CN113117988A - Dispensing path control method for bonding surface of cup body and seat ring of toilet - Google Patents

Dispensing path control method for bonding surface of cup body and seat ring of toilet Download PDF

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CN113117988A
CN113117988A CN202110250631.9A CN202110250631A CN113117988A CN 113117988 A CN113117988 A CN 113117988A CN 202110250631 A CN202110250631 A CN 202110250631A CN 113117988 A CN113117988 A CN 113117988A
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glue
path
dispensing
dispensing path
point
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CN113117988B (en
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张剑
张云瞻
马启航
章珈豪
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Tongji University
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • B05C11/1021—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to presence or shape of target

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Abstract

The invention relates to a dispensing path control method for a bonding surface of a toilet bowl body and a seat ring, which is characterized in that a machine vision is used for detecting an outer edge line of the upper surface of the toilet bowl body to divide a characteristic section, the position and the number of glue distribution points are determined, the glue distribution point planning is completed as a preparation link, and then the optimal time is taken as a performance index, and an improved simulated annealing algorithm is used for planning a dispensing path of a spray gun. The path planning is started from data input, and the optimal dispensing path is output through path generation, path calculation, path updating, iterative control and temperature control in sequence and through adjustment. Compared with the prior art, the invention has the advantages of reducing the dosage and time of the dispensing stage before the cup body is bonded with the seat ring in the manufacturing process of the toilet seat, saving the cost, improving the efficiency and the like.

Description

Dispensing path control method for bonding surface of cup body and seat ring of toilet
Technical Field
The invention relates to the field of processing and manufacturing of a toilet, in particular to a dispensing path control method for a bonding surface of a cup body and a seat ring of the toilet.
Background
Along with the development of the manufacturing industry, the automatic process is continuously improved and perfected, and particularly in the field of production of the toilet bowl, before a seat ring and a cup body are bonded, glue is required to be applied to the upper surface of the cup body. The traditional gluing process is carried out manually, an operator fills the bonding glue into a cloth bag with a discharge spout, and applies the glue on a bonding surface by considering uniform movement and uniform extrusion. However, in the case of cups of different shapes, the glue gun can only apply glue on the surface of the cup according to a predetermined route, which results in long glue application time and large consumption of glue.
Disclosure of Invention
The invention aims to overcome the defects of long glue distribution time and large quantity of glue consumption caused by single route in the prior art, and provides a glue distribution path control method for the bonding surface of a toilet bowl body and a seat ring.
The purpose of the invention can be realized by the following technical scheme:
a dispensing path control method for a bonding surface of a cup body and a seat ring of a toilet bowl specifically comprises the following steps:
s1, acquiring the structural information of the toilet, detecting the figure on the upper surface of the toilet cup body, determining the inner edge line and the outer edge line of the gluing surface of the cup body and the position of the inner edge line and the outer edge line on a preset plane coordinate system, and dividing a plurality of characteristic segments according to the outer edge line;
s2, obtaining a bonding density parameter, and calculating to obtain plane coordinates and the number of glue distribution points on the glue spreading surface;
s3, randomly arranging the glue dispensing points to generate a first glue dispensing path, and simultaneously acquiring the initial temperature and the initial iteration times of the simulated annealing algorithm;
s4, the first dispensing path generates a second dispensing path through a combined random perturbation method, calculates the path length difference between the first dispensing path and the second dispensing path, judges whether the first dispensing path is replaced by the second dispensing path according to the path length difference, and outputs the first dispensing path;
s5, increasing the iteration number of the simulated annealing algorithm by 1, judging whether the current iteration number is greater than the maximum iteration number L, if so, turning to the step S6, otherwise, turning to the step S4;
s6, updating the temperature of the simulated annealing algorithm, and judging the current temperatureWhether or not it is greater than a preset end temperature TendIf so, outputting the current first dispensing path as a final first dispensing path, otherwise, turning to the step S4;
s7, obtaining the position information of the initial position point of the glue gun in the final first glue dispensing path, taking the corresponding glue dispensing point as the initial position of the optimized glue dispensing path, sequentially adding the glue dispensing points subsequent to the initial position point of the glue gun to the optimized glue dispensing path along the initial position, sequentially adding the glue dispensing points preceding the initial position point of the glue gun to the optimized glue dispensing path, and outputting the final optimized glue dispensing path.
In the step S1, the pattern on the upper surface of the toilet bowl body is detected by a machine vision algorithm, and the characteristic segments are divided by a characteristic detection algorithm.
The bonding density parameters include tangential bonding density parameters and normal bonding density parameters, the glue distribution points are located on a point distribution normal line in each characteristic section, the point distribution normals on the characteristic sections are uniformly distributed, the process of calculating the plane coordinates and the number of the glue distribution points on the glue spreading surface in the step S2 specifically includes the steps of taking the normal line at the intersection point of the characteristic sections and the characteristic sections as a side line, calculating the length and the average length of each characteristic section, and calculating the number of interval areas between the point distribution normals in the characteristic sections according to the tangential bonding density parameters, wherein the specific calculation formula is as follows:
Figure BDA0002965904260000021
wherein, TiIs the number of spacer regions,/iIn order to characterize the length of the segment,
Figure BDA0002965904260000022
is the average length of the feature segments, aTIs a tangential bonding density parameter;
calculating the length of the normal line of the point distribution by the inner edge line and the outer edge and the average value of the length, and determining the number of glue distribution points on the normal line of the point distribution according to the normal bonding density parameter, wherein the specific calculation formula is as follows:
Figure BDA0002965904260000023
wherein N isiThe number of adhesive dispensing points on the dispensing point normal line, biThe length of the stationed normal line taken by the point,
Figure BDA0002965904260000024
length average of point normal taken, anCalculating to obtain the total number of glue distribution points according to the number of the spacing areas of the normal distribution points and the number of the glue distribution points on the normal distribution points as normal bonding density parameters, and dividing the normal distribution point into NiThe middle point of each small section is the position of the glue distribution point.
The calculation formula of the path length difference between the first dispensing path and the second dispensing path is as follows:
df＝f(S1)-f(S2)
wherein d isfIs the path length difference, S1Is a first dispensing path, S2For the second dispensing path, f () is a path length calculation function, and the specific formula is as follows:
Figure BDA0002965904260000031
wherein j is the position of the jth glue dispensing point in the glue dispensing path, and x and y are plane coordinates of the glue dispensing point.
The specific process of determining whether to replace the first dispensing path with the second dispensing path according to the path length difference in step S4 is to determine whether the path length difference is smaller than 0, if so, update the first dispensing path to the second dispensing path, otherwise, calculate an acceptance probability and a random number of the path length difference, if the acceptance probability is greater than or equal to the random number, update the first dispensing path to the second dispensing path, and re-label the first dispensing path as a dispensing sequence according to the sequence of the second dispensing path, otherwise, the first dispensing path remains unchanged, and the calculation formula of the acceptance probability is as follows:
Figure BDA0002965904260000032
where P is the acceptance probability, dfT is the temperature of the simulated annealing algorithm, and the random number is [0, 1]]Random numbers are uniformly distributed in the interval.
Further, the calculation formula of the temperature of the simulated annealing algorithm is specifically as follows:
T＝(n+l)2
wherein n is the number of the glue dispensing points, l is the number of iterations, the initial number of iterations is 0, the initial temperature is obtained by substituting a formula, and the formula for updating the temperature of the simulated annealing algorithm in the step S6 is as follows:
T＝g(T)*T
wherein g (t) is a temperature update function of the simulated annealing algorithm, and when the temperature of the simulated annealing algorithm satisfies a first temperature threshold, the first temperature threshold is specifically as follows:
n+1＜T≤(n+l)2
the temperature update function is a first annealing value;
when the temperature of the simulated annealing algorithm satisfies the second temperature threshold, the second temperature threshold is specifically as follows:
T≤n+1
the temperature update function is a second anneal value.
The combined random perturbation method comprises a random approach perturbation method, a random far perturbation method or a random rotation perturbation method, and the second dispensing path is generated by selecting one of the random approach perturbation method, the random far perturbation method or the random rotation perturbation method according to a preset random perturbation probability.
Further, the random approach perturbation method specifically includes the process of randomly generating a first transformation quantity and a second transformation quantity which are different, where the first transformation quantity and the second transformation quantity are positive integers and satisfy the following inequality:
e＜r-3
and e is a first transformation quantity, the value range is [0, n-3], r is a second transformation quantity, the value range is [3, n ], the e-th position in the first glue dispensing path is exchanged with the glue dispensing point on the e + 1-th position, the r-th position is exchanged with the glue dispensing point on the r-1-th position, and the glue dispensing points on the rest positions are unchanged, so that a second glue dispensing path is obtained.
Further, the random away perturbation method specifically includes randomly generating a third transformation quantity and a fourth transformation quantity which are different, where the third transformation quantity and the fourth transformation quantity are positive integers and satisfy the following inequality:
f＜s
and f is a third transformation quantity, the value range is [1, n-2], s is a fourth transformation quantity, the value range is [2, n-1], the f-th position in the first glue dispensing path is exchanged with the glue dispensing point on the f-1 th position, the s-th position is exchanged with the glue dispensing point on the s +1 th position, and the glue dispensing points on the rest positions are unchanged, so that a second glue dispensing path is obtained.
Further, the random rotation perturbation method specifically includes the process of randomly generating a fifth transformation quantity and a sixth transformation quantity which are different, where the fifth transformation quantity and the sixth transformation quantity are positive integers and satisfy the following inequality:
g＜t
wherein g is a fifth transformation quantity, the value range is [1, n-2], t is a sixth transformation quantity, the value range is [2, n-1], the glue distribution points from the g th position to the t th position in the first glue dispensing path are sequentially arranged from the 0 th position to the (t-g) th position in the second glue dispensing path, the glue distribution points from the 0 th position to the (g-1) th position in the first glue dispensing path are sequentially arranged from the (t-g +1) th position to the t th position in the second glue dispensing path, the glue distribution points from the (t +1) th position to the n th position in the first glue dispensing path are sequentially arranged from the (t +1) th position to the n th position in the second glue dispensing path, and thus the second glue dispensing path is obtained.
Further, the random perturbation probability comprises a first perturbation probability group and a second perturbation probability group, when the temperature of the simulated annealing algorithm meets a first temperature threshold value, the first perturbation probability group is adopted, and when the temperature of the simulated annealing algorithm meets a second temperature threshold value, the second perturbation probability group is adopted.
Compared with the prior art, the invention has the following beneficial effects:
the invention uses machine vision to detect the outer edge line of the upper surface of the cup body of the toilet bowl to divide the characteristic section, determines the position and the number of glue distribution points, finishes the planning of the glue distribution points as a preparation link, then generates a plurality of glue distribution paths by combining a random perturbation method by taking the optimal time as a performance index, and plans the glue distribution paths of the spray gun by using an improved simulated annealing algorithm to obtain the optimized glue distribution paths, thereby reducing the dosage and the time of the glue distribution stage before the cup body is bonded with the seat ring in the manufacturing process of the toilet bowl, effectively saving the time cost, improving the production efficiency of the toilet bowl and meeting the requirements of large-scale production.
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FIG. 1 is a schematic flow diagram of the present invention;
FIG. 2 is a schematic diagram of the bonding of the bowl and seat of the toilet of the present invention;
FIG. 3 is a schematic diagram illustrating the division of feature segments on the outer edge line according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of the distribution of glue applying spots in the embodiment of the present invention.
Reference numerals:
1-a seat ring; 2-the cup body; 3-glue gun; 11-water tank port; 12-water replenishing ring; 13-seat ring feature holes; 21-characteristic holes of the cup body; 22-washing the noodles; 31-a glue-spreading nozzle; 32-vacuum air channel assembly.
Detailed Description
The invention is described in detail below with reference to the figures and specific embodiments. The present embodiment is implemented on the premise of the technical solution of the present invention, and a detailed implementation manner and a specific operation process are given, but the scope of the present invention is not limited to the following embodiments.
Examples
As shown in FIG. 2, the seat ring 1 comprises a water tank opening 11, a water replenishing ring 12 and a seat ring characteristic hole 13, the cup body 2 comprises a cup body characteristic hole 21 and a cleaning surface 22, and the glue gun 3 comprises a glue application nozzle 31 and a vacuum air channel assembly 32. Before the cup body 2 is bonded with the seat ring 1, a glue gun 3 is needed to glue the upper surface of the cup body 1, the invention aims to obtain the optimal path plan under the condition of glue dispensing, and the dosage and time of the glue dispensing stage before the cup body is bonded with the seat ring in the manufacturing process of the toilet are reduced.
As shown in fig. 1, a method for controlling a dispensing path of a bonding surface between a cup body and a seat ring of a toilet bowl specifically comprises the following steps:
s1, acquiring the structural information of the toilet, detecting the figure on the upper surface of the toilet cup body, determining the inner edge line and the outer edge line of the gluing surface of the cup body and the position of the inner edge line and the outer edge line on a preset plane coordinate system, and dividing a plurality of characteristic segments according to the outer edge line;
s2, obtaining a bonding density parameter, and calculating to obtain plane coordinates and the number of glue distribution points on a glue spreading surface;
s3, randomly arranging glue distribution points to generate a first glue distribution path, and simultaneously acquiring the initial temperature and the initial iteration times of the simulated annealing algorithm;
s4, the first dispensing path generates a second dispensing path through a combined random perturbation method, calculates the path length difference between the first dispensing path and the second dispensing path, judges whether the first dispensing path is replaced by the second dispensing path according to the path length difference, and outputs the first dispensing path;
s5, increasing the iteration number of the simulated annealing algorithm by 1, judging whether the current iteration number is greater than the maximum iteration number L, if so, turning to the step S6, otherwise, turning to the step S4;
s6, updating the temperature of the simulated annealing algorithm, and judging whether the current temperature is greater than the preset ending temperature TendIf so, outputting the current first dispensing path as a final first dispensing path, otherwise, turning to the step S4;
s7, obtaining the position information of the initial position point of the glue gun in the final first glue dispensing path, taking the corresponding glue dispensing point as the initial position of the optimized glue dispensing path, sequentially adding the glue dispensing points subsequent to the initial position point of the glue gun to the optimized glue dispensing path along the initial position, sequentially adding the glue dispensing points preceding the initial position point of the glue gun to the optimized glue dispensing path, and outputting the final optimized glue dispensing path.
In step S1, detecting the pattern on the upper surface of the toilet bowl body through a machine vision algorithm, and dividing the characteristic segments through a characteristic detection algorithm.
In this embodiment, the ending temperature Tend0.1, and a maximum number of iterations L, in particular a Markov (Metropolis) chain length, with a value of 300(n +1), where n is the number of glue sites.
The adhesive density parameters comprise tangential adhesive density parameters and normal adhesive density parameters, adhesive distribution points are located on a point distribution normal line in each characteristic section, the point distribution normal lines on the characteristic sections are uniformly distributed, the process of calculating the plane coordinates and the number of the adhesive distribution points on the adhesive surface in the step S2 specifically comprises the steps of taking the normal line at the intersection point of the characteristic sections and the characteristic sections as a side line, calculating the length and the average length of each characteristic section, and calculating the number of interval areas between the point distribution normal lines in the characteristic sections according to the tangential adhesive density parameters, wherein the specific calculation formula is as follows:
Figure BDA0002965904260000061
wherein, TiIs the number of spacer regions,/iIn order to characterize the length of the segment,
Figure BDA0002965904260000062
is the average length of the feature segments, aTIs a tangential bonding density parameter;
calculating the length of the normal line of the point distribution by the inner edge line and the outer edge and the average value of the length, and determining the number of glue distribution points on the normal line of the point distribution according to the normal bonding density parameter, wherein the specific calculation formula is as follows:
Figure BDA0002965904260000063
wherein N isiThe number of adhesive dispensing points on the dispensing point normal line, biThe length of the stationed normal line taken by the point,
Figure BDA0002965904260000064
length average of point normal taken, anFor normal bonding density parameters, based on clothThe number of the point normal line interval areas and the number of the glue distribution points on the point normal line are calculated to obtain the total number of the glue distribution points, and the single point normal line is divided into NiThe middle point of each small section is the position of the glue distribution point.
The tangential bonding density parameter and the normal bonding density parameter can be selected by comprehensively considering the service life requirement, the glue dispensing amount on each glue dispensing point and the viscosity of the used glue.
The calculation formula of the path length difference between the first dispensing path and the second dispensing path is as follows:
df＝f(S1)-f(S2)
where d is the path length difference, S1Is a first dispensing path, S2For the second dispensing path, f () is a path length calculation function, and the specific formula is as follows:
Figure BDA0002965904260000071
wherein j is the position of the jth glue dispensing point in the glue dispensing path, and x and y are plane coordinates of the glue dispensing point.
In step S4, the specific process of determining whether to replace the first dispensing path with the second dispensing path according to the path length difference is to determine whether the path length difference is smaller than 0, if so, update the first dispensing path to the second dispensing path, otherwise, calculate the acceptance probability and the random number of the path length difference, if the acceptance probability is greater than or equal to the random number, update the first dispensing path to the second dispensing path, and re-label the first dispensing path as a dispensing sequence according to the sequence of the second dispensing path, otherwise, the first dispensing path remains unchanged, and the calculation formula of the acceptance probability is as follows:
Figure BDA0002965904260000072
where P is the acceptance probability, dfFor path length difference, T is the temperature of the simulated annealing algorithm, and the random number is [0, 1]]Uniformly distributed within the intervalAnd (4) counting the machines.
The calculation formula of the temperature of the simulated annealing algorithm is specifically as follows:
T＝(n+l)2
wherein n is the number of the glue dispensing points, l is the number of iterations, the initial number of iterations is 0, the initial temperature is obtained by substituting a formula, and the formula for updating the temperature of the simulated annealing algorithm in the step S6 is as follows:
T＝g(T)*T
wherein g (t) is a temperature update function of the simulated annealing algorithm, and when the temperature of the simulated annealing algorithm satisfies a first temperature threshold, the first temperature threshold is specifically as follows:
n+1＜T≤(n+l)2
the temperature update function is a first annealing value, which is 0.96 in this embodiment;
when the temperature of the simulated annealing algorithm satisfies the second temperature threshold, the second temperature threshold is specifically as follows:
T≤n+1
the temperature update function is a second annealing value, which in this embodiment is 0.94.
The moderate adjustment of the cooling speed according to T can ensure that a sufficient solving process can be provided at high temperature to better jump out a local optimal solution to obtain a global optimal solution, and can also improve the efficiency of the algorithm after the temperature is reduced. The value range of the cooling parameter g under various use situations is [0.5, 0.99 ]]In view of the fact that the optimal dispensing path solved by the method has higher universality under the type of the fixed-seat toilet stool and the requirement on solving speed is not high, higher 0.96 and higher 0.94 are respectively selected as n +1 < T ≦ (n + l)2And the value of g (T) when T.ltoreq.n + 1.
The combined random perturbation method comprises a random approach perturbation method, a random distance perturbation method or a random rotation perturbation method, and the second dispensing path is generated by selecting one of the random approach perturbation method, the random distance perturbation method or the random rotation perturbation method according to a preset random perturbation probability.
The random approach perturbation method specifically comprises the steps of randomly generating a first transformation quantity and a second transformation quantity which are different, wherein the first transformation quantity and the second transformation quantity are positive integers and satisfy the following inequality:
e＜r-3
wherein e is a first transformation quantity and has a value range of [0, n-3]]R is a second transformation quantity with a value range of [3, n]Exchanging the glue distribution point on the e-th position and the e + 1-th position in the first glue dispensing path, exchanging the glue distribution point on the r-th position and the r-1-th position, and keeping the glue distribution points on the rest positions unchanged to obtain a second glue dispensing path; i.e. according to the current solution S1＝(q0，q1，…，qe，qe+1，…，qr-1，qr，…，qn) Generating a new solution S2＝(q0，q1，…，qe+1，qe…，qr，qr-1…，qn)。
The process of the random away perturbation method is specifically that a third transformation quantity and a fourth transformation quantity which are different are randomly generated, the third transformation quantity and the fourth transformation quantity are positive integers, and the following inequality is satisfied:
f＜s
wherein f is a third transformation quantity and has a value range of [1, n-2]]S is a fourth transformation quantity with a value range of [2, n-1]]Exchanging the f-th position with the glue dispensing point on the f-1 th position in the first glue dispensing path, exchanging the S-th position with the glue dispensing point on the S +1 th position, and keeping the glue dispensing points on the other positions unchanged to obtain a second glue dispensing path, namely according to the current solution S1＝(q0，q1，…，qf-1，qf，…，qs，qs+1，…，qn) Generating a new solution S2＝(q0，q1，…，qf，qf-1…，qs+1，qs…，qn)。
The random rotation perturbation method specifically comprises the process of randomly generating different fifth transformation quantity and sixth transformation quantity, wherein the fifth transformation quantity and the sixth transformation quantity are positive integers and satisfy the following inequality:
g＜t
wherein g is a fifth transformation quantity and has a value range of [1, n-2]]T is the sixthThe transformation quantity has a value range of [2, n-1]]Sequentially arranging the g-th to t-th adhesive dispensing points in the first adhesive dispensing path from the 0 th position to the (t-g) th position of the second adhesive dispensing path, sequentially arranging the 0-th to (g-1) -th adhesive dispensing points in the first adhesive dispensing path from the (t-g +1) th position to the t-th position of the second adhesive dispensing path, sequentially arranging the (t +1) -th to n-th adhesive dispensing points in the first adhesive dispensing path from the (t +1) th position to the n-th position of the second adhesive dispensing path, thereby obtaining a second adhesive dispensing path, namely sequentially arranging the adhesive dispensing points from the g position to the t-th position of the second adhesive dispensing path according to the current solution S1＝(q0，q1，…，qg-1，qg，…，qt，qt+1，…，qn) Generating a new solution S2＝(qg，…，qt，q0，q1，…，qg-1，qt+1，…，qn)。
The random perturbation probability comprises a first perturbation probability group and a second perturbation probability group, when the temperature of the simulated annealing algorithm meets a first temperature threshold value, the first perturbation probability group is adopted, and when the temperature of the simulated annealing algorithm meets a second temperature threshold value, the second perturbation probability group is adopted.
In this embodiment, the probability of selecting the random proximity perturbation method, the random distance perturbation method and the random rotation perturbation method is 0.3, 0.3 and 0.4 respectively; the second perturbation probability group corresponds to a probability of 0.35 for selecting a random proximity perturbation method, a probability of 0.35 for selecting a random distance perturbation method, and a probability of 0.3 for selecting a random rotation perturbation method. The change degree of the simulated annealing algorithm is increased when the temperature T is higher, so that the global optimal solution can be better obtained, and the local optimal solution is jumped out; it is also possible to speed up the algorithm's solution process after the temperature T has dropped.
In the toilet style shown in fig. 3, the outer edge line of the upper surface of the cup body is divided into 8 characteristic segments, each characteristic segment takes the normal line at the intersection point of the characteristic segment and the adjacent characteristic segment as a borderline, and the length of the normal line obtained by respectively obtaining the shape, the size characteristic and the inner edge and the outer edge is as follows:
the first section is a radius R120cm circular arc segmentSpan of 170 DEG, arc length l159.34cm, the cross-sectional width is 4 cm;
the second section and the eighth section are of length l2＝l8The section line is a 30cm straight line segment and is 4cm to 6cm wide;
the third section and the seventh section have a length of l3＝l7The section line is a 9cm straight line segment and is 6cm to 6.2cm wide;
the fourth section and the sixth section are of radius R4＝R610cm arc segment with span of 72 deg. and arc length 1212.57cm, and the transversal width is 6.2cm to 6.4 cm;
the fifth section is a circular arc section with the radius of 50cm, the span is 40 degrees, and the arc length is l334.9cm, and the sectional line width is 6.2cm to 6.25 cm.
The second section, the third section, the seventh section and the eighth section are divided based on an outer edge line normal passing through the center of the characteristic hole, so that the bonding strength is improved better.
As shown in FIG. 4, it is calculated
Figure BDA0002965904260000091
In this example, the tangential bonding density parameter aTCalculating the number of interval regions between normal lines of distribution points of each characteristic segment to be T as 31＝8，T2＝T8＝4，T3＝T7＝2，T4＝T6＝2，T5Uniformly arranging the positions of the normal lines of the distribution points, and detecting to obtain the length b of the normal lines of the distribution points, which is obtained by cutting the inner edge and the outer edgeiAnd calculating the average value
Figure BDA0002965904260000092
Normal adhesion density parameter anAnd (3) calculating to obtain the number of the glue distribution points on the normal lines of the distribution points, equally dividing the normal lines of the distribution points into small sections with corresponding number, wherein the middle points of the small sections are the positions of the glue distribution points, and finally obtaining the total number n of the glue distribution points in the embodiment as 72.
In addition, it should be noted that the specific embodiments described in the present specification may have different names, and the above descriptions in the present specification are only illustrations of the structures of the present invention. All equivalent or simple changes in the structure, characteristics and principles of the invention are included in the protection scope of the invention. Various modifications or additions may be made to the described embodiments or methods may be similarly employed by those skilled in the art without departing from the scope of the invention as defined in the appending claims.

Claims (10)

1. A dispensing path control method for a bonding surface of a cup body and a seat ring of a toilet bowl is characterized by comprising the following steps:
s1, acquiring the structural information of the toilet, detecting the figure on the upper surface of the toilet cup body, determining the inner edge line and the outer edge line of the gluing surface of the cup body and the position of the inner edge line and the outer edge line on a preset plane coordinate system, and dividing a plurality of characteristic segments according to the outer edge line;
s2, obtaining a bonding density parameter, and calculating to obtain plane coordinates and the number of glue distribution points on the glue spreading surface;
s3, randomly arranging the glue dispensing points to generate a first glue dispensing path, and simultaneously acquiring the initial temperature and the initial iteration times of the simulated annealing algorithm;
s4, the first dispensing path generates a second dispensing path through a combined random perturbation method, calculates the path length difference between the first dispensing path and the second dispensing path, judges whether the first dispensing path is replaced by the second dispensing path according to the path length difference, and outputs the first dispensing path;
s5, increasing the iteration number of the simulated annealing algorithm by 1, judging whether the current iteration number is larger than the maximum iteration number, if so, turning to the step S6, otherwise, turning to the step S4;
s6, updating the temperature of the simulated annealing algorithm, judging whether the current temperature is greater than a preset end temperature, if so, outputting the current first dispensing path as a final first dispensing path, and otherwise, turning to the step S4;
s7, obtaining the position information of the initial position point of the glue gun in the final first glue dispensing path, taking the corresponding glue dispensing point as the initial position of the optimized glue dispensing path, sequentially adding the glue dispensing points subsequent to the initial position point of the glue gun to the optimized glue dispensing path along the initial position, sequentially adding the glue dispensing points preceding the initial position point of the glue gun to the optimized glue dispensing path, and outputting the final optimized glue dispensing path.
2. The method according to claim 1, wherein the adhesive density parameters include tangential adhesive density parameters and normal adhesive density parameters, the adhesive dispensing points are located on a dispensing normal line in each characteristic segment, the step S2 of calculating the plane coordinates and the number of the adhesive dispensing points on the adhesive surface specifically includes taking the normal line at the intersection of the characteristic segment and the characteristic segment as a side line, calculating the length and the average length of each characteristic segment, and calculating the number of the spacing areas between the dispensing normal lines in the characteristic segment according to the tangential adhesive density parameters, wherein the specific calculation formula is as follows:
Figure FDA0002965904250000011
wherein, TiIs the number of spacer regions,/iIn order to characterize the length of the segment,
Figure FDA0002965904250000012
is the average length of the feature segments, aTIs a tangential bonding density parameter;
calculating the length of the normal line of the point distribution by the inner edge line and the outer edge and the average value of the length, and determining the number of glue distribution points on the normal line of the point distribution according to the normal bonding density parameter, wherein the specific calculation formula is as follows:
Figure FDA0002965904250000021
wherein N isiThe number of adhesive dispensing points on the dispensing point normal line, biIs the length of the point normal line truncatedThe degree of the magnetic field is measured,
Figure FDA0002965904250000022
length average of point normal taken, anCalculating to obtain the total number of glue distribution points according to the number of the spacing areas of the normal distribution points and the number of the glue distribution points on the normal distribution points as normal bonding density parameters, and dividing the normal distribution point into NiThe middle point of each small section is the position of the glue distribution point.
3. The method as claimed in claim 1, wherein the calculation formula of the path length difference between the first dispensing path and the second dispensing path is as follows:
df＝f(S1)-f(S2)
wherein d isfIs the path length difference, S1Is a first dispensing path, S2For the second dispensing path, f () is a path length calculation function, and the specific formula is as follows:
Figure FDA0002965904250000023
wherein j is the position of the jth glue dispensing point in the glue dispensing path, and x and y are plane coordinates of the glue dispensing point.
4. The method as claimed in claim 1, wherein the step S4 of determining whether to replace the first dispensing path with the second dispensing path according to the path length difference is to determine whether the path length difference is smaller than 0, if yes, update the first dispensing path to the second dispensing path, otherwise, calculate an acceptance probability and a random number of the path length difference, if the acceptance probability is greater than or equal to the random number, update the first dispensing path to the second dispensing path, and re-mark the first dispensing path as a dispensing sequence according to the sequence of the second dispensing path, otherwise, the first dispensing path remains unchanged, and the calculation formula of the acceptance probability is as follows:
Figure FDA0002965904250000024
where P is the acceptance probability, dfT is the temperature of the simulated annealing algorithm, and the random number is [0, 1]]Random numbers are uniformly distributed in the interval.
5. The method according to claim 4, wherein the calculation formula of the temperature of the simulated annealing algorithm is as follows:
T＝(n+l)2
wherein n is the number of the glue dispensing points, l is the number of iterations, the initial number of iterations is 0, the initial temperature is obtained by substituting a formula, and the formula for updating the temperature of the simulated annealing algorithm in the step S6 is as follows:
T＝g(T)*T
wherein g (t) is a temperature update function of the simulated annealing algorithm, and when the temperature of the simulated annealing algorithm satisfies a first temperature threshold, the first temperature threshold is specifically as follows:
n+1＜T≤(n+l)2
the temperature update function is a first annealing value;
when the temperature of the simulated annealing algorithm satisfies the second temperature threshold, the second temperature threshold is specifically as follows:
T≤n+1
the temperature update function is a second anneal value.
6. The method as claimed in claim 5, wherein the combined random perturbation method comprises a random proximity perturbation method, a random distance perturbation method or a random rotation perturbation method, and the second dispensing path is generated by selecting one of the random proximity perturbation method, the random distance perturbation method or the random rotation perturbation method according to a preset random perturbation probability.
7. The method according to claim 6, wherein the random approach perturbation method comprises a process of randomly generating a first transformation quantity and a second transformation quantity which are different from each other, wherein the first transformation quantity and the second transformation quantity are positive integers, and satisfy the following inequality:
e＜r-3
and e is a first transformation quantity, the value range is [0, n-3], r is a second transformation quantity, the value range is [3, n ], the e-th position in the first glue dispensing path is exchanged with the glue dispensing point on the e + 1-th position, the r-th position is exchanged with the glue dispensing point on the r-1-th position, and the glue dispensing points on the rest positions are unchanged, so that a second glue dispensing path is obtained.
8. The method according to claim 6, wherein the random away perturbation method is specifically configured to randomly generate different third transformation amount and fourth transformation amount, and the third transformation amount and the fourth transformation amount are positive integers, and satisfy the following inequality:
f＜s
and f is a third transformation quantity, the value range is [1, n-2], s is a fourth transformation quantity, the value range is [2, n-1], the f-th position in the first glue dispensing path is exchanged with the glue dispensing point on the f-1 th position, the s-th position is exchanged with the glue dispensing point on the s +1 th position, and the glue dispensing points on the rest positions are unchanged, so that a second glue dispensing path is obtained.
9. The method as claimed in claim 6, wherein the random rotation perturbation method is specifically configured to randomly generate different fifth transformation amount and sixth transformation amount, and the fifth transformation amount and the sixth transformation amount are positive integers, and satisfy the following inequality:
g＜t
wherein g is a fifth transformation quantity, the value range is [1, n-2], t is a sixth transformation quantity, the value range is [2, n-1], the glue distribution points from the g th position to the t th position in the first glue dispensing path are sequentially arranged from the 0 th position to the (t-g) th position in the second glue dispensing path, the glue distribution points from the 0 th position to the (g-1) th position in the first glue dispensing path are sequentially arranged from the (t-g +1) th position to the t th position in the second glue dispensing path, the glue distribution points from the (t +1) th position to the n th position in the first glue dispensing path are sequentially arranged from the (t +1) th position to the n th position in the second glue dispensing path, and thus the second glue dispensing path is obtained.
10. The method as claimed in claim 6, wherein the random perturbation probability comprises a first perturbation probability group and a second perturbation probability group, the first perturbation probability group is adopted when the temperature of the simulated annealing algorithm meets a first temperature threshold, and the second perturbation probability group is adopted when the temperature of the simulated annealing algorithm meets a second temperature threshold.
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