CN113105184A - Light sandwich wallboard and preparation method thereof - Google Patents
Light sandwich wallboard and preparation method thereof Download PDFInfo
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- CN113105184A CN113105184A CN202110386118.2A CN202110386118A CN113105184A CN 113105184 A CN113105184 A CN 113105184A CN 202110386118 A CN202110386118 A CN 202110386118A CN 113105184 A CN113105184 A CN 113105184A
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 29
- 239000000843 powder Substances 0.000 claims description 27
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 22
- 239000006004 Quartz sand Substances 0.000 claims description 21
- 239000011398 Portland cement Substances 0.000 claims description 14
- 239000003638 chemical reducing agent Substances 0.000 claims description 13
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 12
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- 230000000996 additive effect Effects 0.000 claims description 11
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- 239000010881 fly ash Substances 0.000 claims description 7
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 6
- 239000011575 calcium Substances 0.000 claims description 6
- 229910052791 calcium Inorganic materials 0.000 claims description 6
- 229920003086 cellulose ether Polymers 0.000 claims description 6
- 239000004816 latex Substances 0.000 claims description 6
- 229920000126 latex Polymers 0.000 claims description 6
- 229910021487 silica fume Inorganic materials 0.000 claims description 6
- 239000004568 cement Substances 0.000 claims description 5
- 239000002518 antifoaming agent Substances 0.000 claims description 4
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 3
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- 229910052808 lithium carbonate Inorganic materials 0.000 claims description 3
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B28/00—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements
- C04B28/02—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing hydraulic cements other than calcium sulfates
- C04B28/04—Portland cements
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B2/00—Walls, e.g. partitions, for buildings; Wall construction with regard to insulation; Connections specially adapted to walls
- E04B2/74—Removable non-load-bearing partitions; Partitions with a free upper edge
- E04B2/7401—Removable non-load-bearing partitions; Partitions with a free upper edge assembled using panels without a frame or supporting posts, with or without upper or lower edge locating rails
- E04B2/7403—Removable non-load-bearing partitions; Partitions with a free upper edge assembled using panels without a frame or supporting posts, with or without upper or lower edge locating rails with special measures for sound or thermal insulation including fire protection
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Structural Engineering (AREA)
- Architecture (AREA)
- Electromagnetism (AREA)
- Civil Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
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- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a light sandwich wallboard and a preparation method thereof. The light sandwich wall board comprises a light heat insulation layer, bonding layers attached to two sides of the light heat insulation layer, and an impact-resistant protective layer attached to the side, away from the light heat insulation layer, of the bonding layer. The preparation method of the light sandwich wallboard comprises the following steps: 1) preparing an impact-resistant protection plate; 2) coating the bonding layer material on two sides of the light heat-insulating layer, then attaching impact-resistant protection plates on the two sides, pressurizing, attaching, and then maintaining to obtain the light sandwich wallboard. The light sandwich wallboard has the characteristics of high strength, high impact resistance, low heat conductivity coefficient, light dead weight, small overall thickness and the like, and the preparation method is simple, strong in flexibility, convenient to implement, low in equipment requirement, capable of greatly improving the production efficiency and reducing the production cost, and suitable for large-area popularization and application.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of building materials, in particular to a light sandwich wallboard and a preparation method thereof.
[ background of the invention ]
The prefabricated building is an important support for transformation, upgrading and development of the future building industry in China, and the prefabricated wall is an important basic material of the prefabricated building. The prefabricated wall body can improve the efficiency of construction, guarantees test piece size precision and stability performance, can also reduce the site operation noise, and the wall body that possesses the thermal-insulated effect of heat preservation can effectively reduce indoor and outdoor heat exchange, is the key that promotes the green, the energy-conserving development of assembled building.
The traditional heat-insulating wall has the defects of heavy self weight, low strength and poor impact resistance, and the walls such as foam concrete, ceramsite concrete and the like have the defects of small self weight and low heat conductivity coefficient, but also have the problems of low strength and poor impact resistance. At present, in order to solve the problems of heavy self weight, low strength and poor impact resistance of a wall body, a sandwich wallboard is usually adopted, a heat insulation material is arranged between two protective layers, the sandwich layer can be effectively protected, the sandwich wallboard has excellent fire resistance and weather resistance, the same service life of a heat insulation system and a main body structure is realized, and the purpose of integrating fire prevention and heat insulation is achieved.
The sandwich layer of the sandwich wall board can adopt inorganic heat-insulating materials such as foam concrete, ceramsite concrete and the like, and can also adopt organic heat-insulating materials such as extruded polystyrene boards, expanded polystyrene boards, polyurethane boards and the like. The inorganic sandwich wallboard has high strength, good durability, fire resistance and flame retardance, but has high density, high heat conductivity coefficient and poor impact resistance. The organic sandwich wallboard is light in weight, low in heat conductivity coefficient and capable of buffering instant impact, but low in strength and poor in durability, and needs to be supported by the protective layers on two sides, so that the mechanical property and durability of the organic sandwich wallboard are directly determined by the strength, impact resistance and cracking resistance of the protective layers. The protective layer is generally made of calcium silicate boards, concrete and the like, and in order to ensure strength, the thickness of the protective layer at least reaches 80mm, so that the light, thin and reduced design and preparation of the sandwich wallboard are difficult to realize. In addition, the surface of the organic heat-insulating material is nonpolar, and the affinity with a polar cement base material is poor, so that the interface bonding property of the organic heat-insulating material and the polar cement base material is poor, hollowing and even falling are easily caused, and the strength and the shock resistance of the organic sandwich wallboard are seriously influenced.
In conclusion, the contradiction between the strength, impact resistance, heat conductivity coefficient and density of the existing sandwich wallboard seriously restricts the popularization and application of the sandwich wallboard.
[ summary of the invention ]
The invention aims to provide a light sandwich wallboard and a preparation method thereof.
The technical scheme adopted by the invention is as follows:
the light sandwich wall board consists of light heat insulating layer, adhesive layers adhered to two sides of the light heat insulating layer and shock resisting protecting layer adhered to the side of the adhesive layer away from the light heat insulating layer.
Preferably, the light heat insulation layer is composed of at least one of extruded polystyrene board (XPS), expanded polystyrene board (EPS) and polyurethane board.
Preferably, the heat conductivity coefficient of the light heat insulation layer is 0.01W/m2·K~0.05W/m2K, density 20kg/m3~80kg/m3。
Preferably, the thickness of the light heat insulation layer is 10 mm-100 mm.
Preferably, the bonding layer is prepared from the following components in parts by mass:
portland cement: 200-800 parts;
fly ash: 0-200 parts of a solvent;
mineral powder: 0-500 parts;
aluminate cement: 0-180 parts;
gypsum powder: 0-50 parts;
ash calcium powder: 0-40 parts;
heavy calcium powder: 0-150 parts;
40-70 mesh quartz sand: 0-320 parts;
70-120 mesh quartz sand: 100-1200 parts;
additive: 2-256 parts;
water: 100 to 600 portions.
Further preferably, the bonding layer is prepared from the following components in parts by mass:
portland cement: 400-700 parts;
fly ash: 50-120 parts;
mineral powder: 200-400 parts;
70-120 mesh quartz sand: 100-1200 parts;
additive: 100-150 parts;
water: 400 to 450 portions.
Preferably, the admixture consists of the following components in parts by mass:
redispersible latex powder: 2-200 parts;
cellulose ether: 0-10 parts;
defoaming agent: 0-20 parts of a solvent;
tartaric acid: 0-3 parts of a solvent;
lithium carbonate: 0-3 parts of a solvent;
water reducing agent: 0 to 20 parts.
Further preferably, the admixture consists of the following components in parts by mass:
redispersible latex powder: 80-120 parts;
cellulose ether: 1-5 parts;
defoaming agent: 5-10 parts;
water reducing agent: 8-12 parts.
Preferably, the thickness of the bonding layer is 0.5mm to 5 mm.
Preferably, the impact-resistant protective layer consists of the following components in parts by mass:
portland cement: 800 to 1200 parts;
mineral powder: 0-400 parts;
silica fume: 0-200 parts of a solvent;
26-40 mesh quartz sand: 600-900 parts;
40-70 mesh quartz sand: 200 to 500 portions;
water reducing agent: 10-40 parts;
PE fiber: 0-20 parts of a solvent;
water: 200 to 350 portions.
Further preferably, the impact-resistant protective layer consists of the following components in parts by mass:
portland cement: 800 to 1200 parts;
mineral powder: 200-400 parts;
silica fume: 100-200 parts;
26-40 mesh quartz sand: 750-850 parts;
40-70 mesh quartz sand: 250-400 parts;
water reducing agent: 15-25 parts;
PE fiber: 5-10 parts;
water: 200 to 300 portions.
Preferably, the thickness of the impact-resistant protective layer is 5 mm-50 mm.
The preparation method of the light sandwich wallboard comprises the following steps:
1) preparing an impact-resistant protection plate;
2) coating the bonding layer material on two sides of the light heat-insulating layer, then attaching impact-resistant protection plates on the two sides, pressurizing, attaching, and then maintaining to obtain the light sandwich wallboard.
Preferably, the pressurizing in the step 2) is performed by applying a pressure of 0.01MPa to 5MPa, and the pressure holding time is 1min to 30 min.
The invention has the beneficial effects that: the light sandwich wallboard has the characteristics of high strength, high impact resistance, low heat conductivity coefficient, light dead weight, small overall thickness and the like, and the preparation method is simple, strong in flexibility, convenient to implement, low in equipment requirement, capable of greatly improving the production efficiency and reducing the production cost, and suitable for large-area popularization and application.
Specifically, the method comprises the following steps:
1) the impact-resistant protective layer in the light sandwich wallboard has high strength and good impact resistance, the thickness and the density of the wallboard can be obviously reduced under the same strength requirement, and the sandwich wallboard can be ensured to have good mechanical property, water resistance and fire resistance;
2) the light heat insulating layer in the light sandwich wallboard has the advantages of low heat conductivity coefficient, low elastic modulus and strong deformation capability, can absorb a large amount of instantaneous impact energy, and ensures that the sandwich wallboard has good heat insulating performance and impact resistance;
3) the bonding layer in the light sandwich wallboard can effectively prevent the problems of debonding, hollowing, falling off and the like between the impact-resistant protective layer and the light heat-insulating layer, and in addition, the light sandwich wallboard has better flexibility, can fully transmit impact and disperse stress, and improves the overall strength and the impact resistance of the sandwich wallboard;
4) the impact-resistant protective layer in the light sandwich wallboard can be prefabricated according to actual strength and size requirements, the bonding layer can adopt construction modes such as pouring, brushing and spraying by regulating and controlling fluidity, and a single-layer light composite wallboard can be prepared according to actual requirements;
5) the light sandwich wallboard disclosed by the invention has the advantages of high strength, high impact resistance, low heat conduction, simple preparation method, strong flexibility, convenience in implementation and low requirement on equipment, the production efficiency is greatly improved, and the production cost is reduced.
[ description of the drawings ]
FIG. 1 is a schematic structural view of a lightweight sandwich wall panel of the present invention;
the attached drawings indicate the following: 1. an impact resistant protective layer; 2. a bonding layer; 3. light insulating layer.
[ detailed description ] embodiments
The invention will be further explained and explained with reference to the drawings and the embodiments.
Example 1:
the preparation method of the light sandwich wallboard comprises the following steps:
1) uniformly mixing 1000 parts by mass of portland cement, 300 parts by mass of mineral powder, 150 parts by mass of silica fume, 810 parts by mass of 26-40-mesh quartz sand, 350 parts by mass of 40-70-mesh quartz sand, 17 parts by mass of polycarboxylic acid water reducing agent, 6 parts by mass of PE (polyethylene) fiber and 261 parts by mass of water, adding a small amount of PE fiber for multiple times, compacting and forming, and performing steam curing for 48 hours to obtain an impact-resistant protection plate with the thickness of 20 mm;
2) uniformly mixing 600 parts by mass of portland cement, 100 parts by mass of fly ash, 300 parts by mass of mineral powder, 1000 parts by mass of 70-120 mesh quartz sand, 433 parts by mass of water and 117 parts by mass of an additive (wherein each part of the additive comprises 100 parts by mass of redispersible latex powder, 1 part by mass of cellulose ether, 6 parts by mass of an organic silicon defoamer and 10 parts by mass of a polycarboxylic acid water reducer) to prepare a bonding layer material (the initial fluidity is 145mm), and pouring the bonding layer material on an extruded polystyrene board (the thermal conductivity is 0.035W/m) with the thickness of 40mm2K, density 35kg/m3) And (2) pouring the extruded polystyrene board on one surface of the core board, wherein the thickness of the extruded polystyrene board is 1mm, covering the extruded polystyrene board with an impact-resistant protection plate, applying pressure of 1.5MPa at the speed of 0.1MPa/min, keeping the pressure for 15min, releasing the pressure at the speed of 0.1MPa/min, performing the same treatment on the other surface of the extruded polystyrene board, curing at normal temperature for 7 days, and forming an adhesive layer and an impact-resistant protection layer on both surfaces of the extruded polystyrene board to obtain the light sandwich wallboard (the structural schematic diagram is shown in figure 1).
Example 2:
the preparation method of the light sandwich wallboard comprises the following steps:
1) uniformly mixing 900 parts by mass of Portland cement, 370 parts by mass of mineral powder, 180 parts by mass of silica fume, 770 parts by mass of 26-40 mesh quartz sand, 390 parts by mass of 40-70 mesh quartz sand, 22 parts by mass of polycarboxylic acid water reducing agent, 5 parts by mass of PE fiber and 258 parts by mass of water, adding a small amount of PE fiber for multiple times, compacting and forming, and performing steam curing for 48 hours to obtain an impact-resistant protection plate with the thickness of 20 mm;
2) uniformly mixing 700 parts by mass of portland cement, 80 parts by mass of fly ash, 220 parts by mass of mineral powder, 1100 parts by mass of 70-120 mesh quartz sand, 420 parts by mass of water and 130 parts by mass of additive (wherein each part of additive comprises 110 parts by mass of redispersible latex powder, 2 parts by mass of cellulose ether, 7 parts by mass of organic silicon defoamer and 11 parts by mass of polycarboxylic acid water reducer) to prepare a bonding layer material (the initial fluidity is 147mm), and pouring the bonding layer material on an expanded polystyrene board (the thermal conductivity is 0.041W/m) with the thickness of 40mm2K, density 35kg/m3) And (2) pouring the polystyrene board on one surface of the board, covering the polystyrene board with an impact-resistant protection board, applying pressure of 1.8MPa at the speed of 0.1MPa/min, keeping the pressure for 10min, releasing the pressure at the speed of 0.1MPa/min, performing the same treatment on the other surface of the polystyrene board, curing at normal temperature for 7 days, and forming an adhesive layer and an impact-resistant protection layer on both surfaces of the polystyrene board to obtain the light sandwich wallboard (the structural schematic diagram is shown in figure 1).
Example 3:
the preparation method of the light sandwich wallboard comprises the following steps:
1) uniformly mixing 1200 parts by mass of Portland cement, 240 parts by mass of mineral powder, 120 parts by mass of silica fume, 850 parts by mass of 26-40 mesh quartz sand, 290 parts by mass of 40-70 mesh quartz sand, 25 parts by mass of polycarboxylic acid water reducing agent, 7 parts by mass of PE (polyethylene) fiber and 270 parts by mass of water, adding a small amount of PE fiber for multiple times, compacting and forming, and performing steam curing for 48 hours to obtain an impact-resistant protection plate with the thickness of 20 mm;
2) uniformly mixing 200 parts by mass of portland cement, 150 parts by mass of chlorate cement, 200 parts by mass of 40-70-mesh quartz sand, 300 parts by mass of 70-120-mesh quartz sand, 100 parts by mass of heavy calcium powder, 30 parts by mass of gypsum powder, 20 parts by mass of ash calcium powder, 240 parts by mass of water and 20 parts by mass of an additive (wherein each additive comprises 12 parts by mass of a polycarboxylic acid water reducer, 3 parts by mass of a redispersible latex powder, 2 parts by mass of cellulose ether, 1 part by mass of an antifoaming agent, 1 part by mass of tartaric acid and 1 part by mass of lithium carbonate) to prepare a bonding layer material (the initial fluidity is 140mm), and pouring the bonding layer material on a polyurethane plate with the thickness of 50mm (the thermal conductivity is 0.025W/m)2K, density 35kg/m3) And (3) pouring the polyurethane board on one surface, covering with an impact-resistant protection board, applying pressure of 1.5MPa at the speed of 0.1MPa/min, keeping the pressure for 15min, releasing the pressure at the speed of 0.1MPa/min, performing the same treatment on the other surface of the polyurethane board, curing at normal temperature for 7 days, and forming an adhesive layer and an impact-resistant protection layer on both surfaces of the polyurethane board to obtain the light sandwich wallboard (the structural schematic diagram is shown in figure 1).
Comparative example 1:
a light steel keel-foam concrete composite wallboard comprises the following steps:
1) fixing the flange of the keel on the central line of the calcium silicate board by using a self-tapping screw;
2) 1740 parts by mass of Portland cement, 497 parts by mass of mineral powder, 248 parts by mass of fly ash, 1 part by mass of triethanolamine, 9 parts by mass of polycarboxylic acid water reducing agent, 81 parts by mass of foam (foam generated by hydrogen peroxide as a foaming agent) and 1000 parts by mass of water are uniformly mixed to prepare foam concrete;
3) uniformly pouring foam concrete to the height of the keel;
4) covering a calcium silicate board, fixing by self-tapping nails, and curing at normal temperature to an age to obtain the light steel keel-foam concrete composite wallboard.
Comparative example 2:
a ceramsite concrete-polystyrene board composite wallboard comprises the following steps:
1) 258 parts by mass of Portland cement, 52 parts by mass of fly ash, 629 parts by mass of sand, 480 parts by mass of ceramsite and 1 part by mass of additive (containing Na)2SO4、CaCl2The chemical excitant) and 196 parts by mass of water are mixed evenly to prepare ceramsite concrete, and the ceramsite concrete is poured on a mould;
2) placing a polystyrene board;
3) inserting a connecting piece;
4) pouring top-layer ceramsite concrete, and regularly spraying water for curing to obtain the ceramsite concrete-polystyrene board composite wallboard.
And (3) performance testing:
the performance tests were performed on the lightweight sandwich wallboards of examples 1-3 and the composite wallboards of comparative examples 1-2, and the test results are shown in the following table:
TABLE 1 Performance test results for lightweight sandwich wallboards of examples 1-3 and composite wallboards of comparative examples 1-2
Note:
compressive strength: the basic performance and the test method of the ultra-high performance concrete are tested according to the T/CBMF 37-2018;
breaking strength: the size of the plate is 300mm multiplied by 150mm, the test span is 200mm, the load acts on the mid-span position of the plate, the loading rate is 0.5mm/min, and the flexural strength calculation formula is as follows: f is 3Fl/2bh2Wherein F is the flexural strength (unit: MPa) of the plate material, F is the limit load (unit: N), l is the span (unit: mm), b is the width (unit: mm) of the plate material, and h is the height (unit: mm) of the plate material;
heat transfer coefficient: respectively sticking a thermocouple sensor and a heat flow sensor on the surface of a plate, then placing the plate at the boundary of a cold and hot cavity with constant ambient temperature, and calculating a formula by acquiring the heat flow density and temperature of the surface of a test piece and the heat transfer coefficient: r ═ te-ti|/q,R0=Ri+R+Re,K=1/R0Wherein K is the heat transfer coefficient (unit: W/m) of the composite plate2K), R and R0Respectively the thermal resistance and the heat transfer resistance (unit: m) of the plate2·K/W),tiAnd teThe temperature (unit:. degree. C.) of the inner and outer surfaces of the sheet, RiAnd ReThe heat exchange resistances of the inner surface and the outer surface of the plate are respectively according to GB50176-2016 civil construction thermal engineering design Specification RiAnd ReRespectively take 0.11m2K/W and 0.04m2K/W, q is the heat flux density of the clad plate (unit: W/m)2);
Falling ball type impact resistance: a steel ball having a weight of 2kg and a diameter of 80mm was released from the height of 2.5m, and the surface of the plate was observed to be damaged upon impact.
As can be seen from Table 1: compared with the comparative example 1, the surface density and the heat transfer coefficient of the wall bodies of the examples 1 to 3 are similar, but the wall bodies of the examples 1 to 3 have thinner thickness (reduced from 150mm to 80mm to 90mm), higher compressive strength and higher flexural strength (the compressive strength is improved from 23.9MPa to 42.6MPa to 46.8 MPa; and the flexural strength is improved from 23.9MPaThe pressure is increased from 7.6MPa to 18.5MPa to 19.0MPa), and the shock resistance is better (the pit is smaller, the crack is fine and the number is small); the wall thicknesses of examples 1-3 are similar to those of comparative example 2, but the wall areal densities of examples 1-3 are lower (from 132 kg/m)2Reduced to 87kg/m2~112kg/m2) The compression strength and the rupture strength are higher (the compression strength is improved from 18.2MPa to 42.6MPa to 46.8 MPa; the rupture strength is improved from 6.1MPa to 18.5 MPa-19.0 MPa, and the heat transfer coefficient is lower (from 1.06W/m)2K is reduced to 0.66W/m2·K~0.74W/m2K), better impact resistance (smaller pits, fine cracks and small number).
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.
Claims (7)
1. A light sandwich wallboard is characterized in that the light sandwich wallboard comprises a light heat insulation layer (3), bonding layers (2) attached to two surfaces of the light heat insulation layer (3), and an impact-resistant protective layer (1) attached to one surface, far away from the light heat insulation layer (3), of the bonding layers (2); wherein: the bonding layer (2) is prepared from the following components in parts by mass:
portland cement: 200-800 parts;
fly ash: 0-200 parts of a solvent;
mineral powder: 0-500 parts;
aluminate cement: 0-180 parts;
gypsum powder: 0-50 parts;
ash calcium powder: 0-40 parts;
heavy calcium powder: 0-150 parts;
40-70 mesh quartz sand: 0-320 parts;
70-120 mesh quartz sand: 100-1200 parts;
additive: 2-256 parts;
water: 100-600 parts;
the anti-impact protective layer (1) is composed of the following components in parts by mass:
portland cement: 800 to 1200 parts;
mineral powder: 0-400 parts;
silica fume: 0-200 parts of a solvent;
26-40 mesh quartz sand: 600-900 parts;
40-70 mesh quartz sand: 200 to 500 portions;
water reducing agent: 10-40 parts;
PE fiber: 0-20 parts of a solvent;
water: 200 to 350 portions.
2. The lightweight sandwich wallboard of claim 1, wherein: the heat conductivity coefficient of the light heat-insulating layer (3) is 0.01W/m2·K~0.05W/m2K, density 20kg/m3~80kg/m3。
3. The lightweight sandwich wallboard of claim 1, wherein: the thickness of the light heat insulation layer (3) is 10 mm-100 mm.
4. The lightweight sandwich wallboard of claim 1, wherein: the additive comprises the following components in parts by mass:
redispersible latex powder: 2-200 parts;
cellulose ether: 0-10 parts;
defoaming agent: 0-20 parts of a solvent;
tartaric acid: 0-3 parts of a solvent;
lithium carbonate: 0-3 parts of a solvent;
water reducing agent: 0 to 20 parts.
5. The lightweight sandwich wallboard of claim 4, wherein: the thickness of the bonding layer is 0.5 mm-5 mm.
6. The lightweight sandwich wallboard of claim 1, wherein: the thickness of the impact-resistant protective layer is 5 mm-50 mm.
7. The preparation method of the light sandwich wallboard of any one of claims 1 to 6, characterized by comprising the following steps:
1) preparing an impact-resistant protection plate;
2) coating the bonding layer materials on two sides of the light heat-insulating layer (2), then attaching impact-resistant protective plates on the two sides, pressurizing, attaching, and then maintaining to obtain the light sandwich wallboard.
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