CN113102193B - Coating machine scraper based on surface hydrophilic and hydrophobic microstructure - Google Patents
Coating machine scraper based on surface hydrophilic and hydrophobic microstructure Download PDFInfo
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- CN113102193B CN113102193B CN202110238389.3A CN202110238389A CN113102193B CN 113102193 B CN113102193 B CN 113102193B CN 202110238389 A CN202110238389 A CN 202110238389A CN 113102193 B CN113102193 B CN 113102193B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/04—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with blades
- B05C11/045—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with blades characterised by the blades themselves
Abstract
A coater scraper designed based on a surface hydrophilic and hydrophobic microstructure is composed of a hydrophilic layer and a hydrophobic layer which are horizontally and uniformly distributed at intervals and are strip-shaped groove microstructures. The hydrophilic layer is formed by hydrophilic treatment of a silicon wafer substrate serving as a scraper substrate; the hydrophobic layer is formed of a hydrophobic material spin-coated on a doctor blade substrate (silicon wafer substrate). The invention has the beneficial effects that: (1) the scraper with the hydrophilic and hydrophobic patterned microstructure design is simple and reasonable in structure, high in coating efficiency and high in precision. (2) Due to the hydrophilic and hydrophobic patterned structure on the surface of the scraper, the surface is uniformly distributed in an alternate hydrophilic and hydrophobic manner, the diffusion phenomenon of ink on the surface of a silicon wafer cutter head is properly inhibited by virtue of the hydrophobic property of partial area materials, the solvent volatilization speed is favorably reduced, so that the ink components are more uniformly spread in the coating process, and a uniform and flat film is prepared.
Description
Technical Field
The invention belongs to the technical field of scraper coating machines and the field of perovskite photovoltaic devices, and particularly relates to a surface microstructure design of a scraper tool bit.
Background
Due to good film-forming property, the blade coater has been applied to the preparation of photovoltaic devices, and the photoelectric conversion efficiency of the blade coater is steadily improved no matter the photovoltaic devices are small-area or large-area photovoltaic devices. At present, people still carry out deep research on the film preparation process to improve the film quality of photoelectric devices and further improve the photoelectric properties of the devices.
The blade coater is an instrument for forming a solid continuous film by applying a coating on a substrate through one or more coating layers; when the existing scraper coating machine is used for coating a base material, a scraper drives ink to move, but because the surface of a scraper tool bit is usually a hydrophilic surface, the ink can be completely spread on the surface of a silicon wafer tool bit, so that the exposed surface area of the ink can be increased, the volatilization speed of a solvent is increased, the ink can form a film unevenly in the coating process, the film appearance is deteriorated, and the performance of a photoelectric device is reduced.
Disclosure of Invention
The invention aims to overcome the defects and problems in the prior art, and provides a coating machine scraper, wherein the surface of a cutter head is subjected to microstructure design, specifically is a hydrophilic and hydrophobic patterned microstructure of the surface of the cutter head, and the microstructure design can effectively improve the problem of ink diffusion in the coating process of the scraper, so that the film forming effect of a coated substrate on a substrate is obviously improved, and the coating machine scraper is applied to the preparation of photovoltaic devices.
The invention is realized by the following technical scheme.
The coater scraper designed based on the surface hydrophilic and hydrophobic microstructure is composed of strip-shaped groove microstructures, wherein the strip-shaped groove microstructures are formed by a hydrophilic layer and a hydrophobic layer which are uniformly distributed at intervals in a transverse direction.
The hydrophilic layer is formed by hydrophilic treatment of a silicon wafer substrate serving as a scraper substrate.
The hydrophobic layer is formed of a hydrophobic material spin-coated on a doctor blade substrate (silicon wafer substrate).
The silicon wafer substrate of the scraper substrate is monocrystalline silicon, silicon monoxide and the like, and preferably monocrystalline silicon.
The hydrophobic layer is a micron-sized ultrathin hydrophobic layer, and is made of hydrophobic materials such as perfluoropolymer, epoxy resin, siloxane, fluorosilane and the like. The perfluorinated polymer is polytetrafluoroethylene, fluorinated ethylene propylene, perfluorinated sulfonyl fluoride resin and the like.
The strip-shaped groove microstructures can be transversely and uniformly distributed at different interval widths, the interval width is actually the width of the hydrophobic surface in the transverse direction, the minimum interval width can reach 0.5 mu m and the maximum interval width can be 50 mu m, and therefore regular patterned microstructures with hydrophilic layers and hydrophobic layers at intervals are formed on the silicon wafer substrate, the fluid dynamics process in the coating process is facilitated, and uniform coating is achieved.
The section of the strip-shaped groove microstructure can be rectangular with different lengths and widths, and is preferably 1 mu m multiplied by 0.2 mu m.
The length of the strip-shaped groove microstructure is determined according to the size of the substrate of the scraper silicon chip, and the preferable length of the groove is 2/3 of the side length of the substrate parallel to the groove.
The hydrophilic treatment is performed by adopting oxygen plasma irradiation, the preferable irradiation time is 10min, and the exposed surface of the silicon substrate is ensured to be a hydrophilic layer with hydrophilicity after the hydrophilic treatment.
The formation process of the structure with the hydrophilic layer and the hydrophobic layer separated from each other is as follows: the scraper substrate is a silicon wafer substrate; arranging a hydrophobic layer on a silicon wafer substrate through a spin coating process, and coating a layer of photoresist on the hydrophobic layer; etching a patterned microstructure substrate with strip-shaped grooves which are transversely and uniformly distributed at intervals by utilizing a photoetching technology with the help of a mask plate; and carrying out hydrophilic treatment on the etched strip-shaped groove with the help of a mask plate to ensure that the exposed surface of the silicon wafer has a hydrophilic function, and finally obtaining the scraper with the hydrophilic and hydrophobic patterned microstructure.
The hydrophilic and hydrophobic patterned microstructure has the size as small as micron level, so that the integral ink coating motion of the scraper on the macro level is not influenced, and the improved microstructure improves the fluid dynamic process of ink on the micro level, thereby achieving the aim of the invention. Secondly, the coating blade is integrally connected to the coater through a blade holder, and its spatial coating position can be adjusted by means of a related device.
The patterned microstructure on the scraper is realized by a photoetching technology, the size of the patterned microstructure reaches the precision of 0.1 mu m, but the technical precision of the technology which can realize the patterning process in the existing printing technology, such as a screen printing technology, cannot meet the requirement required by the invention, but does not represent the technical breakthrough of the future to meet the technical requirement required by the invention, so that the invention is repeatedly engraved.
The scraper disclosed by the invention can be widely applied to the fields of perovskite solar photovoltaic device preparation, organic photovoltaic device preparation and the like by being matched with a coating machine, but is not limited to the application fields.
The invention has the beneficial effects that: 1. the scraper with the hydrophilic and hydrophobic patterned microstructure design is simple and reasonable in structure, high in coating efficiency and high in precision. 2. Due to the hydrophilic and hydrophobic patterned structure on the surface of the scraper, the surface is uniformly distributed in an alternate hydrophilic and hydrophobic manner, the diffusion phenomenon of ink on the surface of a silicon wafer cutter head is properly inhibited by virtue of the hydrophobic property of partial area materials, the solvent volatilization speed is favorably reduced, so that the ink components are more uniformly spread in the coating process, and a uniform and flat film is prepared.
Drawings
FIG. 1 is a diagram of a manufacturing process of a coater blade according to the present invention.
Fig. 2 is a schematic cross-sectional view of different bar-shaped groove microstructures on the surface of the doctor blade according to the present invention.
Fig. 3 is a schematic diagram of uniform arrangement of strip-shaped groove microstructures on the surface of the scraper blade in different lengths and spacing widths.
Fig. 4 is a schematic view of the overall structure of the coater of the present invention.
Fig. 5 is an Atomic Force Microscope (AFM) image of a thin film of an active layer of a perovskite solar cell prepared according to the present invention, wherein a is a thin film prepared without using a patterned doctor blade and b is a thin film prepared using a patterned doctor blade.
FIG. 6 shows the short-circuit current-voltage of perovskite solar cell devices prepared using a knife coaterJ-V) Graph in which the abscissa is Voltage (Voltage), the ordinate is Short-circuit current density (Short-circuit current density), and the solid curve in the graph is a perovskite device prepared using a patterned doctor blade, and the dotted curve is a perovskite device prepared without using a patterned doctor blade. The device structure is formed by ITO/PEDOT: PSS/Perovskite/PC61BM/Ag is taken as an example.
Fig. 7 is an Atomic Force Microscope (AFM) view of an active layer thin film of an organic solar cell prepared according to the present invention, wherein a is a thin film prepared without using a patterned doctor blade, and b is a thin film prepared using a patterned doctor blade.
FIG. 8 shows the short-circuit current density-voltage of an organic solar cell based on the thin film shown in FIG. 5 prepared according to the present inventionJ-V) And a graph, wherein the solid curve is an organic photovoltaic device prepared by using the patterned scraper, and the dotted curve is an organic photovoltaic device prepared without using the patterned scraper. The structure of the device is ITO/PEDOT: PSS/PM6: Y6/PDINO/Al.
In the figure: 1-a patterned mask plate, 2-a photoresist layer, 3-a hydrophobic layer, 4-a silicon wafer substrate, 5-a hydrophilic surface, 6-a hydrophobic surface, 7-a lens clamp, 8-a scraper, 9-a scraper clamp, 10-an electric rotating table, 11-a vertical electric lifting table, 12-a manual translation table, 13-a spiral micrometer, 14-an electric translation table, 15-a supporting base, 16-a substrate electric lifting table, 17-a manual tilting table, 18-a heating table, 19-a substrate plate and 20-a connecting plate.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. The preferred forms of the invention are illustrated in the accompanying drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "mounted" or "connected" to another element, it can be directly mounted or connected to the other element.
Specifically, the explanation will be made with reference to FIG. 1, in which 3X 3 cm of the sample is washed in one piece2On the monocrystalline silicon wafer, the polytetrafluoroethylene hydrophobic layer 3 and the photoresist layer 2 are pre-deposited in a spin coating mode, the speed and time of spin coating polytetrafluoroethylene are 3000r and 30s, and the speed and time of spin coating photoresist are 4000r and 30s, so that the hydrophobic layer with the thickness of 0.2 mu m and the photoresist layer with the thickness of 0.15 mu m are obtained on the silicon wafer substrate 4. Then processing for 5s in ultraviolet light environment with the aid of a mask plate 1 with specific specification to perform photoetching on the photoresist layer 2, and finally performing photoetching processingAnd (2) placing the substrate of the silicon wafer in a developing solution for developing to obtain patterned substrates distributed at uniform intervals (1 [ mu ] m), and performing oxygen plasma irradiation treatment on the substrate for 10min under the covering of a patterned mask plate 1 to ensure that the surface of the exposed substrate 4 of the silicon wafer becomes hydrophilic, while the part of the substrate of the non-silicon wafer is hydrophobic, so that a required hydrophilic and hydrophobic patterned microstructure, specifically a strip-shaped groove type, is realized on the substrate 4 of the silicon wafer, the cross section of the strip-shaped groove is rectangular, the size is 1 [ mu ] m multiplied by 0.2 [ mu ] m, and the length of the strip-shaped groove is 2 cm.
The process of the preparation process of the coater scraper is shown in fig. 1, the silicon wafer substrate deposited with the hydrophobic layer 3 and the photoresist layer 2 is subjected to ultraviolet lithography under the cover of the patterned mask plate 1, and a patterned structure identical to that of the patterned mask plate 1 is realized on the silicon wafer substrate 4 through a developing technology. And then carrying out oxygen plasma irradiation treatment on the obtained patterning structure under the shielding of the patterning mask plate 1, so that the exposed surface of the silicon wafer substrate 4 becomes hydrophilic, and the shielded surface is hydrophobic, thereby realizing the required hydrophilic and hydrophobic patterning microstructure on the silicon wafer substrate 4, wherein the size of the microstructure is as small as micrometer level, and the scraper cannot be influenced. On the contrary, the hydrophilic surface 5 of the hydrophilic silicon wafer substrate 4 and the hydrophobic micro surface 6 are regularly and orderly arranged at certain intervals, so that a hydrophilic and hydrophobic patterned microstructure surface is formed on the surface of the silicon wafer substrate 4 (namely a scraper), the hydrodynamic process of the ink in the printing and coating process is improved, and the uniform and effective coating of the ink is realized.
FIG. 2 is schematic diagrams of different cross sections of a bar-shaped groove microstructure on the surface of a scraper, according to the invention, the depth of the bar-shaped groove microstructure can be controlled by controlling the length of the photoetching time and the thickness of a hydrophobic layer 3, specifically, the exposure time of ultraviolet light and the rotating speed of a spin-coating hydrophobic layer are regulated and controlled; the width of the stripe-shaped groove is determined by the designed patterned mask plate 1, specifically the width of the hydrophilic pattern.
Fig. 3 is a schematic diagram of arrangement of the bar-shaped groove microstructures on the surface of the scraper in different lengths and different spacing widths, and the bar-shaped groove microstructures in different lengths and different spacing widths can be uniformly arranged by designing the patterning size in the patterned mask plate 1.
Fig. 4 is a schematic view of the overall structure of a coater using the coater blade of the present invention, which includes a lens holder 7, a blade 8, a blade holder 9, an electric rotary table 10, a vertical electric lifting table 11, a manual translation table 12, a micrometer screw 13, an electric translation table 14, a support base 15, a substrate electric lifting table 16, a manual tilting table 17, heating tables 18, 19, a substrate plate 19, and a connection plate 20. The lens clamp 7 is fixedly arranged on the supporting base 15, the scraper 8 and the base plate 19 are arranged in front of the lens clamp 7, the scraper 8 is fixedly arranged on the scraper clamp 9, and the scraper clamp 9 and the electric rotating platform 10 are fixedly arranged in the vertical direction; the electric rotating table 10 is fixedly arranged on a vertical electric lifting table 11, the vertical electric lifting table 11 is fixedly connected with a manual translation table 12 through an L-shaped plate, the position of the manual translation table 12 is adjusted through a micrometer screw 13, the manual translation table 12 is connected with an electric translation table 14 through a movable circular plate 20, and the electric translation table 14 is fixedly arranged on a supporting base 15; the lower surface of the base plate 19 is fixedly installed with the heating table 18, and the bottom of the heating table 18 is fixedly installed with the manual tilting table 17; the manual tilting table 17 is fixedly mounted on the base electric lift table 16, and the base electric lift table 16 is fixedly mounted on the support base 15.
The working process of the coating machine scraper based on the surface hydrophilic and hydrophobic microstructure applied to film preparation is as follows: to produce a high quality device film, the motorized stage 14 should first be initialized to an operational state. The temperature of the heating stage 18 is adjusted by a temperature controller to adjust the temperature of the base sheet 19 to a temperature required for coating. The base plate 19 is adjusted to the horizontal position through a manual inclined table 17 and an electric lifting table 16, the scraper 8 is fixed on a scraper clamp 9, a vacuum pump is started to suck glass or other flexible base materials placed on the base plate 19, the coating position and the coating angle of the scraper are adjusted through adjusting an electric rotating table 10, a vertical electric lifting table 11, a manual translation table 12 and an electric translation table 13, in order to accurately control the thickness of the film, copper rulers with different thicknesses are adopted to finely adjust the distance between the base plate 19 and the scraper 8, and the scraper 8 can be finely adjusted through a screw micrometer 13 if necessary, so that the coating precision of the scraper is improved; and then, adjusting the manual translation stage 12 and the electric translation stage 14 to move the scraper to a required position, after the position is completely confirmed, dripping ink on the surface of the substrate, starting a control system, driving the scraper 8 to move forwards and backwards by the electric translation stage 14, and carrying out blade coating on the coated substrate at a proper speed (the crystallization speed is equivalent to the blade coating speed). Due to the action of capillary force, ink can diffuse to the hydrophobic surface 6 at once, so that the diffusion of the ink on the surface of the cutter head can be effectively inhibited, the rapid volatilization of a solvent is reduced, the scraper 8 drives the ink to be uniformly coated on a base material, and finally, a uniform and flat high-quality solid film is formed through annealing, so that an efficient photovoltaic device can be prepared.
The Perovskite device preparation experiment result shows that the performance of the device which is subjected to blade coating by adopting the patterned scraper in the Perovskite device based on the ITO/PEDOT, PSS/Perovskite/PCBM/Ag structure is integrally improved compared with the device which is subjected to blade coating by adopting a common scraper, firstly, the roughness of the film is obviously reduced, and is reduced from 32.5nm to 12.9nm, as shown in an AFM (atomic force microscope) diagram of FIG. 5; secondly, the open-circuit voltage is increased from 0.762V to 1.001V, and the short-circuit current density is increased from 18.872mA cm-2Rise to 20.148 mA cm-2The filling factor is improved from 76.286% to 78.264%, the efficiency of the whole device is improved from 11.012% to 15.165%, and the improvement of the device performance and the improvement of the film quality are inseparable.
The photovoltaic parameter values of the perovskite-type devices are counted in tables 1 and 2, Voltage represents the open-circuit Voltage of the device, Jsc represents the short-circuit current, Fill Factor represents, and Efficiency represents the photoelectric conversion Efficiency.
TABLE 1
The experimental result of the organic photovoltaic device preparation shows that the device which is subjected to blade coating by using the patterned scraper in the organic photovoltaic device based on the ITO/PEDOT: PSS/PM6: Y6/PDINO/Al structure has the performance which is better than that of the device which is subjected to blade coating by using the common scraperTo the overall improvement, the roughness of the film is reduced significantly, from 8.2nm to 2.6nm, as shown in the AFM image of fig. 7; secondly, the open-circuit voltage of the device is increased from 0.862V to 1.024V, and the short-circuit current density is increased from 18.188mA cm-2Rise to 18.648mA cm-2The filling factor is improved from 69.981 to 73.749%, the efficiency of the whole device is improved from 11.031% to 14.585%, and the performance of the organic solar cell is obviously improved.
TABLE 2
The above description is only a preferred embodiment of the present invention, and not intended to limit the spirit and scope of the present invention, it should be noted that, for those skilled in the art, many modifications and variations can be made without departing from the spirit and scope of the present invention, and these modifications and variations should also be considered as the protection scope of the present invention.
Claims (10)
1. A coating machine scraper based on surface hydrophilic and hydrophobic microstructure design is characterized by being composed of strip-shaped groove microstructures, wherein the strip-shaped groove microstructures are formed in a mode that hydrophilic layers and hydrophobic layers are transversely and uniformly distributed at intervals.
2. The coater blade designed based on the hydrophilic and hydrophobic microstructure of claim 1, wherein the hydrophilic layer is formed by hydrophilic treatment of a silicon wafer substrate as a blade substrate.
3. The coater blade designed based on the hydrophilic and hydrophobic microstructure of claim 1, wherein the hydrophobic layer is formed of a hydrophobic material spin-coated on the substrate of the blade.
4. The coater blade designed based on the surface hydrophilic and hydrophobic microstructure according to claim 2, wherein the substrate of the blade is monocrystalline silicon or silicon monoxide.
5. The coater blade designed based on the surface hydrophilic and hydrophobic microstructure according to claim 3, wherein the hydrophobic layer is a micron-sized ultra-thin hydrophobic layer made of perfluoropolymer, epoxy resin, siloxane or fluorosilane.
6. The coater blade designed based on the surface hydrophilic and hydrophobic microstructure according to claim 5, wherein the perfluoropolymer is polytetrafluoroethylene, polyperfluoroethylpropylene or perfluorosulfonyl resin.
7. The coating machine scraper based on the surface hydrophilic and hydrophobic microstructure design according to claim 1, wherein the width of the middle partition of the strip-shaped groove microstructure is 0.5-50 μm.
8. The coater blade designed based on the surface hydrophilic and hydrophobic microstructure according to claim 1, wherein the groove length of the strip-shaped groove microstructure is 2/3 of the side length of the blade substrate parallel to the grooves.
9. The coater blade designed based on the hydrophilic and hydrophobic microstructure of claim 2, wherein the hydrophilic treatment is oxygen plasma irradiation.
10. The coater scraper designed based on the surface hydrophilic and hydrophobic microstructure according to claims 1 to 9, wherein the formation process of the strip-shaped groove microstructure with the hydrophilic layer and the hydrophobic layer separated comprises the following steps: the scraper substrate is a silicon wafer substrate; arranging a hydrophobic layer on a silicon wafer substrate through a spin coating process, and coating a layer of photoresist on the hydrophobic layer; etching a patterned microstructure substrate with strip-shaped grooves which are transversely and uniformly distributed at intervals by utilizing a photoetching technology with the help of a mask plate; and carrying out hydrophilic treatment on the etched strip-shaped groove with the help of a mask plate to ensure that the exposed surface of the silicon wafer has a hydrophilic function, and finally obtaining the scraper with the hydrophilic and hydrophobic patterned microstructure.
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Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01184073A (en) * | 1988-01-18 | 1989-07-21 | Matsushita Electric Ind Co Ltd | Apparatus for coating liquid |
| JPH07209800A (en) * | 1994-01-20 | 1995-08-11 | Fuji Photo Film Co Ltd | Silver halide photographic sensitive material |
| DE19503275A1 (en) * | 1995-02-02 | 1996-08-08 | Roland Man Druckmasch | Printer roller, pref. for dispensing liquids in damping or varnishing units |
| JPH11244760A (en) * | 1998-02-26 | 1999-09-14 | Dainippon Screen Mfg Co Ltd | Substrate treating device |
| US6352758B1 (en) * | 1998-05-04 | 2002-03-05 | 3M Innovative Properties Company | Patterned article having alternating hydrophilic and hydrophobic surface regions |
| JP2002331678A (en) * | 2002-04-01 | 2002-11-19 | Canon Inc | Ink jet head |
| CN1529778A (en) * | 2001-02-02 | 2004-09-15 | ���շ�֯�ɷݹ�˾ | Textile surface |
| JP2009178687A (en) * | 2008-01-31 | 2009-08-13 | Fujifilm Corp | Method and apparatus for applying coating liquid, and inkjet recording apparatus |
| CA2789947A1 (en) * | 2010-02-22 | 2011-08-25 | Itw Ccip Holdings Llc | Windshield treatment and wiper blade combination |
| CN102553795A (en) * | 2010-12-23 | 2012-07-11 | 贺利氏医疗有限公司 | Coating method and coating device |
| CN103282129A (en) * | 2010-12-24 | 2013-09-04 | 丰田自动车株式会社 | Coating device and method for producing electrode plate |
| WO2014148351A1 (en) * | 2013-03-22 | 2014-09-25 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, and computer storage medium |
| WO2016019643A1 (en) * | 2014-08-08 | 2016-02-11 | 京东方科技集团股份有限公司 | Organic electroluminescent display panel and manufacturing method therefor, and display device |
| CN105425385A (en) * | 2015-11-26 | 2016-03-23 | 华南师范大学 | Electrowetting display device for controlling ink motion and preparation method thereof |
| JP2017032509A (en) * | 2015-08-05 | 2017-02-09 | 株式会社古河電工アドバンストエンジニアリング | Sample introduction member and method for introducing sample into well |
| CN108245320A (en) * | 2018-02-27 | 2018-07-06 | 爹地宝贝股份有限公司 | A kind of paper diaper compound core body and its processing method |
| CN108475644A (en) * | 2016-02-03 | 2018-08-31 | 富士胶片株式会社 | The manufacturing method of organic semiconductor film |
| CN109279597A (en) * | 2018-09-28 | 2019-01-29 | 南昌大学 | A kind of preparation method of transparent graphene film |
| CN110632828A (en) * | 2019-09-27 | 2019-12-31 | 中国科学技术大学 | Method for manufacturing hydrophilic and hydrophobic patterned surface on substrate and application thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5020015B2 (en) * | 2007-09-28 | 2012-09-05 | 富士フイルム株式会社 | Liquid coating apparatus and inkjet recording apparatus |
| US8404318B2 (en) * | 2009-06-16 | 2013-03-26 | Kent State University | Methods and apparatus to produce aligned film of lyotropic chromonic liquid crystals |
| PL3292849T3 (en) * | 2010-10-13 | 2021-02-08 | Drylock Technologies Nv | Method and apparatus for producing composite structure |
-
2021
- 2021-03-04 CN CN202110238389.3A patent/CN113102193B/en active Active
Patent Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01184073A (en) * | 1988-01-18 | 1989-07-21 | Matsushita Electric Ind Co Ltd | Apparatus for coating liquid |
| JPH07209800A (en) * | 1994-01-20 | 1995-08-11 | Fuji Photo Film Co Ltd | Silver halide photographic sensitive material |
| DE19503275A1 (en) * | 1995-02-02 | 1996-08-08 | Roland Man Druckmasch | Printer roller, pref. for dispensing liquids in damping or varnishing units |
| JPH11244760A (en) * | 1998-02-26 | 1999-09-14 | Dainippon Screen Mfg Co Ltd | Substrate treating device |
| US6352758B1 (en) * | 1998-05-04 | 2002-03-05 | 3M Innovative Properties Company | Patterned article having alternating hydrophilic and hydrophobic surface regions |
| CN1529778A (en) * | 2001-02-02 | 2004-09-15 | ���շ�֯�ɷݹ�˾ | Textile surface |
| JP2002331678A (en) * | 2002-04-01 | 2002-11-19 | Canon Inc | Ink jet head |
| JP2009178687A (en) * | 2008-01-31 | 2009-08-13 | Fujifilm Corp | Method and apparatus for applying coating liquid, and inkjet recording apparatus |
| CA2789947A1 (en) * | 2010-02-22 | 2011-08-25 | Itw Ccip Holdings Llc | Windshield treatment and wiper blade combination |
| CN102553795A (en) * | 2010-12-23 | 2012-07-11 | 贺利氏医疗有限公司 | Coating method and coating device |
| CN103282129A (en) * | 2010-12-24 | 2013-09-04 | 丰田自动车株式会社 | Coating device and method for producing electrode plate |
| WO2014148351A1 (en) * | 2013-03-22 | 2014-09-25 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, and computer storage medium |
| WO2016019643A1 (en) * | 2014-08-08 | 2016-02-11 | 京东方科技集团股份有限公司 | Organic electroluminescent display panel and manufacturing method therefor, and display device |
| JP2017032509A (en) * | 2015-08-05 | 2017-02-09 | 株式会社古河電工アドバンストエンジニアリング | Sample introduction member and method for introducing sample into well |
| CN105425385A (en) * | 2015-11-26 | 2016-03-23 | 华南师范大学 | Electrowetting display device for controlling ink motion and preparation method thereof |
| CN108475644A (en) * | 2016-02-03 | 2018-08-31 | 富士胶片株式会社 | The manufacturing method of organic semiconductor film |
| CN108245320A (en) * | 2018-02-27 | 2018-07-06 | 爹地宝贝股份有限公司 | A kind of paper diaper compound core body and its processing method |
| CN109279597A (en) * | 2018-09-28 | 2019-01-29 | 南昌大学 | A kind of preparation method of transparent graphene film |
| CN110632828A (en) * | 2019-09-27 | 2019-12-31 | 中国科学技术大学 | Method for manufacturing hydrophilic and hydrophobic patterned surface on substrate and application thereof |
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