CN113141746A

CN113141746A - Electronic equipment

Info

Publication number: CN113141746A
Application number: CN202110343106.1A
Authority: CN
Inventors: 李金玉; 张强; 王铮
Original assignee: Lenovo Beijing Ltd
Current assignee: Lenovo Beijing Ltd
Priority date: 2021-03-30
Filing date: 2021-03-30
Publication date: 2021-07-20
Anticipated expiration: 2041-03-30
Also published as: CN113141746B

Abstract

The embodiment of the application discloses electronic equipment, electronic equipment includes: a first body having a first accommodation chamber and a first plate portion; the first plate portion has an opening communicating with the first accommodation chamber; the first functional piece is arranged in the first accommodating cavity, a gap is formed between the first functional piece and the first plate part, and at least part of the first functional piece corresponds to the position of the opening; the opening is used for preventing heat of the first functional part from being transmitted to the first plate part at the opening.

Description

Electronic equipment

Technical Field

The present application relates to an electronic device.

Background

Electronic devices are devices that people often use. However, the temperature of the electronic device is high at present, and the adaptability of the electronic device is poor.

Disclosure of Invention

In view of this, embodiments of the present disclosure provide an electronic device to solve the problem of high temperature of the electronic device.

In order to achieve the above purpose, the technical solution of the embodiment of the present application is implemented as follows:

an embodiment of the present application provides an electronic device, including:

a first body having a first accommodation chamber and a first plate portion; the first plate portion has an opening communicating with the first accommodation chamber;

the first functional piece is arranged in the first accommodating cavity, a gap is formed between the first functional piece and the first plate part, and at least part of the first functional piece corresponds to the position of the opening;

the opening is used for preventing heat of the first functional part from being transmitted to the first plate part at the opening.

In some optional implementations, the electronic device further includes:

the supporting piece is connected with the first plate part, is positioned at the opening, is used for supporting the first plate part and is provided with a flow channel; the opening is communicated with the first accommodating cavity through the flow passage;

gas of the external environment can enter the first accommodating cavity from the opening and the flow passage;

wherein the thermal conductivity of the support member is smaller than that of the first plate portion.

In some alternative implementations, the support has a slot that matches the shape of the opening, the slot corresponding to the position of the opening; ambient gas can flow from the opening into the slot, the slot forming at least part of the flow passage.

In some optional implementations, the slot is a through slot, the supporting member is in a ring-shaped structure, the slot is formed in the middle of the supporting member, and the edge of the supporting member is attached to the inner side of the first plate portion;

the side, away from the first plate, of the edge of the support member is provided with an opening, the opening is communicated with the slot, the opening and the slot form the flow channel, and gas in the external environment can enter the first accommodating cavity from the slot and the opening and flow through at least part of the surface of the first functional element.

In some optional implementations, the electronic device further includes:

and the filtering piece is covered at the open pore and is used for filtering impurities and/or liquid in the gas passing through the open pore and the open pore.

In some alternative implementations, the support member is spaced apart from the first functional member; or the like, or, alternatively,

the supporting member is rectangular, and a corner of the supporting member is in contact with the first functional member to support the first plate portion.

In some optional implementations, the electronic device further includes:

the second body is rotatably connected with the first body, and the first part of the connecting end of the second body is positioned at the opening;

the first body further includes:

the second plate part is positioned outside the first accommodating cavity, is arranged at an interval with the first plate part, forms a second accommodating cavity with the first plate part, and forms a gap with the first plate part at the opening;

gas of the external environment can enter the second accommodating cavity from the gap;

the second functional piece is arranged in the second accommodating cavity;

and the connecting wire is electrically connected with the display device in the second body and passes through the opening to be electrically connected with the second functional part.

In some alternative implementations of the method of the present invention,

when the second body rotates to a closed state relative to the first body, the first surface of the second body is in contact with the outer surface of the first plate part; the second surface of the second body and the outer surface of the second plate portion satisfy a coplanar condition;

wherein the second surface of the second body and the first surface of the second body are oppositely disposed.

In some optional implementation manners, the first functional component is a main board, the second functional component is a driving board, and the second functional component is used for driving the display device to display.

In some optional implementations, the electronic device further includes:

the driving piece is arranged in the first accommodating cavity and used for driving the gas of the external environment to enter the first accommodating cavity from the opening.

The electronic equipment that this application embodiment provided includes: a first body having a first accommodation chamber and a first plate portion; the first plate portion has an opening communicating with the first accommodation chamber; the first functional piece is arranged in the first accommodating cavity, a gap is formed between the first functional piece and the first plate part, and at least part of the first functional piece corresponds to the position of the opening; the opening is used for preventing heat of the first functional part from being transmitted to the first plate part at the opening; through set up the opening at first board, promptly, remove the part that first board is located the opening part, can prevent the heat of first function spare is in the opening part transmits to first board, eliminated first function spare and made the problem that first board temperature rose at the opening part, reduced electronic equipment's temperature, improved electronic equipment's adaptability.

Drawings

Fig. 1 is a cross-sectional view of an alternative structure of an electronic device provided in an embodiment of the present application;

FIG. 2 is a cross-sectional view of an alternative configuration of an electronic device provided in an embodiment of the present application;

FIG. 3 is a cross-sectional view of an alternative configuration of an electronic device according to an embodiment of the present disclosure;

fig. 4 is an alternative structural schematic diagram of a support member of an electronic device according to an embodiment of the present disclosure;

FIG. 5 is a cross-sectional view of an alternative embodiment of an electronic device according to the present disclosure;

FIG. 6 is a cross-sectional view of an alternative configuration of an electronic device according to an embodiment of the present disclosure;

fig. 7 is an alternative structural schematic diagram of an electronic device according to an embodiment of the present application.

Reference numerals: 101. a second air inlet; 102. a third air inlet; 103. a first air outlet; 110. a first body; 111. a first accommodating chamber; 112. a first plate portion; 113. an opening; 114. a second plate portion; 115. a second accommodating chamber; 116. a gap; 120. a first functional member; 130. a support member; 131. grooving; 132. opening a hole; 140. a connecting wire; 210. a second body.

Detailed Description

Various combinations of the specific features in the embodiments described in the detailed description may be made without contradiction, for example, different embodiments may be formed by different combinations of the specific features, and in order to avoid unnecessary repetition, various possible combinations of the specific features in the present application will not be described separately.

In the description of the embodiments of the present application, it should be noted that, unless otherwise specified and limited, the term "connected" should be interpreted broadly, for example, as an electrical connection, a communication between two elements, a direct connection, or an indirect connection via an intermediate, and the specific meaning of the terms may be understood by those skilled in the art according to specific situations.

It should be noted that the terms "first \ second \ third" referred to in the embodiments of the present application are only used for distinguishing similar objects, and do not represent a specific ordering for the objects, and it should be understood that "first \ second \ third" may exchange a specific order or sequence order if allowed. It should be understood that "first \ second \ third" distinct objects may be interchanged under appropriate circumstances such that the embodiments of the application described herein may be implemented in an order other than those illustrated or described herein.

As shown in fig. 1, the electronic device may include: a first body 110 and a first function 120. The first body 110 has a first accommodation cavity 111 and a first plate portion 112; the first plate portion 112 has an opening 113 communicating with the first accommodation chamber 111; the first functional component 120 is disposed in the first accommodating cavity 111, a gap is formed between the first functional component 120 and the first plate portion 112, and at least a part of the first functional component 120 corresponds to the position of the opening 113; the opening 113 is used for preventing heat of the first functional part 120 from being transferred to the first plate part 112 at the opening 113; by providing the opening 113 in the first plate portion 112, that is, by removing the portion of the first plate portion 112 located at the opening 113, the heat of the first functional component 120 can be prevented from being transferred to the first plate portion 112 at the opening 113, the problem that the first functional component 120 raises the temperature of the first plate portion 112 at the opening 113 is eliminated, the temperature of the electronic device is reduced, and the adaptability of the electronic device is improved.

In the embodiments of the present application, the structure of the electronic device is not limited. For example, the electronic device may be a mobile phone or a computer.

In the embodiment of the present application, the structure of the first body 110 is not limited. For example, the first body 110 may have a rectangular parallelepiped structure. As an example, the first body 110 may be a body of a mobile phone. As another example, the first body 110 may be a body in which a processor of a computer is located.

Here, the shape of the first receiving cavity 111 is not limited. For example, the first receiving cavity 111 may have a rectangular parallelepiped shape.

Here, the position where the first plate portion 112 is provided is not limited. For example, the first plate portion 112 may be a top plate of the first body 110, or may be a bottom plate of the first body 110.

Here, the cross-sectional shape of the opening 113 is not limited. For example, the cross-sectional shape of the opening 113 may be rectangular or may be square.

In the embodiment of the present application, the structure of the first functional element 120 is not limited. For example, the first functional element 120 may be a block structure. For another example, the first functional element 120 may have a plate-like structure. As an example, the first functional element 120 is a motherboard.

In the embodiment of the present application, the opening 113 is used to prevent the heat of the first functional element 120 from being transferred to the first plate portion 112 at the opening 113, and by providing the opening 113 in the first plate portion 112, that is, removing the portion of the first plate portion 112 at the opening 113, the heat of the first functional element 120 can be prevented from being transferred to the first plate portion 112 at the opening 113; meanwhile, the gas of the external environment can enter the first accommodating cavity 111 from the opening 113 to cool the first functional part 120, so that the temperature of the first functional part 120 can be further reduced, the temperature of the electronic device is reduced in a direction-changing manner, and the adaptability of the electronic device is improved.

In some optional implementations of embodiments of the present application, the electronic device may further include: a support 130. The supporting member 130 is connected to the first plate portion 112, the supporting member 130 is located at the opening 113, the supporting member 130 is used for supporting the first plate portion 112, and the supporting member 130 has a flow passage; the opening 113 is communicated with the first accommodating cavity 111 through the flow passage; gas in the external environment can enter the first accommodating cavity 111 from the opening 113 and the flow channel; so that the first functional member 120 and the supporting member 130 are cooled by the gas of the external environment through the opening 113 and the flow passage, and the first functional member 120 is prevented from heating the first plate portion 112 by the supporting member 130.

In the present implementation, the structure of the support 130 is not limited as long as the support 130 has a flow passage through which the opening 113 communicates with the first receiving chamber 111. For example, the supporting member 130 may have a plate-like structure or a block-like structure.

Here, the material of the support 130 is not limited. For example, the material of the support member 130 may be the same as or different from the material of the first plate portion 112.

As an example, the thermal conductivity of the support member 130 is smaller than that of the first plate portion 112; so that both the strength of the first plate portion 112 at the opening 113 can be improved by the support member 130 having low thermal conductivity and more heat of the first functional member 120 can be prevented from being transferred to the first plate portion 112 through the support member 130. In order to improve the supporting strength of the supporting member 130, the supporting member 130 has a certain strength. For example, the material of the support 130 may be hard rubber.

Here, the implementation manner of the support 130 connected to the first plate portion 112 is not limited. For example, the supporting member 130 and the first plate portion 112 may be connected by adhesive glue. Of course, the first plate portion 112 may also be provided with a slot, and the supporting member 130 may be clamped in the slot.

Here, the positional relationship between the support member 130 and the first functional member 120 is not limited. For example, as shown in fig. 2, the supporting member 130 is spaced apart from the first functional member 120. For another example, the corner of the supporting member 130 contacts the first functional member 120 to support the first plate 112, so that the first functional member 120 can support the first plate 112 via the supporting member 130, thereby enhancing the strength of the first plate 112 at the opening 113; here, the support 130 may have a rectangular shape.

Here, the shape of the flow path is not limited. For example, the flow channel may have a rectangular parallelepiped shape or a cylindrical shape.

For example, as shown in fig. 2, the supporting member 130 may have a slot 131, the slot 131 matches with the shape of the opening 113, and the slot 131 corresponds to the position of the opening 113; ambient gas can flow from the opening 113 into the slot 131, where the ambient gas can cool the first functional element 120 and the support 130; here, the slot 131 forms at least a part of the flow passage.

In example one, the shape of the slot 131 is not limited. For example, the slot 131 may have a rectangular parallelepiped shape.

In an example one, the slot 131 may be a through slot or a blind slot. It should be noted that when the slot 131 is a through slot, the flow channel may only include a through slot; when the open groove 131 is a blind groove, the open groove 131 is a part of the flow passage, and the flow passage further includes another part communicating the open groove 131 and the first receiving chamber 111.

In an example one, the shape of the slot 131 and the opening 113 are matched, and the shape of the slot 131 and the shape of the opening 113 are the same or substantially the same.

As an example, the supporting member 130 may have a ring-shaped structure, the middle of the supporting member 130 forms the slot 131, and the edge of the supporting member 130 is attached to the inner side of the first plate portion 112; the side of the supporting member 130 away from the first plate 112 has an opening 132, the opening 132 is communicated with the slot 131, the opening 132 and the slot 131 form the flow passage, and the gas of the external environment can enter the first accommodating cavity 111 from the slot 131 and the opening 132 and flow through at least part of the surface of the first functional member 120; so as to change the position of the gas of the external environment entering the first containing cavity 111 and contacting the first functional element 120 through the guiding function of the opening 132.

Here, the open groove 131 may be a through groove or a blind groove. As an example, as shown in fig. 3 and 4, the slot 131 may be a through slot, so that the air in the external environment can enter the first accommodating cavity 111 from the through slot and enter the first accommodating cavity 111 from the opening 132, the area of the contact between the air in the external environment and the first accommodating cavity 111 is greatly increased, the area of the first functional element 120 and the support element 130 cooled by the air in the external environment is increased, and the heat dissipation capability of the electronic device is improved. It should be noted that, in the case where the supporting member 130 is in contact with the first functional member 120, the gas of the external environment is in contact with the first functional member 120 and the supporting member 130 through the slots 131 and the openings 132; in the case that the first gap is formed between the supporting member 130 and the first functional member 120, the gas of the external environment contacts the first functional member 120 and the supporting member 130 through the first slot 131, the opening 132 and the first gap.

Here, the electronic device may further include: a filter member covering the slots 131 and the openings 132, the filter member being used for filtering impurities and/or liquid in the gas passing through the slots 131 and the openings 132 so as to prevent the impurities and/or liquid from the external environment from entering the first accommodating chamber 111.

The structure of the filter member is not limited as long as the gas can pass through the filter member and the foreign substances and/or the liquid cannot pass through the filter member.

In some optional implementations of embodiments of the present application, the electronic device may further include: a second body 210. The second body 210 is rotatably connected to the first body 110, and a first portion of a connection end of the second body 210 to the first body 110 is located at the opening 113.

In the present implementation, the structure of the second body 210 is not limited. For example, the second body 210 may have a plate-shaped structure. As an example, the first body 110 may be a body where a keyboard of a notebook computer is located, and the second body 210 may be a body where a display screen of the notebook computer is located.

Here, the position of the opening 113 is not limited. For example, as shown in fig. 7, the opening 113 is located at the middle of the first body 110, the opening 113 has a first length in the first direction, the first body 110 has a second length in the first direction, and the value of the first length is smaller than that of the second length. As an example, the value of the second length is 5 times the value of the first length; here, the first direction may be an axial direction in which the second body 210 rotates with respect to the first body 110.

Here, the connection end of the second body 210 to the first body 110 is located at the opening 113, so that the connection line 140 between the second body 210 and the first body 110 is received in the opening 113; if the first plate portion 112 is not provided with the opening 113, in order to provide a space for accommodating the connection wire 140, the plate body in the area of the opening 113 needs to be close to the first functional part 120, so that the distance between the first functional part 120 and the plate body in the area of the opening 113 is too small, and the temperature of the electronic device can be increased by the first functional part 120 through the plate body in the area of the opening 113, so that the temperature of the first plate portion 112 is high.

Here, during the rotation of the second body 210 relative to the first body 110, the first portion of the second body 210 can be located in the opening 113, so as to shield the connection line 140 by the first portion of the second body 210; the first portion of the second body is a portion where the connection end of the second body 210 and the first body 110 is located at the opening 113.

In this implementation, as shown in fig. 5 and 6, the first body 110 may further include: a second plate portion 114, a second functional member, and a connection wire 140. A second plate portion 114 is located outside the first accommodating cavity 111, the second plate portion 114 is arranged at a distance from the first plate portion 112, a second accommodating cavity 115 is formed between the second plate portion 114 and the first plate portion 112, and a gap 116 is formed between the second plate portion 114 and the first plate portion 112 at the opening 113; gas from the external environment can enter the second accommodating cavity 115 from the gap 116; a second functional element is arranged in the second accommodating cavity 115; the connecting wire 140 is electrically connected with the display device in the second body 210, and the connecting wire 140 passes through the opening 113 to be electrically connected with the second functional part; a portion of the connection line 140 is located within the opening 113; so as to accommodate the portion of the connection wire 140 through the opening 113, eliminating the problem of temperature rise of the electronic device caused by providing a space for the portion of the connection wire 140; meanwhile, the gas in the external environment can also dissipate heat for the second functional component in the second accommodating cavity 115 through the gap 116, so that the heat dissipation capability of the electronic device is greatly improved.

Here, the connection line 140 is electrically connected to the second functional element through the opening 113 without limitation. For example, the first plate portion 112 is provided with a wire passage port that communicates the first accommodation chamber 111 and the second accommodation chamber 115; the connection wire 140 is electrically connected to the second functional element through the opening 113 and the wire port.

Here, the second plate portion 114 and the second body 210 are located on the same side as the first plate portion 112, and the second plate portion 114 and the second body 210 are juxtaposed. As an example, as shown in fig. 6 and 7, in a state where the second body 210 is rotated to be closed with respect to the first body 110, a first surface of the second body 210 is in contact with an outer surface of the first plate portion 112; the second surface of the second body 210 and the outer surface of the second plate portion 114 satisfy a coplanar condition; wherein the second surface of the second body 210 and the first surface of the second body 210 are disposed opposite to each other, and the coplanar condition refers to being coplanar or substantially coplanar.

The structure of the second functional element is not limited. For example, the first functional element 120 may be a motherboard, and the second functional element may be a driving board, and the second functional element is used for driving the display device to display; the second functional member is disposed in the first body 110, so that a space for disposing the driving board in the second body 210 can be eliminated, and the second body 210 can be provided with a display device having a larger area.

In an application scenario, as shown in fig. 7, the electronic device is a notebook computer, the first body 110 is a body where a keyboard is located, and the second body 210 is a body where a display is located. The first function 120 is a motherboard and the second function is a driver board. The following table lists the detected temperatures and the design standard temperatures of the respective regions of the first body 110.

The first power consumption is that the electronic equipment works in low power consumption, and the second power consumption is that the electronic equipment works in high power consumption; as shown in fig. 7, the a region is a region where the first board section 112 is provided with a keyboard, the B region is a region where the first board section 112 is near the opening 113, and the C region is a board section provided opposite to the first board section 112; the D area is an area on two sides of the touch pad; the E area is a touchpad area.

As can be seen from the above table, the temperature of each region of the first body 110 can be lower than the standard temperature due to the opening 113, which meets the requirement.

In some optional implementations of the embodiments of the present application, the electronic device may further include: the driving piece, the driving piece set up in first hold the chamber 111, the driving piece is used for driving external environment's gas and follows opening 113 gets into in first holding chamber 111 to opening 113 can be as electronic equipment's first air intake, improves electronic equipment's heat-sinking capability.

In this implementation, the structure of the driving member is not limited. For example, the drive member may be a fan.

In this implementation manner, the electronic device may further include a second air inlet 101 and a first air outlet 103, where the second air inlet 101 is disposed on a first side of the first body 110, and the first air outlet 103 is disposed on a second side of the first body 110; wherein the second side of the first body 110 and the first side of the first body 110 are adjacently disposed.

As an example, the electronic device may be a notebook computer, and the first side of the first body 110 may be a side of the first body 110, or may be a bottom side of the first body 110. The second side of the first body 110 may be a back side of the first body 110.

As yet another example, an electronic device may include: a second air inlet 101, a third air inlet 102 and a first air outlet 103, wherein the second air inlet 101 is arranged at the bottom side of the first body 110, as shown in fig. 5 and 6; the third air inlet 102 is disposed at a side of the first body 110, as shown in fig. 7; the first air outlet 103 is disposed at a back side of the first body 110, as shown in fig. 7.

It should be noted that the second air inlet 101 and the third air inlet 102 may communicate with the first accommodating chamber 111; the first air outlet 103 may be respectively communicated with the first accommodating cavity 111 and the second accommodating cavity 115, and the first air outlet 103 may also be communicated with only the first accommodating cavity 111.

The electronic equipment that this application embodiment provided includes: a first body 110 having a first receiving cavity 111 and a first plate portion 112; the first plate portion 112 has an opening 113 communicating with the first accommodation chamber 111; a first functional member 120 disposed in the first accommodating cavity 111, forming a gap with the first plate portion 112, and at least partially corresponding to the position of the opening 113; the opening 113 is used for preventing heat of the first functional part 120 from being transferred to the first plate part 112 at the opening 113; by providing the opening 113 in the first plate portion 112, that is, by removing the portion of the first plate portion 112 located at the opening 113, the heat of the first functional component 120 can be prevented from being transferred to the first plate portion 112 at the opening 113, the problem that the first functional component 120 raises the temperature of the first plate portion 112 at the opening 113 is eliminated, the temperature of the electronic device is reduced, and the adaptability of the electronic device is improved.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An electronic device, comprising:

2. The electronic device of claim 1, further comprising:

3. The electronic device of claim 2, the support having a slot that matches a shape of the opening, the slot corresponding to a position of the opening; ambient gas can flow from the opening into the slot, the slot forming at least part of the flow passage.

4. The electronic device of claim 3, wherein the slot is a through slot, the supporting member is in a ring structure, the slot is formed in the middle of the supporting member, and the edge of the supporting member is attached to the inner side of the first plate portion;

5. The electronic device of claim 4, further comprising:

6. The electronic device of claim 2, the support member being spaced from the first functional member; or the like, or, alternatively,

7. The electronic device of claim 1, further comprising:

the first body further includes:

the second functional piece is arranged in the second accommodating cavity;

8. The electronic device of claim 7, wherein the electronic device,

9. The electronic device according to claim 7, wherein the first function is a main board, the second function is a driving board, and the second function is used for driving the display device to display.

10. The electronic device of any of claims 1-9, further comprising: