CN113130371A - Wafer supporting device and wafer cleaning device - Google Patents
Wafer supporting device and wafer cleaning device Download PDFInfo
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- CN113130371A CN113130371A CN201911407703.5A CN201911407703A CN113130371A CN 113130371 A CN113130371 A CN 113130371A CN 201911407703 A CN201911407703 A CN 201911407703A CN 113130371 A CN113130371 A CN 113130371A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Abstract
The invention discloses a wafer supporting device and a wafer cleaning device, wherein the wafer supporting device comprises a supporting component, a cleaning component and a cleaning component, wherein the supporting component moves to horizontally support a wafer; at least one of the support members is swingable relative to its direction of movement to adjust the position of the support member. The wafer supporting device enables the supporting roller to be in uniform contact with the outer edge of the wafer, ensures the reliable support of the wafer, and effectively removes impurities on the surface of the wafer through the cleaning brush arranged on the side part of the wafer, thereby realizing the cleaning of the surface of the wafer.
Description
Technical Field
The invention belongs to the technical field of wafer post-processing, and particularly relates to a wafer supporting device and a wafer cleaning device.
Background
Chemical Mechanical Polishing (CMP) is an ultra-precise surface processing technique for global Planarization. Since chemical agents and abrasives are used in large amounts during the chemical mechanical polishing process, which causes contamination of the wafer surface, a post-treatment process needs to be introduced after the chemical mechanical polishing. The post-treatment process typically consists of cleaning and drying to provide a smooth and clean wafer surface.
Horizontal cleaning is common in post-treatment processes, a wafer to be cleaned is horizontally arranged, and cleaning brushes are arranged on two sides of the wafer. The horizontal wet cleaning method utilizes mechanical action to separate the pollutants on the surface of the wafer and make the pollutants enter the cleaning solution, and utilizes chemical reaction between the cleaning solution and the pollutants on the surface of the wafer to dissolve the pollutants into the cleaning solution so as to remove the pollutants on the surface of the wafer.
In the prior art, the wafer is horizontally supported by the supporting roller, as shown in fig. 1(a), the supporting roller 12 'contacts with the outer edge of the wafer W, a part of the supporting roller is provided with a device for driving the supporting roller to rotate, the wafer is rotated by the friction force between the supporting roller 12' and the outer edge of the wafer W, and further, the cleaning brush arranged at the side part of the wafer removes the pollutants on the surface of the wafer; in the embodiment, one of the support rollers 12' is not in contact with the outer edge of the wafer W, the wafer swings during rotation, that is, the wafer cannot be kept horizontal during brushing, and the cleaning brush is in non-uniform contact with the rotating wafer, that is, the cleaning effect of the wafer is affected, as shown in fig. 1 (b). Moreover, after the supporting roller is used for a period of time, the supporting roller is aged and deformed, which also causes the supporting roller to be unevenly or not contacted with the outer edge of the wafer, and the aging of the supporting roller also affects the cleaning effect of the wafer.
Therefore, it is desirable to design a wafer supporting apparatus and a wafer cleaning apparatus to solve the technical problems in the prior art.
Disclosure of Invention
The present invention aims to solve at least to some extent one of the technical problems existing in the prior art. To this end, a first aspect of the present invention provides a wafer supporting apparatus, which includes a support member that moves to horizontally support a wafer; at least one of the support members is swingable relative to its direction of movement to adjust the position of the support member.
Preferably, the support assembly comprises a support roller thereon, and the support assembly swings to adjust a gap between the support roller and the outer edge of the wafer.
Preferably, the support assembly comprises a swivel assembly which enables the support assembly to swing adaptively.
Preferably, the support assembly is provided with a driving support roller and/or a driven support roller, and the support assembly is adaptively swung to adjust the position of the driving support roller and/or the driven support roller.
Preferably, the support assembly comprises a support plate on which a driving support roller and a driven support roller are arranged; the supporting plate is connected with the moving assembly through the rotating assembly, and the moving assembly drives the supporting plate and the supporting rollers on the supporting plate to move oppositely so as to horizontally support the wafer.
Preferably, the supporting assembly comprises a supporting plate, a driving supporting roller, a driven supporting roller and a revolving assembly, the driving supporting roller and/or the driven supporting roller are connected with the supporting plate through the revolving assembly, and the revolving assembly enables the supporting roller to swing in a self-adaptive mode so as to adjust the gap between the supporting roller and the outer edge of the wafer.
Preferably, the gyration subassembly includes connecting axle and sleeve, the one end and the supporting component of connecting axle are connected, the other end pin joint of connecting axle is in setting up the sleeve at the removal subassembly.
Preferably, the supporting roller comprises a connecting part and a supporting part positioned at the top of the connecting part, the supporting part comprises an upper supporting body, a gasket and a lower supporting body, and the gasket is arranged in a groove formed by the upper supporting body and the lower supporting body; and a gap is arranged on the outer side surface and/or part of the top surface of the gasket, which is in contact with the upper support body and the lower support body.
The invention provides a wafer cleaning device, which comprises the wafer supporting device, wherein the wafer supporting device horizontally supports a wafer, and the upper surface and/or the lower surface of the wafer is/are provided with cleaning brushes for removing impurities on the surface of the wafer.
Preferably, the cleaning brush is disposed non-parallel to the side of the horizontally supported wafer.
The invention discloses a wafer supporting device, wherein at least one supporting component arranged in the wafer supporting device can swing in a self-adaptive manner to adjust the gap between a supporting roller and the outer edge of a wafer W, so that the supporting roller is ensured to be in uniform contact with the outer edge of the wafer W, and the wafer W arranged horizontally is ensured to rotate stably. Meanwhile, the invention also discloses a wafer cleaning device which comprises the wafer supporting device, wherein the side surface of the horizontally supported wafer W is provided with a cleaning brush for removing impurities on the surface of the wafer, and the wafer cleaning device has the advantage of good cleaning effect.
Drawings
The advantages of the invention will become clearer and more readily appreciated from the detailed description given with reference to the following drawings, which are given by way of illustration only, and which do not limit the scope of protection of the invention, wherein:
FIG. 1 is a schematic diagram of a wafer support apparatus according to the prior art;
FIG. 2 is a schematic view of a wafer support apparatus according to the present invention;
FIG. 3 is a schematic view of the connection of the rotating assembly with the moving assembly and the support assembly according to the present invention;
FIG. 4 is an enlarged view of a portion of FIG. 3;
FIG. 5 is a schematic view of the structure of the support roll of the present invention;
FIG. 6 is an enlarged view of a portion of the support body of FIG. 5;
fig. 7 is a schematic structural diagram of a wafer cleaning apparatus according to the present invention.
Detailed Description
The technical solution of the present invention will be described in detail with reference to the following embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the present invention for the purpose of illustrating the concepts of the invention; the description is intended to be illustrative and exemplary and should not be taken to limit the scope of the invention. In addition to the embodiments described herein, those skilled in the art will be able to employ other technical solutions which are obvious based on the disclosure of the claims and the specification thereof, and these technical solutions include technical solutions which make any obvious replacement or modification of the embodiments described herein.
The drawings in the present specification are schematic views to assist in explaining the concept of the present invention, and schematically show the shapes of respective portions and their mutual relationships. It should be understood that the drawings are not necessarily to scale, the same reference numerals being used to identify the same elements in the drawings in order to clearly show the structure of the elements of the embodiments of the invention.
As one aspect of the invention, the invention discloses a wafer supporting device which is used for horizontally supporting a wafer. Fig. 2 is a schematic structural view of a wafer supporting apparatus 100 according to the present invention, which includes a supporting assembly 10, the supporting assembly 10 is configured with a moving assembly 20, the moving assembly 20 is disposed at a lower portion of the supporting assembly 10, and the moving assembly 20 drives the supporting assembly 10 to move so as to horizontally support a wafer W.
In the embodiment shown in fig. 2, the number of the support members 10 is 2, and they are moved toward each other to support the wafer W such that the wafer W is horizontally disposed. It is understood that the number of the support members 10 may be other, such as 3, 4 or other numbers, as long as the moving member 20 moves the support members 10 toward the outer edge of the wafer W to support the wafer W.
As one aspect of the present embodiment, the support assembly 10 includes a support plate 11 and support rollers 12, and the support rollers 12 are disposed at an upper portion of the support plate 11. In the embodiment shown in fig. 2, the number of the support rollers 12 is 2, and the contact positions of the support rollers 12 with the outer edge of the wafer W are disposed at the same level so as to ensure the horizontal support of the wafer W. It is understood that the number of the supporting rollers 12 disposed on the upper portion of the supporting plate 11 may be 1, 3 or other numbers, as long as the contact positions of the supporting rollers 12 with the outer edge of the wafer W are ensured to be located on the same horizontal plane.
In the embodiment shown in fig. 2, the wafer supporting apparatus further includes a rotating assembly 30, the rotating assembly 30 is disposed between the supporting assembly 10 and the moving assembly 20, and the rotating assembly 30 enables the supporting assembly 10 connected thereto to swing with respect to the moving direction to adjust the position of the supporting assembly 10, so as to achieve uniform contact between the supporting roller 12 and the outer edge of the wafer W, and avoid the wafer W from swinging during horizontal rotation of the wafer to affect the cleaning effect of the wafer.
As an embodiment of the present invention, as shown in fig. 2, the wafer supporting apparatus includes two support members 10, and a swing member 30 is provided at a lower portion of each support member 10. The rotation component 30 is arranged to enable the support component 10 to swing relative to the moving direction of the support component 10 to adjust the position of the support component, that is, the gap between the support roller 12 and the outer edge of the wafer W is adjusted by the swing of the support component 10, so that the support roller 12 and the outer edge of the wafer W are contacted uniformly, and a good cleaning effect of the wafer is ensured. As a variation of the present embodiment, a lower portion of one support assembly 10 is provided with the swing assembly 30, and the other support assembly 10 may not be provided with the swing assembly 30. That is, one of the support members 10 may swing with respect to its moving direction, ensuring uniform contact of the support roller 12 with the outside of the wafer W. In some embodiments, the wafer support apparatus includes a plurality of support members 10, and the support members 10 are movable along the wafer W to support the wafer W. To ensure uniformity of contact of the support rollers with the outer edge of the wafer W, at least one of the support members 10 may be swung with respect to its moving direction to adjust the gap of the support rollers 12 with respect to the outer edge of the wafer W so that the support rollers are in sufficient contact with the outer edge of the wafer W.
Fig. 3 is a schematic view of the connection of the swivel assembly 30 according to the present invention, and the swivel assembly 30 includes a connecting shaft 31 and a sleeve 32. One end of the connecting shaft 10 is connected to the supporting plate 11 of the supporting assembly 10, and the other end of the connecting shaft 10 is pivoted to the sleeve 32 disposed on the moving assembly 20. The sleeve 32 is provided with a bushing 33 inside, and the end of the connecting shaft 31 is in clearance fit with the bushing 33, so that the connecting shaft 31 can rotate around the bushing 33 inside the sleeve 32 in a self-adaptive manner to drive the support assembly 10 connected with the connecting shaft 31 to swing in the horizontal direction. The bushing 33 is made of a material with good wear resistance and self-lubrication, such as polyethylene terephthalate (PET), Polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC) and/or polypropylene (PP), to ensure that the connection shaft 31 can rotate along the sleeve 32 in a self-adaptive manner. Fig. 4 is a close-up view of the connection of the connecting shaft 31 to the bushing 33, said bushing 33 being made of PTFE in this embodiment, the connecting shaft 31 being self-adaptive in rotation along the bushing 33.
As an embodiment of the present invention, a driving support roller 12a and a driven support roller 12b are provided on the support plate 11 of the support assembly 10, as shown in fig. 2. The driving support roller 12a and the driven support roller 12b are disposed at ends of the support plate 11 such that a place where the driving support roller 12a contacts the wafer W and a place where the driven support roller 12b contacts the wafer W are spaced apart, forming a reliable support for the wafer W. The driving support roller 12a is provided with a direct drive motor, under the action of the direct drive motor, the driving support roller 12a rotates around the axis of the support roller, and under the action of friction force, the support roller drives the wafer W to rotate. The driven supporting roller 12b is not required to be provided with a driving device, the wafer W is fully contacted with the driven supporting roller 12b, the rotating wafer W can drive the driven supporting roller 12b to rotate, the driven supporting roller 12b can reliably limit the rotating wafer W, and the rotating stability of the wafer W is ensured. As another embodiment of the present invention, a driving support roller 12a and a driven support roller 12b are disposed around the outer circumferential side of the wafer W, wherein the driving support roller 12a and the driven support roller 12b are disposed at intervals in order to ensure the smoothness of the rotation of the wafer W.
As a variation of this embodiment, a driving support roller 12a and/or a driven support roller 12b may be disposed on the support plate 11 of the support assembly 10, and the support assembly 10 adaptively swings, and the driving support roller 12a and/or the driven support roller 12b thereon moves in position, so that the support roller 12 fully contacts with the outer edge of the wafer W, and the wafer W is ensured to rotate stably.
As an aspect of the present embodiment, the driven supporting roller 12b may be provided with a speed measuring device to measure the corresponding rotation parameters of the driven supporting roller 12b, such as whether it rotates or not, and how the rotation speed is. In this way, the operating state of the driven supporting roller 12b can be monitored in real time by the speed measuring device, so as to indirectly monitor the rotation state of the horizontally arranged wafer W.
As an embodiment of the present invention, the driving support roller 12a and the driven support roller 12b on the support plate 11 may be connected by a transmission device to realize the rotation of the support rollers 12. The transmission device can be a conveyor belt, a transmission chain or other transmission mechanisms.
As another embodiment of the present invention, the supporting assembly 10 includes a supporting plate 11, a driving supporting roller 12a and a driven supporting roller 12b, and a revolving assembly 30, the driving supporting roller 12a and/or the driven supporting roller 12b is connected to the supporting plate 11 through the revolving assembly 30, and the revolving assembly 30 enables the supporting roller 12 to swing adaptively to adjust a gap between the supporting roller 12 and an outer edge of the wafer W. As one aspect of the present embodiment, the wafer support apparatus includes 4 support members 10, and the support members 10 are disposed along a radial direction of a wafer W to be supported. The support assembly 10 includes a support plate 11, a driving support roller 12a is disposed on the support plate 11, and the driving support roller 12a is connected to the support plate 11 through a swiveling assembly 30. The moving unit 20 is connected to the swing unit 30 and moves in a radial direction of the wafer W. Under the action of the rotating assembly 30, the support plate 11 and the driving support roller 12a thereon can swing relative to the moving direction of the support assembly 10 to adjust the gap between the driving support roller 12a and the outer edge of the wafer W, so as to ensure uniform contact between the support roller and the outer edge of the wafer W. As a variation of this embodiment, at least one piece of support assembly 10 is configured with a pivoting assembly 30 to promote the adaptability of the wafer support apparatus.
Fig. 5 is a schematic structural view of the support roller 12 according to the present invention, and the support roller 12 includes a connection portion 121 and a support portion 122 located on top of the connection portion 121. The connecting body 121 is connected with the supporting plate 11, and a driving motor or a speed measuring device can be arranged on the connecting body 121.
Fig. 6 is a partial enlarged view of the support portion 122 in fig. 5, the support portion 122 includes an upper support 1221, a gasket 1222, and a lower support 1223, the gasket 1222 is disposed in a groove formed by the upper support 1221 and the lower support 1223, an outer side surface of the gasket 1222 is provided with a V-shaped groove, the V-shaped groove is disposed to match with a thickness of the wafer W, in order to ensure that the wafer W is accurately clamped into the V-shaped groove of the gasket 1222, a top surface of the lower support 1223 is provided with a first inclined surface, and the first inclined surface is parallel to a lower inclined surface corresponding to the V-shaped groove. Meanwhile, a second inclined surface is provided on the bottom surface of the upper support 1221, and the second inclined surface is parallel to the lower inclined surface corresponding to the V-shaped groove.
As an embodiment of the present invention, the gasket 1222 is made of polyurethane, which has good chemical resistance, resilience, and mechanical properties, and is capable of absorbing vibration. The washer 1222 made of polyurethane can securely fix the wafer W, and a pair of outer edges of the wafer W forms a secure support. It is understood that the gasket 1222 may be made of other materials having good chemical resistance, resilience, and mechanical properties. Since the support 122 requires a long-term contact with the cleaning liquid, the upper and lower supports 1221 and 1223 are made of a material that is relatively inert to chemical reaction, such as PPS, PTFE, PP, PET, and/or PEEK. In the embodiment shown in fig. 5 and 6, the upper supporter 1221 and the lower supporter 1223 are made of PPS.
In order to weaken the influence of the aged deformation of the gasket 1222 on the support of the wafer W, a gap is provided on the outer side surface of the gasket 1222 contacting the upper support 1221 and the lower support 1223, as shown in fig. 6. The aged-deformed gasket 1222 can fill the reserved gap without affecting the V-shaped groove of the outer side surface of the gasket 1222 by being pressed by the upper supporter 1221 and/or the lower supporter 1223. As a variation of this embodiment, a gap may be provided on a portion of the top surface of the gasket 1222 contacting the upper supporter 1221 and the lower supporter 1223 to provide a space for aging deformation of the gasket 1222, so as to ensure a structural problem of the V-shaped groove for supporting the wafer W. In the embodiment shown in fig. 6, the outer side surfaces and a part of the top surface of the gasket 1222 contacting the upper supporter 1221 and the lower supporter 1223 are provided with a gap to make room for the aged deformation of the gasket 1222. In one aspect of this embodiment, the gap between the outer side surfaces of the gasket 1222 contacting the upper supporter 1221 and the lower supporter 1223 is 0.1mm to 0.5mm, and the gap between the top surfaces of the gasket 1222 contacting the upper supporter 1221 and the lower supporter 1223 is 0.05mm to 0.3 mm.
As another aspect of the present invention, the present invention also discloses a wafer cleaning apparatus 1000, as shown in fig. 7, which includes the above-described wafer supporting apparatus 100, wherein the wafer supporting apparatus 100 horizontally supports the wafer W, and the upper surface and the lower surface of the wafer W are provided with the cleaning brushes 200 for removing impurities on the surface of the wafer. The washing brush 200 is coupled to the bracket assembly 300 at the side to provide power for supporting and rotating the washing brush 200. A plurality of sets of nozzles (not shown) are provided in parallel at the upper portion of the rack assembly 300 to spray the cleaning solution toward the brush 200, and the rotating brush 200 is brought into contact with the side surface of the wafer W to remove foreign substances from the surface of the wafer.
As an embodiment of the present invention, the cleaning brushes 200 are disposed non-parallel to the side surfaces of the horizontally supported wafers W, and the axis of the cleaning brushes 200 forms a certain angle with the horizontal plane on which the wafers W are placed, so that a certain grinding pressure is formed to the wafers W between the cleaning brushes 200, and the rotation of the wafers W is promoted to ensure a good cleaning effect. In one aspect of the present embodiment, the angle between the axis of the brush 200 and the horizontal plane on which the wafer W is placed is 0.1 to 5 °, and preferably, the angle between the axis of the brush 200 and the horizontal plane on which the wafer W is placed is 0.5 °.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A wafer supporting device is characterized by comprising a supporting component, a supporting component and a supporting component, wherein the supporting component moves to horizontally support a wafer; at least one of the support members is swingable relative to its direction of movement to adjust the position of the support member.
2. The wafer support apparatus of claim 1, wherein the support assembly includes a support roller thereon, the support assembly oscillating to adjust a gap between the support roller and an outer edge of the wafer.
3. The wafer support apparatus of claim 1, wherein the support assembly comprises a pivoting assembly that allows the support assembly to adaptively pivot.
4. The wafer support apparatus of claim 1, wherein the support assembly is configured with a driving support roller and/or a driven support roller, the support assembly being adapted to oscillate to adjust the position of the driving support roller and/or the driven support roller.
5. The wafer support apparatus of claim 1, wherein the support assembly comprises a support plate on which a driving support roller and a driven support roller are disposed; the supporting plate is connected with the moving assembly through the rotating assembly, and the moving assembly drives the supporting plate and the supporting rollers on the supporting plate to move oppositely so as to horizontally support the wafer.
6. The wafer support apparatus of claim 1, wherein the support assembly comprises a support plate, a driving support roller and a driven support roller, and a rotation assembly, the driving support roller and/or the driven support roller is connected with the support plate through the rotation assembly, and the rotation assembly enables the support roller to swing adaptively to adjust a gap between the support roller and the outer edge of the wafer.
7. The wafer support apparatus of claim 5, wherein the rotation assembly comprises a connection shaft and a sleeve, one end of the connection shaft is connected to the support assembly, and the other end of the connection shaft is pivotally connected to the sleeve disposed on the moving assembly.
8. The wafer support apparatus of claim 2, wherein the support roller comprises a connection portion and a support portion located at the top of the connection portion, the support portion comprises an upper support body, a gasket and a lower support body, and the gasket is disposed in a groove formed by the upper support body and the lower support body; and a gap is arranged on the outer side surface and/or part of the top surface of the gasket, which is in contact with the upper support body and the lower support body.
9. A wafer cleaning apparatus, comprising the wafer supporting apparatus according to any one of claims 1 to 8, wherein the wafer supporting apparatus supports a wafer horizontally, and the upper surface and/or the lower surface of the wafer is provided with a cleaning brush for removing impurities on the surface of the wafer.
10. The wafer cleaning apparatus according to claim 9, wherein the cleaning brush is disposed non-parallel to the side of the horizontally supported wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911407703.5A CN113130371A (en) | 2019-12-31 | 2019-12-31 | Wafer supporting device and wafer cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911407703.5A CN113130371A (en) | 2019-12-31 | 2019-12-31 | Wafer supporting device and wafer cleaning device |
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| CN113130371A true CN113130371A (en) | 2021-07-16 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113675113A (en) * | 2021-08-20 | 2021-11-19 | 华海清科股份有限公司 | Horizontal wafer cleaning device and cleaning method |
| CN114156227A (en) * | 2022-02-10 | 2022-03-08 | 上海隐冠半导体技术有限公司 | Clamping device |
-
2019
- 2019-12-31 CN CN201911407703.5A patent/CN113130371A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113675113A (en) * | 2021-08-20 | 2021-11-19 | 华海清科股份有限公司 | Horizontal wafer cleaning device and cleaning method |
| CN113675113B (en) * | 2021-08-20 | 2024-04-05 | 华海清科股份有限公司 | Wafer horizontal cleaning device and cleaning method |
| CN114156227A (en) * | 2022-02-10 | 2022-03-08 | 上海隐冠半导体技术有限公司 | Clamping device |
| CN114156227B (en) * | 2022-02-10 | 2022-07-08 | 上海隐冠半导体技术有限公司 | Clamping device |
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