CN113130527A - Backlight plate, manufacturing method of backlight plate and steel mesh - Google Patents
Backlight plate, manufacturing method of backlight plate and steel mesh Download PDFInfo
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- CN113130527A CN113130527A CN201911417777.7A CN201911417777A CN113130527A CN 113130527 A CN113130527 A CN 113130527A CN 201911417777 A CN201911417777 A CN 201911417777A CN 113130527 A CN113130527 A CN 113130527A
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- conversion layer
- led
- led unit
- backlight
- steel mesh
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- 229910000831 Steel Inorganic materials 0.000 title claims abstract description 32
- 239000010959 steel Substances 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 31
- 238000006243 chemical reaction Methods 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000002096 quantum dot Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 239000000499 gel Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Planar Illumination Modules (AREA)
- Liquid Crystal (AREA)
Abstract
A method for manufacturing a backlight plate utilizes a low-cost LED chip as a luminous source of each pixel, and then utilizes a specially manufactured steel mesh to coat a filter material on a specific luminous source, so that light emitted by the luminous source passes through the filter material to obtain an RGB full-color pixel light source.
Description
Technical Field
The application belongs to the technical field of display screen manufacturing, and particularly relates to a backlight plate, a manufacturing method of the backlight plate and a steel mesh.
Background
Currently, on RGB MiniLED backlight or display screen products, three RGB chips are generally adopted as a group to serve as a pixel point of the backlight or display screen. However, the MiniLED red light chip has a low production yield and a high difficulty in mass production process, which leads to a red chip having a price much higher than that of the blue chip and the green chip, and generally, the former has a higher price than the latter, which greatly increases the cost of the RGB MiniLED backlight or display.
Disclosure of Invention
The application aims to provide a backlight plate, a manufacturing method of the backlight plate and a steel mesh, and aims to solve the problem that the overall cost of a product is high due to the fact that a red light chip is high in cost in the traditional backlight plate.
A first aspect of an embodiment of the present application provides a method for manufacturing a backlight plate, including:
the method comprises the following steps that a plurality of backlight units are arranged on a substrate at intervals, each backlight unit comprises a first LED unit and a second LED unit, the first LED unit comprises two LED chips, and the second LED unit comprises one LED chip;
printing a color conversion layer on the second LED unit by using a steel mesh, wherein a through hole matched with the second LED unit is formed in the area, facing the second LED unit, of the steel mesh;
and coating protective glue on each backlight unit for packaging to obtain the LED backlight board.
In one embodiment, the first LED unit includes a blue LED chip and a green LED chip, and the second LED unit is either the blue LED chip or the green LED chip.
In one embodiment, the color conversion layer is a red light conversion layer, and before printing the color conversion layer on the second LED unit using a steel mesh, the method further includes:
a red light conversion layer is prepared.
In one embodiment, preparing a red light conversion layer comprises:
uniformly mixing KSF red fluorescent powder and silica gel to obtain a mixture, wherein the mass ratio of the KSF red fluorescent powder to the silica gel is 20-40%;
and defoaming and stirring the mixture by adopting a vacuum centrifugal defoaming machine to prepare the red fluorescent glue mixed with the red KSF fluorescent powder.
In one embodiment, the color conversion layer is a quantum dot fluorescent glue.
In one embodiment, the cross section of the through hole is a rectangular structure, the depth of the through hole is 140-200 micrometers, the length of the through hole is 120-300 micrometers, and the width of the through hole is 100-200 micrometers.
In one embodiment, before printing the color conversion layer on the second LED unit using a steel mesh, the method further includes:
and manufacturing a steel mesh for printing the color conversion layer, wherein a groove matched with the first LED unit is formed in the area, facing one side of the substrate and facing the first LED unit, of the steel mesh along the direction far away from the substrate.
In one embodiment, the groove has a depth of 120-160 microns, a length of 250-320 microns, and a width of 250-320 microns.
In one embodiment, the LED chip is a MiniLED chip or a micro LED chip.
A second aspect of embodiments of the present application provides a steel mesh for preparing a color conversion layer as described above.
A third aspect of the embodiments of the present application provides a backlight panel, which is manufactured by the above-mentioned method for manufacturing a backlight panel.
The manufacturing method of the backlight plate can utilize the specially manufactured steel mesh printing color conversion layer to print required light rays emitted by the light emitting source on the specific light emitting source, so that the RGB full-color pixel light source is obtained, the process is simple, and due to the color conversion layer, the light emitting source can use a low-cost chip, so that the manufacturing cost of the whole backlight plate is low, and the cost of a product formed based on the backlight plate is also reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic process diagram illustrating a first embodiment of a substrate in a method for manufacturing a backlight panel according to an embodiment of the present disclosure;
fig. 2 is a schematic process diagram illustrating a second embodiment of a substrate in a method for manufacturing a backlight board according to an embodiment of the present disclosure;
fig. 3 is a schematic view of a process of manufacturing a steel mesh printing in the method for manufacturing a backlight panel according to an embodiment of the present application.
Fig. 4A is a schematic top view illustrating a process of manufacturing a steel mesh in the method for manufacturing a backlight panel according to an embodiment of the present disclosure;
fig. 4B is a schematic cross-sectional view illustrating a process of manufacturing a steel mesh in the method for manufacturing a backlight panel according to an embodiment of the present disclosure;
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
The manufacturing method of the backlight plate provided by the embodiment of the application comprises the following steps:
the method comprises the following steps: referring to fig. 1 and 2, a plurality of backlight units 200 are disposed at intervals on a substrate 100, each backlight unit 200 includes a first LED unit 210 and a second LED unit 202, the first LED unit 201 includes two LED chips, and the second LED unit 202 includes one LED chip;
specifically, the LED chips are formed by bonding (die bonding or bulk transfer), and after the conventional reflow soldering, the chips are soldered to the substrate 100 to form the backlight units 200. Optionally, referring to fig. 1, in an embodiment, the first LED unit 210 includes a blue LED chip B and a green LED chip G, and the second LED unit 202 is the blue LED chip B. Referring to fig. 2, the first LED unit 201 includes a blue LED chip B and a green LED chip G, and the second LED unit 202 is the green LED chip G. In other embodiments, the LED chip 200 may also be in the form of 3 blue chips 201, i.e., BBB.
Step two: referring to fig. 3, 4A and 4B, a color conversion layer 400 is printed on the second LED unit 202 by using a steel mesh 300, wherein, referring to fig. 4A and 4B, a through hole 302 matched with the second LED unit 202 is disposed in an area of the steel mesh 300 facing the second LED unit 202.
Step three: and coating a protective adhesive on each backlight unit 200 for packaging to obtain the LED backlight board.
The color conversion layer 400 is a red light conversion layer, so that the backlight plate with the RGB full-color pixel light source has a simple and reliable manufacturing method, and does not need to use a high-cost red light LED chip, thereby saving the cost. The LED chip is a MiniLED chip or a MicroLED chip.
In one embodiment, before step two, the method further comprises: the step of preparing the red light conversion layer 400 is to print the red light conversion layer on the second LED unit 202 using the steel mesh 300, so that each backlight unit 200 has the blue LED chip B and the green LED chip G, and the blue LED chip B or the green LED chip G on which the red light conversion layer is printed, that is, has RGB full color.
If the backlight unit 200 is in the BBB form, two color conversion layers 400 are required to cover the two blue LED chips respectively, so that the blue light passes through the filter material and then emits green light and red light respectively to form an RGB full-color light source. In this manner, the through holes 302 of the steel net 300 should be two for coating the two kinds of filter materials, respectively.
In one embodiment, the step of preparing the red light conversion layer comprises:
And 2, defoaming and stirring the mixture by adopting a vacuum centrifugal defoaming machine to prepare the red fluorescent glue mixed with the red KSF fluorescent powder.
In another embodiment, the color conversion layer is a quantum dot fluorescent glue.
In one embodiment, step two: referring to fig. 4A and 4B, before step two, the method further includes: a step of fabricating a steel net 300 for printing the color conversion layer 400. The steel mesh 200 is provided with a groove 301 adapted to the first LED unit along a direction away from the substrate 100 in a region facing one side of the substrate 100 and facing the first LED unit 210.
It can be understood that, in conjunction with fig. 3, when the steel mesh 300 prints the color conversion layer 400 onto the backlight unit 200, the grooves 301 are for covering the first LED units 201 not to be coated by the color conversion layer 400, and the through holes 302 are for coating the color conversion layer 400 onto the corresponding second LED units 202. The cross section of the through hole is of a rectangular structure, a circular structure or an oval structure.
In some embodiments, the depth of the grooves is 120-160 microns; the length and the width are consistent and are both 250-320 microns. In one embodiment, the grooves have a depth of 150 microns and a length and width of 300 microns.
In other embodiments, the length of the slot is the length of two LED chips plus the pitch of the two chips plus 20 microns or more, for example, if the length of the two chips is 80 microns and the pitch is 30 microns, the length of the slot is 80 × 2+30+20 — 210 microns; in addition, the width of the slot is 20 microns greater than the width of the LED chip, e.g., 60 microns for two chips, the slot width is 80 microns, and if the two chips are not of the same width, the calculation is large. The depth of the groove is more than 1.2 times of the height of the LED chip.
In some embodiments, the cross section of the through hole is a rectangular structure, the depth of the through hole is 140-200 microns, the length of the through hole is 120-300 microns, and the width of the through hole is 100-200 microns. In other embodiments, the length and width of the through hole is more than 20 micrometers than the length and width of the LED chip, and the depth of the through hole is more than 1.5 times the height of the LED chip. Example 1: the height and width of the LED chip is 80 × 60 × 100 micrometers, and the depth and length of the through hole is 100 × 80 × 150 micrometers. Example 2: the through hole 302 has a length of 300 microns and a width of 150 microns, and in this example, the LED chip has a length of 200 microns, a width of 100 microns, and a thickness of less than 150 microns.
The cross section of the through hole is of a circular structure, the depth of the through hole is 140-200 micrometers, and the diameter of the through hole is 100-300 micrometers. The cross section of each through hole is of an oval structure, the depth of each through hole is 140-200 micrometers, the major axis of each through hole is 120-300 micrometers, and the minor axis of each through hole is 100-200 micrometers.
Referring to fig. 4A and 4B, a second aspect of the embodiment of the present application provides that the color conversion layer steel mesh 300 is formed with openings 310 arranged in an array, and the arrangement of the openings 310 is the same as the arrangement of the backlight units in the backlight panel to be manufactured, such as a matrix arrangement.
The opening 310 includes a through hole 302 and a blind hole 301 located at one side of the through hole 302, the size of the through hole 302 corresponds to one LED chip 200, and the size of the blind hole 301 corresponds to the sizes of two LED chips 200. Generally, the inner diameter of the blind hole 301 is at least larger than the size of two LED chips 200, and the through hole 302 should be slightly larger than the size of one LED chip 200 so that the color filter material 400 is coated on the side of the LED chip 200. In one example, blind via 301 is a 300 by 300 micron square trench with a depth of 150 microns. The length and width of the via 302 is 250 microns by 150 microns.
A third aspect of the embodiments of the present application provides a backlight panel manufactured by the above-described method for manufacturing a backlight panel.
A fourth aspect of the embodiments of the present application provides a display screen including the above-described backlight panel.
According to the manufacturing method of the backlight plate, the blue light chip and the green light chip with low cost are used as the light emitting source of each pixel, the filter material is coated on the specific light emitting source through the specially manufactured steel mesh, so that the light emitted by the light emitting source passes through the filter material to obtain the red light, the RGB full-color pixel light source is obtained, the process is simple, the red light chip with high cost is not needed, the manufacturing cost of the whole backlight plate is low, and the cost of a product formed based on the backlight plate is also reduced.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (11)
1. A method for manufacturing a backlight plate is characterized by comprising the following steps:
the method comprises the following steps that a plurality of backlight units are arranged on a substrate at intervals, each backlight unit comprises a first LED unit and a second LED unit, the first LED unit comprises two LED chips, and the second LED unit comprises one LED chip;
printing a color conversion layer on the second LED unit by using a steel mesh, wherein a through hole matched with the second LED unit is formed in the area, facing the second LED unit, of the steel mesh;
and coating protective glue on each backlight unit for packaging to obtain the LED backlight board.
2. The method of claim 1, wherein the first LED unit comprises a blue LED chip and a green LED chip, and the second LED unit is either the blue LED chip or the green LED chip.
3. The method of claim 1, wherein the color conversion layer is a red light conversion layer, and wherein the printing the color conversion layer on the second LED unit using a steel mesh further comprises:
a red light conversion layer is prepared.
4. The method of claim 3, wherein the preparing the red light conversion layer comprises:
uniformly mixing KSF red fluorescent powder and silica gel to obtain a mixture, wherein the mass ratio of the KSF red fluorescent powder to the silica gel is 20-40%;
and defoaming and stirring the mixture by adopting a vacuum centrifugal defoaming machine to prepare the red fluorescent glue mixed with the red KSF fluorescent powder.
5. The method of claim 1, wherein the color conversion layer is a quantum dot phosphor gel.
6. The method of claim 1, wherein the cross section of the through hole is rectangular, the depth of the through hole is 140 to 200 microns, the length of the through hole is 120 to 300 microns, and the width of the through hole is 100 to 200 microns.
7. The method of manufacturing according to claim 1, wherein before printing the color conversion layer on the second LED unit using a steel mesh, further comprising:
and manufacturing a steel mesh for printing the color conversion layer, wherein a groove matched with the first LED unit is formed in the area, facing one side of the substrate and facing the first LED unit, of the steel mesh along the direction far away from the substrate.
8. The method of claim 7, wherein the grooves have a depth of 120 to 160 microns, a length of 250 to 320 microns, and a width of 250 to 320 microns.
9. The method of any one of claims 1 to 8, wherein the LED chip is a MiniLED chip or a MicroLED chip.
10. A steel mesh for producing a color conversion layer according to any one of claims 1 to 9.
11. A backlight which is produced by the method for producing a backlight according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911417777.7A CN113130527A (en) | 2019-12-31 | 2019-12-31 | Backlight plate, manufacturing method of backlight plate and steel mesh |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911417777.7A CN113130527A (en) | 2019-12-31 | 2019-12-31 | Backlight plate, manufacturing method of backlight plate and steel mesh |
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| Publication Number | Publication Date |
|---|---|
| CN113130527A true CN113130527A (en) | 2021-07-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911417777.7A Pending CN113130527A (en) | 2019-12-31 | 2019-12-31 | Backlight plate, manufacturing method of backlight plate and steel mesh |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001222904A (en) * | 2000-02-09 | 2001-08-17 | Seiko Epson Corp | Light source, lighting system, liquid-crystal display and electronic equipment |
| JP2011066229A (en) * | 2009-09-17 | 2011-03-31 | Toshiba Corp | White led light source, backlight unit, liquid crystal panel, and liquid crystal tv |
| CN102795005A (en) * | 2012-07-09 | 2012-11-28 | 厦门飞德利照明科技有限公司 | Fluorescent powder silk-screen printing technology of LED (light emitting diode) module |
| US20150062201A1 (en) * | 2013-08-27 | 2015-03-05 | Boe Technology Group Co., Ltd. | Display device |
| CN204885157U (en) * | 2015-08-18 | 2015-12-16 | 申小飞 | LED light source of can mixing colours |
-
2019
- 2019-12-31 CN CN201911417777.7A patent/CN113130527A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001222904A (en) * | 2000-02-09 | 2001-08-17 | Seiko Epson Corp | Light source, lighting system, liquid-crystal display and electronic equipment |
| JP2011066229A (en) * | 2009-09-17 | 2011-03-31 | Toshiba Corp | White led light source, backlight unit, liquid crystal panel, and liquid crystal tv |
| CN102795005A (en) * | 2012-07-09 | 2012-11-28 | 厦门飞德利照明科技有限公司 | Fluorescent powder silk-screen printing technology of LED (light emitting diode) module |
| US20150062201A1 (en) * | 2013-08-27 | 2015-03-05 | Boe Technology Group Co., Ltd. | Display device |
| CN204885157U (en) * | 2015-08-18 | 2015-12-16 | 申小飞 | LED light source of can mixing colours |
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Application publication date: 20210716 |