CN113113371A - Power electronic assembly with base plate, sleeve and contact pin - Google Patents

Power electronic assembly with base plate, sleeve and contact pin Download PDF

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Publication number
CN113113371A
CN113113371A CN202110022133.9A CN202110022133A CN113113371A CN 113113371 A CN113113371 A CN 113113371A CN 202110022133 A CN202110022133 A CN 202110022133A CN 113113371 A CN113113371 A CN 113113371A
Authority
CN
China
Prior art keywords
section
sleeve
power electronic
contact pin
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110022133.9A
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Chinese (zh)
Inventor
安德烈亚斯·毛尔
罗伯特·贝卢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron Electronics Co ltd
Semikron Elektronik GmbH and Co KG
Original Assignee
Semikron Electronics Co ltd
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Filing date
Publication date
Application filed by Semikron Electronics Co ltd filed Critical Semikron Electronics Co ltd
Publication of CN113113371A publication Critical patent/CN113113371A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/63—Connectors not provided for in any of the groups H01L24/10 - H01L24/50 and subgroups; Manufacturing methods related thereto
    • H01L24/65—Structure, shape, material or disposition of the connectors prior to the connecting process
    • H01L24/66—Structure, shape, material or disposition of the connectors prior to the connecting process of an individual connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/89—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using at least one connector not provided for in any of the groups H01L24/81 - H01L24/86
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/63—Connectors not provided for in any of the groups H01L2224/10 - H01L2224/50 and subgroups; Manufacturing methods related thereto
    • H01L2224/65—Structure, shape, material or disposition of the connectors prior to the connecting process
    • H01L2224/66—Structure, shape, material or disposition of the connectors prior to the connecting process of an individual connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/89—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using at least one connector not provided for in any of the groups H01L2224/81 - H01L2224/86
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10257—Hollow pieces of metal, e.g. used in connection between component and PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10333—Individual female type metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

The invention relates to a power electronic component having a base plate, a bushing and a contact pin, wherein the bushing is arranged on a conductor track of the base plate and a foot section of the bushing is connected to the conductor track in an interlocking and electrically conductive manner, wherein the contact pin is arranged with an insertion section in an inner recess of the bushing, and wherein an interlocking and electrically conductive welded connection formed by means of a laser weld is formed between the pin connection section of the insertion section of the contact pin and an associated bushing connection section of the bushing.

Description

Power electronic assembly with base plate, sleeve and contact pin
Technical Field
The invention relates to a power electronic component having a substrate, a bushing and a contact pin, wherein the bushing is arranged on a conductor track of the substrate, and a foot section of the bushing is connected to the conductor track in a form-fitting (formschlussig) and electrically conductive manner, and wherein the contact pin is arranged in an inner recess of the bushing with an insertion section.
Background
DE 102008005547 a1 discloses as prior art an electrically conductive contact element, i.e. a bushing, which extends in a longitudinal direction and has a first end and a second end opposite the first end. The contact element has a first flange at its first end, which is designed such that, when the contact element is placed in a forward manner on a plane extending perpendicular to the longitudinal direction z, the first flange and the plane have a number (N1 ≧ 2) of first contact surfaces spaced apart from one another. Furthermore, a power semiconductor module is disclosed, which has such a contact element and a contact pin arranged in the contact element.
Disclosure of Invention
Based on the knowledge of the prior art, the object of the invention is to improve the connection between the bushing and the contact pin arranged in the bushing, and to propose a corresponding assembly and a method for the production thereof.
According to the invention, this object is achieved by a power electronic component having a base plate, a bushing and a contact pin, wherein the bushing is arranged on a conductor track of the base plate and a foot section of the bushing is connected to the conductor track in an interlocking and electrically conductive manner, wherein the contact pin is arranged with an insertion section in an inner recess of the bushing, and wherein an interlocking and electrically conductive welded connection formed by means of laser welding is formed between the pin connection section of the insertion section of the contact pin and an associated bushing connection section of the bushing.
Advantageously, the substrate is selected from the group consisting of:
a power electronics substrate, in particular having a ceramic insulating material body and conductor tracks arranged on the ceramic insulating material body;
power electronic connection means, in particular based on thin films;
circuit boards.
In this case, it is also advantageous if the adhesive connection between the conductor tracks of the substrate and the leg sections of the bushing is selected from the group consisting of:
sintered joints, in particular pressure sintered joints;
a brazed connection;
a paste connection;
a welded connection, in particular a laser welded connection.
It may also be advantageous for the contact pin to have a rounded, polygonal, in particular rectangular, in particular square cross section, in particular in the region of the insertion section.
Furthermore, the contact pin may have a compensation section for length compensation, which may be designed in particular as an s-shaped or meandering course of the compensation section.
It is particularly advantageous if the sleeve has a conical opening in its foot section, its end section or both sections.
It may also be advantageous if the sleeve has a linear expansion section in the central section between the foot section and the end section, the linear expansion section preferably being arranged between the sleeve connection section and the foot section, and the linear expansion section may be formed in particular by a slit or by a material weakening, by a thinning. The slot can be designed in particular as a longitudinal or transverse slot, or also as an s-shaped or meandering slot.
It may also be preferred that the base plate has a recess which is aligned with the inner recess of the sleeve and in particular has the same or a larger diameter. In this case, it may also be preferred that the contact pin has a first intermediate section, which is arranged in the recess of the base plate.
Preferably, the inner recess of the sleeve has an inner contour which is rounded, preferably circular. Alternatively, the inner recess can also be of polygonal, in particular rectangular, in particular square design. In this case, in particular in the case of a rounded inner contour, it is not necessary for the insertion section to have the same cross section. It is particularly advantageous if the interior of the sleeve is of round design, while the cross section of the end section is of square design.
According to the invention, this object is achieved by a method for producing a component as described above, having the following steps:
a) connecting the foot section of the sleeve to the associated conductor track of the substrate in a material-locking manner;
b) arranging the insertion section of the contact pin in the sleeve;
c) between the sleeve connection section of the sleeve and the pin connection section of the contact pin, a welded connection is formed by applying a laser beam to the sleeve connection section.
In this case, it is particularly preferred that in method step b) the third section of the contact pin is arranged in the recess of the substrate.
It is clear that in an assembly according to the invention, features mentioned in the singular, in particular the sleeve and the contact pin, can occur several times, unless explicitly or per se excluded or contradicted by the inventive concept. Likewise, individual, in particular all, method steps can occur a plurality of times in the method according to the invention or in the course thereof.
It is to be understood that the different embodiments of the invention, whether or not they are disclosed within the context of a component or method, can be implemented individually or in any combination for the purpose of achieving an improvement. In particular, the features mentioned and explained at present and below can be used not only in the combination indicated, but also in other combinations or alone without departing from the scope of the invention.
Drawings
Further elaborations, advantageous details and features of the invention result from the following description of the exemplary embodiment of the invention, which is illustrated schematically in fig. 1 to 6, or of respective parts thereof.
FIG. 1 shows a three-dimensional view of a cannula;
FIG. 2 shows a three-dimensional view of a substrate with a sleeve disposed thereon;
fig. 3 shows a first embodiment of a power electronic component according to the invention in a side view;
fig. 4 shows a second embodiment of the power electronics module according to the invention in a side view;
fig. 5 shows a third embodiment of the power electronics module according to the invention in a side view;
FIG. 6 shows a modification of the third design;
fig. 7 shows a modification of the bushing according to fig. 1.
Detailed Description
Fig. 1 shows a three-dimensional view of a bushing 4, which is essentially conventional in the art, having a foot section 40, an end section 44 and a central section 42 arranged therebetween. Both the foot section 40 and the end section 44 are designed as perforated disks with concentric, rounded recesses 400, 440, the two recesses 400, 440 being aligned with one another and having the same diameter. The central section 42 is configured as a cylindrical shell, the inner region 420 of which is aligned with the recesses 400, 440 of the foot section 40 and the end section 44. The central section 42 has an inner diameter which is the same as the inner diameter of the two recesses 400, 440 of the foot section 40 and the end section 44. The voids 400, 440 and the interior region 420 of the midsection 42 together comprise the interior void 48.
Alternatively, but not illustrated, the foot section 40 or the end section 44 may also have no recess, so that the sleeve is cup-shaped and the interior of the cup then forms the inner recess.
The tapering of the outer openings of the respective recesses 400, 440 is not shown, but is either mandatory for manufacturing reasons or is clearly and clearly embodied.
The sleeve 4 is made of a metallic material, here copper. Typically, the sleeve 4 has a length in the range 3mm to 10mm, while the internal voids have a diameter in the order of 1 mm.
Fig. 2 shows a three-dimensional view of a base plate 2 on which a sleeve 4 according to fig. 1 is arranged. The substrate 2 shown here is a power electronics substrate with a ceramic insulating material body 20 and conductor tracks 22, 24 arranged thereon. On two of the conductor tracks 24, a bushing is arranged, respectively. Only the power semiconductor component 3 is arranged exemplarily on the further conductor track 22. It is obvious that the bushing 4 and the power semiconductor component 3 can also be arranged on the same conductor track. Otherwise, the substrate 2 is constructed as part of a power electronic assembly 1 as is common in the art.
Fig. 3 shows a first embodiment of a power electronic component 1 according to the invention in a side view. The substrate 2 corresponds to the substrate described in fig. 2 and has, on the conductor track 22, a power semiconductor component 3 which is electrically conductively connected to the conductor track 22 and, purely by way of example, is also electrically conductively connected to a further conductor track by means of a wire crimp.
The foot section 40 of the bushing 4 is arranged in a material-locking manner on the further conductor track 24 by means of the soldered connection 7 and is electrically conductively connected thereto. The sleeve 4 has a round-configured inner recess 48 which is provided for receiving the insertion section 520 of the contact pin 5 during the manufacturing method. The insertion section 520 of the contact pin 5 has a square cross section, the diagonal of which is identical to the diameter of the inner recess 420 within the scope of production possibilities and can therefore be arranged in the sleeve without great effort.
For a safe and continuous electrically conductive connection between the bushing 4 and the contact pin 5, the bushing connection section 46 is loaded with the laser beam 6 after the insertion section 520 of the contact pin 5 has been arranged. By means of this loading in the context of the laser welding method 6, the sleeve connection section 46 is connected in a material-locking manner to the pin connection section 56 (which is a section of the insertion section 520). The laser-welded connection thus formed also secures the contact pin 5 against being pulled out of the sleeve 4.
The contact pin 5 has a second intermediate section 510 in addition to the insertion section 520 and, coupled thereto, a press-in pin section 500.
Fig. 4 shows a second embodiment of the power electronics module 1 according to the invention in a side view. The contact pin 5 shown here has three important sections. Coupled to the insertion section 520 are a compensation section 530 and a connection section 540. The connection section 540 is directly connected by means of the laser welding connection 6 in a material-locking and electrically conductive manner to the conductor track 22 of the power electronic substrate 2, which is similar to the power electronic substrate according to fig. 2 or 3.
Further shown is a circuit board 8 as is common in the art having a plurality of conductor traces 84. A bushing 4 is arranged on one of the conductor tracks 84 and on the side facing away from the power electronics board 2, wherein the foot section 40 of the bushing is electrically conductively connected to this conductor track 84 by means of a soldered connection.
In order to arrange the insertion section 520 of the contact pin 5 in the bushing 4, more precisely in its inner recess 48, the circuit board 8 has a recess 88 for passing through the insertion section 520. The void 88 is arranged in alignment with the interior void 48 and has a larger diameter than the interior void.
After the assembly 1 is produced, an intermediate section 580, which is formed between the insertion section 520 and the compensation section 530, is arranged in this recess 88.
In this embodiment, the insertion section 520 projects slightly from the sleeve 4 at the end section 44. In the context of a laser welding connection, this end section 44 is subjected to a laser beam 6 and thus forms a sleeve connection section 46 which is electrically conductively connected to the pin connection section 56 of the end section 520 of the contact pin 5.
The compensation section 530 is arranged between the power electronics substrate 2 and the circuit board 8 and is therefore able to compensate for changes in the distance between the two, both within the scope of the production method and also within the scope of the subsequent operation.
Fig. 5 shows a third embodiment of the power electronics module 1 according to the invention in a side view. The contact pins 5 are formed in the form of a rod without a compensation section and each have an insertion section 520 at both ends for each arrangement in the bushing 4.
Furthermore, two base plates 8, 9 are shown, each having a sleeve 4. The lower substrate is a film-based connection device 9, which is conventional in the art and is formed by two conductive films 94, 96 and an electrically insulating film 90 arranged between them, at least one of the conductive films forming a respective conductor track 94. The bushing 4 is again arranged on the one conductor track 94 of the connecting device 9 by means of a soldered connection without loss of generality.
A first insertion section 520 of the contact pin 5 is arranged in the sleeve 4 and is electrically conductively connected to it by means of a laser welding connection 60.
The laser welding connection 60 thus connects the sleeve connection section 46 (which is here part of the centering section 42 of the sleeve 4) with the pin connection section 56 of the insertion section 520 of the contact pin 5.
The upper second base plate 8, the sleeve 4 and the insertion section of the contact pin 5 arranged there, here the second insertion section 520, are of the same design as already described with reference to fig. 4.
Fig. 6 shows a modification of the third design in segments. The sleeve 4 is closed at its end section 44 and thus forms a cup. This has the advantage that, if a plurality of contact pins are present, the circuit board can be placed on the contact pins in the manufacturing process and the respective solder connections 60 can then be formed.
Fig. 7 shows a modification of the bushing according to fig. 1. The casing 4 has a line expansion section 422 in the region of the intermediate section 42. The linear expansion section is arranged between the foot section 40 of the casing and its casing connection section 46. The force introduced into the bushing by the contact pin by means of the laser welding connection between the bushing connection section 46 and the pin connection section is therefore decoupled to a certain extent from the connection of the foot section 40 and the base plate.
In this embodiment, the linear expansion section 422 is formed by a plurality of s-shaped slits introduced by laser cutting.

Claims (12)

1. Power electronic component (1) having a substrate (2, 8, 9), a bushing (4) and a contact pin (5), wherein,
the sleeve (4) is arranged on a conductor track (24, 84, 94) of the base plate (2, 8, 9), and a foot section (40) of the sleeve (4) is connected to the conductor track (24, 84, 94) in an interlocking and electrically conductive manner, wherein the contact pin (5) is arranged with an insertion section (520) in an inner recess (48) of the sleeve (4), and wherein an interlocking and electrically conductive welded connection (60) formed by means of a laser welding (6) is formed between a pin connection section (56) of the insertion section (520) of the contact pin (5) and an associated sleeve connection section (46) of the sleeve (4).
2. The power electronic component of claim 1,
the substrate (2, 8, 9) is selected from the group consisting of:
a power electronic substrate (2) having, in particular, a ceramic insulating material body (20) and conductor tracks (22, 24) arranged thereon;
a power electronic connection device (9), in particular a power electronic connection device (9) based on a film;
a circuit board (8).
3. The power electronic component of claim 1 or 2,
the adhesive connection between the conductor tracks (24, 84, 94) of the substrate (2, 8, 9) and the foot sections (40) of the bushing (4) is selected from the group consisting of:
sintered joints, in particular pressure sintered joints;
a soldered connection (7);
sticking and connecting;
welded connections, in particular laser welded connections.
4. The power electronic component of claim 1 or 2,
the contact pin (5) has a rounded, polygonal, in particular rectangular, in particular square cross section, in particular in the region of the insertion section (520).
5. The power electronic component of claim 1 or 2,
the contact pin (5) has a compensation section (530) for length compensation.
6. The power electronic component of claim 1 or 2,
the sleeve (4) has a conical opening in its foot section (40), in its end section (44) or in both sections.
7. The power electronic component of claim 1 or 2,
the sleeve (4) has a linear expansion section (422), which is preferably arranged between the sleeve connection section (46) and the foot section (40).
8. The power electronic component of claim 1 or 2,
the base plate (8) has a recess (88) which is aligned with the inner recess (48) of the sleeve (4) and in particular has the same or a larger diameter.
9. The power electronic component of claim 8,
the contact pin (5) has a first intermediate section (580) which is arranged in the recess (88) of the base plate (8).
10. The power electronic component of claim 1 or 2,
the inner recess (48) of the sleeve (4) has an inner contour which is round, polygonal, in particular rectangular, in particular square.
11. Method for manufacturing a power electronic assembly (1) according to one of claims 1 to 10, having the following steps:
a) connecting the foot section (40) of the bushing (4) to an associated conductor track (24, 84, 94) of the substrate (2, 8, 9) in a cohesive manner;
b) arranging an insertion section (520) of a contact pin (5) in the sleeve (4);
c) a welded connection (60) is formed between the sleeve connection section (46) of the sleeve (4) and the pin connection section (56) of the contact pin (5) by applying a laser beam (6) to the sleeve connection section (46).
12. The method of claim 11, wherein,
in a method step b), a third section (580) of the contact pin (5) is arranged in the recess (88) of the substrate (8).
CN202110022133.9A 2020-01-09 2021-01-08 Power electronic assembly with base plate, sleeve and contact pin Pending CN113113371A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102020100364.1A DE102020100364B4 (en) 2020-01-09 2020-01-09 Power electronic assembly with a substrate, a sleeve and a contact pin and method for producing such an assembly
DE102020100364.1 2020-01-09

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Publication number Priority date Publication date Assignee Title
DE102006042774A1 (en) 2006-09-12 2008-03-27 Qimonda Ag Method for producing an electrical contacting
DE102008005547B4 (en) 2008-01-23 2013-08-29 Infineon Technologies Ag Power semiconductor module and circuit arrangement with a power semiconductor module
US8563364B2 (en) 2011-09-29 2013-10-22 Infineon Technologies Ag Method for producing a power semiconductor arrangement

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