CN113125492A - High-temperature detection method for multilayer printed circuit board - Google Patents
High-temperature detection method for multilayer printed circuit board Download PDFInfo
- Publication number
- CN113125492A CN113125492A CN202110425346.6A CN202110425346A CN113125492A CN 113125492 A CN113125492 A CN 113125492A CN 202110425346 A CN202110425346 A CN 202110425346A CN 113125492 A CN113125492 A CN 113125492A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- heat
- multilayer printed
- high temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
The invention discloses a high-temperature detection method of a multilayer printed circuit board, belonging to the technical field of circuit board detection, the scheme can realize that a circuit board body is tested in a high-temperature state in the process of releasing high temperature by a high-temperature release device, a tester observes the state change of the circuit board body at different temperatures by a high-definition camera on a control terminal, a deformation sensor and a displacement sensor record the deformation of a deformation memory ball and the movement distance of a movable plate driven by the deformation, thereby feeding back different test temperatures, diversifying the test data of the circuit board body, facilitating the data analysis of the tester, enhancing the detection effect, and after the test is finished, an electric heat shield plate is opened by a driving device, heat enters a cooling frame through a heat absorption hole, so that liquid gas in the heat absorption ball is vaporized and absorbs a large amount of heat, thereby realize carrying out cooling treatment to the circuit board body.
Description
Technical Field
The invention relates to the technical field of circuit board detection, in particular to a high-temperature detection method for a multilayer printed circuit board.
Background
The circuit board can be called as a printed circuit board or a printed circuit board, and is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility, and has the characteristics of high wiring density, light weight, thin thickness and good bending property. The circuit board is a provider of electrical connection of electronic components, so that the circuit is miniaturized and visualized, plays an important role in batch production of fixed circuits and optimization of electrical appliance layout, can greatly reduce errors of wiring and assembly, and improves the automation level and the production labor rate.
With the development of technology and consumer demand for electronic products, printed circuit boards with high density and multiple layers are becoming the development trend of circuit boards. Generally, a multi-layer circuit board is formed by laminating a plurality of single-layer boards. The laminated multilayer circuit board generally needs to be subjected to high-temperature testing, at present, when the multilayer circuit board is subjected to high-temperature testing, data feedback is often too single, a testing result cannot be effectively analyzed, and the detection effect is greatly reduced.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the invention aims to provide a high-temperature detection method for a multilayer printed circuit board, which can realize that a circuit board body is tested in a high-temperature state in the process of releasing high temperature by a high-temperature release device, a tester observes the state change of the circuit board body at different temperatures by a high-definition camera on a control terminal, and a deformation sensor and a displacement sensor record the deformation of a deformation memory ball and the movement distance of a movable plate driven by the deformation to feed back different test temperatures, so that the test data of the circuit board body are diversified, the data analysis of the tester is facilitated, the detection effect is enhanced, after the test is finished, an electric heat shield plate is opened by a driving device, heat enters a cooling frame through a heat absorption hole, the liquid gas in the heat absorption ball is vaporized, and a large amount of heat is absorbed, thereby realize carrying out cooling treatment to the circuit board body.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
A high-temperature detection method for a multilayer printed circuit board is characterized by comprising the following steps: the method comprises the following steps:
s1, firstly, fixedly mounting the multilayer printed circuit board to be detected;
s2, driving the testing device to release high temperature through the remote terminal, and performing high temperature test when the multilayer circuit board is in a high temperature state;
s3, secondly, observing the state change of the multilayer printed circuit board at different temperatures on the remote terminal;
s4, uploading state data of the multilayer printed circuit board at different temperatures to a cloud end, and then performing data analysis;
and S5, after the test is finished, finishing high-temperature release, performing heat absorption and cooling through a heat absorption device, and performing cooling treatment on the multilayer printed circuit board.
Further, the testing device in S2 includes a testing platform, a testing frame is installed on the top of the testing platform, a circuit board body is installed on the top of the testing frame, a plurality of groups of fixing plates are arranged in the testing frame, and two moving plates are arranged between two fixing plates in the same group, and the bottoms of the two moving plates are both connected with the bottom of the inner cavity of the testing frame in a sliding manner, a telescopic rod is fixedly connected between the side close to the two fixing plates and the side far away from the two moving plates, a deformation memory ball is installed between the two moving plates, mounting grooves are both formed in the two moving plates, and a displacement sensor and a deformation sensor are respectively installed on the inner walls of the left side and the right side of each mounting groove, a plurality of heat conduction holes are formed in the top of the testing frame, and the heat conduction holes are located right above the deformation memory, the left side and the right side of the test frame are fixedly connected with cooling frames, a mounting plate is fixedly connected between the two cooling frames near the bottom, a high-temperature release device is mounted at the bottom of the mounting plate and is driven to release heat, so that the ambient temperature of the circuit board body is gradually raised, the circuit board body is tested in a high-temperature state, along with the rise of the temperature, the heat enters the test frame through a heat conduction hole, at the moment, the deformation memory ball begins to deform and extends towards the left side and the right side, the deformation sensor records the form change of the deformation memory ball, the deformation memory ball pushes the movable plate to move away from each other under the assistance of the telescopic rod when extending towards the left side and the right side, the displacement sensor records the displacement distance of the movable plate, different test temperatures are reflected through the data records of the deformation sensor and the displacement sensor, when the shape of, the two moving plates move to the maximum distance away from each other, and at the moment, the two moving plates are at the highest test temperature, so that the circuit board body can be tested at different temperatures.
Further, two all install a plurality of heat absorption ball in the cooling frame, two swing joint has the electronic heat shield of a plurality of, two in the cooling frame drive arrangement, two are all installed at the top of cooling frame drive arrangement respectively with the electronic heat shield electric connection of a plurality of two cooling frames, two a plurality of heat absorption hole has all been seted up to one side that the cooling frame is close to mutually, after the test, draws in through the electronic heat shield of drive arrangement control a plurality of for steam enters into around the heat absorption ball in the cooling frame through the gap that heat absorption hole and the electronic heat shield of a plurality of draw in, and the heat absorption ball absorbs the heat that gets into in the cooling frame, realizes cooling the circuit board body.
Further, a plurality of the shape memory ball is made by shape memory alloy material, and the state of a plurality of shape memory ball under normal atmospheric temperature is oval, and shape memory ball that shape memory alloy material was made can take place deformation under high temperature, makes things convenient for the tester to know the change of temperature in real time.
Furthermore, the heat absorption balls are hollow, liquid gas is filled in the heat absorption balls, the filling degree of the liquid gas is 20-30%, and the liquid gas in the heat absorption balls absorbs a large amount of heat during vaporization to cool the circuit board body.
Further, a plurality of electronic heat shield is made by thermal-insulated material, a plurality of the heat absorption ball is made by heat-conducting material, and electronic heat shield is made by thermal-insulated material, can isolated heat, and the heat absorption ball is made by heat-conducting material, makes things convenient for it to absorb the heat.
Furthermore, the test frame is made by thermal-insulated material, a plurality of the surface of movable plate all is scribbled thermal-insulated coating, and the test frame that thermal-insulated material was made can play thermal-insulated effect, and thermal-insulated coating plays thermal-insulated effect, avoids causing the damage to the movable plate.
Further, install on the testboard and observe the cover, and observe the cover and make by transparent thermal-insulated material, all install high definition digtal camera on the antetheca of observing the cover and the back wall, high definition digtal camera sees through transparent observation cover and observes the state of circuit board body under different test temperature, and thermal-insulated material's observation cover can completely cut off the heat, avoids causing the damage to high definition digtal camera.
Further, all through signal connection between displacement sensor and the deformation sensor and the remote terminal, all through signal connection between high temperature release device and two drive arrangement and high definition digtal camera and the remote terminal, through signal connection, conveniently carry out drive control through remote terminal to the power equipment in the testing arrangement, avoid the tester direct operation to cause the damage in the test procedure.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
this scheme can realize in high temperature release high temperature in-process, make the circuit board body test under the high temperature state, the tester observes the state change of circuit board body under different temperatures through high definition digtal camera on control terminal, and deformation sensor and displacement sensor record deformation of deformation memory ball and the displacement distance that deformation drove the movable plate, thereby feedback different test temperature, the test data that makes the circuit board body is diversified, make things convenient for tester's data analysis, reinforcing detection effect, and after the test, open electronic heat shield through drive arrangement, the heat enters into the cooling frame through the heat absorption hole, lead to the inside liquid gas of heat absorption ball to take place vaporization phenomenon, absorb a large amount of heats, thereby the realization is cooled down the processing to the circuit board body.
Drawings
FIG. 1 is a schematic flow chart of a method for detecting a high temperature of a circuit board body according to the present invention;
FIG. 2 is a schematic structural diagram of a testing apparatus according to the present invention;
FIG. 3 is a schematic structural diagram of the shape-changing memory ball of the present invention in a high temperature state;
FIG. 4 is a schematic view of the expanded structure of the electric heat shield of the present invention;
FIG. 5 is a schematic drawing of the electric heat shield according to the present invention;
FIG. 6 is a side view of the viewing cover of the present invention;
fig. 7 is an enlarged schematic view of the structure at a in fig. 2.
The reference numbers in the figures illustrate:
1. a test bench; 2. a test frame; 3. a shape-changing memory ball; 4. moving the plate; 5. a telescopic rod; 6. a fixing plate; 7. a deformation sensor; 8. a displacement sensor; 9. a heat conduction hole; 10. a circuit board body; 11. a high temperature release device; 12. mounting a plate; 13. a cooling frame; 14. a heat absorption ball; 15. a heat absorption hole; 16. an electric heat shield; 17. a drive device; 18. an observation cover; 19. high-definition camera.
Detailed Description
The drawings in the embodiments of the invention will be combined; the technical scheme in the embodiment of the invention is clearly and completely described; obviously; the described embodiments are only some of the embodiments of the invention; but not all embodiments, are based on the embodiments of the invention; all other embodiments obtained by a person skilled in the art without making any inventive step; all fall within the scope of protection of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example (b):
a high-temperature detection method for a multilayer printed circuit board is characterized by comprising the following steps: the method comprises the following steps:
s1, firstly, fixedly mounting the multilayer printed circuit board to be detected;
s2, driving the testing device to release high temperature through the remote terminal, and performing high temperature test when the multilayer circuit board is in a high temperature state;
s3, secondly, observing the state change of the multilayer printed circuit board at different temperatures on the remote terminal;
s4, uploading state data of the multilayer printed circuit board at different temperatures to a cloud end, and then performing data analysis;
and S5, after the test is finished, finishing high-temperature release, performing heat absorption and cooling through a heat absorption device, and performing cooling treatment on the multilayer printed circuit board.
Referring to fig. 2-7, the testing apparatus in S2 includes a testing platform 1, a testing frame 2 is mounted on the top of the testing platform 1, a circuit board body 10 is mounted on the top of the testing frame 2, a plurality of groups of fixing plates 6 are disposed in the testing frame 2, each group of fixing plates 6 includes two fixing plates 6, two moving plates 4 are disposed between the two fixing plates 6 in the same group, bottoms of the two moving plates 4 are slidably connected to the bottom of an inner cavity of the testing frame 2, an expansion link 5 is fixedly connected between a side of the two fixing plates 6 close to each other and a side of the two moving plates 4 far away from each other, the testing frame 2 is made of a heat insulation material, heat insulation coatings are coated on surfaces of the moving plates 4, a shape memory ball 3 is mounted between the two moving plates 4, and further, the shape memory balls 3 are made of a shape memory alloy material, and the shape memory balls 3 are elliptical at, the two movable plates 4 are internally provided with mounting grooves, the inner walls of the left side and the right side of the two mounting grooves are respectively provided with a displacement sensor 8 and a deformation sensor 7, the top of the test frame 2 is provided with a plurality of heat conduction holes 9, the heat conduction holes 9 are positioned right above the deformation memory balls 3, the left side and the right side of the test frame 2 are respectively fixedly connected with a cooling frame 13, a mounting plate 12 is fixedly connected between the two cooling frames 13 near the bottom, the bottom of the mounting plate 12 is provided with a high temperature release device 11, the high temperature release device 11 is driven to release heat, so that the ambient temperature of the circuit board body 10 is gradually increased, the circuit board body 10 is tested in a high temperature state, the test frame 2 made of heat insulation material can play a heat insulation effect, along with the increase of temperature, the heat enters the test frame 2 through the heat conduction holes 9, and the deformation memory balls 3 made of shape memory, so time deformation memory ball 3 begins to take place deformation, extend to the left and right sides, deformation sensor 7 takes notes its form change, and deformation memory ball 3 promotes movable plate 4 when extending to the left and right sides and carries out the motion of keeping apart mutually under the assistance of telescopic link 5, thermal-insulated effect is played to thermal-insulated coating, avoid causing the damage to movable plate 4, and displacement sensor 8 then takes notes its displacement distance, the data record through deformation sensor 7 and displacement sensor 8 reflects different test temperatures, when deformation memory ball 3 form change becomes circular, two movable plates 4 move to maximum distance apart, be in under the highest test temperature this moment, thereby realize making circuit board body 10 test under different temperatures.
Referring to fig. 2-5, a plurality of heat absorbing balls 14 are respectively installed in two cooling frames 13, the interiors of the plurality of heat absorbing balls 14 are in a hollow state, liquid gas is filled in the plurality of heat absorbing balls 14, the filling degree of the liquid gas is 20-30%, a plurality of electric heat shields 16 are movably connected in the two cooling frames 13, driving devices 17 are respectively installed at the tops of the two cooling frames 13, the two driving devices 17 are respectively and electrically connected with the plurality of electric heat shields 16 of the two cooling frames 13, a plurality of heat absorbing holes 15 are respectively formed at the sides of the two cooling frames 13 close to each other, the plurality of electric heat shields 16 are made of heat insulating materials, the plurality of heat absorbing balls 14 are made of heat conducting materials, in the testing process, the electric heat shields 16 are made of heat insulating materials, the electric heat shields are closed to isolate heat when being unfolded, and after the testing is finished, the plurality of electric heat shields 16 are controlled by the driving devices 17 to be folded, the heat enters the periphery of the heat absorption ball 14 in the cooling frame 13 through the gap formed by the heat absorption hole 15 and the electric heat shields 16, so that the liquid gas in the heat absorption ball 14 starts to be vaporized, the liquid gas in the heat absorption ball 14 absorbs a large amount of heat during vaporization, and the heat absorption ball 14 is made of a heat-conducting material, so that the heat in the cooling frame 13 is absorbed by the heat absorption ball 14, and the circuit board body 10 is cooled.
Referring to fig. 2-6, the test table 1 is provided with an observation cover 18, the observation cover 18 is made of transparent heat-insulating material, the front wall and the rear wall of the observation cover 18 are provided with a high-definition camera 19, the displacement sensor 8 and the deformation sensor 7, which are connected with the remote terminal through signals, the high-temperature release device 11 and the two driving devices 17, and the high-definition camera 19 are connected with the remote terminal through signals, through signal connection, the remote terminal is convenient to drive and control the electric equipment in the control test device, meanwhile, the high-definition camera 19 can observe the states of the circuit board body 10 at different test temperatures through the transparent observation cover 18 due to signal connection, and with information transmission to control terminal in, and thermal-insulated material observe the cover 18 and can completely cut off the heat, avoid causing the damage to high definition digtal camera 19 to can effectually avoid the tester to cause the damage in the direct operation of test in-process.
The principle is as follows: when the invention is used, after a circuit board body to be detected is fixedly installed, firstly, the remote terminal controls the high-temperature release device 11 to release heat, so that the ambient temperature of the circuit board body 10 is gradually raised, the circuit board body 10 is tested in a high-temperature state, then, the state of the circuit board body 10 is observed through the high-definition camera 19, information is transmitted to the control terminal, along with the gradual rise of the temperature, the deformation memory ball 3 begins to deform and gradually changes from an ellipse to a circle, the moving plates 4 at two sides of the deformation memory ball are pushed to move away from each other in the deformation process, the deformation sensor 7 and the displacement sensor 8 are used for deforming the shape change of the memory ball 3 and the distance for pushing the moving plates to move away from each other, different testing temperatures are reflected, when the shape of the deformation memory ball 3 is changed into a circle, the two moving plates 4 move away from each other to the maximum distance, at this moment, under the highest test temperature, and then realize making circuit board body 10 test under different temperatures, and with data transmission to the high in the clouds, carry out data analysis, in the test process, electronic heat shield 16 can isolated heat, and after the test, start through remote terminal control drive arrangement 17, drive arrangement 17 control electronic heat shield 16 draws in, make steam enter into cooling frame 13 through the gap that heat absorption hole 15 and a plurality of electronic heat shield 16 draw in around heat absorption ball 14, lead to the liquid gas in the heat absorption ball 14 to begin to take place the vaporization, and can absorb a large amount of heats when the liquid gas in the heat absorption ball 14 vaporizes, and heat absorption ball 14 is made by the heat-conducting material, so heat absorption ball 14 absorbs the heat that gets into cooling frame 13, realize cooling circuit board body 10.
The above; but are merely preferred embodiments of the invention; the scope of the invention is not limited thereto; any person skilled in the art is within the technical scope of the present disclosure; the technical scheme and the improved concept of the invention are equally replaced or changed; are intended to be covered by the scope of the present invention.
Claims (9)
1. A high-temperature detection method for a multilayer printed circuit board is characterized by comprising the following steps: the method comprises the following steps:
s1, firstly, fixedly mounting the multilayer printed circuit board to be detected;
s2, driving the testing device to release high temperature through the remote terminal, and performing high temperature test when the multilayer circuit board is in a high temperature state;
s3, secondly, observing the state change of the multilayer printed circuit board at different temperatures on the remote terminal;
s4, uploading state data of the multilayer printed circuit board at different temperatures to a cloud end, and then performing data analysis;
and S5, after the test is finished, finishing high-temperature release, performing heat absorption and cooling through a heat absorption device, and performing cooling treatment on the multilayer printed circuit board.
2. The method for detecting the high temperature of the multilayer printed circuit board according to claim 1, wherein the method comprises the following steps: the testing device in the S2 comprises a testing table (1), a testing frame (2) is installed at the top of the testing table (1), a circuit board body (10) is installed at the top of the testing frame (2), a plurality of groups of fixing plates (6) are arranged in the testing frame (2), the number of each group of fixing plates (6) is two, two moving plates (4) are arranged between the two fixing plates (6) in the same group, the bottoms of the two moving plates (4) are both in sliding connection with the bottom of an inner cavity of the testing frame (2), telescopic rods (5) are fixedly connected between one side, close to each other, of the two fixing plates (6) and one side, far away from each other, of the two moving plates (4), a deformation memory ball (3) is installed between the two moving plates (4), mounting grooves are formed in the two moving plates (4), and displacement sensors (8) and deformation sensors (7) are installed on the inner walls of the, a plurality of heat conduction hole (9) have been seted up at the top of test frame (2), and heat conduction hole (9) are located deformation memory ball (3) directly over, the equal fixedly connected with cooling frame (13) in both sides about test frame (2), and be close to bottom fixedly connected with mounting panel (12) between two cooling frames (13), high temperature release (11) are installed to the bottom of mounting panel (12).
3. The method for detecting the high temperature of the multilayer printed circuit board according to claim 2, wherein: two all install a plurality of heat absorption ball (14), two in cooling frame (13) swing joint has a plurality of electric heat shield (16), two in cooling frame (13) drive arrangement (17), two are all installed at the top of cooling frame (13) drive arrangement (17) respectively with a plurality of electric heat shield (16) electric connection of two cooling frames (13), two a plurality of heat absorption hole (15) have all been seted up to one side that cooling frame (13) are close to mutually.
4. The method for detecting the high temperature of the multilayer printed circuit board according to claim 2, wherein: the shape memory balls (3) are made of shape memory alloy materials, and the shape memory balls (3) are elliptical at normal temperature.
5. The method for detecting the high temperature of the multilayer printed circuit board according to claim 3, wherein the method comprises the following steps: the interior of the heat absorption balls (14) is hollow, and liquid gas is filled in the heat absorption balls (14) and the filling degree of the liquid gas is 20-30%.
6. The method for detecting the high temperature of the multilayer printed circuit board according to claim 3, wherein the method comprises the following steps: the electric heat shields (16) are all made of heat insulation materials, and the heat absorption balls (14) are all made of heat conduction materials.
7. The method for detecting the high temperature of the multilayer printed circuit board according to claim 2, wherein: the test frame (2) is made of heat insulation materials, and heat insulation coatings are coated on the surfaces of the plurality of moving plates (4).
8. The method for detecting the high temperature of the multilayer printed circuit board according to claim 2, wherein: install on testboard (1) and observe cover (18), and observe cover (18) and make by transparent thermal-insulated material, all install high definition digtal camera (19) on the antetheca of observing cover (18) and the back wall.
9. The method for detecting the high temperature of the multilayer printed circuit board according to claim 3, wherein the method comprises the following steps: displacement sensor (8) and deformation sensor (7) and remote terminal between all through signal connection, all through signal connection between high temperature release (11) and two drive arrangement (17) and high definition digtal camera (19) and the remote terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110425346.6A CN113125492B (en) | 2021-04-20 | 2021-04-20 | High-temperature detection method for multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110425346.6A CN113125492B (en) | 2021-04-20 | 2021-04-20 | High-temperature detection method for multilayer printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113125492A true CN113125492A (en) | 2021-07-16 |
| CN113125492B CN113125492B (en) | 2022-04-22 |
Family
ID=76778334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110425346.6A Active CN113125492B (en) | 2021-04-20 | 2021-04-20 | High-temperature detection method for multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113125492B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113588072A (en) * | 2021-07-23 | 2021-11-02 | 江西天丰建设集团有限公司 | Vibration monitoring device and monitoring system for bridge construction |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040233966A1 (en) * | 2003-02-20 | 2004-11-25 | Conductor Analysis Technologies, Inc. | Method and apparatus for rapid thermal testing |
| CN201378151Y (en) * | 2008-11-24 | 2010-01-06 | 华东理工大学 | Polymorphic gas-solid-phase heat-conduction remote experimental apparatus |
| CN207366485U (en) * | 2017-11-08 | 2018-05-15 | 深圳市联合嘉利科技有限公司 | A kind of band shooting analysis and the automatic distillation analyzer of radio function |
| CN208350693U (en) * | 2018-06-06 | 2019-01-08 | 南京赛宝工业技术研究院 | Integrated circuit plate heat resistance detection device |
| CN210155056U (en) * | 2019-05-23 | 2020-03-17 | 浙江禄森电子科技有限公司 | High-temperature environment test rack for router circuit board |
| CN111006688A (en) * | 2019-11-11 | 2020-04-14 | 上海航天控制技术研究所 | Intelligent online monitoring system for inertial navigation temperature test |
| CN212622335U (en) * | 2020-08-07 | 2021-02-26 | 安徽德科科技有限公司 | Fixing device is used in processing of high thermal stability circuit board |
-
2021
- 2021-04-20 CN CN202110425346.6A patent/CN113125492B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040233966A1 (en) * | 2003-02-20 | 2004-11-25 | Conductor Analysis Technologies, Inc. | Method and apparatus for rapid thermal testing |
| CN201378151Y (en) * | 2008-11-24 | 2010-01-06 | 华东理工大学 | Polymorphic gas-solid-phase heat-conduction remote experimental apparatus |
| CN207366485U (en) * | 2017-11-08 | 2018-05-15 | 深圳市联合嘉利科技有限公司 | A kind of band shooting analysis and the automatic distillation analyzer of radio function |
| CN208350693U (en) * | 2018-06-06 | 2019-01-08 | 南京赛宝工业技术研究院 | Integrated circuit plate heat resistance detection device |
| CN210155056U (en) * | 2019-05-23 | 2020-03-17 | 浙江禄森电子科技有限公司 | High-temperature environment test rack for router circuit board |
| CN111006688A (en) * | 2019-11-11 | 2020-04-14 | 上海航天控制技术研究所 | Intelligent online monitoring system for inertial navigation temperature test |
| CN212622335U (en) * | 2020-08-07 | 2021-02-26 | 安徽德科科技有限公司 | Fixing device is used in processing of high thermal stability circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113588072A (en) * | 2021-07-23 | 2021-11-02 | 江西天丰建设集团有限公司 | Vibration monitoring device and monitoring system for bridge construction |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113125492B (en) | 2022-04-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113125492B (en) | High-temperature detection method for multilayer printed circuit board | |
| TWI486591B (en) | Probe device and test device | |
| US20140104792A1 (en) | Devices Having Flexible Printed Circuits With Bent Stiffeners | |
| CN112946396A (en) | Low-temperature irradiation comprehensive test device and test method | |
| WO2021097870A1 (en) | Electronic product development experimental platform | |
| CN103792485B (en) | Automated test device and method of testing | |
| CN116709752B (en) | Detection test fixture equipment based on flexible circuit board | |
| CN104823530A (en) | Multilayer printed circuit board and manufacturing method thereof | |
| Lee et al. | Technology advancement of laminate substrates for mobile, iot, and automotive applications | |
| CN110146804B (en) | PCB dynamic conduction reliability test method | |
| JP2016127068A (en) | Wiring board and method of manufacturing the same | |
| CN112698111B (en) | Movable three-dimensional electromagnetic field measuring device | |
| Wambera et al. | Board Level Temperature Cycling Reliability of mmWave Modules on Hybrid Substrates | |
| CN202854066U (en) | Device for detecting multilayer PCB (Printed Circuit Board) by using X-ray technology | |
| Cauwe et al. | High-density interconnect technology assessment of printed circuit boards for space applications | |
| Ha et al. | Investigation on Fatigue Life of Non-Symmetric Solder Joints in Chip Resistors | |
| CN220603349U (en) | Detection equipment for DMD prepreg | |
| Ernst et al. | Influences of organic materials on packaging technologies and their consideration for lifetime evaluation | |
| CN211303119U (en) | Electronic product development experiment platform | |
| Lee et al. | Reliability modeling and assessment of embedded capacitors in organic substrates | |
| CN216696386U (en) | Electronic paper test system | |
| CN113899470A (en) | Circuit board detection method and detection device | |
| JP6459478B2 (en) | Manufacturing method for manufacturing multilayer wiring board having via holes with various structures | |
| CN208082486U (en) | A kind of board high-low temperature test chamber | |
| CN207321650U (en) | One kind is used for copper clad laminate drying unit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |