CN113118635A - Magnetic field laser polishing device and method - Google Patents
Magnetic field laser polishing device and method Download PDFInfo
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- CN113118635A CN113118635A CN202110432668.3A CN202110432668A CN113118635A CN 113118635 A CN113118635 A CN 113118635A CN 202110432668 A CN202110432668 A CN 202110432668A CN 113118635 A CN113118635 A CN 113118635A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/3568—Modifying rugosity
- B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0461—Welding tables
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- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a magnetic field laser polishing device and a magnetic field laser polishing method. The processing table assembly is arranged in the rack and used for placing a workpiece to be polished. The two magnetic field assemblies are disposed on the processing table assembly. The magnetic field assembly comprises a magnet container and a plurality of magnets, and the magnets are contained in the magnet container. The two magnetic field assemblies are arranged oppositely and at intervals, a workpiece placing area is formed between the two magnetic field assemblies, and a magnetic field is formed between the magnets of the two magnetic field assemblies; the magnet container can accommodate at least two magnets. The magnetic field laser polishing device can conveniently realize the regulation and control of the magnetic field intensity, and is simple in structure, stable in magnetic field, low in cost, convenient for magnet replacement and beneficial to obtaining stable polishing materials.
Description
Technical Field
The invention relates to the technical field of laser polishing, in particular to a magnetic field laser polishing device and method.
Background
Metal materials are widely used in the fields of daily life, military, aerospace and the like, so that the metal surface processing technology is particularly important. Laser polishing technology is currently favored by numerous scholars and research institutions as a new application of laser machining.
Laser polishing is the melting and evaporation of a thin raised layer on a rough surface of a starting metal material by a focused laser beam spot acting on the rough surface. The melted material flows under the action of surface tension and gravity of the material, fills the concave part on the surface of the metal material and solidifies to finally obtain the polishing material. The laser has potential advantages in metal surface polishing, including selectable polishing speed, less chemical pollution, detectable polishing process and non-contact processing method.
At present, a magnetic field is applied to assist in a laser polishing process to obtain a metal material with a more ideal polishing effect. However, at present, the magnetic field is generated by an electric control method, that is, by an electromagnet. Although the magnetic field intensity is convenient to regulate and control, the structure is complex, the generated magnetic field is unstable, the cost is high, and the stable polishing material is not easy to obtain.
Disclosure of Invention
The invention aims to provide a magnetic field laser polishing device and a magnetic field laser polishing method, which have the advantages of adjustable magnetic field intensity, simple structure, stable magnetic field and low cost, and are beneficial to obtaining stable polishing materials.
The invention discloses a magnetic field laser polishing device which comprises a rack, a processing table assembly and two magnetic field assemblies. The processing table assembly is arranged in the rack and used for placing a workpiece to be polished. The two magnetic field assemblies are disposed on the processing table assembly. The magnetic field assembly comprises a magnet container and a plurality of magnets, and the magnets are contained in the magnet container. The two magnetic field assemblies are arranged oppositely and at intervals, a workpiece placing area is formed between the two magnetic field assemblies, and a magnetic field is formed between the magnets of the two magnetic field assemblies; the magnet container can accommodate at least two magnets.
Optionally, the processing table assembly comprises a turntable, a first motor and a mounting seat subassembly; the mounting seat subassembly is arranged on the rack, the first motor is arranged on the mounting seat subassembly, the rotary table is connected with the first motor, and the two magnetic field assemblies are arranged on the rotary table; the first motor drives the turntable to rotate by taking a transmission shaft of the first motor as a rotation center.
Optionally, the mounting seat subassembly includes a seat body, a rotary mounting frame and a second motor; the seat body is arranged on the rack, the second motor is arranged on the seat body, one end of the rotary mounting frame is connected with the second motor, and the other end of the rotary mounting frame is rotatably connected with the seat body; the second motor is mounted on the rotary mounting frame; the second motor drives the rotary mounting frame to rotate so as to drive the rotary table to rotate by taking the straight line where the transmission shaft of the second motor is located as an axis.
Optionally, the rotary mounting frame comprises a first vertical plate, a second vertical plate and a transverse plate; one end of the first vertical plate is connected with the second motor, and the other end of the first vertical plate is connected with one end of the transverse plate; the second vertical plate is rotatably connected with the seat body, and the other end of the second vertical plate is connected with the other end of the transverse plate; the first motor is installed on the transverse plate and located between the first vertical plate and the second vertical plate.
Optionally, the seat body comprises a bottom plate and a third vertical plate; one end of the first vertical plate is rotatably connected with one end of the bottom plate, and the other end of the first vertical plate is rotatably connected with the second vertical plate; the second motor is disposed on the other end of the base plate.
Optionally, the magnetic field laser polishing device comprises a laser; the laser comprises a laser transmitter, a beam expander and a three-dimensional laser galvanometer which are sequentially arranged according to a light path.
Optionally, the magnetic field strength of the magnetic field is 1T.
The invention also discloses a magnetic field laser polishing method, which is applied to the magnetic field laser polishing device and comprises the following steps:
providing a magnetic field for the workpiece placing area, and enabling the workpiece to be polished to be in the magnetic field;
and starting laser, and carrying out laser polishing on the workpiece to be polished.
Optionally, the method further comprises the steps of:
and adjusting the number of the magnets in the magnet container according to the magnetic field intensity required by the workpiece to be polished so as to adjust the magnetic field intensity.
Optionally, the power of the laser is 180W-230W, and the area of the polishing region is equal to or larger than 100mm2The moving speed of the laser is equal to or greater than 10 mm/s.
According to the magnetic field laser polishing device, the magnet is used as a magnetic field generating source, the magnet is placed in the magnet container, at least two magnets can be placed in the magnet container, when the magnetic field intensity needs to be adjusted, the number of the magnets in the magnet container is directly increased or reduced, the adjustment of the magnetic field intensity is achieved, and the adjustment is simple and convenient. The magnetic field laser polishing device can conveniently realize the regulation and control of the magnetic field intensity, and is simple in structure, stable in magnetic field, low in cost, convenient for magnet replacement and beneficial to obtaining stable polishing materials.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
FIG. 1 is a schematic view of a magnetic field laser polishing apparatus according to an embodiment of the present invention;
FIG. 2 is another schematic view of a magnetic field laser polishing apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic view of the interior of a magnetic field laser polishing apparatus according to an embodiment of the present invention;
FIG. 4 is another schematic internal view of a magnetic field laser polishing apparatus according to an embodiment of the present invention;
fig. 5 is a partially enlarged view of a portion a in fig. 4;
FIG. 6 is a schematic view of a processing station assembly according to an embodiment of the present invention;
FIG. 7 is a schematic view of a magnetic field assembly according to an embodiment of the present invention;
FIG. 8 is a flow chart of a magnetic field laser polishing method according to an embodiment of the present invention.
Wherein, 1, a workpiece to be polished; 100. a frame; 110. a radiation-proof glass door; 200. a processing table assembly; 210. a turntable; 211. a workpiece placement area; 220. a first motor; 230. mounting a seat subassembly; 231. a base body; 231a, a bottom plate; 231b, a third riser; 232. rotating the mounting rack; 232a, a first riser; 232b, a second vertical plate; 232c, a transverse plate; 233. a second motor; 300. a magnetic field assembly; 310. a magnet container; 311. accommodating grooves; 320. a magnet; 400. a laser; 500. sealing the cabin; 510. sealing the cover plate; 600. a gas cylinder; 700. a water-cooling assembly; 800. the control end is rotated.
Detailed Description
It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present invention may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
The invention is described in detail below with reference to the figures and alternative embodiments.
As shown in fig. 1 to 5, as an embodiment of the present invention, a magnetic field laser polishing apparatus is disclosed, which includes a frame 100, a processing table assembly 200, and two magnetic field assemblies 300. The processing table assembly 200, disposed in the frame 100, is used to place the workpiece 1 to be polished. The two magnetic field assemblies 300 are disposed on the processing table assembly 200. The magnetic field assembly 300 includes a magnet container 310 and a plurality of magnets 320, the magnets 320 being received in the magnet container 310. The two magnetic field assemblies 300 are arranged oppositely and at intervals, a workpiece placing area 211 is formed between the two magnetic field assemblies 300, and a magnetic field is formed between the magnets 320 of the two magnetic field assemblies 300; the magnet container 310 may house at least two magnets 320.
At present, the electric control mode, namely the mode of generating a magnetic field through the electromagnet 320, relates to the design of a circuit structure and the like, and although the magnetic field intensity can be conveniently adjusted, the structure is complex, and the generated magnetic field is unstable under the influence of equipment such as current and the like, so that the stable polishing material is not easy to obtain. According to the magnetic field laser polishing device, the magnet 320 is used as a magnetic field generating source, the magnet 320 is arranged in the magnet container 310, at least two magnets 320 can be arranged in the magnet container 310, when the magnetic field intensity needs to be adjusted, the number of the magnets 320 in the magnet container 310 is directly increased or reduced, the adjustment of the magnetic field intensity is realized, and the adjustment is simple and convenient. The magnetic field laser polishing device can conveniently realize the regulation and control of the magnetic field intensity, has simple structure, stable magnetic field and low cost, is convenient for replacing the magnet 320 and is beneficial to obtaining stable polishing materials. The magnet 320 of the present invention may be an NdFeB magnet 320.
The workpiece 1 to be polished is placed between the two magnetic field assemblies 300 during the polishing process, and the workpiece 1 to be polished is in the magnetic field. The magnetic field laser polishing device has the following specific principles: the laser melts the convex surface of the workpiece 1 to be polished, the melted material is liquid from the microscopic level, the liquid part is called a molten pool, the melted material flows under the action of the surface tension and gravity of the material, fills the concave part of the surface of the material and solidifies to finally obtain the ideal surface of the polished material, the convection state and crystallization behavior of the liquid in the molten pool are improved through an external magnetic field, and finally the optimization of the surface appearance and the microstructure of a molten layer after the laser polishing is realized.
In laser polishing without the application of a magnetic field, the melt pool is subjected to surface tension and gravity, and if the melt pool has solidified and at these forces the molten material has not filled the material surface depressions, an uneven surface is regenerated and the polishing effect is not achieved.
Specifically, the magnetic field laser polishing apparatus further comprises a sealing chamber 500, wherein the sealing chamber 500 is covered on the processing table assembly 200 to seal the processing table assembly 200; the capsule 500 is provided with a sealing cover plate 510 which can be opened and closed. The sealed cabin 500 is communicated with an external gas storage bottle 600, and in the laser polishing process, inert gas is introduced into the sealed cabin 500 to protect the workpiece 1 to be polished, so that irregular tiny cracks on the surface of the workpiece 1 to be polished, which are caused by laser polishing in a common air environment, are prevented. The laser polishing is carried out under the protection environment of inert gas, so that the appearance of surface micro cracks can be effectively inhibited, and the surface quality of the workpiece 1 to be polished is further improved. The inert gas may be argon, nitrogen, or the like.
As shown in fig. 5, the processing station assembly 200 includes a turntable 210, a first motor 220, and a mount subassembly 230; the mounting seat subassembly 230 is arranged on the machine frame 100, the first motor 220 is arranged on the mounting seat subassembly 230, the turntable 210 is connected with the first motor 220, and the two magnetic field assemblies 300 are arranged on the turntable 210; the first motor 220 drives the turntable 210 to rotate around a transmission shaft of the first motor 220. In this scheme, carousel 210 drives through first motor 220 and rotates, can change the processing angle of laser, convenient processing. More specifically, the material of the turntable 210 is a metal that can be magnetically attracted, such as iron. At this time, the magnetic field assembly 300 may be directly attached to the turntable 210 to be fixed due to its own magnetism, and the magnetic field assembly 300 is very convenient to mount and dismount. Of course, the magnetic field assembly 300 can also be directly fixed on the turntable 210 by a connecting structure, such as a screw.
As shown in fig. 6, the mounting seat subassembly 230 includes a seat body 231, a rotation mounting frame 232 and a second motor 233; the base 231 is disposed on the rack 100, the second motor 233 is disposed on the base 231, one end of the rotary mounting frame 232 is connected to the second motor 233, and the other end is rotatably connected to the base 231; the second motor 233 is mounted on the rotation mounting frame 232; the second motor 233 drives the rotation mounting frame 232 to rotate, so as to drive the turntable 210 to rotate by taking a straight line where a transmission shaft of the second motor 233 is located as an axis. In this embodiment, the rotation of the turntable 210 is realized by the driving of the second motor 233, so as to change the processing angle of the laser, thereby facilitating the processing. In combination with the first motor 220 driving the turntable 210 to rotate, the magnetic field laser polishing device of the invention can change the laser processing angle in multiple dimensions, and the processing is more convenient.
More specifically, as shown in fig. 6, the rotational mount 232 includes a first riser 232a, a second riser 232b, and a cross plate 232 c; one end of the first vertical plate 232a is connected with the second motor 233, and the other end is connected with one end of the transverse plate 232 c; the second vertical plate 232b is rotatably connected with the seat body 231, and the other end of the second vertical plate is connected with the other end of the transverse plate 232 c; the first motor 220 is installed on the horizontal plate 232c and located between the first vertical plate 232a and the second vertical plate 232 b. As shown in fig. 6, in the present embodiment, the first vertical plate 232a, the second vertical plate 232b and the horizontal plate 232c form the "shape of the restriction", and the rotary plate 210 is disposed on the horizontal plate 232c, so that the second motor 233 can drive the rotary plate 210 to rotate, and the rotary plate 210 rotates more widely when the rotation stroke of the second motor 233 is fixed. In addition, the first motor 220 is installed between the first vertical plate 232a and the second vertical plate 232b, so that space is fully utilized and saved.
Further, the seat body 231 includes a bottom plate 231a and a third riser 231 b; one end of the first vertical plate 232a is rotatably connected with one end of the bottom plate 231a, and the other end of the first vertical plate 232a is rotatably connected with the second vertical plate 232 b; the second motor 233 is disposed on the other end of the base plate 231 a. As shown in fig. 6, in the present embodiment, the second motor 233, the bottom plate 231a and the third vertical plate 231b form a shape of "︺", and the shape of the 'resistance' formed by the first vertical plate 232a, the second vertical plate 232b and the horizontal plate 232c corresponds to the shape of the 'resistance', so as to avoid an accommodating space and a rotating space for the first motor 220, thereby facilitating the installation and rotation of the first motor 220.
On the other hand, as shown in fig. 4, the magnetic field laser polishing apparatus includes a laser 400; the laser 400 includes a laser emitter (not shown), a beam expander (not shown), and a three-dimensional laser galvanometer (not shown) sequentially arranged along an optical path. The beam expander can change the diameter and the divergence angle of the laser beam to change the laser beam into a collimated beam so as to finally obtain a fine high-power-density light spot. The three-dimensional laser galvanometer is internally provided with a plurality of groups of lenses for adjusting light paths so that laser can irradiate the surface of the workpiece 1 to be polished. The three-dimensional laser galvanometer can polish the workpiece 1 to be polished with a curved surface. Therefore, the magnetic field laser polishing device can polish the workpiece 1 to be polished with a plane surface, can polish the workpiece 1 to be polished with a curved surface, and has a good polishing effect.
Specifically, as shown in fig. 7, a receiving groove for receiving the magnet 320 may be disposed on the magnet container 310, and the specific size of the receiving groove may be specifically set according to the size of the magnet 320. The change of the magnetic field strength is realized by increasing or decreasing the number of magnets 320 in the accommodation groove 311. For example, if the magnetic field needs to be increased, the number of the magnets 320 in the housing groove 311 is increased, and if the magnetic field strength needs to be decreased, the number of the magnets 320 in the housing groove 311 is decreased.
As shown in fig. 4, the magnetic field laser polishing apparatus further includes a water cooling assembly 700 for cooling the laser 400 by water circulation to protect the laser emitter and the three-dimensional laser galvanometer. Specifically, the water cooling module 700 has four water pipes, two of which are water inlet pipes and two of which are water outlet pipes, and are respectively connected to the laser 400 to perform circulating water cooling.
For the convenience of processing, as shown in fig. 1 and 2, a radiation-proof glass door 110 is provided on the rack 100, and the radiation-proof glass door 110 prevents laser radiation. The magnetic field laser polishing device further comprises a rotation control end 800, wherein the rotation control end 800 is used for controlling the first motor 220 and the second motor 233 to rotate so as to change the processing angle of the workpiece 1 to be polished.
The magnetic field intensity of the magnetic field is 1T. The magnetic field has the function of applying Lorentz force to the workpiece 1 to be polished and balancing various acting forces in the molten pool before the liquid in the molten pool is solidified, so that a better polishing effect is achieved, and the polishing effect is better when the magnetic field intensity is 1T at present. Of course, in other embodiments, the magnetic field strength may not be 1T. The specific magnitude of the magnetic field intensity can be set according to actual processing requirements.
As shown in fig. 8, as another embodiment of the present invention, there is also disclosed a magnetic field laser polishing method applied to the magnetic field laser polishing apparatus described above, including the steps of:
s100: providing a magnetic field for the workpiece placing area, and enabling the workpiece to be polished to be in the magnetic field;
s200: and starting laser, and carrying out laser polishing on the workpiece to be polished.
In the method, a magnetic field is applied to assist polishing in the laser polishing process, the convection state and crystallization behavior of molten pool liquid are improved, the surface appearance and the microstructure of a melting layer after laser polishing are optimized finally, and a workpiece with a better polishing effect is obtained.
Specifically, before step S200, the water cooling assembly 700 is turned on, and the laser 400 is cooled by water circulation to protect the laser emitter and the three-dimensional laser galvanometer. Specifically, the water cooling assembly 700 has four water pipes, two of which are water inlet pipes and two of which are water outlet pipes.
The method further comprises the steps of: and adjusting the number of the magnets in the magnet container according to the magnetic field intensity required by the workpiece to be polished so as to adjust the magnetic field intensity. When the magnetic field intensity needs to be adjusted, the number of the magnets 320 in the magnet container 310 is directly increased or reduced, so that the adjustment of the magnetic field intensity is realized, and the adjustment is simple and convenient. The magnetic field laser polishing device can conveniently realize the regulation and control of the magnetic field intensity, has simple structure, stable magnetic field and low cost, is convenient for replacing the magnet 320 and is beneficial to obtaining stable polishing materials.
The workpiece 1 to be polished is DC53 die steel, and the melting point of the DC53 die steel is higher and is 1550 ℃. Therefore, correspondingly, the power of the laser is 180W-230W; the polished area has an area of 100mm or more2Avoiding heat accumulation; the moving speed of the laser is equal to or more than 10mm/s, and the polishing efficiency and the polishing quality are improved. Local areas can be selected for polishing, and the traditional polishing method can only polish the whole DC53 die steel surface and cannot polish a certain area.
In order to prevent oxidation of the surface of the workpiece 1 to be polished during the polishing process, an inert gas such as argon gas may be introduced into the hermetic chamber 500, and the hermetic cover plate 510 may be covered.
It should be noted that, the limitations of the steps involved in the present disclosure are not considered to limit the order of the steps without affecting the implementation of the specific embodiments, and the steps written in the foregoing may be executed first, or executed later, or even executed simultaneously, and as long as the present disclosure can be implemented, all should be considered to belong to the protection scope of the present disclosure.
The foregoing is a more detailed description of the invention in connection with specific alternative embodiments, and the practice of the invention should not be construed as limited to those descriptions. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (10)
1. A magnetic field laser polishing apparatus, comprising:
a frame;
the processing table assembly is arranged in the rack and used for placing a workpiece to be polished;
two magnetic field assemblies disposed on the processing table assembly; the magnetic field assembly comprises a magnet container and a plurality of magnets, and the magnets are contained in the magnet container;
the two magnetic field assemblies are arranged oppositely and at intervals, a workpiece placing area is formed between the two magnetic field assemblies, and a magnetic field is formed between the magnets of the two magnetic field assemblies; the magnet container can accommodate at least two magnets.
2. The magnetic field laser polishing apparatus of claim 1 wherein said processing station assembly comprises a turntable, a first motor and a mounting block subassembly; the mounting seat subassembly is arranged on the rack, the first motor is arranged on the mounting seat subassembly, the rotary table is connected with the first motor, and the two magnetic field assemblies are arranged on the rotary table; the first motor drives the turntable to rotate by taking a transmission shaft of the first motor as a rotation center.
3. The magnetic field laser polishing apparatus of claim 2 wherein said mounting block subassembly comprises a block body, a rotational mounting block, and a second motor; the seat body is arranged on the rack, the second motor is arranged on the seat body, one end of the rotary mounting frame is connected with the second motor, and the other end of the rotary mounting frame is rotatably connected with the seat body; the second motor is mounted on the rotary mounting frame; the second motor drives the rotary mounting frame to rotate so as to drive the rotary table to rotate by taking the straight line where the transmission shaft of the second motor is located as an axis.
4. The magnetic field laser polishing apparatus of claim 3, wherein the rotational mount comprises a first riser, a second riser, and a cross plate; one end of the first vertical plate is connected with the second motor, and the other end of the first vertical plate is connected with one end of the transverse plate; the second vertical plate is rotatably connected with the seat body, and the other end of the second vertical plate is connected with the other end of the transverse plate; the first motor is installed on the transverse plate and located between the first vertical plate and the second vertical plate.
5. The magnetic field laser polishing apparatus of claim 4, wherein the housing comprises a bottom plate and a third riser; one end of the first vertical plate is rotatably connected with one end of the bottom plate, and the other end of the first vertical plate is rotatably connected with the second vertical plate; the second motor is disposed on the other end of the base plate.
6. The magnetic field laser polishing apparatus according to any one of claims 1 to 5, wherein the magnetic field laser polishing apparatus comprises a laser; the laser comprises a laser transmitter, a beam expander and a three-dimensional laser galvanometer which are sequentially arranged according to a light path.
7. The magnetic field laser polishing apparatus according to any one of claims 1 to 5, wherein the magnetic field has a magnetic field strength of 1T.
8. A magnetic field laser polishing method applied to the magnetic field laser polishing apparatus according to any one of claims 1 to 7, comprising the steps of:
providing a magnetic field for the workpiece placing area, and enabling the workpiece to be polished to be in the magnetic field;
and starting laser, and carrying out laser polishing on the workpiece to be polished.
9. The method of claim 8, wherein the method further comprises the steps of:
and adjusting the number of the magnets in the magnet container according to the magnetic field intensity required by the workpiece to be polished so as to adjust the magnetic field intensity.
10. The method of claim 8 or 9, wherein the laser has a power of 180W to 230W, and an area of a polished region is 100mm or more2The moving speed of the laser is equal to or greater than 10 mm/s.
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| CN202110432668.3A CN113118635A (en) | 2021-04-21 | 2021-04-21 | Magnetic field laser polishing device and method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113732510A (en) * | 2021-08-26 | 2021-12-03 | 深圳信息职业技术学院 | Double-laser polishing system and composite laser polishing method |
| CN114147347A (en) * | 2021-11-30 | 2022-03-08 | 深圳信息职业技术学院 | Polishing device and magnetic field auxiliary polishing method |
| CN114192985A (en) * | 2021-11-30 | 2022-03-18 | 深圳信息职业技术学院 | Magnetic field assisted laser polishing device and magnetic field assisted polishing method |
| CN114505586A (en) * | 2022-02-23 | 2022-05-17 | 华中科技大学 | Device and method for assisting laser high-precision surface polishing by using magnetic field |
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