CN113141760A - Electronic device - Google Patents
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- CN113141760A CN113141760A CN202110444553.6A CN202110444553A CN113141760A CN 113141760 A CN113141760 A CN 113141760A CN 202110444553 A CN202110444553 A CN 202110444553A CN 113141760 A CN113141760 A CN 113141760A
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- pressing
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- heat pipe
- display screen
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
An embodiment of the present application provides an electronic device, which specifically includes: the device comprises a device body, a flexible display screen and a heat pipe; the flexible display screen is arranged on the equipment body and provided with a first flexible pressing area and a second flexible pressing area; the heat pipe is arranged in the equipment body, a cooling medium is arranged in the heat pipe, and the two ends of the heat pipe are respectively an evaporation end and a condensation end; the evaporation end is provided with a first pressing piece, the first pressing piece is connected with the flexible display screen of the first flexible pressing area, the condensation end is provided with a second pressing piece, and the second pressing piece is connected with the flexible display screen of the second flexible pressing area; wherein the cooling medium flows from the evaporation end to the condensation end in a case where the first flexible pressing region is pressed, and flows from the condensation end to the evaporation end in a case where the second flexible pressing region is pressed.
Description
Technical Field
The application belongs to the technical field of communication, and particularly relates to an electronic device.
Background
Along with the development of communication technology, the functions of electronic equipment such as mobile phones and tablet computers are more and more abundant, and correspondingly, the power consumption and the heat productivity of the electronic equipment are also more and more high.
In the existing electronic equipment, a heat pipe is generally adopted for heat dissipation, namely, an evaporation end of the heat pipe is arranged in a heating area, a condensation end of the heat pipe is arranged in a non-heating area, and heat in the heating area can be taken away through circulation reflux of heat dissipation liquid in the heat pipe between the evaporation end and the condensation end, so that heat dissipation of the heating area is realized.
However, in the existing heat pipe, the heat dissipation liquid completely depends on the temperature difference between the heating area and the non-heating area to realize flowing, so that the heat dissipation efficiency is low, the heating problem of the electronic equipment is easy to be serious, and further, the use experience of a user is poor.
Disclosure of Invention
The application aims at providing an electronic device, and at least solves the problem that the existing electronic device is poor in heat dissipation effect.
In order to solve the technical problem, the present application is implemented as follows:
an embodiment of the present application provides an electronic device, including: the device comprises a device body, a flexible display screen and a heat pipe;
the flexible display screen is arranged on the equipment body and comprises a first flexible pressing area and a second flexible pressing area;
the heat pipe is arranged in the equipment body, a cooling medium is arranged in the heat pipe, and the two ends of the heat pipe are respectively an evaporation end and a condensation end; the evaporation end is provided with a first pressing piece, the first pressing piece is connected with the flexible display screen of the first flexible pressing area, the condensation end is provided with a second pressing piece, and the second pressing piece is connected with the flexible display screen of the second flexible pressing area;
the cooling medium flows from the evaporation end to the condensation end in a case where the first flexible pressing region is pressed, and flows from the condensation end to the evaporation end in a case where the second flexible pressing region is pressed.
In the embodiment of the application, the flexible display screen comprises a first flexible pressing area and a second flexible pressing area, a first pressing piece is arranged at the evaporation end of the heat pipe and connected with the flexible display screen of the first flexible pressing area, and a second pressing piece is arranged at the condensation end of the heat pipe and connected with the flexible display screen of the second flexible pressing area. Under the condition that the first flexible pressing area is pressed, the first flexible pressing area can deform to drive the first pressing piece to press the cooling medium at the evaporation end, so that the cooling medium flows from the evaporation end to the condensation end; when the second flexible pressing area is pressed, the second flexible pressing area can deform to drive the second pressing piece to press the cooling medium at the condensation end, so that the cooling medium flows from the condensation end to the evaporation end. Therefore, under the condition that the first flexible pressing area and the second flexible pressing area are pressed, the flow of a cooling medium in the heat pipe is accelerated, and the heat dissipation efficiency of the heat pipe is improved, so that the heat dissipation performance of the electronic equipment is improved, and the use experience of a user is improved.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
fig. 2 is a second schematic structural diagram of an electronic device according to an embodiment of the present application;
fig. 3 is a schematic cross-sectional view of an electronic device according to an embodiment of the present disclosure;
FIG. 4 is a schematic cross-sectional view of an electronic device according to an embodiment of the present disclosure;
fig. 5 is an exploded schematic view of an electronic device according to an embodiment of the present application;
fig. 6 is a flow chart of a cooling medium in a heat pipe in an electronic apparatus according to an embodiment of the present application;
FIG. 7 is a schematic structural diagram of a heat pipe according to an embodiment of the present application;
FIG. 8 is a schematic cross-sectional view of the heat pipe shown in FIG. 7;
reference numerals: 10-device body, 101-first flexible pressing area, 102-second flexible pressing area, 103-groove, 11-heat pipe, 111-evaporation end, 112-condensation end, 113-first pressing piece, 114-fourth pressing piece, 115-first opening, 116-second opening, 117-first silicon sheet, 118-second silicon sheet, 119-copper pipe, 12-flexible display screen, 14-circuit board, 15-back cover.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The embodiment of the present application provides an electronic device, where the electronic device may include, but is not limited to, any one of a mobile phone, a tablet computer, and a wearable device, and the embodiment of the present application only takes the electronic device as a mobile phone as an example for description, and other application scenarios may be executed by reference.
Referring to fig. 1, a first structural schematic diagram of an electronic device according to an embodiment of the present application is shown, referring to fig. 2, a second structural schematic diagram of an electronic device according to an embodiment of the present application is shown, referring to fig. 3, a sectional structural schematic diagram of an electronic device according to an embodiment of the present application at a certain angle is shown, referring to fig. 4, a sectional structural schematic diagram of an electronic device according to an embodiment of the present application at another angle is shown, referring to fig. 5, an exploded structural schematic diagram of an electronic device according to an embodiment of the present application is shown, referring to fig. 6, a cooling medium flow diagram in a heat pipe in an electronic device according to an embodiment of the present application is shown, referring to fig. 7, a structural schematic diagram of a heat pipe according to an embodiment of the present application is shown, referring to fig. 8, a sectional structural schematic diagram of a heat pipe shown in fig. 7 is shown.
Specifically, the electronic device may include: the device comprises a device body 10, a flexible display screen 12 and a heat pipe 11; the flexible display screen 12 is arranged on the device body 10, and the flexible display screen 12 comprises a first flexible pressing area 101 and a second flexible pressing area 102; the heat pipe 11 is arranged in the equipment body 10, a cooling medium is arranged in the heat pipe 11, and two ends of the heat pipe 11 are respectively an evaporation end 111 and a condensation end 112; the evaporation end 111 is provided with a first pressing member 113, the first pressing member 113 is connected with the flexible display screen of the first flexible pressing region 101, the condensation end 112 is provided with a second pressing member 114, and the second pressing member 114 is connected with the flexible display screen of the second flexible pressing region 102.
When the first flexible pressing region 101 is pressed, the cooling medium flows from the evaporation end 111 to the condensation end by the first pressing member 113, and when the second flexible pressing region 102 is pressed, the cooling medium flows from the condensation end 112 to the evaporation end 111 by the second pressing member 114.
In the embodiment of the present application, since the flexible display screen 12 may include the first flexible pressing region 101 and the second flexible pressing region 102, and the first pressing member 113 is disposed at the evaporation end 111 of the heat pipe 11, the first pressing member 113 is connected to the flexible display screen of the first flexible pressing region 101, the second pressing member 114 is disposed at the condensation end 112 of the heat pipe 11, and the second pressing member 114 is connected to the flexible display screen of the second flexible pressing region 102. When the first flexible pressing area 101 is pressed, the first flexible pressing area 101 deforms, and the first pressing piece 113 is driven to press the cooling medium at the evaporation end 111, so that the cooling medium flows from the evaporation end 111 to the condensation end 112; in the case that the second flexible pressing region 102 is pressed, the second flexible pressing region 102 is deformed to drive the second pressing member 114 to press the cooling medium at the condensation end 112, so that the cooling medium flows from the condensation end 112 to the evaporation end 111. In this way, when the first flexible pressing area 101 and the second flexible pressing area 102 are pressed, the flow of the cooling medium in the heat pipe 11 is accelerated, and the heat dissipation efficiency of the heat pipe 11 is improved, so that the heat dissipation performance of the electronic device is improved, and the use experience of a user is improved.
Specifically, the device body 10 may specifically include a middle frame and various functional components connected to the middle frame, as a main body of the electronic device. The flexible display 12 may be attached to the device body 10 and assume the function of displaying. The first flexible pressing area 101 and the second flexible pressing area 102 may be disposed at intervals in an area on the flexible display 12 that is often pressed by a hand of a user.
For example, as shown in fig. 1, when the electronic device is running a large game, the user usually uses the electronic device across the screen, and the touch areas of both hands are concentrated in the black dashed box in the figure, so that the first flexible pressing region 101 in fig. 1 can be arranged in the black dashed box at the lower left corner, and the second flexible pressing region 102 can be arranged in the black dashed box at the lower right corner, so that, in the case of running the large game on the electronic device, the touch operations of both hands of the user are concentrated in the first flexible pressing region 101 and the second flexible pressing region 102, so that the first flexible pressing region 101 and the second flexible pressing region 102 can be deformed, and the first pressing member 113 and the second pressing member 114 connected thereto are repeatedly pressed, so that the cooling medium flows from the evaporation end 111 to the condensation end 112, and so that the cooling medium flows from the condensation end 112 to the evaporation end 111, and the flow of the cooling medium in the heat pipe 11 is accelerated, the heat dissipation efficiency of the heat pipe 11 is improved.
It should be noted that, in the drawings of the embodiments of the present application, only the first flexible pressing region 101 and the second flexible pressing region 102 are shown to be disposed on the display side of the display device, but in practical applications, the first flexible pressing region 101 and the second flexible pressing region 102 may be disposed at any position, such as a side surface or a non-display side of the electronic device, according to a functional configuration of the electronic device and a usage habit of a user, and the specific positions of the first flexible pressing region 101 and the second flexible pressing region 102 may not be limited in the embodiments of the present application.
In the embodiment of the present application, the first flexible pressing region 101 and the second flexible pressing region 102 can be deformed by pressing by a user. In practical applications, it is also possible to provide some of the components on the device body 10 with flexible components, such as a screen, a middle frame, or a back cover, and to provide the first and second flexible pressing regions 101 and 102 on these flexible components, so that the first and second flexible pressing regions 101 and 102 can be deformed by the user's pressing. It is also possible to design only a local position on the apparatus body 10 as a flexible structure to form the first flexible pressing region 101 and the second flexible pressing region 102, for example, a local position on the color-display side, the side surface, or the non-display side of the apparatus body 10 as a flexible structure. The embodiment of the present application may not be limited to the specific implementation of the first flexible pressing region 101 and the second flexible pressing region 102.
In the using process of the electronic device, according to the using habit of the user, the pressing operation of the user on the screen is most frequent, so that by setting the screen of the electronic device as the flexible display screen 12 and setting the areas of the flexible display screen 12 most frequently touched by the hands of the user as the first flexible pressing area 101 and the second flexible pressing area 102, the frequency of pressing the first flexible pressing area 101 and the second flexible pressing area 102 can be increased, thereby further increasing the deformation frequency of the first flexible pressing area 101 and the second flexible pressing area 102, and further improving the heat dissipation efficiency of the heat pipe 11.
Alternatively, the first pressing member 113 and the second pressing member 114 are both in contact with the flexible display 12, and a preset pre-pressure amount is provided between the first pressing member 113 and the flexible display 12, so that when the first flexible pressing region 101 and the second flexible pressing region 102 on the flexible display 12 are pressed and deformed, the deformation pressure can be rapidly transmitted to the first pressing member 113 and the second pressing member 114, the cooling medium at the evaporation end 111 is pressed by the first pressing member 113, and the cooling medium at the condensation end 112 is pressed by the second pressing member 114, thereby accelerating the flow of the cooling medium in the heat pipe 11 and improving the heat dissipation efficiency of the heat pipe 11.
In practical applications, the first pressing member 113 may protrude from the evaporation end 111 and be at least partially embedded in the first flexible pressing region 101 on the flexible display 12, so that a predetermined pre-pressing amount is achieved between the first pressing member 113 and the first flexible pressing region 101. Similarly, the second pressing member 114 may protrude from the evaporation end 112 and be at least partially embedded in the second flexible pressing region 102 on the flexible display screen 12, so that a predetermined pre-pressure amount is achieved between the second pressing member 114 and the second flexible pressing region 102.
For example, the preset preload amount may be set according to an actual situation, for example, the preset preload amount may be any value between 0.001 mm and 0.01 mm, and the specific value of the preset preload amount may not be limited in the embodiment of the present application.
In an alternative embodiment of the present application, the evaporation end 111 is provided with a first opening 115, and the condensation end 112 is provided with a second opening 116; the first pressing part 113 is movably connected to the first opening 115 and can seal the first opening 115; the second pressing member 114 is movably connected to the second opening 116 and can seal the second opening 116.
Specifically, in practical applications, by the first pressing member 113 being movably connected to the first opening 115, in the case that the first flexible pressing region 101 is deformed by pressing, the first pressing member 113 can correspondingly move downward to press the cooling medium in the first opening 115, so as to press the cooling medium in the heat pipe 11 to flow from the evaporation end 111 to the condensation end 112. Similarly, by the second pressing member 114 being movably connected to the second opening 116, in the case that the second flexible pressing region 102 is deformed by pressing, the second pressing member 114 can correspondingly move downward to press the cooling medium in the second opening, so as to press the cooling medium in the heat pipe 11 to flow from the condensation end 114 to the evaporation end 113.
Optionally, the heat pipe 11 further includes a first silicone sheet 117 and a second silicone sheet 118; wherein, the first silicone sheet 117 is connected between the first pressing piece 113 and the first opening 115, so that the first pressing piece 113 is movably connected to the first opening 115 and the first opening 115 can be sealed; a second silicone sheet 118 is connected between the second pressing member 114 and the second opening 116, so that the second pressing member 114 is movably connected to the second opening 116 and the second opening 116 can be sealed.
Specifically, since the first silicone sheet 117 can be flexibly deformed, the first pressing member 113 can be movably connected to the first opening 115 by the flexible deformation of the first silicone sheet 117. For example, in the case that the first flexible pressing region 101 is pressed to deform, the first pressing member 113 may correspondingly press the first silicone sheet 117 downwards, and since the first silicone sheet 117 may be flexibly deformed, the first pressing member 113 may be enabled to move downwards to press the cooling medium in the first opening 115, so as to press the cooling medium in the heat pipe 11 to flow from the evaporation end 111 to the condensation end 113. Moreover, since the first silicone sheet 117 can be flexibly deformed, the first silicone sheet 117 can better seal the first opening 115, and the cooling medium in the heat pipe 11 is prevented from flowing out of the first opening 115.
Specifically, the first silicone sheet 117 may be an annular silicone sheet, and in order to facilitate the movement of the first pressing member 113 in the first opening 115, the aperture of the first opening 115 may be larger than the outer diameter of the first pressing member 113. The outer diameter of the first silicone sheet 117 may be larger than the aperture of the first opening 114, and the inner diameter of the first silicone sheet 117 may be larger than the outer diameter of the first pressing member 113. By connecting the outer ring of the first silicone sheet 117 to the first opening 114 and connecting the inner ring of the first silicone sheet 117 to the first pressing member 113, the first pressing member 113 and the first opening 114 can be hermetically connected, and the first pressing member 113 can move in the first opening 115 conveniently. In this way, at least part of the first pressing member 113 may be moved into said first opening 114 in case the first flexible pressing zone 101 is pressed, to improve the pressing effect of the first pressing member 113 on the cooling medium inside the heat pipe 11.
In practical applications, the first silicone sheet 117 may be connected to the first pressing member 113 and the first opening 115 respectively through an adhesive medium, and the first silicone sheet 117 may also be connected to the first flexible pressing region 101 through an adhesive medium, so as to reliably fix the heat pipe 11 to the first flexible pressing region 101. For example, the bonding medium may include, but is not limited to, at least one of glue and tape, and the specific type of the bonding medium may not be limited in the embodiments of the present application.
It should be noted that the specific structure, connection relationship and working principle of the second silicone sheet 118 can be implemented with reference to the first silicone sheet 117, and are not described herein again.
Alternatively, the first and second pressing members 113 and 114 may be copper sheets. Since the copper sheet has a good heat dissipation effect, the heat dissipation effect of the heat pipe 11 can be further improved when the first pressing member 113 and the second pressing member 114 are both copper sheets.
Of course, in practical applications, the first pressing member 113 and the second pressing member 114 may be sheet-shaped members made of other materials such as steel sheets and plastic sheets, and specific materials of the first pressing member 113 and the second pressing member 114 in the embodiments of the present application may not be limited.
In another embodiment of the present application, the first pressing member 113 and the second pressing member 114 may also be flexible pressing members, so that, when the first flexible pressing region 101 and the second flexible pressing region 102 are pressed to deform, the first pressing member 113 and the second pressing member 114 can be correspondingly deformed to press the cooling medium in the heat pipe 11, and the structure is simple and easy to implement.
In an embodiment of the present application, a copper pipe 119 may be further disposed in the heat pipe 11, one end of the copper pipe 119 is disposed at the evaporation end 111 of the heat pipe 11, and the other end of the copper pipe 119 is disposed at the condensation end 112 of the heat pipe 11, and the copper pipe 119 may be configured to accelerate heat exchange between the evaporation end 111 and the condensation end 112, so as to further improve a heat dissipation effect of the heat pipe 11.
For example, the flexible pressing member may be made of a material capable of being flexibly deformed, such as silicone rubber, waterproof foam, and the like, and the specific material of the flexible pressing member in the embodiment of the present application may not be limited.
Optionally, the electronic device may further include: the heating element 13 is arranged in the equipment body 10, and the heating element 13 is arranged on one side of the first flexible pressing area 101, which is far away from the heat pipe 11; the heat generating member 13 is connected to the evaporation end 111 of the heat pipe 11, so that when the heat generating member 13 generates heat, the heat can make the cooling medium in the evaporation end 111 evaporate and dissipate the heat. Illustratively, the heat generating member 13 may be a component of the electronic device that is easily heated, such as a heat generating chip, a radio frequency module, and the like.
In practical applications, the condensation end 112 of the heat pipe 11 may be disposed in a region where heat is not easily generated in the apparatus body 10, for example, a region where heat generating components such as a motherboard or a chip are avoided.
In this embodiment, the apparatus body 10 may be a middle frame, the middle frame may be provided with a groove 103, and the heat pipe 11 may be embedded in the groove 103, so as to connect the heat pipe 11 to the apparatus body 10. In practical applications, a circuit board 14 and a rear cover 15 may be further disposed in the device body 10, wherein the circuit board 14 may be used for fixing the heat generating element 13, and the rear cover 15 may be connected to a non-display side of the electronic device for protecting the electronic device.
In an optional embodiment of the present application, the electronic device may further include: a flexible middle frame connected with the apparatus body 10; wherein a first flexible pressing area 101 and a second flexible pressing area 102 are arranged on the flexible middle frame. In this way, by pressing the first flexible pressing region 101 and the second flexible pressing region 102 on the flexible middle frame, the flow of the cooling medium in the heat pipe 11 can be accelerated, and the heat dissipation efficiency of the heat pipe 11 can be improved.
For example, the first flexible pressing region 101 and the second flexible pressing region 102 may be disposed on the upper and lower sides or the left and right sides of the flexible middle frame, and the specific positions of the first flexible pressing region 101 and the second flexible pressing region 102 on the flexible middle frame may not be limited in the embodiments of the present application.
In another optional embodiment of the present application, the electronic device may further include: a flexible rear cover connected to the apparatus body 10; wherein a first flexible pressing area 101, a second flexible pressing area 102 are arranged on the flexible back cover. In this way, by pressing the first flexible pressing region 101 and the second flexible pressing region 102 on the flexible middle frame, the flow of the cooling medium in the heat pipe 11 can be accelerated, and the heat dissipation efficiency of the heat pipe 11 can be improved.
For example, the first flexible pressing region 101 and the second flexible pressing region 102 may be disposed in a central region or an edge region of the flexible rear cover, and the specific positions of the first flexible pressing region 101 and the second flexible pressing region 102 on the flexible rear cover may not be limited in the embodiments of the present application.
In summary, the electronic device according to the embodiment of the present application may include at least the following advantages:
in the embodiment of the application, the flexible display screen comprises a first flexible pressing area and a second flexible pressing area, a first pressing piece is arranged at the evaporation end of the heat pipe and connected with the flexible display screen of the first flexible pressing area, and a second pressing piece is arranged at the condensation end of the heat pipe and connected with the flexible display screen of the second flexible pressing area. Under the condition that the first flexible pressing area is pressed, the first flexible pressing area can deform to drive the first pressing piece to press the cooling medium at the evaporation end, so that the cooling medium flows from the evaporation end to the condensation end; when the second flexible pressing area is pressed, the second flexible pressing area can deform to drive the second pressing piece to press the cooling medium at the condensation end, so that the cooling medium flows from the condensation end to the evaporation end. Therefore, under the condition that the first flexible pressing area and the second flexible pressing area are pressed, the flow of a cooling medium in the heat pipe is accelerated, and the heat dissipation efficiency of the heat pipe is improved, so that the heat dissipation performance of the electronic equipment is improved, and the use experience of a user is improved.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. An electronic device, comprising: the device comprises a device body, a flexible display screen and a heat pipe;
the flexible display screen is arranged on the equipment body and comprises a first flexible pressing area and a second flexible pressing area;
the heat pipe is arranged in the equipment body, a cooling medium is arranged in the heat pipe, and the two ends of the heat pipe are respectively an evaporation end and a condensation end; the evaporation end is provided with a first pressing piece, the first pressing piece is connected with the flexible display screen of the first flexible pressing area, the condensation end is provided with a second pressing piece, and the second pressing piece is connected with the flexible display screen of the second flexible pressing area;
wherein the cooling medium flows from the evaporation end to the condensation end with the first flexible pressing zone pressed; the cooling medium flows from the condensation end to the evaporation end in a case where the second flexible pressing region is pressed.
2. The electronic device according to claim 1, wherein the first pressing member and the second pressing member are in contact with the flexible display screen, and a predetermined amount of preload is provided between the first pressing member and the flexible display screen.
3. The electronic device according to claim 2, wherein at least a portion of the first pressing member and the second pressing member is embedded in the flexible display screen, so that a preset pre-pressing amount exists among the first pressing member, the second pressing member and the flexible display screen.
4. The electronic device of claim 1, wherein the evaporation end is provided with a first opening, and the condensation end is provided with a second opening;
the first pressing piece is movably connected to the first opening and can seal the first opening;
the second pressing piece is movably connected to the second opening and can seal the second opening.
5. The electronic device of claim 4, wherein the heat pipe further comprises: a first silica gel sheet and a second silica gel sheet; wherein the content of the first and second substances,
the first silicone sheet is connected between the first pressing piece and the first opening, so that the first pressing piece is movably connected to the first opening and can seal the first opening;
the second silica gel piece is connected the second pressing piece with between the second opening, so that the second pressing piece swing joint in the second opening and can seal the second opening.
6. The electronic apparatus according to claim 4, wherein an outer diameter of the first pressing piece is smaller than an inner diameter of the first opening, and an outer diameter of the second pressing piece is smaller than an inner diameter of the second opening;
wherein at least a portion of the first pressing piece is movable into the first opening when the first flexible pressing region is pressed, and at least a portion of the second pressing piece is movable into the second opening when the second flexible pressing region is pressed.
7. The electronic device according to claim 5, wherein the first pressing member and the second pressing member are copper sheets.
8. The electronic apparatus according to claim 1, wherein the first pressing member and the second pressing member are flexible pressing members.
9. The electronic device of claim 1, further comprising: the heating part is arranged in the equipment body and is arranged on one side, away from the first flexible pressing area, of the heat pipe;
the heating element is connected with the evaporation end of the heat pipe.
10. The electronic apparatus according to claim 9, wherein the heat generating member includes: at least one of a heat-generating chip and a radio frequency module.
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| CN202110444553.6A CN113141760B (en) | 2021-04-23 | 2021-04-23 | Electronic device |
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| CN202110444553.6A CN113141760B (en) | 2021-04-23 | 2021-04-23 | Electronic device |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080123263A1 (en) * | 2006-11-28 | 2008-05-29 | Kabushiki Kaisha Toshiba | Electronic Device |
| JP2010072904A (en) * | 2008-09-18 | 2010-04-02 | Toshiba Corp | Electronic equipment and heat transport member |
| CN104133606A (en) * | 2014-07-24 | 2014-11-05 | 联胜（中国）科技有限公司 | Touch screen with force feedback system |
| CN104898798A (en) * | 2014-03-04 | 2015-09-09 | 宏碁股份有限公司 | Electronic device and heat dissipation method |
| CN105451503A (en) * | 2014-07-21 | 2016-03-30 | 联想(北京)有限公司 | Electronic equipment |
| CN111465283A (en) * | 2020-04-29 | 2020-07-28 | 深圳市海洋王照明工程有限公司 | Display structure, intelligent lighting operation terminal and electronic equipment |
| CN111669938A (en) * | 2020-05-22 | 2020-09-15 | 广州大学 | Flexible heat pipe and processing method thereof |
| CN112533447A (en) * | 2020-11-27 | 2021-03-19 | 维沃移动通信有限公司 | Heat dissipation method and device and electronic equipment |
-
2021
- 2021-04-23 CN CN202110444553.6A patent/CN113141760B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080123263A1 (en) * | 2006-11-28 | 2008-05-29 | Kabushiki Kaisha Toshiba | Electronic Device |
| JP2010072904A (en) * | 2008-09-18 | 2010-04-02 | Toshiba Corp | Electronic equipment and heat transport member |
| CN104898798A (en) * | 2014-03-04 | 2015-09-09 | 宏碁股份有限公司 | Electronic device and heat dissipation method |
| CN105451503A (en) * | 2014-07-21 | 2016-03-30 | 联想(北京)有限公司 | Electronic equipment |
| CN104133606A (en) * | 2014-07-24 | 2014-11-05 | 联胜（中国）科技有限公司 | Touch screen with force feedback system |
| CN111465283A (en) * | 2020-04-29 | 2020-07-28 | 深圳市海洋王照明工程有限公司 | Display structure, intelligent lighting operation terminal and electronic equipment |
| CN111669938A (en) * | 2020-05-22 | 2020-09-15 | 广州大学 | Flexible heat pipe and processing method thereof |
| CN112533447A (en) * | 2020-11-27 | 2021-03-19 | 维沃移动通信有限公司 | Heat dissipation method and device and electronic equipment |
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