JP6459478B2 - Manufacturing method for manufacturing multilayer wiring board having via holes with various structures - Google Patents

Description

The present invention is a technique for forming via holes having various structures in a multilayer wiring substrate by forming a multilayer substrate by stacking substrates once and vacuum impregnating the multilayer substrate with a conductive paste. In the present invention, since a through hole is provided in a single substrate, there is no restriction on the position and number of the through holes. In addition, printing is performed with an insulating paste excluding the portion of the substrate surface where the wiring pattern and the pad for the through hole are formed in advance, and this substrate is laminated on the multilayer substrate in an arbitrary order, and then formed with the insulating paste. Since the conductive paste is vacuum impregnated into the voids, a substrate in which via holes are electrically connected can be laminated at an arbitrary position of the multilayer wiring substrate. As a result, via holes having various structures can be formed in the multilayer wiring board regardless of the type of via hole, the via structure, and the number of via holes.

As represented by mobile phones and notebook computers, electronic devices are rapidly becoming smaller, lighter, and more multifunctional. In such an electronic device, it is desirable that the wiring distance between various electronic components is as short as possible, and the printed wiring board on which the electronic components are mounted needs to have a higher wiring density and a multilayered wiring board. The board creation method has changed significantly.
Conventional multilayer printed wiring boards used plating through-holes (through-holes) to establish electrical continuity between layers, but because the through-holes were formed by drilling, there was a limit to reducing the through-hole diameter. . In addition, the multilayer printed wiring board requires electrical connection between any conductor layers, but because the structure has through-holes, holes are also formed in unnecessary conductor layers, and the dead area of the wiring is the conductor. Formed between layers. Furthermore, since the wiring of the through hole portion is limited to a straight line, the degree of freedom of wiring is reduced. In addition, surface mount components cannot be mounted on the through holes, and the mounting density of the components does not increase. As means for solving such problems, a multilayer wiring board having a build-up structure has been developed.

The structure of a multilayer wiring board having a build-up structure is roughly classified into two types. One is a “base + buildup layer” structure, and the other is an “all layer buildup layer” structure. The “base + buildup layer” structure is a structure in which a thin buildup layer is stacked on a base core layer. The merit of this structure is that the core layer is composed of a conventional printed wiring board and a buildup layer is stacked thereon, so that a multilayer wiring board can be manufactured simply by expanding the conventional manufacturing equipment. On the other hand, as a disadvantage, it is possible to make fine patterns and very small diameter vias in the build-up layer, but the core layer has the same manufacturing method and design rules as conventional printed wiring boards, which hinders high-density wiring. . In addition, it is possible to overlap the vias, but the manufacturing process becomes complicated and the manufacturing cost increases. On the other hand, the “all-layer build-up” structure allows vias to be randomly arranged over all layers, and further enables a stacked via structure in which vias can be stacked. For this reason, there is a merit that the degree of freedom of design is high and arbitrary layers can be connected with the shortest distance, but the manufacturing cost is generally higher than that of the “base + buildup layer” structure.

As an example of a multilayer wiring board having a “base + buildup layer” structure, Patent Document 1 describes a case of the following five processes. That is, a step of manufacturing a core substrate in which a wiring layer and an interlayer connection by a through-hole that connects the wiring layers are formed on both surfaces of the insulating layer, a wiring layer on each of the lower layer side and the upper layer side of the core substrate, A process of stacking metal foils on a separation layer that can be physically separated between layers, multilayered by a build-up method on the upper layer side of the core substrate, forming two or more wiring layers, and further insulating layers and metals The process includes a process of laminating layers, a process of separating a multilayer wiring board with a separation layer after laminating metal foils, and a process of forming a circuit on the metal foils on both sides after separation to form a wiring layer.

However, in the multilayer wiring board having the “base + buildup layer” structure, the resin insulating layer and the conductor layer can be alternately laminated on the core board by utilizing the rigidity of the core board. That is, since the core substrate plays a role of reinforcement, the core substrate is thicker than the build-up layer. In addition, through-hole conductors are formed in the core substrate for conduction between buildup layers formed on the front and back surfaces.
On the other hand, with the increase in the signal speed in the semiconductor integrated circuit element, the signal frequency used becomes a high frequency band. When the signal frequency increases, when the through-hole conductor that penetrates the core substrate is long, the through-hole conductor contributes as inductance, leading to transmission loss of high-frequency signals and circuit malfunction. In order to solve this problem, if the thickness of the core substrate is reduced, the rigidity of the core substrate is not sufficient at the time of substrate manufacture. Arise. In order to avoid this warp and distortion, a dedicated manufacturing facility such as a support jig is required, which increases the manufacturing cost of the wiring board.
In order to give rigidity to the core substrate, if an insulating substrate containing glass fiber is used, when a via is formed by laser processing, if a powerful laser is irradiated to break the glass fiber, the irradiated laser will be synthetic resin It penetrates through the insulating substrate and damages the underlying copper foil.

Furthermore, in the step of laminating the insulating layer and the metal foil on the wiring layer of the core substrate, the step of providing the wiring layer on the core substrate by the build-up method, and the step of laminating the insulating layer and the metal foil on the wiring layer, Repeated mechanical stress and thermal stress are applied, and the manufactured multilayer wiring board is warped and various strains are generated. This warpage and distortion becomes a factor that causes a potential failure in mounting semiconductor chip components that require fine bonding.
Further, for producing the core substrate, for example, many processes are required as described below, and it is difficult to reduce the manufacturing cost of the multilayer wiring substrate having the “base + buildup layer” structure. First, a through-hole is formed in a double-sided copper-clad substrate made of a rigid material such as a glass epoxy substrate using a laser, and resin residue in the hole is removed by dipping in a high-pressure cleaning or permanganate bath. Next, electroless copper plating and electrolytic copper plating are performed to form a copper film on the substrate surface and through holes. After the through hole covered with the copper film is filled with a hole filling ink by screen printing, excess resin protruding to the surface is removed by polishing such as buffing. Next, after applying a photosensitive photoresist to the entire surface of the substrate, a resist pattern is formed by photolithography. Further, the copper film portion not covered with the resist pattern is removed using an etching solution such as cupric chloride solution, and the resist pattern is removed to form a wiring layer.

Next, as an example of a multilayer wiring board having an “all-layer build-up” structure, for example, Patent Document 2 describes a case including the following seven steps. That is, a base material from which a copper foil can be peeled is prepared, a step of forming a solder resist made of a photosensitive resin insulating material on the copper foil, exposure and development are performed, and a plurality of openings are formed in the solder resist. A step of forming a metal conductor portion made of copper in the opening of the solder resist, and a dissimilar metal layer made of one or more metals having an etching rate lower than that of copper on the surface of the metal conductor portion and the entire surface of the solder resist. After the step of forming by physical film-forming method and the step of forming the dissimilar metal layer, electrolytic copper plating is performed, and on the dissimilar metal layer, an external connection terminal having a diameter larger than that of the opening at a position corresponding to a plurality of openings Forming a wiring pattern at a position different from the position where the external connection terminal is located, and a plurality of trees on the solder resist on which the external connection terminal and the wiring pattern are formed. A build-up process in which a laminated structure is formed by alternately laminating insulating layers and a plurality of conductor layers to form a multilayer structure, and after the build-up process, a process of removing the base material to expose the copper foil is exposed. And etching the copper foil and the metal conductor to expose the surfaces of the plurality of external connection terminals from the openings.

However, a multilayer wiring board having an “all-layer build-up” structure is easily warped because there is no core layer, and is likely to be cracked or chipped. For this reason, it is essential to add a mechanism for suppressing warping or chipping of the substrate to the assembly process of the multilayer wiring board, and the assembly process of the multilayer wiring board must be changed for the coreless substrate. Furthermore, when alternately laminating a plurality of resin insulation layers and a plurality of conductor layers, the dimensional change of the resin insulation layer becomes larger than the dimensional change of the conductor layer, requiring dedicated equipment for alignment, further increasing the manufacturing cost. Increase. Since the conductor pattern is formed by etching the copper foil, there is a limit to the fine pattern that can be created with the thickness of the copper foil.

Furthermore, one of the features of the method for manufacturing a multilayer wiring board in Patent Document 2 is that a solder resist is formed on the base material before the base material removing step. The formation of the solder resist layer on the substrate consists of a series of processes including application, drying, exposure, development, and curing of a liquid resist composed of a photosensitive epoxy resin, and more than 20 processes. By repeating the process once, the smoothness of the surface of the resist layer is finally obtained. At this time, various measures are required to prevent a decrease in yield, such as prevention of adhesion of foreign substances and scratches generated during handling, and the formation of the solder resist layer increases the manufacturing cost of the multilayer wiring board.
Another feature of the manufacturing method is that an opening is provided in the solder resist, and after the opening is plated with copper, a film made of nickel whose etching rate is lower than copper is formed on the surface of the substrate by sputtering. Can be mentioned. When nickel molecules fly to the surfaces of the copper plating layer and the solder resist layer at a high speed, stress is applied to the copper plating layer and the solder resist layer, and strain remains. Further, nickel atoms are pushed into the lattice of the nickel film, and the nickel film has a property of expanding. Since these properties differ from the thermal expansion coefficient of the solder resist and the thermal expansion coefficient of nickel, the solder resist and the nickel film are easily peeled off.

Here, issues relating to the production of a multilayer wiring board having a “base + buildup layer” structure will be reorganized. By utilizing the rigidity of the core substrate, it is possible to alternately laminate resin insulation layers and conductor layers on the core substrate. Therefore, providing rigidity to the core substrate is an essential item for manufacturing multilayer wiring boards. become. However, when producing a rigid core substrate, the various problems described above occur. In addition, many processes are required to create the core substrate, making it difficult to manufacture a multilayer wiring board at low cost. In addition, various loads are applied when alternately laminating resin insulation layers and conductor layers on the core substrate, and it is inevitable that warping and distortion occur. The larger the size, the greater the amount of warpage and distortion that occurs. Such warpage and distortion greatly reduce the yield of the multilayer wiring board. As described above, many problems related to the manufacture of the multilayer wiring board having the “base + buildup layer” structure relate to the manufacturing principle of the multilayer wiring board having the “base + buildup layer” structure. For this reason, it is required to manufacture a multilayer wiring board by a completely new manufacturing method.
In addition, the issues related to the production of multilayer wiring boards having an “all-layer build-up” structure will be reorganized. The “all-layer build-up” structure realizes a via-on-via that overlaps the via hole directly above the via hole to prevent the solder from flowing into the via hole and causing a connection failure of the electronic component. In order to realize pad-on-vias for mounting electronic components such as chips and capacitors, via full plating in which via holes are filled with copper plating is a major feature. For this reason, a rigid wiring board is laminated as a substrate, laser trimming is performed on the necessary parts, via full plating is performed, thereby forming a wiring pattern and performing a one-stage buildup, and repeating this process. A multilayer wiring board having a multi-stage build-up structure is manufactured. Therefore, as the number of build-up steps increases, various loads are applied, the dimensional change of the resin insulation layer and the conductor layer increases, and the substrate in the manufacturing process is heated during laser trimming and copper plating. When a mechanical load or a chemical load is applied, the base material deteriorates, and the yield of the multilayer wiring board decreases. Further, as the number of build-up stages increases, the manufacturing process becomes longer and the manufacturing cost increases. All of these issues relate to the manufacturing principle of a multilayer wiring board having an “all-layer build-up” structure. For this reason, it is required to manufacture a multilayer wiring board by a completely new manufacturing method.

JP 2014-82489 A JP 2012-124363 A

As described above, the main problem of the multilayer wiring board having the “base + build-up layer” structure is to alternately laminate the resin insulating layers and the conductor layers on the core substrate in multiple stages. The main problem of a multilayer wiring board having an “up” structure is to build up a base material in multiple stages. In other words, as the number of substrates to be laminated increases, various loads are applied to the substrate, and defects such as warpage, strain, material deterioration, dimensional change, and misalignment are laminated with the substrate to be laminated. As a result, the yield of the multilayer wiring board decreases. Further, as the number of substrates to be laminated increases, the manufacturing process becomes longer and the manufacturing cost increases. Accordingly, a first problem related to a manufacturing method for manufacturing a multilayer wiring board in which via holes having various structures are formed is to realize a manufacturing method capable of manufacturing a multilayer board necessary for stacking substrates once.
Furthermore, the second problem related to the manufacturing method for manufacturing a multilayer wiring board in which via holes having various structures are formed is a conductive process in which all through-holes are filled with a conductive material in a single process on the laminated multilayer wiring board. A manufacturing method for manufacturing a conductive layer is realized in which all the wiring patterns become conductive layers that are electrically connected to the through hole pads, and the through hole pads become conductive layers that are electrically connected to the through holes. There is. Thereby, the manufacturing process of the multilayer wiring board is remarkably shortened, and the load applied to the base material in the manufacturing process is remarkably reduced. As a result, the yield of the multilayer wiring board is remarkably improved and the manufacturing cost is remarkably reduced. Further, a pad-on-via structure in which the through-hole pad and the via land are made common is formed, and a via-on-via structure in which a via hole is superimposed directly on the via hole is formed. For this reason, when the electronic component is mounted on the multilayer wiring board, the solder does not flow into the through hole. In addition, an electronic component such as an IC chip or a capacitor can be mounted immediately above the via hole.
Furthermore, the third problem related to the manufacturing method of manufacturing a multilayer wiring board in which via holes having various structures are formed is that the via holes having various structures are used as conductive layers regardless of the type of via holes, the via structure and the number of via holes. At the same time, a conductive layer for forming a conductive layer in which a wiring pattern is electrically connected to a through hole pad and a conductive layer in which the through hole pad is electrically connected to a through hole is realized. It is in. That is, the via hole includes a through via hole connecting through all layers, a blind via hole having a dead end structure connecting the inner layer from the surface layer, and a buried via hole having a buried structure connecting only the inner layers other than the surface layer. The via structure includes a stacked via structure in which stacked via holes having the same upper and lower hole positions are connected to each other, and a stacked via structure in which via holes having different upper and lower hole positions are connected to each other. Therefore, when the through via hole, the blind via hole and the buried via hole are formed independently, the via structure becomes a stacked via structure. On the other hand, the via structure in which multiple types of via holes are connected to each other and the via structure in which multiple via holes are connected to each other have a stacker via structure, but these are multilayer wiring in which a stacked via structure and a stacked via structure coexist. It is only an example of a substrate. For this reason, the technique for solving this problem is a technique for manufacturing a multi-layered wiring board having versatility, and this leads to downsizing, weight reduction, and higher functionality of the multilayer wiring board. The production of a multilayer wiring board having a conventional “all-layer build-up” structure has a drawback that it is limited to either a stacked via structure or a stacked via structure by a construction method.
Furthermore, a fourth problem related to the manufacturing method for manufacturing a multilayer wiring board in which via holes having various structures are formed is that the formation of via holes is not accompanied by laser irradiation and plating treatment, and the through holes are formed as conductive layers. This through hole is intended to realize a technique for forming a via hole that forms a conductive layer that is electrically connected to a wiring pattern via a pad for the through hole. As a result, no thermal load or chemical load is applied to the substrate. Further, it is not necessary to repeat steps such as removal of foreign matter, cleaning and drying, and repeated positioning. As a result, the yield of the multilayer wiring board in which various via holes are formed is significantly improved, and the manufacturing cost of the multilayer wiring board is significantly reduced.
As described above, the problem to be solved by the present invention is to realize a manufacturing method for manufacturing a multilayer wiring board that solves the four problems described above.

The first characteristic means related to the manufacturing method for manufacturing a multilayer wiring board in which via holes having various structures are formed in the present invention is to manufacture a multilayer wiring board in which at least one through via hole connecting through all layers is formed. A manufacturing method for manufacturing the multilayer wiring board,
When both the surface layer substrate on which the through via hole is formed and the substrate on which the wiring pattern is not formed are overlapped, at least one through hole is formed at a position where all the through holes overlap to form a through hole. When the first step of providing a hole and the substrate on which the wiring pattern is formed are overlapped with the substrate corresponding to the central portion where the through hole pad is formed and the substrate constituting the through via hole is overlapped, At least one through-hole is provided at a position where the through-holes overlap to form a through-hole, and the surface excluding the portion where the wiring pattern and the through-hole pad are formed is insulative. For the second step of screen printing with paste and the substrate constituting the through via hole described above, the substrate is formed so that all the through holes of the substrate overlap each other. A third step of laminating each other and applying a compressive load, a fourth step of placing the laminated substrates in a vacuum impregnation device, and evacuating the vacuum impregnation device to make the vacuum impregnation device conductive. A fifth step of supplying a paste, a sixth step of returning the vacuum impregnation device to atmospheric pressure, or supplying compressed air to the vacuum impregnation device, and taking out the laminated substrate from the vacuum impregnation device; About the substrate of the surface layer of the laminated substrate, except for the portion where both the wiring pattern and the pad for the through hole are formed, screen printing an insulating paste, followed by a seventh step of heat treatment, A manufacturing method in which these seven steps are successively performed is a manufacturing method for manufacturing a multilayer wiring board in which at least one of the through via holes is formed.

That is, according to this feature means, a multilayer wiring board in which through via holes having a quantity corresponding to the number of through holes provided in the board are formed can be manufactured by continuously performing the seven steps. The seven steps are all composed of a simple process, and secondly, a thermal load is applied to vaporize a low-boiling organic compound from the insulating paste, and thirdly, when a multilayer substrate is constructed. In addition, a stress load sufficient to apply a compressive load is applied, and fourthly, the formation of the conductive layer is not a plating process but a vacuum impregnation of a conductive paste, and a chemical load due to the plating process is not applied. For this reason, the yield of the multilayer wiring board is remarkably improved and the multilayer wiring board can be manufactured at low cost.
The first step is a step in which a through hole is simply provided in the surface layer substrate and the internal substrate in which no wiring pattern is formed. Even if the through-hole is formed by laser irradiation, the laser irradiation load is not applied to the other substrate or base material on which the through-via hole is formed because the single substrate is irradiated with the laser. In other words, in a conventional multilayer substrate with a build-up structure, a laser beam is applied to the multilayer substrate that is in the process of build-up to provide a through-hole, so that a load due to laser irradiation is applied to the substrate and the base material that are in the process of build-up. Applied.
In the second step, a through hole is provided in the internal substrate on which the wiring pattern is formed, and then the surface except for the portion where the wiring pattern and the pad for the through hole are formed is screen-printed with an insulating paste. It is this process. Since a through hole is provided in a single substrate as in the first step, even if the through hole is formed by laser irradiation, a load due to laser irradiation is not applied to other substrates or base materials.
The third step is a step in which the substrates are stacked and the substrates are stacked by applying a compressive load.
The fourth step is simply a step of placing the laminated multilayer substrate in a vacuum impregnation apparatus. The fifth step is a step in which the vacuum impregnation apparatus is evacuated and then the conductive paste is supplied to the vacuum impregnation apparatus. The sixth step is a step of returning the vacuum impregnation apparatus to the atmospheric pressure or only supplying compressed air. The seventh step is a step in which the insulating paste is screen-printed on the surface layer of the laminated multilayer substrate except for the portion where the wiring pattern and the through-hole pad are formed, and then heat-treated.
As described above, since all of the seven steps are simple processes, the yield of the multilayer wiring board on which at least one of the through via holes is formed is significantly improved, and the multilayer wiring board can be manufactured at low cost.
In other words, according to this characteristic means, the multilayer substrate firstly has all the through holes of the substrate constituting the through via hole overlapped, and secondly, the substrate on which the wiring pattern and the through hole pad are formed, voids are formed at a portion corresponding to the pad for the wiring pattern through holes by screen printing of the insulating paste, the third, all voids leads to the through-hole. In addition, a multilayer substrate in which at least one through via hole is formed is formed by stacking the substrates once.
Next, when the conductive paste is vacuum impregnated into the multilayer substrate, the conductive paste penetrates from the through holes of the lowermost substrate, and all the through holes are filled with the conductive paste. In addition, the conductive paste penetrates through the through holes and is filled with the conductive paste in the gaps in which the wiring pattern and the through hole pads are formed. At this time, since the vacuum impregnation apparatus is in a state close to vacuum, an organic compound having a low boiling point is vaporized from the conductive paste, and the conductive paste becomes a conductive material in which a collection of metal powder is dispersed in a binder at a high concentration. As a result, the conductive material is filled in all the through-holes constituting the through-via hole by a single treatment by vacuum impregnation, and at the same time, the conductive material is filled in the wiring pattern and the pad for the through-hole, A conductive layer is formed in the through hole, and at the same time, a conductive layer is also formed on the wiring pattern and the pad for the through hole.
On the other hand, since the surface layer of the laminated multilayer board is covered with a conductive material, the surface layer excluding the part where the wiring pattern and the through hole pad are formed is screen-printed with an insulating paste, and then heat-treated to reduce the boiling point. When the organic compound is vaporized, a conductive layer composed of a wiring pattern and a through hole pad is formed on the surface layer, and the through hole pad becomes a conductive layer electrically connected to the through hole.
As described above, according to this feature means, at least the layers are connected through through the lamination of the substrate once, the vacuum impregnation treatment once, and the formation of the insulating layer on the surface substrate. A multilayer wiring board in which one through via hole is formed is manufactured. For this reason, the yield of the multilayer wiring board is remarkably improved and the manufacturing cost is remarkably reduced. If one through via hole is used as the heat conduction path among the plurality of through via holes, the multilayer wiring board will not be excessively heated, and the electronic component mounted on the board will not fail.
Furthermore, the heat treatment associated with the method for producing a multilayer wiring board according to the present feature means only heat treatment for vaporizing a low boiling point organic compound from the insulating paste, and the material of the substrate is not limited to flame retardancy or non-flame retardancy. Paper base phenolic resin, paper base epoxy resin, glass cloth base epoxy resin, glass cloth base polyimide resin, paper glass cloth base epoxy resin, glass cloth glass nonwoven base epoxy resin, glass cloth base fluorine resin The general-purpose board | substrate currently used for the printed wiring board which consists of various materials, such as these, can be used.
Furthermore, the through-via hole manufactured by this feature means that all the through-holes are filled with the conductive material, and the through-hole pads form a conductive layer that continues to the through-holes. A pad-on-via structure in which the pad and the via land are made common is formed, and a via-on-via structure in which a via hole is superimposed directly on the via hole is formed. For this reason, when electronic components are mounted on the multilayer wiring board, solder does not flow into the through holes. Also, chip electronic components such as an IC chip, a capacitor, and a resistor can be mounted immediately above the through via hole.
On the other hand, even if the gap into which the conductive material permeates has a thickness and line width of about 30 μm, or the through hole is a fine hole with a diameter close to 30 μm, a differential pressure close to atmospheric pressure acts on the gap and the through hole. The conductive material penetrates into all through holes and voids. If the viscosity of the conductive material in which the low boiling point organic compound is vaporized is too high, if the compressed air is supplied to the vacuum impregnation device, a differential pressure close to the compressed air pressure acts on the gap and the through hole. High conductive material penetrates all through holes and voids.
That is, the laminated multilayer substrate is placed in a vacuum impregnation apparatus, and the vacuum impregnation apparatus is evacuated. Furthermore, the laminated multilayer substrate is filled with a conductive paste. As a result, all the gaps and through-holes in which the wiring pattern and the through-hole pads are formed are once in a vacuum state. At this time, an organic compound having a low boiling point is vaporized from the conductive paste, and the conductive paste becomes a conductive material in which a collection of metal powders is dispersed in a binder at a high concentration. After that, when the vacuum impregnation device is opened to the atmosphere, a differential pressure close to atmospheric pressure acts on all the through holes and voids, and this differential pressure causes the conductive material to permeate from the bottom through holes and all the through holes. The conductive material penetrates into the holes and the gaps. On the other hand, when the viscosity of the conductive material is too high, if compressed air is supplied to the vacuum impregnation device, a differential pressure close to the compressed air pressure acts on all through holes and voids, and the conductive material passes through all through holes and voids. To penetrate.
On the other hand, the insulating paste screen-printed on the surface of the substrate also remains as an insulating material in which an organic compound having a low boiling point is vaporized and insulating powder is dispersed in a binder at a high concentration. As a result, the gap between the substrates cannot be penetrated from the joint of the multilayer substrates on which the conductive material is laminated. Moreover, although a conductive material adheres to the side surface of the laminated multilayer substrate, since the insulating material remains on the surface of the substrate on which the wiring pattern is formed, insulation between different substrates is ensured by the insulating material.
As a result, a conductive layer in which all the through holes are conducted, a conductive layer in which the wiring pattern is conducted to the through hole pads, and a conductive layer in which the through hole pads are conducted to the through holes are formed. On the other hand, an insulating layer made of an insulating material is formed on the surface of the substrate on which the wiring pattern is formed, excluding the wiring pattern and the through-hole pad, and insulation between the substrates is ensured. In the substrate on which the wiring pattern and the through hole pad are formed, unnecessary gaps are not formed in the substrate if the conductive layer and the insulating layer have the same thickness.
As the conductive paste, a paste in which a collection of metal powders is dispersed in a binder with a high-boiling organic compound and a low-boiling organic compound that adjusts the viscosity can be used. Thus, a conventional general-purpose paste material can be used because a paste in which the powder is dispersed in a high-boiling organic compound binder and a low-boiling organic compound for adjusting the viscosity can be used.
As described above, according to this characteristic means, a multilayer in which at least one through via hole is formed by stacking the substrate once, vacuum impregnation once, and forming the insulating layer on the surface substrate. A wiring board is manufactured. As a result, among the four problems described in the 12th paragraph, three problems other than the third problem can be solved simultaneously by the method for manufacturing a multilayer wiring board in which through via holes are formed.
The method for manufacturing a multilayer wiring board in which at least one through via hole is formed has been described above. However, according to this feature, through via holes having a number corresponding to the number of through holes provided in the substrate are formed. The Furthermore, if a wiring pattern and via-hole pads that conduct via holes are formed on the substrate, a plurality of through-via holes that conduct via holes can be manufactured. Moreover, if the board | substrate with which via-holes conduct | electrically_connect is comprised with a several different board | substrate, it will conduct | electrically_connect with the several board | substrate from which through-via-holes differ. These are merely examples of forming through via holes having various structures. That is, since the feature means first processes the through hole in the single substrate, there is no restriction on the position and number of the through holes provided in the substrate. Second, the substrate on which the wiring pattern and the through-hole pad are formed has a gap formed in advance in the portion where the wiring pattern and the through-hole pad are formed by screen printing of an insulating paste on the single substrate. When laminating the substrate as a multilayer substrate, the order of lamination can be arbitrarily changed. Therefore, the substrate is laminated at an arbitrary position, and then the conductive paste is impregnated with vacuum. For this reason, the board | substrate with which the wiring pattern in which a via hole conducts is formed can be laminated | stacked on a multilayer distribution board in arbitrary positions. Therefore, according to this feature means, a multilayer wiring board in which through via holes having various structures are formed can be manufactured. As a result, the third problem described in the 12th paragraph can be solved by the manufacturing method of the multilayer wiring board in which the through via hole is formed. For this reason, all the four problems described in the 12th paragraph can be solved by the manufacturing method of the multilayer wiring board in which the through via hole is formed.

The second characteristic means related to the manufacturing method for manufacturing the multilayer wiring board in which via holes having various structures are formed in the present invention is a multilayer wiring board in which at least one blind via hole having a dead end structure connecting the inner layer to the surface layer is formed. The manufacturing method for manufacturing the multilayer wiring board is:
For both the surface layer substrate that constitutes the blind via hole and the substrate other than the innermost substrate, when these substrates are overlapped, at least one through hole is formed at a position where all the through holes overlap to form a through hole. When the first step of providing a hole and the innermost substrate at a position corresponding to the central portion where the pad for the through hole is formed and the substrate constituting the blind via hole are overlapped, all the through holes At least one through-hole is provided at a position that also serves as a position for forming a through-hole, and the surface excluding the portion where the wiring pattern and the through-hole pad are formed is screened with an insulating paste. For the second step of printing and the substrate constituting the blind via hole described above, the substrate is the same so that all the through holes of the substrate overlap each other. A fourth step of laminating and laminating by applying a compressive load, a fourth step of placing the laminated substrate in a vacuum impregnation device, and evacuating the vacuum impregnation device, and conducting paste in the vacuum impregnation device And a sixth step of returning the vacuum impregnation device to atmospheric pressure, or supplying compressed air to the vacuum impregnation device, and taking out the laminated substrate from the vacuum impregnation device, Concerning the substrate of the surface layer of the laminated substrate, it consists of a seventh step in which an insulating paste is screen-printed on a portion excluding a portion where both the wiring pattern and the through hole pad are formed, and then heat-treated. A manufacturing method in which the seven steps are continuously performed is a manufacturing method for manufacturing a multilayer wiring board in which at least one of blind via holes is formed.

That is, according to this feature means, a multilayer wiring board in which blind via holes having a number corresponding to the number of through holes provided in the board are formed can be manufactured by continuously performing the seven steps. The seven steps are all composed of a simple process, and secondly, a thermal load is applied to vaporize a low-boiling organic compound from the insulating paste, and thirdly, when a multilayer substrate is constructed. In addition, a stress load sufficient to apply a compressive load is applied, and fourthly, the formation of the conductive layer is not a plating process but a vacuum impregnation of a conductive paste, and a chemical load due to the plating process is not applied. For this reason, the yield of the multilayer wiring board is remarkably improved, and the multilayer wiring board can be manufactured at low cost.
The first step is a step in which a through hole is only provided in both the surface layer substrate and the substrate excluding the innermost substrate. Even if the through hole is formed by laser irradiation, the laser beam is not applied to other substrates or base materials on which the blind via hole is formed because the single substrate is irradiated with the laser. In other words, in a conventional multilayer substrate having a build-up structure, a laser beam is applied to the multilayer substrate that is in the process of build-up to provide a through hole, so that a load due to laser irradiation is applied to the multilayer substrate that is in the process of build-up. .
The second step is a step in which a through hole is provided in the substrate, and thereafter, the surface excluding the portion where the wiring pattern and the through hole pad are formed is screen-printed with an insulating paste. Similarly to the first step, since a through hole is provided in a single substrate, even if the through hole is formed by laser irradiation, a load due to laser irradiation is not applied to other substrates or base materials.
The third step is a step in which the substrates are stacked and the substrates are stacked by applying a compressive load.
The fourth step is simply a step of placing the laminated multilayer substrate in a vacuum impregnation apparatus. The fifth step is a step in which the vacuum impregnation apparatus is evacuated and then the conductive paste is supplied to the vacuum impregnation apparatus. The sixth step is a step of returning the vacuum impregnation apparatus to the atmospheric pressure or only supplying compressed air. The seventh step is a step in which the insulating paste is screen-printed on the surface layer of the laminated multilayer substrate except for the portion where the wiring pattern and the through-hole pad are formed, and then heat-treated.
As described above, since all of the seven steps are simple processes, the yield of the multilayer wiring board on which at least one of the blind via holes is formed is significantly improved, and the multilayer wiring board can be manufactured at a low cost.
That is, according to this characteristic means, the multilayer substrate firstly has all the through holes of the substrate constituting the blind via hole overlapped, and secondly, the insulating paste is applied to the innermost substrate constituting the blind via hole. Thus, a space is formed at a portion corresponding to the wiring pattern and the pad for the through hole, and thirdly, the space is connected to the through hole. In addition, a multilayer substrate in which at least one blind via hole is formed is formed by stacking the substrates once.
Next, when the laminated multilayer substrate is vacuum-impregnated with the conductive paste, the conductive paste penetrates from the through holes of the surface layer substrate, and all the through holes are filled with the conductive paste. In addition, the conductive paste penetrates through the through hole into the space where the wiring pattern and the through hole pad are formed, and is filled with the conductive paste. At this time, since the vacuum impregnation apparatus is in a state close to vacuum, an organic compound having a low boiling point is vaporized from the conductive paste, and the conductive paste becomes a conductive material in which a collection of metal powder is dispersed in a binder at a high concentration. As a result, all the through holes are filled with the conductive material in one treatment by vacuum impregnation, and at the same time, the wiring pattern and the pads for the through holes are filled with the conductive material. At the same time, a conductive layer is formed on the wiring pattern and the through hole pad.
On the other hand, since the surface layer of the laminated multilayer board is covered with a conductive material, the surface layer excluding the part where the wiring pattern and the through hole pad are formed is screen-printed with an insulating paste, and then heat-treated to reduce the boiling point. When the organic compound is vaporized, a conductive layer including a wiring pattern and a through hole pad is formed on the surface layer, and the through hole pad is electrically connected to the through hole.
As described above, at least one blind via hole having a dead-end structure connecting the inner layer to the inner layer is formed by stacking the substrate once, vacuum impregnation treatment once, and forming the insulating layer on the surface layer substrate. It is formed on a multilayer wiring board. For this reason, the yield of the multilayer wiring board in which the blind via hole is formed is remarkably improved, and the manufacturing cost is remarkably reduced.
Furthermore, the heat treatment associated with the method for producing a multilayer wiring board according to the present feature means only heat treatment for vaporizing a low boiling point organic compound from the insulating paste, and the material of the substrate is not limited to flame retardancy or non-flame retardancy. Paper base phenolic resin, paper base epoxy resin, glass cloth base epoxy resin, glass cloth base polyimide resin, paper glass cloth base epoxy resin, glass cloth glass nonwoven base epoxy resin, glass cloth base fluorine resin The general-purpose board | substrate currently used for the printed wiring board which consists of various materials, such as these, can be used.
Further, the blind via hole manufactured by this feature means is formed with a through hole pad, because the through hole is filled with a conductive material, and the through hole pad forms a conductive layer continuous to the through hole. A pad-on-via structure in which the via land is shared is formed, and a via-on-via structure in which a via hole is superimposed directly on the via hole is formed. For this reason, when electronic components are mounted on the multilayer wiring board, solder does not flow into the through holes. Chip electronic components such as IC chips, capacitors and resistors can be mounted directly above the blind via holes.
On the other hand, even if the gap into which the conductive material permeates has a thickness and line width of about 30 μm, and even if the through hole is a fine hole with a diameter close to 30 μm, a differential pressure close to atmospheric pressure is applied to all the through holes and voids. The conductive material penetrates into all through holes and voids. When the viscosity of the conductive material is too high, if compressed air is supplied to the vacuum impregnation device, the differential pressure close to the compressed air pressure acts on all the through holes and voids. It penetrates through the through holes and voids.
That is, the laminated multilayer substrate is placed in a vacuum impregnation apparatus, and then the vacuum impregnation apparatus is evacuated. Furthermore, the laminated multilayer substrate is filled with a conductive paste. Thereby, the space | gap and through-hole in which a wiring pattern and the pad for through-holes are formed will be in the state near vacuum once. At this time, an organic compound having a low boiling point is vaporized from the conductive paste, and the conductive paste becomes a conductive material in which a collection of metal powders is dispersed in a binder at a high concentration. Thereafter, when the vacuum impregnation apparatus is opened to the atmosphere, a differential pressure close to atmospheric pressure acts on the gap and the through hole. Due to this differential pressure, the conductive material permeates from the lowermost through hole and permeates all through holes and voids. On the other hand, when the viscosity of the conductive material is too high, if compressed air is supplied to the vacuum impregnation device, a differential pressure close to the compressed air pressure acts on all through holes and voids, and a conductive material with high viscosity becomes all voids. And penetrates through holes.
On the other hand, the insulating paste screen-printed on the surface of the substrate on which the wiring pattern and the through-hole pad are formed also vaporizes low boiling point organic compounds by evacuation, and the insulating powder becomes a high concentration binder. It remains as a dispersed insulation. As a result, the gap between the substrates cannot be penetrated from the joint of the multilayer substrates on which the conductive material is laminated. Moreover, although a conductive material adheres to the side surface of the laminated multilayer substrate, since the insulating material remains on the surface of the substrate on which the wiring pattern is formed, insulation between different substrates is ensured by the insulating material.
As a result, a conductive layer in which all the through holes are conducted, a conductive layer in which the wiring pattern is conducted to the through hole pads, and a conductive layer in which the through hole pads are conducted to the through holes are formed. On the other hand, the substrate on which the wiring pattern and the through hole pad are formed has an insulating layer made of an insulating material formed on the surface excluding the wiring pattern and the through hole pad, thereby ensuring insulation between the substrates. . In the substrate on which the wiring pattern and the through hole pad are formed, unnecessary gaps are not formed in the substrate if the conductive layer and the insulating layer have the same thickness.
As the conductive paste, a paste in which a collection of metal powders is dispersed in a binder with a high-boiling organic compound and a low-boiling organic compound that adjusts the viscosity can be used. Thus, a conventional general-purpose paste material can be used because a paste in which the powder is dispersed in a high-boiling organic compound binder and a low-boiling organic compound for adjusting the viscosity can be used.
As described above, according to the feature means, at least one blind via hole is formed in the multilayer substrate by stacking the substrate once, performing the vacuum impregnation process once, and forming the insulating layer on the surface substrate. It is formed. As a result, among the four problems described in the 12th paragraph, three problems other than the third problem can be solved simultaneously by the method for manufacturing a multilayer wiring board in which blind via holes are formed.
The method for manufacturing the multilayer wiring board in which at least one of the blind via holes is formed has been described above. However, according to this characteristic means, blind via holes having a quantity corresponding to the number of through holes provided in the board can be formed. . Furthermore, if a wiring pattern in which via holes are electrically connected to each other and a through-hole pad are formed on the substrate, a plurality of blind via holes in which the blind via holes are electrically connected can be manufactured. If the via holes are connected to each other on different substrates, a plurality of blind via holes are formed in which the blind via holes are connected to each other on different substrates. These are only examples of forming blind via holes of various structures.
That is, since the feature means first processes the through holes in the single substrate, the position and number of the through holes provided in the substrate are not limited. Second, the substrate on which the wiring pattern and the through-hole pad are formed has a gap formed in advance in the portion where the wiring pattern and the through-hole pad are formed by screen printing of an insulating paste on the single substrate. When the substrates are stacked as a multilayer substrate, the stacking order can be arbitrarily changed, so that the substrates are stacked at arbitrary positions, and then the conductive paste is vacuum impregnated. Therefore, a substrate on which a wiring pattern in which via holes are conducted can be formed on a multilayer distribution substrate at an arbitrary position. Therefore, according to this feature means, a multilayer wiring board in which blind via holes having various structures are formed is manufactured. As a result, the third problem described in the 12th paragraph can be solved by the method for manufacturing a multilayer wiring board in which blind via holes are formed. For this reason, all the four problems described in the 12th paragraph can be solved by the method for manufacturing a multilayer wiring board in which blind via holes are formed.

According to the third feature of the manufacturing method for manufacturing a multilayer wiring board in which via holes having various structures are formed in the present invention, at least one buried via hole having a buried structure that connects only inner layers other than the surface layer is formed. A manufacturing method for manufacturing a multilayer wiring board, and a manufacturing method for manufacturing the multilayer wiring board,
For the outermost substrate that constitutes the buried via hole, it is the position corresponding to the central portion where the pad for the through hole is formed, and when the substrates that constitute the buried via hole are overlapped, all the through holes overlap. At least one through-hole is provided at a position that is also a position for forming a through-hole, and the surface excluding the portion where the wiring pattern and the through-hole pad are formed is screen-printed with an insulating paste. When the first step and the innermost substrate are positioned corresponding to the central portion where the pad for the through hole is formed and the substrate constituting the buried via hole is overlapped, all the through holes overlap. At least one through hole is provided at a position that is also a position for forming a through hole, and a wiring pattern and a pad for the through hole are formed. The surface except the position, and a second step of screen printing an insulating paste, the substrate constituting the berries de holes excluding the two substrates, when overlapping the substrates constituting the berries de hole, all the through The third step of providing at least one through hole at a position where the hole overlaps and forms a through hole, and the substrate constituting the above-described buried via hole, so that all the through holes of the substrate overlap each other, A fourth step of stacking the substrates together and applying a compressive load, a fifth step of placing the stacked substrates in a vacuum impregnation device, evacuating the vacuum impregnation device, and A sixth step of supplying the conductive paste to the vacuum impregnation apparatus so that the portion excluding the uppermost layer portion is immersed in the conductive paste; and returning the vacuum impregnation apparatus to atmospheric pressure. Or a manufacturing method for continuously performing these eight steps, comprising a seventh step of supplying compressed air to the vacuum impregnation device and an eighth step of taking out the laminated substrate from the vacuum impregnation device. However, this is a manufacturing method for manufacturing a multilayer wiring board in which at least one buried via hole is formed.

That is, according to this feature means, a multilayer wiring board in which a buried via hole having a quantity corresponding to the number of through holes provided in the board can be manufactured by continuously performing the eight steps. The eight steps consist of a simple process, first, a thermal load that vaporizes a low-boiling organic compound from the insulating paste, and a third, when forming a multilayer substrate. The fourth is the yield of multi-layered wiring boards because the stress is applied by applying a compressive load, and fourthly, the formation of the conductive layer is not a plating process but a vacuum impregnation of a conductive paste and does not apply a chemical load due to the plating process. As a result, the multilayer wiring board can be manufactured at a low cost.
The first and second steps are steps in which through holes are formed in the substrate, and then the surface except for the portions where the wiring patterns and the pads for the through holes are formed is screen-printed with an insulating paste. It is. Even if the through-hole is formed by laser irradiation, the laser irradiation load is not applied to the other substrate or base material on which the through-via hole is formed because the single substrate is irradiated with the laser. In other words, in a conventional multilayer substrate having a build-up structure, a laser beam is applied to the multilayer substrate that is in the process of build-up to provide a through hole, so that a load due to laser irradiation is applied to the multilayer substrate that is in the process of build-up. . Further, the third step is a step of merely providing a through hole in the substrate. Since a through-hole is provided in a single substrate, even if the through-hole is formed by laser irradiation, a load due to laser irradiation is not applied to other substrates or base materials.
The fourth step is a step in which the substrates are stacked and the substrates are stacked by applying a compression load.
The fifth step is simply a step of placing the laminated multilayer substrate in a vacuum impregnation apparatus. The sixth step is a step in which the vacuum impregnation apparatus is evacuated and then the conductive paste is supplied to the vacuum impregnation apparatus. The seventh step is a step of returning the vacuum impregnation apparatus to the atmospheric pressure or only supplying compressed air. The eighth step is a step of simply taking out the laminated multilayer substrate from the vacuum impregnation apparatus.
As described above, each of the eight steps is a simple process, and the yield of the multilayer wiring board on which at least one buried via hole is formed is significantly improved, and the multilayer wiring board can be manufactured at low cost.
In other words, according to this feature means, multilayer substrate, the first, overlapping all the through-hole of the substrate constituting the berries de via hole, the second, the innermost of the substrate, the edge of the substrate with an insulating paste are voids formed in a portion corresponding to the pad wiring pattern and the through-hole leading to the parts, the third, the outermost substrate, is a gap portion corresponding to the pad wiring pattern and the through-holes in the insulating paste And, fourth, all voids are connected to the through holes. Further, a multilayer substrate in which at least one buried via hole is formed can be formed by stacking the substrates once.
Next, when the laminated multilayer substrate is vacuum impregnated with the conductive paste, the conductive paste penetrates from the end of the wiring pattern of the innermost substrate, and all the through holes are filled with the conductive paste. The conductive paste also permeates through the through-holes into the gap formed by the through-hole pads. At this time, since the vacuum impregnation apparatus is in a state close to vacuum, an organic compound having a low boiling point is vaporized from the conductive paste, and the conductive paste becomes a conductive material in which a collection of metal powder is dispersed in a binder at a high concentration. As a result, all the through holes are filled with the conductive material in a single treatment by vacuum impregnation, and at the same time, the conductive material is also filled in the wiring pattern and the pad for the through hole. At the same time, a conductive layer is also formed on the wiring pattern and the through hole pad.
As described above, a multilayer wiring board in which at least one buried via hole having a buried structure that connects only inner layers other than the surface layer is formed by one-time substrate lamination and one-time vacuum impregnation treatment is manufactured. Is done. For this reason, the yield of the multilayer wiring board in which the buried via hole is formed is remarkably improved, and the manufacturing cost is remarkably reduced.
Further, since the multilayer wiring board manufacturing method according to the present feature means is not accompanied by heat treatment, the board material may be a paper base phenol resin, a paper base epoxy resin, a glass cloth base, regardless of whether it is flame retardant or non-flame retardant. Currently used in printed wiring boards made of various materials such as epoxy resin, glass cloth base polyimide resin, paper glass cloth base epoxy resin, glass cloth glass nonwoven base epoxy resin, glass cloth base fluororesin, etc. A general-purpose substrate can be used.
Further, the buried via hole manufactured according to the feature means has a through hole pad because the through hole is filled with a conductive material, and the through hole pad forms a conductive layer continuous to the through hole. A pad-on-via structure in which the via land is shared is formed, and a via-on-via structure in which a via hole is stacked directly on the via hole is formed. For this reason, when chip electronic components such as ICs, capacitors, varistors, inductors, filters or resistors are arranged on a substrate that constitutes a buried via hole in advance, and a multilayer wiring board is manufactured based on this characteristic means, An electronic component can be mounted directly on the board.
On the other hand, even if the gap into which the conductive material permeates has a thickness and line width of about 30 μm, and even if the through hole is a fine hole with a diameter close to 30 μm, a differential pressure close to atmospheric pressure is applied to all the through holes and voids. The conductive material penetrates into all through holes and voids. If the viscosity of the conductive material is too high, if compressed air is supplied to the vacuum impregnation device, a differential pressure close to the compressed air pressure acts on all the through holes and voids. Infiltrates the voids and all through holes.
That is, the laminated multilayer substrate is placed in a vacuum impregnation apparatus, and then the vacuum impregnation apparatus is evacuated. Further, the laminated multilayer substrate is filled with a conductive paste. Thereby, the space | gap and through-hole in which the wiring pattern and the pad for through-holes are formed will be in the state near vacuum once. At this time, an organic compound having a low boiling point is vaporized from the conductive paste, and the conductive paste becomes a conductive material in which a collection of metal powders is dispersed in a binder at a high concentration. Thereafter, when the vacuum impregnation apparatus is opened to the atmosphere, a differential pressure close to atmospheric pressure acts on all the voids and the through holes. Due to this differential pressure, the conductive material permeates from the lowermost through hole and permeates all the gaps and through holes. On the other hand, when the viscosity of the conductive material is too high, if compressed air is supplied to the vacuum impregnation device, a differential pressure close to the compressed air pressure acts on all the voids and the through holes, and the conductive material having a high viscosity becomes all the voids. And penetrates through holes.
On the other hand, the insulating paste screen-printed on the surface of the substrate on which the wiring pattern and the through-hole pad are formed also vaporizes low boiling point organic compounds by evacuation, and the insulating powder becomes a high concentration binder. It remains as a dispersed insulation. As a result, the gap between the substrates cannot be penetrated from the joint of the multilayer substrates on which the conductive material is laminated. Moreover, although a conductive material adheres to the side surface of the laminated multilayer substrate, since the insulating material remains on the surface of the substrate on which the wiring pattern is formed, insulation between different substrates is ensured by the insulating material.
As a result, a conductive layer in which all the through holes are conducted, a conductive layer in which the wiring pattern is conducted to the through hole pads, and a conductive layer in which the through hole pads are conducted to the through holes are formed. On the other hand, the substrate on which the wiring pattern and the through hole pad are formed has an insulating layer made of an insulating material formed on the surface excluding the wiring pattern and the through hole pad, thereby ensuring insulation between the substrates. . In the substrate on which the wiring pattern and the through hole pad are formed, unnecessary gaps are not formed in the substrate if the conductive layer and the insulating layer have the same thickness.
As the conductive paste, a paste in which a collection of metal powders is dispersed in a binder with a high-boiling organic compound and a low-boiling organic compound that adjusts the viscosity can be used. Thus, a conventional general-purpose paste material can be used because a paste in which the powder is dispersed in a high-boiling organic compound binder and a low-boiling organic compound for adjusting the viscosity can be used.
As described above, according to the feature means, at least one of the via via holes is formed in the multilayer substrate by stacking the substrates once and performing the vacuum impregnation process once. As a result, among the four problems described in the 12th paragraph, three problems other than the third problem can be solved simultaneously by the method for manufacturing a multilayer wiring board in which the buried via hole is formed.
The manufacturing method of the multilayer wiring board in which at least one of the via via holes is formed has been described above. However, according to this characteristic means, Can be formed. Furthermore, if a wiring pattern in which via holes are electrically connected to each other and a through-hole pad are formed on the substrate, a plurality of buried via holes in which the via via holes are electrically connected can be formed. If the via holes are electrically connected to different substrates, a plurality of blind via holes are formed in which the via via holes are electrically connected to different substrates. These are merely examples of forming buried via holes having various structures. That is, since the feature means first processes the through holes in the single substrate, the position and number of the through holes provided in the substrate are not limited. Second, the substrate on which the wiring pattern and the through-hole pad are formed has a gap formed in advance in the portion where the wiring pattern and the through-hole pad are formed by screen printing of an insulating paste on the single substrate. When laminating the substrate as a multilayer substrate, the order of lamination can be arbitrarily changed. Therefore, the substrate is laminated at an arbitrary position, and then the conductive paste is impregnated with vacuum. Therefore, a substrate on which a wiring pattern in which via holes are conducted can be formed on a multilayer distribution substrate at an arbitrary position. For this reason, according to this feature means, a multilayer wiring board in which buried via holes having various structures are formed is manufactured. As a result, the third problem described in the 12th paragraph can be solved by the method for manufacturing a multilayer wiring board in which the buried via hole is formed. For this reason, all the four problems described in the 12th paragraph can be solved by the manufacturing method of the multilayer wiring board in which the buried via hole is formed.

According to the fourth feature of the present invention, there is provided at least one stacked via structure in which a blind via hole and a buried via hole are electrically connected. A manufacturing method for manufacturing a multilayer wiring board, and a manufacturing method for manufacturing the multilayer wiring board,
Overlay the substrate that constitutes the blind via hole at the position corresponding to the center portion where the pad for the through hole is formed on both the surface layer substrate that constitutes the blind via hole and the substrate other than the innermost substrate. Together, the first step of providing at least one through hole at a position where all the through holes overlap to form a through hole, the innermost substrate constituting the blind via hole, and the belly When the substrate that is also the outermost substrate constituting the via hole is located at a position corresponding to the center part of each of the two through-hole pads formed, and the substrates constituting the blind via hole are overlapped, The through hole is provided at a position where the through hole overlaps with the through hole, and further, the wiring pattern and the two The second step of screen-printing the surface excluding the portion where the through-hole pad is formed with an insulating paste, and the center where the through-hole pad is formed on the innermost substrate constituting the buried via hole At least one through hole is provided at a position corresponding to a portion and at a position where all the through holes overlap to form a through hole when the substrate constituting the buried via hole is overlapped, The third step of screen-printing the surface excluding the portion where the wiring pattern and the through hole pad are formed with an insulating paste, and the substrate constituting the buried via hole excluding the two substrates, overlaying substrate constituting a de hole, and a fourth step of forming a through hole in a position to form a hole penetrating overlap all the through-holes, and the About the substrate constituting the lined via hole and the substrate constituting the above-described buried via hole, the fifth step of laminating the substrates so that all the through holes overlap each other and applying a compression load, A sixth step of placing the laminated substrate in a vacuum impregnation device; a seventh step of evacuating the vacuum impregnation device and supplying a conductive paste to the vacuum impregnation device; and bringing the vacuum impregnation device to atmospheric pressure. An eighth step of returning or supplying compressed air to the vacuum impregnation device, and taking out the laminated substrate from the vacuum impregnation device, and a wiring pattern and a through-hole pad for the surface layer substrate of the laminated substrate The nine steps comprising the ninth step of screen-printing an insulating paste on the portion excluding the portion where both are formed and then heat-treating are subsequently carried out. This manufacturing method is a manufacturing method for manufacturing a multilayer wiring board on which at least one set of stacker via structures in which blind via holes are conducted to buried via holes is formed.

In other words, according to this feature means, a multilayer wiring board having a stacker via structure in which a blind via hole and a buried via hole are conducted can be manufactured by continuously performing nine processes. Each of the nine steps is a simple process, and a thermal load is applied to vaporize the low-boiling organic compound from the insulating paste, and a stress is applied to apply a compressive load when forming the multilayer substrate. In addition, the formation of the conductive layer is not a plating process, but a vacuum impregnation of a conductive paste, and no chemical load due to the plating process is applied. Therefore, the yield of the multilayer wiring board is significantly improved, and the multilayer wiring board is inexpensive. Can be manufactured.
The first and fourth steps are simply steps for providing a through hole in the substrate. Even if the through-hole is formed by laser irradiation, the laser irradiation load is not applied to other substrates and base materials on which the blind via hole is formed because the single substrate is irradiated with laser. That is, in a conventional multilayer substrate having a build-up structure, a laser beam is applied to the multilayer substrate that is in the process of build-up to provide a through hole, so that a load due to laser irradiation is applied to the multilayer substrate that is in the process of build-up.
In the second and third steps, through holes are provided in the substrate, and the surface excluding the portion where the wiring pattern and the through hole pads are formed is screen-printed with an insulating paste. As in the first and fourth steps, since a through hole is provided in a single substrate, even if the through hole is formed by laser irradiation, a load due to laser irradiation is not applied to other substrates or base materials.
The fifth step is a step in which the substrates are stacked and the substrates are stacked by applying a compressive load.
The sixth step is simply a step of placing the laminated multilayer substrate in a vacuum impregnation apparatus. The seventh step is a step in which the vacuum impregnation apparatus is evacuated and then the conductive paste is supplied to the vacuum impregnation apparatus. The eighth step is a step of returning the vacuum impregnation apparatus to atmospheric pressure or simply supplying compressed air. The ninth step is to take out the laminated multilayer substrate from the vacuum impregnation apparatus and screen-print the insulating paste on the surface layer of the laminated multilayer substrate except for the part where the wiring pattern and the through hole pad are formed. Then, it is a process that only undergoes heat treatment.
As described above, since each of the nine steps is a simple process, the yield of the multilayer wiring board in which the stack via structure in which the blind via hole and the buried via hole are conducted is significantly improved. A multilayer wiring board can be manufactured at low cost.
In other words, according to this characteristic means, the multilayer substrate firstly overlaps all the through holes of the substrate constituting the blind via hole, and secondly overlaps all the through holes of the substrate constituting the buried via hole. , third, the substrate to a blind via hole conductive Berry de via hole, the site where the pads of the through holes and the wiring pattern is formed, voids are formed in the insulating paste, the fourth, the gap through hole It leads to. In addition, a multi-layer substrate in which at least one set of stacker via structure in which the blind via hole and the buried via hole are conducted is formed by stacking the substrates once.
Next, when the laminated multilayer substrate is vacuum impregnated with the conductive paste, the conductive paste penetrates from the through holes of the substrate on the surface layer of the blind via hole, and all the through holes are filled with the conductive paste. The conductive paste penetrates into the gap of the pad for the through hole through the through hole. At this time, since the vacuum impregnation apparatus is in a state close to vacuum, an organic compound having a low boiling point is vaporized from the conductive paste, and the conductive paste becomes a conductive material in which a collection of metal powder is dispersed in a binder at a high concentration. As a result, the conductive material is filled in all the through holes constituting the blind via hole and the buried via hole in a single treatment by vacuum impregnation, and at the same time, the conductive material is filled in the wiring pattern and the pad for the through hole, As a result, conductive layers are formed in all the through holes, and at the same time, conductive layers are formed in the wiring patterns and the pads for the through holes.
On the other hand, since the surface layer of the laminated multilayer substrate is covered with a conductive material, the surface layer except the portion where the wiring pattern of the blind via hole and the pad for the through hole are formed is screen-printed with an insulating paste, and then heat-treated. If an organic compound having a low boiling point is vaporized, a conductive layer is formed on the surface layer of the wiring pattern and the through hole pad, and the through hole pad is electrically connected to the through hole.
As described above, at least one set of stackers in which the blind via hole is electrically connected to the buried via hole by stacking the substrate once, performing the vacuum impregnation process once, and forming the insulating layer on the surface substrate. A multilayer wiring board in which a via structure is formed is manufactured. For this reason, the yield of the multilayer wiring board is remarkably improved and the manufacturing cost is remarkably reduced.
Furthermore, the heat treatment associated with the method for producing a multilayer wiring board according to the present feature means only heat treatment for vaporizing a low boiling point organic compound from the insulating paste, and the material of the substrate is not limited to flame retardancy or non-flame retardancy. Paper base phenolic resin, paper base epoxy resin, glass cloth base epoxy resin, glass cloth base polyimide resin, paper glass cloth base epoxy resin, glass cloth glass nonwoven base epoxy resin, glass cloth base fluorine resin The general-purpose board | substrate currently used for the printed wiring board which consists of various materials, such as these, can be used.
Further, the blind via hole and the buried via hole manufactured by this characteristic means are formed so that the through hole is filled with the conductive material and the through hole pad forms a conductive layer continuous to the through hole. A pad-on-via structure in which a hole pad and a via land are made common is formed, and a via-on-via structure in which a via hole is stacked directly on the via hole is formed. For this reason, when electronic components are mounted on the multilayer wiring board, solder does not flow into the through holes. Further, an electronic component such as an IC chip, a capacitor, or a resistor can be mounted immediately above the blind via hole. Furthermore, when a chip electronic component such as an IC, a capacitor, a varistor, an inductor, a filter or a resistor is arranged on a substrate that forms a buried via hole in advance, and a multilayer wiring board is manufactured based on this characteristic means, Electronic components can be mounted directly above.
On the other hand, even if the gap into which the conductive material permeates has a thickness and line width of about 30 μm, or the through hole is a fine hole with a diameter close to 30 μm, a differential pressure close to atmospheric pressure acts on the gap and the through hole. The conductive material penetrates into the gap and the through hole. When the viscosity of the conductive material is too high, if compressed air is supplied to the vacuum impregnation device, a differential pressure close to the compressed air pressure acts on the gap and the through hole. It penetrates through the through hole.
That is, the laminated multilayer substrate is placed in a vacuum impregnation apparatus, and then the vacuum impregnation apparatus is evacuated. Furthermore, the laminated multilayer substrate is filled with a conductive paste. Thereby, the space | gap and through-hole in which a wiring pattern and the pad for through-holes are formed will be in the state near vacuum once. At this time, an organic compound having a low boiling point is vaporized from the conductive paste, and the conductive paste becomes a conductive material in which a collection of metal powders is dispersed in a binder at a high concentration. Thereafter, when the vacuum impregnation apparatus is opened to the atmosphere, a differential pressure close to atmospheric pressure acts on the gap and the through hole. Due to this differential pressure, the conductive material permeates through the through-holes in the substrate of the surface layer of the blind via hole, and the conductive material penetrates into all the gaps and through-holes. On the other hand, when the viscosity of the conductive material is too high, if compressed air is supplied to the vacuum impregnation device, a differential pressure close to the compressed air pressure acts on the gap and the through hole, and the conductive paste having a high viscosity becomes the gap and the penetration. Penetrates into the pores.
On the other hand, the insulating paste screen-printed on the surface of the substrate on which the wiring pattern and the through-hole pad are formed also vaporizes low boiling point organic compounds by evacuation, and the insulating powder becomes a high concentration binder. It remains as a dispersed insulation. As a result, the conductive material cannot permeate the gap between the substrates from the joints of the laminated multilayer substrates. Moreover, although a conductive material adheres to the side surface of the laminated multilayer substrate, since the insulating material remains on the surface of the substrate on which the wiring pattern is formed, insulation between different substrates is ensured by the insulating material.
As a result, a conductive layer in which all the through holes are conducted, a conductive layer in which the wiring pattern is conducted to the through hole pads, and a conductive layer in which the through hole pads are conducted to the through holes are formed. On the other hand, the substrate in which the blind via hole is electrically connected to the buried via hole is formed with an insulating layer made of an insulating material except for a portion where the wiring pattern and the pad for the through hole are formed, and insulation between the substrates is ensured. The Note that in the substrate in which the blind via hole is electrically connected to the buried via hole, if the conductive layer and the insulating layer have the same thickness, unnecessary voids are not formed.
As the conductive paste, a paste in which a collection of metal powders is dispersed in a binder with a high-boiling organic compound and a low-boiling organic compound that adjusts the viscosity can be used. Thus, a conventional general-purpose paste material can be used because a paste in which the powder is dispersed in a high-boiling organic compound binder and a low-boiling organic compound for adjusting the viscosity can be used.
As described above, according to the feature means, the blind via hole and the buried via hole are electrically connected by one-time lamination of the substrate, one-time vacuum impregnation treatment, and formation of the insulating layer on the surface layer substrate. At least one set of stacker via structures is formed on the multilayer wiring board. As a result, according to the manufacturing method of the multilayer wiring board in which the stack via structure in which the blind via hole and the buried via hole are electrically connected is formed, three of the four problems described in the 12th paragraph except for the third problem are simultaneously performed. Solvable.
In the above, a method for manufacturing a multilayer wiring board in which at least one set of stacker via structures in which a blind via hole and a buried via hole are conducted has been described. A stack via structure having a number of sets corresponding to the number of holes is formed on the multilayer wiring board. Furthermore, if the via holes are configured to conduct on different substrates, a plurality of sets of stacked via structures in which blind via holes and buried via holes are conducted on a plurality of different substrates are formed. These are just examples of various stacker via structures. That is, since the feature means first processes the through holes in the single substrate, the position and number of the through holes provided in the substrate are not limited. Second, the substrate on which the wiring pattern and the through-hole pad are formed has a gap formed in advance in the portion where the wiring pattern and the through-hole pad are formed by screen printing of an insulating paste on the single substrate. When this substrate is laminated as a multilayer substrate, the lamination order is arbitrarily changed, and then the conductive paste is vacuum impregnated. Therefore, a substrate on which a wiring pattern in which via holes are conducted can be formed on a multilayer wiring substrate at an arbitrary position. For this reason, according to this feature means, a multilayer wiring board in which stacker via structures having various structures are formed is manufactured. As a result, the third problem described in the 12th paragraph can be solved by the manufacturing method of the multilayer wiring board with the stacker via structure in which the blind via hole and the buried via hole are conducted. For this reason, all of the four problems described in the 12th paragraph can be solved by the manufacturing method of the multilayer wiring board in which the stack via structure in which the blind via hole and the conductive via hole are conducted is formed.

According to a fifth feature of the present invention, there is provided a manufacturing method for manufacturing a multilayer wiring board having a stacked via structure in which conductive via holes are electrically connected to each other. In the method, the manufacturing method for manufacturing the multilayer wiring board is:
A wiring pattern in which the first buried via hole is electrically connected to the second buried via hole is formed, and two through-hole pads are formed on the substrate constituting one end of the first buried via hole. In a position corresponding to each central portion, and when the substrates constituting the first and second buried via holes are overlapped, all the through holes are overlapped to form a through hole. A first step of screen-printing an insulating paste on the surface excluding a portion where the wiring pattern and the two through-hole pads are formed; and the other of the first buried via holes When the substrate constituting the end portion is overlapped with the substrate constituting the first buried via hole at a position corresponding to the central portion where the through-hole pad is formed. A through-hole is provided at a position where all the through-holes overlap to form a through-hole, and the surface excluding the portion where the wiring pattern and the through-hole pad are formed is formed with an insulating paste. a second step of screen printing, the substrate constituting the first belly de hole excluding the two substrates, when overlapping the substrates constituting the first belly de via holes, overlaps all the through-holes A third step of providing a through hole at a position to form a through hole; and a second belly that opposes a substrate on which a wiring pattern is formed in which the first buried via hole is electrically connected to the second buried via hole. The substrate constituting the other end of the via hole is a position corresponding to the central portion where the pad for the through hole is formed, and the substrate constituting the second buried via hole. If the two are overlapped, a through hole is provided at a position where all the through holes overlap to form a through hole, and the surface excluding the portion where the wiring pattern and the through hole pad are formed is removed. a fourth step of screen printing an insulating paste, the substrate constituting the second berries de hole excluding the two substrates, when superimposing the substrate constituting the second berries de via holes, all A fifth step of providing a through hole at a position where a through hole is formed by overlapping the through hole, a substrate constituting the first buried via hole, and a substrate constituting the second buried via hole; The sixth step of stacking the substrates so that all the through-holes overlap each other and applying a compressive load, and the seventh step of placing the stacked substrates in a vacuum impregnation apparatus And the vacuum impregnation device is evacuated and the conductive paste is supplied to the vacuum impregnation device so that the portion excluding the uppermost layer portion of the laminated substrate is immersed in the conductive paste. And the ninth step of returning the vacuum impregnation device to atmospheric pressure, or supplying compressed air to the vacuum impregnation device, and the tenth step of taking out the laminated substrate from the vacuum impregnation device. The manufacturing method in which the ten steps are continuously performed is a manufacturing method for manufacturing a multilayer wiring board on which a stacked via structure in which buried via holes are electrically connected to each other is formed.

That is, according to this feature means, a multilayer wiring board having a stack via structure in which buried via holes are conducted can be manufactured by continuously performing the process consisting of ten. The process consisting of 10 firstly consists of a simple process, and secondly, a heat load is applied only to vaporize the low boiling point organic compound from the insulating paste, and thirdly, a multilayer substrate is formed. In addition, a stress load sufficient to apply a compressive load is applied, and fourthly, the formation of the conductive layer is not a plating process but a vacuum impregnation of a conductive paste, and no chemical load due to the plating process is applied. As a result, the yield of the multilayer wiring board on which the stacker via structure is formed is improved significantly, and the multilayer wiring board can be manufactured at low cost.
The first, second and fourth processes are simply a process in which a through hole is provided in the substrate, and thereafter, the surface excluding the portion where the wiring pattern and the through hole pad are formed is screen printed with an insulating paste. It is. Since a through-hole is provided in a single substrate, even if the through-hole is formed by laser irradiation, a load due to laser irradiation is not applied to other substrates or base materials. In other words, in a conventional multilayer substrate having a build-up structure, a laser beam is applied to the multilayer substrate that is in the process of build-up to provide a through hole, so that a load due to laser irradiation is applied to the multilayer substrate that is in the process of build-up. .
The third and fifth steps are simply steps for providing a through hole in the substrate. Since a single substrate is irradiated with a laser, a load of laser irradiation is not applied to the multilayer substrate on which the blind via hole is formed.
The sixth step is a step in which the substrates are stacked and the substrates are stacked by applying a compressive load. The seventh step is simply a step of placing the laminated multilayer substrate in a vacuum impregnation apparatus. The eighth step is a step of evacuating the vacuum impregnation apparatus and then supplying the conductive paste to the vacuum impregnation apparatus. The ninth step is a step in which the vacuum impregnation apparatus is returned to atmospheric pressure or only compressed air is supplied. The tenth step is a step of simply taking out the laminated multilayer substrate from the vacuum impregnation apparatus.
As described above, since the process consisting of 10 consists of a simple process, the yield of the multilayer wiring board formed with the stack via structure in which the buried via holes are electrically connected is remarkably improved and the multilayer wiring is formed. The substrate can be manufactured at low cost.
That is, according to this feature, the multilayer substrate firstly has all the through holes of the substrate constituting the first and second buried via holes overlapped, and secondly, the second buried via hole is formed. On the innermost substrate to be formed , a wiring pattern that leads to the edge of the substrate with insulating paste and a space corresponding to the pad for the through hole are formed, and thirdly, a wiring pattern in which the via via holes are electrically connected to each other the formed substrate, voids are formed in a portion corresponding to the pad for the wiring pattern through holes in an insulating paste, fourth, all of the voids leads to the through-hole. In addition, a multilayer substrate having a stack via structure in which the first buried via hole and the second buried via hole are conducted can be formed by stacking the substrates once.
Next, when the laminated multilayer substrate is vacuum-impregnated with the conductive paste, the conductive paste penetrates from the end of the innermost substrate constituting the second buried via hole, and all the through holes are filled with the conductive paste. In addition, the conductive paste penetrates into the gap between the wiring pattern and the pad for the through hole from the through hole, and is filled with the conductive paste. At this time, since the vacuum impregnation apparatus is in a state close to vacuum, an organic compound having a low boiling point is vaporized from the conductive paste, and the conductive paste becomes a conductive material in which a collection of metal powder is dispersed in a binder at a high concentration. As a result, all the through holes are filled with the conductive material in a single treatment by vacuum impregnation, and the gaps between the wiring pattern and the pads for the through holes are filled with the conductive material.
As described above, the stacking via structure in which the buried via holes are electrically connected to each other is formed in the multilayer wiring board by stacking the substrates once and performing the vacuum impregnation process once. For this reason, the yield of the multilayer wiring board is remarkably improved and the manufacturing cost is remarkably reduced.
Further, since the multilayer wiring board manufacturing method according to the present feature means is not accompanied by heat treatment, the board material may be a paper base phenol resin, a paper base epoxy resin, a glass cloth base, regardless of whether it is flame retardant or non-flame retardant. Currently used in printed wiring boards made of various materials such as epoxy resin, glass cloth base polyimide resin, paper glass cloth base epoxy resin, glass cloth glass nonwoven base epoxy resin, glass cloth base fluororesin, etc. A general-purpose substrate can be used.
Further, the buried via hole manufactured according to the feature means has a through hole pad because the through hole is filled with a conductive material, and the through hole pad forms a conductive layer continuous to the through hole. A pad-on-via structure in which the via land is shared is formed, and a via-on-via structure in which a via hole is stacked directly on the via hole is formed. For this reason, when chip electronic components such as ICs, capacitors, varistors, inductors, filters or resistors are arranged on a substrate that constitutes a buried via hole in advance, and a multilayer wiring board is manufactured based on this characteristic means, An electronic component can be mounted directly on the board.
On the other hand, even if the gap into which the conductive material permeates has a thickness and line width of about 30 μm, or the through hole is a fine hole with a diameter close to 30 μm, a differential pressure close to atmospheric pressure acts on the gap and the through hole. The conductive material penetrates into the gap and the through hole. When the viscosity of the conductive material is too high, if compressed air is supplied to the vacuum impregnation device, a differential pressure close to the compressed air pressure acts on the gap and the through hole. It penetrates through the through hole.
That is, the laminated multilayer substrate is placed in a vacuum impregnation apparatus, and thereafter, the laminated multilayer substrate is filled with a conductive paste. Thereby, the space | gap and through-hole in which the wiring pattern and the pad for through-holes are formed will be in the state near vacuum once. At this time, an organic compound having a low boiling point is vaporized from the conductive paste, and the conductive paste becomes a conductive material in which a collection of metal powders is dispersed in a binder at a high concentration. Thereafter, when the vacuum impregnation apparatus is opened to the atmosphere, a differential pressure close to atmospheric pressure acts on the gap and the through hole. Due to this differential pressure, the conductive material permeates from the end of the innermost substrate constituting the second buried via hole and permeates all the gaps and through holes. On the other hand, when the viscosity of the conductive material to be vacuum-impregnated is too high, if compressed air is supplied to the vacuum impregnation device, a differential pressure close to the compressed air pressure acts on the gap and the through hole, and the conductive material having a high viscosity becomes a void. And penetrates the through hole.
On the other hand, the insulating paste screen-printed on the surface of the substrate on which the wiring pattern and the through-hole pad are formed also vaporizes low boiling point organic compounds by evacuation, and the insulating powder becomes a high concentration binder. It remains as a dispersed insulation. As a result, the gap between the substrates cannot be penetrated from the joint of the multilayer substrates on which the conductive material is laminated. Moreover, although a conductive material adheres to the side surface of the laminated multilayer substrate, since the insulating material remains on the surface of the substrate on which the wiring pattern is formed, insulation between different substrates is ensured by the insulating material.
As a result, a conductive layer in which all the through holes are conducted, a conductive layer in which the wiring pattern is conducted to the through hole pads, and a conductive layer in which the through hole pads are conducted to the through holes are formed. On the other hand, the substrate in which the buried via holes are connected to each other and the substrate on which the other wiring patterns of the first and second buried via holes are formed, except for the portion where the wiring pattern and the through hole pad are formed. Then, an insulating layer made of an insulating material is formed, and insulation between the substrates is ensured. In the substrate on which the wiring pattern and the through hole pad are formed, unnecessary gaps are not formed if the conductive layer and the insulating layer have the same thickness.
As the conductive paste, a paste in which a collection of metal powders is dispersed in a binder with a high-boiling organic compound and a low-boiling organic compound that adjusts the viscosity can be used. Thus, a conventional general-purpose paste material can be used because a paste in which the powder is dispersed in a high-boiling organic compound binder and a low-boiling organic compound for adjusting the viscosity can be used.
As described above, according to the present feature means, the stack via structure in which the via via holes are electrically connected to each other is formed in the multilayer wiring board by stacking the substrates once and performing the vacuum impregnation process once. As a result, among the four problems described in the 12th paragraph, three problems other than the third problem can be solved at the same time by the manufacturing method of the multilayer wiring board in which the stack via structure in which the buried via holes are electrically connected to each other is formed. .
In the above, the manufacturing method of the multilayer wiring board in which the stack via structure in which the buried via holes are connected to each other was formed was described. According to this feature, a stacker via structure is formed in which the first buried via hole and the second buried via hole are electrically connected, and at the same time, the third and fourth buried via holes are electrically connected to each other. A card via structure is formed, and a stacker via structure in which the second and third buried via holes are electrically connected, or a stacker via structure in which the first and fourth buried via holes are electrically connected is formed. be able to. Further, if the via holes are electrically connected to each other by a plurality of different substrates, a plurality of buried via holes are formed in which the via via holes are electrically connected to each other by a plurality of different substrates. These are only examples of a stack via structure in which buried via holes are electrically connected.
That is, since the feature means first processes a through hole in a single substrate, there is no restriction on the position and the number of through holes provided in the substrate. Second, the substrate on which the wiring pattern and the through-hole pad are formed has a gap formed in advance in the portion where the wiring pattern and the through-hole pad are formed by screen printing of an insulating paste on the single substrate. When laminating the substrate as a multilayer substrate, the order of lamination can be arbitrarily changed. Therefore, the substrate is laminated at an arbitrary position, and then the conductive paste is impregnated with vacuum. Therefore, a substrate on which a wiring pattern in which via holes are conducted can be formed on a multilayer distribution substrate at an arbitrary position. Therefore, according to this feature means, it is possible to manufacture a multilayer wiring board on which stacker via structures having various structures in which buried via holes are electrically connected are formed. As a result, the third problem described in the 12th paragraph can be solved by the manufacturing method of the multilayer wiring board in the stack via structure where the conductive via holes are electrically connected. For this reason, all the four problems described in the 12th paragraph can be solved by the manufacturing method of the multilayer wiring board in which the stack via structure in which the buried via holes are electrically connected is formed.

According to a sixth feature of the present invention, there is provided a stacking via in which one buried via hole is electrically connected to a blind via hole. A manufacturing method for manufacturing a multilayer wiring board having a structure formed therein, and a manufacturing method for manufacturing the multilayer wiring board,
A substrate corresponding to a central portion where a pad for a through hole is formed on both the surface layer substrate constituting the blind via hole and the substrate excluding the innermost substrate, and the substrate constituting the blind via hole When overlapped, the first step of providing a through hole at a position where all the through holes overlap to form a through hole, the innermost substrate constituting the blind via hole, and the first The substrate which is also the outermost substrate constituting the buried via hole is positioned corresponding to the central portion of each pad where the two through-hole pads are formed, and the substrate constituting the blind via hole is overlaid. When the substrate that forms the first buried via hole and the position where the through holes overlap with each other, the through holes overlap. A surface is formed with an insulating paste except for a portion where a through hole is provided at a position where the wiring pattern is to be placed, and the wiring pattern conducting to the first buried via hole and the two through hole pads are formed. For two through holes in the second step of screen printing and the innermost substrate constituting the first buried via hole and the outermost substrate constituting the second buried via hole A position corresponding to the center portion of each pad on which the first pad is formed, and a position where the through holes overlap when the substrates constituting the first buried via hole are overlapped, and the second belly A wiring pattern in which a through hole is provided at a position where the through holes overlap each other when the substrates constituting the via hole are overlapped, and is further conducted to the second buried via hole. And a third step of screen-printing the surface excluding the portion where the two through-hole pads are formed with an insulating paste, and a first buried via hole excluding the two substrates the substrate, when overlapping the substrates constituting the first belly de via hole, the position for forming a hole penetrating overlap all the through-hole, and a fourth step of forming a through hole, a second Berido When the innermost substrate constituting the via hole is at a position corresponding to the central portion where the pad for the through hole is formed and the substrate constituting the second buried via hole is overlapped, all the through holes are formed. A through hole is provided at a position that also forms a through hole that overlaps, and the surface excluding the portion where the wiring pattern leading to the end of the substrate and the pad for the through hole are formed is insulative. A fifth step of screen printing a paste for the substrate which constitutes the second berries de hole excluding the two substrates, when superimposing the substrate constituting the second berries de via holes, all holes A sixth step of providing a through hole at a position where an overlapping through hole is formed, a substrate constituting the above-described blind via hole, a substrate constituting the above-described first buried via hole, and the above-described second step A seventh step of stacking the substrates and stacking them by applying a compressive load so that all the through holes overlap each other with respect to the substrate constituting the buried via hole, and arranging the stacked substrates in a vacuum impregnation apparatus An eighth step, a ninth step of evacuating the vacuum impregnation device and supplying a conductive paste to the vacuum impregnation device, and returning the vacuum impregnation device to atmospheric pressure. The tenth step of supplying compressed air to the vacuum impregnation device, and taking out the laminated substrate from the vacuum impregnation device, and for the substrate on the surface layer of the laminated substrate, the wiring pattern of the blind via hole and the through hole The eleventh step of screen-printing an insulating paste on a portion excluding the portion where both the pad and the pad are formed, and then heat-treating, is followed by a manufacturing method in which these eleven steps are carried out continuously. This is a manufacturing method for manufacturing a multilayer wiring board in which a stacked via structure in which one buried via hole that conducts via holes is conducted to a blind via hole is formed.

In other words, according to the present feature means, the multilayered structure in which the stacked via structure in which one buried via hole that conducts the via via holes is conducted to the blind via hole is formed by continuously performing the process consisting of 11. A wiring board can be manufactured. The process consisting of 11 firstly consists of a simple process, secondly, a thermal load is applied to vaporize the low boiling point organic compound from the insulating paste, and thirdly, a multilayer substrate is constructed. In addition, a stress load sufficient to apply a compressive load is applied, and fourthly, the formation of the conductive layer is not a plating process but a vacuum impregnation of a conductive paste, and a chemical load due to the plating process is not applied. The yield of the multilayer wiring board on which is formed is significantly improved, and the multilayer wiring board can be manufactured at low cost.
The first, fourth and sixth steps are simply steps for providing a through hole in the substrate. In addition, since a through-hole is provided in a single substrate, even if the through-hole is formed by laser irradiation, a load due to laser irradiation is not applied to other substrates or base materials. In other words, in a conventional multilayer substrate having a build-up structure, a laser beam is applied to the multilayer substrate that is in the process of build-up to provide a through hole, so that a load due to laser irradiation is applied to the multilayer substrate that is in the process of build-up. .
The second, third and fifth steps are simply steps in which a through hole is formed in the substrate, and then the surface except the portion where the wiring pattern and the pad for the through hole are formed is screen printed with an insulating paste. is there. In addition, since a through-hole is provided in a single substrate, even if the through-hole is formed by laser irradiation, a load due to laser irradiation is not applied to other substrates or base materials.
The seventh step is a step in which the substrates are stacked and the substrates are stacked by applying a compressive load.
The eighth step is simply a step of placing the laminated multilayer substrate in a vacuum impregnation apparatus. The ninth step is a step in which the vacuum impregnation apparatus is evacuated and then the conductive paste is supplied to the vacuum impregnation apparatus. The tenth step is a step of returning the vacuum impregnation apparatus to the atmospheric pressure or only supplying compressed air. The eleventh step is to take out the laminated multilayer substrate from the vacuum impregnation apparatus, and screen print the insulating paste except for the portion where the wiring pattern and the through hole pad are formed on the surface layer of the laminated multilayer substrate. Then, it is a process that only involves heat treatment.
As described above, since each of the processes consisting of 11 is a simple process, a multilayer wiring in which a stacked via structure in which one buried via hole is electrically connected to another blind via hole is formed. The yield of the substrate is remarkably improved, and the multilayer wiring substrate can be manufactured at a low cost.
That is, according to the present feature means, the multilayer substrate firstly has all the through holes of the substrate constituting the blind via hole overlapped, and secondly, the substrate of the substrate constituting the first and second buried via holes. All the through-holes overlap, and thirdly, wiring to the substrate in which the blind via hole conducts to the first buried via hole and the substrate on which the wiring pattern of the blind via hole and the first and second buried via holes is formed at a site pattern with the pad of the through-holes are formed, voids are formed in the insulating paste, fourth, all of the voids leads to the through-hole. In addition, it is possible to form a multilayer substrate having a stack via structure in which the first and second buried via holes are electrically connected to each other and the first buried via hole is electrically connected to the blind via hole by a single substrate lamination. .
Next, when the laminated multilayer substrate is vacuum-impregnated with the conductive paste, the conductive paste penetrates from the through-holes of the substrate on the surface layer of the blind via hole, and all the through-holes are filled with the conductive paste. The conductive paste penetrates into the gaps of the pads for use from the through holes and is filled with the conductive paste. At this time, since the vacuum impregnation apparatus is in a state close to vacuum, an organic compound having a low boiling point is vaporized from the conductive paste, and the conductive paste becomes a conductive material in which a collection of metal powder is dispersed in a binder at a high concentration. As a result, all the through holes are filled with the conductive material in a single treatment by vacuum impregnation, and the gaps between the wiring patterns and the pads for the through holes are filled with the conductive material.
As described above, the first and second buried via holes are electrically connected to each other by the lamination of the substrate once, the vacuum impregnation treatment once, and the formation of the insulating layer on the surface layer substrate. A multilayer wiring board having a stack via structure in which one buried via hole is electrically connected to a blind via hole is manufactured. For this reason, the yield of the multilayer wiring board is remarkably improved and the manufacturing cost is remarkably reduced.
Further, in the method of manufacturing a multilayer wiring board according to the present feature means, since the heat treatment is only to vaporize a low boiling point organic compound from the insulating paste, the material of the board is not limited to flame retardant or non-flame retardant. Base material phenolic resin, paper base material epoxy resin, glass cloth base material epoxy resin, glass cloth base material polyimide resin, paper glass cloth base material epoxy resin, glass cloth glass nonwoven fabric base material epoxy resin, glass cloth base material fluorine resin, etc. A general-purpose board currently used for printed wiring boards made of various materials can be used.
Further, the blind via hole and the two via via holes manufactured by this characteristic means are formed so that the through hole is filled with the conductive material and the pad for the through hole is formed to be continuous with the through hole. A pad-on-via structure in which the pad for the through hole and the land of the via are made common is formed, and a via-on-via structure in which the via hole is superimposed directly on the via hole is formed. For this reason, electronic components such as an IC chip, a capacitor, and a resistor can be mounted immediately above the blind via hole. In addition, when chip electronic components such as ICs, capacitors, varistors, inductors, filters or resistors are arranged in advance on a substrate that constitutes a via via hole and a multilayer wiring board is manufactured based on this feature means, Electronic components can be mounted directly above.
On the other hand, even if the gap into which the conductive material permeates has a thickness and line width of about 30 μm, or the through hole is a fine hole with a diameter close to 30 μm, a differential pressure close to atmospheric pressure acts on the gap and the through hole. The conductive material penetrates into the gap and the through hole. When the viscosity of the conductive material is too high, if compressed air is supplied to the vacuum impregnation device, a differential pressure close to the compressed air pressure acts on the gap and the through hole. It penetrates through the through hole.
That is, the laminated multilayer substrate is placed in a vacuum impregnation apparatus, and then the vacuum impregnation apparatus is evacuated. Furthermore, the laminated multilayer substrate is filled with a conductive paste. Thereby, the space | gap and through-hole in which a wiring pattern and the pad for through-holes are formed will be in the state near vacuum once. At this time, an organic compound having a low boiling point is vaporized from the conductive paste, and the conductive paste becomes a conductive material in which a collection of metal powders is dispersed in a binder at a high concentration. Thereafter, when the vacuum impregnation apparatus is opened to the atmosphere, a differential pressure close to atmospheric pressure acts on the gap and the through hole. Due to this differential pressure, the conductive material permeates through the through-holes of the substrate on the surface layer of the blind via hole, and permeates all the gaps and through-holes. On the other hand, when the viscosity of the conductive material to be vacuum-impregnated is too high, if compressed air is supplied to the vacuum impregnation device, a differential pressure close to the compressed air pressure acts on the gap and the through hole, and all the conductive material with high viscosity is It penetrates into the voids and through-holes.
On the other hand, the insulating paste screen-printed on the surface excluding the part where the wiring pattern and the pad for the through hole are formed also evaporates low boiling point organic compounds by vacuum evacuation, and the insulating powder has a high concentration of binder. It remains as an insulating material dispersed in. As a result, the gap between the substrates cannot be penetrated from the joint of the multilayer substrates on which the conductive material is laminated. Moreover, although a conductive material adheres to the side surface of the laminated multilayer substrate, since the insulating material remains on the surface of the substrate on which the wiring pattern is formed, insulation between different substrates is ensured by the insulating paste.
As a result, a conductive layer in which all the through holes are conducted, a conductive layer in which the wiring pattern is conducted to the through hole pads, and a conductive layer in which the through hole pads are conducted to the through holes are formed. On the other hand, the substrate on which the wiring pattern of blind via holes is formed, the substrate on which the buried via holes are connected, and the substrate on which other wiring patterns of the first and second buried via holes are formed are the wiring pattern and the through hole. An insulating layer made of an insulating material is formed except for a portion where a pad for forming is formed, and insulation between substrates is ensured. In the substrate on which the wiring pattern and the through-hole pad are formed, unnecessary gaps are not formed if the conductive layer and the insulating layer have the same thickness.
As the conductive paste, a paste in which a collection of metal powders is dispersed in a binder with a high-boiling organic compound and a low-boiling organic compound that adjusts the viscosity can be used. Thus, a conventional general-purpose paste material can be used because a paste in which the powder is dispersed in a high-boiling organic compound binder and a low-boiling organic compound for adjusting the viscosity can be used.
As described above, according to the present feature means, one of the via via holes is electrically connected to each other by stacking the substrates once, performing the vacuum impregnation process once, and forming the insulating layer on the surface substrate. A stacked via structure in which the buried via hole is electrically connected to the blind via hole is formed on the multilayer wiring board. As a result, among the four problems described in the 12th paragraph, according to the manufacturing method of the multilayer wiring board having the stacker via structure in which the one buried via hole is electrically connected to the blind via hole. Three issues except the third issue can be solved simultaneously.
As described above, the manufacturing method of the multilayer wiring board in which the first buried via hole is electrically connected to the second buried via hole, and further, the stacked via structure in which the first buried via hole is electrically connected to the blind via hole is formed. As described above, according to the feature means, the first blind via hole is formed, the second blind via hole is formed, and the first buried via hole and the second buried via hole are formed. The innermost substrate of the second blind via hole is electrically connected to the outermost substrate of the third buried via hole, and the innermost substrate of the third buried via hole is connected to the fourth buried via hole. It can be configured to conduct to the outermost substrate. As a result, two sets of stacked via structures are formed in which one buried via hole is electrically connected to another blind via hole. Furthermore, the first blind via hole is conducted to the second blind via hole, the first buried via hole is conducted to the third buried via hole, and the second buried via hole is further connected to the fourth buried via hole. A stack via structure that conducts to a via hole can be easily formed by changing the arrangement position of a substrate on which a wiring pattern that conducts via holes is formed in a multilayer substrate. These are just examples of various stacker via structures. That is, since the feature means first processes the through holes in the single substrate, the position and number of the through holes provided in the substrate are not limited. Second, the substrate on which the wiring pattern and the through-hole pad are formed has a gap formed in advance in the portion where the wiring pattern and the through-hole pad are formed by screen printing of an insulating paste on the single substrate. When laminating the substrate as a multilayer substrate, the order of lamination can be arbitrarily changed. Therefore, the substrate is laminated at an arbitrary position, and then the conductive paste is impregnated with vacuum. For this reason, a substrate in which a buried via hole is electrically connected to a blind via hole, a substrate in which a buried via hole is electrically connected, and a substrate in which a blind via hole is electrically connected can be laminated on a multilayer substrate at an arbitrary position. For this reason, according to this feature means, a multilayer wiring board is produced in which a buried via hole in which the buried via holes are electrically connected to each other and a stacker via structure having various structures that are electrically connected to the blind via holes are formed. As a result, the third problem described in the 12th paragraph can be solved by the manufacturing method of the multilayer wiring board with the stacked via structure in which the one buried via hole is electrically connected to the blind via hole. For this reason, all of the four problems described in the 12th paragraph are achieved by the manufacturing method of the multilayer wiring board having the stacker via structure in which the one buried via hole is electrically connected to the blind via hole. Solvable.

According to a seventh feature of the present invention, there is provided a plurality of characteristic features relating to a manufacturing method for manufacturing a multilayer wiring board having via holes of various structures comprising at least one through via hole, at least one blind via hole, and at least one buried via hole. A manufacturing method for manufacturing a multilayer wiring board in which via holes are formed, and a manufacturing method for manufacturing the multilayer wiring board,
When both the surface layer substrate on which the through via hole is formed and the substrate on which the wiring pattern is not formed, the substrate constituting the through via hole is overlapped, at least at a position where all the through holes overlap to form a through hole. The first step of providing one through hole and the substrate on which the wiring pattern is formed are overlapped with the substrate constituting the through via hole at a position corresponding to the central portion where the pad for the through hole is formed. And at least one through-hole at a position where all the through-holes overlap to form a through-hole, and a surface excluding a portion where the wiring pattern and the through-hole pad are formed , Both the second step of screen printing with an insulating paste, the surface layer substrate constituting the blind via hole, and the substrate excluding the innermost substrate Then, when the substrates constituting the blind via hole are overlapped, the third step of providing at least one through hole at the position where all the through holes overlap to form the through hole, and the innermost side constituting the blind via hole The position corresponding to the central portion where the pad for the through hole is formed on the substrate, and also the position where all the through holes are overlapped to form a through hole when the substrates constituting the blind via hole are overlapped. A fourth step in which at least one through-hole is provided at a position, and the surface excluding the portion where the wiring pattern leading to the end of the substrate and the through-hole pad are formed is screen-printed with an insulating paste And the position corresponding to the central portion where the through hole pad is formed on the outermost substrate constituting the buried via hole. In addition, when the substrates constituting the buried via hole are overlapped, at least one through hole is provided at a position where all the through holes overlap to form a through hole, and the wiring pattern and the through hole are provided. In the fifth step of screen-printing the surface excluding the portion where the pad is formed with an insulating paste and the innermost substrate constituting the buried via hole, in the central portion where the through-hole pad is formed When the corresponding substrate and the substrate constituting the buried via hole are overlapped, at least one through hole is provided at a position where all the through holes overlap to form a through hole. A sixth step of screen-printing the surface excluding the portion where the wiring pattern leading to the end of the substrate and the through-hole pad are formed with an insulating paste If, for the substrate which constitutes the berries de holes excluding the two substrates, when overlapping the substrates constituting the berries de via hole, the position for forming a hole penetrating overlap all the through-holes, at least one through The seventh step of providing a hole, the substrate constituting the through via hole described above, and the substrate constituting the blind via hole described above are overlapped with each other so that all the through holes overlap each other, and a compressive load is applied. In addition, an eighth step of laminating, a ninth step of placing the laminated substrate in a vacuum impregnation device, and a tenth step of evacuating the vacuum impregnation device and supplying a conductive paste to the vacuum impregnation device The vacuum impregnation apparatus is returned to atmospheric pressure, or the eleventh step of supplying compressed air to the vacuum impregnation apparatus, and the laminated substrate is removed from the vacuum impregnation apparatus. An insulating paste is screened on the substrate of the surface layer of the laminated substrate, except for the portions where the wiring patterns of the through via holes and the blind via holes and the pads for the through holes are formed. The manufacturing method comprising printing and then heat-treating the twelfth step, and continuously performing these twelve steps comprises at least one of each via hole comprising a through via hole, a blind via hole and a buried via hole. This is a manufacturing method for manufacturing a multilayer wiring board in which a plurality of via holes are formed.

In other words, according to the present feature means, the multi-layered structure in which a plurality of via holes including at least one of the via holes including the through via hole, the blind via hole, and the buried via hole is formed by continuously performing the process including the twelve. A wiring board can be manufactured. The process consisting of 12 firstly consists of a simple process, and secondly, a heat load is applied only to vaporize the low boiling point organic compound from the insulating paste, and thirdly, a multilayer substrate is constructed. In addition, a stress load sufficient to apply a compressive load is applied, and fourthly, the formation of the conductive layer is not a plating process but a vacuum impregnation of a conductive paste, and a chemical load due to the plating process is not applied. The yield of the multilayer wiring board in which a plurality of via holes including via holes and buried via holes are formed is significantly improved, and the multilayer wiring board can be manufactured at low cost.
The first, third and seventh steps are simply steps for providing a through hole in the substrate. In addition, since a through-hole is provided in a single substrate, even if the through-hole is formed by laser irradiation, a load due to laser irradiation is not applied to other substrates or base materials. In other words, in a conventional multilayer substrate having a build-up structure, a laser beam is applied to the multilayer substrate that is in the process of build-up to provide a through hole, so that a load due to laser irradiation is applied to the multilayer substrate that is in the process of build-up. .
In the second, fourth, fifth and sixth steps, a through hole is provided in the substrate, and thereafter, the surface excluding the portion where the wiring pattern and the through hole pad are formed is screen-printed with an insulating paste. It is only a process. In addition, since a through-hole is provided in a single substrate, even if the through-hole is formed by laser irradiation, a load due to laser irradiation is not applied to other substrates or base materials.
The eighth step is a step in which the substrates are stacked and the substrates are stacked by applying a compressive load.
The ninth step is simply a step of placing the laminated multilayer substrate in a vacuum impregnation apparatus. The tenth step is a step in which the vacuum impregnation apparatus is evacuated, and then the conductive paste is supplied to the vacuum impregnation apparatus. The eleventh step is a step of returning the vacuum impregnation apparatus to the atmospheric pressure or only supplying compressed air. In the twelfth step, the laminated multilayer substrate is taken out from the vacuum impregnation apparatus, and wiring patterns of through via holes and blind via holes and pads for the through holes are formed on the surface layer of the laminated multilayer substrate. Except for the part, it is a process in which the insulating paste is screen-printed and then heat-treated.
As described above, since the process consisting of 12 is a simple process, a plurality of via holes including at least one of each via hole including a through via hole, a blind via hole, and a buried via hole are formed. The yield of the multilayer wiring board is remarkably improved and the multilayer wiring board can be manufactured at a low cost.
That is, according to this feature means, in the multilayer substrate, first, all the through holes of the substrate constituting the through via hole overlap, and secondly, all the through holes of the substrate constituting the blind via hole overlap, Third, all the through holes of the substrate constituting the buried via hole are overlapped. Fourth, the substrate on which the wiring pattern of the through via hole, the blind via hole, and the buried via hole is formed is a wiring pattern and a pad for the through hole. There site formed is, voids are formed by insulating paste, fifth, all voids leads to the through-hole. In addition, a multi-layer substrate that includes a plurality of via holes including at least one through via hole, at least one blind via hole, and at least one buried via hole is formed by stacking the substrates once.
Next, when the laminated multilayer substrate is vacuum-impregnated with a conductive paste, from the through hole at the bottom end of the through via hole, the through hole at the surface layer of the blind via hole, and the end of the innermost substrate constituting the buried via hole The conductive paste penetrates, all the through holes are filled with the conductive paste, and the conductive paste penetrates from the through holes into the gaps between the wiring pattern and the pad for the through holes, and is filled with the conductive paste. The At this time, since the vacuum impregnation apparatus is in a state close to vacuum, an organic compound having a low boiling point is vaporized from the conductive paste, and the conductive paste becomes a conductive material in which a collection of metal powder is dispersed in a binder at a high concentration. As a result, all the through holes are filled with the conductive material in a single treatment by vacuum impregnation, and the gaps between the wiring patterns and the pads for the through holes are filled with the conductive material. On the other hand, since the surface layer of the laminated multilayer substrate is covered with a conductive material, screen printing with an insulating paste is performed except for the portion where the wiring pattern of the through via hole and the blind via hole and the pad for the through hole are formed. When the heat treatment is performed, a conductive layer is formed on the surface layer on the wiring pattern and the through hole pad, and the through hole pad is electrically connected to the through hole.
As described above, at least one through via hole, at least one blind via hole, and at least one buried layer are formed by stacking a single substrate, performing a single vacuum impregnation process, and forming an insulating layer on the surface substrate. A multilayer wiring board in which a plurality of via holes including via holes is formed is manufactured. For this reason, the yield of the multilayer wiring board is remarkably improved and the manufacturing cost is remarkably reduced. If one through via hole is used as the heat conduction path among the plurality of through via holes, the multilayer wiring board will not be excessively heated, and the electronic component mounted on the board will not fail.
Furthermore, the method for producing a multilayer wiring board according to this feature means is a heat treatment that simply vaporizes a low-boiling organic compound from an insulating paste, regardless of whether the material of the board is flame retardant or non-flame retardant. Various materials such as phenol resin, paper base epoxy resin, glass cloth base epoxy resin, glass cloth base polyimide resin, paper glass cloth base epoxy resin, glass cloth glass nonwoven base epoxy resin, glass cloth base fluororesin, etc. A general-purpose substrate that is currently used for printed wiring boards made of various materials can be used.
Further, the through via hole, the blind via hole, and the buried via hole manufactured by the characteristic means form a conductive layer in which the through hole is filled with the conductive material and the through hole pad is continuous with the through hole. Therefore, a pad-on-via structure in which the through-hole pad and the via land are made common is formed, and a via-on-via structure in which the via hole is superimposed immediately above the via hole is formed. For this reason, an electronic component such as an IC chip, a capacitor, or a resistor can be mounted immediately above the through via hole and the blind via hole. In addition, when chip electronic components such as ICs, capacitors, varistors, inductors, filters or resistors are arranged in advance on a substrate that constitutes a via via hole and a multilayer wiring board is manufactured based on this feature means, A chip electronic component can be mounted immediately above.
On the other hand, even if the gap into which the conductive material permeates has a thickness and line width of about 30 μm, or the through hole is a fine hole with a diameter close to 30 μm, a differential pressure close to atmospheric pressure acts on the gap and the through hole. The conductive material penetrates into the gap and the through hole. When the viscosity of the conductive material is too high, if compressed air is supplied to the vacuum impregnation device, a differential pressure close to the compressed air pressure acts on the gap and the through hole. It penetrates through the through hole.
That is, the laminated multilayer substrate is placed in a vacuum impregnation apparatus, and then the vacuum impregnation apparatus is evacuated. Furthermore, the laminated multilayer substrate is filled with a conductive paste. Thereby, the space | gap and through-hole in which a wiring pattern and the pad for through-holes are formed will be in the state near vacuum once. At this time, an organic compound having a low boiling point is vaporized from the conductive paste, and the conductive paste becomes a conductive material in which a collection of metal powders is dispersed in a binder at a high concentration. Thereafter, when the vacuum impregnation apparatus is opened to the atmosphere, a differential pressure close to atmospheric pressure acts on the gap and the through hole. Due to this differential pressure, the conductive material penetrates from the lowermost through hole of the through via hole, from the through hole in the surface layer of the blind via hole, and from the end of the innermost substrate constituting the buried via hole. It penetrates into the gap and the through hole. On the other hand, when the viscosity of the conductive material to be vacuum-impregnated is too high, if compressed air is supplied to the vacuum impregnation device, a differential pressure close to the compressed air pressure acts on the gap and the through hole, and a conductive paste having a high viscosity is obtained. Osmose | permeates a space | gap and a through-hole.
On the other hand, the insulating paste screen-printed on the surface excluding the part where the wiring pattern and the pad for the through hole are formed also evaporates low boiling point organic compounds by vacuum evacuation, and the insulating powder has a high concentration of binder. It remains as an insulating material dispersed in. As a result, the conductive material cannot permeate the gap between the substrates from the joints of the laminated multilayer substrates. Moreover, although a conductive material adheres to the side surface of the laminated multilayer substrate, since the insulating material remains on the surface of the substrate on which the wiring pattern is formed, insulation between different substrates is ensured by the insulating paste.
As a result, a conductive layer in which all the through holes are conducted, a conductive layer in which the wiring pattern is conducted to the through hole pads, and a conductive layer in which the through hole pads are conducted to the through holes are formed. On the other hand, an insulating layer made of an insulating material is formed except for a portion where a wiring pattern of through via holes, blind via holes, buried via holes, and pads for through holes are formed, and insulation between substrates is secured. In the substrate on which the wiring pattern and the through hole pad are formed, unnecessary gaps are not formed if the conductive layer and the insulating layer have the same thickness. Furthermore, the surface layer of the laminated multilayer substrate is screen-printed except for the portion where the wiring pattern of the through via hole and the blind via hole and the pad for the through hole are formed with an insulating paste, and then heat-treated, and the wiring pattern is formed on the surface layer. A conductive layer is formed on the through hole pad, and the through hole pad is electrically connected to the through hole.
As the conductive paste, a paste in which a collection of metal powders is dispersed in a binder with a high-boiling organic compound and a low-boiling organic compound that adjusts the viscosity can be used. Thus, a conventional general-purpose paste material can be used because a paste in which the powder is dispersed in a high-boiling organic compound binder and a low-boiling organic compound for adjusting the viscosity can be used.
As described above, according to the present feature means, through through-holes, blind via-holes and buried via-holes can be obtained by stacking a substrate once, performing a vacuum impregnation treatment once, and forming an insulating layer on the surface layer substrate. A plurality of via holes are formed in the multilayer wiring board. As a result, according to the method of manufacturing a multilayer wiring board in which a plurality of via holes including through via holes, blind via holes, and buried via holes are formed, three problems other than the third problem among the four problems described in the 12th paragraph are obtained. It can be solved at the same time.
In the above, a method for manufacturing a multilayer wiring board in which a plurality of via holes each including at least one through via hole, at least one blind via hole, and at least one buried via hole has been described has been described. Each of the through via hole, the blind via hole, and the buried via hole having a number corresponding to the number of through holes provided in the substrate is formed in the multilayer wiring board. Furthermore, through via holes, between blind via holes, and further, if a substrate in which buried via holes are conductive is arranged in a multilayer substrate, through via holes are conductive, blind via holes are conductive, The buried via holes are electrically connected. Furthermore, if the structure of the multilayer substrate is such that the blind via holes and the via via holes are conducted on a plurality of different substrates, the blind via holes and the buried via holes are conducted on a plurality of different substrates. . These are merely examples of forming a plurality of via holes having various structures including through via holes, blind via holes, and buried via holes. That is, since the feature means first processes the through holes in the single substrate, the position and number of the through holes provided in the substrate are not limited. Second, the substrate on which the wiring pattern and the through-hole pad are formed has a gap formed in advance in the portion where the wiring pattern and the through-hole pad are formed by screen printing of an insulating paste on the single substrate. When laminating the substrate as a multilayer substrate, the order of lamination can be arbitrarily changed. Therefore, the substrate is laminated at an arbitrary position, and then the conductive paste is impregnated with vacuum. Therefore, a substrate in which via holes are electrically connected can be stacked on the multilayer distribution substrate at an arbitrary position. For this reason, according to this characteristic means, a multilayer wiring board in which a plurality of via holes having various structures including through via holes, blind via holes, and buried via holes can be manufactured. As a result, the third problem described in the 12th paragraph can be solved by the method for manufacturing a multilayer wiring board in which a plurality of via holes including through via holes, blind via holes, and buried via holes are formed. For this reason, all of the four problems described in the 12th paragraph can be solved by the method of manufacturing a multilayer wiring board in which a plurality of via holes including through via holes, blind via holes, and buried via holes are formed.

The eighth characteristic means related to the manufacturing method of manufacturing a multilayer wiring board in which via holes having various structures according to the present invention are provided is at least one set of stacker via structures in which blind via holes and buried via holes are electrically connected, and at least one set. A manufacturing method for manufacturing a multilayer wiring board in which a plurality of via holes composed of two through via holes is formed, and the manufacturing method for manufacturing the multilayer wiring board includes:
When both the surface layer substrate on which the through via hole is formed and the substrate on which the wiring pattern is not formed, the substrate constituting the through via hole is overlapped, at least at a position where all the through holes overlap to form a through hole. The first step of providing one through hole and the substrate on which the wiring pattern is formed are overlapped with the substrate constituting the through via hole at a position corresponding to the central portion where the pad for the through hole is formed. And at least one through-hole at a position where all the through-holes overlap to form a through-hole, and a surface excluding a portion where the wiring pattern and the through-hole pad are formed , Both the second step of screen printing with an insulating paste, the surface layer substrate constituting the blind via hole, and the substrate excluding the innermost substrate The position corresponding to the central portion where the pad for the through-hole is formed, and the position where the through-hole is overlapped when the substrates constituting the blind via hole are overlapped with each other. A third step of providing at least one through-hole, and an innermost substrate constituting the blind via hole and a substrate which is also the outermost substrate constituting the buried via hole. A position corresponding to each central portion where the pad is formed, and a position where all the through holes overlap to form a through hole when the substrates constituting the blind via hole are overlapped; When the substrates constituting the via holes are overlapped, the through holes are formed at positions where all the through holes overlap to form the through holes. In addition, a fourth process of screen printing with an insulating paste on the surface excluding a portion where the wiring pattern conducting to the buried via hole and the two through-hole pads is formed, and the buried via hole are configured. The innermost substrate is a position corresponding to the central portion where the pad for the through hole is formed, and when the substrate constituting the buried via hole is overlapped, all the through holes are overlapped to penetrate the hole. A fifth step in which a through hole is provided at a position where the wiring pattern is to be formed, and the surface excluding the portion where the wiring pattern and the through hole pad are formed is screen-printed with an insulating paste; the substrate constituting the berries de hole except the substrates and overlaying the substrate of the berries de hole, penetrating overlap all the through-holes The sixth step of providing a through hole at a position where a hole is to be formed, the substrate constituting the above-described through via hole, and the substrate constituting the above-described blind via hole so that all the through holes overlap each other. A seventh step of laminating each other and applying a compressive load to laminate, an eighth step of placing the laminated substrates in a vacuum impregnation device, and evacuating the vacuum impregnation device to make the vacuum impregnation device conductive. A ninth step of supplying a paste, a tenth step of returning the vacuum impregnation device to atmospheric pressure, or supplying compressed air to the vacuum impregnation device, and taking out the laminated substrate from the vacuum impregnation device, A portion excluding a portion where the wiring patterns of the through via holes and the blind via holes and the pads for the through holes are formed on the surface layer substrate of the laminated substrate And an eleventh step in which an insulating paste is screen-printed and then heat-treated, and a manufacturing method in which these eleven steps are continuously performed is at least one set of stackers in which blind via holes are electrically connected to buried via holes. A manufacturing method for manufacturing a multilayer wiring board in which a plurality of via holes each including a via structure and at least one through via hole are formed.

In other words, according to the present feature means, the step consisting of 11 is continuously performed, so that the blind via hole and the buried via hole are at least one pair of stacked via holes and at least one through via hole. A multilayer wiring board having a plurality of via holes can be manufactured. The process consisting of 11 firstly consists of a simple process, secondly, a thermal load is applied to vaporize the low boiling point organic compound from the insulating paste, and thirdly, a multilayer substrate is constructed. In addition, a stress load sufficient to apply a compressive load is applied, and fourthly, the formation of the conductive layer is not a plating process but a vacuum impregnation of a conductive paste, and a chemical load due to the plating process is not applied. The yield is remarkably improved and the multilayer wiring board can be manufactured at a low cost.
The first, third and sixth steps are simply steps for providing a through hole in the substrate. In addition, since a through-hole is provided in a single substrate, even if the through-hole is formed by laser irradiation, a load due to laser irradiation is not applied to other substrates or base materials. In other words, in a conventional multilayer substrate having a build-up structure, a laser beam is applied to the multilayer substrate that is in the process of build-up to provide a through hole, so that a load due to laser irradiation is applied to the multilayer substrate that is in the process of build-up. .
The second, fourth and fifth steps are simply steps in which a through hole is formed in the substrate, and then the surface except the portion where the wiring pattern and the through hole pad are formed is screen printed with an insulating paste. is there. In addition, since a through-hole is provided in a single substrate, even if the through-hole is formed by laser irradiation, a load due to laser irradiation is not applied to other substrates or base materials.
The seventh step is a step in which the substrates are stacked and the substrates are stacked by applying a compressive load.
The eighth step is simply a step of placing the laminated multilayer substrate in a vacuum impregnation apparatus. The ninth step is a step in which the vacuum impregnation apparatus is evacuated and then the conductive paste is supplied to the vacuum impregnation apparatus. The tenth step is a step of returning the vacuum impregnation apparatus to the atmospheric pressure or only supplying compressed air. In the eleventh step, the laminated multilayer substrate is taken out from the vacuum impregnation apparatus, and wiring patterns of through via holes and blind via holes and pads for the through holes are formed on the surface layer of the laminated multilayer substrate. Except for the part, it is a process in which the insulating paste is screen-printed and then heat-treated.
As described above, since the process consisting of 11 is a simple process, a plurality of stacks of at least one stack via structure in which the blind via hole and the buried via hole are electrically connected and at least one of the through via holes are provided. The yield of the multilayer wiring board in which the via hole is formed is significantly improved, and the multilayer wiring board can be manufactured at low cost.
That is, according to this feature means, in the multilayer substrate, first, all the through holes of the substrate constituting the through via hole overlap, and secondly, all the through holes of the substrate constituting the blind via hole overlap, Third, all through holes of the substrate constituting the via via hole overlap, and fourth, the substrate on which the wiring pattern of the through via hole, the blind via hole, and the buried via hole is formed, and the blind via hole is electrically connected to the buried via hole. the substrate to be, part of the pad for the wiring pattern through holes are formed, voids are formed by insulating paste, fifth, all voids leads to the through-hole. In addition, a multilayer substrate is formed by laminating a single substrate to form a plurality of via holes including at least one set of stacked via holes in which blind via holes and buried via holes are electrically connected, and at least one through via hole.
Next, when the laminated multilayer substrate is vacuum impregnated with the conductive paste, the conductive paste penetrates from the bottom through hole of the through via hole and the through hole in the surface layer of the blind via hole, and all the through holes are conductive. The conductive paste penetrates into the gap between the wiring pattern and the pad for the through hole from the through hole, and is filled with the conductive paste. At this time, since the vacuum impregnation apparatus is in a state close to vacuum, an organic compound having a low boiling point is vaporized from the conductive paste, and the conductive paste becomes a conductive material in which a collection of metal powder is dispersed in a binder at a high concentration. As a result, all the through holes are filled with the conductive material in a single treatment by vacuum impregnation, and the gaps between the wiring patterns and the pads for the through holes are filled with the conductive material. On the other hand, since the surface layer of the laminated multilayer board is covered with a conductive material, screen printing is performed except for the portion where the wiring pattern of the through via hole and the blind via hole and the pad for the through hole are formed with an insulating paste, and then When the heat treatment is performed, a conductive layer is formed on the surface layer on the wiring pattern and the through hole pad, and the through hole pad is electrically connected to the through hole.
As described above, at least one set of stack vias in which the blind via hole and the buried via hole are electrically connected by stacking the substrate once, performing the vacuum impregnation process once, and forming the insulating layer on the surface substrate. A multilayer wiring board having a plurality of via holes each having a structure and at least one through via hole is manufactured. For this reason, the yield of the multilayer wiring board is remarkably improved and the manufacturing cost is remarkably reduced. If one through via hole is used as the heat conduction path among the plurality of through via holes, the multilayer wiring board will not be excessively heated, and the electronic component mounted on the board will not fail.
Further, in the method of manufacturing a multilayer wiring board according to the present feature means, since the heat treatment is only to vaporize a low boiling point organic compound from the insulating paste, the material of the board is not limited to flame retardant or non-flame retardant. Base material phenolic resin, paper base material epoxy resin, glass cloth base material epoxy resin, glass cloth base material polyimide resin, paper glass cloth base material epoxy resin, glass cloth glass nonwoven fabric base material epoxy resin, glass cloth base material fluorine resin, etc. A general-purpose board currently used for printed wiring boards made of various materials can be used.
Further, the through via hole, the blind via hole, and the buried via hole manufactured by the characteristic means form a conductive layer in which the through hole is filled with the conductive material and the through hole pad is continuous with the through hole. Therefore, a pad-on-via structure in which the through-hole pad and the via land are made common is formed, and a via-on-via structure in which the via hole is superimposed directly on the via hole is formed. For this reason, an electronic component such as an IC chip, a capacitor, or a resistor can be mounted immediately above the through via hole and the blind via hole. When chip electronic components such as ICs, capacitors, varistors, inductors, filters or resistors are arranged on the substrate that constitutes the via via hole in advance and a multilayer wiring board is manufactured based on this feature means, Chip electronic components can be mounted.
On the other hand, even if the gap into which the conductive material permeates has a thickness and line width of about 30 μm, or the through hole is a fine hole with a diameter close to 30 μm, a differential pressure close to atmospheric pressure acts on the gap and the through hole. The conductive material penetrates into the gap and the through hole. When the viscosity of the conductive material is too high, if compressed air is supplied to the vacuum impregnation device, a differential pressure close to the compressed air pressure acts on the gap and the through hole. It penetrates through the through hole.
That is, the laminated multilayer substrate is placed in a vacuum impregnation apparatus, and then the vacuum impregnation apparatus is evacuated. Further, the laminated multilayer substrate is filled with a conductive paste. Thereby, the space | gap and through-hole in which the wiring pattern and the pad for through-holes are formed will be in the state near vacuum once. At this time, an organic compound having a low boiling point is vaporized from the conductive paste, and the conductive paste becomes a conductive material in which a collection of metal powders is dispersed in a binder at a high concentration. Thereafter, when the vacuum impregnation apparatus is opened to the atmosphere, a differential pressure close to atmospheric pressure acts on the gap and the through hole. Due to this differential pressure, the conductive material penetrates from the lowest through hole in the through via hole and from the through hole in the surface layer of the blind via hole, and penetrates into all the gaps and through holes. On the other hand, when the viscosity of the conductive material to be vacuum-impregnated is too high, if compressed air is supplied to the vacuum impregnation device, a differential pressure close to the compressed air pressure acts on the gap and the through hole, and a conductive paste having a high viscosity is obtained. Osmose | permeates a space | gap and a through-hole.
On the other hand, the insulating paste screen-printed on the surface excluding the part where the wiring pattern and the pad for the through hole are formed also evaporates low boiling point organic compounds by vacuum evacuation, and the insulating powder has a high concentration of binder. It remains as an insulating material dispersed in. As a result, the conductive material cannot permeate the gap between the substrates from the joints of the laminated multilayer substrates. Moreover, although a conductive material adheres to the side surface of the laminated multilayer substrate, since the insulating material remains on the surface of the substrate on which the wiring pattern is formed, insulation between different substrates is ensured by the insulating paste.
As a result, a conductive layer in which all the through holes are conducted, a conductive layer in which the wiring pattern is conducted to the through hole pads, and a conductive layer in which the through hole pads are conducted to the through holes are formed. On the other hand, an insulating layer made of an insulating material is formed except for a portion where a wiring pattern of through via holes, blind via holes, buried via holes, and pads for through holes are formed, and insulation between substrates is secured. In the substrate on which the wiring pattern and the through hole pad are formed, unnecessary gaps are not formed if the conductive layer and the insulating layer have the same thickness. Furthermore, the surface layer of the laminated multilayer substrate is screen-printed except for the portion where the wiring pattern of the through via hole and the blind via hole and the pad for the through hole are formed with an insulating paste, and then heat-treated, and the wiring pattern is formed on the surface layer. A conductive layer is formed on the through hole pad, and the through hole pad is electrically connected to the through hole.
As the conductive paste, a paste in which a collection of metal powders is dispersed in a binder with a high-boiling organic compound and a low-boiling organic compound that adjusts the viscosity can be used. Thus, a conventional general-purpose paste material can be used because a paste in which the powder is dispersed in a high-boiling organic compound binder and a low-boiling organic compound for adjusting the viscosity can be used.
As described above, according to the feature means, the blind via hole and the buried via hole are electrically connected by one-time lamination of the substrate, one-time vacuum impregnation treatment, and formation of the insulating layer on the surface layer substrate. A plurality of via holes including at least one stacker via structure and at least one through via hole are formed in the multilayer wiring board. As a result, among the four problems described in the 12th paragraph, according to the method of manufacturing a multilayer wiring board in which a plurality of via holes including a via hole and a stack via structure in which a blind via hole and a conductive via hole are electrically connected are formed, Three issues except the third issue can be solved simultaneously.
In the above, the manufacturing method of the multilayer wiring board in which the at least 1 set of stack via structure which a blind via hole and a buried via hole conduct | electrically_connect, and at least 1 penetration via hole was formed was demonstrated. According to this characteristic means, a second blind via hole is formed together with the first blind via hole, and a second buried via hole is formed together with the first buried via hole. The buried via hole can be made conductive. As a result, two sets of stack via structures are formed in which the blind via hole is electrically connected to the buried via hole. Furthermore, the stack blind via structure in which the first blind via hole is conducted to the second blind via hole and the first buried via hole is conducted to the second buried via hole forms a wiring pattern in which the via holes are conducted to each other. It can be easily formed by changing the arrangement position of the substrate to be formed in the multilayer substrate. Further, a plurality of through via holes can be formed according to the number of through holes provided in the substrate on which the through via hole is formed. Furthermore, if the substrate through which the blind via hole and the buried via hole are made of is composed of a plurality of different substrates, a plurality of sets of stacker via structures in which the blind via hole and the buried via hole are conducted through a plurality of different substrates are formed. Is done. These are merely examples of a multilayer wiring board in which a stack via structure and a through via hole in which a blind via hole and a buried via hole are conducted are formed. That is, since the feature means first processes the through holes in the single substrate, the position and number of the through holes provided in the substrate are not limited. Secondly, the substrate on which the wiring pattern and the through-hole pad are formed has a space formed in advance in the portion where the wiring pattern and the through-hole pad are formed by screen printing of the insulating paste on the single substrate. When this substrate is laminated as a multilayer substrate, the order of lamination can be arbitrarily changed, so the substrates are laminated at arbitrary positions, and then vacuum-impregnated with a conductive paste. Therefore, a substrate in which via holes are electrically connected can be stacked on the multilayer distribution substrate at an arbitrary position. Therefore, according to this feature means, a plurality of sets of stacker via structures in which the blind via hole and the buried via hole are conducted can be formed as various stacker via structures. Also, with respect to the through via hole, a plurality of through via holes can be formed in various structures. As a result, according to this characteristic means, the manufacturing method of the multilayer wiring board in which a plurality of via holes including a via via hole and a stack via structure in which a blind via hole and a conductive via hole are electrically connected are described in the 12th paragraph. Three problems can be solved. For this reason, all of the four problems described in the 12th paragraph are achieved by a method of manufacturing a multilayer wiring board in which a plurality of via holes including a through via hole and a stack via structure in which a blind via hole and a conductive via hole are electrically connected are formed. Solvable.

According to a ninth feature of the present invention, there is provided a stacker via structure in which one buried via hole is electrically connected to another blind via hole. And a manufacturing method for manufacturing a multilayer wiring board in which a plurality of via holes including at least one through via hole are formed, and the manufacturing method for manufacturing the multilayer wiring board includes:
When both the surface layer substrate on which the through via hole is formed and the substrate on which the wiring pattern is not formed, the substrate constituting the through via hole is overlapped, at least at a position where all the through holes overlap to form a through hole. The first step of providing one through hole and the substrate on which the wiring pattern is formed are overlapped with the substrate constituting the through via hole at a position corresponding to the central portion where the pad for the through hole is formed. And at least one through-hole at a position where all the through-holes overlap to form a through-hole, and a surface excluding a portion where the wiring pattern and the through-hole pad are formed , Both the second step of screen printing with an insulating paste, the surface layer substrate constituting the blind via hole, and the substrate excluding the innermost substrate The position corresponding to the central portion where the pad for the through-hole is formed, and the position where the through-hole is overlapped when the substrates constituting the blind via hole are overlapped with each other. And a third step of providing a through hole, and an innermost substrate constituting the blind via hole and an outermost substrate constituting the first buried via hole, for two through holes. A position corresponding to the center portion of each pad where the pad is formed and a position where the through holes overlap each other when the substrates constituting the blind via hole are overlapped, and the first buried via hole is formed. When the substrates to be stacked are overlapped, a through hole is provided at a position where the through holes overlap with each other, and further connected to the first buried via hole. A fourth step of screen-printing the surface excluding the wiring pattern and the portion where the two through-hole pads are formed with an insulating paste, and the innermost substrate constituting the first buried via hole A position corresponding to the central portion of each pad where the pads for two through holes are formed, and the positions where the through holes overlap when the substrates constituting the first buried via hole are overlaid However, when the substrate constituting the second buried via hole is overlapped with the position, the wiring pattern in which the through hole is provided at the position where the through hole overlaps with each other and further conductive to the second buried via hole is provided. And a second step of screen-printing the surface excluding the portion where the two through-hole pads are formed with an insulating paste, and a first veri fi cation excluding the two substrates. The substrate constituting the over de hole and overlapping the substrate constituting the first berries de via hole, the position for forming a hole penetrating overlap all the through-hole, a sixth step of forming a through hole, the second The innermost substrate constituting the buried via hole is a position corresponding to the central portion where the pad for the through hole is formed, and when the substrates constituting the second buried via hole are overlapped, A through hole is provided at a position where the through hole overlaps to form a through hole, and the surface excluding a portion where the wiring pattern leading to the end of the substrate and the through hole pad are formed is provided. , constituting a seventh step of screen printing, the substrate constituting the second berries de hole excluding the two substrates, a second belly de via holes in an insulating paste When the substrates to be stacked are overlapped, the eighth step of providing a through hole at a position where all the through holes overlap to form a through hole, the substrate constituting the through via hole, and the blind via hole are formed. With respect to the substrate, the ninth step of stacking the substrates so that all the through-holes overlap each other and applying a compression load, and the tenth step of placing the stacked substrates in a vacuum impregnation apparatus, An eleventh step of evacuating the vacuum impregnation apparatus and supplying a conductive paste to the vacuum impregnation apparatus, and returning the vacuum impregnation apparatus to atmospheric pressure or supplying compressed air to the vacuum impregnation apparatus. Twelve steps and taking out the laminated substrate from the vacuum impregnation apparatus, and wiring each of the through via hole and the blind via hole with respect to the surface layer substrate of the laminated substrate It consists of a thirteenth step of screen-printing an insulating paste on a portion excluding a portion where the turn and each through-hole pad are formed, and then performing a heat treatment, and these 13 steps are carried out continuously. A manufacturing method manufactures a multilayer wiring board in which a plurality of via holes including a stacked via structure in which one buried via hole is electrically connected to a blind via hole and at least one through via hole is formed. It is a manufacturing method.

That is, according to the present feature means, by continuously performing the process consisting of 13, one buried via hole that conducts between the buried via holes becomes at least one of the stack via structure and the through via hole that conducts to the blind via hole. A multilayer wiring board having a plurality of via holes can be manufactured. The process consisting of 13 firstly consists of a simple process, and secondly, a heat load that vaporizes the low boiling point organic compound from the insulating paste is applied, and thirdly, a multilayer substrate is formed. At the same time, a stress load sufficient to apply a compressive load is applied. Fourth, the formation of the conductive layer is not a plating process but a vacuum impregnation of a conductive paste, and a chemical load due to the plating process is not applied. The yield of a multilayer wiring board in which a plurality of via holes each consisting of a stacked via hole and at least one of a through via hole are significantly improved, and one buried via hole that conducts to each other is significantly improved. Can be manufactured inexpensively.
The first, third, sixth and eighth steps are simply steps for providing a through hole in the substrate. In addition, since a through-hole is provided in a single substrate, even if the through-hole is formed by laser irradiation, a load due to laser irradiation is not applied to other substrates or base materials. In a conventional multilayer substrate having a build-up structure, a laser beam is applied to the multilayer substrate in the process of build-up to provide a through-hole, and thus a load due to laser irradiation is applied to the multilayer substrate in the process of build-up.
In the second, fourth, fifth and seventh steps, a through hole is provided in the substrate, and then the surface except for the portion where the wiring pattern and the through hole pad are formed is screen-printed with an insulating paste. It is only a process. In addition, since a through-hole is provided in a single substrate, even if the through-hole is formed by laser irradiation, a load due to laser irradiation is not applied to other substrates or base materials.
The ninth step is a step in which the substrates are stacked and the substrates are stacked by applying a compressive load.
The tenth step is simply a step of placing the laminated multilayer substrate in a vacuum impregnation apparatus. The eleventh step is a step in which the vacuum impregnation apparatus is evacuated and then the conductive paste is supplied to the vacuum impregnation apparatus. The twelfth step is a step of returning the vacuum impregnation apparatus to the atmospheric pressure or only supplying compressed air. The thirteenth step is to take out the laminated multilayer substrate from the vacuum impregnation apparatus, except on the surface layer of the laminated multilayer substrate, except for the part where the wiring pattern of the through via hole and the blind via hole and the pad for the through hole are formed. In this process, the insulating paste is screen-printed and then heat-treated.
As described above, since the process consisting of 13 is a simple process, one buried via hole in which the buried via holes are connected to each other includes a stack via structure and a through via hole conducting to the blind via hole. The yield of the multilayer wiring board formed with a plurality of via holes is remarkably improved, and the multilayer wiring board can be manufactured at low cost.
That is, according to this feature means, in the multilayer substrate, first, all the through holes of the substrate constituting the through via hole overlap, and secondly, all the through holes of the substrate constituting the blind via hole overlap, Third, all the through holes of the substrate constituting the two via via holes are overlapped, and fourth, the substrate on which a wiring pattern is formed in each of the through via hole, the blind via hole, and the buried via hole, and the blind via hole The substrate on which the wiring pattern that conducts to the via via hole is formed, and the substrate on which the wiring pattern that conducts the via via hole to each other includes a portion on which each wiring pattern and each through hole pad are formed. but voids are formed by insulating paste, fifth, all voids leads to the through-hole. In addition, a multilayer substrate comprising a stack via structure in which one buried via hole is electrically connected to a blind via hole and a plurality of via holes each including at least one through via hole is formed by laminating the substrates once. It is formed.
Next, when the laminated multilayer substrate is vacuum-impregnated with the conductive paste, the conductive paste penetrates from the lowermost through hole of the through via hole and the through hole of the surface layer of the blind via hole, and all the through holes pass through the conductive paste. In addition, the conductive paste penetrates through the through holes into the gaps made up of the wiring patterns and the pads for the through holes, and is filled with the conductive paste. At this time, since the vacuum impregnation apparatus is in a state close to vacuum, an organic compound having a low boiling point is vaporized from the conductive paste, and the conductive paste becomes a conductive material in which a collection of metal powder is dispersed in a binder at a high concentration. As a result, all the through holes are filled with the conductive material in a single treatment by vacuum impregnation, and the gaps between the wiring patterns and the pads for the through holes are filled with the conductive material. On the other hand, since the surface layer of the laminated multilayer substrate is covered with a conductive material, screen printing with an insulating paste is performed except for the portion where the wiring pattern of the through via hole and the blind via hole and the pad for the through hole are formed. When heat treatment is performed, the conductive layer is formed on the surface layer and the wiring pattern and the through hole pad, and the conductive layer of the through hole pad is electrically connected to the conductive layer of the through hole.
As explained above, one via via is conducted to one blind via hole by conducting one substrate lamination, one vacuum impregnation treatment, and forming an insulating layer on the surface substrate. A multilayer wiring board in which a plurality of via holes including a stacker via structure and at least one through via hole are formed is manufactured. For this reason, the yield of the multilayer wiring board is remarkably improved and the manufacturing cost is remarkably reduced. If one through via hole is used as the heat conduction path among the plurality of through via holes, the multilayer wiring board does not rise in temperature excessively, and the electronic component mounted on the board does not break down.
Further, in the method of manufacturing a multilayer wiring board according to the present feature means, since the heat treatment is only to vaporize a low boiling point organic compound from the insulating paste, the material of the board is not limited to flame retardant or non-flame retardant. Base material phenolic resin, paper base material epoxy resin, glass cloth base material epoxy resin, glass cloth base material polyimide resin, paper glass cloth base material epoxy resin, glass cloth glass nonwoven fabric base material epoxy resin, glass cloth base material fluorine resin, etc. A general-purpose board currently used for printed wiring boards made of various materials can be used.
Further, the through via hole, the blind via hole, and the buried via hole manufactured by the characteristic means form a conductive layer in which the through hole is filled with the conductive material and the through hole pad is continuous with the through hole. Therefore, a pad-on-via structure in which the through-hole pad and the via land are made common is formed, and a via-on-via structure in which the via hole is superimposed immediately above the via hole is formed. For this reason, an electronic component such as an IC chip, a capacitor, or a resistor can be mounted immediately above the through via hole and the blind via hole. In addition, when chip electronic components such as ICs, capacitors, varistors, inductors, filters or resistors are arranged in advance on a substrate that constitutes a via via hole and a multilayer wiring board is manufactured based on this feature means, A chip electronic component can be mounted immediately above.
On the other hand, even if the gap into which the conductive material permeates has a thickness and line width of about 30 μm, or the through hole is a fine hole with a diameter close to 30 μm, a differential pressure close to atmospheric pressure acts on the gap and the through hole. The conductive material penetrates into the gap and the through hole. When the viscosity of the conductive material is too high, if compressed air is supplied to the vacuum impregnation device, a differential pressure close to the compressed air pressure acts on the gap and the through hole. It penetrates through the through hole.
That is, the laminated multilayer substrate is placed in a vacuum impregnation apparatus, and then the vacuum impregnation apparatus is evacuated. Furthermore, the laminated multilayer substrate is filled with a conductive paste. Thereby, the space | gap and through-hole in which a wiring pattern and the pad for through-holes are formed will be in the state near vacuum once. At this time, an organic compound having a low boiling point is vaporized from the conductive paste, and the conductive paste becomes a conductive material in which a collection of metal powders is dispersed in a binder at a high concentration. Thereafter, when the vacuum impregnation apparatus is opened to the atmosphere, a differential pressure close to atmospheric pressure acts on the gap and the through hole, and this differential pressure causes the bottom via hole at the bottom of the through via hole and the surface layer of the blind via hole. The conductive material penetrates from the through holes and penetrates all the gaps and the through holes. On the other hand, when the viscosity of the conductive material to be vacuum-impregnated is too high, if compressed air is supplied to the vacuum impregnation device, a differential pressure close to the compressed air pressure acts on the gap and the through hole, and a conductive paste having a high viscosity is obtained. Osmose | permeates a space | gap and a through-hole.
On the other hand, the insulating paste screen-printed on the surface excluding the part where the wiring pattern and the pad for the through hole are formed also evaporates low boiling point organic compounds by vacuum evacuation, and the insulating powder has a high concentration of binder. It remains as an insulating material dispersed in. As a result, the conductive material cannot permeate the gap between the substrates from the joints of the laminated multilayer substrates. Moreover, although a conductive material adheres to the side surface of the laminated multilayer substrate, since the insulating material remains on the surface of the substrate on which the wiring pattern is formed, insulation between different substrates is ensured by the insulating paste.
As a result, a conductive layer in which all the through holes are conducted, a conductive layer in which the wiring pattern is conducted to the through hole pads, and a conductive layer in which the through hole pads are conducted to the through holes are formed. That is, the conductive layer in which all the through holes are made conductive by the conductive material to all the through holes constituting the through via holes, all the through holes constituting the blind via holes, and all the through holes constituting the two buried via holes. Is formed. A conductive layer is formed of a conductive material at a portion where a wiring pattern formed in each of the through via hole, the blind via hole, and the two buried via holes and a pad for the through hole are formed, and the wiring pattern of the through via hole penetrates. The through hole is connected to the through hole through the pad for the hole, the wiring pattern of the blind via hole is connected to the through hole through the through hole pad, and the wiring pattern of the blind via hole is connected to the buried via hole is the through hole pad. Conduction through the through hole. Furthermore, a conductive material is provided in a portion where a wiring pattern and a through hole pad are formed where the blind via hole is conducted to the buried via hole, and a portion where the wiring pattern and the through hole pad are formed where the buried via hole is conducted. In addition, a conductive layer is formed, and a conductive layer in which a wiring pattern in which buried via holes are connected to each other forms a conductive layer in which the through hole pad is connected to the through hole, A conductive layer in which each wiring pattern of one buried via hole is connected to the through hole pad and a conductive layer in which the through hole pad is connected to the through hole are formed.
On the other hand, an insulating layer made of an insulating material is formed except for the part where the wiring pattern of each of the through via hole, the blind via hole and the buried via hole and the pad for the through hole are formed, and insulation between the substrates is ensured. . In the substrate on which the wiring pattern and the through hole pad are formed, unnecessary gaps are not formed if the conductive layer and the insulating layer have the same thickness.
Furthermore, the surface layer of the laminated multilayer substrate is screen-printed with an insulating paste except for the part where the wiring pattern of the through via hole and the blind via hole and the pad for the through hole are formed, and then heat-treated to wire the surface layer. A conductive layer composed of a pattern and a through-hole pad is formed, and a conductive layer in which the through-hole pad is electrically connected to the through-hole is formed.
As the conductive paste, a paste in which a collection of metal powders is dispersed in a binder with a high-boiling organic compound and a low-boiling organic compound that adjusts the viscosity can be used. Thus, a conventional general-purpose paste material can be used because a paste in which the powder is dispersed in a high-boiling organic compound binder and a low-boiling organic compound for adjusting the viscosity can be used.
As described above, according to the present feature means, one of the via via holes is electrically connected to each other by stacking the substrates once, performing the vacuum impregnation process once, and forming the insulating layer on the surface substrate. A plurality of via holes including a stacked via structure in which the buried via hole is electrically connected to the blind via hole and at least one through via hole are formed in the multilayer wiring board. As a result, according to the manufacturing method of the multilayer wiring board in which a plurality of via holes each including a stacked via structure in which one buried via hole is electrically connected to a blind via hole and a plurality of via holes are formed, Of the four issues described in, three issues except the third issue can be solved simultaneously.
The manufacturing method of the multilayer wiring board in which one buried via hole in which the buried via holes are electrically connected to the blind via hole and at least one through via hole has been described above has been described. According to the present feature, the second blind via hole is formed together with the first blind via hole, and the third buried via hole and the fourth buried via hole are formed together with the first buried via hole and the second buried via hole. And the innermost substrate of the second blind via hole is electrically connected to the outermost substrate of the third buried via hole, and the innermost substrate of the third blind via hole is the fourth belly. It can be configured to conduct to the outermost substrate of the via hole, thereby forming two sets of stacker via structures. Furthermore, the first blind via hole is conducted to the second blind via hole, the first buried via hole is conducted to the third buried via hole, and the second buried via hole is further connected to the fourth buried via hole. A stack via structure that conducts to a via hole can be easily formed by changing the arrangement position of a substrate on which a wiring pattern that conducts via holes is formed in a multilayer substrate. Further, a plurality of through via holes can be formed according to the number of through holes provided in the substrate on which the through via hole is formed. These are merely examples of a multilayer wiring board in which a plurality of via holes each including a stacked via hole in which a buried via hole conducting a blind via hole and a through via hole are formed. That is, since the feature means first processes the through holes in the single substrate, the position and number of the through holes provided in the substrate are not limited. Second, the substrate on which the wiring pattern and the through-hole pad are formed has a gap formed in advance in the portion where the wiring pattern and the through-hole pad are formed by screen printing of an insulating paste on the single substrate. When laminating the substrate as a multilayer substrate, the order of lamination can be arbitrarily changed. Therefore, the substrate is laminated at an arbitrary position, and then the conductive paste is impregnated with vacuum. Therefore, a substrate in which via holes are electrically connected can be stacked on the multilayer distribution substrate at an arbitrary position. For this reason, according to the present feature means, a plurality of via holes including a stack via structure having various structures in which a buried via hole conducting between the via via holes and a through via hole having various structures are conducted to the blind via hole. Can be manufactured. As a result, a plurality of via holes including a stacked via structure in which one buried via hole is electrically connected to another blind via hole and a through via hole are formed in the multilayer wiring board manufacturing method according to the 12th paragraph. Three problems can be solved. For this reason, according to the manufacturing method of the multilayer wiring board in which a plurality of via holes including a stacked via structure in which one via hole is electrically connected to another blind via hole and a plurality of via holes are formed in 12 paragraphs, All four issues described can be solved.
As described above in paragraphs 13 to 30, it is possible to manufacture a multilayer wiring board in which via holes having various structures are formed by using nine feature means including the first feature means to the ninth feature means. It was. As a result, according to the present invention, various via holes are formed as conductive layers regardless of the type of via hole, the via structure, the number of via holes, and the number of via structures, and the via holes are wired through the through-hole pads. A multilayer wiring board on which a conductive layer conducting to the pattern is formed is manufactured. As a result, according to the present invention, all the four problems described in the 12th paragraph can be solved by the manufacturing method for manufacturing a multilayer wiring board in which via holes having various structures are formed.

The tenth characteristic means related to the manufacturing method for manufacturing a multilayer wiring board in which via holes having various structures are formed in the present invention is the first characteristic means to the ninth characteristic means excluding the third characteristic means and the fifth characteristic means. In the manufacturing method for manufacturing a multilayer wiring board described in any of the feature means, any feature of the first feature means to the ninth feature means, excluding the third feature means and the fifth feature means. The conductive paste described in the means is obtained by dispersing a metal compound that precipitates metal by pyrolysis in alcohol, and mixing the alcohol dispersion with an organic compound having a boiling point lower than the temperature at which the metal compound is thermally decomposed. This is a conductive paste.

That is, according to this characteristic means, as the pressure of the vacuum impregnation apparatus decreases, alcohol is vaporized from the conductive paste, and the conductive paste has a high-boiling organic compound with a fine powder of metal compound. A suspension dispersed in concentration. Further, when the vacuum impregnation apparatus is evacuated, the space on the substrate surface where the wiring pattern and the through hole pad are formed and the through hole are in a state close to a vacuum. After that, when the vacuum impregnation apparatus is opened to the atmosphere, or when compressed air is supplied, a differential pressure close to atmospheric pressure or a differential pressure close to compressed air pressure acts on the voids and through holes on the substrate surface. The suspension penetrates through the through-holes and voids, and all the through-holes and voids are filled with the suspension.
That is, since the vacuum impregnation apparatus is evacuated, the voids and the through holes on the surface of the substrate are once in a vacuum state. At this time, the low boiling point alcohol occupying most of the dispersion is vaporized from the dispersion in which the metal compound is dispersed in the molecular state in the alcohol, and the metal compound crystal is precipitated as a fine powder on the high boiling point organic compound. The conductive paste becomes a suspension in which a fine powder of a metal compound is dispersed in an organic compound having a high concentration and a high boiling point. Thereafter, when the vacuum impregnation apparatus is returned to atmospheric pressure or compressed air is supplied, a differential pressure close to the atmospheric pressure or a differential pressure close to the compressed air pressure acts on the voids and the through holes on the substrate surface. Even if the suspension has a high viscosity, or the gap is narrow and the through-holes are fine, the suspension penetrates into all the through-holes and the gaps without gaps, and the gaps and the through-holes are suspended. Filled with turbid liquid.
Thereafter, the laminated multilayer substrate is taken out from the vacuum impregnation apparatus and heat-treated. Initially, a trace amount of high-boiling organic compound is vaporized. When the organic compound is vaporized, the volume of the conductive layer that forms the wiring pattern and the pad for the through hole is slightly reduced. However, since the compressive load is applied to the laminated multilayer substrate, the substrates are slightly close to each other. Then, the fine powder of the metal compound enters the irregularities on the substrate surface and fills the fine gaps between the substrates. Even in the through-hole, a small amount of high-boiling organic compound is vaporized and the volume of the conductive layer is slightly reduced, but when the substrates approach each other, the metal from the narrow gap where the through-hole pad is formed Part of the fine powder of the compound is extruded, and the through-hole is also filled with a collection of fine powder of the metal compound.
When the temperature is further increased, thermal decomposition of the metal compound starts, and the metal compound is decomposed into a metal and an inorganic or organic substance. When the temperature is further increased, the inorganic substance or the organic substance is vaporized, and a collection of metal fine particles having a size of 10 to 100 nm is deposited. As a result, the narrow gap and the through hole in which the wiring pattern and the through hole pad are formed are filled with the collection of metal fine particles, and a conductive layer made up of the metal fine particles is formed.
That is, the metal compound is separated into a metal (in a molecular cluster state) and an inorganic or organic substance by thermal decomposition, the metal having a large specific gravity stays, and the inorganic or organic substance having a low specific gravity moves onto the metal. When the temperature further rises, the heat of vaporization is taken away and the inorganic or organic matter is vaporized. When the vaporization of the inorganic substance or organic substance is completed, the metal obtains thermal energy to form granular fine particles, stabilizes and finishes the thermal decomposition. As a result, a collection of metal fine particles is deposited in the narrow gap and the through hole in which the wiring pattern and the through hole pad are formed.
On the other hand, since the granular metal fine particles precipitated by the thermal decomposition of the metal compound are in an active state having no impurities, they are metal-bonded at a site where the granular fine particles are in contact with each other to form a collection of metal-bonded metal fine particles. . For this reason, it is easily deformed when stress is applied to the collection of metal fine particles. Therefore, since compressive stress is applied to the substrates, when voids are formed in the minute gaps between the substrates, the collection of metal fine particles that are metal-bonded to fill the voids is deformed, and the collection of metal fine particles is It enters into the irregularities on the substrate surface and fills the fine gaps between the substrates.
The through holes are also filled with a collection of fine powders of the metal compound. However, when the metal compound is thermally decomposed, a collection of metal fine particles is deposited in the through holes. At this time, a collection of metal fine particles simultaneously precipitates in a minute gap between the substrate on which the wiring pattern and the through hole pad are formed, so that the wiring pattern and the through hole pad are continuously connected to the through hole. The conductive layer to be formed is formed of a collection of metal fine particles that are metal-bonded.
As described above, according to this feature means, when the metal compound filling the through hole, the wiring pattern, the through hole pad, and the through hole is thermally decomposed, a collection of metal fine particles having a size of 10 to 100 nm is formed. The wiring pattern, the through hole pad, and the through hole are simultaneously deposited. For this reason, even if the wiring pattern has a thickness and line width of about 30 μm, and even if the through hole is a micro hole with a diameter close to 30 μm, the metal-bonded metal fine particles are collected in the wiring pattern and the through hole pad. And a conductive layer that is continuously connected to the through hole. In addition, since a compressive stress is applied to the laminated multilayer substrate, when a void is formed in the gap between the substrates, a collection of metal bonded metal fine particles is deformed to fill the void, and the metal bonded metal fine particles The gathers are deformed by compressive stress and enter the irregularities on the substrate surface. For this reason, the conductive layer that continuously conducts the wiring pattern, the through-hole pad, and the through-hole does not peel from the gap between the substrates.

The eleventh characteristic means related to the manufacturing method for manufacturing a multilayer wiring board in which via holes having various structures are formed in the present invention is the manufacturing method for manufacturing a multilayer wiring board described in the tenth characteristic means. The metal compound described in the tenth feature lies in that the ligand composed of an inorganic molecule or ion is a metal complex having a metal complex ion coordinated to the metal ion.

That is, according to this feature means, the metal compound described in the tenth feature means is composed of a metal complex, so that the conductive paste is vacuum-impregnated into the multilayer substrate, and the multilayer substrate is further heat-treated in a reducing atmosphere. , A metal complex thermally decomposed at a relatively low temperature of 180 to 220 ° C., a collection of granular metal fine particles falling in a size range of 10 to 100 nm is deposited, and a metal in which adjacent granular metal fine particles are metal-bonded By the collection of fine particles, a conductive layer is formed in which the wiring pattern, the through hole pad, and the through hole are continuously conducted. As a result, a conductive layer is formed on the surface of a multilayer substrate made of a base material constituting a general-purpose printed wiring board such as a paper phenol board, a paper epoxy board, a glass composite board, or a glass epoxy board.
The temperature at which the metal complex is thermally decomposed is lower than the boiling point of the organic compound used as the raw material for the insulating paste described in the eleventh feature means, and the metal complex is thermally decomposed to precipitate a collection of metal fine particles. Even after the formation of the conductive layer made of a collection of metal fine particles on the through hole, the wiring pattern, and the through hole pad, the tenth surface is formed on the surface of the substrate on which the wiring pattern and the through hole pad are formed. The organic compound described in one feature means continues to form an insulating layer.
That is, when a metal complex having a metal complex ion in which a ligand composed of an inorganic molecule or ion is coordinated to a metal ion is heat-treated in a reducing atmosphere, the molecular weight of the ligand composed of the inorganic molecule or ion is small. For this reason, the coordination bond is first divided at 150-190 ° C., which is a relatively low temperature, and decomposed into an inorganic substance and a metal. When the temperature is further increased, the inorganic substance having a low molecular weight easily takes the heat of vaporization and vaporizes, and after the vaporization of all the inorganic substances is completed, the metal is deposited at a temperature of 180 to 220 ° C. That is, the metal ion is the largest among the ions constituting the metal complex. For this reason, the distance between the metal ion and the ligand is the longest. Accordingly, when the metal complex is heat-treated in a reducing atmosphere, the coordination bond portion where the metal ion is bonded to the ligand is first divided and decomposed into a metal and an inorganic substance. When the temperature further rises, the inorganic material takes the heat of vaporization and vaporizes, and after all the inorganic material is vaporized, the metal obtains thermal energy, stabilizes by forming particulate fine particles, and finishes thermal decomposition. As a result, a collection of metal fine particles is deposited. As such a metal complex, an ammonia complex in which ammonia NH ₃ is coordinated to a metal ion as a ligand, an aqua complex in which water H ₂ O is coordinated to a metal ion as a ligand, a chlorine ion, Cl ^- is, or chlorine ions Cl ^- and chloro complexes and ammonia NH ₃ is coordinated to the metal ion is a ligand, a cyano group CN ^- is coordinated to the metal ion becomes ligand ions cyano complexes, bromide Br ^- various such iodine complex is coordinated to the metal ion becomes ligand ions ^- bromo complex, iodide ions I of coordinating to the metal ion becomes ligand ions A metal complex is mentioned.
These metal complexes are the metal complexes that are the easiest to synthesize among the metal complexes, and are the cheapest metal complexes. Furthermore, ammine complexes and chloro complexes are metal complexes that are easier to synthesize and less expensive than metal complexes in which other inorganic molecules or ions form ligands.
A metal complex having such properties is dispersed in alcohol, and an organic compound is dissolved or mixed in the dispersion to prepare a conductive paste. When a multilayer substrate laminated with this conductive paste is vacuum-impregnated and heat-treated in a reducing atmosphere, after the alcohol and organic compound are vaporized, the thermal decomposition of the metal complex proceeds simultaneously in the surface of the substrate and in the through-holes. Is formed of a collection of granular metal fine particles falling within a range of 10 to 100 nm, and a conductive layer is formed in which the wiring pattern, the through hole pad, and the through hole are continuously conducted.
As described above, according to this feature means, the metal complex is completely thermally decomposed at a relatively low temperature of 180 to 220 ° C. in a reducing atmosphere, and metal fine particles are deposited. For this reason, a conductive layer can be formed on the surface of a multilayer substrate made of a base material constituting a general-purpose printed wiring board. Metal complexes are industrial chemicals that are easy to synthesize and inexpensive, and a multilayer wiring board in which various via holes are formed can be manufactured at low cost.

A twelfth feature means related to a manufacturing method for manufacturing a multilayer wiring board in which via holes having various structures are formed in the present invention is the manufacturing method for manufacturing a multilayer wiring board described in the tenth feature means. metal compounds described tenth feature means, the oxygen ions constituting the carboxyl group in the carboxylic acid is covalently bound to the metal ion, wherein the carboxylic acid is in that it is a carboxylic acid metal compound that consists of saturated fatty acids.

That is, according to this feature means, in order to form the metal compound described in the tenth feature means with a carboxylic acid metal compound, a multilayer paste is vacuum impregnated with a conductive paste containing the carboxylic acid metal compound, When the multilayer substrate is heat-treated in the air atmosphere, it thermally decomposes at a temperature of 290-400 ° C. according to the boiling point of the carboxylic acid, and a collection of granular metal fine particles having a size in the range of 10-100 nm is precipitated, and the adjacent granular A collection of metal fine particles obtained by metal bonding of the metal fine particles forms a conductive layer in which the wiring pattern, the through hole pad, and the through hole are continuously conducted. Therefore, such a carboxylic acid metal compound becomes a raw material of the conductive paste described in the tenth feature means. As a result, a conductive layer is formed not only on the ceramic substrate but also on the surface of the multilayer wiring substrate made of a heat-resistant synthetic resin substrate.
The temperature at which the carboxylic acid metal compound is thermally decomposed is lower than the boiling point of the organic compound that is the raw material of the insulating paste, so that the carboxylic acid metal compound is thermally decomposed to precipitate a collection of metal fine particles. Insulating layers made of organic compounds may continue to be formed on the substrate on which the wiring pattern and the through hole pads are formed even after the conductive layer made of a collection of metal fine particles is formed on the through hole pads. it can.
That is, the metal ion is the largest among the ions constituting the carboxylate metal compound. Therefore, in the carboxylate metal compound in which the oxygen ion constituting the carboxyl group is covalently bonded to the metal ion, the distance between the oxygen ion constituting the carboxyl group and the metal ion is longer than the distance between the other ions. When heat treatment is performed in a carboxylic acid metal compound having such molecular structure characteristics in the air atmosphere, when the boiling point of the carboxylic acid is exceeded, the bond between the oxygen ion and the metal ion constituting the carboxyl group is first divided, and the carboxylic acid And metal. In addition, when the carboxylic acid is composed of saturated fatty acids, the carboxylic acid takes the heat of vaporization and evaporates, depending on the boiling point of the carboxylic acid, because there is no unsaturated structure in which the carbon atoms are excessive relative to the hydrogen atoms. In addition, all the carboxylic acid is vaporized at a temperature of 290 to 400 ° C. to deposit a metal. Such carboxylic acid metal compounds include carboxylic acid metal compounds composed of saturated fatty acids such as octyl acid metal compounds, lauric acid metal compounds, and stearic acid metal compounds.
In addition, since the carboxylic acid metal compound consisting of an unsaturated fatty acid has an excess of carbon atoms relative to the hydrogen atom as compared with the carboxylic acid metal compound consisting of a saturated fatty acid, a metal oxide is deposited by thermal decomposition. For example, for copper oleate, copper oxide Cu ₂ O and copper oxide CuO are deposited at the same time and require processing costs for reduction to copper. In particular, copper oxide Cu ₂ O needs to be reduced to copper in a reducing atmosphere after being once oxidized to copper oxide CuO in an atmosphere richer in oxygen gas than the air atmosphere, and thus the cost of the reduction treatment is increased.
Furthermore, carboxylic acid metal compounds are inexpensive industrial chemicals that can be easily synthesized. That is, when a general-purpose carboxylic acid is reacted with a strong alkali, a carboxylic acid alkali metal compound is produced. Thereafter, when the carboxylic acid alkali metal compound is reacted with an inorganic metal compound, carboxylic acid metal compounds composed of various metals are obtained. Synthesized. Moreover, the carboxylic acid used as a raw material is an organic acid having a relatively low boiling point among the boiling points of the organic acid, and the metal is deposited in the temperature range of 290 to 400 ° C. in the atmospheric air according to the boiling point of the carboxylic acid. . The carboxylic acid metal compound is a general-purpose industrial chemical that is cheaper than the metal complex described in the twelfth feature means.
As described above, the carboxylic acid metal compound in the feature means is a raw material for the conductive paste.

A thirteenth feature means related to a method of manufacturing a multilayer wiring board having via holes having various structures according to the present invention is the manufacturing method of manufacturing a multilayer wiring board described in the tenth feature means. The organic compound described in the tenth feature means is any organic compound consisting of carboxylic acid esters or glycol ethers, and the organic compound is first dissolved or mixed in alcohol, and secondly. The alcohol-dissolved solution or alcohol-mixed solution has a higher viscosity than the alcohol, and thirdly, an organic compound having these three properties, the boiling point being lower than the temperature at which the metal compound described in the tenth feature means is thermally decomposed. It is a compound.

That is, according to this feature means, since the organic compound has three properties, the organic compound is a raw material for the conductive paste described in the tenth feature means. As such an organic compound, among organic compounds composed of carboxylic acid esters or glycol ethers, an organic compound having a relatively small molecular weight has the above three properties.
That is, when the metal compound described in the tenth feature means is the metal complex described in the eleventh feature means, the metal complex described in the eleventh feature means is dispersed in an alcohol, When any one of the organic compounds in the characteristic means is mixed with the alcohol dispersion, a conductive paste having a higher viscosity than the alcohol dispersion can be produced. A multilayer substrate laminated with this conductive paste is vacuum impregnated and further subjected to heat treatment by applying a compressive load. At this time, the alcohol is first vaporized, then the organic compound is vaporized, and the metal complex is further thermally decomposed. As a result, a conductive layer in which the wiring pattern, the through-hole pad and the through-hole are continuously conducted is formed on the surface of the laminated substrate.
Further, when the metal compound described in the tenth feature means is the carboxylic acid metal compound described in the twelfth feature means, the carboxylic acid that deposits the metal by pyrolysis described in the twelfth feature means. When any organic compound in the feature means is mixed with the alcohol dispersion of the acid metal compound, the conductive paste described in the tenth feature means having a higher viscosity than the alcohol dispersion can be produced. A multilayer substrate laminated with this conductive paste is vacuum impregnated and subjected to heat treatment by applying a compressive load. At this time, the alcohol is first vaporized, then the organic compound is vaporized, and the carboxylic acid metal compound is further thermally decomposed. As a result, a conductive layer in which the wiring pattern, the through-hole pad and the through-hole are continuously conducted is formed on the surface of the laminated substrate.
As explained above, the organic compound of this feature means becomes a raw material for the conductive paste.

A fourteenth feature means related to a manufacturing method for manufacturing a multilayer wiring board in which via holes having various structures are formed according to the present invention is the first feature means excluding the third feature means and the fifth feature means. In the manufacturing method for manufacturing a multilayer wiring board according to any of the ninth characteristic means, any one of the first characteristic means to the ninth characteristic means, excluding the third characteristic means and the fifth characteristic means. The insulating paste described in the characteristic means includes the conductive paste described in any of the first characteristic means to the ninth characteristic means except the third characteristic means and the fifth characteristic means. An organic compound having a boiling point higher than the temperature at which a metal compound that deposits metal by thermal decomposition is thermally decomposed is a mixed solution with an alcohol dissolved or mixed in an alcohol.

That is, according to this feature means, the conductive paste described in any one of the feature means from the first feature means to the ninth feature means except for the third feature means and the fifth feature means. Since the paste contains an organic compound having a boiling point higher than the temperature at which the metal compound that deposits the metal by thermal decomposition is thermally decomposed, the insulating paste is wired When the screen is printed on the surface occupying most of the substrate on which the pattern and the pad for the through hole are formed, an insulating layer made of a very thin film having a thickness of about 30 μm can be formed. Therefore, when the laminated multilayer substrate is vacuum impregnated with a conductive paste, a wiring pattern having a thickness of about 30 μm and a conductive layer of a through hole pad can be formed on the surface of the substrate excluding the insulating layer.
That is, a mixed liquid obtained by mixing a high-boiling organic compound with alcohol increases in viscosity according to the mixing ratio of the organic compound, and screen printing on the substrate becomes possible. On the other hand, the conventional insulating paste is a mixture in which insulating powder such as metal oxide having a high density is dispersed in an organic compound vehicle, so that the powder is printed together with the vehicle. Viscosity is required. Furthermore, since the insulating layer is formed when the powder of the organic compound is vaporized and the powder is brought close to each other, the dispersion ratio of the powder in the vehicle is high, and the viscosity of the insulating paste is increased. For this reason, even if the conventional insulating paste is screen-printed, an insulating layer having a thickness of about 30 μm cannot be formed. In addition, when a fine powder is used to reduce the thickness of the insulating layer, the finer the powder, the higher the production cost of the powder. On the other hand, the insulating paste of this feature means is a liquid that does not contain a solid, has a significantly lower viscosity than the conventional insulating paste, and can form an insulating layer having a thickness of about 30 μm. In addition, since it is a mixture of a high-boiling organic compound, which is a general-purpose industrial chemical, mixed with alcohol, the insulating paste of this feature means is significantly less expensive to manufacture than the conventional insulating paste.
When the substrates on which such an insulating layer is formed are stacked and stacked by applying a compressive load, the irregularities on the substrate surface approach each other and overlap. At this time, a load is also applied to the thin film-like body of the insulating layer made of liquid, and the insulating layer enters the unevenness of the substrate surface and fills the narrow gap between the substrates.
In addition, when the conductive paste is vacuum impregnated on the laminated multilayer substrate, when the vacuum impregnation device is evacuated, alcohol with a low boiling point vaporizes, and a viscous high boiling point organic compound forms an insulating layer. To do. On the other hand, the volume of the insulating layer is reduced when the alcohol is vaporized, but the compression load is applied to the laminated multilayer substrates, so that the substrates come closer to each other, and the organic compound enters the irregularities on the substrate surface. The minute gap is filled. Due to the presence of the insulating layer made of the viscous organic compound, the conductive paste in which the alcohol is vaporized cannot penetrate the narrow gap between the substrates from the joint of the laminated multilayer substrates, and the insulating layer is not disturbed. As a result, the fine gap between the substrates on which the wiring pattern and the through-hole pad are formed is filled with both the conductive layer evaporated of alcohol and the insulating layer evaporated of alcohol described in paragraph 32, Unnecessary voids are not formed.
Thereafter, the laminated multilayer substrate is taken out from the vacuum impregnation apparatus and heat-treated with a compressive load applied. First, a trace amount of a high-boiling organic compound is vaporized from the conductive layer. When the organic compound is vaporized, the volume of the conductive layer is slightly reduced, but the substrates are further brought closer to each other by the compressive load, and the metal powder fines fill the gaps between the narrowed substrates. At this time, the organic compound forming the insulating layer moves and fills a narrow gap between the substrates with the organic compound. As a result, the fine gaps of the laminated multilayer substrate are filled without any gaps by both the fine powder of the metal compound forming the conductive layer described in paragraph 32 and the viscous organic compound forming the insulating layer. .
When the temperature is further increased, the metal compound in the conductive layer is thermally decomposed, and a collection of metal fine particles having a size of 10 to 100 nm is deposited. At this time, since the organic compound forming the insulating layer has a boiling point higher than the thermal decomposition temperature of the metal compound, the state in which the insulating layer is formed as a viscous liquid is maintained. Thus, in the narrow gap between the substrates on which the wiring pattern and the pad for the through hole are formed, a collection of metal bonded metal fine particles described in paragraph 32 forms a conductive layer, and a viscous organic compound forms an insulating layer. The narrow gap between the substrates is filled with no gap between the conductive layer and the insulating layer. For this reason, the viscous organic compound forming the insulating layer does not fall off from the fine gap between the substrates.
As described above, according to this feature means, since the insulating paste is an organic compound having a high boiling point is configured with a liquid obtained by mixing alcohol, the possible formation of 30μm approximately thin insulating layer by screen printing Become. As a result, when the laminated multilayer substrate is vacuum impregnated with a conductive paste, a wiring pattern having a thickness of about 30 μm and a through hole pad can be formed. The narrow gap between the substrates is filled with no gap between the insulating layer and the conductive layer, and no unnecessary gap is formed. For this reason, the viscous liquid insulating layer does not fall out from the minute gap between the substrates.

According to a fifteenth feature of the present invention, a fifteenth feature means related to a method of manufacturing a multilayer wiring board having via holes having various structures is the method of manufacturing a multilayer wiring board described in the fourteenth feature means. The organic compound described in the fourteenth feature means is any organic compound comprising a carboxylic acid ester, a glycol, or a glycol ether, and the organic compound is first dissolved in an alcohol. Or secondly, the alcohol solution or alcohol mixture has a higher viscosity than the alcohol, and thirdly, the first characteristic means to the fifth characteristic means are excluded from the first characteristic means to the fifth characteristic means. 9. The ligand composed of an inorganic molecule or ion contained in the conductive paste described in any of the characteristic means is coordinated to the metal ion. Boiling point metal complexes than the thermal decomposition temperature with combined metal complex ions is high, it lies in an organic compound having both of these three properties.

In other words, according to this feature means, the organic compound has three properties, so this organic compound is a raw material for the insulating paste described in the fourteenth feature means. As such an organic compound, among organic compounds composed of carboxylic acid esters, glycols, or glycol ethers, an organic compound having a relatively large molecular weight has three properties.
When an organic compound having three properties is dissolved or mixed in alcohol, the alcohol solution or alcohol mixed solution increases in viscosity according to the mixing ratio of the organic compound, and becomes an insulating paste that can be screen-printed on a substrate. Become. Since such an alcohol solution or alcohol mixture is composed of a liquid, an insulating layer made of a very thin film having a thickness of about 30 μm can be formed by screen printing. Furthermore, the organic compound contains an inorganic molecule or ion contained in the conductive paste described in any one of the first to ninth feature means, excluding the third and fifth feature means. The metal complex having a metal complex ion coordinated to the metal ion has a boiling point higher than the temperature at which the metal complex is thermally decomposed. Even after forming, an insulating layer made of an organic compound can continue to be formed on the substrate surface.
As explained above, the organic compound of this feature means becomes a raw material for the insulating paste.

A sixteenth feature means related to a manufacturing method for manufacturing a multilayer wiring board in which via holes having various structures are formed in the present invention is the manufacturing method for manufacturing a multilayer wiring board described in the fourteenth feature means. The organic compound described in the fourteenth feature means is any organic compound comprising a carboxylic acid ester or a carboxylic acid, and the organic compound is first dissolved or mixed in an alcohol, and secondly. The alcohol solution or alcohol mixture has a higher viscosity than the alcohol, and thirdly, any of the first to ninth feature means, excluding the third and fifth feature means. The oxygen ions constituting the carboxyl group in the carboxylic acid contained in the conductive paste described in the means are covalently bonded to the metal ions, and the carboxylic acid is saturated. Carboxylic acid metal compound having a boiling point higher than the thermal decomposition temperature comprised of fatty acids, in that it is an organic compound having both of these three properties.

In other words, according to this feature means, the organic compound has three properties, so this organic compound is a raw material for the insulating paste described in the fourteenth feature means. Oxygen ions constituting a carboxyl group in carboxylic acid, contained in the conductive paste described in any one of the first to ninth feature means, excluding the third and fifth feature means. Is an organic compound having a boiling point higher than the temperature at which the carboxylic acid metal compound composed of saturated fatty acid is thermally decomposed, and has a relatively high molecular weight among carboxylic acid esters or carboxylic acids. Large organic compounds combine three properties.
That is, when an organic compound having the above three properties is dissolved or mixed in alcohol, the alcohol solution or alcohol mixed solution increases in viscosity according to the mixing ratio of the organic compound and can be screen-printed. become. Since such an alcohol solution or alcohol mixture is composed of a liquid, an insulating layer made of a very thin film having a thickness of about 30 μm can be formed by screen printing. Further, the organic compound contains a carboxyl in a carboxylic acid contained in the conductive paste described in any one of the first to ninth feature means, excluding the third and fifth feature means. Since the oxygen ions constituting the group are covalently bonded to the metal ions and the carboxylic acid has a boiling point higher than the temperature at which the carboxylic acid metal compound composed of saturated fatty acids is thermally decomposed, the carboxylic acid metal compound is heated by heat treatment. Even after decomposition and formation of a conductive layer on the surface of the substrate, an insulating layer made of an organic compound can continue to be formed on the surface of the substrate.
As explained above, the organic compound of this feature means becomes a raw material for the insulating paste.

(Delete)

(Delete)

(Delete)

(Delete)

(Delete)

(Delete)

(Delete)

(Delete)

(Delete)

(Delete)

(Delete)

(Delete)

(Delete)

(Delete)

(Delete)

(Delete)

(Delete)

(Delete)

(Delete)

(Delete)

It is a figure explaining the manufacturing method which manufactures the multilayer wiring board in which two through-via holes were formed. It is a figure explaining the manufacturing method which manufactures the multilayer wiring board in which two penetration via holes and nine blind via holes were formed. It is a figure explaining the manufacturing method which manufactures the multilayer wiring board in which two through-via holes, four blind via holes, and 12 buried via holes were formed. It is a figure explaining the manufacturing method which manufactures the multilayer wiring board in which two through-via holes, 8 blind via holes, and 12 buried via holes were formed.

Embodiment 1
This embodiment is an embodiment relating to a metal complex in which a metal is deposited by heat treatment. The metal compound which is the raw material of the conductive paste in the present invention is a substrate in which the metal compound is thermally decomposed when the conductive paste first dispersed in alcohol and secondly vacuum-impregnated is heat-treated, and laminated. These two properties are combined to deposit a collection of metal fine particles on the surface.
Here, an embodiment of a metal compound dispersed in alcohol will be described with respect to a metal compound as a raw material of the conductive paste. Here, the metal is copper, and a copper compound will be described as an example. Inorganic copper compounds such as copper chloride, copper sulfate, and copper nitrate dissolve in alcohol, and copper ions are eluted, so that many copper ions cannot participate in the precipitation of copper fine particles. Accordingly, it is necessary that the copper compound does not dissolve in the solvent but has a property of being dispersed in the solvent. In addition, inorganic copper compounds such as copper oxide, copper chloride, and copper sulfide are not dispersed in alcohols. For this reason, these inorganic copper compounds are not suitable as a copper compound used as the raw material of an electrically conductive paste.
Next, the copper compound must deposit a collection of copper fine particles on the surface of the laminated substrate. Among the chemical reactions in which copper is produced from a copper compound, one of the simplest chemical reactions is a thermal decomposition reaction. That is, only by raising the temperature of the copper compound, the copper compound is thermally decomposed and copper is deposited. Furthermore, if the thermal decomposition temperature of the copper compound is low, the heat treatment temperature of the laminated multilayer board is low, and the surface of the multilayer wiring board comprising a general-purpose printed wiring board such as a paper phenol board, a paper epoxy board, or a glass epoxy board. A conductive layer can be formed. A copper complex that forms a copper complex ion by coordination of a molecule or ion made of an inorganic substance as a ligand and coordinating with a copper ion located at the center of the molecular structure has a low molecular weight. The thermal decomposition temperature of is lower than the temperature at which the organic copper compound in which an organic substance having a higher molecular weight forms a ligand thermally decomposes. For this reason, although such a copper complex is a more expensive material than an organic copper compound, it collects a collection of copper fine particles at a lower heat treatment temperature. A conductive layer can be formed on the surface of the wiring board, and as a result, a multilayer wiring board in which various via holes are formed can be manufactured at low cost.
That is, the copper ion is the largest among the molecules constituting the copper complex. Incidentally, the covalent bond radius of copper atoms is 132 ± 4 pm, while the covalent bond radius of nitrogen atoms is 71 ± 1 pm, and the covalent bond radius of oxygen atoms is 66 ± 2 pm. For this reason, in the molecular structure of a copper complex, the distance of the coordinate bond part in which a ligand coordinates-bonds to a copper ion is the longest. Accordingly, in the heat treatment in the reducing atmosphere, the coordination bond portion is first divided and decomposes into a metal and an inorganic substance, and copper is deposited after the vaporization of the inorganic substance is completed.
A copper complex having such properties is dispersed in alcohol, and an organic compound is dissolved or mixed in the dispersion to produce a conductive paste. This conductive paste is vacuum-impregnated into the laminated multilayer substrate and heat-treated. First, the alcohol is vaporized, and then the organic compound is vaporized. When the temperature is further increased, thermal decomposition of the copper complex starts, the copper complex is decomposed into copper and an inorganic substance, and after the vaporization of the inorganic substance is completed, copper forms granular fine particles and finishes the thermal decomposition reaction of the copper complex. At this time, a collection of particulate copper fine particles is deposited according to the molar concentration of the copper complex dispersed in the alcohol, and the particulate fine particles are metal-bonded at contact points where they contact each other to form a multilayer structure. As a result, a conductive layer is formed in which the wiring pattern, the through hole pad, and the through hole are continuously conducted.
As such a copper complex, ammonia NH ₃ serves as a ligand to form an ammine complex that coordinates to a copper ion, chlorine ion Cl ⁻ , or chlorine ion Cl ⁻ and ammonia NH ₃ serve as a ligand. Since the chloro complex coordinated to the copper ion is relatively easy to synthesize compared to other copper complexes, it can be produced at a relatively low production cost among copper complexes. When such a copper complex is heat-treated in a reducing atmosphere such as ammonia gas or hydrogen gas, the coordination bond site is first divided and thermal decomposition is completed at a relatively low temperature of about 200 ° C. Moreover, it disperse | distributes to alcohol, such as methanol and n-butanol, to the dispersion concentration near 10 weight%. For example, there is a tetraammine copper complex ion [Cu (NH ₃ ) ₄ ] ²⁺ or a hexaammine copper complex ion [Cu (NH ₃ ) ₆ ] ²⁺ . As such a copper complex, for example, tetraammine copper nitrate [Cu ( NH ₃ ) ₄ ] (NO ₃ ) ₂ or hexaammine copper sulfate [Cu (NH ₃ ) ₆ ] SO ₄ .
As described above, a metal complex is desirable as a raw material for the conductive paste in which a metal compound is thermally differentiated at a lower heat treatment temperature to deposit a metal. As a result, a conductive layer can be formed on the surface of a multilayer wiring board made of a general-purpose printed wiring board such as a paper phenol board, a paper epoxy board, or a glass epoxy board.

Embodiment 2
The present embodiment is an embodiment relating to a carboxylic acid metal compound that deposits a metal by heat treatment. As described in the above metal complex, the metal compound that is the raw material of the conductive paste in the present invention is firstly dispersed in alcohol, and secondly, when the conductive paste that has been vacuum impregnated is heat-treated, The compound is thermally decomposed, and has these two properties of depositing metal fine particles on the surface of the laminated substrate.
Here, the deposited metal is copper, and a copper compound will be described as an example. As described in the above metal complex, an inorganic copper compound is not suitable as a copper compound dispersed in alcohol. Among chemical reactions in which copper is generated from a copper compound, one of the simplest chemical reactions is a thermal decomposition reaction. Here, unlike the above-described metal complex, an organic copper compound that precipitates copper by thermal decomposition will be described. An organic copper compound can be produced at a lower cost than a copper complex if copper is deposited by thermal decomposition and the synthesis is easier than that of the above-described copper complex. An organic copper compound having such properties is copper carboxylate.
In other words, the largest ion among the ions constituting copper carboxylate is a copper ion. Therefore, if the oxygen ion constituting the carboxyl group in the copper carboxylate is covalently bonded to the copper ion, the distance between the copper ion and the oxygen ion constituting the carboxyl group is the longest among the distances between the ions. When copper carboxylate having such molecular structure characteristics is heated in the atmosphere, it decomposes into carboxylic acid and copper at the boiling point of the carboxylic acid constituting the carboxylate copper. When the temperature is further increased, if the carboxylic acid is a saturated fatty acid, the carboxylic acid takes the heat of vaporization and vaporizes, and copper is deposited after the vaporization of the carboxylic acid is completed. Note that the thermal decomposition of copper carboxylate in a reducing atmosphere proceeds at a higher temperature than the thermal decomposition in the air atmosphere, so the cost for the thermal decomposition in the air atmosphere can be low. In addition, if the carboxylic acid is an unsaturated fatty acid, the carbon atoms are excessive with respect to the hydrogen atoms, so that when the carboxylic acid copper comprising the unsaturated fatty acid is thermally decomposed, a copper oxide is deposited. Furthermore, among copper carboxylates, the oxygen ions that make up the carboxyl groups act as ligands, and the copper carboxylates that are coordinated and close to the copper ions shorten the distance between the copper ions and the oxygen ions. In addition, the distance between the oxygen ion and the ion bonded to the copper ion on the opposite side is the longest. In such a thermal decomposition reaction of copper carboxylate, the bond portion between the oxygen ion and the ion bonded on the opposite side of the copper ion is first divided, and as a result, copper oxide is deposited.
Furthermore, copper carboxylate is an organic copper compound that is easy to synthesize and inexpensive. That is, when a carboxylic acid is reacted in a strong alkali solution such as sodium hydroxide, an alkali metal carboxylate is generated. When this alkali metal carboxylate is reacted with an inorganic copper compound such as copper sulfate, copper carboxylate is produced. Below, embodiment of copper carboxylate is described.
The composition formula of copper carboxylate is represented by COOR-Cu-COOR. R is a hydrocarbon, and this compositional formula is C _m H _n (where m and n are integers). Among the substances constituting copper carboxylate, the copper ion Cu ²⁺ located at the center of the composition formula is the largest. Therefore, when the copper ion Cu ²⁺ and the oxygen ion O ⁻ constituting the carboxyl group are covalently bonded, the distance between the copper ion Cu ²⁺ and the oxygen ion O ⁻ is maximized. The reason is that the covalent bond radius of the copper atom is 132 ± 4 pm, the covalent bond radius of the oxygen atom is 66 ± 2 pm, and the covalent bond radius of the carbon atom is 73 pm. For this reason, copper carboxylate, in which copper ions and oxygen ions constituting the carboxyl group are covalently bonded, has a bond portion between the copper ion having the longest bond distance and the oxygen ion constituting the carboxyl group at the boiling point of the carboxylic acid. And is separated into copper and carboxylic acid. When the temperature is further increased, if the carboxylic acid is a saturated fatty acid, the carboxylic acid takes the heat of vaporization and vaporizes, and copper is deposited after the vaporization of the carboxylic acid is completed. Examples of such carboxylic acid copper include copper octylate (also referred to as copper 2-ethylhexanoate), copper laurate (also referred to as copper dodecanoate), and copper stearate (also referred to as aluminum octadecanoate). Many of such copper carboxylates are commercially available as metal soaps.
Furthermore, if the boiling point of the saturated fatty acid is relatively low with respect to the carboxylic acid copper composed of the saturated fatty acid, the carboxylic acid copper is thermally decomposed at a relatively low temperature, and the heat treatment cost for precipitating the copper is low. When the hydrocarbon constituting the saturated fatty acid has a long chain structure, the longer the long chain, that is, the higher the molecular weight of the saturated fatty acid, the higher the boiling point of the saturated fatty acid. Incidentally, the boiling point at atmospheric pressure of lauric acid having a molecular weight of 200.3 is 296 ° C., and the boiling point of stearic acid having a molecular weight of 284.5 at 361 ° C. is 361 ° C. Therefore, copper carboxylate composed of saturated fatty acid having a relatively small molecular weight of saturated fatty acid has a relatively low thermal decomposition temperature, and thus is desirable as a raw material for depositing copper.
When the saturated fatty acid is a saturated fatty acid having a branched chain structure, the chain length is shorter and the boiling point is relatively lower than the saturated fatty acid having a linear structure. As a result, the copper carboxylate composed of a saturated fatty acid having a branched chain structure undergoes a thermal decomposition temperature at a relatively low temperature. Furthermore, since saturated fatty acids having a branched chain structure have polarity, copper carboxylate composed of saturated fatty acids having a branched chain structure also has polarity, and is dispersed at a relatively high rate in an organic solvent having polarity such as alcohol. Octyl acid is a saturated fatty acid having such a branched structure. That is, octylic acid has a structural formula represented by CH ₃ (CH ₂ ) ₃ CH (C ₂ H ₅ ) COOH, and is branched into an alkane of CH ₃ (CH ₂ ) ₃ and C ₂ H ₅ with CH. Carboxyl group COOH binds. The boiling point of octylic acid at atmospheric pressure is 228 ° C., which is 68 ° C. lower than that of lauric acid. For this reason, copper octylate is desirable as a raw material for depositing copper. Copper octylate is thermally decomposed at 290 ° C. in an air atmosphere to precipitate copper, and is dispersed up to 10% by weight in methanol, n-butanol or the like.

Embodiment 3
In the present embodiment, firstly, it is dissolved or mixed in alcohol, secondly, the alcoholic solution or alcoholic mixture has a higher viscosity than alcohol, and thirdly, at least one of a metal complex and a carboxylic acid metal compound. It is an embodiment relating to an organic compound having these three properties, the boiling point of which is lower than the temperature at which one metal compound is thermally decomposed. That is, if the boiling point of the organic compound is lower than the temperature at which the metal complex is thermally decomposed, the organic compound becomes a raw material for the conductive paste using the metal complex as a metal raw material. On the other hand, if the boiling point of the organic compound is higher than the temperature at which the metal complex is thermally decomposed and lower than the temperature at which the carboxylic acid metal compound is thermally decomposed, the organic compound is a conductive paste using the carboxylic acid metal compound as a metal raw material. It becomes a raw material. By the way, the temperature at which the metal complex thermally decomposes in a reducing atmosphere is 180 to 220 ° C., and the octylic acid metal compound that thermally decomposes at the lowest temperature among the carboxylic acid metal compounds is thermally decomposed at 290 ° C. in the air atmosphere.
If the boiling point of the organic compound is higher than the temperature at which the metal complex is thermally decomposed and lower than the temperature at which the carboxylic acid metal compound is thermally decomposed, the organic compound becomes an insulating pace raw material. However, this insulating paste is limited to the case where a conductive paste using a metal complex as a metal raw material is used. Furthermore, the boiling point of the organic compound is a carboxylic acid metal compound is higher than the thermal decomposition temperature, the organic compound comprises a material of the insulating space. As this insulating paste, both a conductive paste using a metal complex as a metal raw material and a conductive paste using a carboxylic acid metal compound as a metal raw material can be used as the conductive paste.
Examples of the organic compound having the above three properties include carboxylic acid esters, glycols, and glycol ethers.
Carboxylic acid esters are obtained by condensation reaction of carboxylic acid and alcohol or phenol, and are acetic acid esters, propionic acid esters, butyric acid esters, bivalic acid esters, caproic acid esters, caprylic acid esters, capric acid. Esters, lauric acid esters, myristic acid esters, palmitic acid esters, stearic acid esters, saturated carboxylic acid esters, acrylic acid esters, crotonic acid esters, methacrylic acid esters, olein There are enormous numbers of carboxylic acid esters such as esters with unsaturated carboxylic acids composed of acid esters and the like, and esters with aromatic carboxylic acids composed of benzoic acid esters and phthalic acid esters.
Further, among the saturated carboxylic acids, acetates which are esters of acetic acid and alcohol or phenol having a low molecular weight include methyl acetate, ethyl acetate, butyl acetate, propyl acetate, isopropyl acetate, octyl acetate, heptyl acetate, acetic acid. There are acetates such as benzyl, phenyl acetate and vinyl acetate. Acetic esters other than methyl acetate have a higher boiling point than methanol and a lower boiling point than n-butanol. Moreover, it melt | dissolves in methanol and a methanol solution has a viscosity higher than methanol. Therefore, a conductive paste is produced by dispersing a metal complex or carboxylic acid metal compound in methanol and mixing any one of acetates excluding methyl acetate with this dispersion.
For example, vinyl acetate (monomer) has a chemical formula of CH ₃ COO—CH═CH ₂ , dissolves in methanol, has a higher viscosity than methanol, and has a boiling point of 72.7 ° C. higher than that of methanol. Therefore, when a metal complex or a carboxylic acid metal compound is dispersed in methanol and vinyl acetate is mixed with this dispersion, the viscosity of the dispersion increases according to the amount of the mixed vinyl acetate, and a conductive paste is produced. Vinyl acetate is a general-purpose organic compound used as a raw material used for the synthesis of polyvinyl acetate.
Further, methyl laurate is an ester of lauric acid and alcohol having a large molecular weight among saturated fatty acids. Methyl laurate has the chemical formula CH ₃ (CH ₂ ) ₁₀ —COOCH ₃ , is dissolved in n-butanol, has a higher viscosity than n-butanol, has a boiling point higher than that of n-butanol, and the metal complex is hot. The temperature is 262 ° C., which is higher than the decomposition temperature and lower than the temperature at which the metal octylate compound thermally decomposes. Therefore, when a metal octylate compound is dispersed in n-butanol and methyl laurate is mixed with this dispersion, the viscosity of the dispersion increases according to the amount of the mixed methyl laurate, and a conductive paste is produced. . On the other hand, since the boiling point of methyl laurate is higher than the temperature at which the metal complex is thermally decomposed, when a metal complex is used as a raw material for the conductive paste, a solution obtained by dissolving methyl laurate in methanol or n-butanol is not insulated. It becomes a sex paste. Note that methyl laurate is a general-purpose organic compound used as a raw material for synthetic fiber oils, metal oils, synthetic lubricants, synthetic resins, cosmetics, and surfactants.
As described above, the esters obtained by the condensation reaction of the saturated fatty acid and the alcohol have been described with respect to acetate esters having a small molecular weight and lauric acid esters having a large molecular weight. Many saturated fatty acid esters with relatively low molecular weight, such as acetate esters, dissolve in methanol, have a higher viscosity than methanol, have a boiling point higher than that of methanol, and lower than the temperature at which the metal complex thermally decomposes Therefore, it becomes a raw material of a conductive paste using a metal complex or a metal carboxylate as a metal raw material. In addition, many saturated fatty acid esters having a relatively large molecular weight such as lauric acid are dissolved in n-butanol, have a higher viscosity than n-butanol, have a boiling point higher than that of n-butanol, and have metal complexes. Although it has a property that is higher than the temperature at which pyrolysis is performed but lower than the temperature at which the carboxylic acid metal compound is thermally decomposed, it becomes a raw material for conductive paste using the carboxylic acid metal compound as a metal raw material. Moreover, when using a metal complex as a raw material of an electrically conductive paste, it becomes a raw material of an insulating paste.
On the other hand, acrylic esters obtained by the condensation reaction of acrylic acid, which is an unsaturated carboxylic acid having a low molecular weight, and an alcohol include methyl acrylate having a boiling point of 80 ° C., ethyl acrylate having a boiling point of 100 ° C., and a boiling point of 132 There are isobutyl acrylate having a boiling point of 148 ° C, butyl acrylate having a boiling point of 148 ° C, and 2-ethylhexyl acrylate having a boiling point of 214 ° C. Methyl acrylate and ethyl acrylate are soluble in methanol and have a higher viscosity than methanol, and the boiling point is higher than that of methanol but lower than that of n-butanol. For this reason, when a metal complex or a metal carboxylate compound is dispersed in methanol and methyl acrylate or ethyl acrylate is mixed with this dispersion, a conductive paste is produced. Moreover, the boiling point of butyl acrylate and isobutyl acrylate is higher than the boiling point of n-butanol and lower than the temperature at which the metal complex is thermally decomposed. For this reason, when a metal complex or a metal carboxylate compound is dispersed in n-butanol and butyl acrylate or isobutyl acrylate is mixed with this dispersion, a conductive paste is produced. Furthermore, the boiling point of 2-ethylhexyl acrylate is higher than the temperature at which the metal complex is thermally decomposed. For this reason, when using a metal complex as a raw material of an electrically conductive paste, 2-ethylhexyl acrylate becomes a raw material of an insulating paste.
For example, butyl acrylate has a chemical formula of CH ₂ ═CHCOC ₄ H ₉ , dissolves in n-butanol, and has a boiling point of 148 ° C. higher than that of n-butanol. Therefore, when a metal complex or a metal carboxylate compound is dispersed in n-butanol and butyl acrylate is mixed with this dispersion, the viscosity of the dispersion increases according to the amount of butyl acrylate mixed, and the conductive paste becomes Manufactured. Note that butyl acrylate is an inexpensive organic compound used as a raw material for fiber treatment agents, adhesives, paints, synthetic resins, acrylic rubbers, and emulsions.
In addition, esters with crotonic acid and methacrylic acid, which are unsaturated carboxylic acids having a molecular weight greater than that of acrylic acid, have the same properties as the acrylic esters described above.
Since the boiling point of the ester obtained by the condensation reaction of acrylic acid, crotonic acid or methacrylic acid and 2-ethylhexanol is higher than the temperature at which the metal complex is thermally decomposed, when using the metal complex as a raw material for the conductive paste A solution obtained by dissolving any of these esters in methanol or n-butanol becomes an insulating paste.
On the other hand, the glycols include ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol and the like.
Ethylene glycol represented by a chemical formula of C ₂ H ₄ (OH) ₂ is a liquid monomer having a boiling point of 197 ° C. dissolved in methanol and n-butanol. Diethylene glycol represented by the chemical formula O (CH ₂ CH ₂ OH) ₂ is a liquid monomer having a boiling point of 244 ° C., dissolved in methanol and n-butanol. Propylene glycol represented by the chemical formula CH ₃ CHOHCH ₂ OH is a liquid monomer having a boiling point of 188 ° C. mixed with methanol and n-butanol. Dipropylene glycol is a liquid monomer having a chemical formula of [CH ₃ CH (OH) CH ₂ ] ₂ O, miscible with methanol and n-butanol and having a boiling point of 232 ° C. Tripropylene glycol is a liquid monomer having a chemical formula of [CH ₃ CH (OH) CH ₂ ] ₃ O, miscible with methanol and n-butanol, and having a boiling point of 265 ° C. Thus, the boiling point of glycols is higher than the temperature at which the metal complex is thermally decomposed and lower than the thermal decomposition temperature of the carboxylic acid metal compound. Accordingly, when a carboxylic acid metal compound is used as a raw material for the conductive paste, glycols become a raw material for the conductive paste. Further, when a metal complex is used as a raw material for the conductive paste, glycols become a raw material for the insulating paste. Glycols are not only used as intermediate raw materials for resins, but also have excellent properties as a solvent, and also take advantage of features such as wetting, moisturizing, preserving, emulsifying, high boiling point, low freezing point, foods, pharmaceuticals, cosmetics, It is a general-purpose organic compound that is widely used in heating media, refrigerants, antifreezes, and the like.
On the other hand, glycol ethers include ethylene glycol ethers, propylene glycol ethers, and dialkyl glycol ethers in which hydrogen at the terminals of ethylene glycol, diethylene glycol, and triethylene glycol is substituted with an alkyl group.
Ethylene glycol ethers are methyl glycol, methyl diglycol, methyl triglycol, methyl polyglycol, isopropyl glycol, isopropyl diglycol, butyl glycol, butyl diglycol, butyl triglycol, isobutyl glycol, isobutyl diglycol, hexyl glycol, hexyl Examples include diglycol, 2-ethylhexyl glycol, 2-ethylhexyl diglycol, allyl glycol, phenyl glycol, phenyl diglycol, benzyl glycol, and benzyl diglycol.
Among them, methyl glycol having a boiling point of 125 ° C, isopropyl glycol having a boiling point of 142 ° C, butyl glycol having a boiling point of 171 ° C, isobutyl glycol having a boiling point of 161 ° C, and allyl glycol having a boiling point of 159 ° C are n -Dissolves in butanol, has a higher viscosity than n-butanol, has a boiling point higher than that of n-butanol and lower than the temperature at which the metal complex thermally decomposes. For this reason, when a metal complex or a carboxylic acid metal compound is dispersed in n-butanol and any one of these ethylene glycol ethers is mixed with this dispersion, a conductive paste is produced.
Ethylene glycol ethers other than the above five types of ethylene glycol ethers dissolve in n-butanol, have a higher viscosity than n-butanol, have a boiling point higher than that of n-butanol, and the metal complex is thermally decomposed. It is higher than the temperature but lower than the temperature at which the metal carboxylate is thermally decomposed. For this reason, when a carboxylic acid metal compound is dispersed in n-butanol and any one of these ethylene glycol ethers is mixed into this dispersion, a conductive paste is produced. In addition, when using a metal complex as a raw material of the conductive paste, a solution obtained by dissolving any of the above-described five types of ethylene glycol ethers excluding the ethylene glycol ether in methanol or n-butanol is an insulating paste. Become.
For example, butyl triglycol (hereinafter referred to as BTG) has a chemical formula of C ₄ H ₉ O— (CH ₂ CH ₂ O) ₃ —H, dissolves in n-butanol, and has a boiling point of a metal octylate compound. It is 271 ° C. lower than the decomposition temperature. Therefore, when the carboxylic acid metal compound is dispersed in n-butanol and BTG is mixed with the dispersion, the viscosity of the dispersion increases according to the amount of the mixed BTG, and a conductive paste is produced. Further, when a metal complex is used as a raw material for the conductive paste, BTG becomes a raw material for the insulating paste. BTG is a general-purpose organic compound used as a raw material for paints, inks, dyes, photographic copying solutions, cleaning agents, electrolytic solutions, soluble oils, hydraulic fluids, brake fluids, refrigerants, antifreezing agents, and the like.
The propylene glycol ethers include methyl propylene glycol, methyl propylene diglycol, methyl propylene triglycol, propyl propylene glycol, propyl propylene diglycol, butyl propylene glycol, butyl propylene diglycol, butyl propylene triglycol, phenyl propylene glycol, Examples include methylpropylene glycol acetate.
Among them, methyl propylene glycol having a boiling point of 121 ° C., propyl propylene glycol having a boiling point of 150 ° C., butyl propylene glycol having a boiling point of 170 ° C., and methyl propylene glycol acetate having a boiling point of 146 ° C. are dissolved in n-butanol. It has a higher viscosity than n-butanol and has a boiling point higher than that of n-butanol and lower than the temperature at which the metal complex thermally decomposes. For this reason, when a metal complex or a carboxylic acid metal compound is dispersed in n-butanol and any one of these ethylene glycol ethers is mixed with this dispersion, a conductive paste is produced.
In addition, propylene glycol ethers other than the four types of propylene glycol ethers described above are dissolved in n-butanol, have a higher viscosity than n-butanol, have a boiling point higher than that of n-butanol, and the metal complex is thermally decomposed. Is lower than the temperature at which the metal carboxylate is thermally decomposed. For this reason, when a carboxylic acid metal compound is dispersed in n-butanol and any one of these ethylene glycol ethers is mixed into this dispersion, a conductive paste is produced. In addition, when a metal complex is used as the raw material of the conductive paste, a solution obtained by dissolving any of these propylene glycol ethers in methanol or n-butanol becomes an insulating paste.
Further, dialkyl glycol ethers include dimethyl glycol, dimethyl diglycol, dimethyl triglycol, methyl ethyl diglycol, diethyl diglycol, dibutyl diglycol, dimethylpropylene diglycol and the like. Among these, dimethyl glycol is dissolved in methanol, has a higher viscosity than methanol, and has a boiling point of 85 ° C. higher than that of methanol. For this reason, when a metal complex or a carboxylic acid metal compound is dispersed in methanol and dimethyl glycol is mixed with this dispersion, a conductive paste is produced. Also, dimethyldiglycol having a boiling point of 162 ° C. and dimethylpropylene diglycol having a boiling point of 176 ° C. are dissolved in n-butanol and have a higher viscosity than n-butanol, and the boiling point is higher than that of n-butanol. Lower than the temperature at which the metal complex thermally decomposes. For this reason, when a metal complex or a carboxylic acid metal compound is dispersed in n-butanol and these dialkyl glycol ethers are mixed in the dispersion, a conductive paste is produced. Furthermore, dialkyl glycol ethers other than the above-mentioned three types of dialkyl glycol ethers dissolve in n-butanol, have a higher viscosity than n-butanol, have a boiling point higher than that of n-butanol, and the metal complex is thermally decomposed. It is higher than the temperature but lower than the temperature at which the metal carboxylate is thermally decomposed. For this reason, when a carboxylic acid metal compound is dispersed in n-butanol and any one of these dialkyl glycol ethers is mixed into this dispersion, a conductive paste is produced. Further, when a metal complex is used as a raw material for the conductive paste, a solution obtained by dissolving any of these dialkyl glycol ethers in methanol or n-butanol becomes an insulating paste.
Ethylene glycol ethers and propylene glycol ethers are used as raw materials for paints, inks, dyes, photocopy liquids, cleaning agents, electrolytes, soluble oils, hydraulic fluids, brake fluids, refrigerants, antifreezes, etc. It is a general-purpose organic compound. Dialkyl glycol ether is a general-purpose organic compound used as a raw material for a reaction solvent, a separation / extraction agent, a polymerization solvent, a decomposition preventing and stabilizing agent, an electrolytic solution for batteries and capacitors, in addition to the above-mentioned applications.

Embodiment 4
In this embodiment, first, the alcohol is dissolved or mixed in the alcohol, and secondly, the alcohol solution or the alcohol mixed solution has a higher viscosity than the alcohol, and thirdly, the boiling point is higher than the temperature at which the metal carboxylate is thermally decomposed. Embodiments relating to high organic compounds. That is, when such an organic compound is dissolved or mixed in alcohol, an insulating paste can be produced. At this time, both a conductive paste using a metal complex as a metal raw material and a conductive paste using a carboxylic acid metal compound as a metal raw material can be used as the conductive paste.
Myristic acid esters, palmitic acid esters, stearic acid esters, which are saturated fatty acid esters having a large molecular weight, oleic acid esters, which are unsaturated fatty acids having a large molecular weight, aromatic carboxylic acid esters, and molecular weight Saturated organic fatty acids and dicarboxylic acids having two carboxyl groups include organic compounds having a boiling point higher than the temperature at which the carboxylic acid metal compound is thermally decomposed. Such an organic compound becomes a raw material for the insulating paste when the metal carboxylate is used as the raw material for the conductive paste.
Examples of the ester of myristic acid and alcohol having a large molecular weight include myristic acid esters such as methyl myristate, isopropyl myristate, cetyl myristate, myristyl myristate, and octyldodecyl myristate. For example, methyl myristate is represented by the chemical formula CH ₃ (CH ₂ ) ₁₂ —COOCH ₃ and dissolves in methanol and n-butanol. The solution has a higher viscosity than methanol and n-butanol, and the boiling point is octyl. The temperature is 323 ° C., which is higher than the temperature at which the acid metal compound is thermally decomposed. Accordingly, methyl myristate is dissolved in methanol or n-butanol, the viscosity increases according to the amount of dissolved methyl myristate, and an insulating paste is produced. Note that methyl myristate is a general-purpose organic compound used as a raw material for cosmetic bases, pharmaceutical aids, textile oils, synthetic resin lubricants, and the like.
Esters of stearic acid and alcohol having a molecular weight higher than myristic acid include methyl stearate having a boiling point of 356 ° C., butyl stearate having a boiling point of 389 ° C., 2-ethylhexyl stearate having a boiling point of 432 ° C., boiling point Is isotridecyl stearate having a boiling point of 549 ° C. and stearyl stearate having a boiling point of 549 ° C. For example, butyl stearate has the chemical formula CH ₃ (CH ₂ ) ₁₆ —COO (CH ₂ ) ₃ CH ₃ and is soluble in methanol and n-butanol, and the solution has a higher viscosity than methanol and n-butanol. Furthermore, the boiling point is 389 ° C., which is higher than the temperature at which the metal octylate compound is thermally decomposed.
On the other hand, esters of oleic acid and alcohol having a relatively large molecular weight among monovalent unsaturated fatty acids include methyl oleate having a boiling point of 351 ° C., isobutyl oleate having a boiling point of 415 ° C., and a boiling point of 490 There is decyl oleate which is in ° C. For example, isobutyl oleate is represented by the chemical formula CH ₃ (CH ₂ ) ₈ (CH) ₂ (CH ₂ ) ₇ —COOCH ₂ CH (CH ₃ ) ₂ , dissolved in methanol or n-butanol, methanol, n- It has a higher viscosity than butanol, has a boiling point of 415 ° C., and is higher than the temperature at which the metal octylate is thermally decomposed. Therefore, isobutyl oleate is dissolved in n-butanol, and the viscosity of the dispersion increases according to the amount of dissolved methyl oleate, and an insulating paste is produced. Note that isobutyl oleate is a general-purpose organic compound used as a raw material for plasticizers for synthetic resins.
Further, esters of aromatic carboxylic acid include benzyl benzoate obtained by dehydration condensation of benzoic acid and benzyl alcohol, the chemical formula is represented by C ₆ H ₅ CO ₂ CH ₂ C ₆ H ₅ , and methanol or n-butanol It has a viscosity higher than that of methanol or n-butanol and is 324 ° C. higher than the temperature at which the metal octylate is thermally decomposed. Therefore, benzyl benzoate is a raw material for the insulating paste. Benzyl benzoate is a general-purpose organic compound used as a raw material for antiparasitic insecticides, food additives as artificial flavors, and plasticizers for polymers such as cellulose.
In addition, esters of aromatic carboxylic acids include phthalates. The boiling point of diallyl phthalate given by the chemical formula C ₆ H ₄ (COOCH ₂ CH═CH ₂ ) ₂ is 329 ° C., and the phthalic acid given by the chemical formula C ₆ H ₄ (COO (CH ₂ ) ₃ CH ₃ ) ₂ Dibutyl has a boiling point of 340 ° C., di-ethylhexyl phthalate given by the chemical formula C ₆ H ₄ (COOCH ₂ CHCH ₃ (CH ₂ ) ₃ CH ₃ ) ₂ has a boiling point of 385 ° C., and C ₆ H ₄ (COO The boiling point of diisodecyl phthalate whose chemical formula is given by (CH ₂ ) ₇ CH (CH ₂ ) ₂ ) ₂ is 426 ° C. Any phthalates are soluble in methanol and n-butanol, have a higher viscosity than methanol and n-butanol, and are higher than the temperature at which the metal octylate is thermally decomposed. Therefore, these phthalates are used as raw materials for the insulating paste. Diallyl phthalate is a general-purpose organic compound used as a raw material for thermosetting resins, and dibutyl phthalate is a general-purpose organic compound used as a raw material for processability improving additives, paints, adhesives, etc. Di-2-ethylhexyl acid is a general-purpose organic compound used as a raw material for general-purpose plasticizers, electric wire coatings, wallpaper, films, blood bags and tubes, and diisodecyl phthalate is a low-volatile plasticizer, an insulating improvement additive, It is a general-purpose organic compound used as a raw material for heat-resistant electric wires and synthetic lasers.
Furthermore, fatty acids having a high molecular weight include fatty acids having a boiling point higher than the temperature at which the metal octylate is thermally decomposed. As a straight-chain saturated fatty acid, the chemical formula is given by CH ₃ (CH ₂ ) ₁₄ COOH, and palmitic acid having the boiling point of 341 ° C. is given by the chemical formula CH ₃ (CH ₂ ) ₁₅ COOH, and the boiling point is 100 mmHg. The margaric acid having a property of 227 ° C. is given by the chemical formula CH ₃ (CH ₂ ) ₁₆ COOH, and the stearic acid having a boiling point of 383 ° C. is given by the chemical formula CH ₃ (CH ₂ ) ₁₈ COOH. Arachidic acid having a boiling point of 328 ° C. is given by the chemical formula CH ₃ (CH ₂ ) ₂₀ COOH, and there is behenic acid having a boiling point of 306 ° C. Of these, palmitic acid and stearic acid are dissolved in n-butanol to form an insulating paste. Stearic acid is an inexpensive industrial chemical that is manufactured in large quantities as a raw material for cosmetics, as a reaction raw material for soaps and esters, and as a raw material for blending color pencils. Palmitic acid is an inexpensive industrial chemical produced in large quantities as a raw material for soaps and surfactants.
Further, as a linear unsaturated fatty acid, palmitoleic acid having a chemical formula of CH ₃ (CH ₂ ) ₅ CH═CH (CH ₂ ) ₇ COOH and having a boiling point of 364 ° C. has a chemical formula of CH ₃ (CH _{2 7} CH = CH (CH ₂ ) ₇ COOH, which has a property of boiling point of 360 ° C. Of these, oleic acid is mixed with n-butanol to form an insulating paste. Oleic acid is used as a reaction raw material for esters, amines, amides, soaps, etc., as a raw material for blending greases, oils, etc. It is an inexpensive industrial chemical manufactured as a raw material for oily ingredients in cosmetics and pharmaceuticals.
Furthermore, glutaric acid having a formula of HOOC— (CH ₂ ) ₃ —COOH as a dicarboxylic acid has a boiling point of 303 ° C. and dissolves in methanol to form an insulating paste. Glutaric acid is a general industrial chemical used as a synthetic intermediate for activators and polymers. Further, adipic acid given by the formula HOOC— (CH ₂ ) ₄ —COOH has a boiling point of 339 ° C. and dissolves in methanol to form an insulating paste. Adipic acid is a raw material for 6,6-nylon and is an inexpensive industrial chemical produced in large quantities.

Example 1
In this embodiment, a multilayer wiring board in which two through via holes are formed is manufactured. In this example, a substrate made of glass epoxy resin having a thickness of 0.2 mm was used as the substrate (for example, product ES-3230 of Risho Kogyo Co., Ltd.). In addition, the material of the substrate is not limited to glass epoxy resin, and if the substrate is not thermally decomposed at a temperature condition in which the metal compound that is the raw material of the conductive paste is thermally decomposed, that is, if the substrate is not irreversibly changed, It can be used as a substrate. In this example, since a copper complex that is completely decomposed by being exposed to a temperature of 200 ° C. for about 5 minutes is used, a glass composite in which glass fibers are overlapped and impregnated with an epoxy resin, or paper is impregnated with an epoxy resin. Paper epoxy can be used. Furthermore, it is not limited to an above-mentioned rigid base material, The flexible base material which consists of a polyimide film or a polyethylene terephthalate film can also be used as a board | substrate. In addition, as a short-time heat resistance of a substrate, even a paper epoxy having a solder heat resistance at 260 ° C. and having the lowest heat resistance has a solder heat resistance of 58 seconds or more at 260 ° C. Paper epoxies do not pyrolyze when exposed to temperature conditions where the complex is pyrolyzed.
In addition, the conductive paste used in this example uses a copper complex that is thermally decomposed at a relatively low temperature as a metal compound to deposit copper, and further, a copper complex ion that is most easily synthesized among copper complexes. Tetraammine copper nitrate, which is a nitrate of tetraammine copper ion [Cu (NH ₃ ) ₄ ] ²⁺ in which four ammines (referring to ligands of ammonia NH ₃ ) are coordinated to copper ion Cu ²⁺ . Cu (NH ₃ ) ₄ ] (NO ₃ ) ₂ (for example, a product of Mitsuwa Chemicals Co., Ltd.) was used. Disperse in methanol so that this tetraammine copper nitrate occupies 10% by weight, and vinyl acetate (monomer) (for example, a product of Showa Denko KK) occupies 5% by weight as a thickener to increase the viscosity of this dispersion. To prepare a conductive paste.
Furthermore, the insulating paste used in this example was mixed with n-butanol so that dipropylene glycol (for example, a product of Asahi Glass Co., Ltd.) as a thickener accounted for 5% by weight.
Next, the manufacturing method of a multilayer wiring board is demonstrated based on FIG. First, eight substrates having the same shape were overlapped to form through holes 1 having a diameter of 50 μm at two locations of the substrates (for example, Hi-Puncher manufactured by Nikkiso Co., Ltd. is used for processing the through holes) (FIG. 1 (a)). Next, the insulating paste was screen-printed with a thickness of 50 μm on the surface of one of the eight substrates except for the portion where the wiring pattern 3 and the through-hole pad 2 were formed ( Screen printing uses, for example, a product MTVC-320 manufactured by Microtec Corporation). The through-hole pad 2 has a diameter of 100 μm, and the wiring pattern 3 has a line width of 50 μm (shown in FIG. 1B). Then, the board | substrate with which the insulating paste was printed was arrange | positioned at the bottom, eight board | substrates were positioned so that all the through-holes 1 may overlap, and it applied and laminated | stacked by applying a 2 MPa compressive load.
Next, the laminated substrate was placed in a cylindrical container, and the cylindrical container was placed in a vacuum impregnation apparatus (for example, a vacuum high pressure impregnation apparatus manufactured by Mikado Technos Co., Ltd. was used). Thereafter, the vacuum impregnation apparatus was evacuated, and the cylindrical container was filled with the conductive paste so that the laminated substrate was immersed in the conductive paste. After 5 minutes, the vacuum impregnation apparatus was opened to the atmosphere, and after another 5 minutes, the laminated substrate was taken out from the vacuum impregnation apparatus. Thereafter, the insulating paste was screen-printed with a thickness of 100 μm on the surface layer of the laminated substrate except for a portion where a through-hole pad having a diameter of 200 μm was formed. Thereafter, the laminated substrate was heat-treated in an atmosphere of hydrogen gas with a compressive load applied. First, the temperature was raised to 75 ° C. to vaporize methanol and vinyl acetate. Next, the substrate was left at 200 ° C. for 5 minutes to thermally decompose tetraammine copper nitrate.
Next, with respect to the sample manufactured under the above-described conditions, the sample is cut at the center line of the substrate that connects the two through-holes that are separated from each other, and the through-hole, the wiring pattern, and the through-hole pad on the cut surface are formed. Observed with an electron microscope. As the electron microscope, an extremely low acceleration voltage SEM owned by JFE Techno-Research Corporation was used. This apparatus can observe the surface with an extremely low acceleration voltage from 100 V, and can directly observe the surface of the sample without forming a conductive film.
First, a secondary electron beam between 900-1000 V of the reflected electron beam was taken out and subjected to image processing, and through holes, wiring patterns, and through hole pads at various parts of the sample cross section were observed. The inside of the through hole, the wiring pattern, and the pad for the through hole were uniformly filled with a collection of granular fine particles having a size of 40 to 60 nm.
Next, image processing was performed by extracting energy between 900 and 1000 V of the reflected electron beam, and the difference in the material of the granular fine particles was observed depending on the density of the image. Since the collection of granular fine particles was not recognized, it was found that they were composed of the same atoms.
Furthermore, the energy and intensity of characteristic X-rays were image-processed, and the types of elements constituting the particulate particles were analyzed. Since the particulate fine particles were composed only of copper atoms, they were copper particulate fine particles.
From the above observation results, any through-hole, wiring pattern, and through-hole pad are filled with a collection of copper fine particles having a size of 40-60 nm. A through via hole in which the via holes are electrically connected to each other was formed in the laminated substrate. If one of the two through via holes is used as a heat conduction path, the multilayer wiring board manufactured in this embodiment becomes a multilayer wiring board having excellent thermal conductivity.
The manufacturing process for forming two through via holes in the present embodiment is the same manufacturing process as the manufacturing process for forming three or more through via holes. Further, the position in the multilayer substrate where the through via holes are electrically connected can be freely changed. Furthermore, since the means for conducting the through via holes is a process that only screen-prints the insulating paste on the substrate in advance, the manufacturing cost does not increase. Therefore, a plurality of through via holes having various structures can be formed on the multilayer wiring board at a low manufacturing cost regardless of the structure of the through via holes. This is due to the following two features of the present invention. The first feature is that through holes are processed for a single substrate, so the position and number of through holes can be changed arbitrarily, and the processing cost will hardly change even if the number of through holes increases. Absent. The second feature is that the substrate in which the via holes are conductive can be stacked on the multilayer distribution substrate at an arbitrary position because the stacking order can be arbitrarily changed when the substrate is stacked as a multilayer substrate. Furthermore, since it is a process that merely screen-prints an insulating paste on a single substrate, even if the number of substrates through which via holes are connected increases, manufacturing costs do not increase.

Example 2
In this embodiment, there are two through-via holes, and a total of nine blind via holes consisting of three in the width direction of the substrate and three in the length direction of the substrate. It is an Example which manufactures the multilayer wiring board formed in the laminated substrate.
First, the structure of the multilayer wiring board will be described. The two through-hole via holes are conducted at the lowermost substrate, and the depths of the nine blind via holes are different in each blind via hole. FIG. 2A is a diagram schematically showing an upper surface layer of a multilayer wiring board to be manufactured. From blind via holes Bl1 having a depth of one substrate, blind via holes having a depth of nine substrates. Nine types of blind via holes having different depths, each consisting of up to Bl9, were formed at different positions. T1 and T2 are positions where two through via holes are formed. Note that the wiring patterns of the blind via holes (B11-B19) and the through via holes (T1 and T2) adopt various shapes and cannot be uniquely determined. In this embodiment, the blind via hole and the through via hole penetrate each other. Only the hole pads are shown in FIG. 2A as Bl1-Bl9 and T1 and T2. Note that the case where a plurality of blind via holes are formed in the laminated substrate is not limited to the present embodiment. The substrate, conductive paste, and insulating paste used in this example are the same as those used in Example 1.
Next, the manufacturing method of a multilayer wiring board is demonstrated based on FIG. First, through-holes 1 having a diameter of 50 μm were formed in a total of 11 locations, each consisting of a portion for forming two through-via holes and a portion for forming nine blind via holes, on a single substrate having the same shape (see FIG. 2 (b) shows a cross section at the center line of the substrate). Next, through-holes 1 having a diameter of 50 μm are formed in a total of 10 locations, including a portion where two through-via holes are formed and a portion where eight blind via holes except for Bl1 are formed on one substrate having the same shape. (FIG. 2C shows a cross section taken along the center line of the substrate). Furthermore, a through hole 1 having a diameter of 50 μm is formed in a total of nine locations, each of which includes a portion where two through via holes are formed on one substrate having the same shape and a portion where seven blind via holes excluding Bl1 and Bl2 are formed. (FIG. 2D shows a cross section taken along the center line of the substrate). Further, through holes 1 having a diameter of 50 μm are formed in a total of eight locations, which are composed of a portion for forming two through via holes and a portion for forming six blind via holes excluding Bl1-Bl3, on one substrate having the same shape. (A cross section taken along the center line of the substrate is shown in FIG. 2 (e)). Furthermore, through holes 1 having a diameter of 50 μm are formed in a total of seven locations, each of which includes a portion for forming two through via holes and a portion for forming five blind via holes excluding Bl1-Bl4, on one substrate having the same shape. It was formed (FIG. 2 (f) shows a cross section at the center line of the substrate). Furthermore, through holes 1 having a diameter of 50 μm are formed in a total of six locations, each of which includes a portion where two through via holes are formed and a portion where four blind via holes other than Bl1-Bl5 are formed on one substrate having the same shape. It was formed (the cross section at the center line of the substrate is shown in FIG. 2G). Furthermore, through holes 1 having a diameter of 50 μm are formed in a total of five locations consisting of a portion where two through via holes are formed and a portion where three blind via holes other than Bl1-Bl6 are formed on one substrate having the same shape. It was formed (the cross section at the center line of the substrate is shown in FIG. 2H). Further, through holes 1 having a diameter of 50 μm are formed in a total of four locations including a portion for forming two through via holes and a portion for forming two blind via holes made of B1 8 and B1 9 on one substrate having the same shape. (FIG. 2 (i) shows a cross section taken along the center line of the substrate). Furthermore, through-holes 1 having a diameter of 50 μm were formed in a total of three locations consisting of a portion for forming two through-via holes and a portion for forming Bl9 blind via holes on a single substrate having the same shape (FIG. 2). (J) shows a cross section taken along the center line of the substrate). Finally, through holes 1 having a diameter of 50 μm were formed at two locations where two through via holes were to be formed on a single substrate having the same shape (FIG. 2 (k) shows a cross section at the center line of the substrate) ). Thereafter, the insulating paste was screen-printed with a thickness of 50 μm on the surface of the substrate of FIG. 2 (k), except for a portion where a wiring pattern for conducting two through via holes and a pad for through holes were formed. . The through-hole pad 2 has a diameter of 100 μm, and the wiring pattern has a line width of 50 μm (shown in FIG. 2 (l)). Thereafter, the substrate on which the insulating paste is printed is disposed at the bottom, and the substrate illustrated in FIG. (J), the substrate illustrated in FIG. (I), the substrate illustrated in FIG. The illustrated substrate, the substrate illustrated in FIG. (F), the substrate illustrated in FIG. (E), the substrate illustrated in FIG. (D), the substrate illustrated in FIG. (C), and finally the substrate illustrated in FIG. Are stacked one after the other, and 10 substrates are positioned so that the through-holes provided at two locations at the end of the substrate overlap each other, and a 2.5 MPa compressive load is applied to laminate (see FIG. 2 (m) The cross section of the center line is shown.
Next, the laminated substrate was placed in a cylindrical container, and the cylindrical container was placed in a vacuum impregnation apparatus. Thereafter, the vacuum impregnation apparatus was evacuated, and the cylindrical container was filled with the conductive paste so that the laminated substrate was immersed in the conductive paste. After 5 minutes, the vacuum impregnation apparatus was opened to the atmosphere, and after another 5 minutes, the laminated substrate was taken out from the vacuum impregnation apparatus. Thereafter, the insulating layer is formed except for the portion where the pad 2 of two through holes (T1 and T2) having a diameter of 200 μm and the pad 2 of nine blind via holes (B1 to B9) are formed on the surface layer of the laminated substrate. The paste was screen printed with a thickness of 100 μm (shown in FIG. 2 (n)). Thereafter, the laminated substrate was heat-treated in an atmosphere of hydrogen gas with a compressive load applied. First, the temperature was raised to 75 ° C. to vaporize methanol and vinyl acetate. Next, the substrate was left at 200 ° C. for 5 minutes to thermally decompose tetraammine copper nitrate.
Next, with respect to the sample manufactured under the above conditions, the sample is cut at the center line of the substrate connecting the two through holes provided at both end portions of the substrate, and the through holes and two through holes for forming two through via holes on the cut surface are formed. Similarly to Example 1, the through hole forming one blind via hole and the part where the wiring pattern and the through hole pad were formed were observed with an electron microscope.
First, a secondary electron beam between 900-1000 V of the reflected electron beam was taken out and subjected to image processing, and through holes, wiring patterns, and through hole pads at various parts of the sample cross section were observed. The inside of the through hole, the wiring pattern, and the pad for the through hole were uniformly filled with a collection of granular fine particles having a size of 40 to 60 nm.
Next, image processing was performed by extracting energy between 900 and 1000 V of the reflected electron beam, and the difference in the material of the granular fine particles was observed depending on the density of the image. Since the collection of granular fine particles was not recognized, it was found that they were composed of the same atoms.
Furthermore, the energy and intensity of characteristic X-rays were image-processed, and the types of elements constituting the particulate particles were analyzed. Since the particulate fine particles were composed only of copper atoms, they were copper particulate fine particles.
From the above observation results, since any through hole, wiring pattern, and pad for the through hole are filled with a collection of copper fine particles having a size of 40-60 nm, two through via holes connecting through all layers are connected. It was found that through via holes that conduct each other and nine blind via holes with different depths were formed in the laminated substrate. If one of the two through via holes is used as a heat conduction path, the multilayer wiring board manufactured in this embodiment becomes a multilayer wiring board having excellent thermal conductivity.
The manufacturing process for forming nine blind via holes having different depths from the two through via holes in the present embodiment is the same as the manufacturing process for forming ten or more through via holes having different depths from three or more through via holes. It is a manufacturing process. Further, since the position and depth of the blind via hole can be freely changed and the processing is merely to provide the through hole in the single substrate, the manufacturing cost does not increase. Therefore, a via hole including a plurality of through via holes and a plurality of blind via holes having a depth can be formed on the multilayer wiring board at a low manufacturing cost regardless of the position and number of the via holes.

Example 3
In this embodiment, two through via holes T1, T2, four blind via holes Bl1-Bl4, and 12 buried via holes Bu1-Bul12 are formed. This is an example of manufacturing a multilayer wiring board.
First, the structure of the multilayer wiring board will be described. The first blind via hole Bl1 has a depth of six substrates and is electrically connected to the first buried via hole Bu1 connecting the fifth substrate and the sixth substrate at the lower end of each via hole. . The second blind via hole B12 has a depth of five substrates and is electrically connected to the second buried via hole Bu2 connecting the fourth substrate and the fifth substrate at the lower end portion of each via hole. . The third blind via hole B13 has a depth of four substrates, the third and fourth buried via holes Bu3 and Bu4 connecting the third substrate and the fourth substrate, and the respective via holes. Conducts at the lower end. The fourth blind via hole Bl4 has a depth of three substrates, and the fifth and sixth buried via holes Bu5 and Bu6 connecting the second substrate and the third substrate, Conducts at the lower end. Further, the buried via hole Bu7 connecting the third substrate to the fifth substrate is composed of two buried via holes Bu8 and Bu9 connecting the fifth substrate and the sixth substrate, and each via hole. Conducts at the upper end. The buried via hole Bu10 that connects the fourth substrate to the fourth substrate from the second substrate is two buried via holes Bu11 and Bu12 that connect the fourth substrate and the fifth substrate, and the upper end of each via hole. Conduction at. FIG. 3A is a diagram schematically showing the upper surface layer of the multilayer wiring board to be manufactured. In addition, since the wiring patterns of the blind via holes (B11-B14) and the through via holes (T1, T2) adopt various shapes and cannot be uniquely determined, in this embodiment, the blind via holes and the through via holes Only the pads for the through holes are shown in FIG. 3A as B11-B14, T1, and T2. The substrate, conductive paste, and insulating paste used in this example are the same as those used in Example 1.
Next, the manufacturing method of a multilayer wiring board is demonstrated based on FIG. First, through holes 1 having a diameter of 50 μm were formed at six locations where through via holes T1, T2 and blind via holes Bl1-Bl4 were formed on a single substrate having the same shape (the center of T1 in FIG. 3B). And shows a cross section of a line connecting the center of Bu11). Next, through holes 1 having a diameter of 50 μm were formed in a total of five locations in addition to the three locations on one substrate having the same shape (shown in FIG. 3C). Furthermore, through holes 1 having a diameter of 50 μm were formed in a total of six places in addition to the five places on one substrate having the same shape (shown in FIG. 3D). Furthermore, on one substrate having the same shape, the positions of three of the six through holes and one new hole are added to form a total of four through holes 1 having a diameter of 50 μm. (Shown in FIG. 3 (e)). Thereafter, the wiring pattern 3 and the through-hole pad 2 are provided on the upper side of the substrate in FIG. 3E corresponding to the positions of the three through-holes among the six through-holes in FIG. The insulating paste was screen-printed with a thickness of 50 μm except for the portion to be formed. The through-hole pad 2 has a diameter of 100 μm, and the wiring pattern 3 has a line width of 50 μm (shown in FIG. 3F). Further, a through hole 1 having a diameter of 50 μm was formed at the position of two of the four through holes in FIG. 3E on one substrate having the same shape (FIG. 3G). (A cross section of a line connecting the center of T1 and the center of Bu11 is shown in the figure). Thereafter, the wiring pattern 3 and the pad 2 for the through hole are formed on the upper side of the substrate of FIG. 3G corresponding to the positions of the two through holes of the four through holes of FIG. The insulating paste was screen-printed with a thickness of 50 μm except for the portion to be formed. The through-hole pad 2 has a diameter of 100 μm, and the wiring pattern 3 has a line width of 50 μm (shown in FIG. 3H). Furthermore, one of the two through holes shown in Fig. 3 (g) is added to one substrate with the same shape, and two new holes are added, for a total of three holes with a diameter of 50 µm. Hole 1 was formed (shown in FIG. 3 (i)). After this, it corresponds to the position of one of the two through-holes in FIG. 3 (g), and two of the through-holes in the three through-holes in FIG. The insulating paste was screen-printed with a thickness of 50 μm on the upper side of the substrate of FIG. 3 (i) corresponding to the position, except for the part where the wiring pattern 3 and the through-hole pad 2 were formed. The through-hole pad 2 has a diameter of 100 μm, and the wiring pattern has a line width of 50 μm (shown in FIG. 3J). Further, a through hole 1 having a diameter of 50 μm was formed in one substrate having the same shape at the same position as the three through holes in FIG. 3I (shown in FIG. 3K). Furthermore, a through hole 1 having a diameter of 50 μm was formed in one of the three through holes shown in FIG. 3 (k) on one substrate having the same shape (shown in FIG. 3 (l)). Thereafter, the substrate of FIG. (L) is disposed at the bottom, and the substrate of FIG. (K), the substrate of FIG. (I), the substrate of FIG. (G), and the substrate of FIG. The substrate of FIG. (D), the substrate of FIG. (C), and the substrate of FIG. (B) are sequentially arranged on top, and the through holes constituting the two through via holes provided at the ends of the substrate overlap each other. Thus, the eight substrates were positioned and laminated by applying a compressive load of 2 MPa (shown in FIG. 3 (m)).
Next, the laminated substrate was placed in a cylindrical container, and the cylindrical container was placed in a vacuum impregnation apparatus. Thereafter, the vacuum impregnation apparatus was evacuated, and the cylindrical container was filled with the conductive paste so that the laminated substrate was immersed in the conductive paste. After 5 minutes, the vacuum impregnation apparatus was opened to the atmosphere, and after another 5 minutes, the laminated substrate was taken out from the vacuum impregnation apparatus. Thereafter, the insulating paste was screen-printed with a thickness of 100 μm on the surface layer of the laminated substrate except for a portion where a pad for a through hole having a diameter of 200 μm and two pads for a blind via hole were formed (see FIG. 3 (m)). Thereafter, the laminated substrate was heat-treated in a hydrogen gas reducing atmosphere with a compressive load applied. First, the temperature was raised to 75 ° C. to vaporize methanol and vinyl acetate. Next, the substrate was left at 200 ° C. for 5 minutes to thermally decompose tetraammine copper nitrate.
Next, for the sample manufactured under the above conditions, the sample is cut along a line connecting the center of the through via hole T1 and the center of the blind via hole Bl1, and a through hole for forming the through via hole in the cut surface and two blind via holes are formed. In the same manner as in Example 1, the through-holes to be formed, the through-holes to form six buried via holes, the four wiring patterns and the respective wiring patterns to form the through-hole pads and the through-hole pads Observed with a microscope.
First, a secondary electron beam between 900-1000 V of the reflected electron beam was taken out and subjected to image processing, and through holes, wiring patterns, and through hole pads in various parts of the cross section of the sample were observed. The inside of the through hole and the wiring pattern and the pad for the through hole were uniformly filled with a collection of granular fine particles having a size of 40 to 60 nm.
Next, image processing was performed by extracting energy between 900 and 1000 V of the reflected electron beam, and the difference in the material of the granular fine particles was observed depending on the density of the image. Since the collection of granular fine particles was not recognized, it was found that they were composed of the same atoms.
Furthermore, the energy and intensity of characteristic X-rays were image-processed, and the types of elements constituting the particulate particles were analyzed. Since the particulate fine particles were composed only of copper atoms, they were copper particulate fine particles.
From the above observation results, since any through hole, any wiring pattern, and any through hole pad are filled with a collection of copper fine particles having a size of 40-60 nm, the entire layer is penetrated and connected. The through via hole and the lower end of the first blind via hole are electrically connected to the lower end of the first buried via hole, and the lower end of the second blind via hole is electrically connected to the lower ends of the second and third buried via holes. It was found that a via hole structure in which the lower end portion of the fourth buried via hole was electrically connected to the upper end portions of the fifth and sixth buried via holes was formed in the laminated substrate. If the through via hole is used as a heat conduction path, the multilayer wiring board manufactured in this embodiment becomes a multilayer wiring board having excellent thermal conductivity.
In the present embodiment, the manufacturing process for forming four blind via holes and twelve buried via holes is the same as the manufacturing process for forming five or more blind via holes and thirteen or more buried via holes. . In addition, the position of the substrate through which the blind via hole and the buried via hole are electrically connected can be freely changed, and it is a process that merely screen-prints the insulating paste on the single substrate, and therefore, from the plurality of blind via holes and the plurality of buried via holes A via structure in which via holes are electrically connected to each other at various positions can be formed on a multilayer wiring board at a low manufacturing cost regardless of the position and number of via holes.

Example 4
In the present embodiment, two through via holes T1 and T2, eight blind via holes Bl1-Bl8, and twelve buried via holes Bu1-Bul12 are formed. 1 is an example of manufacturing a multilayer wiring board that has been manufactured.
First, the structure of the multilayer wiring board will be described. The lower end portion of the first blind via hole Bl1 having a depth of two substrates is electrically connected to the upper end portion of the first buried via hole Bu1 that connects the third substrate and the fourth substrate. Further, the lower end portion of the second blind via hole Bl2 having a depth of two substrates is electrically connected to the upper end portion of the second buried via hole Bu2 that connects the third substrate and the fourth substrate. . Further, a third blind via hole provided at the lower part of the laminated substrate and having an upper end portion of a third blind via hole Bl3 having a depth of two substrates connects the ninth substrate and the tenth substrate. Conduction at the lower end of Bu3. The fourth blind lead provided at the lower portion of the laminated substrate and having the upper end of the fourth blind via hole Bl4 having the depth of two substrates connects the ninth substrate and the tenth substrate. Conduction is made at the lower end of the via hole Bu4. Further, the upper end portion of the fifth buried via hole Bl5 connecting the fifth substrate to the eighth substrate is electrically connected to the lower end portion of the first buried via hole Bu1 and the second buried via hole Bu2. At the same time, the lower end portion of the fifth buried via hole Bu5 is electrically connected to the upper end portion of the third buried via hole Bu3 and the fourth buried via hole Bu4. Further, the lower end portion of the fifth blind via hole Bl5 having the depth of four substrates is conducted at the lower end portion of the sixth buried via hole Bu6 connecting the third substrate and the fourth substrate, In addition, conduction is made at the upper end portion of the seventh buried via hole Bu7 connecting the fifth substrate and the sixth substrate. Further, the lower end portion of the sixth blind via hole Bl6 having the depth of four substrates is electrically connected to the upper end portion of the eighth buried via hole Bu8 connecting the fifth substrate and the sixth substrate. . Further, a ninth blind lead is provided at the lower part of the laminated substrate, and the upper end portion of the seventh blind via hole Bl7 having a depth of two substrates connects the ninth substrate and the tenth substrate. Conduction is made at the lower end of the via hole Bu9 and the tenth buried via hole Bu10. Further, an eleventh belly provided at the lower part of the laminated substrate and having an upper end portion of an eighth blind via hole Bl8 having a depth of two substrates connects the ninth substrate and the tenth substrate. Conduction is conducted at the lower end of the via hole Bu11. Further, the upper end portion of the twelfth buried via hole Bu12 connecting the seventh substrate and the eighth substrate is electrically connected to the lower end portion of the seventh buried via hole Bu7 and the eighth buried via hole Bu8. At the same time, the lower end of the twelfth buried via hole Bu12 is electrically connected to the upper ends of the ninth buried via hole Bu9, the tenth buried via hole Bu10, and the eleventh buried via hole Bu11. FIG. 4A is a diagram schematically showing the upper surface layer of the multilayer wiring board to be manufactured. Since the wiring patterns of the blind via holes Bl1-B8 and the through via holes T1, T2 are not uniquely determined by adopting various shapes, in this embodiment, the pad for the through hole between the blind via hole and the through via hole is used. Are shown as B11-B18 and T1, T2 in FIG. 4 (a). Note that the substrate, conductive paste, and insulating paste used in this example are the same as those used in Example 1.
Next, a method for manufacturing a multilayer wiring board will be described. First, through holes 1 having a diameter of 50 μm are formed in a total of six places where two through via holes T1, T2 and four blind via holes Bl1, Bl2, Bl5, B16 are formed on one substrate having the same shape. did. FIG. 4B illustrates the through hole formation position in a cross section of a line connecting the center of the through via hole T1 and the center of the through via hole T2. The following drawings are similar sectional views. Next, a through-hole 1 having a diameter of 50 μm was formed on the same shape of one substrate at the same position as the above six locations (shown in FIG. 4C). Furthermore, in addition to the four places where two through via holes T1, T2 and two blind via holes Bl5, Bl6 are formed on one substrate having the same shape, three buried via holes Bu1, Bu2, Bu6 are formed. The locations were added, and through holes 1 having a diameter of 50 μm were formed in a total of 7 locations (shown in FIG. 4D). After this, on the upper side of the substrate provided with through holes at seven locations shown in FIG. 4 (d), at the position corresponding to the lower end portion of the first blind via hole Bl1 and at the upper end portion of the first buried via hole Bu1. Except for the part of the pad for the through hole formed at the corresponding position and the part where the wiring pattern for conducting these two via holes is formed, it further corresponds to the lower end of the second blind via hole B12. Except for the part of the pad for the through hole formed at the position and the position corresponding to the upper end portion of the second buried via hole Bu2, and the part where the wiring pattern for conducting these two via holes is formed. The active paste was screen printed with a thickness of 50 μm. The through-hole pad 2 has a diameter of 100 μm, and the wiring pattern 3 has a line width of 50 μm. Note that the print pattern in screen printing is the same as the print pattern illustrated in FIGS. 3F, 3H, 3J, and the like in Example 3, and therefore the print pattern is not shown. Further, a through hole 1 having a diameter of 50 μm was formed in one substrate having the same shape at the same position as the seven places shown in FIG. 4D (shown in FIG. 4E). Further, through holes 1 having a diameter of 50 μm are formed at a total of five positions where two through via holes T1, T2 and three buried via holes Bu5, Bu7, Bu8 are formed on one substrate having the same shape. Formed (shown in FIG. 4 (f)). After this, on the upper side of the substrate provided with the through holes at the five positions shown in FIG. 4 (f), positions corresponding to the lower end portions of the first buried via hole Bu1 and the second buried via hole Bu2, Except for the part of the pad for the through hole formed at the position corresponding to the upper end portion of the fifth buried via hole Bu5 and the part where the wiring pattern for conducting these three via holes is formed, Portions corresponding to the lower end portions of the blind via hole Bl5 and the sixth buried via hole Bu6, and portions of pads for through holes formed at positions corresponding to the upper end portion of the seventh buried via hole Bu7, Except for the portion where the wiring pattern for conducting the three via holes is formed, a position corresponding to the lower end of the sixth blind via hole Bl6 and an eighth buried via The insulating paste is formed in a thickness of 50 μm, except for the part of the pad for the through hole formed at the position corresponding to the upper end of the rule Bu8 and the part where the wiring pattern for conducting these two via holes is formed. Screen printed. The through-hole pad 2 has a diameter of 100 μm, and the wiring pattern 3 has a line width of 50 μm. Further, through holes 1 having a diameter of 50 μm were formed in the same shape of one substrate at five locations similar to the substrate illustrated in FIG. 4F (illustrated in FIG. 4G). Furthermore, through holes 1 having a diameter of 50 μm were formed in a total of four positions where two through via holes T1, T2 and two buried via holes Bu5, Bu12 were formed on one substrate having the same shape ( (Illustrated in FIG. 4 (h)). Thereafter, on the upper side of the substrate provided with through holes at four positions shown in FIG. 4 (h), positions corresponding to the lower end portions of the seventh buried via hole Bu7 and the eighth buried via hole Bu8, and Except for the part of the pad for the through hole formed at the position corresponding to the upper end portion of the twelve buried via hole Bu12 and the part where the wiring pattern for conducting these three via holes is formed, the insulating paste is used. Screen printing was performed at a thickness of 50 μm. The through-hole pad 2 has a diameter of 100 μm, and the wiring pattern 3 has a line width of 50 μm. Furthermore, through-holes 1 having a diameter of 50 μm were formed on the same shape of one substrate at four locations similar to the substrate illustrated in FIG. 4H (illustrated in FIG. 4I). Further, two through via holes T1, T2 and five buried via holes Bu3, Bu4, Bu9, Bu10, Bu11 are formed on one substrate of the same shape, and a total of seven positions with a diameter of 50 μm. Hole 1 was formed (shown in FIG. 4 (j)). Thereafter, on the upper side of the substrate provided with through holes at seven locations shown in FIG. 4 (j), the position corresponding to the lower end of the fifth buried via hole Bu5, the third buried via hole Bu3 and the fourth Except for the part of the pad for the through hole formed at the position corresponding to the upper end of the buried via hole Bu4 and the part where the wiring pattern for conducting these three via holes is formed, A position corresponding to the lower end of the second buried via hole Bu12, and a position corresponding to the upper end of the ninth buried via hole Bu9, the tenth buried via hole Bu10, and the upper end of the eleventh buried via hole Bu11; Insulating paste with a thickness of 50 μm is removed except for the part of the pad for the through hole formed in the hole and the part where the wiring pattern for conducting these four via holes is formed. And screen printing. The through-hole pad 2 has a diameter of 100 μm, and the wiring pattern 3 has a line width of 50 μm. Further, through holes 1 having a diameter of 50 μm were formed on one substrate having the same shape at seven locations similar to the substrate illustrated in FIG. 4J (illustrated in FIG. 4K). Furthermore, a through hole 1 having a diameter of 50 μm was formed at the position where two through via holes T1 and T2 and four blind via holes Bl3, Bl4, Bl7, and Bl8 are formed on a single substrate having the same shape ( (Illustrated in FIG. 4 (l)). After this, on the upper side of the substrate provided with through holes at six locations shown in FIG. 4 (l), on the position corresponding to the lower end portion of the third buried via hole Bu3 and on the upper end portion of the third blind via hole Bl3. Except for the part of the pad for the through hole formed at the corresponding position and the part where the wiring pattern for conducting these two via holes is formed, it further corresponds to the lower end portion of the fourth buried via hole Bu4. Except for the position of the pad for the through hole formed at the position and the position corresponding to the upper end portion of the fourth blind via hole Bl4, and the portion where the wiring pattern for conducting these two via holes is formed, A portion of a pad for a through hole formed at the lower end of the ninth buried via hole Bu9 and the tenth buried via hole Bu10, and a seventh blind via hole Bl7 Except for the portion of the pad for the through hole formed at the position corresponding to the upper end portion and the portion where the wiring pattern for conducting these three via holes is formed, the eleventh buried via hole Bu11 A portion of the through hole pad formed in the lower end portion, a portion of the through hole pad formed in a position corresponding to the upper end portion of the eighth blind via hole Bl8, and a wiring pattern for conducting these two via holes The insulating paste was screen-printed with a thickness of 50 μm except for the part where the film was formed. The through-hole pad 2 has a diameter of 100 μm, and the wiring pattern 3 has a line width of 50 μm. Furthermore, through-holes 1 having a diameter of 50 μm were formed on the same shape of one substrate at six locations similar to the substrate illustrated in FIG. 4L (illustrated in FIG. 4M). Thereafter, the substrate of FIG. (M) is placed at the bottom, the substrate of FIG. (L) is further placed thereon, the substrate of FIG. (K), the substrate of FIG. (J), and the substrate of FIG. The substrate of FIG. (H), the substrate of FIG. (G), the substrate of FIG. (F), the substrate of FIG. (E), the substrate of FIG. Position the 12 substrates so that the through holes constituting the two through via holes provided at the end of the substrate are overlapped with the substrate of FIG. Then, they were laminated by applying a compressive load of 3 MPa (shown in FIG. 4 (n) by a cross section of a line connecting the center of the through via hole T1 and the center of the through via hole T2).
Next, the laminated substrate was placed in a cylindrical container, and the cylindrical container was placed in a vacuum impregnation apparatus. Thereafter, the vacuum impregnation apparatus was evacuated, and the cylindrical container was filled with the conductive paste so that the laminated substrate was immersed in the conductive paste. After 5 minutes, the vacuum impregnation apparatus was opened to the atmosphere, and after another 5 minutes, the laminated substrate was taken out from the vacuum impregnation apparatus. Thereafter, the insulating paste was screen-printed with a thickness of 100 μm on the surface layer of the laminated substrate except for a portion where a through-hole pad having a diameter of 200 μm and two blind via-hole pads were formed. Thereafter, the laminated substrate was heat-treated in a hydrogen gas reducing atmosphere with a compressive load applied. First, the temperature was raised to 75 ° C. to vaporize methanol and vinyl acetate. Next, the substrate was left at 200 ° C. for 5 minutes to thermally decompose tetraammine copper nitrate.
Next, with respect to the sample manufactured under the above-described conditions, the sample is cut at the center line of the substrate connecting the centers of the two through via holes T1 and T2, and each through hole forming two through via holes on the cut surface and Each through hole for forming a blind via hole, each through hole for forming 12 buried via holes, each wiring pattern for forming 12 wiring patterns and a pad for the through hole, and a pad for the through hole Was observed with an electron microscope in the same manner as in Example 1.
First, a secondary electron beam between 900-1000 V of the reflected electron beam was taken out and subjected to image processing, and through holes, wiring patterns, and through hole pads in various parts of the cross section of the sample were observed. The inside of the through hole and the wiring pattern and the through hole pad were uniformly filled with a collection of particulate fine particles having a size of 40 to 60 nm.
Next, image processing was performed by extracting energy between 900 and 1000 V of the reflected electron beam, and the difference in the material of the granular fine particles was observed depending on the density of the image. Since the collection of granular fine particles was not recognized, it was found that they were composed of the same atoms.
Furthermore, the energy and intensity of characteristic X-rays were image-processed, and the types of elements constituting the particulate particles were analyzed. Since the particulate fine particles were composed only of copper atoms, they were copper particulate fine particles.
From the above observation results, any through hole, any wiring pattern, and any through hole pad were filled with a collection of copper fine particles having a size of 40-60 nm. Therefore, the through via hole connecting through all the layers and the lower end of the first blind via hole are electrically connected to the lower end of the first buried via hole, and the lower end of the second blind via hole is connected to the second belly. Conducting with the lower end of the via hole, the upper end of the third blind via hole is connected with the lower end of the third buried via hole, and the upper end of the fourth blind via hole is connected with the lower end of the fourth buried via hole. Conductive, the lower end portion of the first buried via hole and the second buried via hole are conducted to the upper end portion of the fifth buried via hole, and the upper end of the third buried via hole and the fourth buried via hole Is connected to the lower end of the fifth buried via hole, and the lower end of the fifth blind via hole is connected to the lower end of the sixth buried via hole and the seventh buried via hole. Conducting with the end, the lower end of the sixth blind via hole is connected with the upper end of the eighth buried via hole, and the upper end of the seventh blind via hole is connected with the ninth and tenth buried via holes. The upper end of the eighth blind via hole is electrically connected to the lower end of the eleventh buried via hole, and the upper end of the twelfth buried via hole is connected to the seventh buried via hole. The lower end of the eighth buried via hole is electrically connected to the lower end of the twelfth buried via hole, and the lower end of the twelfth buried via hole is electrically connected to the upper end of the ninth, tenth and eleventh buried via holes. It was found that the via hole structure to be formed on the laminated substrate. If the through via hole is used as a heat conduction path, the multilayer wiring board manufactured in this embodiment becomes a multilayer wiring board having excellent thermal conductivity.
In the present embodiment, the manufacturing process for forming eight blind via holes and twelve buried via holes is the same as the manufacturing process for forming nine or more blind via holes and thirteen or more buried via holes. . In addition, the position of the substrate through which the blind via hole and the buried via hole are electrically connected can be freely changed, and the processing is only the screen printing of the insulating paste on the single substrate, so the plurality of blind via holes and the plurality of buried via holes can be used. A via structure in which via holes are electrically connected to each other at various positions can be formed on a multilayer wiring board at a low manufacturing cost regardless of the position and number of via holes. This is because of the two features of the present invention described in the first embodiment.
Although the production of the multilayer wiring board in which the via holes having various structures are formed has been described by the four embodiments described above, the production of the multilayer wiring board according to the present invention is not limited to the four embodiments. That is, since the present invention has the following two features, various via holes are used as conductive layers regardless of the type of via hole, the via structure, the number of via holes, and the number of via structures, and the via hole is a pad for a through hole. A multilayer wiring board is produced in which a conductive layer is formed which is electrically connected to the wiring pattern through the wiring. The first feature is that through holes are processed for a single substrate, so the position and number of through holes can be changed arbitrarily. Even if the number of through holes increases, the processing cost will not increase. Almost unchanged. The second feature is that the substrate in which the via holes are conductive can be stacked on the multilayer distribution substrate at an arbitrary position because the stacking order can be arbitrarily changed when the substrate is stacked as a multilayer substrate. Furthermore, since it is a process that merely screen-prints an insulating paste on a single substrate, even if the number of substrates through which via holes are connected increases, manufacturing costs do not increase. For this reason, a multilayer wiring board in which via holes having various structures are formed can be manufactured at low cost.

DESCRIPTION OF SYMBOLS 1 Through-hole 2 Pad for through-hole 3 Wiring pattern T1, T2 Through-via hole Bl1-Bl9 Blind via hole Bu1-Bu12 Beled via hole

Claims (16)

A manufacturing method for manufacturing a multilayer wiring board in which at least one of through via holes connecting through all layers is formed,
When both the surface layer substrate on which the through via hole is formed and the substrate on which the wiring pattern is not formed are overlapped, at least one through hole is formed at a position where all the through holes overlap to form a through hole. When the first step of providing a hole and the substrate on which the wiring pattern is formed are overlapped with the substrate corresponding to the central portion where the through hole pad is formed and the substrate constituting the through via hole is overlapped, At least one through-hole is provided at a position where the through-holes overlap to form a through-hole, and the surface excluding the portion where the wiring pattern and the through-hole pad are formed is insulative. For the second step of screen printing with paste and the substrate constituting the through via hole described above, the substrate is formed so that all the through holes of the substrate overlap each other. A third step of laminating each other and applying a compressive load, a fourth step of placing the laminated substrates in a vacuum impregnation device, and evacuating the vacuum impregnation device to make the vacuum impregnation device conductive. A fifth step of supplying a paste, a sixth step of returning the vacuum impregnation device to atmospheric pressure, or supplying compressed air to the vacuum impregnation device, and taking out the laminated substrate from the vacuum impregnation device; About the substrate of the surface layer of the laminated substrate, except for the portion where both the wiring pattern and the pad for the through hole are formed, screen printing an insulating paste, followed by a seventh step of heat treatment, A manufacturing method in which these seven steps are successively performed is a manufacturing method for manufacturing a multilayer wiring board in which at least one of the through via holes is formed. A manufacturing method for manufacturing a multilayer wiring board in which at least one blind via hole having a dead end structure connecting an inner layer from a surface layer is formed,
For both the surface layer substrate that constitutes the blind via hole and the substrate other than the innermost substrate, when these substrates are overlapped, at least one through hole is formed at a position where all the through holes overlap to form a through hole. When the first step of providing a hole and the innermost substrate at a position corresponding to the central portion where the pad for the through hole is formed and the substrate constituting the blind via hole are overlapped, all the through holes At least one through-hole is provided at a position that also serves as a position for forming a through-hole, and the surface excluding the portion where the wiring pattern and the through-hole pad are formed is screened with an insulating paste. For the second step of printing and the substrate constituting the blind via hole described above, the substrate is the same so that all the through holes of the substrate overlap each other. A fourth step of laminating and laminating by applying a compressive load, a fourth step of placing the laminated substrate in a vacuum impregnation device, and evacuating the vacuum impregnation device, and conducting paste in the vacuum impregnation device And a sixth step of returning the vacuum impregnation device to atmospheric pressure, or supplying compressed air to the vacuum impregnation device, and taking out the laminated substrate from the vacuum impregnation device, Concerning the substrate of the surface layer of the laminated substrate, it consists of a seventh step in which an insulating paste is screen-printed on a portion excluding a portion where both the wiring pattern and the through hole pad are formed, and then heat-treated. A manufacturing method in which the seven steps are continuously performed is a manufacturing method for manufacturing a multilayer wiring board in which at least one of blind via holes is formed. A manufacturing method for manufacturing a multilayer wiring board in which at least one buried via hole having a buried structure that connects only inner layers other than the surface layer is formed,
For the outermost substrate that constitutes the buried via hole, it is the position corresponding to the central portion where the pad for the through hole is formed, and when the substrates that constitute the buried via hole are overlapped, all the through holes overlap. At least one through-hole is provided at a position that is also a position for forming a through-hole, and the surface excluding the portion where the wiring pattern and the through-hole pad are formed is screen-printed with an insulating paste. When the first step and the innermost substrate are positioned corresponding to the central portion where the pad for the through hole is formed and the substrate constituting the buried via hole is overlapped, all the through holes overlap. At least one through hole is provided at a position that is also a position for forming a through hole, and a wiring pattern and a pad for the through hole are formed. The surface except the position, and a second step of screen printing an insulating paste, the substrate constituting the berries de holes excluding the two substrates, when overlapping the substrates constituting the berries de hole, all the through The third step of providing at least one through hole at a position where the hole overlaps and forms a through hole, and the substrate constituting the above-described buried via hole, so that all the through holes of the substrate overlap each other, A fourth step of stacking the substrates together and applying a compressive load, a fifth step of placing the stacked substrates in a vacuum impregnation device, evacuating the vacuum impregnation device, and A sixth step of supplying the conductive paste to the vacuum impregnation apparatus so that the portion excluding the uppermost layer portion is immersed in the conductive paste; and returning the vacuum impregnation apparatus to atmospheric pressure. Or a manufacturing method for continuously performing these eight steps, comprising a seventh step of supplying compressed air to the vacuum impregnation device and an eighth step of taking out the laminated substrate from the vacuum impregnation device. However, this is a manufacturing method for manufacturing a multilayer wiring board in which at least one buried via hole is formed. A manufacturing method for manufacturing a multilayer wiring board on which at least one set of stacker via structures in which blind via holes are conducted to buried via holes is formed,
Overlay the substrate that constitutes the blind via hole at the position corresponding to the center portion where the pad for the through hole is formed on both the surface layer substrate that constitutes the blind via hole and the substrate other than the innermost substrate. Together, the first step of providing at least one through hole at a position where all the through holes overlap to form a through hole, the innermost substrate constituting the blind via hole, and the belly When the substrate that is also the outermost substrate constituting the via hole is located at a position corresponding to the center part of each of the two through-hole pads formed, and the substrates constituting the blind via hole are overlapped, The through hole is provided at a position where the through hole overlaps with the through hole, and further, the wiring pattern and the two The second step of screen-printing the surface excluding the portion where the through-hole pad is formed with an insulating paste, and the center where the through-hole pad is formed on the innermost substrate constituting the buried via hole At least one through hole is provided at a position corresponding to a portion and at a position where all the through holes overlap to form a through hole when the substrate constituting the buried via hole is overlapped, The third step of screen-printing the surface excluding the portion where the wiring pattern and the through hole pad are formed with an insulating paste, and the substrate constituting the buried via hole excluding the two substrates, overlaying substrate constituting a de hole, and a fourth step of forming a through hole in a position to form a hole penetrating overlap all the through-holes, and the About the substrate constituting the lined via hole and the substrate constituting the above-described buried via hole, the fifth step of laminating the substrates so that all the through holes overlap each other and applying a compression load, A sixth step of placing the laminated substrate in a vacuum impregnation device; a seventh step of evacuating the vacuum impregnation device and supplying a conductive paste to the vacuum impregnation device; and bringing the vacuum impregnation device to atmospheric pressure. An eighth step of returning or supplying compressed air to the vacuum impregnation device, and taking out the laminated substrate from the vacuum impregnation device, and a wiring pattern and a through-hole pad for the surface layer substrate of the laminated substrate The nine steps comprising the ninth step of screen-printing an insulating paste on the portion excluding the portion where both are formed and then heat-treating are subsequently carried out. This manufacturing method is a manufacturing method for manufacturing a multilayer wiring board on which at least one set of stacker via structures in which blind via holes are conducted to buried via holes is formed. A manufacturing method for manufacturing a multilayer wiring board formed with a stack via structure in which buried via holes are electrically connected to each other,
A wiring pattern in which the first buried via hole is electrically connected to the second buried via hole is formed, and two through-hole pads are formed on the substrate constituting one end of the first buried via hole. In a position corresponding to each central portion, and when the substrates constituting the first and second buried via holes are overlapped, all the through holes are overlapped to form a through hole. A first step of screen-printing an insulating paste on the surface excluding a portion where the wiring pattern and the two through-hole pads are formed; and the other of the first buried via holes When the substrate constituting the end portion is overlapped with the substrate constituting the first buried via hole at a position corresponding to the central portion where the through-hole pad is formed. A through-hole is provided at a position where all the through-holes overlap to form a through-hole, and the surface excluding the portion where the wiring pattern and the through-hole pad are formed is formed with an insulating paste. a second step of screen printing, the substrate constituting the first belly de hole excluding the two substrates, when overlapping the substrates constituting the first belly de via holes, overlaps all the through-holes A third step of providing a through hole at a position to form a through hole; and a second belly that opposes a substrate on which a wiring pattern is formed in which the first buried via hole is electrically connected to the second buried via hole. The substrate constituting the other end of the via hole is a position corresponding to the central portion where the pad for the through hole is formed, and the substrate constituting the second buried via hole. If the two are overlapped, a through hole is provided at a position where all the through holes overlap to form a through hole, and the surface excluding the portion where the wiring pattern and the through hole pad are formed is removed. a fourth step of screen printing an insulating paste, the substrate constituting the second berries de hole excluding the two substrates, when superimposing the substrate constituting the second berries de via holes, all A fifth step of providing a through hole at a position where a through hole is formed by overlapping the through hole, a substrate constituting the first buried via hole, and a substrate constituting the second buried via hole; The sixth step of stacking the substrates so that all the through-holes overlap each other and applying a compressive load, and the seventh step of placing the stacked substrates in a vacuum impregnation apparatus And the vacuum impregnation device is evacuated and the conductive paste is supplied to the vacuum impregnation device so that the portion excluding the uppermost layer portion of the laminated substrate is immersed in the conductive paste. And the ninth step of returning the vacuum impregnation device to atmospheric pressure, or supplying compressed air to the vacuum impregnation device, and the tenth step of taking out the laminated substrate from the vacuum impregnation device. The manufacturing method in which the ten steps are continuously performed is a manufacturing method for manufacturing a multilayer wiring board on which a stacked via structure in which buried via holes are electrically connected to each other is formed. A manufacturing method of manufacturing a multilayer wiring board in which a stacked via structure in which one buried via hole is electrically connected to another blind via hole is formed.
And surface of the substrate constituting the blind via hole, with both of the substrate except the innermost substrate, a position corresponding to the center portion of the pad of the through-holes are formed, and the substrate of the blind via hole When overlapped, the first step of providing a through hole at a position where all the through holes overlap to form a through hole, the innermost substrate constituting the blind via hole, and the first The substrate which is also the outermost substrate constituting the buried via hole is positioned corresponding to the central portion of each pad where the two through-hole pads are formed, and the substrate constituting the blind via hole is overlaid. And the position where the through holes overlap, and the position where the through holes overlap when the substrate constituting the first buried via hole is overlapped However, a through-hole is provided at a certain position, and the surface excluding the portion where the wiring pattern conducting to the first buried via hole and the two through-hole pads are formed is screened with an insulating paste. For the second step of printing and the innermost substrate constituting the first buried via hole and the outermost substrate constituting the second buried via hole, A position corresponding to a central portion of each pad on which the pad is formed, and a position where the through holes overlap when the substrates constituting the first buried via hole are overlapped, and the second buried A wiring pattern that is provided with a through hole at a position where the through holes overlap each other when the substrates constituting the via hole are overlapped, and further conductive to the second buried via hole And a third step of screen-printing the surface excluding the portion where the two through-hole pads are formed with an insulating paste, and a first buried via hole excluding the two substrates. for the substrate, when overlapping the substrates constituting the first belly de via hole, the position for forming a hole penetrating overlap all the through-hole, and a fourth step of forming a through hole, a second belly de hole Is the position corresponding to the central portion where the through-hole pad is formed, and when the substrate constituting the second buried via hole is overlapped, all the through-holes overlap. In addition, a through-hole is provided at a position that is also a position for forming a through-hole, and a surface excluding a portion where the wiring pattern leading to the end of the substrate and the through-hole pad are formed is formed on an insulating tape A fifth step of screen printing with paste, the substrate constituting the second berries de hole excluding the two substrates, when superimposing the substrate constituting the second berries de via holes, all holes A sixth step of providing a through hole at a position where an overlapping through hole is formed, a substrate constituting the above-described blind via hole, a substrate constituting the above-described first buried via hole, and the above-described second step A seventh step of stacking the substrates and stacking them by applying a compressive load so that all the through holes overlap each other with respect to the substrate constituting the buried via hole, and arranging the stacked substrates in a vacuum impregnation apparatus An eighth step, a ninth step of evacuating the vacuum impregnation device and supplying a conductive paste to the vacuum impregnation device, and returning the vacuum impregnation device to atmospheric pressure, or , A tenth step of supplying compressed air to the vacuum impregnation device, and taking out the laminated substrate from the vacuum impregnation device, and for the substrate on the surface layer of the laminated substrate, a wiring pattern of blind via holes and a through hole pad A manufacturing method comprising the eleventh step in which an insulating paste is screen-printed on a portion excluding the portion where both are formed, and then heat-treated, and the eleven steps are continuously performed. This is a manufacturing method of manufacturing a multilayer wiring board in which a stacked via structure in which one buried via hole that conducts to each other is conducted to a blind via hole is formed. A manufacturing method for manufacturing a multilayer wiring board in which a plurality of via holes including at least one of each via hole including a through via hole, a blind via hole, and a buried via hole is formed.
When both the surface layer substrate on which the through via hole is formed and the substrate on which the wiring pattern is not formed, the substrate constituting the through via hole is overlapped, at least at a position where all the through holes overlap to form a through hole. The first step of providing one through hole and the substrate on which the wiring pattern is formed are overlapped with the substrate constituting the through via hole at a position corresponding to the central portion where the pad for the through hole is formed. And at least one through-hole at a position where all the through-holes overlap to form a through-hole, and a surface excluding a portion where the wiring pattern and the through-hole pad are formed , Both the second step of screen printing with an insulating paste, the surface layer substrate constituting the blind via hole, and the substrate excluding the innermost substrate Then, when the substrates constituting the blind via hole are overlapped, the third step of providing at least one through hole at the position where all the through holes overlap to form the through hole, and the innermost side constituting the blind via hole The position corresponding to the central portion where the pad for the through hole is formed on the substrate, and also the position where all the through holes are overlapped to form a through hole when the substrates constituting the blind via hole are overlapped. A fourth step in which at least one through-hole is provided at a position, and the surface excluding the portion where the wiring pattern leading to the end of the substrate and the through-hole pad are formed is screen-printed with an insulating paste And the position corresponding to the central portion where the through hole pad is formed on the outermost substrate constituting the buried via hole. In addition, when the substrates constituting the buried via hole are overlapped, at least one through hole is provided at a position where all the through holes overlap to form a through hole, and the wiring pattern and the through hole are provided. In the fifth step of screen-printing the surface excluding the portion where the pad is formed with an insulating paste and the innermost substrate constituting the buried via hole, in the central portion where the through-hole pad is formed When the corresponding substrate and the substrate constituting the buried via hole are overlapped, at least one through hole is provided at a position where all the through holes overlap to form a through hole. A sixth step of screen-printing the surface excluding the portion where the wiring pattern leading to the end of the substrate and the through-hole pad are formed with an insulating paste If, for the substrate which constitutes the berries de holes excluding the two substrates, when overlapping the substrates constituting the berries de via hole, the position for forming a hole penetrating overlap all the through-holes, at least one through The seventh step of providing a hole, the substrate constituting the through via hole described above, and the substrate constituting the blind via hole described above are overlapped with each other so that all the through holes overlap each other, and a compressive load is applied. In addition, an eighth step of laminating, a ninth step of placing the laminated substrate in a vacuum impregnation device, and a tenth step of evacuating the vacuum impregnation device and supplying a conductive paste to the vacuum impregnation device The vacuum impregnation apparatus is returned to atmospheric pressure, or the eleventh step of supplying compressed air to the vacuum impregnation apparatus, and the laminated substrate is removed from the vacuum impregnation apparatus. An insulating paste is screened on the substrate of the surface layer of the laminated substrate, except for the portions where the wiring patterns of the through via holes and the blind via holes and the pads for the through holes are formed. The manufacturing method comprising printing and then heat-treating the twelfth step, and continuously performing these twelve steps comprises at least one of each via hole comprising a through via hole, a blind via hole and a buried via hole. This is a manufacturing method for manufacturing a multilayer wiring board in which a plurality of via holes are formed. A manufacturing method for manufacturing a multilayer wiring board in which a plurality of via holes including at least one set of a stack via structure and a through via hole in which a blind via hole is electrically connected to a buried via hole is formed.
When both the surface layer substrate on which the through via hole is formed and the substrate on which the wiring pattern is not formed, the substrate constituting the through via hole is overlapped, at least at a position where all the through holes overlap to form a through hole. The first step of providing one through hole and the substrate on which the wiring pattern is formed are overlapped with the substrate constituting the through via hole at a position corresponding to the central portion where the pad for the through hole is formed. And at least one through-hole at a position where all the through-holes overlap to form a through-hole, and a surface excluding a portion where the wiring pattern and the through-hole pad are formed , Both the second step of screen printing with an insulating paste, the surface layer substrate constituting the blind via hole, and the substrate excluding the innermost substrate The position corresponding to the central portion where the pad for the through-hole is formed, and the position where the through-hole is overlapped when the substrates constituting the blind via hole are overlapped with each other. A third step of providing at least one through-hole, and an innermost substrate constituting the blind via hole and a substrate which is also the outermost substrate constituting the buried via hole. A position corresponding to each central portion where the pad is formed, and a position where all the through holes overlap to form a through hole when the substrates constituting the blind via hole are overlapped; When the substrates constituting the via holes are overlapped, the through holes are formed at positions where all the through holes overlap to form the through holes. In addition, a fourth process of screen printing with an insulating paste on the surface excluding a portion where the wiring pattern conducting to the buried via hole and the two through-hole pads is formed, and the buried via hole are configured. The innermost substrate is a position corresponding to the central portion where the pad for the through hole is formed, and when the substrate constituting the buried via hole is overlapped, all the through holes are overlapped to penetrate the hole. A fifth step in which a through hole is provided at a position where the wiring pattern is to be formed, and the surface excluding the portion where the wiring pattern and the through hole pad are formed is screen-printed with an insulating paste; the substrate constituting the berries de hole except the substrates and overlaying the substrate of the berries de hole, penetrating overlap all the through-holes The sixth step of providing a through hole at a position where a hole is to be formed, the substrate constituting the above-described through via hole, and the substrate constituting the above-described blind via hole so that all the through holes overlap each other. A seventh step of laminating each other and applying a compressive load to laminate, an eighth step of placing the laminated substrates in a vacuum impregnation device, and evacuating the vacuum impregnation device to make the vacuum impregnation device conductive. A ninth step of supplying a paste, a tenth step of returning the vacuum impregnation device to atmospheric pressure, or supplying compressed air to the vacuum impregnation device, and taking out the laminated substrate from the vacuum impregnation device, A portion excluding a portion where the wiring patterns of the through via holes and the blind via holes and the pads for the through holes are formed on the surface layer substrate of the laminated substrate And an eleventh step in which an insulating paste is screen-printed and then heat-treated, and a manufacturing method in which these eleven steps are continuously performed is at least one set of stackers in which blind via holes are electrically connected to buried via holes. A manufacturing method for manufacturing a multilayer wiring board in which a plurality of via holes each including a via structure and at least one through via hole are formed. A manufacturing method for manufacturing a multilayer wiring board in which a plurality of via holes including a stacked via structure in which one buried via hole is electrically connected to a blind via hole and at least one through via hole is formed.
When both the surface layer substrate on which the through via hole is formed and the substrate on which the wiring pattern is not formed, the substrate constituting the through via hole is overlapped, at least at a position where all the through holes overlap to form a through hole. The first step of providing one through hole and the substrate on which the wiring pattern is formed are overlapped with the substrate constituting the through via hole at a position corresponding to the central portion where the pad for the through hole is formed. And at least one through-hole at a position where all the through-holes overlap to form a through-hole, and a surface excluding a portion where the wiring pattern and the through-hole pad are formed , Both the second step of screen printing with an insulating paste, the surface layer substrate constituting the blind via hole, and the substrate excluding the innermost substrate The position corresponding to the central portion where the pad for the through-hole is formed, and the position where the through-hole is overlapped when the substrates constituting the blind via hole are overlapped with each other. And a third step of providing a through hole, and an innermost substrate constituting the blind via hole and an outermost substrate constituting the first buried via hole, for two through holes. A position corresponding to the center portion of each pad where the pad is formed and a position where the through holes overlap each other when the substrates constituting the blind via hole are overlapped, and the first buried via hole is formed. When the substrates to be stacked are overlapped, a through hole is provided at a position where the through holes overlap with each other, and further connected to the first buried via hole. A fourth step of screen-printing the surface excluding the wiring pattern and the portion where the two through-hole pads are formed with an insulating paste, and the innermost substrate constituting the first buried via hole A position corresponding to the central portion of each pad where the pads for two through holes are formed, and the positions where the through holes overlap when the substrates constituting the first buried via hole are overlaid However, when the substrate constituting the second buried via hole is overlapped with the position, the wiring pattern in which the through hole is provided at the position where the through hole overlaps with each other and further conductive to the second buried via hole is provided. And a second step of screen-printing the surface excluding the portion where the two through-hole pads are formed with an insulating paste, and a first veri fi cation excluding the two substrates. The substrate constituting the over de hole and overlapping the substrate constituting the first berries de via hole, the position for forming a hole penetrating overlap all the through-hole, a sixth step of forming a through hole, the second The innermost substrate constituting the buried via hole is a position corresponding to the central portion where the pad for the through hole is formed, and when the substrates constituting the second buried via hole are overlapped, A through hole is provided at a position where the through hole overlaps to form a through hole, and the surface excluding a portion where the wiring pattern leading to the end of the substrate and the through hole pad are formed is provided. , constituting a seventh step of screen printing, the substrate constituting the second berries de hole excluding the two substrates, a second belly de via holes in an insulating paste When the substrates to be stacked are overlapped, the eighth step of providing a through hole at a position where all the through holes overlap to form a through hole, the substrate constituting the through via hole, and the blind via hole are formed. With respect to the substrate, the ninth step of stacking the substrates so that all the through-holes overlap each other and applying a compression load, and the tenth step of placing the stacked substrates in a vacuum impregnation apparatus, An eleventh step of evacuating the vacuum impregnation apparatus and supplying a conductive paste to the vacuum impregnation apparatus, and returning the vacuum impregnation apparatus to atmospheric pressure or supplying compressed air to the vacuum impregnation apparatus. Twelve steps and taking out the laminated substrate from the vacuum impregnation apparatus, and wiring each of the through via hole and the blind via hole with respect to the surface layer substrate of the laminated substrate It consists of a thirteenth step of screen-printing an insulating paste on a portion excluding a portion where the turn and each through-hole pad are formed, and then performing a heat treatment, and these 13 steps are carried out continuously. A manufacturing method manufactures a multilayer wiring board in which a plurality of via holes including a stacked via structure in which one buried via hole is electrically connected to a blind via hole and at least one through via hole is formed. It is a manufacturing method. The manufacturing method for manufacturing a multilayer wiring board according to any one of claims 1 to 9, excluding claim 3 and claim 5, wherein claim 3 and claim 5 are excluded. The conductive paste according to any one of claims 9 to 9, wherein a metal compound that precipitates a metal by thermal decomposition is dispersed in alcohol, and the alcohol dispersion has a boiling point lower than a temperature at which the metal compound is thermally decomposed. A manufacturing method for manufacturing a multilayer wiring board according to any one of claims 1 to 9, excluding claims 3 and 5, wherein the conductive paste is a conductive paste made of a mixed liquid in which an organic compound is mixed. . 11. The manufacturing method for manufacturing a multilayer wiring board according to claim 10, wherein the metal compound according to claim 10 has a metal complex ion in which a ligand consisting of an inorganic molecule or ion is coordinated to a metal ion. The manufacturing method which manufactures the multilayer wiring board of Claim 10 which is a metal compound which consists of a metal complex. In the manufacturing method which manufactures the multilayer wiring board described in Claim 10, The metal compound described in Claim 10 is a carboxylic acid metal compound, Comprising: This carboxylic acid metal compound is a carboxyl group in carboxylic acid. The manufacturing method which manufactures the multilayer wiring board of Claim 10 which is the carboxylic acid metal compound in which the oxygen ion to comprise is covalently bonded to a metal ion, and 2ndly, the said carboxylic acid is comprised with a saturated fatty acid. In the manufacturing method which manufactures the multilayer wiring board described in Claim 10, The organic compound described in Claim 10 is any organic compound which consists of carboxylic acid ester or glycol ether, Comprising: This organic compound Is first dissolved or mixed in alcohol, secondly the alcohol solution or alcohol mixture has a higher viscosity than the alcohol, and thirdly, the temperature at which the metal compound according to claim 10 is thermally decomposed. The manufacturing method which manufactures the multilayer wiring board of Claim 10 which is an organic compound which has these three properties with a lower boiling point. The manufacturing method for manufacturing a multilayer wiring board according to any one of claims 1 to 9, excluding claim 3 and claim 5, wherein claim 3 and claim 5 are excluded. The insulating paste according to any one of claims 9 to 9 contains the conductive paste according to any one of claims 1 to 9, excluding claims 3 and 5. 6. An insulating paste comprising a mixed solution of an organic compound having a boiling point higher than a temperature at which a metal compound that precipitates a metal by thermal decomposition has a temperature higher than the temperature at which the metal compound is thermally decomposed or mixed with an alcohol. The manufacturing method which manufactures the multilayer wiring board as described in any one of Claims 1-9 which remove | excludes. 15. The manufacturing method for manufacturing a multilayer wiring board according to claim 14, wherein the organic compound according to claim 14 is any organic compound comprising a carboxylic acid ester, a glycol, or a glycol ether. The organic compound is first dissolved or mixed in alcohol, and secondly, the alcohol solution or alcohol mixed solution has a viscosity higher than that of the alcohol, and thirdly, claim 3 and claim 5. A metal complex having a metal complex ion in which a ligand composed of an inorganic molecule or ion is included in the conductive paste according to any one of claims 1 to 9 except that the ligand is formed by coordination bond to a metal ion. 15. The multilayer wiring board according to claim 14, which is an organic compound having both of these three properties, which has a boiling point higher than the temperature at which pyrolysis occurs. Production method. In the manufacturing method which manufactures the multilayer wiring board described in Claim 14, the organic compound described in Claim 14 is any organic compound which consists of carboxylic acid esters or carboxylic acid, and the organic compound is First, it is dissolved or mixed in alcohol, and secondly, the alcohol solution or alcohol mixture has a higher viscosity than the alcohol, and thirdly, except for claims 3 and 5, Carboxylic acid metal compound in which an oxygen ion constituting a carboxyl group in a carboxylic acid is covalently bonded to a metal ion, and the carboxylic acid is composed of a saturated fatty acid, which is contained in the conductive paste according to claim 9 15. The multilayer wiring board according to claim 14, which is an organic compound having a boiling point higher than the temperature at which pyrolysis occurs and having these three properties. Production methods that.

Images