CN113130421A - QSFP28 optical module of COB encapsulation - Google Patents
QSFP28 optical module of COB encapsulation Download PDFInfo
- Publication number
- CN113130421A CN113130421A CN202110393604.7A CN202110393604A CN113130421A CN 113130421 A CN113130421 A CN 113130421A CN 202110393604 A CN202110393604 A CN 202110393604A CN 113130421 A CN113130421 A CN 113130421A
- Authority
- CN
- China
- Prior art keywords
- optical module
- cob
- groove
- fixedly connected
- storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 89
- 238000005538 encapsulation Methods 0.000 title claims abstract description 8
- 238000004806 packaging method and process Methods 0.000 claims abstract description 54
- 239000003292 glue Substances 0.000 claims abstract description 28
- 239000000853 adhesive Substances 0.000 claims abstract description 23
- 230000001070 adhesive effect Effects 0.000 claims abstract description 23
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000007767 bonding agent Substances 0.000 claims description 8
- 239000004411 aluminium Substances 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000000428 dust Substances 0.000 abstract description 7
- 239000013307 optical fiber Substances 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/041—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00
- H01L25/042—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00 the devices being arranged next to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention discloses a QSFP28 optical module packaged by a COB (chip on board), which comprises a storage stacking box, wherein a COB packaging device comprises an aluminum substrate, the top of the aluminum substrate is bonded with an insulating layer through an adhesive, the top of the insulating layer is bonded with a circuit layer through the adhesive, the top of the circuit layer is bonded with a bonding lead through the adhesive, and the top of the storage stacking box is bonded with a QSFP optical module chip through the adhesive. This QSFP28 optical module of COB encapsulation, through the setting of packaging glue and wall adhesive, make the built-in chip of QSFP28 optical module can carry out the COB encapsulation to QSFP optical module chip and circuit layer through packaging glue cooperation wall adhesive, and carry out effective soft protection to QSFP optical module chip and circuit layer, can prevent dust protection to QSFP optical module chip and circuit layer simultaneously, avoided QSFP28 optical module chip to receive outside or the collision of packaging hardware inner wall easily, cause the problem of the colliding with wearing and tearing of QSFP28 optical module chip.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a QSFP28 optical module packaged by a COB.
Background
The optical module is composed of an optoelectronic device, a functional circuit, an optical interface and the like, the optoelectronic device comprises a transmitting part and a receiving part, in a simple way, the optical module has the functions that a transmitting end converts an electric signal into an optical signal, and after the optical signal is transmitted through an optical fiber, a receiving end converts the optical signal into the electric signal, a QSFP28 optical module in the optical module can be a new-generation optical module and is favored by manufacturers due to the advantages of small size, high port density, low power consumption and the like, a QSFP28 optical module is also called a 100G optical module which is an important component in a 100G network and is mainly used in 100G Ethernet application, a QSFP28 optical module adopts an MTP interface, the transmission distance of the MTP interface is 70m when the MTP interface is used together with OM3 multimode optical fiber, the transmission distance of the MTP interface is 100m when the QSFP28SR4 optical module is used together with the OM4 multimode optical fiber and is suitable for, The QSFP28LR4 optical module is also called a 100GBASE-LR4QSFP28 optical module, and the IEEE sets the 100GBASE-LR4 standard for the 100GQSFP28 optical module for 100G long-distance transmission. The QSFP28LR4 optical module also adopts 4 optical fiber channels, and the difference is that the QSFP28LR4 optical module introduces WDM technology, and can multiplex different wavelengths of the 4 optical fiber channels onto one optical fiber for transmission, so the QSFP28LR4 optical module adopts a duplex LC interface, the transmission distance can reach 10km when used together with a single-mode optical fiber, a solution is provided for the requirement of continuously increasing the transmission distance of an ultra-large data center, and the built-in chip of the QSFP28 optical module needs to be packaged and stored after being produced.
After the built-in chip of the existing QSFP28 optical module is packaged, the QSFP28 optical module chip is easily collided by the outside or the inner wall of a packaging device, so that the QSFP28 optical module chip is collided and worn, and meanwhile, when the QSFP28 optical module chip is stored and stored, dust easily enters a circuit board of the QSFP28 optical module chip, so that the circuit of the QSFP28 optical module chip is influenced when being used.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a QSFP28 optical module packaged by a COB (chip on Board), which solves the problems that a built-in chip of the existing QSFP28 optical module is easily collided by the outside or the inner wall of a packaging device, and dust easily enters a chip circuit board of the QSFP28 optical module.
In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides a QSFP28 optical module of COB encapsulation, includes the storage stacking box, the positive fixedly connected with control panel of storage stacking box, the top of storage stacking box is rotated and is connected with the chamber door, the equal fixedly connected with case handle in both sides of storage stacking box, the handle groove has all been seted up to the both sides of storage stacking box, the top of storage stacking box and the below joint that is located the chamber door have COB packaging hardware, COB packaging hardware includes aluminium base board, the top of aluminium base board has the insulating layer through the bonding agent bonding, the top of insulating layer has the circuit layer through the bonding agent bonding, the top on circuit layer has the bonding lead through the bonding agent bonding, the top of storage stacking box has QSFP optical module chip through the bonding agent bonding, the top on circuit layer has the enclosure glue, the top on circuit layer has the encapsulation glue, aluminium base board bottom all around the fixedly connected with gag lever, the storage stacking box comprises a storage stacking box body, and is characterized in that a placing groove is formed in the top of the storage stacking box body, a limiting groove is formed in the top of the storage stacking box body, a top supporting plate is movably connected to the top of the storage stacking box body, a hydraulic cylinder is fixedly connected to the bottom of an inner cavity of the storage stacking box body, an output end of the hydraulic cylinder is fixedly connected with a hydraulic rod, a supporting bottom plate is movably connected to the inner cavity of the storage stacking box body, a telescopic rod is fixedly connected to the bottom of the supporting bottom plate, and a supporting column is.
Preferably, the outer surface of the box handle is matched with the inner surface of the handle groove, and two sides of the QSFP optical module chip are clamped with one sides of the two bonding leads opposite to each other.
Preferably, the outer surface of the packaging adhesive is bonded with the inner surface of the enclosure adhesive, and the bottom of the packaging adhesive is bonded with the bonding lead and the top of the QSFP optical module chip.
Preferably, the inner surface of the placing groove is matched with the outer surface of the aluminum substrate, and the limiting groove is communicated with the placing groove.
Preferably, the inner surface of the limiting groove is matched with the outer surface of the limiting rod, and the bottom of the supporting bottom plate is fixedly connected with the top end of the hydraulic rod.
Preferably, the bottom end of the telescopic rod is fixedly connected with the bottom of the inner cavity of the storage stacking box, and the top end of the supporting column is fixedly connected with the bottom of the top supporting plate.
Preferably, the inner wall of the limiting groove is fixedly connected with a small magnet, the top of the storage stacking box is provided with a groove in a penetrating mode, and the outer surface of the top supporting plate is matched with the inner surface of the groove.
Preferably, the placing groove is communicated with the groove, and stacking clamping grooves are formed in the periphery of the top of the box door.
Advantageous effects
The invention provides a QSFP28 optical module packaged by a COB. Compared with the prior art, the method has the following beneficial effects:
(1) the COB packaged QSFP28 optical module comprises an aluminum substrate, an insulating layer is bonded on the top of the aluminum substrate through an adhesive, a circuit layer is bonded on the top of the insulating layer through the adhesive, a bonding lead is bonded on the top of the circuit layer through the adhesive, a QSFP optical module chip is bonded on the top of a storage stacking box through the adhesive, a wall glue is bonded on the top of the circuit layer, a packaging glue is bonded on the top of the circuit layer, the outer surface of the packaging glue is bonded with the inner surface of the wall glue, the bottom of the packaging glue is bonded with the bonding lead and the top of the QSFP optical module chip, the built-in chip of the QSFP28 optical module can be used for COB packaging the QSFP optical module chip and the circuit layer through the packaging glue matched with the wall glue and effectively soft protecting the QSFP optical module chip and the circuit layer, meanwhile, the QSFP optical module chip and the circuit layer can be protected against dust, the problem that the QSFP28 optical module chip is damaged due to the fact that the QSFP28 optical module chip is easily collided by the outside or the inner wall of a packaging device is solved, and the problem that when the QSFP28 optical module chip is stored and stored, dust easily enters a circuit board of the QSFP28 optical module chip and the circuit of the QSFP28 optical module chip is influenced when in use is solved.
(2) The COB packaged QSFP28 optical module is characterized in that limiting rods are fixedly connected with the periphery of the bottom of an aluminum substrate, a storage stacking box is arranged at the top of the storage stacking box, a limiting groove is arranged at the top of the storage stacking box, the inner surface of the storage stacking box is matched with the outer surface of the aluminum substrate, the limiting groove is communicated with the storage groove, a top supporting plate is movably connected with the top of the storage stacking box, a hydraulic cylinder is fixedly connected with the bottom of an inner cavity of the storage stacking box, the output end of the hydraulic cylinder is fixedly connected with a hydraulic rod, a supporting bottom plate is movably connected with the inner cavity of the storage stacking box, a telescopic rod is fixedly connected with the bottom of the supporting bottom plate, a supporting column is fixedly connected with the top of the supporting bottom plate, a small magnet is fixedly connected with the inner wall of the limiting groove, and the COB packaging device can be effectively stored by matching the limiting groove with the limiting grooves, small-size magnet carries out magnetic force to the gag lever post and absorbs, through the setting of pneumatic cylinder and top layer board for when user of service needs take out COB packaging hardware, can hold in the palm COB packaging hardware out through pneumatic cylinder cooperation hydraulic stem and top layer board, make things convenient for user of service to take COB packaging hardware, very big improvement the use convenience of storage stacking box.
(3) This QSFP28 optical module of COB encapsulation, top through piling up the case at the storage is rotated and is connected with the chamber door, the equal fixedly connected with case handle in both sides of storage piling up case, the handle groove has all been seted up to the both sides of storage piling up case, all seted up around the chamber door top and piled up the draw-in groove, the surface of case handle and the internal surface looks adaptation in handle groove, the top of storage piling up case and the below joint that is located the chamber door have COB packaging hardware, through the setting in case handle and handle groove, make storage piling up case when carrying out the storage of whole set, can transversely pile up the joint through case handle and handle groove, the column foot vertically piles up the joint with piling up the draw-in groove, orderliness when having improved storage piling up case arrangement greatly, the clean and tidy nature after the arrangement of storage piling up case has been improved simultaneously.
Drawings
FIG. 1 is a perspective view of the external structure of the present invention;
FIG. 2 is a top plan view of the storage stacking box structure of the present invention;
fig. 3 is a longitudinal sectional view illustrating the construction of the COB packing apparatus of the present invention;
FIG. 4 is an exploded view of a portion of the structure of the present invention;
FIG. 5 is a front view of the internal structure of the storage stacking box of the present invention;
fig. 6 is an enlarged view of a in fig. 5 of the present invention.
FIG. 1, a stacking box is stored; 2. a control panel; 3. a box door; 4. a case handle; 5. a handle slot; 6. a COB packaging device; 7. an aluminum substrate; 8. an insulating layer; 9. a circuit layer; 10. bonding a lead; 11. QSFP28 optical module chip; 12. wall glue; 13. packaging glue; 14. a limiting rod; 15. a placement groove; 16. a limiting groove; 17. a top pallet; 18. a hydraulic cylinder; 19. a hydraulic lever; 20. a telescopic rod; 21. a support base plate; 22. a support pillar; 23. a small magnet; 24. stacking the card slots.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: a QSFP28 optical module packaged by a COB comprises a storage stacking box 1, wherein a control panel 2 is fixedly connected to the front of the storage stacking box 1, a box door 3 is rotatably connected to the top of the storage stacking box 1, box handles 4 are fixedly connected to both sides of the storage stacking box 1, handle grooves 5 are formed in both sides of the storage stacking box 1, the storage stacking box 1 is transversely stacked and clamped through the box handles 4 and the handle grooves 5, a COB packaging device 6 is clamped and connected to the top of the storage stacking box 1 and below the box door 3, the COB packaging device 6 comprises an aluminum substrate 7, an insulating layer 8 is bonded to the top of the aluminum substrate 7 through an adhesive, a circuit layer 9 is bonded to the top of the insulating layer 8 through the adhesive, a bonding lead 10 is bonded to the top of the circuit layer 9 through the adhesive, an FP28 optical module chip 11 is bonded to the top of the storage stacking box 1 through the adhesive, a fence glue 12 is bonded to the top of the circuit layer 9, the packaging glue 12 is used for packaging and limiting the packaging glue 13, the packaging glue 13 is bonded on the top of the circuit layer 9, the packaging glue 13 can be used for carrying out dustproof protection on the QSFP optical module chip and the circuit layer 9, the QSFP28 optical module chip 11 is prevented from being easily collided by the outside or the inner wall of a packaging device to cause collision and abrasion of the QSFP28 optical module chip 11, the QSFP28 optical module chip 11 is matched with the packaging glue 13 to carry out COB packaging on the QSFP optical module chip and the circuit layer 9 through the packaging glue 12 and effectively carry out soft protection on the QSFP optical module chip and the circuit layer 9, meanwhile, the QSFP optical module chip and the circuit layer 9 can be protected from dust, the problem that dust easily enters a circuit board of the QSFP28 optical module chip 11 when the QSFP28 optical module chip 11 is stored and causes the circuit of the QSFP28 optical module chip 11 to be influenced when in use is solved, the periphery of the bottom of the aluminum substrate 7 is fixedly connected, the limiting rod 14 is made of metal, the top of the storage stacking box 1 is provided with a placing groove 15, the placing groove 15 is matched with the limiting groove 16 and the limiting rod 14 to effectively store the COB packaging device 6, the top of the storage stacking box 1 is provided with the limiting groove 16, the top of the storage stacking box 1 is movably connected with a top supporting plate 17, the bottom of the inner cavity of the storage stacking box 1 is fixedly connected with a hydraulic cylinder 18, the hydraulic cylinder 18 is electrically connected with an external power supply, the hydraulic cylinder 18 is controlled by an external PLC (programmable logic controller) programming program, the hydraulic cylinder 18 stops working after rising to a specified height and keeps a stretching state, when a user needs to take out the COB packaging device 6, the COB packaging device 6 can be lifted out through the hydraulic cylinder 18 matched with a hydraulic rod 19 and the top supporting plate 17, the user can take out the COB packaging device 6 conveniently, the use and storage convenience of the storage stacking box 1 are greatly improved, the output end, the inner cavity of the storage stacking box 1 is movably connected with a supporting bottom plate 21, the top of the supporting bottom plate 21 is fixedly connected with a rubber pad, the bottom of the supporting bottom plate 21 is fixedly connected with an expansion link 20, the top of the supporting bottom plate 21 is fixedly connected with a supporting column 22, the outer surface of a box handle 4 is matched with the inner surface of a handle groove 5, two sides of a QSFP28 optical module chip 11 are respectively clamped with one side opposite to two bonding leads 10, the outer surface of a packaging glue 13 is bonded with the inner surface of a wall glue 12, the bottom of the packaging glue 13 is bonded with the bonding leads 10 and the top of a QSFP28 optical module chip 11, the inner surface of a placing groove 15 is matched with the outer surface of an aluminum substrate 7, a limiting groove 16 is communicated with the placing groove 15, the inner surface of the limiting groove 16 is matched with the outer surface of a limiting rod 14, the bottom of the supporting bottom of the bottom plate 21 is fixedly connected, the top of support column 22 and the bottom fixed connection of top layer board 17, the small-size magnet 23 of inner wall fixedly connected with of spacing groove 16, small-size magnet 23 carries out magnetic force absorption to gag lever post 14, the top of storage pile box 1 is run through and is seted up flutedly, the surface of top layer board 17 and the internal surface looks adaptation of recess, communicate between standing groove 15 and the recess, 3 tops of chamber door have all been seted up all around and have been piled up draw-in groove 24, the column foot cooperation is piled up draw-in groove 24 and is vertically piled up the joint to storage pile box 1, the orderliness when having improved storage pile box 1 arrangement greatly, the neatness after storage pile box 1 arrangement has been improved simultaneously.
And those not described in detail in this specification are well within the skill of those in the art.
When the COB packaging device works, a user takes out an aluminum substrate 7, bonds an insulating layer 8 on the aluminum substrate 7 through an adhesive, bonds a circuit layer 9 on the insulating layer 8 through the adhesive, bonds bonding leads 10 on the circuit layer 9, bonds a QSFP28 optical module chip 11 between the two bonding leads 10, coats the adhesive at the bottom of the QSFP28 optical module chip 11 to be bonded with the circuit layer 9, bonds a wall glue 12 on the edge of the top of the circuit layer 9, bonds a packaging glue 13 between the wall glues 12 to package the circuit layer 9, the bonding leads 10 and the QSFP28 optical module chip 11, and then completes the manufacturing of the COB packaging device 6, the user starts a hydraulic cylinder 18 through a control panel 2, the hydraulic cylinder 18 starts to drive a hydraulic rod 19 to shrink, the hydraulic rod 19 shrinks to drive a supporting bottom plate 21 to descend, and a telescopic rod 20 performs auxiliary supporting on the supporting bottom plate 21, the support bottom plate 21 extends to drive the support column 22 and the top support plate 17 to descend, a user can easily take out the COB packaging device 6, then the COB packaging device 6 is clamped in the placing groove 15 through the limit rod 14 in a matching mode with the limit groove 16, the small magnet 23 performs magnetic attraction on the limit rod 14, after the user finishes placing, the storage stacking box 1 is closed through the box door 3, the user can longitudinally stack through the column foot matching stacking clamping groove 24 and transversely stack through the box handle 4 matching with the handle groove 5, when the user needs to take out the COB packaging device 6, the user starts the hydraulic cylinder 18 through the control panel 2, the hydraulic cylinder 18 starts to drive the hydraulic rod 19 to extend, the hydraulic rod 19 extends to drive the support bottom plate 21 to ascend, the telescopic rod 20 performs auxiliary support on the support bottom plate 21, the support bottom plate 21 extends to drive the support column 22 and the top support plate 17 to ascend, the top supporting plate 17 supports the aluminum substrate 7, the COB packaging device 6 is supported out, and a user can easily take out the COB packaging device 6.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a QSFP28 optical module of COB encapsulation, includes storage stacking box (1), the front fixedly connected with control panel (2) of storage stacking box (1), the top of storage stacking box (1) is rotated and is connected with chamber door (3), its characterized in that: the both sides of storage pile case (1) are equal fixedly connected with case handle (4), handle groove (5) have all been seted up to the both sides of storage pile case (1), the top of storage pile case (1) and the below joint that is located chamber door (3) have COB packaging hardware (6), COB packaging hardware (6) include aluminium base board (7), the top of aluminium base board (7) bonds through the bonding agent has insulating layer (8), the top of insulating layer (8) bonds through the bonding agent has circuit layer (9), the top of circuit layer (9) bonds through the bonding agent has bonding lead (10), the top of storage pile case (1) bonds through the bonding agent has QSFP28 optical module chip (11), the top of circuit layer (9) has enclosure glue (12), the top of circuit layer (9) has packaging glue (13), equal fixedly connected with gag lever post (14) all around of aluminium base board (7) bottom, standing groove (15) have been seted up at the top of storage pile box (1), spacing groove (16) have been seted up at the top of storage pile box (1), the top swing joint of storage pile box (1) has top layer board (17), the bottom fixedly connected with pneumatic cylinder (18) of storage pile box (1) inner chamber, the output fixedly connected with hydraulic stem (19) of pneumatic cylinder (18), the inner chamber swing joint of storage pile box (1) has supporting baseplate (21), the bottom fixedly connected with telescopic link (20) of supporting baseplate (21), the top fixedly connected with support column (22) of supporting baseplate (21).
2. The COB-packaged QSFP28 optical module according to claim 1, wherein: the outer surface of the box handle (4) is matched with the inner surface of the handle groove (5), and two sides of the QSFP28 optical module chip (11) are clamped with one side, opposite to the two bonding leads (10).
3. The COB-packaged QSFP28 optical module according to claim 1, wherein: the outer surface of the packaging adhesive (13) is adhered to the inner surface of the fence adhesive (12), and the bottom of the packaging adhesive (13) is adhered to the bonding lead (10) and the top of the QSFP28 optical module chip (11).
4. The COB-packaged QSFP28 optical module according to claim 1, wherein: the inner surface of the placing groove (15) is matched with the outer surface of the aluminum substrate (7), and the limiting groove (16) is communicated with the placing groove (15).
5. The COB-packaged QSFP28 optical module according to claim 1, wherein: the inner surface of the limiting groove (16) is matched with the outer surface of the limiting rod (14), and the bottom of the supporting bottom plate (21) is fixedly connected with the top end of the hydraulic rod (19).
6. The COB-packaged QSFP28 optical module according to claim 1, wherein: the bottom of telescopic link (20) and the bottom fixed connection of storage pile case (1) inner chamber, the top of support column (22) and the bottom fixed connection of top layer board (17).
7. The COB-packaged QSFP28 optical module according to claim 1, wherein: the inner wall of the limiting groove (16) is fixedly connected with a small magnet (23), the top of the storage stacking box (1) is provided with a groove in a penetrating mode, and the outer surface of the top supporting plate (17) is matched with the inner surface of the groove.
8. The COB-packaged QSFP28 optical module according to claim 1, wherein: the placing groove (15) is communicated with the groove, and stacking clamping grooves (24) are formed in the periphery of the top of the box door (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110393604.7A CN113130421A (en) | 2021-04-13 | 2021-04-13 | QSFP28 optical module of COB encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110393604.7A CN113130421A (en) | 2021-04-13 | 2021-04-13 | QSFP28 optical module of COB encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113130421A true CN113130421A (en) | 2021-07-16 |
Family
ID=76776092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110393604.7A Pending CN113130421A (en) | 2021-04-13 | 2021-04-13 | QSFP28 optical module of COB encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113130421A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010260625A (en) * | 2009-05-11 | 2010-11-18 | Makita Corp | Box and its stacking structure |
| CN203707128U (en) * | 2014-01-16 | 2014-07-09 | 浙江远大电子开发有限公司 | Combined COB packaging structure |
| CN209119050U (en) * | 2018-11-06 | 2019-07-16 | 深圳格兰达智能装备股份有限公司 | A kind of chip jig stacker mechanism |
| CN110255023A (en) * | 2019-05-10 | 2019-09-20 | 盐城品迅智能科技服务有限公司 | It is a kind of for intelligent storage equipment material pile up device and material tiling method |
| CN209486349U (en) * | 2019-04-22 | 2019-10-11 | 毛小俊 | A kind of optic fiber transceiver module |
-
2021
- 2021-04-13 CN CN202110393604.7A patent/CN113130421A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010260625A (en) * | 2009-05-11 | 2010-11-18 | Makita Corp | Box and its stacking structure |
| CN203707128U (en) * | 2014-01-16 | 2014-07-09 | 浙江远大电子开发有限公司 | Combined COB packaging structure |
| CN209119050U (en) * | 2018-11-06 | 2019-07-16 | 深圳格兰达智能装备股份有限公司 | A kind of chip jig stacker mechanism |
| CN209486349U (en) * | 2019-04-22 | 2019-10-11 | 毛小俊 | A kind of optic fiber transceiver module |
| CN110255023A (en) * | 2019-05-10 | 2019-09-20 | 盐城品迅智能科技服务有限公司 | It is a kind of for intelligent storage equipment material pile up device and material tiling method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209001336U (en) | A kind of VCSEL sensor-packaging structure | |
| CN113130421A (en) | QSFP28 optical module of COB encapsulation | |
| CN103855331A (en) | Polymer battery structure | |
| CN110641801B (en) | Folding mobile phone packaging box | |
| CN211165536U (en) | High efficiency corrugated container board box press | |
| CN214357577U (en) | Optical module packing environment-friendly plastic uptake box | |
| CN209087839U (en) | It is a kind of close to encapsulation structure of optical sensor | |
| CN209834318U (en) | Reinforced layered packaging box | |
| CN211544416U (en) | Crashproof packing carton with corner protection | |
| CN210793967U (en) | Portable supporting structure for carton | |
| CN220810373U (en) | Moisture-proof corrugated box | |
| CN217306516U (en) | Higher encapsulation optical device of leakproofness | |
| CN214650486U (en) | Anti-collision totally-enclosed foam pad structure for electric appliance packaging | |
| CN220810147U (en) | Dampproofing resistance to compression packing box | |
| CN219097347U (en) | Gift packaging box | |
| CN216547404U (en) | Baking packaging box with bottom damp-proof structure | |
| CN109378702A (en) | A kind of VCSEL sensor-packaging structure and its packaging method | |
| CN110817037A (en) | Lining assembly and packing box thereof | |
| CN211109028U (en) | Plate type cigarette gift box capable of being mechanically packaged | |
| CN206098435U (en) | Full zhou faguang LED of two -sided encapsulation | |
| CN218447911U (en) | Infrared receiving module | |
| CN109968236A (en) | A kind of polymer battery core Soft Roll positioning turnover tooling | |
| CN214567252U (en) | Packing carton is used in production of optical communication module | |
| CN220595487U (en) | Spliced packing box | |
| CN220282017U (en) | Gift box of anticollision resistance to compression |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |