CN113092870B - Glue performance parameter testing method - Google Patents
Glue performance parameter testing method Download PDFInfo
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- CN113092870B CN113092870B CN202110243584.5A CN202110243584A CN113092870B CN 113092870 B CN113092870 B CN 113092870B CN 202110243584 A CN202110243584 A CN 202110243584A CN 113092870 B CN113092870 B CN 113092870B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
- G01R27/2617—Measuring dielectric properties, e.g. constants
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
- G01R27/2688—Measuring quality factor or dielectric loss, e.g. loss angle, or power factor
- G01R27/2694—Measuring dielectric loss, e.g. loss angle, loss factor or power factor
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Abstract
The invention discloses a method for testing performance parameters of glue, which comprises the following steps of obtaining a sample to be tested, wherein the sample to be tested comprises an antenna stratum, a glue layer to be tested, a PCB medium layer and a circuit layer which are sequentially stacked from bottom to top, the circuit layer comprises a resonant ring, and the thickness of the glue layer to be tested is equal to that of the PCB medium layer; according to a formula
Calculating to obtain the average dielectric constant DK _ ave of the adhesive layer to be detected and the PCB medium layer; according to a formula
And calculating to obtain the dielectric constant DK of the adhesive layer to be detected. The test method can test the performance parameters of the glue with low cost, in particular the performance parameters of the glue under the millimeter wave frequency band.
Description
Technical Field
The invention relates to a method for testing performance parameters of glue.
Background
For 5G millimeter wave antenna modules, the industry chooses to combine the rf chip and the substrate antenna to form an AIP (package antenna) to reduce the rf system loss, and thus the integration level is higher and the performance is more excellent. The AIP composed of the dielectric resonator antenna module is an excellent solution because the number of required PCB layers is greatly reduced compared with the number of substrate layers of the prior AIP, and the AIP has high processing precision and low cost.
However, the dielectric resonator antenna still needs to integrate 2-3 layers of PCB boards for matching and interconnection, and the PCB boards are usually connected and fixed by using an adhesive method. For the dielectric constant (DK) and the dielectric loss (DF) of glue under different frequencies, a glue manufacturer only provides the DK and the DF with extremely low frequency such as 10KHz, on one hand, a tester is expensive for a millimeter wave frequency band, on the other hand, the glue can be adhered to a measuring instrument and cannot be directly measured, and the DK and the DF of the glue when the glue works in the millimeter wave frequency band are difficult to provide by the manufacturer due to the factors.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the method is particularly suitable for testing the dielectric constant of the glue working in a millimeter wave frequency band.
In order to solve the technical problems, the invention adopts the technical scheme that: the method for testing the performance parameters of the glue comprises the following steps,
obtaining a sample to be tested, wherein the sample to be tested comprises an antenna stratum, a glue layer to be tested, a PCB medium layer and a circuit layer which are sequentially stacked from bottom to top, the circuit layer comprises a resonant ring, and the thickness of the glue layer to be tested is equal to that of the PCB medium layer;
resonant frequency f of resonant ring for testing sample to be tested0；
According to the formula
Calculating to obtain effective dielectric constant xieffAnd C represents the speed of light;
according to the formula
Calculating the effective width W of the resonant ringeffH represents the thickness of the glue layer to be measured, W represents the actual line width of the resonance ring, and t represents the thickness of the resonance ring;
according to a formula
Calculating to obtain the average dielectric constant DK _ ave of the adhesive layer to be detected and the PCB medium layer;
according to a formula
Calculating to obtain the dielectric constant DK of the adhesive layer to be measured, wherein DK _ PCB represents the adhesive layer to be measuredAnd the dielectric constant of the PCB dielectric layer.
The invention has the beneficial effects that:
the test method can test the performance parameters of the glue with low cost, in particular the performance parameters of the glue under the millimeter wave frequency band.
Because the resonance ring is arranged on the PCB dielectric layer, the processing precision is high, the consistency error is small, and the testing precision can be effectively improved.
If the resonance ring is directly placed on the adhesive layer to be tested, a plurality of problems such as serious alignment error, impedance change caused by surface oxidation of the resonance ring, deflection of the resonance ring, hand touch damage of the resonance ring and the like can occur, and the testing and simulation error is larger, so that the testing method has the advantage of more accurate and credible testing result.
Drawings
FIG. 1 is a side view of a sample to be tested according to one embodiment of the present invention;
fig. 2 is a top view of a circuit layer in a sample to be tested according to a first embodiment of the invention.
Description of reference numerals:
1. an antenna formation;
2. a glue layer to be tested;
3. a PCB medium layer;
4. a circuit layer; 41. a resonant ring; 42. a microstrip line; 43. and a radio frequency connector.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
The most key concept of the invention is as follows: and (3) utilizing the resonant ring and combining a single-layer PCB (printed Circuit Board) process to manufacture a test sample, detecting the test sample, and calculating the performance parameters of the to-be-detected glue layer according to the detection result.
Referring to fig. 1 and 2, the method for testing the performance parameters of glue comprises the following steps,
obtaining a sample to be tested, wherein the sample to be tested comprises an antenna stratum 1, a glue layer 2 to be tested, a PCB medium layer 3 and a circuit layer 4 which are sequentially stacked from bottom to top, the circuit layer 4 comprises a resonant ring 41, and the thickness of the glue layer 2 to be tested is equal to that of the PCB medium layer 3;
resonant frequency f of resonant ring 41 for testing sample to be tested0；
According to the formula
Calculating to obtain effective dielectric constant xieffAnd C represents the speed of light;
according to the formula
Calculating the effective width W of the resonant ring 41effH represents the thickness of the adhesive layer 2 to be measured, W represents the actual line width of the resonance ring 41, and t represents the thickness of the resonance ring 41;
according to a formula
Calculating to obtain the average dielectric constant DK _ ave of the adhesive layer 2 to be tested and the PCB medium layer 3;
according to a formula
And calculating to obtain the dielectric constant DK of the glue layer 2 to be tested, wherein DK _ PCB represents the dielectric constant of the PCB medium layer 3.
From the above description, the beneficial effects of the present invention are:
the test method can test the performance parameters of the glue with low cost, in particular the performance parameters of the glue under the millimeter wave frequency band.
Because the resonant ring 41 is arranged on the PCB dielectric layer 3, the processing precision is high, the consistency error is small, and the testing precision and the accuracy of the glue dielectric constant can be effectively improved.
Further according to the formula
Calculating to obtain total loss tot _ loss, wherein La represents the loss obtained by testingInsertion loss of the resonant ring 41, BW denotes a resonant ring 3dB bandwidth;
calculating to obtain the average dielectric loss DF _ ave of the glue layer 2 to be measured and the PCB dielectric layer 3 according to a calculation formula DF _ ave, wherein rad _ loss represents the radiation loss of the resonance ring 41, and metal _ loss represents the metal loss of the resonance ring 41;
according to a formula
And calculating to obtain the dielectric loss DF of the glue layer 2 to be detected, wherein the DF _ PCB represents the dielectric loss of the PCB dielectric layer 3.
From the above description, the dielectric loss DF of the glue layer 2 to be measured can be obtained by simple calculation.
Further, the manufacturing step of the sample to be tested comprises,
obtaining a single-layer PCB and an antenna stratum 1, wherein the single-layer PCB comprises a PCB dielectric layer 3 and a PCB metal layer arranged on the surface of one side of the PCB dielectric layer 3;
etching the single-layer PCB to form the circuit layer 4 on the PCB metal layer;
and adhering the antenna ground layer 1 to one side of the PCB dielectric layer 3 far away from the PCB metal layer by using the glue layer 2 to be detected.
From the above description, the sample to be measured is easy to manufacture and has high processing precision.
Further, the thickness of the PCB dielectric layer 3 is 0.1-0.2 mm.
As can be seen from the above description, the thickness of the dielectric layer 3 of the PCB is suitable. The thicker the thickness of the PCB dielectric layer 3 is, the wider the line width requirement of the test transmission line is, but the transmission line width required by the millimeter wave radio frequency connector on the market is limited, so the thickness requirement of the PCB dielectric is thinner.
Further, the circuit layer 4 further includes a microstrip line 42 connected to the resonant ring 41.
Furthermore, the number of the microstrip lines 42 is two, the two microstrip lines 42 are arranged in a collinear manner, and the resonant ring 41 is located between the two microstrip lines 42.
Further, the circuit layer 4 further includes a radio frequency connector 43 connected to the microstrip line 42, where the radio frequency connector 43 is located at one end of the microstrip line 42, which is far away from the resonant ring 41.
As can be seen from the above description, the microstrip line 42 and the rf connector 43 are used to facilitate the testing of the resonant ring 41.
Furthermore, the antenna ground layer 1 is parallel to the PCB dielectric layer 3.
From the above description, it is beneficial to improve the accuracy of the test result by the antenna ground layer 1 being parallel to the PCB dielectric layer 3.
Further, the projection area of the antenna ground layer 1 is completely overlapped with the projection area of the PCB dielectric layer 3 along the thickness direction projection of the test sample.
Example one
Referring to fig. 1 and fig. 2, a first embodiment of the present invention is: the method for testing the performance parameters of the glue comprises the following steps,
obtaining a sample to be detected, wherein the sample to be detected comprises an antenna stratum 1, a glue layer 2 to be detected, a PCB medium layer 3 and a circuit layer 4 which are sequentially stacked from bottom to top; the circuit layer 4 includes a resonant ring 41, microstrip lines 42 and a radio frequency connector 43, two ends of the microstrip lines 42 are respectively connected to the resonant ring 41 and the radio frequency connector 43, specifically, the number of the microstrip lines 42 is two, the two microstrip lines 42 are arranged in a collinear manner, and the resonant ring 41 is located between the two microstrip lines 42; the thickness of the glue layer 2 to be tested is equal to that of the PCB medium layer 3, preferably, the thickness of the PCB medium layer 3 is 0.1-0.2mm, and further preferably, the thickness of the PCB medium layer 3 is 0.1mm or 0.2 mm; the antenna ground layer 1 is parallel to the PCB dielectric layer 3, so that the circuit layer 4 can be kept parallel to the glue layer 2 to be tested to avoid the circuit layer 4 from deflecting relative to the glue layer 2 to be tested to cause inaccurate test results. In detail, the projection area of the antenna ground layer 1 and the projection area of the PCB dielectric layer 3 are completely overlapped by projecting along the thickness direction of the test sample. In this embodiment, the material of the antenna ground layer 1 is copper.
For testing samples to be testedResonant frequency f of the resonant ring 410；
According to formula (I)
Calculating to obtain effective dielectric constant xieffAnd C represents the speed of light;
next, a calculation process of the dielectric constant DK of the adhesive layer 2 to be measured is described first, and then a calculation process of the dielectric loss DF of the adhesive layer 2 to be measured is described.
The calculation process of the dielectric constant DK of the glue layer 2 to be measured is as follows:
according to the formula (II)
Calculating the effective width W of the resonant ring 41effH represents the thickness of the adhesive layer 2 to be measured, W represents the actual line width of the resonance ring 41, and t represents the thickness of the resonance ring 41;
and because of xieffIs calculated as
Therefore, the formula (I) can be derived according to the above formulas (I), (II) and (III)
According to the derived calculation formula (I)
The average dielectric constant DK _ ave of the adhesive layer 2 to be tested and the PCB dielectric layer 3 can be obtained through calculation;
according to the calculation formula (II)
The dielectric constant DK of the glue layer 2 to be tested can be obtained through calculation, the DK _ PCB represents the dielectric constant of the PCB medium layer 3, and the DK _ PCB is provided by a manufacturer of the PCB medium layer 3.
The calculation process of the dielectric constant DF of the glue layer 2 to be measured is as follows:
according to formula (IV)
Calculating to obtain total loss tot _ loss, wherein the unit of the total loss tot _ loss is dB/cm; la represents the insertion loss of the resonance ring 41 obtained by the test; BW denotes the resonant ring 3dB bandwidth in GHz.
According to a calculation formula (three), calculating to obtain an average dielectric loss DF _ ave of the glue layer 2 to be measured and the PCB dielectric layer 3, wherein rad _ loss represents the radiation loss of the resonance ring 41, and metal _ loss represents the metal loss of the resonance ring 41, and because the radiation loss of the resonance ring 41 and the metal loss of the resonance ring 41 are both small, the radiation loss of the resonance ring 41 and the metal loss of the resonance ring 41 can be directly simulated by simulation software to obtain corresponding results;
according to the calculation formula (IV)
The dielectric loss DF of the glue layer 2 to be tested can be obtained through calculation, and the DF _ PCB represents the dielectric loss of the PCB dielectric layer 3.
In this embodiment, the step of preparing the sample to be tested includes,
obtaining a single-layer PCB and an antenna stratum 1, wherein the single-layer PCB comprises a PCB dielectric layer 3 and a PCB metal layer arranged on the surface of one side of the PCB dielectric layer 3;
etching the single-layer PCB to form the circuit layer 4 on the PCB metal layer;
and adhering the antenna ground layer 1 to one side of the PCB dielectric layer 3 far away from the PCB metal layer by using the glue layer 2 to be detected.
As can be readily appreciated, different resonant frequencies f0Corresponding to the resonant rings 41 with different calibers, therefore, before the test sample is manufactured, the calibers of the resonant rings 41 need to be designed, and a glue manufacturer can provide the dielectric constant DK of the glue under the low-frequency working conditionLow frequencyThe actual line of the resonant ring 41 can be obtained by combining the data with the equations (one), (two) and (three)Width WDesign ofThe designer can use the result to design the aperture of the resonating ring 41. Specifically, the method comprises the following steps:
assuming that the designer intends to design a resonant ring corresponding to 10GHz, equation (one) is transformed into
The formula (III) is modified into
The formula (II) is modified into
Therefore, the actual line width W of the resonance ring corresponding to the 10GHz working frequency point can be calculatedDesign of. Note that, W is the same asDesign ofThe result of (1) is only the estimated data, and therefore, when the actual test is performed, the resonance frequency f of the resonance ring of the sample to be tested0Actual testing is required.
In conclusion, the glue performance parameter testing method provided by the invention is low in implementation cost, high in testing precision and accurate in testing result, and is particularly suitable for DK data and DF data of glue under a millimeter wave frequency band.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (9)
1. The glue performance parameter testing method is characterized by comprising the following steps: comprises the following steps of (a) carrying out,
obtaining a sample to be tested, wherein the sample to be tested comprises an antenna stratum, a glue layer to be tested, a PCB medium layer and a circuit layer which are sequentially stacked from bottom to top, the circuit layer comprises a resonant ring, and the thickness of the glue layer to be tested is equal to that of the PCB medium layer;
resonant frequency f of resonant ring for testing sample to be tested0；
According to the formula
Calculating to obtain effective dielectric constant xieffAnd C represents the speed of light;
according to the formula
Calculating the effective width W of the resonant ringeffH represents the thickness of the glue layer to be measured, W represents the actual line width of the resonance ring, and t represents the thickness of the resonance ring;
according to a formula
Calculating to obtain the average dielectric constant DK _ ave of the adhesive layer to be detected and the PCB medium layer;
according to a formula
And calculating to obtain the dielectric constant DK of the glue layer to be detected, wherein DK _ PCB represents the dielectric constant of the PCB medium layer.
2. The method for testing the performance parameters of the glue according to claim 1, characterized in that: according to the formula
Calculating to obtain total loss tot _ loss, wherein La represents insertion loss of the resonant ring obtained through testing, and BW represents 3dB bandwidth of the resonant ring;
calculating to obtain the average dielectric loss DF _ ave of the glue layer to be measured and the PCB medium layer according to a calculation formula DF _ ave, wherein rad _ loss represents the radiation loss of the resonance ring, and metal _ loss represents the metal loss of the resonance ring;
according to a formula
Calculating to obtain the dielectric loss DF and DF-PCB expression of the glue layer to be detectedAnd dielectric loss of the PCB dielectric layer.
3. The method for testing the performance parameters of the glue according to claim 1, characterized in that: the manufacturing steps of the sample to be tested comprise,
obtaining a single-layer PCB and an antenna stratum, wherein the single-layer PCB comprises a PCB dielectric layer and a PCB metal layer arranged on the surface of one side of the PCB dielectric layer;
etching the single-layer PCB to form the circuit layer on the PCB metal layer;
and adhering the antenna ground layer to one side of the PCB dielectric layer far away from the PCB metal layer by using a glue layer to be tested.
4. The method for testing the performance parameters of the glue according to claim 1, characterized in that: the thickness of the PCB dielectric layer is 0.1-0.2 mm.
5. The method for testing the performance parameters of the glue according to claim 1, characterized in that: the line layer further comprises a microstrip line connected with the resonant ring.
6. The method for testing the performance parameters of the glue according to claim 5, wherein: the number of the microstrip lines is two, the two microstrip lines are arranged in a collinear way, and the resonance ring is positioned between the two microstrip lines.
7. The method for testing the performance parameters of the glue according to claim 5, wherein: the circuit layer further comprises a radio frequency connector connected with the microstrip line, and the radio frequency connector is located at one end, far away from the resonant ring, of the microstrip line.
8. The method for testing the performance parameters of the glue according to claim 1, characterized in that: the antenna stratum is parallel to the PCB dielectric layer.
9. The method for testing the performance parameters of the glue according to claim 1, characterized in that: and projecting along the thickness direction of the sample to be detected, wherein the projection area of the antenna stratum is completely overlapped with the projection area of the PCB dielectric layer.
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Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4634963A (en) * | 1983-09-21 | 1987-01-06 | The Boeing Company | Method and apparatus for the testing of dielectric materials |
| US6496018B1 (en) * | 1998-09-25 | 2002-12-17 | Oji Paper Co., Ltd. | Method and device for measuring dielectric constant |
| CN101147072A (en) * | 2005-03-23 | 2008-03-19 | 日本电气株式会社 | Resonator, printed board, and method for measuring complex dielectric constant |
| CN102353847A (en) * | 2011-07-08 | 2012-02-15 | 山东大学 | Method for measuring dielectric constant of underground double-layer medium and system thereof |
| CN102650661A (en) * | 2012-04-27 | 2012-08-29 | 北京京东方光电科技有限公司 | Measurement system for semi-conducting film |
| CN105445563A (en) * | 2015-12-17 | 2016-03-30 | 中国航天科工集团八五一一研究所 | Device and method for measuring parameters of BST ceramic in X waveband |
| CN107057098A (en) * | 2016-12-30 | 2017-08-18 | 广东生益科技股份有限公司 | For the pre-preg material of circuit substrate, laminate, preparation method and printed circuit board comprising it |
| CN107678067A (en) * | 2017-08-30 | 2018-02-09 | 同济大学 | A kind of GPR dielectric constant predictor method of urban road underground hierarchy |
| CN109975325A (en) * | 2019-03-12 | 2019-07-05 | 电子科技大学 | A kind of millimere-wave band liquid crystal material test macro and method |
| CN111157802A (en) * | 2020-01-03 | 2020-05-15 | 西安交通大学 | Method for measuring microwave dielectric property of high-loss material by adopting electric field symmetric structure |
| CN111426885A (en) * | 2019-01-09 | 2020-07-17 | 华北电力大学（保定） | CSRR microstrip resonance sensor for measuring complex dielectric constant and application thereof |
-
2021
- 2021-03-05 CN CN202110243584.5A patent/CN113092870B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4634963A (en) * | 1983-09-21 | 1987-01-06 | The Boeing Company | Method and apparatus for the testing of dielectric materials |
| US6496018B1 (en) * | 1998-09-25 | 2002-12-17 | Oji Paper Co., Ltd. | Method and device for measuring dielectric constant |
| CN101147072A (en) * | 2005-03-23 | 2008-03-19 | 日本电气株式会社 | Resonator, printed board, and method for measuring complex dielectric constant |
| CN102353847A (en) * | 2011-07-08 | 2012-02-15 | 山东大学 | Method for measuring dielectric constant of underground double-layer medium and system thereof |
| CN102650661A (en) * | 2012-04-27 | 2012-08-29 | 北京京东方光电科技有限公司 | Measurement system for semi-conducting film |
| CN105445563A (en) * | 2015-12-17 | 2016-03-30 | 中国航天科工集团八五一一研究所 | Device and method for measuring parameters of BST ceramic in X waveband |
| CN107057098A (en) * | 2016-12-30 | 2017-08-18 | 广东生益科技股份有限公司 | For the pre-preg material of circuit substrate, laminate, preparation method and printed circuit board comprising it |
| CN107678067A (en) * | 2017-08-30 | 2018-02-09 | 同济大学 | A kind of GPR dielectric constant predictor method of urban road underground hierarchy |
| CN111426885A (en) * | 2019-01-09 | 2020-07-17 | 华北电力大学（保定） | CSRR microstrip resonance sensor for measuring complex dielectric constant and application thereof |
| CN109975325A (en) * | 2019-03-12 | 2019-07-05 | 电子科技大学 | A kind of millimere-wave band liquid crystal material test macro and method |
| CN111157802A (en) * | 2020-01-03 | 2020-05-15 | 西安交通大学 | Method for measuring microwave dielectric property of high-loss material by adopting electric field symmetric structure |
Non-Patent Citations (1)
| Title |
|---|
| 基于微带谐振法的介电常数无损伤测量;郭富祥等;《重庆邮电大学学报( 自然科学版)》;20170630;第29卷(第3期);346-350 * |
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