CN113125859A - Packaging structure for testing shielding effectiveness and shielding effectiveness testing method - Google Patents
Packaging structure for testing shielding effectiveness and shielding effectiveness testing method Download PDFInfo
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- CN113125859A CN113125859A CN202110259173.5A CN202110259173A CN113125859A CN 113125859 A CN113125859 A CN 113125859A CN 202110259173 A CN202110259173 A CN 202110259173A CN 113125859 A CN113125859 A CN 113125859A
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- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/08—Measuring electromagnetic field characteristics
- G01R29/0807—Measuring electromagnetic field characteristics characterised by the application
- G01R29/0814—Field measurements related to measuring influence on or from apparatus, components or humans, e.g. in ESD, EMI, EMC, EMP testing, measuring radiation leakage; detecting presence of micro- or radiowave emitters; dosimetry; testing shielding; measurements related to lightning
- G01R29/0835—Testing shielding, e.g. for efficiency
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Abstract
The application provides a packaging structure for testing shielding effectiveness and a method for testing shielding effectiveness, wherein the packaging structure comprises a base body, the base body is an insulator, at least one first metal layer is paved in the base body, the base body is provided with a first connecting piece and a second connecting piece, and the first connecting piece is electrically connected with the first metal layer; the transmitting antenna is arranged on the upper surface of the base body, the second connecting piece is electrically connected with the transmitting antenna, and the transmitting antenna is positioned on the upper side of the first metal layer; and the plastic packaging layer is arranged on the substrate and wraps the transmitting antenna. This application is used for testing shielding effectiveness's test sample's structure through improving, makes test sample more press close to actual work scene, uses the test sample after the improvement to test promptly the packaging structure in this application, can obtain shielding effectiveness's test result more accurately.
Description
Technical Field
The application belongs to the technical field of shielding effectiveness testing, and particularly relates to a packaging structure for testing shielding effectiveness and a method for testing shielding effectiveness.
Background
SIP packaging is increasingly used in a wide variety of applications, particularly in some wearable products, due to its advantages of higher integration and miniaturization. However, the reduction of the chip-to-chip distance due to the integration and miniaturization of SIP causes some problems. For example, if the SIP incorporates radio frequency, high-speed signal and switching power supply, serious electromagnetic interference (EMI) problem may be caused, which may affect the normal operation of the device. To solve the above problem of magnetic interference, a shielding structure needs to be disposed on the package through a shielding process to prevent the components in the package from being magnetically interfered. Different shielding structures are tested before they are used.
The existing test method is mainly characterized in that a metal shielding layer is sputtered on a circular substrate to serve as a test sample, and the test sample is placed in a flange coaxial bracket for testing, but the test result of the sample for testing has large error, so that the test result is inaccurate; in addition, plane waves are used as an excitation source in the scheme, namely, only the shielding effect on far-field interference is considered, the shielding effect on near-field interference is not considered, meanwhile, the shielding effectiveness under a sub-cavity shielding scene cannot be considered in the scheme, and the test form is single.
Disclosure of Invention
The present application aims to provide a package structure for testing shielding effectiveness and a method for testing shielding effectiveness, which solve the problem of inaccurate testing result of shielding effectiveness.
According to a first aspect of the present application, there is provided a package structure for testing shielding effectiveness, comprising:
the substrate is an insulator, at least one first metal layer is paved in the substrate, the substrate is provided with a first connecting piece and a second connecting piece, and the first connecting piece is electrically connected with the first metal layer;
the transmitting antenna is arranged on the upper surface of the base body, the second connecting piece is electrically connected with the transmitting antenna, and the transmitting antenna is positioned on the upper side of the first metal layer;
the plastic packaging layer is arranged on the substrate and wraps the transmitting antenna; wherein the content of the first and second substances,
the plastic packaging layer and the base body are used for arranging a metal shielding structure.
Optionally, a first metal shielding layer is continuously disposed on the plastic package layer and at least a portion of the outer surface of the substrate, and the first metal shielding layer is connected to the first metal layer.
Optionally, the package structure further includes a receiving antenna and a third connecting member, the receiving antenna and the third connecting member are disposed on the substrate, the third connecting member is electrically connected to the receiving antenna, and the plastic package layer covers the receiving antenna;
the plastic packaging layer is provided with an opening penetrating through the plastic packaging layer, and the opening is arranged between the transmitting antenna and the receiving antenna.
Optionally, the package structure further includes a second metal layer disposed on the substrate, the second metal layer is disposed on an upper side of the first metal layer and electrically connected to the first metal layer, and the second metal layer is exposed to an external environment through the opening.
Optionally, a first metal shielding layer is continuously disposed on the plastic package layer and at least a portion of the outer surface of the base, a second metal shielding layer is disposed in the opening, the first metal shielding layer is connected to the first metal layer, and the second metal shielding layer is configured to be connected to a reference ground.
Optionally, the package structure includes a third metal layer, the third metal layer is laid in the substrate, the third metal layer is disposed on the lower side of the first metal layer, and the first connector is electrically connected to the first metal layer through the third metal layer.
Optionally, the package structure further includes a circuit board, the first connector is connected to a reference ground on the circuit board, and the second connector is electrically connected to the circuit board.
Optionally, the package structure further includes a circuit board, the first connector is connected to a reference ground on the circuit board, the second connector is electrically connected to the circuit board, and the third connector is electrically connected to the circuit board.
According to a second aspect of the present application, there is provided a method for testing shielding effectiveness, which is applied to the package structure for testing shielding effectiveness described above, the method includes:
connecting the emitting end of the detection device with the second connecting piece, and connecting the first connecting piece with a reference ground;
obtaining test parameters when the detection end of the detection device is positioned at a test position;
arranging a metal shielding structure outside the packaging structure through a shielding process, so that the metal shielding structure is connected with a reference ground;
obtaining shielding parameters when the detection end of the detection device is positioned at the test position;
and comparing or calculating the test parameters and the shielding parameters to obtain shielding effectiveness parameters.
Optionally, the metal shielding structure includes a first metal shielding layer continuously disposed on the molding layer and at least a portion of the outer surface of the substrate.
Optionally, the test position includes a position where a detection end of the detection device is far away from the package structure; alternatively, the first and second electrodes may be,
the test position comprises a position where the detection end of the detection device is close to the packaging structure.
Optionally, the package structure further includes a receiving antenna and a third connecting member, where the receiving antenna and the third connecting member are disposed on the substrate, the third connecting member is electrically connected to the receiving antenna, the receiving antenna is covered by the plastic package layer, an opening penetrating through the plastic package layer is formed in the plastic package layer, and the opening is disposed between the transmitting antenna and the receiving antenna;
the metal shielding structure comprises a first metal shielding layer and a second metal shielding layer, wherein the first metal shielding layer is continuously arranged on the plastic packaging layer and at least part of the outer surface of the base body, and the second metal shielding layer is arranged in the opening.
Optionally, the test position includes a position where the detection end of the detection device is connected to the third connecting member.
The technical effect of the application lies in that, through improving the structure of the test sample for testing the shielding effectiveness, the test sample is closer to the actual working scene, and the test result of the shielding effectiveness can be more accurately obtained by using the improved test sample for testing.
Further features of the present application and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which is to be read in connection with the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and together with the description, serve to explain the principles of the application.
FIG. 1 is a cross-sectional view of a package structure for testing shielding effectiveness provided herein;
FIG. 2 is a plan view of the substrate under the first embodiment;
FIG. 3 is a bottom view of the base;
FIG. 4 is a top view of the substrate under the second embodiment;
FIG. 5 is a top view of the substrate under a third embodiment;
FIG. 6 is a cross-sectional view of a package structure with an opening in the molding layer;
FIG. 7 is a cross-sectional view of a package structure with a second metal shielding layer disposed in an opening of a plastic package layer;
fig. 8 is a cross-sectional view of a package structure provided with a first metallic shield layer and a second metallic shield layer;
fig. 9 is a cross-sectional view of a package structure with a molding layer without an opening disposed on a circuit board;
FIG. 10 is a far field disturbance test schematic for a package structure;
FIG. 11 is a schematic diagram of near field interference testing of a package structure;
fig. 12 is a cross-sectional view of a package structure with an opening in a molding layer disposed on a circuit board;
FIG. 13 is a schematic illustration of a split cavity shielding test.
Reference numerals:
1. a substrate; 2. a first metal layer; 3. a second metal layer; 4. a third metal layer; 5. a first connecting member; 6. a second connecting member; 7. a third connecting member; 8. a plastic packaging layer; 9. a transmitting antenna; 10. a receiving antenna; 11. a PA amplifier; 12. an LNA amplifier; 13. a first resistor; 14. a second resistor; 15. an opening; 16. a circuit board; 17. a first connection portion; 18. a second connecting portion; 19. a third connecting portion; 20. a first joint; 21. a second joint; 22. a detection device; 23. a transmitting end; 24. a detection end; 25. a first metal shielding layer; 26. and a second metal shielding layer.
Detailed Description
Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the application, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
As shown in fig. 1 to 5, the present application provides a package structure for testing shielding effectiveness, which includes a substrate 1, a transmitting antenna 9 and a molding layer 8. The substrate 1 is an insulator, so that electronic elements arranged on the substrate 1 can be prevented from being conducted with each other, and the substrate plays a role in bearing other parts on the packaging structure. At least one layer of first metal layer 2 is laid in the base body 1, preferably, the first metal layer 2 is distributed on the cross section of the whole base body 1 in the horizontal direction, that is, the peripheral edge of the first metal layer 2 can be observed from the side wall of the base body 1, and the peripheral edge of the first metal layer 2 is continuously arranged, so that the connection with the metal shielding structure is conveniently realized in the subsequent step of arranging the metal shielding structure. And base member 1 has first connecting piece 5 and second connecting piece 6, first connecting piece 5 and second connecting piece 6 all set up in packaging structure's surface, are convenient for communicate with outer wall equipment, and first connecting piece 5 and second connecting piece 6 can set up the lower bottom surface at base member 1. The first connecting piece 5 is electrically connected with the first metal layer 2, so that the first metal layer 2 can be electrically connected with external equipment in the base body 1, preferably, a through hole can be formed in the base body 1, and the first connecting piece 5 is connected with the first metal layer 2 in the base body 1 through the through hole, so that the whole packaging structure is modularized, and the subsequent operation is simpler and more convenient.
The transmitting antenna 9 is disposed on the upper surface of the substrate 1, for example, the transmitting antenna 9 is disposed on the upper surface of the substrate 1, the shape of the transmitting antenna 9 may be various shapes, such as a spiral shape, an L shape, or a serpentine shape, and the spiral transmitting antenna 9 has better effect than other antennas. The second connecting piece 6 with the transmitting antenna 9 electricity is connected, and is the same, can be provided with the via hole in base member 1, the second connecting piece 6 passes through the via hole with the transmitting antenna 9 electricity is connected, transmitting antenna 9 is located first metal level 2 upside, promptly the one side of first metal level 2 with transmitting antenna 9 is just right, when being convenient for set up the metallic shield structure on packaging structure, makes and forms a shielding space between metallic shield structure and the first metal level 2, sets up transmitting antenna 9 in the shielding space and realizes the shielding to the radiation that transmitting antenna 9 sent.
The plastic package layer 8 is arranged on the substrate 1, and the transmitting antenna 9 is wrapped by the plastic package layer 8, so that the transmitting antenna 9 is protected, and a metal shielding structure is more convenient to arrange. The plastic packaging layer 8 and the base body 1 are used for arranging a metal shielding structure, namely the plastic packaging layer 8 and the base body 1 are used for bearing the metal shielding structure, the whole packaging structure is used for testing the shielding effectiveness of the metal shielding structure, and the metal shielding structure can be arranged on the plastic packaging layer 8 and the outer surface of the base body 1 and also can be arranged inside the plastic packaging layer 8 and the base body 1.
The existing test sample for testing the shielding effectiveness is a circular substrate, and the metal shielding layer is arranged on the substrate in a sputtering mode and the like, so that the actual application scene of the metal shielding layer is not considered in the situation, and the test result is inaccurate.
And this application is through improving the structure of the test sample who is used for testing shielding efficiency, adjusts the structure of test sample to three-dimensional form, makes test sample more press close to actual work scene, uses the test sample after the improvement to test and can more accurately obtains the test result of shielding efficiency, is favorable to selecting the better metal shielding structure of effect and sets up the technology of metal shielding structure, guarantees the shielding efficiency of final product, wherein, detection device 22 can be vector network analyzer.
Furthermore, in the existing scheme, plane waves are used as an excitation source, that is, only the shielding effect on far-field interference is considered, but the shielding effect on near-field interference is not considered, the transmitting antenna 9 is arranged on the packaging structure of the present application, the transmitting antenna 9 can be used as a radiation source, whether the packaging structure shields radiation or not can be detected from the outside of the packaging structure, the far-field shielding effect and the near-field shielding effect can be tested by using the same packaging structure in different scenes, and the shielding effects in different scenes can be tested; simultaneously, the current scheme need use flange coaxial bracket to test circular shape base plate, and this equipment price is more expensive, and the packaging structure of this application need not use above-mentioned flange coaxial bracket when the test, can save the test cost.
Further, the packaging structure comprises a PA amplifier 12LNA11PA, the PA amplifier 12LNA11PA is disposed on the base body 1, the second connecting piece 6 is connected with the transmitting antenna 9 through the PA amplifier 12LNA11PA, and the PA amplifier 12LNA11PA is used for increasing the transmitting power of the antenna, which is beneficial to detecting radiation; the packaging structure further comprises a first resistor 13, the first resistor 13 is arranged on the base body 1, the first resistor 13 is electrically connected with the transmitting antenna 9, signal reflection can be reduced, broadband measurement is achieved, and the first resistor 13 is preferably a 50-ohm resistor.
Optionally, the plastic package layer 8 and at least part of the outer surface of the base 1 are continuously provided with a first metal shielding layer 25, the first metal shielding layer 25 is connected with the first metal layer 2, and the first metal layer 2 is communicated with a reference ground during actual testing, so that a shielding space can be formed between the first metal shielding layer 25 and the first metal layer 2, and a shielding effect of the package structure is ensured. The first metal shielding layer 25 can be disposed on the plastic sealing layer 8 and at least a portion of the outer surface of the substrate 1 by sputtering, spraying, electroplating, etc., and the first metal shielding layer 25 has high electrical conductivity. Preferably, the first metal shielding layer 25 is connected to the peripheral edge of the first metal layer 2, so that the first metal shielding layer 25 and the first metal layer 2 together enclose a shielding space, where the first metal shielding layer 25 may be a conformal shielding structure.
Optionally, as shown in fig. 6 to 8, the package structure further includes a receiving antenna 10 and a third connecting member 7, the receiving antenna 10 and the third connecting piece 7 are arranged on the base body 1, the receiving antenna 10 and the transmitting antenna 9 can be arranged on the same surface of the base body 1, so that the subsequent arrangement of a metal shielding structure is convenient, the third connecting member 7 may be disposed on the same surface of the base body 1 as the first connecting member 5 and the second connecting member 6 to facilitate connection with an external device, the third connecting member 7 is electrically connected to the receiving antenna 10, and similarly, a through-hole may be provided in the base body 1, through which an electrical connection between the third connection member 7 and the reception antenna 10 is achieved, the plastic package layer 8 wraps the receiving antenna 10, so that the receiving antenna 10 is protected conveniently, and meanwhile, the first metal shielding layer 25 wraps the receiving antenna 10 conveniently. Be provided with receiving antenna 10, can make the packaging structure of this application have transmitting antenna 9 and receiving antenna 10 simultaneously, for the branch chamber shielding in the same packaging structure of test provides convenient condition, make the packaging structure of this application have the variety of function.
Have on the plastic envelope layer 8 and run through the opening 15 of plastic envelope layer 8, just opening 15 sets up transmitting antenna 9 with between the receiving antenna 10, can set up metallic shield structure in foretell opening 15, divide the chamber to shield and provide structural support for realizing the test in packaging structure, preferably, above-mentioned opening 15 divides whole plastic envelope layer 8 into two parts, and partly 8 claddings of plastic envelope layer have transmitting antenna 9, and partly 8 claddings of plastic envelope layer have receiving antenna 10, when setting up metallic shield structure in opening 15, can guarantee that packaging structure has comparatively preferred shielding effect.
It should be noted that the sub-cavity shielding means that a relatively large number of electronic components are arranged in one package structure, radiation may be generated between the electronic components to affect other components in the same package structure, and at this time, a component emitting radiation and a component affected by the radiation need to be shielded, and this shielding is the sub-cavity shielding.
Further, the package structure comprises an LNA amplifier 12LNA11PA, the LNA amplifier 12LNA11PA is disposed on the base body 1, and the third connecting member 7 is electrically connected to the receiving antenna 10 through the LNA amplifier 12LNA11PA for amplifying a receiving signal and facilitating the receiving signal; the packaging structure comprises a second resistor 14, the second resistor 14 is arranged on the substrate 1, the second resistor 14 is electrically connected with the receiving antenna 10, signal reflection can be reduced, broadband measurement is achieved, and the second resistor 14 is preferably a 50 Ω resistor.
Optionally, the package structure further includes a second metal layer 3, the second metal layer 3 is disposed on the substrate 1, the second metal layer 3 is disposed on the upper side of the first metal layer 2 and electrically connected to the first metal layer 2, and the second metal layer 3 is exposed to the external environment through the opening 15, wherein the first metal layer 2 is connected to the reference ground, the second metal layer 3 is connected to the first metal layer 2 so as to extend the reference ground to the surface of the substrate 1 where the antenna is disposed, and the second metal layer 3 is connected to the external environment through an opening 15 formed in the molding layer 8, so that the metal shielding structure in the opening 15 is connected to the second metal layer 3 so as to ground the metal shielding structure disposed in the opening 15, which preferably achieves the effect of sub-cavity shielding, and certainly the second metal layer 3 may not be disposed, and the metal shielding structure disposed in the opening 15 can form an electrical connection with the first metal shielding structure disposed on the external surface, the effect of the partial cavity shielding can also be achieved, but the former effect is superior to the latter effect.
Optionally, the plastic package layer 8 and at least a part of the outer surface of the base 1 are continuously provided with a first metal shielding layer 25, the opening 15 is provided with a second metal shielding layer 26, the first metal shielding layer 25 is connected to the first metal layer 2, the second metal shielding layer 26 is configured to be connected to a reference ground, in this case, when the first metal shielding layer 25 passes through the opening 15 formed in the plastic package layer 8, the first metal shielding layer 25 and the second metal shielding layer 26 form a connection relationship, so that the first metal shielding layer 25 and the second metal shielding layer are simultaneously the reference ground, thereby ensuring a shielding effect, and meanwhile, the second metal shielding layer 26 may also be connected to the second metal layer 3 disposed on the base 1, which enables the package structure to have a better shielding effect. In addition, the second metal layer 3 is preferably silver, and silver paste is disposed in the opening 15 when the second metal shielding layer 26 is disposed, so that a better shielding effect can be achieved.
Optionally, the packaging structure includes third metal level 4, third metal level 4 lays in the base member 1, third metal level 4 can be for the setting mode the same with first metal level 2, makes the circumference lateral wall of third metal level 4 reveal at the surface of base member 1, third metal level 4 sets up first metal level 2 downside, first connecting piece 5 passes through third metal level 4 with first metal level 2 electricity is connected, makes to be provided with two-layer metal level in the base member 1, that is to say is provided with the shielding layer of two-layer ground connection in base member 1, can guarantee better shielding effect, reduces the influence of the setting of base member 1 itself to metal shielding structure shielding performance test, has further promoted the accuracy of shielding effectiveness test.
Optionally, as shown in fig. 9 and 12, the package structure further includes a circuit board 16, the first connecting element 5 is connected to a reference ground on the circuit board 16, the second connecting element 6 is electrically connected to the circuit board 16, and when testing, the transmitting end 23 of the detecting device 22 is connected to the circuit board 16, and the circuit board 16 can communicate the transmitting end 23 with the second connecting element 6, that is, the circuit board 16 is used as an adaptor, so that the external device is connected to the package structure through the circuit board 16, because the package structure is manufactured in an actual installation, the package structure has a small size and cannot be connected to a plug of the external device, and the circuit board 16 is used as an adaptor, so that the electrical connection between the external device and the package structure can be conveniently achieved.
Optionally, the package structure further includes a circuit board 16, the first connecting element 5 is connected to a reference ground on the circuit board 16, the second connecting element 6 is electrically connected to the circuit board 16, and the third connecting element 7 is electrically connected to the circuit board 16, where the circuit board 16 in this embodiment has the same function as the circuit board 16 mentioned above, and only the package structure is different and the connection relationship in the circuit board 16 is different, which is not described herein again.
Further, a first connecting portion 17, a second connecting portion 18 and a first connector 20 are arranged on the circuit board 16, the first connecting portion 17 is a reference ground, and the second connecting portion 18 is electrically connected with the first connector 20; the first connecting portion 17 is electrically connected to the first connecting member 5, the second connecting portion 18 is electrically connected to the second connecting member 6, meanwhile, the circuit board 16 may also have a third connecting portion 19 and a second connector 21, the third connecting portion 19 is electrically connected to the third connecting member 7, and when the circuit board 16 is used as an adaptor, the package structure and an external device are electrically connected through the first connector 20 and the second connector 21 on the circuit board 16.
The application provides a method for testing shielding effectiveness, which is applied to the packaging structure for testing shielding effectiveness, and the method comprises the following steps:
the emitting end 23 of the detecting means 22 is connected to said second connection 6 and said first connection 5 is connected to a reference ground.
The transmitting end 23 of the detecting device 22 can send out an excitation signal, the second end of the detecting device 22 is connected with the second connecting piece 6, the excitation signal can be transmitted to the transmitting antenna 9, the transmitting antenna 9 radiates outwards, the first connecting piece 5 is connected with the first metal layer 2, the first metal layer 2 can be grounded, and further, the detecting device 22 and the packaging structure can be connected through the circuit board 16 as a transit piece.
Test parameters are obtained when the testing end 24 of the testing device 22 is in the testing position.
The test parameters are parameters of antenna radiation detected at a test position when the package structure is not provided with the shielding layer, and the test parameters are used for comparing or calculating shielding effectiveness. The obtained test parameters may be preset and labeled together with the package structure, or may be obtained by performing a field test when the shielding effectiveness is measured, and the values of the test parameters may be directly read from the detection device 22, so that the accuracy of the test parameters of the field test may be better.
And a metal shielding structure is arranged outside the packaging structure through a shielding process, so that the metal shielding structure is connected with a reference ground, and the metal shielding structure can block radiation emitted from the transmitting antenna 9 to the outside of the metal shielding structure.
The shielding parameters are obtained when the detection end 24 of the detection device 22 is in the test position.
When the transmitting antenna 9 emits radiation outwards, the detecting end 24 of the detecting device 22 is located at the testing position to obtain the shielding parameter, and the shielding parameter can be directly read from the detecting device 22.
Comparing or calculating the test parameters and the shielding parameters to obtain shielding effectiveness parameters, for example, the shielding effectiveness can be calculated by using the test parameters and the shielding parameters through a specific formula; the shielding effectiveness can also be obtained by comparing the test parameters with the shielding parameters, and a detection method is provided for the packaging structure of the application.
Optionally, the metal shielding structure comprises a first metal shielding layer 25 continuously disposed on the molding compound layer 8 and at least a portion of the outer surface of the substrate 1, that is, the first metal shielding layer 25 is disposed only on the outer surface of the package structure.
Alternatively, as shown in fig. 10, the testing position includes a position where the detecting end 24 of the detecting device 22 is far away from the package structure, and in this case, the far-field shielding effectiveness is tested, specifically, the detecting end 24 of the detecting device 22 may be one meter away from the package structure and the parameters are tested and obtained, and in the case of testing the far-field shielding effectiveness, the detecting end 24 of the detecting device 22 may be an antenna.
Alternatively, as shown in fig. 11, the testing position includes a position where the detecting end 24 of the detecting device 22 is close to the package structure, and at this time, the near field shielding effectiveness is tested, specifically, the detecting end 24 of the detecting device 22 may be tested and parameters may be obtained under a condition of being close to the upper surface of the package structure, and the detecting end 24 of the detecting device 22 may be a magnetic probe under a condition of testing the near field shielding effectiveness.
Further, in the case where the metal shielding structure includes the first metal shielding layer 25 and the second metal shielding layer 26, the far-field shielding effectiveness and the near-field shielding effectiveness of the package structure may also be tested; the testing of far field shielding effectiveness and near field shielding effectiveness is preferably performed in an EMC darkroom.
Optionally, the package structure further includes a receiving antenna 10 and a third connecting member 7, the receiving antenna 10 and the third connecting member 7 are disposed on the substrate 1, the third connecting member 7 is electrically connected to the receiving antenna 10, the receiving antenna 10 is covered by the molding compound layer 8, an opening 15 penetrating through the molding compound layer 8 is formed in the molding compound layer 8, and the opening 15 is disposed between the transmitting antenna 9 and the receiving antenna 10; the metal shielding structure comprises a first metal shielding layer 25 continuously arranged on the plastic package layer 8 and at least a part of the outer surface of the base body 1, and a second metal shielding layer 26 arranged in the opening 15, namely, the package structure is tested for shielding effectiveness under the condition that the package structure is provided with the first metal shielding layer 25 and the second metal shielding layer 26 and is provided with the receiving antenna 10.
As shown in fig. 13, the testing position includes a position where the detecting end 24 of the detecting device 22 is connected to the third connecting member 7, that is, the receiving antenna 10 on the package structure is used as the detecting end 24 of the monitoring device, that is, the transmitting antenna 9 in the package structure is used to emit radiation, and the antenna in the package structure is used to receive radiation, so that the cavity shielding performance of the package structure can be tested.
Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present application. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the present application. The scope of the application is defined by the appended claims.
Claims (13)
1. A package structure for testing shielding effectiveness, comprising:
the substrate is an insulator, at least one first metal layer is paved in the substrate, the substrate is provided with a first connecting piece and a second connecting piece, and the first connecting piece is electrically connected with the first metal layer;
the transmitting antenna is arranged on the upper surface of the base body, the second connecting piece is electrically connected with the transmitting antenna, and the transmitting antenna is positioned on the upper side of the first metal layer;
the plastic packaging layer is arranged on the substrate and wraps the transmitting antenna; wherein the content of the first and second substances,
the plastic packaging layer and the base body are used for arranging a metal shielding structure.
2. The package structure for testing shielding effectiveness of claim 1, wherein the molding compound layer and at least a portion of the outer surface of the substrate are continuously disposed with a first metal shielding layer, and the first metal shielding layer is connected to the first metal layer.
3. The package structure for testing shielding effectiveness of claim 1, further comprising a receiving antenna and a third connecting member, wherein the receiving antenna and the third connecting member are disposed on the substrate, the third connecting member is electrically connected to the receiving antenna, and the plastic encapsulation layer encapsulates the receiving antenna;
the plastic packaging layer is provided with an opening penetrating through the plastic packaging layer, and the opening is arranged between the transmitting antenna and the receiving antenna.
4. The package structure for testing shielding effectiveness of claim 3, further comprising a second metal layer disposed on the substrate, wherein the second metal layer is disposed on the first metal layer and electrically connected to the first metal layer, and the second metal layer is exposed to an external environment through the opening.
5. The package structure for testing shielding effectiveness according to claim 3, wherein a first metal shielding layer is continuously disposed on the molding compound layer and at least a portion of the outer surface of the substrate, and a second metal shielding layer is disposed in the opening, the first metal shielding layer being connected to the first metal layer, and the second metal shielding layer being configured to be connected to a reference ground.
6. The package structure for testing shielding effectiveness of claim 1, wherein the package structure comprises a third metal layer, the third metal layer is disposed in the substrate, the third metal layer is disposed under the first metal layer, and the first connecting member is electrically connected to the first metal layer through the third metal layer.
7. The package structure for testing shielding effectiveness of any one of claims 1-2, further comprising a circuit board, wherein the first connector is electrically connected to a ground reference on the circuit board, and the second connector is electrically connected to the circuit board.
8. The package structure for testing shielding effectiveness of any one of claims 3 to 5, further comprising a circuit board, wherein the first connector is electrically connected to a ground reference on the circuit board, the second connector is electrically connected to the circuit board, and the third connector is electrically connected to the circuit board.
9. A method for testing shielding effectiveness, applied to the package structure for testing shielding effectiveness according to any one of claims 1 to 8, the method comprising:
connecting the emitting end of the detection device with the second connecting piece, and connecting the first connecting piece with a reference ground;
obtaining test parameters when the detection end of the detection device is positioned at a test position;
arranging a metal shielding structure outside the packaging structure through a shielding process, so that the metal shielding structure is connected with a reference ground;
obtaining shielding parameters when the detection end of the detection device is positioned at the test position;
and comparing or calculating the test parameters and the shielding parameters to obtain shielding effectiveness parameters.
10. The method for testing shielding effectiveness of claim 9, wherein the metallic shielding structure comprises a first metallic shielding layer continuously disposed on the molding compound layer and at least a portion of the outer surface of the substrate.
11. The method for testing shielding effectiveness of claim 10, wherein the testing position includes a position where a testing end of the testing device is far away from the package structure; alternatively, the first and second electrodes may be,
the test position comprises a position where the detection end of the detection device is close to the packaging structure.
12. The method for testing shielding effectiveness of claim 9, wherein the package structure further comprises a receiving antenna and a third connecting member, the receiving antenna and the third connecting member are disposed on the substrate, the third connecting member is electrically connected to the receiving antenna, the receiving antenna is covered by the molding compound, the molding compound has an opening penetrating through the molding compound, and the opening is disposed between the transmitting antenna and the receiving antenna;
the metal shielding structure comprises a first metal shielding layer and a second metal shielding layer, wherein the first metal shielding layer is continuously arranged on the plastic packaging layer and at least part of the outer surface of the base body, and the second metal shielding layer is arranged in the opening.
13. The method for testing shielding effectiveness of claim 12, wherein the testing position includes a position where a testing end of the testing device is connected to the third connecting member.
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100144201A1 (en) * | 2008-12-05 | 2010-06-10 | Defibaugh George R | Electrical connector system |
| CN102944780A (en) * | 2012-11-06 | 2013-02-27 | 西安开容电子技术有限责任公司 | Testing method for shielding effectiveness of small-size shielding cavity |
| CN107843793A (en) * | 2017-11-24 | 2018-03-27 | 广州力赛计量检测有限公司 | A kind of testing jig, shield effectiveness test system and its method of testing |
| CN110707072A (en) * | 2019-09-06 | 2020-01-17 | 华为机器有限公司 | System-in-package module and terminal equipment |
| CN111415913A (en) * | 2020-04-09 | 2020-07-14 | 环维电子(上海)有限公司 | Selective packaging SIP module with electromagnetic shielding structure and preparation method thereof |
| CN111446175A (en) * | 2020-04-07 | 2020-07-24 | 华进半导体封装先导技术研发中心有限公司 | Radio frequency chip integrated packaging structure and preparation method thereof |
| CN111613614A (en) * | 2020-06-29 | 2020-09-01 | 青岛歌尔智能传感器有限公司 | System-in-package structure and electronic device |
| CN111883516A (en) * | 2020-07-24 | 2020-11-03 | 青岛歌尔智能传感器有限公司 | Packaging structure and packaging method of integrated module and electronic equipment |
| CN114512789A (en) * | 2020-11-17 | 2022-05-17 | 江苏长电科技股份有限公司 | Antenna packaging structure and manufacturing method thereof |
-
2021
- 2021-03-10 CN CN202110259173.5A patent/CN113125859B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100144201A1 (en) * | 2008-12-05 | 2010-06-10 | Defibaugh George R | Electrical connector system |
| CN102944780A (en) * | 2012-11-06 | 2013-02-27 | 西安开容电子技术有限责任公司 | Testing method for shielding effectiveness of small-size shielding cavity |
| CN107843793A (en) * | 2017-11-24 | 2018-03-27 | 广州力赛计量检测有限公司 | A kind of testing jig, shield effectiveness test system and its method of testing |
| CN110707072A (en) * | 2019-09-06 | 2020-01-17 | 华为机器有限公司 | System-in-package module and terminal equipment |
| CN111446175A (en) * | 2020-04-07 | 2020-07-24 | 华进半导体封装先导技术研发中心有限公司 | Radio frequency chip integrated packaging structure and preparation method thereof |
| CN111415913A (en) * | 2020-04-09 | 2020-07-14 | 环维电子(上海)有限公司 | Selective packaging SIP module with electromagnetic shielding structure and preparation method thereof |
| CN111613614A (en) * | 2020-06-29 | 2020-09-01 | 青岛歌尔智能传感器有限公司 | System-in-package structure and electronic device |
| CN111883516A (en) * | 2020-07-24 | 2020-11-03 | 青岛歌尔智能传感器有限公司 | Packaging structure and packaging method of integrated module and electronic equipment |
| CN114512789A (en) * | 2020-11-17 | 2022-05-17 | 江苏长电科技股份有限公司 | Antenna packaging structure and manufacturing method thereof |
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