CN113079673A - Cooling type pipeline type server cabinet structure and cooling flow control method - Google Patents
Cooling type pipeline type server cabinet structure and cooling flow control method Download PDFInfo
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- CN113079673A CN113079673A CN202110239591.8A CN202110239591A CN113079673A CN 113079673 A CN113079673 A CN 113079673A CN 202110239591 A CN202110239591 A CN 202110239591A CN 113079673 A CN113079673 A CN 113079673A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
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Abstract
The invention provides a cooling type pipeline type server cabinet structure and a cooling flow control method, wherein the structure comprises a server cabinet, server nodes and a heat exchange module; the server cabinet is provided with a heat dissipation coil pipe in the two side shells, the heat dissipation coil pipe is provided with a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet are respectively arranged at the upper end and the lower end in the two side shells of the server cabinet; the server nodes are inserted into the server cabinet, and the server node shells are arranged inside the two side shells of the server cabinet in a fitting manner; the heat exchange module is connected with a liquid inlet main pipe and a liquid return main pipe, a liquid inlet of the heat dissipation coil pipe in each server cabinet is connected with the liquid inlet main pipe, and a liquid outlet of the heat dissipation coil pipe in each server cabinet is connected with the liquid return main pipe; the cooling liquid is arranged in the heat dissipation coil pipes, flows from the heat exchange module to the liquid inlet main pipe, then flows to the liquid inlet of each heat dissipation coil pipe, penetrates through the heat dissipation coil pipes, flows to the liquid return main pipe from the liquid outlet, and returns to the heat exchange module.
Description
Technical Field
The invention belongs to the technical field of server heat dissipation, and particularly relates to a cooling type pipeline type server cabinet structure and a cooling flow control method.
Background
In recent years, as the demand for data computing is increasing day by day due to the fact that the intelligent technology is changing day by day, the computing demand and the performance of the server are also increasing, and besides the traditional single core or dual cores, the architecture of a multi-computing core is also more and more implemented and put into operation.
The operating frequency of the CPU is very high, a large amount of heat is generated during operation, and a single server has a plurality of operation cores therein, and a server cabinet has a plurality of server modules or blades, so that the waste heat generated by a single server cabinet is very remarkable when the servers are multiplied one by one. At present, the heat of the server is solved by cooling mostly in a mode of blowing air by a fan to take away accumulated heat, so that redundant heat is dissipated into a space, a large amount of noise is generated by the fan, the temperature of the space is also raised, and in addition, a large-scale air conditioning device is required to cool a machine room, so that the redundant heat is as small as a CPU and as large as the machine room, the whole heat dissipation system is buckled in a ring mode, and the energy consumption and the noise pollution generated in the process are considerable.
The existing server heat dissipation structure is that a plurality of fans are arranged in a server, when the server works, a CPU generates heat energy to raise the temperature, waste heat is led out to terminal fins of the heat dissipation fins through the heat dissipation fins arranged on the CPU, and then air is driven to flow through the fans arranged in the server, so that air flow passes through the terminal fins of the CPU heat dissipation device, and the waste heat is taken out of an inner space of the server to a shell, even an open space outside the cabinet, and the effect of heat dissipation in the server is achieved. The disadvantages of this method are the low heat dissipation efficiency of the fan and the noise pollution.
In recent years, a heat dissipation structure using liquid cooling has been developed to improve the heat conduction efficiency of a heat conduction path from a CPU to a server casing, but in principle, waste heat in a server is still dissipated to a space in the form of air. In addition, because the behavioral characteristics of the server module are designed into a hot plug-in mode, most of the existing liquid cooling heat dissipation structures are only limited to single module independent operation, and the immersion type liquid cooling structure is quite complex to realize.
Therefore, it is desirable to provide a cooling type rack structure for a duct server and a cooling flow control method thereof.
Disclosure of Invention
The invention provides a cooling type pipeline server cabinet structure and a cooling flow control method, aiming at the defects that the prior server fan heat dissipation mode in the prior art is low in efficiency and serious in noise pollution, and the prior liquid cooling mode still cannot be separated from air heat dissipation, so as to solve the technical problems.
In a first aspect, the present invention provides a cooling type pipeline server cabinet structure, including a server cabinet, server nodes and a heat exchange module;
first heat dissipation coil pipes are arranged in the shells on the two sides of the server cabinet, each first heat dissipation coil pipe is provided with a first liquid inlet and a first liquid outlet, the first liquid inlets are arranged at the upper ends of the shells on the two sides of the server cabinet, and the first liquid outlets are arranged at the lower ends of the shells on the two sides of the server cabinet;
the server nodes are inserted into the server cabinet, and the server node shells are arranged inside the two side shells of the server cabinet in a fitting manner;
the heat exchange module is connected with a liquid inlet main pipe and a liquid return main pipe, a first liquid inlet of a first heat dissipation coil pipe in each server cabinet is connected with the liquid inlet main pipe, and a first liquid outlet of the first heat dissipation coil pipe in each server cabinet is connected with the liquid return main pipe;
the first heat dissipation coil pipe is internally provided with cooling liquid, the cooling liquid flows to the liquid inlet main pipe from the heat exchange module, then flows to the first liquid inlet of the first heat dissipation coil pipe in each server cabinet, and after penetrating through the first heat dissipation coil pipe, flows to the liquid return main pipe from the first liquid outlet, and returns to the heat exchange module.
Furthermore, a plurality of laminates are arranged in the server cabinet, and the laminates are arranged on the inner side of the server cabinet in parallel;
a second heat dissipation coil is arranged in the layer plate, the second heat dissipation coil is provided with a second liquid inlet and a second liquid outlet, the second liquid inlet is connected with the liquid inlet main pipe, and the second liquid outlet is connected with the liquid return main pipe;
the second cooling coil is also internally provided with cooling liquid, and the cooling liquid enters the first liquid inlet of the first cooling coil in the server cabinet from the liquid inlet main pipe, simultaneously enters the second liquid inlet of the second cooling coil in each layer plate of the server cabinet from the liquid inlet main pipe, and flows to the liquid return main pipe from the second liquid outlet after penetrating through the second cooling coil;
inside the server node cut apart with the plywood and insert the server rack, and server node shell and plywood laminating set up.
Further, the heat exchange module comprises a heat exchange unit and a circulation control unit;
the heat exchange unit is connected with both the liquid inlet main pipe and the liquid return main pipe;
a flow control valve is arranged at the liquid inlet main pipe or the liquid return main pipe, a first temperature sensor and a flow velocity sensor are arranged in the liquid inlet main pipe or the liquid return main pipe, and a second temperature sensor is arranged in a server node;
the circulation control unit is connected with the flow control valve, the first temperature sensor, the flow velocity sensor and the second temperature sensor.
Further, the heat exchange unit adopts an air conditioning heat exchange unit or a heat utilization exchange unit.
Furthermore, the server node shell, the server cabinet shell and the laminate are all metal shells;
the first heat dissipation coil pipe and the second heat dissipation coil pipe are made of carbon steel pipes, stainless steel pipes or copper pipes.
Further, the cooling liquid is water or fluorinated cooling liquid.
In a second aspect, the present invention provides a cooling flow control method for a cooling type ducted server rack structure according to the first aspect, including the following steps:
s1, a circulation control unit acquires the temperature of a server node and judges whether the temperature of the server node meets the requirement or not;
if not, go to step S2;
if yes, return to step S1;
and S2, the circulation control unit acquires the real-time flow rate of the cooling liquid in the liquid inlet main pipe or the liquid return main pipe, calculates a target flow rate value according to the corresponding relation between the flow rate of the cooling liquid and the temperature change, and controls the flow control valve to change the real-time flow rate of the cooling liquid until the target flow rate value is met.
Further, the step S1 specifically includes the following steps:
s11, the circulation control unit acquires the real-time temperature of the server node through a second temperature sensor;
s12, judging whether the real-time temperature of the server node is in accordance with the requirement compared with the target temperature of the server node by a circulation control unit;
if yes, return to step S11;
if not, the process proceeds to step S2.
Further, the step S2 specifically includes the following steps:
s21, the circulation control unit acquires the real-time flow rate of the cooling liquid through a flow rate sensor and acquires the initial temperature of the cooling liquid through a first temperature sensor;
s22, the circulation control unit obtains the corresponding relation between the flow rate and the temperature change of the cooling liquid, and then a target flow rate value is calculated according to the real-time flow rate of the cooling liquid, the initial temperature of the cooling liquid and the target temperature of the server node;
s23, the circulation control unit changes the real-time flow rate of the cooling liquid through the flow control valve and judges whether the flow rate meets the requirement of a target flow rate value;
if yes, return to step S1;
if not, the process returns to step S22.
Further, the step S22 specifically includes the following steps:
s221, the circulation control unit obtains the corresponding relation between the flow rate of the cooling liquid and the temperature change as follows:
Flow＝Enode*60/(QL*(TF-TQ0)*1000)*Node (1)；
wherein Flow is the Flow of cooling liquid required by a server cabinet and has the unit of L/min, EnodeConsuming power for the server node in units of W, QLIs a characteristic parameter of the cooling liquid and has the unit of ℃/J and TQ0Is the initial temperature of the cooling liquid, in degrees C.FThe real-time temperature of the server Node is expressed in the unit of DEG C, and the Node is the number of the server nodes in the cabinet;
s222, the circulation control unit deforms the corresponding relation between the flow rate of the cooling liquid and the temperature change to obtain:
TF＝TQ0+(Enode*0.06)/(QL*Flow) (2)；
s223, the circulation control unit sets the real-time Flow rate of the cooling liquid to Flow1Flow over1The real-time temperature of the corresponding server node is TF1Setting the target temperature of the server node to be TF2And T isF1The corresponding target Flow rate is Flow2And (3) carrying the set parameters into formula (2) to obtain:
TF2-TF1＝(TQ0+(Enode*0.06)/(QL*Flow2))-(TQ0+(Enode*0.06)/(QL*Flow2)) (3)；
transforming equation (3) to obtain:
Flow2＝HEnode/(TF2-TF1+HEnode/Flow1) (4)；
wherein HEnode＝(Enode*0.06)/QL；
S224, enabling the cooling liquid to Flow in real time1Server node real-time temperature TF1And server node target temperature TF2Substituting the formula (4) to calculate the target Flow rate value Flow2。
The beneficial effect of the invention is that,
the cooling type pipeline type server cabinet structure and the cooling flow control method greatly improve the heat conductivity of the total heat flow conduction path, change the existing heat convection heat dissipation structure using low-heat-conductivity air media into a structure directly using the original server cabinet metal shell with high density and heat conductivity as media, embed the heat dissipation coil pipe in the server cabinet shell, improve the heat dissipation efficiency of the whole system by using the heat conduction effect of the high-density media, and improve the recycling of the total waste heat energy.
In addition, the invention has reliable design principle, simple structure and very wide application prospect.
Therefore, compared with the prior art, the invention has prominent substantive features and remarkable progress, and the beneficial effects of the implementation are also obvious.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of a cooled ducted server rack configuration according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a cooled ducted server rack according to another embodiment of the present invention;
FIG. 3 is a schematic diagram of an application of the two cooling duct server rack configurations of FIGS. 1 and 2 according to the present invention;
FIG. 4 is a cooling cycle control schematic of the present invention;
FIG. 5 is a first schematic flow chart of the method of the present invention;
FIG. 6 is a second schematic flow chart of the method of the present invention;
in the figure, 1-server cabinet; 2-a server node; 3-a heat exchange module; 3.1-a heat exchange unit; 3.2-a cyclic control unit; 4-a first heat-dissipating coil; 4.1-a first liquid inlet; 4.2-a first liquid outlet; 5-liquid inlet main pipe; 6-liquid return main pipe; 7-layer plate; 8-a second heat-dissipating coil; 9-a flow control valve; 10-a flow rate sensor; 11-a first temperature sensor; 12-second temperature sensor.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
as shown in fig. 1 and fig. 3, the present invention provides a cooling type pipe server cabinet structure, which includes a server cabinet 1, a server node 2 and a heat exchange module 3;
first heat dissipation coil pipes 4 are arranged in the shells on the two sides of the server cabinet 1, the first heat dissipation coil pipes 4 are provided with first liquid inlets 4.1 and first liquid outlets 4.2, the first liquid inlets 4.1 are arranged at the upper ends of the shells on the two sides of the server cabinet 1, and the first liquid outlets 4.2 are arranged at the lower ends of the shells on the two sides of the server cabinet 1;
the server node 2 is inserted into the server cabinet 1, and the shells of the server node 2 are attached to the inner parts of the shells at the two sides of the server cabinet 1;
the heat exchange module 3 is connected with a liquid inlet main pipe 5 and a liquid return main pipe 6, a first liquid inlet 4.1 of a first heat dissipation coil 4 in each server cabinet 1 is connected with the liquid inlet main pipe 5, and a first liquid outlet 4.3 of the first heat dissipation coil 4 in each server cabinet 1 is connected with the liquid return main pipe 6;
the first heat dissipation coil 4 is internally provided with cooling liquid, the cooling liquid flows from the heat exchange module 3 to the liquid inlet main pipe 5, then flows to the first liquid inlet 4.1 of the first heat dissipation coil 4 in each server cabinet 1, and after penetrating through the first heat dissipation coil 4, flows from the first liquid outlet 4.2 to the liquid return main pipe 6 to return to the heat exchange module 3.
Example 2:
as shown in fig. 2 and 3, the present invention provides a cooling type ducted server rack structure, as shown in fig. 1 and 3, comprising a server rack 1, server nodes 2, and a heat exchange module 3;
first heat dissipation coil pipes 4 are arranged in the shells on the two sides of the server cabinet 1, the first heat dissipation coil pipes 4 are provided with first liquid inlets 4.1 and first liquid outlets 4.2, the first liquid inlets 4.1 are arranged at the upper ends of the shells on the two sides of the server cabinet 1, and the first liquid outlets 4.2 are arranged at the lower ends of the shells on the two sides of the server cabinet 1;
the server node 2 is inserted into the server cabinet 1, and the shells of the server node 2 are attached to the inner parts of the shells at the two sides of the server cabinet 1;
the heat exchange module 3 is connected with a liquid inlet main pipe 5 and a liquid return main pipe 6, a first liquid inlet 4.1 of a first heat dissipation coil 4 in each server cabinet 1 is connected with the liquid inlet main pipe 5, and a first liquid outlet 4.3 of the first heat dissipation coil 4 in each server cabinet 1 is connected with the liquid return main pipe 6;
the first heat dissipation coil 4 is internally provided with cooling liquid, the cooling liquid flows from the heat exchange module 3 to the liquid inlet main pipe 5, then flows to the first liquid inlet 4.1 of the first heat dissipation coil 4 in each server cabinet 1, and flows from the first liquid outlet 4.2 to the liquid return main pipe 6 after penetrating through the first heat dissipation coil 4, and returns to the heat exchange module 3;
a plurality of laminates 7 are arranged in the server cabinet 1, and the laminates 7 are arranged on the inner side of the server cabinet 1 in parallel;
a second heat dissipation coil 8 is arranged in the layer plate 7, the second heat dissipation coil 8 is provided with a second liquid inlet and a second liquid outlet, the second liquid inlet is connected with the liquid inlet main pipe 5, and the second liquid outlet is connected with the liquid return main pipe 6;
the second cooling coil 8 is also provided with cooling liquid, and the cooling liquid enters the first liquid inlet 4.1 of the first cooling coil 4 in the server cabinet 1 from the liquid inlet main pipe 5, simultaneously enters the second liquid inlet of the second cooling coil 8 in each layer plate 7 of the server cabinet 1 from the liquid inlet main pipe 5, penetrates through the second cooling coil 8 and then flows to the liquid return main pipe 6 from the second liquid outlet;
inside the server node cut apart with the plywood and insert the server rack, and server node shell and plywood laminating set up.
As shown in fig. 3, the cooling type pipeline server cabinet structure includes two embodiments of server cabinets and three embodiments of server cabinets, where a server cabinet without a tier plate only absorbs heat of a server node by inner surfaces of left and right sides of the server cabinet, and then the heat is brought to a heat exchange module by a first heat dissipation coil to cool; and the server cabinet structure with the laminates is characterized in that the second heat dissipation coil pipes are arranged between the laminates, the laminates also absorb heat of the server nodes, and then the heat is brought to the heat exchange module by the second heat dissipation coil pipes to be cooled.
In certain embodiments, as shown in fig. 4, the heat exchange module 3 comprises a heat exchange unit 3.1 and a circulation control unit 3.2; the heat exchange unit adopts an air conditioning heat exchange unit or a heat utilization exchange unit in 3.1 yuan;
the heat exchange unit 3.1 is connected with both the liquid inlet main pipe 5 and the liquid return main pipe 6;
a flow control valve 9 is arranged at the liquid inlet main pipe 5 or the liquid return main pipe 6, a first temperature sensor 11 and a flow velocity sensor 10 are arranged in the liquid inlet main pipe 5 or the liquid return main pipe 6, and a second temperature sensor 12 is arranged in the server node 2;
the circulation control unit 3.2 is connected to the flow control valve 9, the first temperature sensor 11, the flow rate sensor 10 and the second temperature sensor 12.
In some embodiments, the server node 3 shell, the server cabinet 2 shell and the laminate 7 are all made of metal shells;
the first heat dissipation coil 4 and the second heat dissipation coil 8 are made of carbon steel pipes, stainless steel pipes or copper pipes;
the cooling liquid is water or fluorinated cooling liquid.
Example 3:
as shown in fig. 5, the present invention provides a cooling flow control method based on the cooling type ducted server rack structure of embodiment 1 or embodiment 2, including the following steps:
s1, a circulation control unit acquires the temperature of a server node and judges whether the temperature of the server node meets the requirement or not;
if not, go to step S2;
if yes, return to step S1;
and S2, the circulation control unit acquires the real-time flow rate of the cooling liquid in the liquid inlet main pipe or the liquid return main pipe, calculates a target flow rate value according to the corresponding relation between the flow rate of the cooling liquid and the temperature change, and controls the flow control valve to change the real-time flow rate of the cooling liquid until the target flow rate value is met.
Example 4:
as shown in fig. 6, the present invention provides a cooling flow control method based on the cooling type ducted server rack structure of embodiment 1 or embodiment 2, including the following steps:
s1, a circulation control unit acquires the temperature of a server node and judges whether the temperature of the server node meets the requirement or not;
s11, the circulation control unit acquires the real-time temperature of the server node through a second temperature sensor;
s12, judging whether the real-time temperature of the server node is in accordance with the requirement compared with the target temperature of the server node by a circulation control unit;
if yes, return to step S11;
if not, go to step S2;
s2, the circulation control unit obtains the real-time flow rate of the cooling liquid in the liquid inlet main pipe or the liquid return main pipe, calculates a target flow rate value according to the corresponding relation between the flow rate of the cooling liquid and the temperature change, and controls the flow control valve to change the real-time flow rate of the cooling liquid until the real-time flow rate of the cooling liquid meets the target flow rate value; the method comprises the following specific steps:
s21, the circulation control unit acquires the real-time flow rate of the cooling liquid through a flow rate sensor and acquires the initial temperature of the cooling liquid through a first temperature sensor;
s22, the circulation control unit obtains the corresponding relation between the flow rate and the temperature change of the cooling liquid, and then a target flow rate value is calculated according to the real-time flow rate of the cooling liquid, the initial temperature of the cooling liquid and the target temperature of the server node;
s23, the circulation control unit changes the real-time flow rate of the cooling liquid through the flow control valve and judges whether the flow rate meets the requirement of a target flow rate value;
if yes, return to step S1;
if not, the process returns to step S22.
In some embodiments, step S22 includes the following steps:
s221, the circulation control unit obtains the corresponding relation between the flow rate of the cooling liquid and the temperature change as follows:
Flow＝Enode*60/(QL*(TF-TQ0)*1000)*Node (1)；
wherein Flow is the Flow of cooling liquid required by a server cabinet and has the unit of L/min, EnodeConsuming power for the server node in units of W, QLIs a characteristic parameter of the cooling liquid and has the unit of ℃/J and TQ0Is the initial temperature of the cooling liquid, in degrees C.FThe real-time temperature of the server Node is expressed in the unit of DEG C, and the Node is the number of the server nodes in the cabinet;
s222, the circulation control unit deforms the corresponding relation between the flow rate of the cooling liquid and the temperature change to obtain:
TF＝TQ0+(Enode*0.06)/(QL*Flow) (2)；
s223, the circulation control unit sets the real-time Flow rate of the cooling liquid to Flow1Flow over1The real-time temperature of the corresponding server node is TF1Setting the target temperature of the server node to be TF2And T isF1The corresponding target Flow rate is Flow2And (3) carrying the set parameters into formula (2) to obtain:
TF2-TF1＝(TQ0+(Enode*0.06)/(QL*Flow2))-(TQ0+(Enode*0.06)/(QL*Flow2)) (3)；
transforming equation (3) to obtain:
Flow2＝HEnode/(TF2-TF1+HEnode/Flow1) (4)；
wherein HEnode＝(Enode*0.06)/QL；
S224, enabling the cooling liquid to Flow in real time1Server node real-time temperature TF1And server node target temperature TF2Substituting the formula (4) to calculate the target Flow rate value Flow2。
The correspondence between the flow rate of the cooling liquid and the temperature change in step S221 is obtained as follows: setting the electric energy power of a server node to be 2000 watts, the temperature of the server node before cooling to be 50 degrees, wherein water is used as cooling liquid, an air-conditioning heat exchange unit is adopted by a heat exchange system, the temperature of cooling water provided by the air-conditioning heat exchange unit is 10 degrees, so the temperature difference is 40 degrees, the electric energy power of the server node is 2000 watts and is equivalent to heat to be dissipated, energy is consumed, the heat is converted into 477.7 calories per second according to a joule heat conversion formula 1 that the calorie is 4.1868 joules, 1 calorie of heat is generated when the calorie is converted into one second, 1 calorie of heat is consumed when the temperature of 1 gram of liquid water is increased by 1 degree, so that the cooling water just consumes 477.7 calories of heat temperature rise by 40 degrees, 477.7/40 grams is required when the heat is converted per second, namely 11.94ml is about 12 ml/second, the standard flow unit liter/minute is converted, and the flow rate is 0.72 liter/minute;
the flow rate of 0.72 l/min is the cooling water amount required by the unit server node, one server cabinet indicates how many server nodes are, the number of the cooling water amounts required by the unit server node multiplied by the number of the server nodes is the cooling water amount required by 1 cabinet, and if 8 server cabinets exist, the required water amount is 0.72 × 8 to 5.76 l/min.
Although the present invention has been described in detail by referring to the drawings in connection with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and scope of the present invention, and these modifications or substitutions are within the scope of the present invention/any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A cooling type pipeline type server cabinet structure is characterized by comprising a server cabinet, server nodes and a heat exchange module;
first heat dissipation coil pipes are arranged in the shells on the two sides of the server cabinet, each first heat dissipation coil pipe is provided with a first liquid inlet and a first liquid outlet, the first liquid inlets are arranged at the upper ends of the shells on the two sides of the server cabinet, and the first liquid outlets are arranged at the lower ends of the shells on the two sides of the server cabinet;
the server nodes are inserted into the server cabinet, and the server node shells are arranged inside the two side shells of the server cabinet in a fitting manner;
the heat exchange module is connected with a liquid inlet main pipe and a liquid return main pipe, a first liquid inlet of a first heat dissipation coil pipe in each server cabinet is connected with the liquid inlet main pipe, and a first liquid outlet of the first heat dissipation coil pipe in each server cabinet is connected with the liquid return main pipe;
the first heat dissipation coil pipe is internally provided with cooling liquid, the cooling liquid flows to the liquid inlet main pipe from the heat exchange module, then flows to the first liquid inlet of the first heat dissipation coil pipe in each server cabinet, and after penetrating through the first heat dissipation coil pipe, flows to the liquid return main pipe from the first liquid outlet, and returns to the heat exchange module.
2. The cooling type ducted server rack structure of claim 1, wherein a plurality of floors are provided in the server rack, the floors being arranged in parallel inside the server rack;
a second heat dissipation coil is arranged in the layer plate, the second heat dissipation coil is provided with a second liquid inlet and a second liquid outlet, the second liquid inlet is connected with the liquid inlet main pipe, and the second liquid outlet is connected with the liquid return main pipe;
the second cooling coil is also internally provided with cooling liquid, and the cooling liquid enters the first liquid inlet of the first cooling coil in the server cabinet from the liquid inlet main pipe, simultaneously enters the second liquid inlet of the second cooling coil in each layer plate of the server cabinet from the liquid inlet main pipe, and flows to the liquid return main pipe from the second liquid outlet after penetrating through the second cooling coil;
inside the server node cut apart with the plywood and insert the server rack, and server node shell and plywood laminating set up.
3. The cooled ducted server rack structure of claim 1, wherein the heat exchange module includes a heat exchange unit and a circulation control unit;
the heat exchange unit is connected with both the liquid inlet main pipe and the liquid return main pipe;
a flow control valve is arranged at the liquid inlet main pipe or the liquid return main pipe, a first temperature sensor and a flow velocity sensor are arranged in the liquid inlet main pipe or the liquid return main pipe, and a second temperature sensor is arranged in a server node;
the circulation control unit is connected with the flow control valve, the first temperature sensor, the flow velocity sensor and the second temperature sensor.
4. The cooling type ducted server cabinet structure according to claim 1 or 3, wherein the heat exchange unit employs an air-conditioning heat exchange unit or a heat utilization exchange unit.
5. The cooled ducted server rack structure of claim 2 wherein the server node enclosures, server rack enclosures and laminates are metal enclosures;
the first heat dissipation coil pipe and the second heat dissipation coil pipe are made of carbon steel pipes, stainless steel pipes or copper pipes.
6. The cooled ducted server rack structure of claim 1 wherein the cooling fluid is water or fluorinated cooling fluid.
7. A cooling flow control method based on the cooling type ducted server rack structure according to any one of claims 1 to 6, comprising the steps of:
s1, a circulation control unit acquires the temperature of a server node and judges whether the temperature of the server node meets the requirement or not;
if not, go to step S2;
if yes, return to step S1;
and S2, the circulation control unit acquires the real-time flow rate of the cooling liquid in the liquid inlet main pipe or the liquid return main pipe, calculates a target flow rate value according to the corresponding relation between the flow rate of the cooling liquid and the temperature change, and controls the flow control valve to change the real-time flow rate of the cooling liquid until the target flow rate value is met.
8. The cooling flow control method of the cooling type ducted server rack structure according to claim 7, wherein the step S1 is as follows:
s11, the circulation control unit acquires the real-time temperature of the server node through a second temperature sensor;
s12, judging whether the real-time temperature of the server node is in accordance with the requirement compared with the target temperature of the server node by a circulation control unit;
if yes, return to step S11;
if not, the process proceeds to step S2.
9. The cooling flow control method of the cooling type ducted server rack structure according to claim 8, wherein the step S2 is as follows:
s21, the circulation control unit acquires the real-time flow rate of the cooling liquid through a flow rate sensor and acquires the initial temperature of the cooling liquid through a first temperature sensor;
s22, the circulation control unit obtains the corresponding relation between the flow rate and the temperature change of the cooling liquid, and then a target flow rate value is calculated according to the real-time flow rate of the cooling liquid, the initial temperature of the cooling liquid and the target temperature of the server node;
s23, the circulation control unit changes the real-time flow rate of the cooling liquid through the flow control valve and judges whether the flow rate meets the requirement of a target flow rate value;
if yes, return to step S1;
if not, the process returns to step S22.
10. The cooling flow control method of the cooling type ducted server rack structure according to claim 9, wherein the step S22 is as follows:
s221, the circulation control unit obtains the corresponding relation between the flow rate of the cooling liquid and the temperature change as follows:
Flow＝Enode*60/(QL*(TF-TQ0)*1000)*Node (1)；
wherein Flow is the Flow of cooling liquid required by a server cabinet and has the unit of L/min, EnodeConsuming power for the server node in units of W, QLIs a characteristic parameter of the cooling liquid and has the unit of ℃/J and TQ0Is the initial temperature of the cooling liquid, in degrees C.FThe real-time temperature of the server Node is expressed in the unit of DEG C, and the Node is the number of the server nodes in the cabinet;
s222, the circulation control unit deforms the corresponding relation between the flow rate of the cooling liquid and the temperature change to obtain:
TF＝TQ0+(Enode*0.06)/(QL*Flow) (2)；
s223, the circulation control unit sets the real-time Flow rate of the cooling liquid to Flow1Flow over1The real-time temperature of the corresponding server node is TF1Setting the target temperature of the server node to be TF2And T isF1The corresponding target Flow rate is Flow2And (3) carrying the set parameters into formula (2) to obtain:
TF2-TF1＝(TQ0+(Enode*0.06)/(QL*Flow2))-(TQ0+(Enode*0.06)/(QL*Flow2)) (3)；
transforming equation (3) to obtain:
Flow2＝HEnode/(TF2-TF1+HEnode/Flow1) (4)；
wherein HEnode＝(Enode*0.06)/QL；
S224, enabling the cooling liquid to Flow in real time1Server node real-time temperature TF1And server node target temperature TF2Substituting the formula (4) to calculate the target Flow rate value Flow2。
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