CN113078070A - Device plastic packaging method - Google Patents

Abstract

The invention discloses a device plastic package method, which comprises the following steps: carrying out paster processing on the first surface of the piece to be molded; bonding the first surface of the part to be molded, which is subjected to surface mounting processing, with the carrier plate; carrying out paster processing on the second surface of the part to be molded, which is bonded on the carrier plate; carrying out plastic package operation on the to-be-molded part subjected to second surface mounting processing on the carrier plate; and separating the to-be-molded part subjected to plastic packaging operation from the carrier plate. Compared with the prior art, beneficial effect lies in: through increasing the support plate for the piece of waiting of accomplishing one side paster processing is moulded and is can be carried out the secondary paster on the support plate after, once only accomplishes the work of two-sided plastic envelope, can effectual reduction wait to mould the step that the piece carries out two-sided plastic envelope, thereby better improvement plastic envelope efficiency, simultaneously at the plastic envelope in-process, saved the upset and waited the process of moulding the piece, make to wait to mould the piece and need not carry out secondary positioning, just also can provide the plastic envelope quality.

Description

Device plastic packaging method

[ technical field ] A method for producing a semiconductor device

The invention relates to the technical field of plastic packaging processes, in particular to a device plastic packaging method.

[ background of the invention ]

With the continuous progress of the SIP packaging technology, in order to improve the reliability of products and the demand for further miniaturization of products, the double-sided plastic package structure gradually replaces the single-sided plastic package structure, and becomes the mainstream of the advanced SIP packaging technology. In the prior art, a product of a double-sided plastic package structure generally comprises a bottom layer, a top layer and a middle layer, the double-sided plastic package structure generally needs to be subjected to two times of plastic package operation, and the two times of plastic package operation are performed after the bottom layer patch is completed and after the top layer patch is completed, so that the double-sided plastic package process in the prior art has the following defects:

1. the process is complex, the process flow is long, and the overall yield is poor;

2. because two times of mold sealing are needed, the requirement on the plastic packaging material is higher, and the delamination or popcorn effect is easily generated in the subsequent thermal process, thereby causing the performance of the product to be poor and even the electrical property to be invalid;

3. the fixed investment and the process cost are both high;

4. and the second plastic package is easy to generate deviation and overflow glue due to the tolerance problem of the die.

In view of the above, it is desirable to provide a device molding method and an electronic apparatus to overcome the deficiencies of the prior art.

[ summary of the invention ]

The invention aims to provide a device plastic packaging method, which aims to simplify the device plastic packaging method and improve the plastic packaging quality.

In order to achieve the above object, the present invention provides a device plastic packaging method, comprising:

carrying out paster processing on the first surface of the piece to be molded;

bonding the first surface of the part to be molded, which is subjected to surface mounting processing, with the carrier plate;

carrying out paster processing on the second surface of the part to be molded, which is bonded on the carrier plate;

carrying out plastic package operation on the to-be-molded part subjected to second surface mounting processing on the carrier plate;

and separating the to-be-molded part subjected to plastic packaging operation from the carrier plate.

As an improvement of the plastic packaging method of the device, the carrier plate is made of a metal plate or a glass plate with a smooth and flat surface.

As an improvement of the device plastic packaging method, the carrier plate is pre-pasted with a double-sided adhesive tape for adhering the to-be-molded piece before adhering the to-be-molded piece processed by the first surface paster.

As an improvement of the device plastic packaging method, after the plastic packaging operation of the to-be-molded part is completed, the viscidity of the double-sided adhesive tape is removed in a heating or refrigerating mode so as to separate the to-be-molded part which is subjected to the plastic packaging operation from the carrier plate.

As an improvement of the plastic packaging method of the device, the method further comprises the following steps:

and curing the to-be-molded part which is separated from the carrier plate and subjected to plastic packaging.

Compared with the prior art, the device plastic package method and the electronic equipment have the beneficial effects that: through increasing the support plate for the piece of waiting of accomplishing one side paster processing is moulded and is can be carried out the secondary paster on the support plate after, once only accomplishes the work of two-sided plastic envelope, can effectual reduction wait to mould the step that the piece carries out two-sided plastic envelope, thereby better improvement plastic envelope efficiency, simultaneously at the plastic envelope in-process, saved the upset and waited the process of moulding the piece, make to wait to mould the piece and need not carry out secondary positioning, just also can provide the plastic envelope quality.

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a flowchart of steps of a device plastic packaging method provided by the present invention.

Fig. 2 is a schematic diagram of steps of plastic encapsulation by the method of fig. 1.

[ detailed description ] embodiments

In order to make the objects, technical solutions and advantageous effects of the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and the detailed description. It should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.

Referring to fig. 1, the method for plastic packaging a device provided by the present invention includes the following steps:

step S1, performing SMT (Surface Mounting Technology) on the first Surface of the to-be-molded object.

And step S2, adhering the first surface of the piece to be molded, which is subjected to the patch processing, to the carrier plate.

The carrier plate is made of a metal plate or a glass plate with a smooth and flat surface, and a double-sided adhesive tape for adhering the piece to be molded is attached to the surface of the carrier plate in a preset mode.

It should be noted that, before bonding, the carrier plate needs to be placed horizontally, the double-sided adhesive tape on the carrier plate is arranged upward, and then the piece to be molded is placed on the carrier plate in a posture that the first surface faces downward, so that the carrier plate can be bonded with the piece to be molded, and the second surface of the piece to be molded faces upward, which facilitates the next step.

And step S3, performing SMT on the second surface of the to-be-molded part bonded on the carrier plate.

And step S4, performing plastic package operation on the to-be-molded part subjected to the second surface patch processing on the carrier plate.

It should be understood that when plastic package operation is performed on a to-be-molded part, two sides are performed simultaneously, that is, plastic package is performed on the first surface and the second surface of the to-be-molded part simultaneously, so that the to-be-molded part does not need to be turned over, the plastic package time can be shortened, the to-be-molded part does not need to be turned over, and the process of performing secondary positioning between plastic packages is omitted, therefore, the plastic package precision is higher, and the plastic package effect can be better improved

And step S5, separating the to-be-molded part subjected to the plastic packaging operation from the carrier plate.

Here, after the double-sided adhesive tape loses its adhesiveness by physical means or chemical means, the to-be-molded part after the plastic packaging operation is completed is separated from the carrier plate.

It can be understood that after the part to be molded after the plastic packaging operation is completed is separated from the carrier plate, the carrier plate can be beneficial to the plastic packaging work of the next part to be molded again.

Further, the device plastic package method provided by the invention further comprises a step S6 of curing the to-be-molded piece separated from the carrier plate and subjected to the plastic package operation, so as to facilitate the operations of laser printing, plate separation and film coating of the plastic package piece.

In summary, according to the device plastic package method provided by the invention, the carrier plate is added, so that the piece to be molded after one-side surface mounting processing can be subjected to secondary surface mounting on the carrier plate, and then double-side plastic package work can be completed at one time, and steps of double-side plastic package of the piece to be molded can be effectively reduced, so that the plastic package efficiency is better improved, and meanwhile, in the plastic package process, the process of overturning the piece to be molded is omitted, so that the piece to be molded is not required to be subjected to secondary positioning, and the plastic package quality can be provided.

It should be understood that, although the steps in the flowchart of fig. 1 are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least a portion of the steps in fig. 1 may include multiple sub-steps or multiple stages that are not necessarily performed at the same time, but may be performed at different times, and the order of performance of the sub-steps or stages is not necessarily sequential, but may be performed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.

Referring to fig. 2, for a person skilled in the art to more clearly understand the device plastic packaging method provided in the present invention, the following describes specific operation steps of plastic packaging with reference to practical operation:

step S11, preparing a carrier plate, specifically, selecting a metal plate or a glass plate with a certain thickness, and according to the size of a piece to be molded, cutting and grinding to prepare the carrier plate with a regular shape and a smooth and flat surface;

step S12, attaching a double-sided adhesive tape to the carrier board, specifically, determining the attaching position of the double-sided adhesive tape according to the position of the device on the to-be-molded part, or selecting to completely cover the carrier board;

step S13, carrying out the first SMT on the piece to be molded;

step S14, bonding one surface of the part to be molded, which is subjected to the first SMT, with the carrier plate;

step S15, performing a second SMT on the to-be-molded part on the carrier plate;

and step S16, performing plastic package operation on the to-be-molded part subjected to the second SMT on the carrier plate.

And step S17, tearing off the to-be-molded part subjected to the plastic packaging operation from the carrier plate, and recycling the carrier plate according to the steps to perform the plastic packaging work of the next to-be-molded part.

Therefore, the device plastic package method provided by the invention has the advantages that double-sided plastic package is completed at one time, the carrier plate can be repeatedly beneficial, the carrier plate can be made of a cheaper material, the cost of double-sided plastic package can be effectively reduced, and the efficiency of double-sided plastic package is improved.

The invention is not limited solely to that described in the specification and embodiments, and additional advantages and modifications will readily occur to those skilled in the art, so that the invention is not limited to the specific details, representative apparatus, and illustrative examples shown and described herein, without departing from the spirit and scope of the general concept as defined by the appended claims and their equivalents.

Claims (5)

1. A waterproof and sealing structure, comprising:

carrying out paster processing on the first surface of the piece to be molded;

bonding the first surface of the part to be molded, which is subjected to surface mounting processing, with the carrier plate;

carrying out paster processing on the second surface of the part to be molded, which is bonded on the carrier plate;

carrying out plastic package operation on the to-be-molded part subjected to second surface mounting processing on the carrier plate;

and separating the to-be-molded part subjected to plastic packaging operation from the carrier plate.

2. A device plastic package method according to claim 1, wherein the carrier plate is made of a metal plate or a glass plate with a smooth and flat surface.

3. The device plastic package method according to claim 1, wherein the carrier board is pre-pasted with a double-sided adhesive tape for adhering the to-be-molded piece before adhering the to-be-molded piece processed by the first surface mounting.

4. A device plastic package method according to claim 3, wherein after the plastic package operation is completed, the stickiness of the double-sided adhesive tape is removed by heating or cooling so as to separate the plastic package from the carrier plate.

5. A device plastic package method according to claim 1, further comprising:

and curing the to-be-molded part which is separated from the carrier plate and subjected to plastic packaging.

Images