CN113114889A - Imaging device and electronic apparatus - Google Patents
Imaging device and electronic apparatus Download PDFInfo
- Publication number
- CN113114889A CN113114889A CN202110386486.7A CN202110386486A CN113114889A CN 113114889 A CN113114889 A CN 113114889A CN 202110386486 A CN202110386486 A CN 202110386486A CN 113114889 A CN113114889 A CN 113114889A
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- chip module
- photosensitive chip
- module
- driving part
- driving
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Studio Devices (AREA)
Abstract
The application discloses a camera device and electronic equipment, wherein the camera device comprises a shell, a lens module, a photosensitive chip module, a driving piece and a rolling piece; the photosensitive chip module is arranged in the shell, and the lens module is arranged in the shell and is spaced from the photosensitive chip module; the driving part comprises a first driving part and a second driving part which are matched with each other, the first driving part is arranged on the shell, the second driving part is arranged inside the photosensitive chip module, and the second driving part can drive the photosensitive chip module to move under the driving of the first driving part so as to change the distance from the photosensitive chip module to the lens module; one of sensitization chip module and casing is provided with the holding tank, and the rolling piece is located the holding tank to contact with another person in installed part and the casing, the rolling piece can take place to roll when sensitization chip module removes. This application can obviously reduce the drive power of driving piece, realizes camera device's miniaturized design to promote the stationarity of sensitization chip module motion.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to an image pickup device and electronic equipment.
Background
With the wider application of the camera device in electronic devices such as mobile phones, the camera device becomes a popular selling point of each mobile phone terminal. The shake generated by holding or walking during photographing and video recording makes the image fuzzy, and the imaging quality is greatly reduced.
In the related art, the camera device adopts a positioning mode for driving the lens module to move, but the lens module has large mass and needs large driving force in the movement process. Future development demand lens module number is more, needs bigger drive power and current design to camera device itself, is unfavorable for the power dissipation design of camera device itself to propose the difficulty point to lens module lift in-process stationarity is relatively poor.
In addition, the focusing driving system specific to the related art causes a large size of the whole image pickup apparatus, causes a great trouble in designing the image pickup apparatus, involves a large number of parts for the focusing system, and has a complicated corresponding assembly process, which imposes a strict requirement on the production and processing of the image pickup apparatus.
Disclosure of Invention
The application aims at providing a camera device and electronic equipment, has solved current lens module at least and has removed and to drive power requirement higher to lead to camera device to drive power requirement higher, overall structure is complicated and the technical problem of design not convenient for.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a camera device, where the camera device includes a housing, a lens module, a photosensitive chip module, and a driving element; the photosensitive chip module is arranged in the shell, and the lens module is arranged in the shell and is spaced from the photosensitive chip module; the driving piece is arranged in the shell and can drive the photosensitive chip module to move so as to change the distance between the photosensitive chip module and the lens module.
In a second aspect, an embodiment of the present application provides an electronic device, including: an imaging apparatus as in the embodiment of the first aspect of the present application.
In the embodiment of this application, lens module and sensitization chip module interval set up and have certain distance, and the driving piece can drive sensitization chip module and move towards lens module, perhaps drives sensitization chip module and keeps away from lens module, and then changes the distance between sensitization chip module and the lens module, realizes camera device's focusing. Especially, for camera device, the weight of sensitization chip module will be far less than the weight of lens module, and this makes this application embodiment required driving force very little when drive sensitization chip module motion, especially compares in the design of drive lens module among the correlation technique, can obviously reduce the driving force of driving piece, simplifies the structure simultaneously. Therefore, under the condition that the driving piece provides the driving force with the same magnitude, the embodiment of the application can drive the photosensitive chip module with larger weight; under the condition that the driving piece provides the drive power of the same size, this application embodiment can drive the farther distance of the sensitization chip module of same weight, and then promoted camera device's focusing scope.
In addition, the sensitization chip module sets up in the inside of casing to and there is certain distance between the lens module, this makes this application embodiment directly utilize casing inner space drive sensitization chip module to remove. That is, this application embodiment is direct with casing inner space as sensitization chip module removal space, and whole camera device's structure size can not change at the use like this, has effectively reduced camera device's space size, can realize camera device's miniaturized design, and the daily adaptation of being convenient for is particularly applicable to the frivolous design of electronic equipment such as cell-phone.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is an exploded view of an imaging device according to one embodiment of the present application;
FIG. 2 is a cross-sectional view of an imaging device according to one embodiment of the present application;
FIG. 3 is a cross-sectional view of an imaging device according to one embodiment of the present application;
FIG. 4 is a cross-sectional view of an imaging device according to one embodiment of the present application.
Reference numerals in fig. 1 to 4:
102 shell, 104 lens module, 106 photosensitive chip module, 108 driving part, 110 first driving part, 112 second driving part, 114 mounting part, 116 photosensitive chip, 118 mounting groove, 120 detection part, 122 rolling part, 124 flexible circuit board, 126 optical filtering part, 128 mounting cavity, 130 supporting part and 132 cover body.
Detailed Description
Reference will now be made in detail to the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description and claims of this application, the term "plurality" means two or more unless otherwise specified. Further, "and/or" in the specification and claims means at least one of the connected objects.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be taken as limiting the present application.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
An image pickup apparatus and an electronic device according to an embodiment of the present application are described below with reference to fig. 1 to 4. The arrows in fig. 4 indicate the moving direction of the photo sensor chip module 106.
As shown in fig. 1 and 4, a first embodiment of the present application provides an image capturing apparatus, which includes a housing 102, a lens module 104, a photo-sensing chip module 106, a driving member 108, and a rolling member 122. The photo sensor chip module 106 is disposed in the housing 102, and the lens module 104 is mounted in the housing 102 and spaced apart from the photo sensor chip module 106; the driving member 108 includes a first driving portion 110 and a second driving portion 112, the first driving portion 110 is disposed on the housing 102, the second driving portion 112 is disposed on the photo sensor chip module 106, and the first driving portion 110 and the second driving portion 112 cooperate to drive the photo sensor chip module 106 to move, so as to change a distance between the photo sensor chip module 106 and the lens module 104; one of the photo sensor chip module 106 and the housing 102 is provided with a receiving groove, and the rolling member 122 is disposed inside the receiving groove and contacts with the other one of the photo sensor chip module 106 and the housing 102 to roll in the process of lifting the photo sensor chip module 106.
As shown in fig. 2, fig. 3 and fig. 4, in the camera device according to the embodiment of the present disclosure, the lens module 104 and the photo sensor module 106 are disposed at an interval and have a certain distance, and the driving component 108 can drive the photo sensor module 106 to move toward the lens module 104, or drive the photo sensor module 106 to move away from the lens module 104, so as to change the distance between the photo sensor module 106 and the lens module 104, thereby achieving the focusing of the camera device.
Particularly, for the image capturing apparatus, the weight of the photo sensor module 106 is much lower than that of the lens module 104, which makes the driving force required for driving the photo sensor module 106 to move in the embodiment of the present application small, and particularly compared with the design scheme of driving the lens module in the related art, the driving force of the driving member 108 can be significantly reduced, and the structure is simplified. Thus, as shown in fig. 4, in the case that the driving members 108 provide the same driving force, the embodiment of the present application can drive the photosensitive chip module 106 with a larger weight; under the condition that the driving member 108 provides the driving force with the same magnitude, the embodiment of the application can drive the photosensitive chip module 106 with the same weight for a longer distance, thereby improving the focusing range of the camera device.
In addition, as shown in fig. 1 and 4, the photo chip module 106 is disposed inside the housing 102 and has a certain distance from the lens module 104, which enables the embodiment of the present application to directly use the internal space of the housing 102 to drive the photo chip module 106 to move. That is, the embodiment of the present application directly uses the inner space of the housing 102 as the moving space of the photo sensor chip module 106, so that the structural size of the whole camera device does not change during the use, the spatial size of the camera device is effectively reduced, the miniaturized design of the camera device can be realized, the daily adaptation is facilitated, and the camera device is particularly suitable for the light and thin design of electronic devices such as mobile phones.
Also, as shown in fig. 2, 3 and 4, the rolling member 122 is disposed inside the receiving groove and can roll inside the receiving groove. Like this, in the camera device use, rolling member 122 is in between installed part 114 and the casing 102, and can roll at the in-process that sensitization chip module 106 reciprocated, there is the friction in the inside of avoiding installed part 114 and casing 102 on the one hand, on the other hand plays good direction limiting displacement, avoid sensitization chip module 106 to take place to rock at the removal in-process, it is accurate to guarantee the position between sensitization chip module 106 and the lens module 104, the stationarity of sensitization chip module 106 in-process has been promoted to a very big extent.
In one embodiment, as shown in FIG. 1, the rolling members 122 may be ball bearings. It should be noted that the rolling member 122 is not shown in the figures for clarity in fig. 1 to 4, but the accommodating groove is not shown in the figures, but it can be understood by those skilled in the art.
As a possible embodiment, one of the first driving part 110 and the second driving part 112 is a coil, and the other is a magnet cooperating with the coil. Thus, under the condition that the coil is electrified, according to the fleming's left-hand rule (the law of the relationship among the directions of the applied ampere force, the direction of the magnetic induction intensity and the current of the electrified conductor bar when the electrified lead is judged to be in the magnetic field), the magnet generates upward or downward torque to drive the photosensitive chip module 106 to move, so that the distance between the photosensitive chip module 106 and the lens module 104 is changed, and the focusing function of the camera device is realized.
In a specific embodiment, as shown in fig. 1, the second driving portion 112 is a coil and is disposed on the photo sensor chip module 106, and the first driving portion 110 is a magnet and is disposed on the housing 102.
As one possible implementation, as shown in fig. 2, 3 and 4, the photo sensor chip module 106 includes a photo sensor chip 116 and a mounting member 114. The mounting member 114 is disposed inside the housing 102, the second driving portion 112 is disposed on the mounting member 114, and the first driving portion 110 is disposed on the inner side wall of the housing 102, so that the first driving portion 110 is opposite to the second driving portion 112, and it is ensured that the coil can drive the magnet to drive the mounting member 114 to move under the obtained condition. In addition, set up photosensitive chip 116 on installation part 114 to make photosensitive chip 116 can move under the drive of installation part 114, and then change the distance between photosensitive chip 116 and lens module 104, realize the automatic focusing of making a video recording.
In addition, as shown in fig. 2, 3 and 4, the rolling element 122 is located between the outer sidewall of the mounting element 114 and the inner sidewall of the housing 102, so as to ensure that a good rolling effect can be formed between the outer sidewall of the mounting element 114 and the inner sidewall of the housing 102 in the process that the mounting element 114 drives the photosensitive chip 116 to move up and down, and thus, friction between the outer sidewall of the mounting element 114 and the inner side of the housing 102 is avoided.
As a possible embodiment, the receiving groove may be provided at an outer sidewall of the mounting member 114. Such that the mounting member 114 can be used to mount both the photosensitive chip 116 and the mounting member 114.
As a possible embodiment, the accommodating groove may be disposed on an inner sidewall of the housing 102. Thus, the processing difficulty and the processing requirement for the photosensitive chip module 106, particularly the mounting member 114, can be reduced.
As one possible embodiment, as shown in fig. 1 and 4, the mounting member 114 is provided with a mounting groove 118, and the photosensitive chip 116 is disposed in the mounting groove 118. Thus, the photosensitive chip 116 is accommodated in the mounting groove 118, so that the space area occupied by the photosensitive chip module 106 can be effectively reduced, and the miniaturization design of the photosensitive chip module 106 and the camera device is facilitated. In addition, the second driving portion 112 is located at a side of the photo sensor chip 116 and disposed on the mounting member 114, so as to reasonably plan the positions of the photo sensor chip 116 and the second driving portion 112, and simultaneously ensure that the positions of the second driving portion 112 and the first driving portion 110 are closer to ensure the driving force of the driving member 108 to the photo sensor chip module 106.
As a possible embodiment, as shown in fig. 2, the second driving part 112 is disposed in the mounting groove 118 and disposed at a side wall of the mounting groove 118. Thus, the mounting groove 118 can be used for accommodating the photo sensor chip 116 and the second driving portion 112, thereby avoiding the increase of the volume of the photo sensor chip module 106 caused by the second driving portion 112.
In a specific embodiment, as shown in fig. 2, after the production of the photo sensor chip module 106 is completed, the second driving portion 112 is attached to a side surface of the mounting member 114 in a manner of a patch (may be attached to an inner side of the mounting groove 118, or may be directly attached to an outer side of the mounting member 114).
As a possible embodiment, as shown in fig. 3, the second driving portion 112 is directly embedded in the mounting member 114 and is located at a side of the photosensitive chip 116. Thus, the second driving portion 112 can be directly received in the mounting member 114, thereby avoiding the increase of the volume of the photo sensor module 106 caused by the second driving portion 112.
In one embodiment, as shown in FIG. 3, after the photo sensor chip module 106 is manufactured, the second driving portion 112 is embedded in the mounting member 114.
As a possible embodiment, as shown in fig. 2, 3 and 4, the image pickup apparatus further includes a detection member 120. The detection member 120 is disposed on the photosensitive chip module 106, and can be used to detect the displacement of the photosensitive chip module 106 and feed back the moving position of the photosensitive chip module 106 in real time, so as to accurately adjust the distance between the photosensitive chip module 106 and the lens module 104, thereby achieving the accurate focusing of the camera device.
In an embodiment, the detecting element 120 may adopt a position hall sensor to feed back the moving position of the photo sensor module 106 in real time.
In an embodiment, the detecting member 120 may be directly mounted on the second driving portion 112.
As a possible implementation, as shown in FIG. 1, the photo sensor module 106 further includes a flexible circuit board 124, and the flexible circuit board 124 is disposed on the mounting member 114 and cooperates with the photo sensor 116.
In an embodiment, the photo sensor module 106 is a hard-soft integrated circuit board.
As a possible implementation manner, as shown in fig. 1, the image capturing apparatus further includes a filter 126, and the filter 126 is disposed on the mounting member 114 and covers the photo chip 116 and is located between the photo chip 116 and the lens module 104. In the use process of the image capturing device, the light filter 126 can filter red light and prevent infrared light from entering the light sensing chip 116, thereby preventing color cast of the image.
As one possible embodiment, as shown in fig. 1, the housing 102 includes a mounting cavity 128, a support 130, and a cover 132. Wherein, the photosensitive chip module 106 is disposed inside the mounting cavity 128 and can move inside the mounting cavity 128; the supporting member 130 is disposed in the mounting cavity 128, and the lens module 104 is supported on the supporting member 130, so as to ensure the position stability of the lens module 104. In addition, the cover 132 covers the mounting cavity 128, and the cover 132 is provided with an opening, and the lens module 104 is disposed through the opening of the cover 132 and at least partially located in the mounting groove 118. Thus, the overall size of the imaging device can be reduced.
An embodiment of a second aspect of the present application provides an electronic device including the image capturing apparatus set forth in the embodiment of the first aspect of the present application. Therefore, all the advantages of the above-mentioned image pickup apparatus are obtained, and are not discussed herein.
In a specific embodiment, the electronic device may be a mobile phone, a camera, a motion camera, an unmanned aerial vehicle, or the like.
With the wider application of the camera device in electronic devices such as mobile phones, the camera device becomes a popular selling point of each mobile phone terminal. The shake generated by holding or walking during photographing and video recording makes the image fuzzy, and the imaging quality is greatly reduced. In the 5G era, video creation and sharing will come with a new round of outbreak, and people's requirements for equipment for shooting videos are becoming higher and higher. This requires that the image pickup apparatus have good anti-shake performance, compensate for image shift caused by shake, and provide stability and definition of a screen. The embodiment of the application provides a new focusing design scheme, which can effectively reduce the size of the camera device and improve the alignment performance of the camera device.
As shown in fig. 1, an object of the embodiment of the present application is to provide a new driving scheme, in which the driving element 108 and the detecting element 120 are transferred to the photo sensor module 106, and the auto-focusing of the image capturing apparatus is realized by driving the photo sensor module 106, so that the process is simple, the space occupation of the image capturing apparatus is reduced to a great extent, and the whole stacking of the image capturing apparatus is facilitated.
As shown in fig. 1 and 4, in the embodiment of the present invention, a closed-loop coil (not limited to the illustrated arrangement mode) is attached to the side surface of the mounting groove 118 of the mounting member 114, and a position detecting member 120 is disposed in the coil, so that the moving position of the photo sensor chip module 106 can be accurately fed back. A magnet (not limited to the illustrated placement) is placed on the side surface of the photo sensor chip module 106. Under the condition that the coil is electrified, according to the fleming's left-hand rule (the law of the relation among the directions of the ampere force applied to the coil, the direction of the magnetic induction intensity and the current of the electrified conductor bar when the electrified lead is judged to be in a magnetic field), the magnet generates upward or downward torque to drive the photosensitive chip module 106 to move, and the automatic focusing function of the camera device is realized by changing the distance between the photosensitive chip module 106 and the lens module 104.
It should be noted that, in the related art, the lens module 104 is driven to move, and the embodiment of the present application drives the photo sensor module 106 to move, so that the driving force required for driving the photo sensor module 106 to move is smaller, and the required structure is simpler. The camera device provided by the embodiment of the application occupies small space, is beneficial to the stacking design of the whole structure, and can realize a miniaturized anti-shake camera system; the structure and the working procedure of the camera device are simple, a motor is not needed, the processing working procedures are reduced (the motor is saved), the overall reliability is better, and the cost is lower; the performance of the camera device is improved, the mode of driving the lens module is replaced, the mode of driving the photosensitive chip module 106 is adopted, and the photosensitive chip module 106 with a larger size can be pushed under the same thrust condition.
In a specific embodiment, after the production of the photo sensor chip module 106 is completed, the second driving portion 112 is attached to the side surface of the mounting member 114 in a manner of a patch (may be attached to the inner side of the mounting groove 118, or may be directly attached to the outer side of the mounting member 114).
In a specific embodiment, as shown in fig. 3, after the production of the photo sensor chip module 106 is completed, the second driving portion 112 is embedded in the mounting member 114.
Other configurations of …, such as … and …, and the like and operation according to embodiments of the present application are known to those of ordinary skill in the art and will not be described in detail herein.
In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. An image pickup apparatus is characterized in that,
the camera device comprises a shell, a lens module, a photosensitive chip module, a driving piece and a rolling piece;
the photosensitive chip module is arranged in the shell, and the lens module is arranged in the shell and is spaced from the photosensitive chip module;
the driving part comprises a first driving part and a second driving part which are matched with each other, the first driving part is arranged on the shell, the second driving part is arranged in the photosensitive chip module, and the second driving part can drive the photosensitive chip module to move under the driving of the first driving part so as to change the distance from the photosensitive chip module to the lens module;
one of sensitization chip module with in the casing is provided with the holding tank, the rolling piece is located in the holding tank, and with the installed part with another one in the casing contacts, the rolling piece can be in when sensitization chip module removes takes place to roll.
2. The image pickup apparatus according to claim 1, wherein said photo-sensing chip module comprises:
a mounting member disposed within the housing, the rolling member being located between an outer sidewall of the mounting member and an inner sidewall of the housing;
the sensitization chip set up in on the installed part, the second drive division set up in the installed part.
3. The image pickup apparatus according to claim 2,
the accommodating groove is formed on the outer side wall of the mounting piece; or
The accommodating groove is formed in the inner side wall of the shell.
4. The image pickup apparatus according to claim 2,
the mounting piece is provided with a mounting groove, and the second driving part is positioned in the mounting groove; or
The second driving part is embedded in the mounting part.
5. The image pickup apparatus according to any one of claims 1 to 4,
the first driving part is arranged on the inner side wall of the shell and located on the outer side wall of the photosensitive chip module.
6. The image pickup apparatus according to any one of claims 1 to 4,
one of the first drive part and the second drive part is a coil, and the other is a magnet.
7. The image pickup apparatus according to any one of claims 1 to 4, further comprising:
the detection piece is arranged on the photosensitive chip module and can be used for detecting the distance from the photosensitive chip module to the lens module.
8. The image pickup apparatus according to any one of claims 2 to 4, further comprising:
a flexible circuit board disposed at the mounting member;
and the light filtering piece is arranged on the mounting piece and is positioned between the lens module and the photosensitive chip.
9. The image pickup apparatus according to any one of claims 2 to 4, wherein the housing includes:
the photosensitive chip module is arranged in the mounting cavity;
the supporting piece is arranged in the mounting cavity, and the lens module is supported on the supporting piece;
the cover body is arranged in the mounting cavity in a covering mode, an opening is formed in the cover body, and the lens module is arranged in the cover body in a penetrating mode and at least located in the mounting cavity.
10. An electronic device, comprising:
the image pickup apparatus according to any one of claims 1 to 9.
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CN202110386486.7A CN113114889B (en) | 2021-04-12 | 2021-04-12 | Imaging device and electronic apparatus |
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CN202110386486.7A CN113114889B (en) | 2021-04-12 | 2021-04-12 | Imaging device and electronic apparatus |
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