automatic drive or the program control of the machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/24Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
    • B23Q17/2452Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves for measuring features or for detecting a condition of machine parts, tools or workpieces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06Work-clamping means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01Arrangements or apparatus for facilitating the optical investigation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Biochemistry (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

The invention provides a method for detecting the state of a cutting tool, which can detect a through hole formed in a cutting edge besides defects. The method for detecting the state of the cutting tool comprises the following steps: a voltage recording step of recording a change in voltage value from a position where the cutting edge does not shield the pulsed light received by the light receiving section to a position where the cutting edge enters the entering section while rotating the cutting tool; and a determination step of determining the state of the cutting edge based on a change in the voltage value recorded in the voltage recording step. In the determination step, it is determined that there is no defect in the cutting edge when there is no increase in the voltage value, and it is determined that there is a defect in the cutting edge when a periodic and temporary increase in voltage occurs immediately after the cutting edge starts to shield the pulsed light.

Description

Method for detecting state of cutting tool
Technical Field
The present invention relates to a method for detecting the state of a cutting tool attached to a cutting apparatus.
Background
A cutting tool used in a cutting apparatus may have a cutting edge or a through hole at a position radially inward of the cutting edge due to a load during machining, collision of a scattered chip, or the like. When a workpiece is machined in such a state of the cutting edge, chipping and cracking are generated more than expected, and therefore a tool damage detector has been developed to constantly monitor the cutting tool (see, for example, patent document 1). The tool breakage detector shown in patent document 1 generally detects a defect in the cutting edge of the cutting edge.
Patent document 1: japanese patent laid-open No. 2001 and 298001
The cutting tool may have a through hole formed at a position radially inward of the cutting edge due to collision of the chip. The generated through-holes also cause chipping or cracking. However, the tool breakage detector disclosed in patent document 1 only inspects a defect of the cutting edge, and thus there is a concern that a through hole will be missed.
Disclosure of Invention
Accordingly, an object of the present invention is to provide a method for detecting the state of a cutting tool, which can detect a through hole formed in a cutting edge in addition to defects.
According to the present invention, there is provided a method of detecting a state of a cutting tool, the method detecting a state of a cutting edge of the cutting tool in a cutting apparatus, the cutting apparatus including: a chuck table for holding a workpiece; a cutting unit for cutting the workpiece held by the chuck table by attaching the cutting tool having a cutting edge on the outer periphery to the spindle; a blade edge inspection unit including an intruding portion into which the cutting edge of the cutting tool intrudes, and a light emitting portion and a light receiving portion disposed to face each other with the intruding portion interposed therebetween; and a moving unit that relatively moves the blade edge inspection unit and the cutting unit in a radial direction of the cutting tool, wherein the blade edge inspection unit further includes: a photoelectric conversion unit that converts the amount of the pulsed light received by the light receiving unit into a voltage; and a voltage recording unit that records the voltage converted by the photoelectric conversion unit for each pulse, wherein the method for detecting the state of the cutting tool comprises the steps of: a voltage recording step of driving the moving unit while rotating the cutting tool, and recording a change in the voltage during a period of movement from a position where the cutting edge does not shield the pulsed light received by the light receiving unit to a position where the cutting edge intrudes into the intruding portion by a predetermined amount; and a determination step of determining a state of the cutting edge based on the change in the voltage recorded in the voltage recording step, wherein the determination step determines that there is no defect in the cutting edge when there is no increase in the voltage equal to or greater than a predetermined value, determines that there is a defect at a tip of the cutting edge when there is a periodic and temporary increase in the voltage immediately after the cutting edge starts to shield the pulsed light, and determines that a through hole is formed radially inward of an outer peripheral edge of the cutting edge when there is a periodic and temporary increase in the voltage after a state in which there is no periodic and temporary increase in the voltage continues from immediately after the cutting edge starts to shield the pulsed light.
Preferably, the moving unit includes an incision feeding unit that moves the cutting unit or a light receiving and emitting unit moving unit that integrally moves the light emitting unit and the light receiving unit.
The invention has the following effects: in addition to the defect, the through hole formed in the cutting edge can be detected.
Drawings
Fig. 1 is a perspective view showing a configuration example of a cutting apparatus for implementing the method of detecting the state of a cutting tool according to embodiment 1.
Fig. 2 is a perspective view showing a main part of a cutting unit and a unit main body of a blade edge inspection unit of the cutting apparatus shown in fig. 1.
Fig. 3 is a diagram schematically showing the structure of a blade edge inspection unit of the cutting apparatus shown in fig. 1.
Fig. 4 is a side view schematically showing the pulse light emitted from the light emitting portion of the blade edge inspection unit of the cutting apparatus shown in fig. 1 and the cutting tool.
Fig. 5 is a diagram showing voltage values of voltages obtained by converting the light quantity of pulsed light by the photoelectric conversion unit in the blade edge inspection unit of the cutting device shown in fig. 1.
Fig. 6 is a schematic diagram illustrating a position where the cutting edge inspection unit of the cutting apparatus shown in fig. 1 detects the cutting edge state of the cutting edge of the cutting tool.
Fig. 7 is a view schematically showing the structure of the 2 nd blade edge inspection unit of the cutting apparatus shown in fig. 1.
Fig. 8 is a flowchart showing a flow of a method for detecting the state of a cutting tool according to embodiment 1.
Fig. 9 is a diagram showing an example of a change in voltage value when it is determined that a defect has occurred in the cutting edge in the determination step of the method for detecting the state of the cutting tool shown in fig. 8.
Fig. 10 is a diagram showing an example of a change in voltage value when it is determined that a through hole has occurred in the cutting edge in the determination step of the method for detecting the state of the cutting tool shown in fig. 8.
Fig. 11 is a diagram schematically showing the configuration of the 2 nd cutting edge inspection unit of the cutting apparatus for implementing the method of detecting the state of the cutting tool according to embodiment 2.
Description of the reference symbols
1: a cutting device; 10: a chuck table; 20: a cutting unit; 21: a cutting tool; 23: a main shaft; 40: a blade edge inspection unit; 44: an intrusion section; 45: a light emitting section; 46: a light receiving section; 53: z-axis moving means (moving means, cutting and feeding means); 70: a 2 nd blade edge inspection unit (blade edge inspection unit); 74: an intrusion section; 75: a light emitting section; 76: a light receiving section; 80: a light receiving/emitting unit moving unit; 101: a photoelectric conversion unit; 102: a voltage recording section; 200: a workpiece; 212: cutting edges; z: radial direction; ST 2: a voltage recording step; ST 3: and a judging step.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. The components described below include those that can be easily conceived by those skilled in the art, and substantially the same ones. The following structures may be combined as appropriate. Various omissions, substitutions, and changes in the structure may be made without departing from the spirit of the invention.
[ embodiment 1 ]
A method for detecting the state of a cutting tool according to embodiment 1 of the present invention will be described with reference to the drawings. The method for detecting the state of a cutting tool according to embodiment 1 is implemented in the cutting apparatus 1 shown in fig. 1. First, the structure of the cutting apparatus 1 will be described. Fig. 1 is a perspective view showing a configuration example of a cutting apparatus for implementing the method of detecting the state of a cutting tool according to embodiment 1. Fig. 2 is a perspective view showing a main part of a cutting unit and a unit main body of a blade edge inspection unit of the cutting apparatus shown in fig. 1.
In embodiment 1, a workpiece 200 to be processed in a cutting apparatus 1 shown in fig. 1 is a wafer such as a disc-shaped semiconductor wafer or an optical device wafer, which is a base material such as silicon, gallium arsenide, SiC (silicon carbide), or sapphire. In the workpiece 200, devices 203 are formed in regions partitioned in a lattice shape by a plurality of planned dividing lines 202 formed in a lattice shape on the front surface 201.
The workpiece 200 of the present invention may be a so-called TAIKO (registered trademark) wafer having a thinned central portion and a thick portion formed on an outer peripheral portion, or may be a resin package substrate such as a rectangular QFN (Quad Flat No lead) package substrate having a plurality of resin-sealed devices, a ceramic substrate, a ferrite substrate, a substrate including at least one of nickel and iron, a glass substrate, or the like, in addition to the wafer. In embodiment 1, the workpiece 200 is supported by the ring frame 205 with the back surface 204 thereof bonded to the adhesive tape 206 having the ring frame 205 attached to the outer peripheral edge thereof.
(cutting device)
The cutting apparatus 1 shown in fig. 1 is a machining apparatus that holds a workpiece 200 on a chuck table 10 and performs a cutting process along a line to divide 202 by a cutting tool 21. As shown in fig. 1, the cutting apparatus 1 includes: a chuck table 10 that suctions and holds the workpiece 200 by a holding surface 11; a cutting unit 20 for cutting the workpiece 200 held by the chuck table 10 by a cutting tool 21; an imaging unit 30 that images the workpiece 200 held by the chuck table 10; and a blade tip inspection unit 40.
As shown in fig. 1, the cutting apparatus 1 includes a moving unit 50 for moving the chuck table 10 and the cutting unit 20 relative to each other. The mobile unit 50 has at least: an X-axis moving unit 51 as a machining feed unit that performs machining feed of the chuck table 10 in an X-axis direction parallel to the horizontal direction; a Y-axis moving unit 52 as an index feeding unit that index-feeds the cutting unit 20 in a Y-axis direction parallel to the horizontal direction and perpendicular to the X-axis direction; a Z-axis moving unit 53 as a plunge-feed unit that plunges and feeds the cutting unit 20 in a Z-axis direction parallel to a vertical direction perpendicular to both the X-axis direction and the Y-axis direction; and a rotation moving unit 54 that rotates the chuck table 10 about an axis parallel to the Z-axis direction.
The X-axis moving unit 51 moves the moving plate 12 supporting the chuck table 10 and the rotating unit 54 in the X-axis direction, which is a machining feed direction, and thereby relatively feeds the chuck table 10 and the cutting unit 20 in the X-axis direction. The Y-axis moving unit 52 relatively index-feeds the chuck table 10 and the cutting unit 20 in the Y-axis direction by moving the cutting unit 20 in the Y-axis direction, which is an index-feed direction. The Z-axis moving unit 53 moves the cutting unit 20 in the Z-axis direction, which is a cutting feed direction, and thereby cuts and feeds the chuck table 10 and the cutting unit 20 relatively in the Z-axis direction. The rotating and moving unit 54 is disposed on the moving plate 12. The Z-axis direction corresponds to the radial direction of the cutting insert 21.
The X-axis moving unit 51, the Y-axis moving unit 52, and the Z-axis moving unit 53 have: a well-known ball screw provided to be rotatable about an axis; a known motor that rotates the ball screw around the axis, and a known guide rail that supports the chuck table 10 or the cutting unit 20 to be movable in the X-axis direction, the Y-axis direction, or the Z-axis direction. The Z-axis moving means 53 is a moving means described in the claims for moving the cutting unit 20 in the Z-axis direction and moving the light emitting unit 45 and the light receiving unit 46 of the blade edge inspection unit 40 and the cutting unit 20 relative to each other in the Z-axis direction.
The chuck table 10 has a disk shape, and the holding surface 11 for holding the workpiece 200 is formed of porous ceramics or the like. The chuck table 10 is provided to be movable in the X-axis direction by the X-axis moving unit 51 such that the moving plate 12 is movable between a machining region below the cutting unit 20 and a carrying-in/out region away from the lower side of the cutting unit 20 to carry in/out the workpiece 200. The chuck table 10 is provided to be rotatable about an axis parallel to the Z-axis direction by a rotation moving unit 54. The chuck table 10 is connected to a vacuum suction source, not shown, and sucks and holds the workpiece 200 placed on the holding surface 11 by the vacuum suction source. In embodiment 1, the chuck table 10 sucks and holds the back surface 204 side of the workpiece 200 via the adhesive tape 206. As shown in fig. 1, a plurality of clamping portions 13 for clamping the ring frame 205 are provided around the chuck table 10.
The cutting unit 20 is a cutting member that attaches a cutting tool 21 to the spindle 23 and cuts the workpiece 200 held by the chuck table 10. As shown in fig. 1, the cutting apparatus 1 is a dicing saw having two cutting units 20, that is, two spindles, a so-called facing biaxial type cutting apparatus.
The cutting units 20 are provided to be movable in the Y-axis direction by the Y-axis moving unit 52 and movable in the Z-axis direction by the Z-axis moving unit 53 with respect to the workpiece 200 held by the chuck table 10. As shown in fig. 1, the cutting unit 20 is provided on the support frame 3 erected from the apparatus main body 2 via the Y-axis moving unit 52, the Z-axis moving unit 53, and the like. The cutting unit 20 can position the cutting tool 21 at an arbitrary position on the holding surface 11 of the chuck table 10 by the Y-axis moving unit 52 and the Z-axis moving unit 53.
As shown in fig. 2, the cutting unit 20 has: a cutting tool 21; a spindle housing 22 provided to be movable in the Y-axis direction and the Z-axis direction by a Y-axis moving unit 52 and a Z-axis moving unit 53; a spindle 23 which is provided in the spindle housing 22 so as to be rotatable about an axis, is rotated by a motor not shown, and has a cutting tool 21 attached to a tip thereof; and a tool cover 24 fixed to the front end surface of the spindle housing 22.
The cutting tool 21 is an extremely thin cutting abrasive having a substantially ring shape. In embodiment 1, as shown in fig. 2, the cutting tool 21 is a so-called hub tool, and includes an annular circular base 211 and an annular cutting edge 212 disposed on an outer peripheral edge of the circular base 211 to cut the workpiece 200. The cutting edge 212 is formed of abrasive grains such as diamond and CBN (Cubic Boron Nitride) and a bonding material such as metal or resin, and has a predetermined thickness. The cutting edge 212 of the cutting tool 21 wears when cutting the workpiece 200. In the present invention, the cutting insert 21 may be a so-called gasketing insert constituted only by the cutting edges 212.
The spindle 23 is rotated around the axis by a motor, and rotates the cutting tool 21. The tool cover 24 covers at least the upper side of the cutting tool 21. The tool cover 24 is fixed to the front end surface of the spindle housing 22. Further, the cutter cover 24 has a shower nozzle 25 and a pair of cutter nozzles 26. The spray nozzle 25 faces the tip of the cutting edge 212 of the cutting tool 21 in the X-axis direction, and supplies cutting water to the tip of the cutting edge 212 of the cutting tool 21 during cutting. The tool nozzles 36 extend parallel to the X-axis direction and are arranged at intervals in the Y-axis direction. The pair of tool nozzles 26 positions the lower ends of the cutting edges 212 of the cutting tools 21 relative to each other, and supplies cutting water to the lower ends of the cutting edges 212 of the cutting tools 21 during cutting.
The axial centers of the cutting tool 21 and the spindle 23 of the cutting unit 20 are set parallel to the Y-axis direction.
The imaging unit 30 is fixed to one of the cutting units 20 so as to move integrally with the one of the cutting units 20. The imaging unit 30 includes an imaging element for imaging a region to be divided of the workpiece 200 before cutting held by the chuck table 10. The imaging Device is, for example, a CCD (Charge-Coupled Device) imaging Device or a CMOS (Complementary metal oxide semiconductor) imaging Device. The imaging unit 30 images the workpiece 200 held by the chuck table 10 to obtain an image for performing alignment, that is, positioning of the workpiece 200 and the cutting tool 21, and outputs the obtained image to the control unit 100 of the blade edge inspection unit 40.
Further, the cutting device 1 includes: an X-axis direction position detection unit, not shown, for detecting the position of the chuck table 10 in the X-axis direction; a Y-axis direction position detection unit, not shown, for detecting the position of the cutting unit 20 in the Y-axis direction; and a Z-axis direction position detection unit for detecting a Z-axis direction position of the cutting unit 20. The X-axis direction position detecting unit and the Y-axis direction position detecting unit may be constituted by a linear scale parallel to the X-axis direction or the Y-axis direction and a readhead. The Z-axis direction position detection unit detects the position of the cutting unit 20 in the Z-axis direction using the pulse of the motor. The X-axis direction position detection unit, the Y-axis direction position detection unit, and the Z-axis direction position detection unit output the X-axis direction of the chuck table 10, and the Y-axis direction or Z-axis direction position of the lower end of the cutting edge 212 of the cutting unit 20 to the control unit 100.
In embodiment 1, the positions of the chuck table 10 and the cutting unit 20 of the cutting apparatus 1 in the X-axis direction, the Y-axis direction, and the Z-axis direction are determined based on reference positions that are set in advance and are not shown. In embodiment 1, the reference position in the Z-axis direction of the cutting unit 20 is a position where the holding surface 11 of the chuck table 10 and the lower end of the cutting edge 212 of the cutting tool 21 are located on the same plane.
(blade edge inspection Unit)
Next, the cutting edge inspection means will be explained. Fig. 3 is a diagram schematically showing the structure of a blade edge inspection unit of the cutting apparatus shown in fig. 1. Fig. 4 is a side view schematically showing the pulse light emitted from the light emitting portion of the blade edge inspection unit of the cutting apparatus shown in fig. 1 and the cutting tool. Fig. 5 is a diagram showing voltage values of voltages obtained by converting the light quantity of pulsed light by the photoelectric conversion unit in the blade edge inspection unit of the cutting device shown in fig. 1. Fig. 6 is a diagram illustrating a position at which the cutting edge inspection unit of the cutting apparatus shown in fig. 1 detects the cutting edge state of the cutting edge of the cutting tool.
The edge inspection unit 40 is a unit that detects the state of the edge of the cutting edge 212 of the cutting tool 21 for cutting the workpiece 200. The blade edge inspection means 40 detects, as the state of the blade edge, the presence or absence of a defect, which is a local defect from the outer edge of the cutting blade 212, and the presence or absence of a through hole 213 (shown in fig. 4 and the like), the through hole 213 penetrating at a position radially inward of the outer edge of the cutting blade 212. The defect or the through hole 213 may occur during the manufacturing of the cutting insert 21 or during the cutting process. The through hole 213 is generated by a part of the workpiece 200 cut during the cutting process colliding with the workpiece, and has an inner diameter of about 40 μm, for example. The blade tip inspection unit 40 has a unit main body 41 shown in fig. 2 and 3.
In embodiment 1, the unit body 41 is attached to the inner surface of a water tank 60, and the water tank 60 is provided around the chuck table 10, receives cutting water containing chips generated by cutting the workpiece 200 by the cutting unit 20, and has a water discharge port, not shown, for discharging the cutting water.
The unit main body 41 includes a pair of leg portions 42 and a coupling portion 43 that stand in the Z-axis direction. The pair of leg portions 42 are disposed at intervals from each other in the Y-axis direction. The spacing between the pair of leg portions 42 is wider than the thickness of the cutting edge 212 of the cutting insert 21. Therefore, the pair of leg portions 42 are provided with an entering portion 44 between each other, into which the cutting edge 212 of the cutting insert 21 enters. That is, the blade edge inspection unit 40 has an intruding portion 44. The pair of leg portions 42 are disposed so as to sandwich the cutting edge 212 of the cutting tool 21 therebetween when the cutting edge 212 of the cutting tool 21 is inserted therebetween. The coupling portion 43 couples the lower end portions of the pair of leg portions 42 to each other, and extends in the horizontal direction parallel to the Y-axis direction.
The unit body 41 includes a light emitting section 45 and a light receiving section 46 with the intrusion section 44 therebetween in the Y axis direction. The light emitting section 45 is provided on one leg 42 of the pair of legs 42. The light emitting unit 45 includes an optical fiber 48, and the optical fiber 48 is connected to the light source 47, transmits pulsed light (hereinafter referred to as pulsed light 300 shown in fig. 4) from the light source 47, and emits light toward the light receiving unit 46, which is the other leg 42. In embodiment 1, the outer diameter of the optical fiber 48 of the light emitting section 45 is, for example, 0.3mm or more and 5mm or less, and the spot diameter of the pulsed light 300 is, for example, 0.3mm or more and 5mm or less. The light emitting unit 45 emits pulsed light 300 at a predetermined frequency.
The light receiving unit 46 is provided on the other leg 42, receives the pulsed light 300 emitted from the light emitting unit 45, and outputs the received pulsed light 300 to the control unit 100.
As shown in fig. 1 and 3, the blade edge inspection unit 40 includes a control unit 100 as an arithmetic unit in addition to the unit body 41. The control unit 100 includes a photoelectric conversion unit 101, a voltage recording unit 102, a determination unit 103, and a control unit 104.
The photoelectric conversion unit 101 converts the light amount of the pulsed light 300 received by the light receiving unit 46 into a voltage. The photoelectric conversion unit 101 converts the voltage value of the voltage corresponding to the light amount of the pulsed light 300 input from the light receiving unit 46. In embodiment 1, the light quantity of pulsed light 300 received by light receiving unit 46 is proportional to the voltage value of the voltage converted by photoelectric conversion unit 101.
Further, as the cutting tool 21 descends in the Z-axis direction and enters the deep portion of the intruding portion 44, the amount 301 (shown by a broken line in fig. 4) of the cutting tool 21 blocking the pulsed light 300 emitted from the light emitting portion 45 and received by the light receiving portion 46 increases. Then, the voltage value of the voltage converted by the photoelectric conversion portion 101 gradually decreases as shown in fig. 5.
In fig. 5, the horizontal axis shows the elapsed time after the cutting tool 21 starts to descend, and the vertical axis shows the voltage value of the voltage converted by the photoelectric conversion portion 101. In embodiment 1, fig. 5 shows a voltage value of 100% when the photoelectric conversion unit 101 receives 100% of the pulsed light 300 (when the light receiving rate of the pulsed light 300 is 100%), and a voltage value of 0% when the photoelectric conversion unit 101 receives 0% of the pulsed light 300 (when the light receiving rate of the pulsed light 300 is 0%).
The voltage recording unit 102 stores the voltage converted by the photoelectric conversion unit 101 for each pulse. In embodiment 1, the voltage recording unit 102 records the voltage value of the voltage converted by the photoelectric conversion unit 101 in one-to-one correspondence with the timing at which the pulsed light 300 is input to the photoelectric conversion unit 101.
The determination unit 103 determines whether or not the state of the edge of the cutting edge 212 of the cutting tool 21 inserted into the penetration portion 44, that is, the presence or absence of the defect and the through hole 213 is generated, based on the change in the voltage value of the voltage recorded by the voltage recording unit 102.
The control unit 104 controls each component of the cutting unit 20 and the edge inspection unit 40, and causes the edge inspection unit 40 to perform an operation of detecting the state of the edge of the cutting edge 212 of the cutting tool 21. In the operation of detecting the state of the cutting edge, the control unit 104 positions the relative position of the cutting tool 21 with respect to the unit main body 41 of the cutting edge inspection unit 40 at a position where the light receiving rate of the pulsed light 300 received by the light receiving unit 46, that is, the voltage value converted by the photoelectric conversion unit 101, is 100%, and sequentially positions the relative position at 90%, 80%, 70%, 60%, 50%, 40%, 30%, 20%, 10%, 0% which is decreased from 100% by 10% which is a predetermined value.
The controller 104 causes the edge point inspection unit 40 to perform the edge point state detection operation at each of positions where the relative position of the cutting tool 21 with respect to the unit main body 41 of the edge point inspection unit 40 is 90%, 80%, 70%, 60%, 50%, 40%, 30%, 20%, 10%, and 0% of the light acceptance rate of the pulsed light 300 received by the light receiving unit 46, that is, the voltage value converted by the photoelectric conversion unit. In the operation of detecting the state of the blade edge, the control unit 104 emits pulsed light 300 at a predetermined frequency from the light emitting unit 45 while rotating the spindle 23 at a predetermined number of revolutions, receives the pulsed light 300 at the light receiving unit 46, converts the pulsed light into a voltage at the photoelectric conversion unit 101, and records the voltage in the voltage recording unit 102.
The positions at which the voltage value converted by the photoelectric conversion portion 101 is 100%, 90%, 80%, 70%, 60%, 50%, 40%, 30%, 20%, 10%, 0% are the positions at which the lower end of the cutting edge 212 of the cutting tool 21 is located as indicated by the horizontal line in fig. 6. In particular, in embodiment 1, the position where the voltage value converted by the photoelectric conversion unit 101 is 100% is a position where the cutting edge 212 does not shield the pulsed light 300 received by the light receiving unit 46 at all, and is a starting position for starting the state of detecting the edge tip in the state detection method of the cutting tool 21.
In embodiment 1, the position where the voltage value converted by the photoelectric conversion unit 101 is 0% is, for example, a position where the lower end of the cutting edge 212 of the cutting tool 21 is lower than a position on the same plane as the lower end of the pulsed light 300. The position at which the voltage value converted by the photoelectric conversion unit 101 is 0% is a position at which the cutting edge 212 completely shields the pulsed light 300 received by the light receiving unit 46, and is an end position at which the state of the cutting edge is detected by the end detection method of the state of the cutting tool 21. In embodiment 1, the positions at which the voltage value converted by the photoelectric conversion portion 101 is 90%, 80%, 70%, 60%, 50%, 40%, 30%, 20%, 10%, 0% lower than 100% by a predetermined value are detection positions for detecting the state of the cutting edge in the state detection method of the cutting tool 21. In the present invention, the predetermined value is not limited to 10%. In embodiment 1, the position where the voltage value converted by the photoelectric conversion unit 101 is 90% is the position immediately after the cutting edge 212 starts to shield the pulse light 300.
Further, the control unit 104 sets the combination of the frequency of light emission of the pulsed light 300 and the rotation speed of the cutting tool 21 so that the pulsed light 300 is not always irradiated to the same angle of the cutting tool 21, that is, the pulsed light 300 is not irradiated to the same position of the cutting edge 212 of the cutting tool 21. The same position where the pulsed light 300 is not irradiated to the cutting edge 212 of the cutting tool 21 means that the positions where the pulsed light 300 is irradiated to the cutting edge 212 of the cutting tool 21 are circumferentially shifted, the whole of the positions where the pulsed light 300 is irradiated to the cutting edge 212 of the cutting tool 21 is not overlapped, and that a part of the positions where the pulsed light 300 is irradiated to the cutting edge 212 of the cutting tool 21 may be overlapped with each other.
For example, in embodiment 1, when the outer diameter of the cutting edge 212 of the cutting tool 21 is 55.6mm, the length of the outer periphery of the cutting edge 212 is 174.6725515mm, and the rotational speed of the cutting tool 21 is 60000rpm, the frequency of light emission of the pulsed light 300 may be 250kHz, the sampling period of the pulsed light 300 by the light receiving unit 46 may be 0.004ms, and the interval between the centers of the positions at which the pulsed light 300 is irradiated to the outer edge of the cutting edge 212 of the cutting tool 21 may be 0.698690206 mm.
The control unit 104 of the control unit 100 controls each component of the cutting apparatus 1 to cause the cutting apparatus 1 to perform a machining operation on the workpiece 200. Further, the control unit 100 is a computer, and the control unit 100 includes: an arithmetic processing device having a microprocessor such as a Central Processing Unit (CPU); a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory); and an input/output interface device. The arithmetic processing device of the control unit 100 performs arithmetic processing in accordance with a computer program stored in a storage device, and outputs control signals for controlling the cutting device 1 and the edge inspection unit 40 to the respective components of the cutting device 1 and the edge inspection unit 40 via the input/output interface device.
The control unit 100 is connected to a display unit 110 including a liquid crystal display device or the like for displaying a state of a machining operation, an image, or the like, an input unit, not shown, used by an operator for registering machining content information or the like, and a notification unit 120 for notifying the operator. The input unit is configured by at least one of an external input device such as a touch panel and a keyboard provided in the display unit 110. The notification unit 120 gives at least one of sound and light to notify the operator.
The blade edge inspection unit 40 is also used to determine a reference position of the cutting unit 20 in the Z-axis direction. The control unit 100 stores in advance a voltage value of a voltage converted by the photoelectric conversion portion 101 when the cutting unit 20 is located at a reference position in the Z-axis direction as a reference voltage 400 (shown in fig. 5). The cutting edge inspection means 40 gradually lowers the cutting tool 21 and gradually inserts the cutting tool into the depth of the intruding portion 44, and the light receiving portion 46 receives the pulsed light 300 from the light emitting portion 45, and detects and stores the detection result of the Z-axis direction position detection means when the voltage value of the voltage converted by the photoelectric conversion portion 101 becomes the reference voltage 400 as the reference position of the cutting means 20 in the Z-axis direction. The control unit 104 of the control unit 100 performs cutting using the reference position in the Z-axis direction of the cutting unit 20 detected by the cutting edge inspection unit 40.
The cutting apparatus 1 detects the reference position in the Z-axis direction of the cutting unit 20 by using the blade edge inspection unit 40, for example, every time one piece of the workpiece 200 is cut or every time a predetermined number of pieces of the workpiece 200 are cut, the time is stored as a part of the processing content information in the storage device of the control unit 100.
The cutting apparatus 1 includes a 2 nd blade edge inspection means 70 shown in fig. 7. Fig. 7 is a view schematically showing the structure of the 2 nd blade edge inspection unit of the cutting apparatus shown in fig. 1. The 2 nd blade edge inspection means 70 detects the state of the blade edge of the cutting edge 212 of the cutting tool 21 during the cutting process. The 2 nd blade edge inspection means 70 detects the presence or absence of a defect, which is a local defect from the outer edge of the cutting edge 212, as the state of the blade edge.
As shown in fig. 7, the 2 nd blade edge inspection unit 70 includes a unit body 71, and a photoelectric conversion unit 101, a voltage recording unit 102, and a determination unit 103 of the blade edge inspection unit 40. In embodiment 1, the unit body 71 is provided to the cutter cover 24. The unit main body 71 includes: a pair of leg portions 72 that are provided upright in the Z-axis direction, and that are spaced apart from each other in the Y-axis direction to position the cutting edges 212 of the cutting tools 21 therebetween; and a coupling portion 73 that couples the upper end portions of the pair of leg portions 72 to each other. Between the pair of leg portions 72 is an intruding portion 74 into which the cutting edge 212 of the cutting insert 21 intrudes. The 2 nd blade edge inspection unit 70 has an intruding portion 74.
The unit body 71 includes a light emitting section 75 provided on one leg 72 of the pair of legs 72, and a light receiving section 76 provided on the other leg 72. The light emitting unit 75 has an optical fiber 78, and the optical fiber 78 is connected to the light source 77, transmits the pulse-like light emitted from the light source 77, and emits the light toward the light receiving unit 76, which is the other leg 72. In embodiment 1, the outer diameter of the optical fiber 78 of the light emitting section 75 is, for example, 0.3mm or more and 5mm or less, and the light receiving section 76 receives the pulse-like light emitted from the light emitting section 75 and outputs the received pulse-like light to the photoelectric conversion section 101 of the control unit 100.
The photoelectric conversion portion 101 converts the amount of the pulse-like light received by the light receiving portion 76 into a voltage. The photoelectric conversion unit 101 converts the voltage into a voltage having a voltage value corresponding to the light amount of the pulsed light 300 input from the light receiving unit 76. In embodiment 1, the light amount of pulsed light 300 received by light receiving unit 76 is proportional to the voltage value of the voltage converted by photoelectric conversion unit 101.
Further, when a defect occurs in the cutting edge 212 of the cutting tool 21 during the cutting process, the amount of light received by the pulsed light emitted from the light emitting section 75 and received by the light receiving section 76 increases compared to before the defect occurs.
The voltage recording unit 102 stores the voltage converted by the photoelectric conversion unit 101 for each pulse. In embodiment 1, the voltage recording unit 102 records the voltage value of the voltage converted by the photoelectric conversion unit 101 in one-to-one correspondence with the timing at which the pulsed light is input to the photoelectric conversion unit 101.
The determination unit 103 determines whether or not the state of the edge of the cutting edge 212 of the cutting tool 21, that is, whether or not a defect occurs, based on a change in the voltage value of the voltage recorded by the voltage recording unit 102. The determination unit 103 determines whether or not the voltage value recorded by the voltage recording unit 102 during cutting is periodically increased more than a preset increase rate associated with tool consumption, and determines that a defect has occurred in the cutting edge 212 of the cutting tool 21 when it is determined that the voltage value is periodically increased more than the increase rate.
The control unit 104 controls each component of the 2 nd cutting edge inspection unit 70, and causes the 2 nd cutting edge inspection unit 70 to perform an operation of detecting the state of the cutting edge 212 of the cutting tool 21. In embodiment 1, when the determination unit 103 determines that a defect has occurred in the cutting edge 212 of the cutting tool 21, the control unit 104 stops the cutting process and operates the notification means 120 to notify the operator of the operation. When the determination unit 103 determines that the voltage value does not increase more than the increase rate and does not increase periodically, the control unit 104 determines that the cutting process is continued without causing a defect in the cutting edge 212 of the cutting tool 21. The functions of the photoelectric conversion unit 101, the determination unit 103, and the control unit 104 are realized by the operation processing device of the control unit 100 executing a computer program stored in a storage device. The function of the voltage recording section 102 is realized by the memory device of the control unit 100.
In the cutting apparatus 1 configured as described above, when an operator or the like registers information on the processing contents in the control unit 100, places the workpiece 200 on the holding surface 11 of the chuck table 10 in the carrying-in/out area via the adhesive tape 206, and receives an instruction to start the processing operation from the operator or the like from the control unit 100, the processing operation is started. When the machining operation is started, the cutting apparatus 1 sucks and holds the workpiece 200 on the holding surface 11 via the adhesive tape 206, clamps the annular frame 205 by the clamping portion 13, rotates the spindle 33 around the axis, and supplies the cutting water from the nozzles 25 and 26. The cutting apparatus 1 moves the chuck table 10 from the carrying in/out area to the machining area by the moving means 50 to a position below the imaging means 30, and images the workpiece 200 sucked and held by the chuck table 10 by the imaging means 30 to perform alignment.
The cutting apparatus 1 cuts the cutting tool 21 to a position reaching the adhesive tape 206 on the line to divide 202 of the object 200 while relatively moving the cutting tool 21 and the object 200 along the line to divide 202 by the moving means 50 based on the processing content information. When the cutting apparatus 1 cuts all the lines to divide 202 of the object 200, the chuck table 10 is moved from the processing area to the carrying in/out area.
In the carrying-in and carrying-out region, the cutting apparatus 1 stops the movement of the chuck table 10, stops the suction holding of the workpiece 200 by the chuck table 10, releases the clamping by the clamping portion 13, and ends the machining operation.
(method of detecting the State of the cutting tool)
The cutting tool state detection method according to embodiment 1 is a method for detecting the presence or absence of a defect at the cutting edge of the cutting edge 212 of the cutting tool 21 and the presence or absence of the through hole 213 in the cutting device 1 having the above-described configuration. Fig. 8 is a flowchart showing a flow of a method for detecting the state of a cutting tool according to embodiment 1. Fig. 9 is a diagram showing an example of a change in voltage value when it is determined that a defect has occurred in the cutting edge in the determination step of the method for detecting the state of the cutting tool shown in fig. 8. Fig. 10 is a diagram showing an example of a change in voltage value when it is determined that a through hole has occurred in the cutting edge in the determination step of the method for detecting the state of the cutting tool shown in fig. 8.
The method for detecting the state of the cutting tool according to embodiment 1 (hereinafter referred to as the state detection method) is performed at a timing such as every time a single workpiece 200 is cut or every time a predetermined number of workpieces 200 are cut. The timing for implementing the state detection method is stored in the storage device of the control unit 100 as a part of the processing content information. In embodiment 1, the cutting apparatus 1 detects the reference position of the cutting unit 20 in the Z-axis direction using the cutting edge inspection unit 40 after performing the state detection method and determining that both the defect and the through hole 213 are not generated, but in the present invention, the timing of performing the state detection method and the timing of detecting the reference position are not limited to the timing described in embodiment 1.
As shown in fig. 8, the state detection method has a start position setting step ST1, a voltage recording step ST2, and a determination step ST 3.
The start position setting step ST1 is a step of positioning the lower end of the cutting edge 212 of the cutting tool 21 at the start position. In the start position setting step ST1, the control unit 104 of the control unit 100 controls the motor of the cutting unit 20 to rotate the spindle 23, and controls the moving unit 50 to position the lower end of the cutting edge 212 of the cutting tool 21 of the cutting unit 20 directly above the intruding portion 44 of the blade edge inspection unit 40 without supplying the cutting water from the nozzles 25 and 26. In the start position setting step ST1, the control unit 104 of the control unit 100 emits pulsed light 300 at a predetermined frequency from the light source 47, emits pulsed light 300 from the light emitting unit 45 toward the light receiving unit 46, and controls the Z-axis moving unit 53 to lower the cutting unit 20 and insert the cutting edge 212 of the cutting tool 21 into the intruding portion 44.
In the start position setting step ST1, the control unit 104 of the control unit 100 controls the Z-axis moving unit 53 based on the voltage value of the voltage received by the light receiving unit 46 and converted by the photoelectric conversion unit 101, positions the cutting unit 20 at the start position, and stops the movement of the cutting unit 20 in the Z-axis direction.
The voltage recording step ST2 is a step of: the Z-axis moving means 53 is driven while the cutting tool 21 is rotated, and changes in voltage values during a period from a start position at which the cutting edge 212 does not shield the pulsed light 300 received by the light receiving section 46 to a position at which the cutting edge 212 enters the entering section by a predetermined amount are recorded. In embodiment 1, in the voltage recording step ST2, the control unit 104 of the control unit 100 controls the Z-axis moving unit 53 to lower the cutting unit 20 while rotating the cutting tool 21 and insert the cutting tool 21 into the deep portion of the intruding portion 44. In embodiment 1, in the voltage recording step ST2, the control unit 104 of the control unit 100 controls the Z-axis moving unit 53 based on the voltage value received by the light receiving unit 46 and converted by the photoelectric conversion unit 101, positions the Z-axis moving unit at a detection position where the voltage value is reduced by 10% which is a predetermined value from the start position, that is, a position where the voltage value is 90%, and stops the movement of the cutting unit 20 in the Z-axis direction. In the voltage recording step ST2, the voltage recording portion 102 of the control unit 100 records the voltage value of the voltage received by the light receiving portion 46 and converted by the photoelectric conversion portion 101.
The determination step ST3 is a step of determining the state of the cutting edge 212 based on the change in the voltage value of the voltage recorded in the voltage recording step ST 2. In embodiment 1, in determination step ST3, determination unit 103 of control unit 100 determines whether or not there is no increase in voltage of 500 (shown in fig. 9 and 10) or more in the change in voltage recorded by voltage recording unit 102 in voltage recording step ST 2. In the determination step ST3, when there is no increase of the voltage of 500 (shown in fig. 9 and 10) or more in the change of the voltage recorded by the voltage recording unit 102 in the previous voltage recording step ST2, the determination unit 103 of the control unit 100 determines that there is no defect in the cutting edge 212 and determines that there is no abnormality in the cutting edge 212 of the cutting tool 21.
In the determination step ST3, when a voltage value of 500 or more periodically and temporarily increases as shown in fig. 9 during the change in voltage recorded by the voltage recording unit 102 in the previous voltage recording step ST2, it is determined that a defect has occurred at the tip of the cutting edge 212, and the determination unit 103 of the control unit 100 determines that there is an abnormality in the cutting edge 212 of the cutting tool 21. In this way, in the determination step ST3, when the determination unit 103 of the control unit 100 periodically and temporarily increases the voltage value from the position at which the cutting edge 212 becomes 90% immediately after the start of the shielding of the pulsed light 300, it is determined that a defect has occurred at the tip of the cutting edge 212. In determination step ST3, control unit 104 of control unit 100 records the determination result of determination unit 103 in the storage device.
The controller 104 of the control unit 100 determines whether there is an abnormality in step ST3 (step ST 4). When the controller 104 of the control unit 100 determines that there is an abnormality in the determination step ST3 (yes in step ST4), the notification unit 120 is operated to notify the operator (step ST5), and the state detection method is ended.
When the control unit 104 of the control unit 100 determines that there is no abnormality in the determination step ST3 (no in step ST4), it determines whether or not the cutting tool 21 of the cutting unit 20 is located at the end position (position at which 0% is reached) based on the voltage value of the voltage received by the light receiving unit 46 and converted by the photoelectric conversion unit 101 (step ST 6).
When the control unit 104 of the control unit 100 determines that the cutting tool 21 of the cutting unit 20 is located at the end position (position at 0%) (yes in step ST6), the end state detection method returns to the voltage recording step ST2 when it determines that the cutting tool 21 of the cutting unit 20 is not located at the end position (position at 0%) (no in step ST 6).
In the returned voltage recording step ST2, the control unit 104 of the control unit 100 controls the Z-axis moving unit 53 to lower the cutting unit 20, and based on the voltage value of the voltage received by the light receiving unit 46 and converted by the photoelectric conversion unit 101, the control unit is positioned at a detection position where the voltage value is lowered by 10%, which is a predetermined value, compared to the position where the voltage value is 90%, that is, at a position where the voltage value is 80%, and stops the movement of the cutting unit 20 in the Z-axis direction. In the voltage recording step ST2, the voltage recording unit 102 of the control unit 100 records the voltage value of the voltage received by the light receiving unit 46 and converted by the photoelectric conversion unit 101, and the process proceeds to the determination step ST 3.
In the determination step ST3, when there is no increase of the voltage of 500 (shown in fig. 9 and 10) or more in the change of the voltage recorded by the voltage recording unit 102 in the previous voltage recording step ST2, the determination unit 103 of the control unit 100 determines that there is no through hole 213 and determines that there is no abnormality in the cutting edge 212 of the cutting tool 21.
In addition, in the determination step ST3, when a regular and temporary increase in the voltage value of 500 or more occurs in the change in the voltage recorded by the voltage recording unit 102 in the previous voltage recording step ST2 as shown in fig. 10, the determination unit 103 of the control unit 100 determines that the through hole 213 is formed at a position radially inward of the outer peripheral edge of the cutting edge 212, and determines that there is an abnormality in the cutting edge 212 of the cutting tool 21. As described above, in the determination step ST3, when a state in which no regular and temporary voltage value increase occurs at any of the detection positions having a voltage value of less than 90% continues from the position that becomes 90% immediately after the cutting edge 212 starts to shield the pulsed light 300, the determination unit 103 of the control unit 100 determines that the through hole 213 has occurred at a position radially inward of the outer peripheral edge of the cutting edge 212 and determines that there is an abnormality in the cutting edge 212 of the cutting tool 21. In the determination step ST3, the control unit 104 of the control unit 100 records the determination result of the determination unit 103 in the storage device, and proceeds to step ST 4.
In this way, with the state detection method, the cutting tool 21 of the cutting unit 20 and the blade edge checking unit 40 are moved in the Z-axis direction from the start position toward the end position and sequentially positioned at the detection position where the voltage value is reduced by a predetermined amount, and the voltage recording step ST2, the determination step ST3, the step ST4, and the step ST6 are repeated until it is determined in the determination step ST3 that a defect or a through hole 213 has occurred in the cutting blade 212. In the state detection method, when it is not determined in the determination step ST3 that a defect or a through hole 213 has occurred in the cutting edge 212, the cutting tool 21 and the edge inspection means 40 of the cutting means 20 are sequentially positioned at detection positions where the voltage value decreases by a predetermined amount from the start position toward the end position, and the state of the edge is determined.
As described above, in the state detection method according to embodiment 1, in the determination step ST3, when a regular and temporary increase in voltage value occurs from the position that is 90% immediately after the cutting edge 212 starts to shield the pulsed light 300, the determination unit 103 of the control unit 100 determines that a defect has occurred at the tip of the cutting edge 212. In the state detection method according to embodiment 1, in the determination step ST3, when a state in which no regular and temporary voltage value increase occurs is continued from a position that is 90% immediately after the cutting edge 212 starts to shield the pulsed light 300, and then a regular and temporary voltage value increase occurs at any position of the detection positions having voltage values smaller than 90%, the determination unit 103 of the control unit 100 determines that the through hole 213 has occurred at a position radially inward of the outer peripheral edge of the cutting edge 212. As a result, the state detection method according to embodiment 1 has an effect of being able to detect the through hole 213 formed in the cutting edge 212 in addition to the defect.
In the state detection method according to embodiment 1, the cutting unit 20 is moved by the Z-axis moving unit 53 as the cutting feed unit that moves the cutting unit 20, and the cutting tool 21 is inserted into the entering portion 44. As a result, the state detection method of embodiment 1 achieves the following effects: the through hole 213 formed in the cutting blade 212 can be detected in the order of the start position, each detection position, and the end position, in addition to the defect.
[ 2 nd embodiment ]
A method for detecting the state of a cutting tool according to embodiment 2 of the present invention will be described with reference to the drawings. Fig. 11 is a diagram schematically showing the configuration of the 2 nd cutting edge inspection unit of the cutting apparatus for implementing the method of detecting the state of the cutting tool according to embodiment 2. In fig. 11, the same portions as those in embodiment 1 are denoted by the same reference numerals, and description thereof is omitted.
In the method for detecting the state of the cutting tool according to embodiment 2, the unit main body 71 of the 2 nd cutting edge inspection unit 70 is provided to be movable in the Z axis direction with respect to the tool cover 24 by the light-receiving/emitting unit moving unit 80, the light-receiving/emitting unit moving unit 80 lowers the unit main body 71 of the 2 nd cutting edge inspection unit 70 from the start position toward the end position, the 2 nd cutting edge inspection unit 70 emits pulsed light 300 from the light-emitting unit 75, and records the change in the voltage value described above, and determines the presence or absence of the occurrence of the defect and the through hole 213, other than this, the same as embodiment 1 is used.
The light-receiving-part moving unit 80 is a moving unit described in the claims that moves the light-emitting part 75 and the light-receiving part 76 of the unit main body 71 of the 2 nd blade edge inspection unit 70 in the Z-axis direction integrally, and moves the light-emitting part 75 and the light-receiving part 76 of the 2 nd blade edge inspection unit 70 and the cutting unit 20 in the Z-axis direction relatively. As shown in fig. 11, the light receiving/emitting unit moving unit 80 includes: a well-known ball screw 81 provided to be rotatable about an axis; a well-known motor 82 that rotates the ball screw 81 about the axis to move the unit body 71 up and down; and a known guide rail 83 for supporting the unit main body 71 to be movable in the Z-axis direction.
In the method for detecting the state of the cutting tool according to embodiment 2, in the determination step ST3, when a regular and temporary increase in the voltage value occurs from the position that is 90% immediately after the cutting edge 212 starts to shield the pulsed light 300, the determination unit 103 of the control unit 100 determines that a defect has occurred at the tip of the cutting edge 212. In the state detection method according to embodiment 1, in the determination step ST3, when a state in which no regular and temporary voltage value increase occurs is continued from a position that is 90% immediately after the cutting edge 212 starts to shield the pulsed light 300, and then a regular and temporary voltage value increase occurs at any position of the detection positions having voltage values smaller than 90%, the determination unit 103 of the control unit 100 determines that the through hole 213 has occurred at a position radially inward of the outer peripheral edge of the cutting edge 212. As a result, the method for detecting the state of the cutting tool according to embodiment 2 has the following effects in the same manner as embodiment 1: in addition to the defect, the through hole 213 formed in the cutting edge 212 can be detected.
In the method for detecting the state of the cutting tool according to embodiment 2, the cutting tool 21 is inserted between the light emitting section 45 and the light receiving section 46 by the light receiving/emitting section moving means 80 moving the unit main body 71 of the 2 nd cutting edge inspection unit 70. As a result, the method for detecting the state of the cutting tool according to embodiment 2 has the following effects: the through hole 213 formed in the cutting blade 212 can be detected in the order of the start position, each detection position, and the end position, in addition to the defect.
The present invention is not limited to the above embodiments. That is, various modifications can be made and implemented without departing from the scope of the present invention. In the above embodiment, the example in which the lowering of the cutting tool 21 is stopped at the height of each% and the light receiving amount is measured to determine the defect or the through hole is shown in the voltage recording step ST2, but the time for stopping the lowering of the cutting tool 21 is short enough to measure at least 1 week of the cutting tool 21.

Claims (2)

1. A method for detecting the state of a cutting tool, which detects the state of the cutting edge of the cutting tool in a cutting device,
the cutting device comprises:
a chuck table for holding a workpiece;
a cutting unit for cutting the workpiece held by the chuck table by attaching the cutting tool having a cutting edge on the outer periphery to the spindle;
a blade edge inspection unit including an intruding portion into which the cutting edge of the cutting tool intrudes, and a light emitting portion and a light receiving portion disposed to face each other with the intruding portion interposed therebetween; and
a moving unit that relatively moves the tip checking unit and the cutting unit in a radial direction of the cutting tool,
wherein,
the blade tip inspection unit further includes:
a photoelectric conversion unit that converts the amount of the pulsed light received by the light receiving unit into a voltage; and
a voltage recording section that records the voltage converted by the photoelectric conversion section for each pulse,
the method for detecting the state of the cutting tool comprises the following steps:
a voltage recording step of driving the moving unit while rotating the cutting tool, and recording a change in the voltage during a period of movement from a position where the cutting edge does not shield the pulsed light received by the light receiving unit to a position where the cutting edge intrudes into the intruding portion by a predetermined amount; and
a determination step of determining a state of the cutting edge based on the change of the voltage recorded by the voltage recording step,
in the step of the determination, it is determined that,
when the voltage is not increased more than a predetermined value, it is determined that there is no defect in the cutting edge,
when the voltage is periodically and temporarily increased immediately after the cutting blade starts to shield the pulsed light, it is determined that a defect has occurred at the tip of the cutting blade,
when the regular and temporary voltage increase occurs after a state in which the regular and temporary voltage increase does not occur is continued immediately after the cutting blade starts to shield the pulsed light, it is determined that the through hole is formed at a position radially inward of the outer peripheral edge of the cutting blade.
2. The state detecting method of a cutting tool according to claim 1,
the moving unit includes an incision feeding unit that moves the cutting unit or a light receiving and emitting unit moving unit that integrally moves the light emitting unit and the light receiving unit.
CN202110006655.XA 2020-01-07 2021-01-05 Method for detecting state of cutting tool Active CN113146473B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020001052A JP7370256B2 (en) 2020-01-07 2020-01-07 Cutting blade condition detection method
JP2020-001052 2020-01-07

Publications (2)

Publication Number Publication Date
CN113146473A true CN113146473A (en) 2021-07-23
CN113146473B CN113146473B (en) 2024-05-10

Family

ID=76878435

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110006655.XA Active CN113146473B (en) 2020-01-07 2021-01-05 Method for detecting state of cutting tool

Country Status (5)

Country Link
JP (1) JP7370256B2 (en)
KR (1) KR20210089078A (en)
CN (1) CN113146473B (en)
SG (1) SG10202012886YA (en)
TW (1) TW202127044A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114012603B (en) * 2021-11-09 2022-12-06 江苏京创先进电子科技有限公司 Grinding wheel cutter comprehensive state detection method, device, equipment and storage medium

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001298001A (en) * 2000-04-12 2001-10-26 Disco Abrasive Syst Ltd Cutting blade detecting mechanism for cutting device
CN1766590A (en) * 2005-10-24 2006-05-03 中国电子科技集团公司第四十五研究所 Apparatus and method for detecting broken blade of scribing machine
CN101402227A (en) * 2007-10-03 2009-04-08 株式会社迪思科 Cutting blade detection mechanism
CN101650307A (en) * 2009-07-17 2010-02-17 山东富美科技有限公司 Scraper blade surface detection system
CN102384909A (en) * 2010-09-01 2012-03-21 北京中电科电子装备有限公司 Detecting device and detecting method for cutter body breakage
CN206876593U (en) * 2017-05-23 2018-01-12 拓卡奔马机电科技有限公司 Break detection device for cutting
JP2019093465A (en) * 2017-11-21 2019-06-20 株式会社ディスコ Cutting device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002370140A (en) * 2001-06-12 2002-12-24 Disco Abrasive Syst Ltd Blade monitoring device
JP4679209B2 (en) * 2005-04-04 2011-04-27 株式会社ディスコ Cutting apparatus and blade state detection method
JP2018158413A (en) * 2017-03-23 2018-10-11 株式会社ディスコ Cutting device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001298001A (en) * 2000-04-12 2001-10-26 Disco Abrasive Syst Ltd Cutting blade detecting mechanism for cutting device
CN1766590A (en) * 2005-10-24 2006-05-03 中国电子科技集团公司第四十五研究所 Apparatus and method for detecting broken blade of scribing machine
CN101402227A (en) * 2007-10-03 2009-04-08 株式会社迪思科 Cutting blade detection mechanism
CN101650307A (en) * 2009-07-17 2010-02-17 山东富美科技有限公司 Scraper blade surface detection system
CN102384909A (en) * 2010-09-01 2012-03-21 北京中电科电子装备有限公司 Detecting device and detecting method for cutter body breakage
CN206876593U (en) * 2017-05-23 2018-01-12 拓卡奔马机电科技有限公司 Break detection device for cutting
JP2019093465A (en) * 2017-11-21 2019-06-20 株式会社ディスコ Cutting device

Also Published As

Publication number Publication date
CN113146473B (en) 2024-05-10
KR20210089078A (en) 2021-07-15
JP2021109256A (en) 2021-08-02
TW202127044A (en) 2021-07-16
JP7370256B2 (en) 2023-10-27
SG10202012886YA (en) 2021-08-30

Similar Documents

Publication Publication Date Title
JP2010199227A (en) Grinding device
JP6983026B2 (en) Cutting equipment
CN113146473B (en) Method for detecting state of cutting tool
TW202310979A (en) Grinding apparatus
TWI820320B (en) Processing equipment
JP2019186491A (en) Processing method for work piece
CN114734332A (en) Grinding device
CN117260505A (en) Cutting device and dressing method
JP5538015B2 (en) Method of determining machining movement amount correction value in machining apparatus
JP7362334B2 (en) Processing method
US20220168918A1 (en) Processing apparatus
CN110571146B (en) Method for processing rectangular workpiece
JP2012024895A (en) Cutting method
JP7271181B2 (en) diagnostic method
JP2021122919A (en) Cutting device
JP2024068982A (en) Cutting blade detecting mechanism
JP2024073263A (en) Processing device
JP2017064821A (en) Bending detection method of cutting blade
TW202432328A (en) Cutting device, reading device
JP2024108199A (en) Cutting device, reading device
JP2024067497A (en) Cutting device
KR20220098680A (en) Inspection apparatus and machining apparatus
KR20200087699A (en) Workpiece processing method
CN112992724A (en) Processing device
CN112983873A (en) Method for measuring attractive force

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant