CN113130353B - Automatic shaping mechanism of new energy automobile IGBT chip - Google Patents
Automatic shaping mechanism of new energy automobile IGBT chip Download PDFInfo
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- CN113130353B CN113130353B CN202110286987.8A CN202110286987A CN113130353B CN 113130353 B CN113130353 B CN 113130353B CN 202110286987 A CN202110286987 A CN 202110286987A CN 113130353 B CN113130353 B CN 113130353B
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- 230000007246 mechanism Effects 0.000 title claims abstract description 67
- 238000007493 shaping process Methods 0.000 title claims abstract description 26
- 238000005452 bending Methods 0.000 claims abstract description 191
- 238000010008 shearing Methods 0.000 claims abstract description 162
- 238000000034 method Methods 0.000 claims abstract description 34
- 238000013519 translation Methods 0.000 claims abstract description 23
- 238000007667 floating Methods 0.000 claims description 85
- 230000008569 process Effects 0.000 claims description 23
- 238000000465 moulding Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 17
- 230000009471 action Effects 0.000 description 5
- 238000007599 discharging Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
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- Shearing Machines (AREA)
Abstract
The invention discloses an automatic shaping mechanism of a new energy automobile IGBT chip, and aims to provide the automatic shaping mechanism of the new energy automobile IGBT chip, which not only can effectively improve the efficiency of chip pin shearing and bending processing, but also can effectively solve the problem that the dimensional accuracy of the chip pin shearing and bending after shaping is affected due to the chip positioning error of two processing procedures of pin shearing and bending. It comprises a frame; the pin shearing advancing and retreating mechanism comprises a first guide rail arranged on the frame and a main sliding seat sliding along the first guide rail; the chip positioning device comprises a chip positioning clamping jaw arranged on the main sliding seat; the chip pin shearing and bending one-time forming mechanism comprises a pin shearing and bending cutter assembly, a second guide rail which is arranged on the main slide seat and parallel to the first guide rail, an upper slide seat which slides along the second guide rail, and a translation actuating mechanism which is arranged on the frame and used for driving the upper slide seat to move.
Description
Technical Field
The invention relates to a shaping mechanism, in particular to an automatic shaping mechanism for a new energy automobile IGBT chip.
Background
At present, a plurality of chips are arranged on an IGBT module of a new energy automobile, and pins of the chips are required to be shaped according to the installation requirement of the IGBT module, namely pins of the IGBT chip pair are sheared and bent. In the prior art, the processing of pin cutting and bending of the chip of the IGBT module is generally divided into two procedures of pin cutting and pin bending, namely pin cutting and pin bending are performed, pins of the chip are cut in the pin cutting procedure equipment, so that the pin length of the chip meets the installation requirement; then, the die is moved to a device for bending the leads of the die. The chip pin cutting and bending processing operation of the traditional IGBT module is required to pass through two processing procedures in sequence, so that the processing efficiency is affected, and the dimensional accuracy of the chip pin cutting after bending and forming is easily affected due to the chip positioning errors of the two processing procedures.
Disclosure of Invention
The invention aims to provide the automatic shaping mechanism for the IGBT chip of the new energy automobile, which not only can effectively improve the efficiency of chip pin shearing and bending processing, but also can effectively solve the problem that the dimensional accuracy of the chip pin shearing after bending and shaping is affected due to the chip positioning errors of two processing procedures of pin shearing and bending.
The technical scheme of the invention is as follows:
an automatic shaping mechanism of new energy automobile IGBT chip includes:
a frame;
the cutting pin advancing and retreating mechanism comprises a first guide rail arranged on the frame, a main sliding seat sliding along the first guide rail and an advancing and retreating executing mechanism arranged on the frame and used for driving the main sliding seat to move;
the chip positioning device comprises a chip positioning clamping jaw arranged on the main sliding seat, and the chip positioning clamping jaw is used for clamping and fixing a chip of which the pin to be sheared is bent;
the chip pin shearing and bending one-time forming mechanism comprises a pin shearing and bending cutter assembly, a second guide rail which is arranged on the main slide seat and is parallel to the first guide rail, an upper slide seat which slides along the second guide rail, and a translation actuating mechanism which is arranged on the frame and is used for driving the upper slide seat to move,
the pin shearing and bending cutter assembly comprises a pin shearing and bending cutter arranged on the upper sliding seat, a pin shearing blade and a bending baffle arranged on the frame, a cutter accommodating opening is formed between the pin shearing blade and the bending baffle, the pin shearing and bending cutter comprises a shearing blade matched with the pin shearing blade and a bending part matched with the bending baffle, the cutter accommodating opening and the pin shearing and bending cutter are distributed along the moving direction of the main sliding seat, and the opening of the cutter accommodating opening faces the pin shearing and bending cutter;
the translation actuating mechanism is used for driving the upper sliding seat and the shearing foot bending cutter to move along the second guide rail and enabling the shearing foot bending cutter to move into the cutter accommodating opening; in the process that the cutting foot bending cutter moves into the cutter accommodating opening, the cutting edge of the cutting foot bending cutter is matched with the cutting foot blade so as to cut the feet of the pins of the chip, and then the bending part of the cutting foot bending cutter is matched with the bending baffle plate so as to bend the pins of the chip.
The automatic shaping mechanism of the new energy automobile IGBT chip of this scheme specifically works as follows:
firstly, driving a main sliding seat and a chip positioning device to move to a position in the direction of a shearing pin bending cutter by a driving and reversing executing mechanism; then, clamping and fixing the chips to be sheared and bent on the chip positioning clamping jaw, wherein the chips clamped and fixed on the chip positioning clamping jaw are vertically distributed, the pins of the chips are also vertically distributed, and the pins of the chips extend towards the direction;
secondly, the translation actuating mechanism drives the upper sliding seat and the shearing foot bending cutter to move along the second guide rail, and the shearing foot bending cutter is moved into the cutter accommodating opening; in the process that the pin shearing and bending cutter moves into the cutter accommodating opening, the shearing edge of the pin shearing and bending cutter is matched with the pin shearing blade to shear pins of the chip, and then the bending part of the pin shearing and bending cutter is matched with the bending baffle plate to bend the pins of the chip; and then in same station, the pin of chip is cut and bent in the same process to effectively improve the efficiency of the pin processing of cutting the pin of chip, once fix a position the pin of chip and accomplish the pin of chip and bend moreover, so can effectively solve the problem that the chip cuts the pin and bends the dimensional accuracy after shaping because of cutting the pin and bending the chip positioning error of two processing procedures.
Preferably, the bending baffle is located above the blade of the cutting foot, the end face of the cutting foot bending cutter facing the cutter accommodating opening forms a cutter inclined plane, the lower part of the cutter inclined plane is inclined towards the direction of the cutter accommodating opening, the joint part of the cutter inclined plane and the lower surface of the cutting foot bending cutter forms the cutting edge, and the joint part of the cutter inclined plane and the upper surface of the cutting foot bending cutter forms the bending part. Therefore, the cutting pin and bending of the chip pins can be realized through the cutter inclined plane of the same cutting pin bending cutter, the cutter structure can be further simplified, and the efficiency of the chip pin cutting and bending processing is improved.
Preferably, the inclination angle of the cutter bevel is 75-88 degrees.
The floating type anti-backlash device comprises a reset spring, a third guide rail, a floating slide seat, a floating column accommodating opening, a vertical guide sleeve, a floating column, a roller and a push plate, wherein the third guide rail is arranged on a frame and is parallel to a first guide rail;
in the process that the translation actuating mechanism drives the upper sliding seat to move towards the direction of the cutter accommodating opening, the pushing inclined plane is contacted with the roller and pushes the floating column to move upwards along the vertical guide sleeve, and the floating sliding seat, the bending baffle and the pin shearing blade move towards the direction of the pin shearing cutter through the matching of the inclined plane of the floating column and the inclined plane of the side wall, then the roller is supported on the supporting plane, and in the process that the roller is supported on the supporting plane, the floating column keeps motionless, and the floating sliding seat, the bending baffle and the pin shearing blade also keep motionless.
In order to ensure that pins of a chip do not interfere with the bending baffle and the pin shearing blade in the process of vertically placing the chip on the chip positioning clamping jaw, a certain gap is reserved between the pins of the chip and the bending baffle and the pin shearing blade after the chip is placed and clamped on the chip positioning clamping jaw; moreover, as the pins of the chip can be bent at a small angle, the gap which needs to be reserved between the pins of the chip and the bending baffle and between the pins and the pin shearing blade can not be too small, and the gap is generally reserved for 1-2 mm; therefore, although the chips can be placed smoothly and clamped and fixed on the chip positioning clamping jaw, the chips cannot interfere with the bending baffle and the pin shearing blade; but at the same time, a gap of 1-2 mm exists between the pin of the chip fixed on the chip positioning clamping jaw, the bending baffle and the pin shearing blade; due to the gap, in the process that the translation executing mechanism drives the pin shearing and bending cutter to move into the cutter accommodating port, the shearing edge of the pin shearing and bending cutter firstly abuts against the pin of the chip until the pin of the chip abuts against the pin shearing blade, and in the process, the pin of the chip is bent, so that the problem of dimensional accuracy of the chip after the pin shearing and bending molding is affected; in order to solve the problem, the floating gap eliminating device is arranged, so that the chip can be placed and clamped on the chip positioning clamping jaw smoothly, and the problem that the dimensional accuracy of the chip after pin shearing and bending forming is affected due to the fact that a 1-2 mm gap exists between a pin of the chip fixed on the chip positioning clamping jaw and the bending baffle and the pin shearing blade is solved under the condition that the chip can not interfere with the bending baffle and the pin shearing blade is solved; in particular, the method comprises the steps of,
in the scheme, after the chip is placed and clamped and fixed on the chip positioning clamping jaw, gaps are reserved among pins of the chip, the bending baffle and the pin shearing blade, so that the chip can be placed and clamped and fixed on the chip positioning clamping jaw smoothly, and interference between the pins of the chip, the bending baffle and the pin shearing blade is avoided;
in the process that the translation executing mechanism drives the pin shearing and bending cutter to move into the cutter accommodating opening, the pushing inclined plane is firstly contacted with the roller and pushes the floating column to move upwards along the vertical guide sleeve, so that the inclined plane of the floating column is tightly abutted against the inclined plane of the side wall, and the floating sliding seat, the bending baffle and the pin shearing blade are pushed to move towards the pin shearing and bending cutter, so that the bending baffle and the pin shearing blade are close to the pin of the chip, then the roller is supported on the supporting plane, and at the moment, the gap between the pin of the chip and the bending baffle and the pin shearing blade is eliminated or greatly reduced; meanwhile, the floating column is kept motionless, the floating sliding seat, the bending baffle and the pin shearing blade are kept motionless, and then, in the process that the translation actuating mechanism is used for driving the upper sliding seat and the pin shearing and bending cutter to move along the second guide rail and enabling the pin shearing and bending cutter to move into the cutter accommodating opening, the roller is kept supported on the supporting plane; then, the shearing edge of the shearing foot bending cutter is matched with the shearing foot blade to realize shearing feet on the pins of the chip, and then the bending part of the shearing foot bending cutter is matched with the bending baffle plate to realize bending of the pins of the chip; therefore, the chip positioning clamping jaw is capable of being placed and clamped and fixed on the chip positioning clamping jaw smoothly, and the problem that the dimensional accuracy of the chip after the chip pin is bent and formed is affected due to the fact that a 1-2 mm gap exists between the pin of the chip fixed on the chip positioning clamping jaw and the bending baffle and the pin cutting blade is solved effectively under the condition that the chip can not interfere with the bending baffle and the pin cutting blade.
Preferably, a floating column limiting block is arranged on the outer side face of the floating column, and the floating column limiting block is located above the vertical guide sleeve. So, the translation actuating mechanism drives the upper sliding seat and the shearing foot bending cutter to move in the direction away from the cutter accommodating opening, and after the push plate is separated from the roller, the floating column moves downwards under the action of dead weight until the limiting block of the floating column abuts against the vertical guide sleeve; simultaneously, the floating sliding seat moves away from the direction of the shearing pin bending cutter under the action of the reset spring.
Preferably, a side of the shearing blade facing the shearing bending cutter is provided with a shearing blade matched with the shearing blade, and the side of the bending baffle facing the shearing bending cutter is positioned on the same vertical plane with the shearing blade.
Preferably, the chip positioning clamping jaw is a pneumatic finger, two clamping fingers of the pneumatic finger are respectively provided with a clamping block, and two opposite side surfaces of the clamping blocks on the two clamping fingers are respectively provided with an elastic plate.
Preferably, the pin cutting advancing and retreating mechanism further comprises a main slide seat limiting block arranged on the frame, and the main slide seat limiting block and the pin cutting blade are located on the same side of the main slide seat.
Preferably, the chip grabbing device further comprises an feeding and discharging manipulator, wherein the feeding and discharging manipulator is used for grabbing chips.
The beneficial effects of the invention are as follows: the chip pin shearing and bending processing efficiency can be effectively improved, and the problem that the dimensional accuracy of the chip pin shearing after bending and forming is affected due to the chip positioning errors of the pin shearing and bending two processing procedures can be effectively solved.
Drawings
Fig. 1 is a schematic structural view of an automatic shaping mechanism for a new energy automobile IGBT chip of the present invention.
Fig. 2 is a partial enlarged view at a in fig. 1.
In the figure:
the cutting foot advancing and retreating mechanism 3.1, the first guide rail 3.11, the main slide seat 3.12 and the advancing and retreating executing mechanism 3.13;
chip positioning device 3.2, chip positioning clamping jaw 3.21, clamping block 3.22, mounting bracket 3.23;
the chip pin shearing and bending one-step forming mechanism 3.3, a second guide rail 3.31, an upper sliding seat 3.32, a translation actuating mechanism 3.33, a pin shearing and bending cutter 3.34, a shearing blade 3.341, a bending part 3.342, a pin shearing blade 3.35, a bending baffle plate 3.36 and a cutter accommodating port 3.37;
the device comprises a floating gap eliminating device 3.4, a third guide rail 3.41, a floating sliding seat 3.42, a floating column accommodating port 3.43, a side wall inclined surface 3.44, a push plate 3.45, a supporting plane 3.46, a pushing inclined surface 3.47, a vertical guide sleeve 3.48, a floating column 3.49, a roller 3.410, a floating column inclined surface 3.411 and a floating column limiting block 3.412;
chip 3.5.
Detailed Description
For the purpose of making the technical solution embodiment, the technical solution and the advantages of the present invention more apparent, the technical solution of the embodiment of the present invention will be clearly explained and illustrated below with reference to the accompanying drawings, but the following embodiment is only a preferred embodiment of the present invention, not all embodiments. Based on the examples in the implementation manner, other examples obtained by a person skilled in the art without making creative efforts fall within the protection scope of the present invention.
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present solution and are not to be construed as limiting the solution of the present invention.
These and other aspects of embodiments of the invention will be apparent from and elucidated with reference to the description and drawings described hereinafter. In the description and drawings, particular implementations of embodiments of the invention are disclosed in detail as being indicative of some of the ways in which the principles of embodiments of the invention may be employed, but it is understood that the scope of the embodiments of the invention is not limited correspondingly. On the contrary, the embodiments of the invention include all alternatives, modifications and equivalents as may be included within the spirit and scope of the appended claims.
In the description of the present invention, it should be understood that the terms "thickness," "upper," "lower," "horizontal," "top," "bottom," "inner," "outer," "circumferential," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the present invention. In the description of the present invention, the meaning of "a plurality" means at least two, for example, two, three, etc., unless explicitly defined otherwise, the meaning of "a number" means one or more.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
First embodiment: as shown in fig. 1 and 2, the automatic shaping mechanism of the IGBT chip of the new energy automobile comprises a frame, a pin cutting advancing and retreating mechanism 3.1, a chip positioning device 3.2 and a one-step shaping mechanism 3.3 for pin cutting and bending of the chip.
The pin shearing advancing and retreating mechanism 3.1 comprises a first guide rail 3.11 arranged on the frame, a main sliding seat 3.12 sliding along the first guide rail and an advancing and retreating executing mechanism 3.13 arranged on the frame and used for driving the main sliding seat to move; in this embodiment, the first guide rail is horizontally distributed, and the advancing and retreating executing mechanism is an air cylinder.
The chip positioning device 3.2 comprises a chip positioning clamping jaw 3.21 arranged on the main sliding seat, and the chip positioning clamping jaw is used for clamping and fixing a chip of which the pin to be sheared is bent; in this embodiment, the main slide is provided with a mounting bracket 3.23, and the chip positioning clamping jaw is fixed on the mounting bracket. The chip positioning clamping jaw is a pneumatic finger, two clamping fingers of the pneumatic finger are respectively provided with a clamping block 3.22, and two opposite side surfaces of the clamping blocks on the two clamping fingers are respectively provided with an elastic plate.
The chip pin shearing and bending one-time forming mechanism 3.3 comprises a pin shearing and bending cutter assembly, a second guide rail 3.31 arranged on the main slide seat and parallel to the first guide rail, an upper slide seat 3.32 sliding along the second guide rail and a translation actuating mechanism 3.33 arranged on the frame and used for driving the upper slide seat to move. In this embodiment, the translation actuator is a cylinder.
The pin shearing and bending cutter assembly comprises a pin shearing and bending cutter 3.34 arranged on the upper sliding seat, a pin shearing blade 3.35 arranged on the frame and a bending baffle 3.36. A cutter accommodating port 3.37 is formed between the pin shearing blade and the bending baffle. The pin bending cutter comprises a cutting edge 3.341 matched with the pin cutting blade and a bending part 3.342 matched with the bending baffle. The cutter accommodating opening and the shearing foot bending cutters are distributed along the moving direction of the main sliding seat, and the opening of the cutter accommodating opening faces the shearing foot bending cutters.
The translation actuating mechanism is used for driving the upper sliding seat and the shearing foot bending cutter to move along the second guide rail and enabling the shearing foot bending cutter to move into the cutter accommodating opening; in the process that the cutting foot bending cutter moves into the cutter accommodating opening, the cutting edge of the cutting foot bending cutter is matched with the cutting foot blade so as to cut the feet of the pins of the chip, and then the bending part of the cutting foot bending cutter is matched with the bending baffle plate so as to bend the pins of the chip.
In this embodiment, the pin cutting advancing and retreating mechanism further includes a main slide stopper disposed on the frame, and the main slide stopper and the pin cutting blade are located on the same side of the main slide.
The automatic shaping mechanism of the new energy automobile IGBT chip of this scheme specifically works as follows:
firstly, as shown in fig. 1 and 2, the advancing and retreating executing mechanism drives the main sliding seat and the chip positioning device to move to a proper position in the direction of the shearing pin bending cutter, specifically, the advancing and retreating executing mechanism drives the main sliding seat and the chip positioning device to move in the direction of the shearing pin bending cutter until the main sliding seat is propped against the main sliding seat limiting block; then, clamping and fixing the chip 3.5 to be sheared and bent on the chip positioning clamping jaw, wherein the chips clamped and fixed on the chip positioning clamping jaw are vertically distributed, pins of the chips are also vertically distributed, and the pins of the chips extend towards the direction;
secondly, the translation actuating mechanism drives the upper sliding seat and the shearing foot bending cutter to move along the second guide rail, and the shearing foot bending cutter is moved into the cutter accommodating opening; in the process that the pin shearing and bending cutter moves into the cutter accommodating opening, the shearing edge of the pin shearing and bending cutter is matched with the pin shearing blade to shear pins of the chip, and then the bending part of the pin shearing and bending cutter is matched with the bending baffle plate to bend the pins of the chip; and then in same station, the pin of chip is cut and bent in the same process to effectively improve the efficiency of the pin processing of cutting the pin of chip, once fix a position the pin of chip and accomplish the pin of chip and bend moreover, so can effectively solve the problem that the chip cuts the pin and bends the dimensional accuracy after shaping because of cutting the pin and bending the chip positioning error of two processing procedures.
Further, as shown in fig. 1 and 2, the bending baffle is located above the blade of the cutting pin, the end face of the cutting pin, which faces the cutter accommodating opening, forms a cutter inclined plane 3.343, the lower part of the cutter inclined plane is inclined towards the direction of the cutter accommodating opening, the junction part of the cutter inclined plane and the lower surface of the cutting pin, which bends the cutter, forms the cutting edge, and the junction part of the cutter inclined plane and the upper surface of the cutting pin, which bends the cutter, forms the bending part. Therefore, the cutting pin and bending of the chip pins can be realized through the cutter inclined plane of the same cutting pin bending cutter, the cutter structure can be further simplified, and the efficiency of the chip pin cutting and bending processing is improved.
The inclination angle of the cutter bevel is 75-88 degrees, and in this embodiment, the inclination angle of the cutter bevel is 85 degrees. The bending baffle is parallel to the pin shearing blade.
In this embodiment, a side of the pin cutting blade facing the pin bending cutter is provided with a pin cutting edge matched with the cutting edge, and a side of the bending baffle facing the pin bending cutter and the pin cutting edge are located on the same vertical plane.
Further, as shown in fig. 1 and 2, the automatic shaping mechanism of the IGBT chip of the new energy automobile further includes a floating gap eliminating device 3.4. The floating gap eliminating device comprises a reset spring, a third guide rail 3.41 which is arranged on the frame and is parallel to the first guide rail, a floating slide seat 3.42 which slides along the third guide rail, a floating column accommodating opening 3.43 which is arranged on the floating slide seat and has a downward opening, a vertical guide sleeve 3.48 which is arranged on the frame and is positioned below the floating slide seat, a floating column 3.49 which slides up and down along the vertical guide sleeve, a roller 3.410 which is arranged at the lower end of the floating column and a push plate 3.45 which is positioned below the floating column. The bending baffle and the pin shearing blade are both fixed on the floating slide seat. The push plate is fixed on the upper sliding seat, the upper surface of the push plate comprises a supporting plane 3.46 and a pushing inclined plane 3.47 which are matched with the roller, the supporting plane and the pushing inclined plane are distributed along the direction of the first guide rail, the supporting plane is parallel to the first guide rail, and the supporting plane is horizontally distributed. The side wall of the floating column accommodating opening is provided with a side wall inclined surface 3.44, the upper part of the floating column extends into the floating column accommodating opening, and the upper part of the floating column is provided with a floating column inclined surface 3.411 matched with the side wall inclined surface.
The floating slide seat moves away from the direction of the shearing pin bending cutter under the action of the reset spring, and the side wall inclined surface abuts against the floating column inclined surface. In this embodiment, the reset spring and the cutting blade are located at the same side of the floating slide, one end of the reset spring is propped against the frame, and the other end is propped against the floating slide. The return spring is not shown in the figures.
In the process that the translation actuating mechanism drives the upper sliding seat to move towards the direction of the cutter accommodating opening, the pushing inclined plane is contacted with the roller and pushes the floating column to move upwards along the vertical guide sleeve, and the floating sliding seat, the bending baffle and the pin shearing blade move towards the direction of the pin shearing cutter through the matching of the inclined plane of the floating column and the inclined plane of the side wall, then the roller is supported on the supporting plane, and in the process that the roller is supported on the supporting plane, the floating column keeps motionless, and the floating sliding seat, the bending baffle and the pin shearing blade also keep motionless.
In order to ensure that pins of a chip do not interfere with the bending baffle and the pin shearing blade in the process of vertically placing the chip on the chip positioning clamping jaw, a certain gap is reserved between the pins of the chip and the bending baffle and the pin shearing blade after the chip is placed and clamped on the chip positioning clamping jaw; moreover, as the pins of the chip can be bent at a small angle, the gap which needs to be reserved between the pins of the chip and the bending baffle and between the pins and the pin shearing blade can not be too small, and the gap is generally reserved for 1-2 mm; therefore, although the chips can be placed smoothly and clamped and fixed on the chip positioning clamping jaw, the chips cannot interfere with the bending baffle and the pin shearing blade; but at the same time, a gap of 1-2 mm exists between the pin of the chip fixed on the chip positioning clamping jaw, the bending baffle and the pin shearing blade; due to the gap, in the process that the translation executing mechanism drives the pin shearing and bending cutter to move into the cutter accommodating port, the shearing edge of the pin shearing and bending cutter firstly abuts against the pin of the chip until the pin of the chip abuts against the pin shearing blade, and in the process, the pin of the chip is bent, so that the problem of dimensional accuracy of the chip after the pin shearing and bending molding is affected; in order to solve the problem, the floating gap eliminating device is arranged, so that the chip can be placed and clamped on the chip positioning clamping jaw smoothly, and the problem that the dimensional accuracy of the chip after pin shearing and bending forming is affected due to the fact that a 1-2 mm gap exists between a pin of the chip fixed on the chip positioning clamping jaw and the bending baffle and the pin shearing blade is solved under the condition that the chip can not interfere with the bending baffle and the pin shearing blade is solved; in particular, the method comprises the steps of,
in the scheme, after the chip is placed and clamped and fixed on the chip positioning clamping jaw, gaps are reserved among pins of the chip, the bending baffle and the pin shearing blade, so that the chip can be placed and clamped and fixed on the chip positioning clamping jaw smoothly, and interference between the pins of the chip, the bending baffle and the pin shearing blade is avoided;
in the process that the translation executing mechanism drives the pin shearing and bending cutter to move into the cutter accommodating opening, the pushing inclined plane is firstly contacted with the roller and pushes the floating column to move upwards along the vertical guide sleeve, so that the inclined plane of the floating column is tightly abutted against the inclined plane of the side wall, and the floating sliding seat, the bending baffle and the pin shearing blade are pushed to move towards the pin shearing and bending cutter, so that the bending baffle and the pin shearing blade are close to the pin of the chip, then the roller is supported on the supporting plane, and at the moment, the gap between the pin of the chip and the bending baffle and the pin shearing blade is eliminated or greatly reduced; meanwhile, the floating column is kept motionless, the floating sliding seat, the bending baffle and the pin shearing blade are kept motionless, and then, in the process that the translation actuating mechanism is used for driving the upper sliding seat and the pin shearing and bending cutter to move along the second guide rail and enabling the pin shearing and bending cutter to move into the cutter accommodating opening, the roller is kept supported on the supporting plane; then, the shearing edge of the shearing foot bending cutter is matched with the shearing foot blade to realize shearing feet on the pins of the chip, and then the bending part of the shearing foot bending cutter is matched with the bending baffle plate to realize bending of the pins of the chip; therefore, the chip positioning clamping jaw is capable of being placed and clamped and fixed on the chip positioning clamping jaw smoothly, and the problem that the dimensional accuracy of the chip after the chip pin is bent and formed is affected due to the fact that a 1-2 mm gap exists between the pin of the chip fixed on the chip positioning clamping jaw and the bending baffle and the pin cutting blade is solved effectively under the condition that the chip can not interfere with the bending baffle and the pin cutting blade.
Further, a floating column limiting block 3.412 is arranged on the outer side face of the floating column, and the floating column limiting block is located above the vertical guide sleeve. So, the translation actuating mechanism drives the upper sliding seat and the shearing foot bending cutter to move in the direction away from the cutter accommodating opening, and after the push plate is separated from the roller, the floating column moves downwards under the action of dead weight until the limiting block of the floating column abuts against the vertical guide sleeve; simultaneously, the floating sliding seat moves away from the direction of the shearing pin bending cutter under the action of the reset spring.
Further, the automatic shaping mechanism of the IGBT chip of the new energy automobile further comprises an upper and lower manipulator, and the upper and lower manipulator is used for grabbing the chip. The feeding and discharging mechanical arm grabs the chips (the chips are vertically distributed) to be bent by the pins to be cut, places the chips to be bent by the pins to be cut at the chip positioning clamping jaw, and clamps and fixes the chips to be bent by the pins to be cut on the chip positioning clamping jaw so as to realize automatic feeding of the chips; in the same way, after the chip is sheared and bent, the feeding and discharging manipulator grabs the chip at the chip positioning clamping jaw (the chip after the shearing and bending is completed), and takes away the chip, so that automatic discharging is realized.
The foregoing description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and any simple modification, variation and equivalent transformation of the above embodiment according to the technical substance of the present invention still fall within the scope of the technical solution of the present invention.
Claims (8)
1. The utility model provides a new energy automobile IGBT chip automatic molding mechanism which characterized in that includes:
a frame;
the cutting pin advancing and retreating mechanism comprises a first guide rail arranged on the frame, a main sliding seat sliding along the first guide rail and an advancing and retreating executing mechanism arranged on the frame and used for driving the main sliding seat to move;
the chip positioning device comprises a chip positioning clamping jaw arranged on the main sliding seat, and the chip positioning clamping jaw is used for clamping and fixing a chip of which the pin to be sheared is bent;
the chip pin shearing and bending one-time forming mechanism comprises a pin shearing and bending cutter assembly, a second guide rail, an upper slide seat and a translation actuating mechanism, wherein the second guide rail is arranged on the main slide seat and is parallel to the first guide rail, the upper slide seat slides along the second guide rail, the translation actuating mechanism is arranged on the frame and is used for driving the upper slide seat to move, the pin shearing and bending cutter assembly comprises a pin shearing and bending cutter arranged on the upper slide seat, a pin shearing blade and a bending baffle plate arranged on the frame, a cutter accommodating opening is formed between the pin shearing blade and the bending baffle plate, the pin shearing and bending cutter comprises a shearing blade matched with the pin shearing blade and a bending part matched with the bending baffle plate, the cutter accommodating opening and the pin shearing and bending cutter are distributed along the moving direction of the main slide seat, and the opening of the cutter accommodating opening faces the pin shearing and bending cutter;
the translation actuating mechanism is used for driving the upper sliding seat and the shearing foot bending cutter to move along the second guide rail and enabling the shearing foot bending cutter to move into the cutter accommodating opening; in the process that the pin shearing and bending cutter moves into the cutter accommodating opening, the shearing edge of the pin shearing and bending cutter is matched with the pin shearing blade to shear pins of the chip, and then the bending part of the pin shearing and bending cutter is matched with the bending baffle plate to bend the pins of the chip;
the bending baffle is positioned above the cutter blade, the end face of the cutter blade, which faces the cutter accommodating opening, forms a cutter inclined plane, the lower part of the cutter inclined plane inclines towards the direction of the cutter accommodating opening, the joint part of the cutter inclined plane and the lower surface of the cutter blade forms the cutting edge, and the joint part of the cutter inclined plane and the upper surface of the cutter blade forms the bending part.
2. The automatic shaping mechanism of the IGBT chip of the new energy automobile according to claim 1, wherein the inclination angle of the cutter inclined plane is 75-88 degrees.
3. The automatic shaping mechanism of the new energy automobile IGBT chip according to claim 1 or 2, further comprising a floating gap eliminating device, wherein the floating gap eliminating device comprises a reset spring, a third guide rail which is arranged on the frame and is parallel to the first guide rail, a floating slide seat sliding along the third guide rail, a floating column accommodating opening which is arranged on the floating slide seat and is downward in an opening, a vertical guide sleeve which is arranged on the frame and is positioned below the floating slide seat, a floating column sliding up and down along the vertical guide sleeve, a roller arranged at the lower end of the floating column and a push plate positioned below the floating column, the bending baffle and the foot shearing blade are both fixed on the floating slide seat, the push plate is fixed on the upper slide seat, the upper surface of the push plate comprises a supporting plane and a pushing inclined plane which are matched with the roller, the supporting plane is parallel to the first guide rail, a side wall inclined plane is arranged on the side wall of the floating column accommodating opening, the upper part of the floating column stretches into the floating column accommodating opening, the upper part of the floating column is provided with a floating column inclined plane matched with the side wall inclined plane, and the bending baffle and the shearing blade moves away from the inclined plane of the cutter in the direction of the reset spring;
in the process that the translation actuating mechanism drives the upper sliding seat to move towards the direction of the cutter accommodating opening, the pushing inclined plane is contacted with the roller and pushes the floating column to move upwards along the vertical guide sleeve, and the floating sliding seat, the bending baffle and the pin shearing blade move towards the direction of the pin shearing cutter through the matching of the inclined plane of the floating column and the inclined plane of the side wall, then the roller is supported on the supporting plane, and in the process that the roller is supported on the supporting plane, the floating column keeps motionless, and the floating sliding seat, the bending baffle and the pin shearing blade also keep motionless.
4. The automatic shaping mechanism of the IGBT chip of the new energy automobile according to claim 3, wherein a floating column limiting block is arranged on the outer side face of the floating column and is positioned above the vertical guide sleeve.
5. The automatic shaping mechanism of the IGBT chip of the new energy automobile according to claim 1 or 2, wherein a shearing blade matched with the shearing blade is arranged on one side of the shearing blade facing to the shearing bending cutter, and the side of the bending baffle facing to the shearing bending cutter is positioned on the same vertical plane with the shearing blade.
6. The automatic shaping mechanism of the IGBT chip of the new energy automobile according to claim 1 or 2, wherein the chip positioning clamping jaw is a pneumatic finger, two clamping fingers of the pneumatic finger are respectively provided with a clamping block, and two opposite side surfaces of the clamping blocks on the two clamping fingers are respectively provided with an elastic plate.
7. The automatic shaping mechanism for the IGBT chip of the new energy automobile according to claim 1 or 2, wherein the pin cutting advancing and retreating mechanism further comprises a main sliding seat limiting block arranged on the frame, and the main sliding seat limiting block and the pin cutting blade are positioned on the same side of the main sliding seat.
8. The automatic shaping mechanism for the IGBT chips of the new energy automobile according to claim 1 or 2, further comprising an upper and lower feeding mechanical arm, wherein the upper and lower feeding mechanical arm is used for grabbing the chips.
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| CN113130353A (en) | 2021-07-16 |
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