CN113119330B - Process and device for stretching diamond wire bus for cutting silicon wafer - Google Patents
Process and device for stretching diamond wire bus for cutting silicon wafer Download PDFInfo
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- CN113119330B CN113119330B CN202110439924.1A CN202110439924A CN113119330B CN 113119330 B CN113119330 B CN 113119330B CN 202110439924 A CN202110439924 A CN 202110439924A CN 113119330 B CN113119330 B CN 113119330B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention relates to the technical field of cutting equipment and discloses a cutting silicon wafer diamond wire bus stretching device, which comprises a stretching device, wherein the upper side of the outer surface of the stretching device is fixedly connected with a cutting device, the upper side of the outer surface of the stretching device is fixedly connected with a fixing device, the stretching device comprises a device plate, the lower side of the outer surface of the device plate is fixedly connected with a device pipe, the left side of the outer surface of the device pipe is provided with a threaded rod, the right end of the threaded rod is provided with a movable block, the front side of the outer surface of the movable block is provided with a spring plate, the right side of the outer surface of the spring plate is provided with an auxiliary block, the right side of the inner wall of the device pipe is fixedly connected with a fixing block, one end of the spring plate is provided with a movable rod, and the cutting silicon wafer diamond wire bus stretching process and the stretching device enable the threaded rod to rotate.
Description
Technical Field
The invention relates to the technical field of cutting equipment, in particular to a process and a device for stretching a diamond wire bus of a cut silicon wafer.
Background
In the fabrication of solar cell modules, monocrystalline silicon is sliced for subsequent further processing.
Therefore, the cutting device for cutting the silicon wafer appears on the market, the traditional cutting device adopts the diamond wire to cut the silicon wafer, but when the service time of the marine cutting device is long, the brackets on the left side and the right side cannot generate larger pulling force on the diamond wire, so that the cutting capability of the cutting device for the silicon wafer is insufficient, and the stretching process and the stretching device for cutting the silicon wafer diamond wire bus are urgently needed on the market at present, so that the problem that the traditional cutting device has no stretching effect on the diamond wire is solved.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a process and a device for stretching a silicon wafer diamond wire bus, which have the advantages of stretching the diamond wire and the like, and solve the problem that the traditional cutting device in the prior art cannot stretch the diamond wire.
In order to achieve the purpose of stretching the diamond wire mentioned in the background art, the invention provides the following technical scheme: the device comprises a stretching device, wherein the upper side of the outer surface of the stretching device is fixedly connected with a cutting device, and the upper side of the outer surface of the stretching device is fixedly connected with a fixing device;
the stretching device comprises a device plate, a device pipe is fixedly connected to the lower side of the outer surface of the device plate, a threaded rod is arranged on the left side of the outer surface of the device pipe, a movable block is arranged at the right end of the threaded rod, a spring plate is arranged on the front side of the outer surface of the movable block, an auxiliary block is arranged on the right side of the outer surface of the spring plate, a fixed block is fixedly connected to the right side of the inner wall of the device pipe, a movable rod is arranged at one end of the spring plate, and an auxiliary rod is arranged on one side of the outer surface of the movable rod;
the cutting device comprises a supporting rod, the left side of the outer surface of the supporting rod is fixedly connected with a device box body, the upper side of the inner wall of the device box body is fixedly connected with a spring device, the lower end of the spring device is fixedly connected with a movable groove plate, the rear side of the outer surface of the movable groove plate is provided with a rotary table, the right side of the outer surface of the movable groove plate is fixedly connected with a fixed ring, and the right side of the outer surface of the fixed ring is fixedly connected with a cutting rope;
the fixing device comprises a fixing plate, a supporting rod is fixedly connected to the upper side of the outer surface of the fixing plate, a pressing rod is arranged on the rear side of the outer surface of the supporting rod, a fixing device box body is fixedly connected to the front end of the pressing rod, a power rod is arranged on the upper side of the outer surface of the fixing device box body, an auxiliary disc is arranged at the lower end of the power rod, a limiting disc is arranged on the lower side of the outer surface of the auxiliary disc, and a fixing clamping plate is arranged on the front side of the outer surface of the fixing device box body.
Preferably, the rear side of the inner wall of the device pipe is provided with a sliding groove, and the rear side of the outer surface is overlapped with the rear side of the inner wall of the device pipe and penetrates through the rear side of the inner wall of the device pipe to the rear side of the outer surface of the device pipe, and the inner wall of the sliding groove is overlapped with a sliding rod, and the front end of the sliding rod is overlapped with the rear side of the outer surface of the auxiliary rod and penetrates through the rear side of the outer surface of the auxiliary rod to the front side of the outer surface of the auxiliary rod.
Preferably, the device pipe and one side of the outer surface of the movable rod are provided with hole grooves, the hole grooves penetrate through the device pipe and one side of the outer surface of the movable rod, and the inner walls of the hole grooves are overlapped with the outer surface of the auxiliary rod.
The right side of the outer surface of the spring plate is provided with a tooth block, the left side of the outer surface of the fixed block is also provided with a tooth block, and the tooth blocks at the left side and the right side are matched with each other, so that when the spring plate moves, one side of the outer surface of the left tooth block is overlapped with one side of the outer surface of the right tooth block, and the spring plate is fixed.
Preferably, the right side of the outer surface of the movable groove plate is fixedly connected with a long rod, and the right end of the long rod is overlapped with the left side of the outer surface of the support rod, penetrates through the left side of the outer surface of the support rod, extends to the right side of the outer surface of the support rod, extends to the left side of the outer surface of the fixed ring and is fixedly connected with the left side of the outer surface of the fixed ring.
The front side of the outer surface of the rotary table is provided with a rotary rod, the rear end of the rotary rod is overlapped with the front side of the outer surface of the rotary table and penetrates through the front side of the outer surface of the rotary table to the rear side of the outer surface of the rotary table and extends to the rear side of the inner wall of the device box, is overlapped with the rear side of the inner wall of the device box and penetrates through the rear side of the inner wall of the device box to the rear side of the outer surface of the device box and extends to the front side of the outer surface of the rotary handle, and is fixedly connected with the front side of the outer surface of the rotary handle, so that the rotary table is driven to rotate when the rotary handle rotates.
Preferably, the rear side of the outer surface of the supporting rod is provided with an upper sliding groove and a lower sliding groove, the front side of the outer surface of the upper sliding groove and the rear side of the outer surface of the supporting rod are overlapped, and penetrate through the rear side of the outer surface of the supporting rod to the front side of the outer surface of the supporting rod, and the inner walls of the upper sliding groove and the lower sliding groove are overlapped with the outer surface of the pressing rod.
The auxiliary disc is provided with inclined plates on the upper side of the outer surface of the auxiliary disc, the inclined plates are also arranged on one side of the outer surface of the power rod, and the inclined surfaces of the inclined plates on the two sides are overlapped, so that the auxiliary disc rotates when the power rod is pressed downwards.
The cutting silicon wafer diamond wire bus stretching process adopts a cutting silicon wafer diamond wire bus stretching device, and comprises the following steps:
firstly, placing a silicon wafer in a fixing device, and pressing a power rod to enable an auxiliary disc to drive a limiting disc to rotate, so that a fixing clamping plate is overlapped with the outer surface of the silicon wafer, and the silicon wafer is fixed;
secondly, fixedly connecting the cutting device with the upper side of the outer surface of the stretching device, and then rotating the threaded rod to move the spring plate, so that the movable rods at the left side and the right side drive the cutting rope to stretch;
step three, the turntable rotates, so that the turntable drives the movable groove plate to move, and the fixed belt drives the cutting rope to move downwards;
and fourthly, enabling the cutting rope to move downwards, and then enabling the silicon wafer to be cut through upwards stretching the pressing rod.
Compared with the prior art, the invention provides a silicon wafer cutting diamond wire bus stretching process and a silicon wafer cutting diamond wire bus stretching device, and the silicon wafer cutting diamond wire bus stretching process and the silicon wafer cutting diamond wire bus stretching device have the following beneficial effects:
1. according to the silicon wafer diamond wire bus stretching process and the silicon wafer diamond wire bus stretching device, through the threaded rod arranged in the pull rope device, when the threaded rod rotates, the movable block drives the spring plate to move, one side of the outer surface of the spring plate is overlapped with one side of the outer surface of the auxiliary block, the spring plate drives the movable rod to move, and the upper end of the movable rod is fixedly connected with the lower side of the outer surface of the cutting device, so that the cutting rope is stretched.
2. According to the silicon wafer cutting diamond wire bus stretching process and the silicon wafer cutting diamond wire bus stretching device, the rotating rod is arranged on the front side of the surface of the rotating disc in the cutting device, the rear end of the rotating rod is overlapped with the front side of the surface of the rotating disc, penetrates through the front side of the surface of the rotating disc, extends to the rear side of the inner wall of the box body of the device, penetrates through the rear side of the inner wall of the box body of the device, and extends to the rear side of the outer surface of the box body of the device, so that when the rotating rod drives the rotating disc to rotate, the cutting rope moves downwards to cut the silicon wafer.
3. According to the silicon wafer cutting diamond wire bus stretching process and the silicon wafer cutting diamond wire bus stretching device, the power rod is arranged in the fixing device, when the power rod moves downwards, the power rod drives the auxiliary disc and the limiting disc to move, when one side of the outer surface of the limiting disc is overlapped with one side of the outer surface of the fixing clamp plate, the fixing clamp plate moves, and when the other side of the outer surface of the fixing clamp plate is overlapped with one side of the outer surface of the silicon wafer, the silicon wafer is fixed in the device.
Drawings
FIG. 1 is a schematic elevational cross-sectional view of the structure of the present invention;
FIG. 2 is a schematic elevational cross-sectional view of the structural stretching apparatus of the present invention;
FIG. 3 is a schematic elevational cross-sectional view of a structural cutting device of the present invention;
FIG. 4 is a schematic side cross-sectional view of the structural fastening device of the present invention.
Wherein: 1. a stretching device; 2. a cutting device; 3. a fixing device; 101. a device board; 102. an apparatus tube; 103. a threaded rod; 104. a movable block; 105. a spring plate; 106. an auxiliary block; 107. a fixed block; 108. a movable rod; 109. an auxiliary lever; 201. a support rod; 202. a device case; 203. a spring device; 204. a movable trough plate; 205. a turntable; 206. a fixing ring; 207. cutting the rope; 301. a fixing plate; 302. a support rod; 303. pressing a pressing rod; 304. a fixture housing; 305. a power lever; 306. an auxiliary disc; 307. a limiting disc; 308. and fixing the clamping plate.
Description of the embodiments
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-4, a device for stretching a diamond wire bus of a cut silicon wafer comprises a stretching device 1;
as shown in fig. 1, a cutting device 2 is fixedly connected to the upper side of the outer surface of the stretching device 1, and a fixing device 3 is fixedly connected to the upper side of the outer surface of the stretching device 1;
as shown in fig. 2, the stretching device 1 comprises a device plate 101, a device tube 102 is fixedly connected to the lower side of the outer surface of the device plate 101, a threaded rod 103 is arranged on the left side of the outer surface of the device tube 102, a movable block 104 is arranged at the right end of the threaded rod 103, a spring plate 105 is arranged on the front side of the outer surface of the movable block 104, an auxiliary block 106 is arranged on the right side of the outer surface of the spring plate 105, a fixed block 107 is fixedly connected to the right side of the inner wall of the device tube 102, a movable rod 108 is arranged at one end of the spring plate 105, and an auxiliary rod 109 is arranged on one side of the outer surface of the movable rod 108;
as shown in fig. 3, the cutting device 2 comprises a supporting rod 201, a device box 202 is fixedly connected to the left side of the outer surface of the supporting rod 201, a spring device 203 is fixedly connected to the upper side of the inner wall of the device box 202, a movable groove plate 204 is fixedly connected to the lower end of the spring device 203, a rotary table 205 is arranged on the rear side of the outer surface of the movable groove plate 204, a fixed ring 206 is fixedly connected to the right side of the outer surface of the movable groove plate 204, and a cutting rope 207 is fixedly connected to the right side of the outer surface of the fixed ring 206;
as shown in fig. 4, the fixing device 3 includes a fixing plate 301, a supporting rod 302 is fixedly connected to the upper side of the outer surface of the fixing plate 301, a pressing rod 303 is provided at the rear side of the outer surface of the supporting rod 302, a fixing device box 304 is fixedly connected to the front end of the pressing rod 303, a power rod 305 is provided at the upper side of the outer surface of the fixing device box 304, an auxiliary disc 306 is provided at the lower end of the power rod 305, a limiting disc 307 is provided at the lower side of the outer surface of the auxiliary disc 306, and a fixing clamping plate 308 is provided at the front side of the outer surface of the fixing device box 304.
Specifically, as shown in fig. 2, a sliding groove is provided on the rear side of the inner wall of the device pipe 102, and the rear side of the outer surface is overlapped with the rear side of the inner wall of the device pipe 102 and penetrates the rear side of the inner wall of the device pipe 102 to the rear side of the outer surface of the device pipe 102, and the inner wall of the sliding groove is overlapped with a sliding rod, and the front end of the sliding rod is overlapped with the rear side of the outer surface of the auxiliary rod 109 and penetrates the rear side of the outer surface of the auxiliary rod 109 to the front side of the outer surface of the auxiliary rod 109.
Specifically, as shown in fig. 2, the outer surfaces of the device tube 102 and the movable rod 108 are provided with holes, the holes penetrate through the outer surfaces of the device tube 102 and the movable rod 108, and the inner walls of the holes overlap with the outer surfaces of the auxiliary rods 109.
Through the above technical scheme, the right side of the outer surface of the spring plate 105 is provided with the tooth blocks, the left side of the outer surface of the fixed block 107 is also provided with the tooth blocks, and the tooth blocks on the left side and the right side are matched, so that when the spring plate 105 moves, one side of the outer surface of the left tooth block is overlapped with one side of the outer surface of the right tooth block, and the spring plate 105 is fixed.
Specifically, as shown in fig. 3, a long rod is fixedly connected to the right side of the outer surface of the movable slot plate 204, and the right end of the long rod is overlapped with the left side of the outer surface of the supporting rod 201, penetrates through the left side of the outer surface of the supporting rod 201, extends to the right side of the outer surface of the supporting rod 201, extends to the left side of the outer surface of the fixed ring 206, and is fixedly connected with the left side of the outer surface of the fixed ring 206.
Through the above technical scheme, the front side of the outer surface of the turntable 205 is provided with the rotating rod, and the rear end of the rotating rod is overlapped with the front side of the outer surface of the turntable 205 and penetrates through the front side of the outer surface of the turntable 205 to the rear side of the outer surface of the turntable 205 and extends to the rear side of the inner wall of the device box 202, is overlapped with the rear side of the inner wall of the device box 202 and penetrates through the rear side of the inner wall of the device box 202 to the rear side of the outer surface of the device box 202 and extends to the front side of the outer surface of the rotating handle, and is fixedly connected with the front side of the outer surface of the rotating handle, so that when the rotating handle rotates, the rotating handle is driven to rotate.
Specifically, as shown in fig. 4, the rear side of the outer surface of the support rod 302 is provided with an upper and lower chute, and the front side of the outer surface of the upper and lower chute is overlapped with the rear side of the outer surface of the support rod 302, and penetrates the rear side of the outer surface of the support rod 302 to the front side of the outer surface of the support rod 302, and the inner wall of the upper and lower chute is overlapped with the outer surface of the pressing rod 303.
Through the above technical scheme, the upper side of the outer surface of the auxiliary disc 306 is provided with the inclined plate, and one side of the outer surface of the power rod 305 is also provided with the inclined plate, and the inclined surfaces of the inclined plates on both sides overlap, so that the auxiliary disc 306 rotates when the power rod 305 is pressed downwards.
The cutting silicon wafer diamond wire bus stretching process adopts a cutting silicon wafer diamond wire bus stretching device, and comprises the following steps:
firstly, placing a silicon wafer in a fixing device 3, and pressing a power rod 305 to enable an auxiliary disk 306 to drive a limit disk 307 to rotate, so that a fixing clamping plate 308 is overlapped with the outer surface of the silicon wafer, and the silicon wafer is fixed;
secondly, fixedly connecting the cutting device 2 with the upper side of the outer surface of the stretching device 1, and then rotating the threaded rod 103 to move the spring plate 105, so that the movable rods 108 on the left side and the right side drive the cutting rope 207 to stretch;
step three, the turntable 205 is rotated, so that the turntable 205 drives the movable groove plate 204 to move, and the fixed ring 206 drives the cutting rope 207 to move downwards;
step four, the silicon wafer is cut by moving the cutting string 207 downward and then by pulling the pressing rod 303 upward.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. Cutting silicon chip buddha's warrior attendant line generating line stretching device, including stretching device (1), its characterized in that: the upper side of the outer surface of the stretching device (1) is fixedly connected with a cutting device (2), and the upper side of the outer surface of the stretching device (1) is fixedly connected with a fixing device (3);
the stretching device (1) comprises a device plate (101), a device tube (102) is fixedly connected to the lower side of the outer surface of the device plate (101), a threaded rod (103) is arranged on the left side of the outer surface of the device tube (102), a movable block (104) is arranged at the right end of the threaded rod (103), a spring plate (105) is arranged on the front side of the outer surface of the movable block (104), an auxiliary block (106) is arranged on the right side of the outer surface of the spring plate (105), a fixed block (107) is fixedly connected to the right side of the inner wall of the device tube (102), a movable rod (108) is arranged at one end of the spring plate (105), and an auxiliary rod (109) is arranged on one side of the outer surface of the movable rod (108);
the cutting device (2) comprises a supporting rod (201), a device box body (202) is fixedly connected to the left side of the outer surface of the supporting rod (201), a spring device (203) is fixedly connected to the upper side of the inner wall of the device box body (202), a movable groove plate (204) is fixedly connected to the lower end of the spring device (203), a turntable (205) is arranged on the rear side of the outer surface of the movable groove plate (204), a fixed ring (206) is fixedly connected to the right side of the outer surface of the movable groove plate (204), and a cutting rope (207) is fixedly connected to the right side of the outer surface of the fixed ring (206);
fixing device (3) are including fixed plate (301), fixed plate (301) surface upside fixedly connected with bracing piece (302), bracing piece (302) surface rear side is provided with presses pole (303), press pole (303) front end fixedly connected with fixing device box (304), fixing device box (304) surface upside is provided with power pole (305), power pole (305) lower extreme is provided with auxiliary disc (306), auxiliary disc (306) surface downside is provided with spacing dish (307), fixing device box (304) surface front side is provided with fixed splint (308).
2. The dicing die wire busbar tensioning device of claim 1, wherein: the device is characterized in that a sliding groove is formed in the rear side of the inner wall of the device pipe (102), the rear side of the outer surface is overlapped with the rear side of the inner wall of the device pipe (102) and penetrates through the rear side of the inner wall of the device pipe (102) to the rear side of the outer surface of the device pipe (102), a sliding rod is overlapped on the inner wall of the sliding groove, and the front end of the sliding rod is overlapped with the rear side of the outer surface of the auxiliary rod (109) and penetrates through the rear side of the outer surface of the auxiliary rod (109) to the front side of the outer surface of the auxiliary rod (109).
3. The dicing die wire busbar tensioning device of claim 1, wherein: the device comprises a device pipe (102) and a movable rod (108), wherein the outer surfaces of the device pipe (102) and the movable rod (108) are provided with hole grooves, the hole grooves penetrate through the outer surfaces of the device pipe (102) and the movable rod (108), and the inner walls of the hole grooves are in lap joint with the outer surfaces of auxiliary rods (109).
4. The dicing die wire busbar tensioning device of claim 1, wherein: the right side of the outer surface of the movable groove plate (204) is fixedly connected with a long rod, the right end of the long rod is overlapped with the left side of the outer surface of the supporting rod (201), penetrates through the left side of the outer surface of the supporting rod (201), extends to the right side of the outer surface of the supporting rod (201), extends to the left side of the outer surface of the fixed ring (206), and is fixedly connected with the left side of the outer surface of the fixed ring (206).
5. The dicing die wire busbar tensioning device of claim 1, wherein: the rear side of the outer surface of the supporting rod (302) is provided with an upper sliding groove and a lower sliding groove, the front side of the outer surface of the upper sliding groove and the rear side of the outer surface of the supporting rod (302) are overlapped, and penetrate through the rear side of the outer surface of the supporting rod (302) to the front side of the outer surface of the supporting rod (302), and the inner wall of the upper sliding groove and the inner wall of the lower sliding groove are overlapped with the outer surface of the pressing rod (303).
6. The process for stretching the diamond wire bus of the cut silicon wafer is characterized in that the device for stretching the diamond wire bus of the cut silicon wafer according to claims 1-5 is adopted, and is characterized in that: the method comprises the following steps:
firstly, placing a silicon wafer in a fixing device (3), and pressing a power rod (305) to enable an auxiliary disc (306) to drive a limiting disc (307) to rotate, so that a fixing clamping plate (308) is overlapped with the outer surface of the silicon wafer, and the silicon wafer is fixed;
secondly, fixedly connecting the cutting device (2) with the upper side of the outer surface of the stretching device (1), and then rotating the threaded rod (103) to move the spring plate (105), so that the movable rods (108) on the left side and the right side drive the cutting rope (207) to stretch;
step three, the turntable (205) is rotated, so that the turntable (205) drives the movable groove plate (204) to move, and the fixed ring (206) drives the cutting rope (207) to move downwards;
and fourthly, enabling the cutting rope (207) to move downwards, and then enabling the silicon wafer to be cut by upwards stretching the pressing rod (303).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110439924.1A CN113119330B (en) | 2021-04-23 | 2021-04-23 | Process and device for stretching diamond wire bus for cutting silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110439924.1A CN113119330B (en) | 2021-04-23 | 2021-04-23 | Process and device for stretching diamond wire bus for cutting silicon wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113119330A CN113119330A (en) | 2021-07-16 |
| CN113119330B true CN113119330B (en) | 2023-07-28 |
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| CN202110439924.1A Active CN113119330B (en) | 2021-04-23 | 2021-04-23 | Process and device for stretching diamond wire bus for cutting silicon wafer |
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Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101169063B1 (en) * | 2012-02-23 | 2012-07-31 | 김석현 | The diamond wire saw for cutting apparatus of semiconductor panel |
| EP3160673B1 (en) * | 2014-06-27 | 2021-09-01 | Luca Toncelli | Wire shaping machine for cutting blocks of natural stone material |
| CN110653959A (en) * | 2018-06-28 | 2020-01-07 | 江苏晶品新能源科技有限公司 | Single crystal silicon rod cutting device of diamond wire roller |
| CN108995062B (en) * | 2018-08-13 | 2020-06-02 | 浙江贝盛新材料科技有限公司 | Adjust more convenient single crystal silicon rod cutting device |
| CN110238211A (en) * | 2019-07-17 | 2019-09-17 | 高特(江苏)新材料有限公司 | Stretching device is used in a kind of processing of diamond wire bus |
| CN110180915B (en) * | 2019-07-17 | 2023-12-08 | 高特(江苏)新材料有限公司 | Diamond wire bus stretching impurity removing device |
| CN212315176U (en) * | 2020-04-10 | 2021-01-08 | 高特(江苏)新材料有限公司 | Diamond wire bus stretching device |
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2021
- 2021-04-23 CN CN202110439924.1A patent/CN113119330B/en active Active
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