CN113084280A - Hardware surface polishing process - Google Patents
Hardware surface polishing process Download PDFInfo
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- CN113084280A CN113084280A CN202110414770.0A CN202110414770A CN113084280A CN 113084280 A CN113084280 A CN 113084280A CN 202110414770 A CN202110414770 A CN 202110414770A CN 113084280 A CN113084280 A CN 113084280A
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- 238000007517 polishing process Methods 0.000 title claims abstract description 20
- 238000005498 polishing Methods 0.000 claims abstract description 109
- 239000000843 powder Substances 0.000 claims abstract description 51
- 239000000463 material Substances 0.000 claims abstract description 43
- 239000000126 substance Substances 0.000 claims abstract description 19
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 17
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 17
- 230000005291 magnetic effect Effects 0.000 claims description 13
- 239000013013 elastic material Substances 0.000 claims description 11
- 238000004140 cleaning Methods 0.000 claims description 10
- 239000004005 microsphere Substances 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 9
- 239000003302 ferromagnetic material Substances 0.000 claims description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 230000007797 corrosion Effects 0.000 claims description 6
- 238000005260 corrosion Methods 0.000 claims description 6
- 239000003112 inhibitor Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000012943 hotmelt Substances 0.000 claims description 4
- 235000021355 Stearic acid Nutrition 0.000 claims description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- XIXADJRWDQXREU-UHFFFAOYSA-M lithium acetate Chemical compound [Li+].CC([O-])=O XIXADJRWDQXREU-UHFFFAOYSA-M 0.000 claims description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 3
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000008117 stearic acid Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 41
- 230000008439 repair process Effects 0.000 abstract description 17
- 230000007547 defect Effects 0.000 abstract description 8
- 238000001125 extrusion Methods 0.000 description 23
- 230000000994 depressogenic effect Effects 0.000 description 13
- 230000009471 action Effects 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000004043 dyeing Methods 0.000 description 6
- 238000000265 homogenisation Methods 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 230000005012 migration Effects 0.000 description 4
- 238000013508 migration Methods 0.000 description 4
- 238000012856 packing Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000002775 capsule Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000005389 magnetism Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000005426 magnetic field effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H3/00—Electrochemical machining, i.e. removing metal by passing current between an electrode and a workpiece in the presence of an electrolyte
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H11/00—Auxiliary apparatus or details, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H9/00—Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a hardware surface polishing process, belonging to the technical field of five-surface polishing, which can organically integrate a plurality of polishing modes innovatively, adopts a powder filling bag to extrude a filling material into a concave part of the hardware surface for temporary repair, carries out rough polishing by mechanical polishing after the repair is finished, eliminates the large-area convex defect and improves the polishing efficiency, after the mechanical polishing is finished, the chemical polishing is adopted to carry out the fine polishing on the convex defects, meanwhile, the concave parts are not affected, after the chemical polishing is finished, the concave part is leveled in an electrochemical polishing mode, compared with the existing single polishing mode, the invention integrates the advantages of three polishing modes, not only can strictly control the cost and improve the polishing efficiency, meanwhile, the interference to hardware is almost eliminated, and the overall and local polishing effect is obviously improved.
Description
Technical Field
The invention relates to the technical field of five-surface polishing, in particular to a hardware surface polishing process.
Background
Hardware refers to a tool obtained by processing and casting metals such as gold, silver, copper, iron, tin and the like, and is used for fixing things, processing things, decoration and the like, and polishing refers to a processing method for reducing the roughness of the surface of a workpiece by utilizing the action of machinery, chemistry or electrochemistry so as to obtain a bright and flat surface. The method is to carry out modification processing on the surface of a workpiece by using a polishing tool and abrasive particles or other polishing media.
Polishing does not improve the dimensional accuracy or geometric accuracy of the workpiece, but aims to obtain a smooth surface or a mirror surface gloss, and sometimes also serves to eliminate gloss (matting). Polishing wheels are commonly used as polishing tools. The polishing wheel is generally made of a laminate of a plurality of layers of canvas, felt or leather, both sides of which are clamped by metal disks, and the rim of which is coated with a polishing agent formed by uniformly mixing micro-powder abrasive and grease, etc.
Surface polishing can be classified into mechanical polishing, chemical polishing, and desmearing polishing, in which mechanical polishing is low in cost, but high in strength, and large-area polished surfaces are not uniform; although the chemical polishing is simple and quick to operate, the effect is poorer than that of electrolytic polishing; the electrolytic polishing has high cost and complex equipment, but the polishing effect is optimal, the polishing modes have advantages and disadvantages and are difficult to play the greatest role, and especially for hardware with large-area rough surfaces, the single polishing mode has poor effect.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the invention aims to provide a hardware surface polishing process, various polishing modes can be organically combined innovatively, the filling material is extruded into the concave part of the surface of the hardware by the powder filling bag for temporary repair, rough polishing is carried out by mechanical polishing after repair is finished, the large-area convex defect is eliminated, the polishing efficiency is improved, after the mechanical polishing is finished, the chemical polishing is adopted to carry out the fine polishing on the convex defects, meanwhile, the concave parts are not affected, after the chemical polishing is finished, the concave part is leveled in an electrochemical polishing mode, compared with the existing single polishing mode, the invention integrates the advantages of three polishing modes, not only can strictly control the cost and improve the polishing efficiency, meanwhile, the interference to hardware is almost eliminated, and the overall and local polishing effect is obviously improved.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
A hardware surface polishing process comprises the following steps:
s1, cleaning sundries on the surface of the hardware, and then washing the hardware clean by deionized water and drying the hardware;
s2, preheating the surface of the hardware to 80-120 ℃, filling the concave part of the surface of the hardware for multiple times by using a powder filling bag, and applying a magnetic field in the opposite direction of the powder filling bag;
s3, cooling and cleaning the surface of the hardware, and then mechanically polishing the surface of the hardware until a concave part can be observed;
s4, immersing the hardware in the polishing solution for chemical polishing for 10-20S, then taking out and washing the hardware, heating the hardware and cleaning the concave part by adopting a high-pressure air gun;
and S5, performing electrochemical polishing on the hardware, and flattening the concave part on the surface of the hardware.
Further, the powder filling bag in step S2 includes location roof, the deformable bag body and filling layer, location roof and the deformable bag body interconnect constitute sealed cavity bag body, the filling layer is connected in the deformable bag body and is kept away from the one end of location roof, and when the filling layer cladding was on the five gold surfaces, receive its heating back and melt to fill to the depressed part on five metals surface under the squeezing action, and accomplish the repair after the cooling solidification, can reduce the influence of mechanical polishing and chemical polishing in-process to the depressed part.
Furthermore, the positioning top plate is made of a hard material, the deformable bag body is made of an elastic material, the filling layer is made of a hot-melt material and chromium oxide micro powder in a mass ratio of 1:1 in a mixing mode, the chromium oxide micro powder has high strength, influences caused by mechanical polishing can be coped with, and meanwhile corrosion caused by chemical polishing can be avoided.
Furthermore, the particle size of the chromium oxide micro powder is 20-200 μm, and the chromium oxide micro powder is enough to fill and repair most of the depressed areas after dyeing treatment, and the position of the depressed areas can be displayed after dyeing treatment, even the characteristics of the depressed areas can be judged qualitatively according to the color area and the depth, so that the method has a prompt effect on the subsequent polishing mode.
Further, location roof lower extreme is connected with the powder chain that fills of many intensive distributions, but bag body lower extreme that can deform is connected with many evenly distributed's elasticity homogenization silk, fills the powder chain and can extrude the bag body that can deform under the effect in magnetic field, and then acts on and fills the repair to the depressed area on five metals surface on the filling layer, improves and packs the effect, and elasticity homogenization silk can take place deformation when receiving the extrusion to reset after the extrusion disappears and carry out the effect of mixing evenly to remaining filling layer, local scarce material phenomenon even that does not have easily appears, thereby improve follow-up a lot of filling effect.
Further, fill the powder chain including the elasticity reset wire that connects gradually, the guide wire with press the material microballon, and the elasticity reset wire is connected with the location roof, press the material microballon to play the effect of the directly deformable bag body of direct extrusion, be difficult for causing the damage to the deformable bag body on the one hand, on the other hand utilizes the sphere characteristics can enlarge the effect scope, the elasticity reset wire plays the effect that the elasticity resets, thereby realize a lot of extrusion under the effect in intermittent type nature magnetic field, thereby improve and fill the effect, the guide wire plays the effect of supplementary direction, the cooperation is pressed the material microballon and can be realized the extrusion of high strength, the phenomenon of distortion is difficult for appearing.
Furthermore, the elastic reset wire is made of elastic materials, the guide wire is made of hard materials, the pressing material microspheres are made of ferromagnetic materials, the elastic reset wire is made of elastic materials and can force the powder filling chain to reset integrally after the magnetic field disappears, the guide wire is used for forcing the deformable bag body to deform at multiple points uniformly, and therefore the extrusion filling effect on the filling layer is improved, the situation that partial materials are not completely released and filled due to distortion deformation is not prone to occurring, the pressing material microspheres are made of ferromagnetic materials and do not show magnetism in a normal state, mutual attraction is avoided, the later migration extrusion action is interfered, and the downward migration triggering powder filling action can be attracted under the action of the magnetic field.
Further, the mechanical polishing in the step S3 is performed by polishing the hardware surface with a 240# -320# fiber wheel and cloth wheel coated with polishing paste.
Further, the polishing solution in step S4 contains the following raw materials by mass percent: 50-80% of phosphoric acid, 18-48% of sulfuric acid, 0.1-0.2% of lithium acetate, 0.3-0.5% of flow mark inhibitor, 0.1-0.2% of corrosion inhibitor and the balance of water.
Further, after the electrochemical polishing in step S5, sealing is performed by using stearic acid dissolved in isopropanol at a mass fraction of 50%, at a temperature of 90 ℃ for 30 min.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) the scheme can organically integrate multiple polishing modes innovatively, the filling material is squeezed into a concave part on the surface of the hardware by the powder filling bag for temporary repair, rough polishing is carried out by mechanical polishing after repair is finished, large-area convex defects are eliminated, the polishing efficiency is improved, fine polishing is carried out on the convex defects by chemical polishing after mechanical polishing is finished, meanwhile, the concave part cannot be influenced, hole cleaning is carried out after chemical polishing is finished, then, the concave part is leveled based on an electrochemical polishing mode, compared with the existing single polishing mode, the polishing method integrates the advantages of the three polishing modes, not only can strictly control the cost and improve the polishing efficiency, but also hardly interferes with the hardware, and obviously improves the overall and local polishing effect.
(2) The powder filling bag in the step S2 comprises a positioning top plate, a deformable bag body and a filling layer, wherein the positioning top plate and the deformable bag body are connected with each other to form a sealed hollow bag body, the filling layer is connected to one end, far away from the positioning top plate, of the deformable bag body, when the deformable bag body is coated on the surface of the hardware, the filling layer is heated and then melted, the filling layer is filled in the concave position of the surface of the hardware under the extrusion effect, the repair is completed after the filling layer is cooled and solidified, and the influence on the concave position in the mechanical polishing and chemical polishing processes can be reduced.
(3) The positioning top plate is made of a hard material, the deformable bag body is made of an elastic material, the filling layer is made of a hot-melt material and chromium oxide micro powder which are mixed according to the mass ratio of 1:1, and the chromium oxide micro powder has high strength, can not only cope with the influence caused by mechanical polishing, but also can avoid corrosion caused by chemical polishing.
(4) The particle size of the chromium oxide micro powder is 20-200 mu m, and the chromium oxide micro powder can sufficiently fill and repair most of the depressed areas after dyeing treatment, and the position of the depressed areas can be displayed after dyeing treatment, even the characteristics of the depressed areas can be qualitatively judged according to the color area and the depth, and the chromium oxide micro powder has a prompt effect on a subsequent polishing mode.
(5) The location roof lower extreme is connected with the powder chain that fills of many intensive distributions, but bag body lower extreme that can deform is connected with many evenly distributed's elasticity homogenization silk, fill the powder chain and can extrude the bag body that can deform under the effect in magnetic field, and then act on and fill the repair to the sunken region on five metals surface on the filling layer, improve the packing effect, but elasticity homogenization silk can take place deformation when receiving the extrusion, and reset after the extrusion disappears and carry out the effect of mixing evenly to remaining filling layer, local few material phenomenon of no material even is difficult to appear, thereby improve follow-up a lot of packing effect.
(6) Fill the powder chain including the elasticity silk that resets that connects gradually, the guide wire with press the material microballon, and the elasticity silk that resets is connected with the location roof, press the material microballon to play the effect of the directly extruded deformable bag body, on the one hand be difficult for causing the damage to the deformable bag body, on the other hand utilizes the sphere characteristics can enlarge the effect scope, the elasticity silk that resets plays the effect that the elasticity resets, thereby realize extrudeing many times under the effect in intermittent type nature magnetic field, thereby improve the packing effect, the guide wire plays the effect of supplementary direction, the cooperation is pressed the material microballon and can be realized the extrusion of high strength, the phenomenon of distortion is difficult for appearing.
(7) Elastic reset wire adopts elastic material to make, the guide wire adopts hard material to make, press the material microballon to adopt ferromagnetic material to make, elastic reset wire adopts elastic material can force to fill the powder chain and wholly reset after the magnetic field disappears, the guide wire is used for forcing the deformable bag body to take place even multiple spot deformation, thereby improve the extrusion filling effect to the filling layer, the difficult distortion that appears and the partial material that leads to does not completely release the condition of filling, press the material microballon to adopt ferromagnetic material not show magnetism under normal condition, can not inter attraction and disturb the later migration extrusion action of disturbing, and can receive attraction under the magnetic field effect and move downwards and trigger and fill the powder action.
Drawings
FIG. 1 is a schematic flow diagram of the present invention;
FIG. 2 is a schematic view of the powder-filled bag according to the present invention;
FIG. 3 is a schematic view of the construction of the powder filling bag part of the present invention;
FIG. 4 is a schematic view of the powder charging chain of the present invention.
The reference numbers in the figures illustrate:
the device comprises a positioning top plate 1, a deformable bag body 2, a filling layer 3, an elastic homogenizing wire 4, a powder filling chain 5, an elastic resetting wire 51, a guide wire 52 and a material pressing microsphere 53.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
referring to fig. 1-2, a hardware surface polishing process includes the following steps:
s1, cleaning sundries on the surface of the hardware, and then washing the hardware clean by deionized water and drying the hardware;
s2, preheating the surface of the hardware to 80-120 ℃, filling the concave part of the surface of the hardware for multiple times by using a powder filling bag, and applying a magnetic field in the opposite direction of the powder filling bag;
s3, cooling and cleaning the surface of the hardware, and then mechanically polishing the surface of the hardware until a concave part can be observed;
s4, immersing the hardware in the polishing solution for chemical polishing for 10-20S, then taking out and washing the hardware, heating the hardware and cleaning the concave part by adopting a high-pressure air gun;
and S5, performing electrochemical polishing on the hardware, and flattening the concave part on the surface of the hardware.
Referring to fig. 3, the powder filling bag in step S2 includes a positioning top plate 1, a deformable bag body 2 and a filling layer 3, the positioning top plate 1 and the deformable bag body 2 are connected to form a sealed hollow bag body, the filling layer 3 is connected to one end of the deformable bag body 2 away from the positioning top plate 1, when the hardware surface is coated with the filling layer 3, the filling layer is heated and then melted, and fills the recess on the hardware surface under the extrusion action, and completes the repair after cooling and solidification, so as to reduce the influence on the recess in the mechanical polishing and chemical polishing processes.
The positioning top plate 1 is made of a hard material, the deformable bag body 2 is made of an elastic material, the filling layer 3 is made of a hot-melt material and chromium oxide micro powder which are mixed according to the mass ratio of 1:1, and the chromium oxide micro powder has high strength, can not only cope with the influence caused by mechanical polishing, but also can avoid corrosion caused by chemical polishing.
The particle size of the chromium oxide micro powder is 20-200 mu m, and the chromium oxide micro powder can sufficiently fill and repair most of the depressed areas after dyeing treatment, and the position of the depressed areas can be displayed after dyeing treatment, even the characteristics of the depressed areas can be qualitatively judged according to the color area and the depth, and the chromium oxide micro powder has a prompt effect on a subsequent polishing mode.
The powder chain 5 that fills that 1 lower extreme of location roof is connected with many intensive distributions, the 2 lower extremes of the bag body that can deform are connected with many evenly distributed's elasticity homogenization silk 4, fill powder chain 5 can extrude the bag body 2 that can deform under the effect in magnetic field, and then act on and fill the repair to the depressed area on five metals surface on the filling layer 3, improve the packing effect, elasticity homogenization silk 4 can take place deformation when receiving the extrusion, and reset after the extrusion disappears and carry out the effect of mixing evenly to remaining filling layer 3, the phenomenon of local few material or even no material is difficult to appear, thereby improve follow-up a lot of filling effect.
Please refer to fig. 4, the powder filling chain 5 includes the elastic reset wire 51, the guide wire 52 and the material pressing microsphere 53 which are connected in sequence, and the elastic reset wire 51 is connected with the positioning top plate 1, the material pressing microsphere 53 plays a role of directly extruding the deformable bag body 2, on one hand, the deformable bag body 2 is not easily damaged, on the other hand, the sphere characteristics can be utilized to expand the action range, the elastic reset wire 51 plays a role of elastic reset, thereby realizing multiple times of extrusion under the effect of the intermittent magnetic field, thereby improving the filling effect, the guide wire 52 plays a role of auxiliary guiding, the material pressing microsphere 53 is matched to realize the extrusion of high strength, and the phenomenon of distortion is not easily generated.
Elastic reset wire 51 adopts elastic material to make, guide wire 52 adopts hard material to make, press material microballon 53 to adopt ferromagnetic material to make, elastic reset wire 51 adopts elastic material can force to fill whitewashed chain 5 whole and reset after the magnetic field disappears, guide wire 52 is used for forcing the deformable bag body 2 to take place even multiple spot deformation, thereby improve the extrusion filling effect to filling layer 3, the difficult distortion that appears and the partial material that leads to does not completely release the circumstances of filling, press material microballon 53 to adopt ferromagnetic material not show magnetism under normal condition, can not attract each other and disturb the following migration extrusion action of disturbing, and can receive the attraction under the magnetic field effect and move downwards and trigger and fill whitewashed action.
The mechanical polishing in step S3 is performed by polishing the hardware surface using a 240# -320# fiber wheel and cloth wheel coated with polishing paste.
The polishing solution in the step S4 contains the following raw materials by mass percent: 50-80% of phosphoric acid, 18-48% of sulfuric acid, 0.1-0.2% of lithium acetate, 0.3-0.5% of flow mark inhibitor, 0.1-0.2% of corrosion inhibitor and the balance of water.
And step S5, sealing by using stearic acid dissolved in isopropanol with the mass fraction of 50% after electrochemical polishing, wherein the temperature is 90 ℃ and the time is 30 min.
The electrochemical polishing process belongs to the known technology of those skilled in the art, and the specific process thereof depends on the difference of different hardware, and is not described herein again, and is adjusted by those skilled in the art.
Example 2:
the embodiment is an improvement on the basis of embodiment 1, wherein the pressing microspheres 53 are made of an elastic film-shaped material to form a hollow capsule structure, and 80-90% of micro-nano-scale iron powder is filled in the capsule structure, so that the capsule structure can be adaptively dispersed in an extrusion state, on one hand, the extrusion range is further expanded, on the other hand, the extrusion can be more finely performed, and compared with embodiment 1, the filling effect is better for the metal surface of a smaller concave area.
The remainder was in accordance with example 1.
The invention can organically integrate a plurality of polishing modes innovatively, adopts a powder filling bag to extrude filling materials into the sunken part on the surface of the hardware for temporary repair, carries out rough polishing through mechanical polishing after repair, eliminates large-area convex defects to improve the polishing efficiency, adopts chemical polishing to carry out fine polishing on the convex defects after mechanical polishing is finished, does not influence the sunken part, cleans holes after chemical polishing is finished, and then carries out leveling on the sunken part based on an electrochemical polishing mode.
The above are merely preferred embodiments of the present invention; the scope of the invention is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.
Claims (10)
1. A hardware surface polishing process is characterized in that: the method comprises the following steps:
s1, cleaning sundries on the surface of the hardware, and then washing the hardware clean by deionized water and drying the hardware;
s2, preheating the surface of the hardware to 80-120 ℃, filling the concave part of the surface of the hardware for multiple times by using a powder filling bag, and applying a magnetic field in the opposite direction of the powder filling bag;
s3, cooling and cleaning the surface of the hardware, and then mechanically polishing the surface of the hardware until a concave part can be observed;
s4, immersing the hardware in the polishing solution for chemical polishing for 10-20S, then taking out and washing the hardware, heating the hardware and cleaning the concave part by adopting a high-pressure air gun;
and S5, performing electrochemical polishing on the hardware, and flattening the concave part on the surface of the hardware.
2. The hardware surface polishing process according to claim 1, characterized in that: the powder filling bag in the step S2 comprises a positioning top plate (1), a deformable bag body (2) and a filling layer (3), wherein the positioning top plate (1) and the deformable bag body (2) are connected with each other to form a sealed hollow bag body, and the filling layer (3) is connected to one end, far away from the positioning top plate (1), of the deformable bag body (2).
3. The hardware surface polishing process according to claim 2, characterized in that: the positioning top plate (1) is made of a hard material, the deformable bag body (2) is made of an elastic material, and the filling layer (3) is made of a hot-melt material and chromium oxide micro powder which are mixed according to a mass ratio of 1: 1.
4. The hardware surface polishing process according to claim 3, characterized in that: the particle size of the chromium oxide micro powder is 20-200 mu m, and the chromium oxide micro powder is dyed.
5. The hardware surface polishing process according to claim 2, characterized in that: the lower end of the positioning top plate (1) is connected with a plurality of densely distributed powder filling chains (5), and the lower end of the deformable bag body (2) is connected with a plurality of uniformly distributed elastic homogenizing threads (4).
6. The hardware surface polishing process according to claim 5, characterized in that: the powder filling chain (5) comprises an elastic reset wire (51), a guide wire (52) and a material pressing microsphere (53) which are sequentially connected, and the elastic reset wire (51) is connected with the positioning top plate (1).
7. The hardware surface polishing process according to claim 6, characterized in that: the elastic reset wire (51) is made of elastic materials, the guide wire (52) is made of hard materials, and the pressing material microspheres (53) are made of ferromagnetic materials.
8. The hardware surface polishing process according to claim 1, characterized in that: the mechanical polishing in the step S3 is to polish the hardware surface by using a 240# -320# fiber wheel and a cloth wheel coated with polishing paste.
9. The hardware surface polishing process according to claim 1, characterized in that: the polishing solution in the step S4 contains the following raw materials by mass percent: 50-80% of phosphoric acid, 18-48% of sulfuric acid, 0.1-0.2% of lithium acetate, 0.3-0.5% of flow mark inhibitor, 0.1-0.2% of corrosion inhibitor and the balance of water.
10. The hardware surface polishing process according to claim 1, characterized in that: and step S5, sealing by using stearic acid dissolved in isopropanol with the mass fraction of 50% after electrochemical polishing, wherein the temperature is 90 ℃ and the time is 30 min.
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Effective date of registration: 20240722 Address after: 518000 Sha Si High tech Park, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province, China Applicant after: Shenzhen Juyang Precision Hardware Co.,Ltd. Country or region after: China Address before: 524500 Jiefang Middle Road, Meilu street, Wuchuan City, Zhanjiang City, Guangdong Province Applicant before: Wu Jiesen Country or region before: China |
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