CN113099614A - Circuit board maintenance tool - Google Patents
Circuit board maintenance tool Download PDFInfo
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- CN113099614A CN113099614A CN202110354857.3A CN202110354857A CN113099614A CN 113099614 A CN113099614 A CN 113099614A CN 202110354857 A CN202110354857 A CN 202110354857A CN 113099614 A CN113099614 A CN 113099614A
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- circuit board
- airflow
- channel
- jig
- air flow
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- 238000012423 maintenance Methods 0.000 title claims abstract description 43
- 239000000463 material Substances 0.000 claims description 6
- 239000002969 artificial stone Substances 0.000 claims description 5
- 238000009434 installation Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 9
- 239000012790 adhesive layer Substances 0.000 description 6
- 230000001788 irregular Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to a circuit board maintenance jig, which comprises a jig body for installing a circuit board, wherein the jig body is connected with an air flow driving mechanism which drives the air flow in the jig body to flow; the maintenance jig of the circuit board also comprises an airflow channel formed inside the jig body and an air vent formed on the jig body, wherein the air vent is communicated with the airflow channel, and the jig body is communicated with the airflow driving mechanism through the airflow channel; in the installation state, the vent hole is arranged corresponding to the circuit board. The air vent is communicated with the air flow channel, the jig body is communicated with the air flow driving mechanism through the air flow channel, when the air flow driving mechanism drives the air flow in the air flow channel to pass through the air vent, the heat on the surface of the circuit board is taken away, and the surface temperature of the circuit board is effectively reduced.
Description
Technical Field
The utility model relates to an electronic component maintains technical field, especially relates to a circuit board maintenance tool.
Background
With the development of science and technology, the circuit board enables the circuit to be miniaturized and visualized, and plays an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances. In order to protect the circuit board, the circuit board is usually mounted in an electrical appliance in a packaged form.
The package type is a housing for mounting a semiconductor integrated circuit chip, and plays a role of mounting, fixing, sealing, and protecting the chip. The integrated circuit requires heating during assembly and maintenance. Over-high temperature can cause the chip to crack, and further damage electronic components in the integrated circuit.
Disclosure of Invention
In order to overcome the problem that exists among the correlation technique, this disclosure provides a circuit board maintenance tool.
According to a first aspect of the embodiments of the present disclosure, a circuit board maintenance jig is provided, which includes a jig body for mounting the circuit board, the jig body is connected to an airflow driving mechanism, and the airflow driving mechanism drives an airflow in the jig body to flow;
the maintenance jig for the circuit board further comprises an airflow channel formed inside the jig body and an air vent formed in the jig body, wherein the air vent is communicated with the airflow channel, and the jig body is communicated with the airflow driving mechanism through the airflow channel;
and in the mounting state, the vent hole is arranged corresponding to the circuit board.
Optionally, the maintenance jig for the circuit board further comprises a containing groove formed in the jig body, and the vent hole is arranged on the bottom wall of the containing groove;
the accommodating groove is used for accommodating the circuit board.
Optionally, the airflow channel includes a first channel, the first channel extends along a first direction of the jig body, the vent hole includes a plurality of first air holes formed in a bottom wall of the receiving groove, and the plurality of first air holes are communicated with the first channel; in the mounting state, the first surface of the circuit board is in contact connection with the bottom wall of the accommodating groove; and/or the presence of a gas in the gas,
the air flow channel further comprises a second channel, the second channel extends along a second direction of the jig body, the vent hole further comprises a plurality of second air holes formed in the bottom wall of the accommodating groove, and the plurality of second air holes are communicated with the second channel; in the mounting state, the second surface of the circuit board is in contact connection with the bottom wall of the accommodating groove;
wherein the first direction and the second direction are the same or different.
Optionally, the airflow drive mechanism comprises a positive pressure drive unit or a negative pressure drive unit.
Optionally, the positive pressure driving unit comprises a positive pressure driving part and a first pipeline, and the positive pressure driving part is communicated with the airflow channel through the first pipeline;
the positive pressure driving part drives the airflow to flow from the outside of the jig body to the airflow channel and further flow to the surface of the circuit board through the vent hole.
Optionally, the negative pressure driving unit comprises a negative pressure driving part and a second pipeline, and the negative pressure driving part is communicated with the airflow channel through the second pipeline;
the negative pressure driving part drives the airflow to flow from the vent hole into the airflow channel and further flow to the outside of the jig body.
Optionally, the airflow driving mechanism further comprises an airflow adjusting unit;
the air flow adjusting unit is arranged between the positive pressure driving unit and the air flow channel; or the like, or, alternatively,
the air flow adjusting unit is arranged between the negative pressure driving unit and the air flow channel.
Optionally, the circuit board maintenance jig further comprises a limiting structure arranged on the jig body, and in an installation state, the limiting structure is connected with the circuit board to limit the circuit board to move relative to the jig body.
Optionally, the limiting structure comprises a plurality of limiting parts and a plurality of fasteners, and the limiting parts are detachably mounted on the jig body through the fasteners.
Optionally, the jig body includes a first body forming the airflow channel, and a second body cooperating with the first body to seal the airflow channel, and the second body is detachably connected to the first body.
Optionally, the jig body is made of a synthetic stone material.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects: the air vent is communicated with the air flow channel, the jig body is communicated with the air flow driving mechanism through the air flow channel, when the air flow driving mechanism drives the air flow in the air flow channel to pass through the air vent, the heat on the surface of the circuit board is taken away, and the surface temperature of the circuit board is effectively reduced.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic view of a circuit board maintenance jig in the related art.
Fig. 2 is a schematic diagram of a circuit board maintenance jig in an exemplary embodiment.
Fig. 3 is a schematic diagram of a circuit board maintenance fixture in an exemplary embodiment.
Fig. 4 is a schematic view of a jig body in an exemplary embodiment.
Fig. 5 is a schematic view of a first body in an exemplary embodiment.
Fig. 6 is a schematic view of a first body in an exemplary embodiment.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.
In order to increase the stability of the chip in the circuit board, a filling adhesive layer is usually disposed at the bottom of the chip for protecting the solder balls and the solder joints after the chip is soldered in the circuit board. The disassembly and the welding of the circuit board need to be heated, and the filling adhesive layer at the bottom of the chip is heated to expand, so that the tin crack of the chip is easily caused, and the hidden trouble is increased.
In the related art, the circuit board is usually placed on a jig, and the jig can assist a maintenance worker in disassembling electronic components on the circuit board or soldering the electronic components on the circuit board. Enough space is reserved on the jig for heat dissipation of the circuit board.
In one example, as shown in fig. 1, the jig includes a jig body 1 ', and a supporting region 11' and a heat dissipation region 12 'are provided on the jig body 1'. The supporting region 1 ' is used for supporting the circuit board, the heat dissipation region 12 ' includes a through hole penetrating through the jig body 1 ', and the circuit board and the through hole are arranged correspondingly in the installation state. When the maintenance personnel utilize the hot-blast rifle to heat for the circuit board, the air of filling glue film department chip periphery realizes the transmission of natural convection through the through-hole, makes the chip cooling. And the air around the chip at the position of the filling adhesive layer is not enough to effectively transfer heat only by a natural convection mode, and the chip still has the problem of tin cracking due to the expansion of the filling adhesive layer when heated.
The utility model provides a circuit board maintenance tool to fixed circuit board, supplementary maintenance personal maintains the circuit board. The circuit board maintenance jig comprises a jig body for mounting the circuit board, wherein the jig body is used for limiting the movement of the circuit board and ensuring the normal operation of maintenance work. The jig body is connected with the air flow driving mechanism, and the air flow driving mechanism drives the air flow in the jig body to flow. The maintenance jig for the circuit board further comprises an airflow channel formed inside the jig body and an air vent formed in the jig body. The air vent is communicated with the airflow channel, and the jig body is communicated with the airflow driving mechanism through the airflow channel. In the installation state, the vent hole is arranged corresponding to the circuit board, and when airflow in the airflow channel passes through the vent hole, the heat on the surface of the circuit board is taken away, so that the surface temperature of the circuit board is effectively reduced.
In an exemplary embodiment, as shown in fig. 2 and 4, a circuit board maintenance tool, such as a BGA (Ball Grid Array), is provided to accommodate more pins, so that the circuit board has higher speed performance. The circuit board may have a regular rectangular shape or an irregular shape. The specific shape of the circuit board is subject to actual design and is not limited herein.
The circuit board maintenance jig comprises a jig body 1 for mounting a circuit board, and the jig body 1 is made of, for example, a synthetic stone material. The synthetic stone material has the characteristics of low heat conduction and high temperature resistance, so that the jig body 1 can still keep the capability of physical characteristics in a severe high-temperature environment. The jig body 1 is further connected with the airflow driving mechanism 2, and the airflow driving mechanism 2 drives the airflow in the jig body 1 to flow. The airflow driving mechanism 2 is matched with the jig body 1 made of synthetic stone materials, so that the heat dissipation effect of the circuit board can be further improved.
In this embodiment, referring to fig. 2, the current board maintenance jig further includes an airflow channel 11 formed inside the jig body 1, and a vent 12 formed in the jig body 1, wherein the vent 12 is communicated with the airflow channel 11, and the jig body 1 is communicated with the airflow driving mechanism through the airflow channel 11. In the mounted state, the vent hole 12 is provided corresponding to the circuit board. When the airflow driving mechanism 2 drives the airflow in the airflow channel 11 to flow, and the airflow passes through the vent hole 12, the airflow around the circuit board at the vent hole 12 is pushed to flow, so that the heat on the surface of the circuit board is driven, the surface temperature of the circuit board is reduced, and the electronic components in the circuit board are prevented from being damaged due to overhigh temperature of a welding point.
In the present embodiment, as still referring to fig. 2, the jig body 1 includes a first body 15 forming the air flow channel 11, and a second body 16 cooperating with the first body 15 to seal the air flow channel 11, and the second body 16 is detachably connected to the first body 15. The first body 15 and the second body 16 can be detachably connected through a sliding block (not shown in the figure) and a sliding groove (not shown in the figure), so that the operation is simple and the detachment is convenient. The first body 15 and the second body 16 can be connected through threads and screw holes, so that the sealing effect of the assembled airflow channel 11 is further improved, and the airflow is prevented from flowing out from a gap between the first body 15 and the second body 16 to influence the flowing effect of the airflow.
Here, it should be noted that the second body 16 and the first body 15 are not limited to the detachable connection manner, and the second body 16 and the first body 15 may also be integrally formed to ensure the integrity of the jig body 1 and further improve the sealing effect of the airflow channel 11.
In an exemplary embodiment, as shown in fig. 2-4, the maintenance jig for a circuit board further includes a receiving groove 13 formed in the jig body 1, and the receiving groove 13 is recessed in the jig body 1 along a height direction (refer to a Z-axis direction shown in fig. 2) of the jig body 1, for example. The shape of the receiving groove 13 is, for example, a rectangular shape or an irregular shape, and the specific shape of the receiving groove 13 is based on the shape of the circuit board, which is not limited herein.
In the present embodiment, referring to fig. 2 and 3, the accommodating groove 13 is used for accommodating a circuit board, and in the installation state, the circuit board is embedded in the accommodating groove 13, so that the circuit board is in contact connection with the groove bottom wall of the accommodating groove 13 and the groove side wall of the accommodating groove 13. The containing groove 13 can limit the movement of the circuit board along the extending direction of the jig body 1, and avoid the phenomenon that the circuit board shifts when being welded or disassembled, thereby influencing the normal operation of maintenance work. The extending direction of the jig main body 1 may be, for example, the longitudinal direction of the jig main body 1 (refer to the X-axis direction shown in fig. 2), or the extending direction of the jig main body 1 may be, for example, the width direction of the jig main body 1 (refer to the Y-axis direction shown in fig. 2).
In one example, as shown in fig. 3, when the receiving groove 13 is in a regular rectangular shape, the receiving groove 13 includes a first groove 131, and a shape of a groove profile of the first groove 131 is adapted to a shape of an outer profile of the circuit board. In the mounted state, the first surface of the circuit board is in contact connection with the bottom wall of the first groove 131, so that the second surface of the circuit board is exposed out of the jig body 1, and a maintenance worker can disassemble or weld the second surface of the circuit board. Of course, it is understood that the bottom wall of the first groove 131 may be in contact connection with the second surface of the circuit board, so that the maintenance personnel can perform the disassembling or welding process on the first surface of the circuit board. The first surface of the circuit board is opposite to the second surface of the circuit board.
In another example, as shown in fig. 2, when the receiving groove 13 has an irregular shape, the receiving groove 13 includes a first groove 131 and a second groove 132, and the first groove 131 and the second groove 132 are symmetrically disposed on the jig body 1. In the mounted state, the first surface of the circuit board is in contact with the bottom wall of the first groove 131, or the second surface of the circuit board is in contact with the bottom wall of the second groove 132.
In the implementation process, when the first surface of the circuit board needs to be soldered or disassembled, the second surface of the circuit board is mounted in the second groove 132, so that the first surface of the circuit board is exposed outside the second groove 132. When the second surface of the circuit board needs to be soldered or disassembled, the first surface of the circuit board is mounted in the first groove 131, so that the second surface of the circuit board is exposed outside the first groove 131.
When the accommodating groove 13 is irregular, the first groove 131 and the second groove 132 are provided to match with the first surface and the second surface of the circuit board, so that the jig body 1 can satisfy the maintenance procedures of different surfaces of the circuit board, and the convenience of the jig body 1 is improved.
It should be noted that the accommodating groove 13 is not limited to the first groove 131 and the second groove 132, the specific number of the accommodating grooves 13 is designed based on actual requirements, and the accommodating groove 13 may include both the accommodating grooves 13 with regular shapes and irregular shapes, so as to improve the universality of the accommodating groove 13 and meet the requirements of maintenance.
In this embodiment, referring to fig. 2, 4-6, the vent 12 is disposed on the bottom wall of the accommodating groove 13, the vent 12 penetrates through the bottom wall of the accommodating groove 13, and the airflow channel 11 is communicated with the vent 13 on the accommodating groove 13, so that the airflow can directly act on the surface of the circuit board through the vent 12, thereby improving the heat dissipation effect of the circuit board.
In one example, as shown in fig. 4 to 6, the airflow channel 11 includes a first channel 111, the first channel 111 extends along a first direction of the jig body 1, the vent 12 includes a plurality of first air holes 121 formed in the bottom wall of the receiving groove 13, and the plurality of first air holes 121 are communicated with the first channel 111. In the mounted state, the first surface of the circuit board is in contact connection with the bottom wall of the accommodating groove 13, so that the first air hole 121 can be arranged corresponding to the first surface of the circuit board, and the air flow of the first air hole 121 can act on the first surface of the circuit board to reduce the surface temperature of the circuit board.
Alternatively, as shown in fig. 4 to 6, the airflow channel 11 includes a second channel 112, the second channel 112 extends along the second direction of the jig body 1, the vent hole 12 includes a second air hole 122 formed in the bottom wall of the accommodating groove 13, and the plurality of second air holes 122 are communicated with the second channel 112. In the mounted state, the second surface of the circuit board is in contact connection with the bottom wall of the accommodating groove 13, so that the second air hole 122 can be arranged corresponding to the second surface of the circuit board, and the air flow of the second air hole 122 can act on the second surface of the circuit board to reduce the surface temperature of the circuit board.
In another example, as shown in fig. 4 to 6, the airflow passage 11 includes a first passage 111 and a second passage 112, and the vent hole 12 includes a plurality of first vent holes 121 formed in the bottom wall of the accommodating groove 13, and second vent holes 122 formed in the bottom wall of the accommodating groove 13. The first channel 111 extends along a first direction of the jig body 1, the first channel 111 is communicated with the plurality of first air holes 121, the second channel 112 extends along a second direction of the jig body 1, and the second channel 112 is communicated with the second air holes 122. The first channel 111 and the second channel 112 are not interfered with each other, so that the flowing effect of the air flow is improved, and the air flow at the vent hole 12 can be directly acted on the surface of the circuit board.
Wherein the first direction and the second direction are the same or different. The first channel 111 and the second channel 112 may extend in the longitudinal direction of the jig body 1 (see the X-axis direction shown in fig. 2) or in the width direction of the jig body 1 (see the Y-axis direction shown in fig. 2), for example. The first channel 111 may extend in the longitudinal direction of the jig body 1 (see the X-axis direction shown in fig. 2), and the second channel 112 may extend in the width direction of the jig body 1 (see the Y-axis direction shown in fig. 1). Of course, it is understood that the first channel 111 and the second channel 112 are not limited to the above extending manner, and the first channel 111 and the second channel 112 may have irregular shapes, particularly based on the actual design.
In an exemplary embodiment, as shown in fig. 2 and 4, the airflow driving mechanism 2 includes a positive pressure driving unit 21, the positive pressure driving unit 21 includes a positive pressure driving portion 211 and a first pipe 212, a connection through hole 14 communicating with the airflow channel 11 is formed on the jig body 1, and the first pipe 212 is connected to the connection through hole 14, so that the positive pressure driving portion 211 communicates with the airflow channel 11 through the first pipe 212. The positive pressure driving part 211 is, for example, an air pump, and the positive pressure driving part 211 drives the air flow to flow into the air flow channel 11 from the outside of the jig body 1, and then flows to the surface of the circuit board through the vent hole 12, takes away the heat on the surface of the circuit board, and reduces the surface temperature of the circuit board. The positive pressure driving part 211 directly drives the air flow to the air flow channel 11, so that a positive pressure state is formed in the air flow channel 11, the continuous air flow enters the air flow channel 11, the air flow in the air flow channel 11 is pushed out from the air flow channel 11 to the outside of the jig body 1 through the vent hole 12, the heat on the surface of the circuit board is taken away by the air flow at the vent hole 12, the problem that the filling adhesive layer in the circuit board is expanded due to heating is avoided, and the chip in the circuit board is further protected.
Wherein, the airflow driving mechanism 2 further comprises an airflow adjusting unit 23, and the airflow adjusting unit 23 is arranged between the positive pressure driving unit 21 and the airflow channel 11. The airflow adjusting unit 23 is disposed on the first duct 212, for example, and the throughput of the airflow in the first duct 212 is changed by the airflow adjusting unit 23 to adjust the flow rate of the airflow, so as to avoid that the flow rate of the airflow in the airflow channel 11 is too large or too small, which affects the airflow flowing effect at the circuit board.
In an exemplary embodiment, as shown in fig. 2 and 4, the airflow drive mechanism 2 includes a negative pressure drive unit 22, the negative pressure drive unit 22 includes a negative pressure drive portion 221 and a second duct 222, and the negative pressure drive portion 221 communicates with the airflow passage 11 through the second duct 222. The negative pressure driving part 221 includes, for example, an air pump 2211 and a vacuum generator 2212, and the air pump 2211 and the vacuum generator 2212 of the negative pressure driving part 221 operate to drive the air flow to flow from the vent hole 12 into the air flow channel 11 and further to flow to the outside of the jig body 1. The air pump 2211 and the vacuum generator 2212 work to pump out the air flow in the air flow channel 11, so that a negative pressure state is formed in the air flow channel 11, the air flow outside the jig body 1 enters the air flow channel 11 through the air vent 12, the air flow at the air vent 12 flows to take away the heat on the surface of the circuit board, the temperature of the circuit board is prevented from being too high, and the electronic components in the circuit board are further damaged.
Wherein, the airflow driving mechanism 2 further comprises an airflow adjusting unit 23, and the airflow adjusting unit 23 is arranged between the negative pressure driving unit 22 and the airflow channel 11. The airflow adjusting unit 23 is disposed on the second duct 222, for example, and the throughput of the airflow in the second duct 222 is changed by the airflow adjusting unit 23 to adjust the flow rate of the airflow, so as to avoid that the flow rate of the airflow at the vent 12 is too large or too small, which affects the airflow flowing effect at the circuit board.
Here, it should be noted that the positive pressure driving unit 211 and the negative pressure driving unit 221 in the above embodiment may be switched by themselves. For example, the vacuum generator 2212 of the negative pressure driving part 221 may be detachably disposed between the air pump 2211 and the second duct 222. When the air flow driving mechanism 2 drives the air flow in the air flow path 11 in the form of positive pressure, the vacuum generator 2212 can be detached, and the air pump 2211 is directly connected to the second duct 222 to form the positive pressure driving portion 211. When the air flow driving mechanism 2 drives the air flow in the air flow path 11 in the form of negative pressure, a vacuum generator 2212 may be fitted between the air pump 2211 and the second duct 222 to form the negative pressure driving portion 221. The positive pressure driving part 211 and the negative pressure driving part 221 share the air pump and the pipeline, so that the air pump and the pipeline are convenient to disassemble and assemble and free to switch, materials are saved, and the operation cost of maintenance is effectively reduced.
In an exemplary embodiment, as shown in fig. 2 and 3, the circuit board maintenance jig further includes a limiting structure 4 disposed on the jig body 1, and in an installation state, the limiting structure 4 is connected to the circuit board to limit the circuit board from moving relative to the jig body 1. The phenomenon that the circuit board shifts in the disassembling and welding processes is avoided, and the normal operation of disassembling and welding is guaranteed.
In one example, the limiting structure 4 includes a plurality of glues (not shown in the figure), and the limiting structure 4 is bonded to the circuit board and the jig body 1, respectively, so that the circuit board is fixed on the jig body 1. Wherein, limit structure 4's colloid is weak colloid, avoids viscidity too big, damages the circuit board.
In another example, as shown in fig. 2, the limiting structure 4 includes, for example, a plurality of limiting portions 41 and a plurality of fastening members 42, and the limiting portions 41 correspond to the fastening members 42 one to one. The jig main body 1 is provided with a plurality of screw holes (not shown), and the stopper portion 41 is detachably mounted in the screw holes of the jig main body 1 by fasteners 42.
The position-limiting portion 41 is, for example, a pressing plate structure, the fastening member 42 is a fastening screw, and the fastening member 42 penetrates through the position-limiting portion 41 and is screwed with the screw hole. The surface of the circuit board is pressed by the partial structure of the limiting portion 41 to limit the movement of the circuit board along the depth direction (refer to the Z-axis direction shown in fig. 2) of the jig body 1, so that the circuit board is ensured to be stably installed in the accommodating groove 13, and the circuit board is prevented from shaking during maintenance.
Here, it should be noted that the limiting structure 4 presses the circuit board not to be too tight, so that a gap may be formed between the circuit board and the accommodating groove 13. When the airflow driving mechanism 2 drives the airflow in the airflow passage 11 to flow, the airflow may flow out of the vent hole 12 or into the vent hole 12 through the gap between the circuit board and the receiving groove 13. In the mounted state, the limiting structure 4 and the accommodating groove 13 can be matched together to limit the movement of the circuit board.
In this embodiment, referring to fig. 4, the circuit board maintenance jig further includes a plurality of adjusting screw buttons 17 disposed on the jig body 1, and the adjusting screw buttons 17 are disposed on opposite sides of the accommodating groove 13 of the jig body 1 and are uniformly distributed on the jig body 1 to support the jig body 1. When tool body 1 was arranged in the platform of unevenness, can adjust adjusting screw button 17 to guarantee tool body 1's stability, avoid tool body 1 to appear the phenomenon of rocking because of the platform unevenness.
The utility model provides a circuit board maintenance tool, airflow channel communicates with air vent and air current actuating mechanism respectively. When the heat gun heats the circuit board, the airflow driving mechanism drives the airflow in the airflow channel to push the airflow at the circuit board of the vent hole to flow, so that the circuit board is quickly cooled. Meanwhile, the airflow adjusting unit is shifted to adjust the flow rate of the airflow so as to change the cooling speed of the circuit board, and the parameters of the airflow are determined according to the positions and the sizes of the filling adhesive layers of different electrical appliances, so that the energy consumption is reduced, the danger of adhesive explosion is reduced, the circuit board is further protected, and the tin crack of a chip in the circuit board is avoided.
In addition, this circuit board maintenance tool that openly provides sets up the air vent partially, cools down to the assigned position of circuit board, promotes the cooling effect, improves maintenance efficiency, reduces the maintenance and the change frequency of circuit board, practices thrift the cost.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the embodiments disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.
Claims (11)
1. A circuit board maintenance jig is characterized by comprising a jig body for mounting a circuit board, wherein the jig body is connected with an air flow driving mechanism, and the air flow driving mechanism drives air flow in the jig body to flow;
the maintenance jig for the circuit board further comprises an airflow channel formed inside the jig body and an air vent formed in the jig body, wherein the air vent is communicated with the airflow channel, and the jig body is communicated with the airflow driving mechanism through the airflow channel;
and in the mounting state, the vent hole is arranged corresponding to the circuit board.
2. The tool of claim 1, further comprising a receiving groove formed in the tool body, wherein the vent hole is disposed on a bottom wall of the receiving groove;
the accommodating groove is used for accommodating the circuit board.
3. The apparatus of claim 2, wherein the airflow channel comprises a first channel extending along a first direction of the fixture body, the vent hole comprises a plurality of first air holes formed on a bottom wall of the receiving groove, and the plurality of first air holes are communicated with the first channel; in the mounting state, the first surface of the circuit board is in contact connection with the bottom wall of the accommodating groove; and/or the presence of a gas in the gas,
the air flow channel further comprises a second channel, the second channel extends along a second direction of the jig body, the vent hole further comprises a plurality of second air holes formed in the bottom wall of the accommodating groove, and the plurality of second air holes are communicated with the second channel; in the mounting state, the second surface of the circuit board is in contact connection with the bottom wall of the accommodating groove;
wherein the first direction and the second direction are the same or different.
4. The apparatus of claim 1, wherein the airflow driving mechanism comprises a positive pressure driving unit or a negative pressure driving unit.
5. The circuit board maintenance jig according to claim 4, wherein the positive pressure driving unit includes a positive pressure driving portion and a first pipe, the positive pressure driving portion being communicated with the airflow channel through the first pipe;
the positive pressure driving part drives the airflow to flow from the outside of the jig body to the airflow channel and further flow to the surface of the circuit board through the vent hole.
6. The circuit board maintenance jig according to claim 4, wherein the negative pressure driving unit includes a negative pressure driving portion and a second duct, the negative pressure driving portion being communicated with the airflow channel through the second duct;
the negative pressure driving part drives the airflow to flow from the vent hole into the airflow channel and further flow to the outside of the jig body.
7. The circuit board maintenance jig according to claim 4, wherein the airflow driving mechanism further includes an airflow adjusting unit;
the air flow adjusting unit is arranged between the positive pressure driving unit and the air flow channel; or the like, or, alternatively,
the air flow adjusting unit is arranged between the negative pressure driving unit and the air flow channel.
8. The apparatus as claimed in claim 1, further comprising a position-limiting structure disposed on the fixture body, wherein the position-limiting structure is connected to the circuit board to limit the circuit board from moving relative to the fixture body when the fixture is mounted.
9. The apparatus of claim 8, wherein the limiting structure comprises a plurality of limiting parts and a plurality of fastening members, and the limiting parts are detachably mounted on the jig body through the fastening members.
10. The apparatus as claimed in claim 1, wherein the apparatus body includes a first body forming the airflow channel and a second body cooperating with the first body to seal the airflow channel, and the second body is detachably connected to the first body.
11. The circuit board repairing jig according to claim 1, wherein the jig body is made of a synthetic stone material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110354857.3A CN113099614A (en) | 2021-03-31 | 2021-03-31 | Circuit board maintenance tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110354857.3A CN113099614A (en) | 2021-03-31 | 2021-03-31 | Circuit board maintenance tool |
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| Publication Number | Publication Date |
|---|---|
| CN113099614A true CN113099614A (en) | 2021-07-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110354857.3A Pending CN113099614A (en) | 2021-03-31 | 2021-03-31 | Circuit board maintenance tool |
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| CN (1) | CN113099614A (en) |
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| CN210225924U (en) * | 2019-05-07 | 2020-03-31 | 浙江精通自动控制技术有限公司 | Wave soldering jig |
| CN111010819A (en) * | 2019-12-17 | 2020-04-14 | 北京无线电计量测试研究所 | Printed board mounting die and method |
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| US6347734B1 (en) * | 2000-03-27 | 2002-02-19 | Emc Corporation | Methods and apparatus for installing a module on a circuit board using heating and cooling techniques |
| CN2686277Y (en) * | 2003-12-29 | 2005-03-16 | 技嘉科技股份有限公司 | Circuit board ripple welding tool |
| CN202411612U (en) * | 2011-12-19 | 2012-09-05 | 株洲南车时代电气股份有限公司 | Wave-soldering jig |
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