CN113105706B - Flexible copper-clad plate processing equipment based on perfluoro vinyl ether copolymer - Google Patents
Flexible copper-clad plate processing equipment based on perfluoro vinyl ether copolymer Download PDFInfo
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- CN113105706B CN113105706B CN202110392928.9A CN202110392928A CN113105706B CN 113105706 B CN113105706 B CN 113105706B CN 202110392928 A CN202110392928 A CN 202110392928A CN 113105706 B CN113105706 B CN 113105706B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/681—Component parts, details or accessories; Auxiliary operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08J2327/18—Homopolymers or copolymers of tetrafluoroethylene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2329/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Derivatives of such polymer
- C08J2329/10—Homopolymers or copolymers of unsaturated ethers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
Abstract
The invention relates to the field of copper-clad plate materials, in particular to a processing device of a flexible copper-clad plate based on a perfluoro vinyl ether copolymer. The specific technical scheme is as follows: a flexible copper clad plate material based on a perfluoro olefin ether copolymer comprises a substrate film layer, wherein the substrate film layer is composed of a perfluoro olefin ether copolymer or a composite material of the perfluoro olefin ether copolymer; the processing equipment of the flexible copper clad laminate material based on the perfluoro olefin ether copolymer comprises a pressurizing mechanism and a turnover mechanism; the pressurizing mechanism has pressurizing and heating functions; the turnover mechanism can turn over the pressurizing mechanism integrally.
Description
Technical Field
The invention relates to the field of copper-clad plate materials, in particular to a flexible copper-clad plate material based on a perfluoro vinyl ether copolymer and processing equipment thereof.
Background
With the continuous development and progress of science and technology, due to the miniaturization, light weight and thinness of electronic products, the printed circuit board is forced to have various high-quality and high-technical characteristics, so that the manufacturing technology of the printed circuit board directly relates to various high and new technologies in the present day, and the copper clad plate, which is the main and most important material, must have various high-quality and high-technical characteristics along with the manufacturing technology.
The traditional FR-4 copper-clad plate is a thermosetting hard plate material prepared by compounding and curing epoxy resin/glass fiber, the dielectric constant (4.5-4.8) and the dielectric loss (0.018-0.025) of the material are large, the dielectric property is also influenced by temperature change, and the material is difficult to be applied to 5G communication. In order to meet the higher performance requirements of 5G communication, copper-clad plate materials are being transformed from conventional circuit base materials (epoxy resin) to high-speed circuit base materials (modified epoxy resin) and finally to high-frequency high-speed circuit base materials (ultralow dielectric, ultralow loss, heat resistance and easy processing). In addition, the copper-clad plate also needs to meet the development trend of integration, light weight and flexibility of electronic products, and on the basis of low dielectric constant and low dielectric loss, the material also needs to have the characteristics of heat resistance, flexibility, easy processing, capability of being bonded with copper foil and the like. In recent years, there has been literature on the preparation of high performance copper clad laminate materials by modifying epoxy resin (Study on epoxy matrix modified with poly (2, 6-dimethyl-1, 4-phenylene ether) for application to a copper clad laminate, compound. Sci. Technol. 2002, 62, 783-789) or using liquid crystal polymers (Lee, h. J., manufacturing method of liquid crystal polymer and flexible copper clad laminate having liquid crystal polymer film, united States patent US20190240957A1 (2019)). However, the prior invention still has the problems of high dielectric constant, large dielectric loss, low heat-resistant temperature and the like. The invention uses thermoplastic fluorine-containing polymer with excellent dielectric property as a matrix, prepares the flexible copper-clad plate by compounding with nano silicon dioxide, and prepares the high-performance copper-clad plate material by using designed processing equipment.
Disclosure of Invention
The invention aims to provide a flexible copper clad plate material based on a perfluoro olefin ether copolymer and processing equipment thereof, so as to solve the problems.
In order to achieve the purpose of the invention, the technical scheme adopted by the invention is as follows: the flexible copper clad plate material based on the perfluoro alkene ether copolymer comprises a substrate film layer, wherein the substrate film layer is composed of the perfluoro alkene ether copolymer or a nano composite material of the perfluoro alkene ether copolymer.
Preferably, the molecular structural formula of the perfluoro vinyl ether copolymer is as follows:
(ii) a Wherein x and y are greater than 0.
Preferably, the nano composite material prepared by compounding the perfluoro alkenyl ether copolymer and the nano silicon dioxide is used as a substrate film layer.
Preferably, the copper-clad laminate further comprises two copper foils and an insulating layer; the insulating layer is formed by laminating a substrate film layer and glass fiber cloth; the substrate film layer and the glass fiber cloth are crossed and superposed in a mode of 'film + cloth + film', and the outer side of the insulating layer is provided with a perfluoro-vinyl ether fluororesin film; two copper foils are respectively attached to two sides of the insulating layer.
Preferably, the thickness of the insulating layer is 0.2-1mm.
Preferably, the perfluoroalkene ether copolymer nanocomposites are prepared by melt processing.
The processing equipment of the flexible copper clad laminate material based on the perfluoro olefin ether copolymer comprises a pressurizing mechanism and a turnover mechanism; the pressurizing mechanism has pressurizing and heating functions; the turnover mechanism can turn over the pressurizing mechanism integrally.
Preferably, the pressurizing mechanism comprises a pressure bearing plate and a pressurizing plate, and heating mechanisms are arranged in the pressure bearing plate and the pressurizing plate; the pressure plate is positioned above the bearing plate, one side of the pressure plate is hinged with the bearing plate, and a power device is arranged at the hinged position to control the hinged position to rotate.
Preferably, the turnover mechanism comprises two fixing columns and a rotating machine, the two fixing columns are respectively arranged on two sides of the bearing plate, the rotating machine is arranged on one fixing column, a rotating shaft of the rotating machine is fixedly connected with one side of the bearing plate, and a transmission shaft is arranged on the other fixing column and is rotatably sleeved with one side of the bearing plate.
Preferably, the processing equipment is also provided with a clamp for clamping and fixing the perfluoro-vinyl ether fluororesin film, the glass fiber cloth and the copper foil in a matching way, and the bearing plate is fixedly provided with a fixed limiting frame matched with the clamp; the clamp is of a square frame structure and is provided with four clamps which can extend into the frame, and the clamps are symmetrically arranged at four corners in the square frame; the fixed limiting frame is of a square frame structure, and a clamping plate for fixing the material to be processed is arranged on the inner side of the frame; the clamping device is characterized in that a bulge is arranged below the clamping, and a clamping groove corresponding to the fixing limiting frame is arranged above the fixing limiting frame.
The beneficial technical effects of the invention are as follows: the perfluoro vinyl ether copolymer serving as a substrate film layer has excellent chemical stability, corrosion resistance, sealing property, electrical insulation property and ageing resistance, the copper-clad plate prepared from the perfluoro vinyl ether copolymer has low dielectric loss and low dielectric constant, has extremely low refractive index, and is lower in signal transmission delay and more excellent in comprehensive performance; meanwhile, the processing steps for preparing the copper-clad plate by the perfluoro alkenyl ether are less, and the finished product has strong bending resistance and higher heat resistance.
Therefore, compared with the prior art, the flexible copper clad plate material and the preparation method thereof have the advantages of low dielectric constant, low dielectric loss, high temperature resistance, few processing steps and high processing efficiency.
Drawings
FIG. 1 is an overall structural view of an embodiment of the present invention;
FIG. 2 is a structural diagram of the clamp of the embodiment of the invention;
FIG. 3 is a structural diagram of a fixing and limiting frame according to an embodiment of the present invention;
FIG. 4 is a structural view of a pressing mechanism according to an embodiment of the present invention;
fig. 5 is a structural diagram of a retractable claw in accordance with an embodiment of the present invention.
In the figure: the processing equipment comprises a processing device 1, a clamping 11, a pressurizing mechanism 2, a bearing plate 21, a pressurizing plate 22, a fixed limiting frame 23, a clamping plate 231, a clamping plate 232, a clamping groove 233, a clamping piece 25, a turnover mechanism 3, a fixed column 31, a rotating machine 32, a telescopic claw 41, a mechanical claw 411, a steering piece 412, a conveying belt 42, a horizontal rod 43, a first telescopic rod 431, a second telescopic rod 432, a roller 44, a preparation table 5 and a preparation table 6.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Unless otherwise specified, the technical means used in the examples are conventional means well known to those skilled in the art.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience of describing the invention, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the invention.
Referring to fig. 1-3, the present embodiment includes a substrate layer composed of a perfluoroalkylene ether copolymer or a nanocomposite of perfluoroalkylene ether copolymers. The molecular structural formula of the perfluoro alkene ether copolymer is as follows:
Preferably, the value range of x and y in the molecular structural formula of the perfluoro vinyl ether copolymer is 50-90; wherein x: the value of y can be adjusted at will, when the value of x is smaller, the comprehensive performance of the perfluoro-vinyl ether copolymer is closer to that of polytetrafluoroethylene, and meanwhile, the refractive index of the perfluoro-vinyl ether copolymer is increased, and the glass transition temperature of the perfluoro-vinyl ether copolymer is reduced; the molecular structural formula of the perfluoro alkenyl ether copolymer in this example is X: and y =72, the glass transition temperature is 175 ℃, the material is transparent and non-crystalline, and the dielectric loss, the dielectric constant and the refractive index are low, so that the copper clad laminate is particularly suitable for being used as a copper clad laminate base material film layer.
The perfluoroalkene ether copolymer nanocomposites are prepared by melt processing. The nanometer composite material prepared by compounding the perfluoro alkene ether copolymer and the nanometer silicon dioxide is used as a substrate film layer; the perfluoro alkenyl ether copolymer and the nano silicon dioxide nano composite material are obtained by twin-screw extrusion, banburying or injection molding, the melting processing temperature is 220-260 ℃, and the perfluoro alkenyl ether copolymer/silicon dioxide nano composite material is obtained by the steps of extrusion, granulation, drying and the like. Although the perfluoro alkenyl ether copolymer can be dissolved and melt-processed, the perfluoro alkenyl ether copolymer has low friction coefficient and is difficult to adhere any substance, and the nano composite material prepared by compounding the perfluoro alkenyl ether copolymer with the nano silicon dioxide enhances the adhesion of the perfluoro alkenyl ether copolymer with the copper foil, improves the heat-resistant temperature of the copper clad plate material, reduces the processing difficulty of the copper clad plate and increases the yield. The obtained nano composite material and glass fiber cloth are overlapped together to obtain an insulating layer, the insulating layer is overlapped in a mode of 'film + cloth + film' in a crossed mode, the outer side of the insulating layer is made of perfluoro-vinyl ether fluororesin film, and the thickness of the insulating layer is 0.2-1mm. Preferably, the insulating layer is formed by overlapping 7 layers of composite materials and 6 layers of glass fiber cloth in a crossed mode, and the thickness of the insulating layer is 0.5mm.
The processing equipment of the flexible copper clad plate material based on the perfluoro olefin ether copolymer is characterized in that: the processing equipment 1 comprises a pressurizing mechanism 2 and a turnover mechanism 3; the pressurizing mechanism 2 has pressurizing and heating functions; the turnover mechanism 3 can turn over the whole pressurizing mechanism 2.
The heating temperature of the pressurizing mechanism 2 is 160-200 deg.C, preferably 180 deg.C, and the pressurizing pressure is 40-120kgf/cm 2 Preferably 60kgf/cm 2 . The programmable logic controller is electrically connected with the pressurizing mechanism 2 and the turnover mechanism 3 to control the pressurizing mechanism 2 to heat and pressurize, and the turnover mechanism 3 turns over the pressurizing mechanism 2; the heating and pressurizing time of the pressurizing mechanism 2 is 1.5-3 hours, preferably 2.5 hours, and a finished product of the perfluoro-vinyl ether copolymer copper-clad plate is obtained.
Because the perfluoro vinyl ether copolymer can be melt-processed and dissolved, the perfluoro vinyl ether copolymer can be used as a substrate film layer to be directly filled in the glass fiber cloth while being pressurized and processed with the glass fiber cloth, the processing equipment omits the step of using fluororesin emulsion to pretreat the glass fiber cloth, greatly reduces the energy consumption and improves the production efficiency. Heating and pressing the copper-clad plate to turn over; the upset is carried out 2 times, overturns when going on to 1/3, 2/3 respectively for total heating is long, and the upset is avoided leading to filling inhomogeneous condition to glass fiber cloth because of the influence of gravity and is taken place, makes the copper-clad plate overall quality that the preparation formed higher.
The pressurizing mechanism 2 comprises a pressure bearing plate 21 and a pressurizing plate 22, and heating mechanisms are arranged in the pressure bearing plate 21 and the pressurizing plate 22 for heating the pressure bearing plate and the pressurizing plate; the pressure plate 22 is located above the pressure bearing plate 21, one side of the pressure plate is hinged with the pressure bearing plate 21, and a power device is arranged at the hinged position to control the hinged position to rotate. The turnover mechanism 3 comprises two fixing columns 31 and a transfer machine 32, the two fixing columns 31 are respectively arranged on two sides of the bearing plate 21, one fixing column 31 is provided with the transfer machine 32, a rotating shaft of the transfer machine 32 is fixedly connected with one side of the bearing plate 21, and the other fixing column 31 is provided with a transmission shaft which is rotatably sleeved with one side of the bearing plate 21.
The processing equipment 1 is also provided with a clamp 11 for clamping and fixing the perfluoro-olefine ether fluororesin film, the glass fiber cloth and the copper foil in a matching way, and a fixed limiting frame 23 matched with the clamp 11 is fixedly arranged on the bearing plate 21; the clamp 11 is a square frame structure and is provided with four clamps 12 capable of extending into the frame, and the clamps 12 are symmetrically arranged at four corners in the square frame; the fixed limiting frame 23 is a square frame structure, and a clamping piece 232 for fixing the material to be processed is arranged on the inner side of the frame; a bulge is arranged below the clamp 11, and a clamping groove 233 corresponding to the bulge is arranged above the fixed limiting frame 23. The fixing limiting frame 23 is also provided with a clamping plate 231 below the clamping plate 232, and the clamping plate 232 can move up and down to clamp and fix the substitute processing material under the matching of the clamping plate 231; the clip 232 is connected with the fixed limiting frame 23 through a telescopic structure and can be completely retracted into the frame.
The processing equipment 1 is provided with a conveying belt 42, and a telescopic claw 41 is arranged on the conveying belt 42; the telescopic claw 41 is provided with two mechanical claws 411 which can horizontally grab the clamp 11. The two mechanical claws 411 of the telescopic claw 41 are connected through a horizontal rod 43, the lower end face of the horizontal rod 43 is provided with a sliding groove, a first telescopic rod 431 and a second telescopic rod 432, one end of the first telescopic rod 431 is connected with the sliding groove in a sliding mode, the first telescopic rod 431 is perpendicular to the horizontal rod 43, and the other ends of the first telescopic rod 431 and the second telescopic rod 432 are provided with horizontal rollers 44. The joints of the first telescopic rod 431 and the second telescopic rod 432 with the horizontal rod 43 are provided with driving devices which can move on the sliding chute; the gripper 411 is provided at its upper end with a turning member 412 for rotating the gripper 411. The rollers 44 arranged on the first telescopic rod 431 and the second telescopic rod 432 can flatten the material to be processed under the cooperation of the clamp 11, and the quality of the finished product is effectively improved.
Grooves are formed in the other hinged sides of the pressure bearing plate 21 and the pressure plate 22, and a clamping piece 25 is further arranged on the pressure bearing plate 21; the clamping piece 25 is provided with protrusions corresponding to the distribution of the grooves when the pressure plate 22 covers the pressure bearing plate 21, and the clamping piece 25 is connected with the pressure bearing plate 21 through a sliding groove; the pressurizing mechanism 2 is also provided with a material receiving manipulator for taking out the copper-clad plate.
When an operator manufactures a copper-clad plate, the perfluorinated alkene ether fluororesin membrane, the glass fiber cloth and the copper foil are clamped by using a clamp 11 and are sequentially placed on a preparation table 5, and after the programmable logic controller is well set with processing parameters, the processing equipment 1 is started to start processing. In the processing, after the retractable claw 41 grabs the clamp 11 placed on the preparation table 5, the clamp is transported to the pressurizing mechanism 2 through the conveyor belt 42, and the clamp is overlapped in a mode of 'film + cloth + film'; the protrusion of the clamp 11 is engaged with the engaging groove 233, the manipulator 411 releases the clamp 11, and the steering member 412 rotates the manipulator 411 to prevent the manipulator from blocking the movement of the first telescopic rod 431 and the second telescopic rod 432.
Then the first telescopic rod 431 and the second telescopic rod 432 slide to the right end of the horizontal rod 43, the two clamps 12 on the right side of the clamp 11 are loosened, and the roller 44 descends to be tightly pressed with the bearing plate 21 to replace the processing material; the clamping piece 232 at the right side of the fixed limiting clamp 23 retracts into the frame, and then the clamping piece 232 rises away from the clamping plate 231 and then extends out of the frame to clamp the material to be processed again; then the first telescopic rod 431 and the second telescopic rod 432 move towards the left side of the horizontal rod 42 together, the two clamps 12 on the left side of the clamp 11 are loosened, the clamping piece 232 on the left side of the fixed limiting clamp 23 retracts into the frame, and then the clamping piece 232 rises away from the clamping plate 231 and extends out of the frame to clamp the material to be processed again; finally, the second telescopic rod 432 moves to the right side of the horizontal rod 42, and the clamping piece 232 on the right side of the fixed limiting clamp 23 clamps the material to be processed again. After the material to be processed is leveled and fixed, the first telescopic rod 431 and the second telescopic rod 432 are reset and contracted to the middle section of the horizontal rod 42, and the telescopic claw 41 places the clamp 11 for unloading the processing material on the preparation table 6.
Then the power device drives the pressure plate 22 to rotate to cover the pressure bearing plate 21, and the clamping piece 25 clamps and fixes the pressure bearing plate 21 and the pressure bearing plate 22; the pressing plate 22 presses the material to be processed, and the pressure receiving plate 21 and the pressing plate 22 heat the material to be processed at the same time. In the processing process, the rotating machine 32 drives the rotating shaft 33 to turn over the pressurizing mechanism 2 according to the parameters set by an operator in the programmable logic controller; after the processing is finished, the manufactured copper-clad plate is taken out by the material receiving manipulator. The performance of the obtained copper-clad plate is as follows:
| sample (I) | Dielectric constant | Dielectric loss | Heat resistance temperature | Peel strength |
| Perfluoroolefin ether copolymer | 2.3 | 0.005 | 175 | 1.5N/mm |
| Perfluoroolefin copolymer/nanosilica (80/20) | 2.5 | 0.006 | 180 | 1.8N/mm |
| Copper-clad plate | 2.9 | 0.008 | 240 | 2.3N/mm |
Claims (7)
1. The processing equipment of the flexible copper clad plate material based on the perfluoro olefin ether copolymer is characterized in that: the processing equipment (1) comprises a pressurizing mechanism (2) and a turnover mechanism (3); the pressurizing mechanism (2) has pressurizing and heating functions; the turnover mechanism (3) can turn over the pressurizing mechanism (2) integrally;
the processing equipment (1) is also provided with a clamp (11) which is used for clamping and fixing the perfluoro-vinyl ether fluororesin membrane, the glass fiber cloth and the copper foil in a matching way, and a fixed limiting frame (23) which is matched with the clamp (11) is fixedly arranged on the bearing plate (21); the clamping device is characterized in that the clamping device (11) is of a square frame structure and is provided with four clamps (12) capable of extending into the frame, and the clamps (12) are symmetrically arranged at four corners in the square frame; the fixed limiting frame (23) is of a square frame structure, and a clamping piece (232) for fixing the material to be processed is arranged on the inner side of the frame; a bulge is arranged below the clamp (11), and a clamping groove (233) corresponding to the fixed limiting frame is arranged above the fixed limiting frame (23);
the flexible copper-clad plate material comprises a base material film layer, wherein the base material film layer is composed of a perfluoro alkene ether copolymer or a composite material of the perfluoro alkene ether copolymer.
2. The processing equipment of the flexible copper clad plate material based on the perfluoro olefin ether copolymer as claimed in claim 1, wherein: the pressurizing mechanism (2) comprises a pressure bearing plate (21) and a pressurizing plate (22), and heating mechanisms are arranged in the pressure bearing plate (21) and the pressurizing plate (22); the pressure plate (22) is positioned above the bearing plate (21), one side of the pressure plate is hinged with the bearing plate (21), and a power device is arranged at the hinged position to control the hinged position to rotate.
3. The processing equipment of the flexible copper clad plate material based on the perfluoro olefin ether copolymer as claimed in claim 2, wherein: the turnover mechanism (3) comprises two fixing columns (31) and a rotating machine (32), the two fixing columns (31) are respectively arranged on two sides of the bearing plate (21), one fixing column (31) is provided with the rotating machine (32), a rotating shaft (33) of the rotating machine (32) is fixedly connected with one side of the bearing plate (21), and the other fixing column (31) is provided with a transmission shaft which is rotatably sleeved with one side of the bearing plate (21).
4. The processing equipment of the flexible copper clad plate material based on the perfluoro olefin ether copolymer as claimed in claim 1, wherein: the molecular structural formula of the perfluoro vinyl ether copolymer is as follows:
5. The processing equipment of the flexible copper clad plate material based on the perfluoro olefin ether copolymer as claimed in claim 1, wherein: the nanometer composite material prepared by compounding the perfluoro alkene ether copolymer and the nanometer silicon dioxide is used as a substrate film layer.
6. The processing equipment of the flexible copper clad plate material based on the perfluoro olefin ether copolymer as claimed in claim 5, wherein: the copper foil structure also comprises two copper foils and an insulating layer; the insulating layer is formed by laminating a substrate film layer and glass fiber cloth; the substrate film layer and the glass fiber cloth are crossed and superposed in a mode of 'film + cloth + film', and the outer side of the insulating layer is provided with a perfluoro-vinyl ether fluororesin film; two copper foils are respectively attached to two sides of the insulating layer.
7. The processing equipment of the flexible copper clad plate material based on the perfluoro olefin ether copolymer as claimed in claim 6, wherein: the thickness of the insulating layer is 0.2-1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110392928.9A CN113105706B (en) | 2021-04-13 | 2021-04-13 | Flexible copper-clad plate processing equipment based on perfluoro vinyl ether copolymer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110392928.9A CN113105706B (en) | 2021-04-13 | 2021-04-13 | Flexible copper-clad plate processing equipment based on perfluoro vinyl ether copolymer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113105706A CN113105706A (en) | 2021-07-13 |
| CN113105706B true CN113105706B (en) | 2023-03-21 |
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| CN208247687U (en) * | 2018-05-15 | 2018-12-18 | 深圳市鑫荣进绝缘材料有限公司 | A kind of fixed device of copper-clad plate processing |
| CN108790327B (en) * | 2018-05-21 | 2020-12-04 | 江苏泰氟隆科技有限公司 | High-performance copper-clad plate with polytetrafluoroethylene filled film and composite glass cloth and manufacturing process thereof |
| CN110435255A (en) * | 2019-07-24 | 2019-11-12 | 浙江华正新材料股份有限公司 | Insulating layer, metal-based copper-clad plate |
| CN110733211B (en) * | 2019-10-30 | 2020-09-29 | 深圳市弘海电子材料技术有限公司 | High-frequency low-loss glue-free flexible copper-clad plate and manufacturing method thereof |
| CN110948995B (en) * | 2019-12-12 | 2022-07-15 | 惠州市联创丽声电子有限公司 | Copper foil steel plate's compression fittings |
| US20220272838A1 (en) * | 2020-05-18 | 2022-08-25 | Sumitomo Electric Industries, Ltd. | Method for manufacturing dielectric sheet, method for manufacturing substrate for high-frequency printed wiring board, dielectric sheet, and substrate for high-frequency printed wiring board |
| CN112218431A (en) * | 2020-09-25 | 2021-01-12 | 朱雷 | Circuit substrate copper film pressing equipment and process thereof |
| CN112375173B (en) * | 2020-11-23 | 2022-08-19 | 杭州师范大学 | Low-refractive-index transparent material and preparation method and application thereof |
| CN112625166A (en) * | 2020-11-23 | 2021-04-09 | 杭州师范大学 | Low-dielectric-loss heat-resistant material and preparation method and application thereof |
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