CN113073363B - Chemical bonding method suitable for endoscope structure - Google Patents
Chemical bonding method suitable for endoscope structure Download PDFInfo
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- CN113073363B CN113073363B CN202110300217.4A CN202110300217A CN113073363B CN 113073363 B CN113073363 B CN 113073363B CN 202110300217 A CN202110300217 A CN 202110300217A CN 113073363 B CN113073363 B CN 113073363B
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- GRWVQDDAKZFPFI-UHFFFAOYSA-H chromium(III) sulfate Chemical compound [Cr+3].[Cr+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GRWVQDDAKZFPFI-UHFFFAOYSA-H 0.000 claims description 4
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- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 235000018417 cysteine Nutrition 0.000 claims description 3
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- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 6
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- 238000010023 transfer printing Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
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- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- LYFDUQMGDPBGMQ-DKWTVANSSA-N (2s)-2-amino-3-hydroxypropanoic acid;copper Chemical compound [Cu].OC[C@H](N)C(O)=O LYFDUQMGDPBGMQ-DKWTVANSSA-N 0.000 description 1
- 206010068051 Chimerism Diseases 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
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- 239000000956 alloy Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
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- VVYPIVJZLVJPGU-UHFFFAOYSA-L copper;2-aminoacetate Chemical compound [Cu+2].NCC([O-])=O.NCC([O-])=O VVYPIVJZLVJPGU-UHFFFAOYSA-L 0.000 description 1
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/06—Wholly-metallic mirrors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a chemical bonding method suitable for an endoscope structure, which comprises the steps of preprocessing a bonding surface of a heterogeneous material to be bonded to expose the material of the bonding surface; etching the exposed joint surface to generate a microstructure array pattern densely arranged on the surface; then making nano-scale micropores on the surface of the pattern; sequentially performing replacement layer growth, seed crystal layer replacement and intermediate layer plating on the microstructure array patterns of the heterogeneous materials to be bonded to obtain a composite plating layer; the materials to be joined are respectively connected with the positive electrode and the negative electrode, an ion source is supplemented by electrolyte under the action of high-voltage current, the composite coating generates a transfer ion reaction, and a continuous junction is directly formed on the junction surface to achieve the junction effect. The composite coating is suitable for the growth of crystal faces of corresponding metal materials in the exchange process of surface charges through wet electrochemical bonding, so that an effective bonding state is generated, and effective bonding and jogging of two heterogeneous materials are achieved.
Description
Technical Field
The invention belongs to the technical field of materials, and particularly relates to a chemical bonding method suitable for an endoscope structure.
Background
In terms of application in related fields of medicine, the medical device field is most suitable for the living medical behaviors and applications, and in the rapid development state of medical devices, related technologies such as invasive endoscopes are most common in various types of surgical operations or related medical behaviors, however, various endoscopes in medical devices need to be suitable for the severe external physiological environment factors formed by the acid-base environment in the human body and the related physiological environment, so that the establishment of a fitting joint assembly technology capable of forming a high-safety endoscope is an important issue and a deep field in the assembly field of endoscopes.
In various types of endoscope structure products, especially in medical use, the need to relate to corresponding severe environmental factors, such as physiological environments, acid-base environments, and bacterial environments, may lead to corrosive states or potential structural destructive behaviors caused by unexpected destructive behaviors of the endoscope structure and related joint surfaces.
Disclosure of Invention
The invention aims to provide a chemical bonding method suitable for an endoscope structure heterogeneous material, which can effectively overcome the limitation of external conditions such as various different material characteristics, package shapes and the like, and completely resist the defect of incomplete package caused by corrosion behavior and related structural destructive behavior.
In order to achieve the above purpose, the following technical scheme is adopted:
A chemical bonding method suitable for an endoscope structure, comprising the steps of:
(1) Surface treatment
Pretreating the joint surface of the heterogeneous materials to be joined to expose the materials of the joint surface;
(2) Microstructure array fabrication
Etching the exposed joint surface to generate a microstructure array pattern densely arranged on the surface; then making nano-scale micropores on the surface of the pattern;
(3) Preparation of composite coating
Sequentially performing replacement layer growth, seed crystal layer replacement and intermediate layer plating on the microstructure array patterns of the heterogeneous materials to be bonded to obtain a composite plating layer;
(4) Wet electrochemical bonding
The materials to be joined are respectively connected with the positive electrode and the negative electrode, an ion source is supplemented by electrolyte under the action of high-voltage current, the composite coating generates a transfer ion reaction, and a continuous junction is directly formed on the junction surface to achieve the junction effect.
According to the scheme, the heterogeneous material comprises a metal material, a semiconductor material or a high polymer material.
According to the scheme, the surface treatment process in the step 1 comprises corrosion or cleaning or corrosion and cleaning.
According to the scheme, the microstructure array is prepared by adopting wet etching to imprint an array pattern, and the specific process is as follows:
preparing a mould with a microstructure array, carrying out catalytic corrosion by utilizing electrolytic reaction suitable for the material of the joint surface, and reversely etching and copying the microstructure array pattern of the mould on the joint surface.
According to the scheme, the microstructure array is prepared by adopting dry-type imprinting transfer printing of an array pattern, and the specific process is as follows:
A mold with a microstructure array is prepared, and a microstructure array pattern of the mold is formed on the joint surface by dry electrolytic imprinting applied to the joint surface material.
According to the scheme, the replacement layer growth in the step 3 comprises the following steps:
Immersing the joint surface into catalytic electrolysis metal complex liquid to enable the metal complex to form a catalytic ion layer on the surface of the microstructure array; the complex solution is a complex solution of tin dioxide and glycine, cysteine, arginine or serine.
According to the above scheme, the seed crystal layer replacement in step 3 includes the following steps:
immersing the joint surface in chloride solution of gold, silver, palladium or platinum, carrying out substitution under the catalysis of the catalytic ion layer, and carrying out adsorption substitution on the catalytic ion layer on the surface of the microstructure array to form a metal coating.
According to the scheme, the intermediate layer plating layer in the step 3 comprises the following steps:
And electroplating to prepare nickel, copper, zinc, chromium or titanium on the metal coating on the surface of the microstructure array through the three electrodes to obtain an intermediate layer coating.
According to the scheme, the electrolyte in the step 4 mainly comprises a nickel ion source and comprises nickel sulfate/nickel chloride/hydrochloric acid/additive; wherein nickel sulfate is 0.5-1M; nickel chloride 0.5-1M; hydrochloric acid 0.1-0.2M; the additive is glycine, polyvinyl alcohol or glacial acetic acid.
According to the scheme, the electrolyte in the step 4 mainly comprises a chromium ion source and comprises chromium sulfate/chromium chloride/hydrochloric acid/sulfuric acid/additive; wherein, the chromium sulfate is 0.5-1M; 0.5-1M of chromium chloride; hydrochloric acid and sulfuric acid 0.1-0.2M; the additive is glycine, polyvinyl alcohol or glacial acetic acid. M (mol/L).
Compared with the prior art, the beneficial effects are as follows:
the heterogeneous material bonding method can be directly used for surface bonding of heterogeneous special-shaped structures, and the structural shape of the heterogeneous material bonding method is not limited by a round shape, an annular shape, a square shape or a related specific shape; is particularly suitable for assembling and manufacturing the endoscope structure.
The composite coating is subjected to wet electrochemical bonding, and the surface charge exchange process is suitable for the corresponding metal material crystal face growth process to generate ionization on the surface, so that the ionization and carrier redistribution process of the material are generated, and then an effective bonding state is generated, and the effective bonding and jogging of two heterogeneous materials are achieved. A two-phase fluid fusion process similar to instant joining is produced that effectively forms a dense structural representation of the joining chimerism and is effectively applicable to joining processes of metallic materials.
Detailed Description
The following examples further illustrate the technical aspects of the present invention, but are not intended to limit the scope of the present invention.
Taking chemical bonding of endoscope structures as an example, the general embodiments generally relate to stainless steel and glass or related polymer materials, such as indium tin oxide glass, fluorinated glass, sapphire glass, plastic lenses.
(1) The original film layer is removed, namely surface treatment.
The process mainly removes a film with a protective effect on the surface of a workpiece surface material such as metal or alloy material to be subjected to plating treatment, and any corrosion, etching or plating treatment needs to be performed firstly to remove the film so as to be convenient for subsequent operation execution.
Taking stainless steel alloy as an example, a chromizing film which is easy to oxidize is generated on the surface due to the components of Fe, ni, au and Cr metal, and a chromium oxide film is continuously generated for protection before cleaning and corrosion to a certain depth, and the film is required to be effectively removed through the corrosion effect so as to facilitate the subsequent process.
(2) And (5) preparing a microstructure.
The process is mainly characterized in that after or without removing the original film, the surface microstructure of the joint surface of the workpiece to be joined is prepared, and the microstructure can be prepared by wet imprinting etching or dry imprinting transfer printing, so that a densely arranged ordered array pattern is generated on the surface of the workpiece to be joined, and the plating layer can be coated on the surface of the pattern according to the basic shape of the pattern in the subsequent plating layer treatment process.
Wet etch imprint patterning: the micro-structure array is precisely processed to prepare an electrolytic reaction which is suitable for the material of the workpieces to be joined and can be subjected to catalytic corrosion, and the pattern of the precise die can be directly reversely etched and copied on the joint surface of the workpieces to be joined, so that the micro-structure pattern of the array to be formed can be formed.
The specific operation is as follows:
1. an ultra-precise die is adopted, the pyramid structure is 0.1-0.3um, the interval is 0.05-0.1um, and the material is high-rigidity materials such as stainless steel, silicon-based, tungsten steel and the like;
2. preparing a special etching solution, preparing hydrofluoric acid, hydrogen peroxide, isopropanol and water, wherein the ratio is controlled to be 1:5:0.5:10;
3. Forming an electrochemical etching reaction, and configuring an electrode (a mould) for etching, a carbon electrode (a processing workpiece) and a reference electrode;
4. Carrying out wet micro-nano imprinting, holding pressure between a workpiece and a die, and conducting current to form an electrochemical etching reaction;
5. Adjusting the voltage to 0.01-1.37-2.0V,0.05-0.1A, referring to an electrochemical workstation, observing the potential output to a descending trend, wherein the operation time can be 0-60 seconds;
6. after the reaction is completed, the cleaning action is carried out, ultrasonic vibration cleaning is carried out for 1 minute, 1 minute and 5 minutes respectively by purified water/IPA/purified water in sequence, and then the drying is carried out.
Dry imprint transfer: the micro-structure array is processed by applying electrolysis to crush the joint surface of the workpiece to be jointed to form a two-phase interface which can be dissolved and diffused temporarily, and the micro-structure pattern is formed on the joint surface by dry type electrolytic stamping. Or by utilizing a micro-structure array of precision processing, making physical contact surface softening which is suitable for the material of the workpieces to be joined and can perform thermoplastic action for solidification stamping, and directly reversely etching and copying the pattern of the precision die on the joint surface of the workpieces to be joined, thus forming the micro-structure pattern of the array to be formed.
The specific operation is as follows:
1. an ultra-precise die is adopted, the pyramid structure is 0.1-0.3um, the interval is 0.05-0.1um, and the material is high-rigidity materials such as stainless steel, silicon-based, tungsten steel and the like;
2. cleaning a die, preparing isopropanol, performing ultrasonic vibration cleaning for 1 minute, and performing ultrasonic vibration cleaning for 1 minute by using ultrapure water;
3. vacuum drying the mould to ensure that no residue exists in the process of removing the surface moisture;
4. Heating the mold to react, and configuring and maintaining the temperature in a range of 5-10 degrees which is larger than the melting point of the material to be imprinted;
5. Carrying out dry micro-nano imprinting, holding pressure between a workpiece and a die, and heating to form a thermoplastic imprinting reaction;
6. After the temperature is adjusted and maintained for 10-30 seconds, cooling, solidifying and shaping are carried out, wherein the operation time can be 300 seconds;
7. After the reaction is completed, the cleaning action is carried out, ultrasonic vibration cleaning is carried out for 1 minute, 1 minute and 5 minutes respectively by purified water/IPA/purified water in sequence, and then the drying is carried out.
The second surface micro-etching is mainly used for finishing the patterned and grown workpiece, and nano-scale micropore preparation is carried out:
1. Preparing a dedicated etching solution, and preparing hydrofluoric acid, hydrogen peroxide, isopropanol, chloroplatinic acid and water in a ratio of 1:5:0.5:0.1:10;
2. The area of the workpiece which is not required to be etched is completely sealed and coated, so that no liquid seepage is ensured;
3. forming an electrochemical etching reaction, and configuring an electrode (a processing workpiece) for etching, a carbon electrode and a reference electrode;
4. wet nano-pore etching is carried out, and electrochemical etching reaction is formed by immersing a workpiece in etching liquid and passing on current;
5. Adjusting the voltage to 0.01-1.37-2.0V,0.05-0.1A, referring to an electrochemical workstation, observing the potential output to a descending trend, wherein the operation time can be 0-10 seconds;
6. after the reaction is completed, the cleaning action is carried out, ultrasonic vibration cleaning is carried out for 1 minute, 1 minute and 5 minutes respectively by purified water/IPA/purified water in sequence, and then the drying is carried out.
(3) And (3) preparing a composite coating.
The process comprises the steps of coating a microstructure array prepared by workpieces to be joined so as to facilitate the subsequent heterojunction, wherein the composite coating needs to be subjected to three steps in sequence.
And (3) growth of a replacement layer: after the microstructure array of the workpieces to be joined, which is already prepared, is cleaned, an active catalytic electrolysis metal complex solution, which is usually a complex solution of tin dioxide and specific amino acids, is placed into the workpiece microstructure array, and the workpiece microstructure array is immersed into the solution, so that the metal complex (such as copper glycine complex Cu-Gly, copper serine complex Cu-Ser and copper cysteine complex Cu-Cys) can form an active catalytic ion layer on the surface of the microstructure array.
The specific operation is as follows:
1. ultrasonically cleaning the workpiece with the surface hardening film removed in purified water for 5 minutes to ensure that the microstructure array is clean;
2. placing the mixture into an IPA cleaning liquid ultrasonic cleaning tank for cleaning for 5 minutes, and ensuring the removal of organic matters;
3. placing the mixture into a purified water ultrasonic cleaning tank for cleaning for 5 minutes, and cleaning to ensure IPA removal;
4. and preparing a 0.1M solution by using tin dioxide SnCl 2, dilute hydrochloric acid and amino acid, immersing the workpiece microstructure array in the solution for 1 minute, and ensuring that the surface of the workpiece is filled with tin ions to obtain a catalytic ion layer.
Seed layer replacement: the microstructure array for carrying out the growth of the replacement layer is immersed in a chloride solution containing precious metals such as gold, silver, palladium, platinum and the like, so that the metal source ions are subjected to the catalysis of a catalytic ion layer to be replaced, the adsorption replacement is directly carried out on the surface to form a pure metal plating layer, the plating layer is usually selected to be a crystalline phase matched with the next step, the seed crystal layer is selected to be mainly corresponding to a metal film which needs to be coated, the microstructure array has a base layer capable of catalyzing the plating film, and the effect of effective plating layer combining force and catalytic growth is generated.
The specific operation is as follows:
1. using platinum coating as case, preparing 0.1M solution with chloroplatinic acid diluted hydrochloric acid;
2. Placing a replacement layer on the surface of the workpiece microstructure array into the workpiece microstructure array for replacement reaction, wherein Sn ions on the surface of the workpiece and platinum ions generate replacement reduction reaction, and directly forming a platinum metal plating layer on the surface;
3. ensuring that a stable plating layer can adopt a subsequent platinum electroplating process;
4. preparing an electrolyte of 0.1N-0.5N chloroplatinic acid/dilute hydrochloric acid/water;
5. a plating electrode (workpiece), a carbon electrode and a reference electrode are configured;
6. the platinum coating process can be completed by adjusting the voltage to 0.01-1.10V and 0.05-0.1A and referring to an electrochemical workstation, observing the potential output to a descending trend. The plating process can be selected from vapor deposition or sputtering process.
An intermediate layer plating layer: and (3) after the related plating layers of the obtained metal plating layers such as gold, silver, palladium, platinum and the like are finished, performing a plating film generation process of the intermediate layer. The choice of the coating can be generally matched with the choice of the crystal phase of the bonding layer between the seed layer and the next layer, and the following related metal ion sources such as nickel, copper, zinc, chromium, titanium and the like are generally selected on the basis of the choice of strength, rigidity and toughness, and the pure plating reaction can be directly utilized in the coating reaction. Three-phase electrodes, a cathode, an anode and a reference electrode are arranged in electrolyte containing a metal source, one electrode is arranged as a clamp workpiece, the other electrode is a carbon electrode, electrochemical oxidation-reduction potential suitable for plating is selected as basic voltage, proper current input is debugged, the plating is carried out in a staged mode, when the plating approaches to completion, the input of adjusting current is improved, the strength and the bonding force of the plating are stabilized, then slow adjusting current is carried out, and the quality of the plating is controlled.
The preparation process comprises the following steps:
1. taking a platinum coating as a case, and preparing 0.1M-0.5M solution by nickel nitrate, chromium nitrate, dilute hydrochloric acid and dilute nitric acid;
2. Placing a workpiece in the reaction chamber to perform a displacement reaction, wherein a noble metal layer such as platinum on the surface of the workpiece can perform a displacement reduction reaction with nickel ions, and a nickel metal plating layer is directly formed on the surface;
3. ensuring that a stable plating layer can adopt a subsequent nickel electroplating process;
4. Preparing an electrolyte of 0.1N-0.5N nickel nitrate/chromium nitrate/dilute hydrochloric acid/amino acid/water;
5. a plating electrode (workpiece), a carbon electrode and a reference electrode are configured;
6. The platinum coating process can be completed by adjusting the voltage to 0.01-1.10V and 0.05-0.1A and referring to an electrochemical workstation, observing the potential output to a descending trend.
(4) Wet electrochemical bonding.
Preparing electrolyte by nickel nitrate, chromium nitrate, dilute hydrochloric acid and amino acid; the workpiece is placed in the wet electrochemical joint, the composite plating layer on the surface of the workpiece generates a transfer ion reaction, and a continuous junction is directly formed on the surface, so that a stable junction can be ensured to generate a junction.
The method comprises the following steps:
preparing electrolyte of 0.1M-0.5M nickel nitrate/chromium nitrate/dilute hydrochloric acid/amino acid/water;
Disposing a conjugate electrode (workpiece a), a conjugate electrode (workpiece B), and a reference electrode;
and adjusting the voltage to be 1-5V and 1.0-10.0A, referring to an electrochemical workstation, and observing the potential output to a descending trend to finish the wet electrochemical bonding process.
The diffusion bonding of the two plating layers on the surfaces of the workpieces to be bonded provides a large-range surface area by utilizing the surface microstructure to increase the space for penetrating the biting force of the two plating layers, voltage and current flow in the joint surfaces of the two workpieces to provide effective interface bonding, and then pressure drop is carried out to gradually adjust the bonding strength of the joint surfaces to rise so as to achieve the bonding effect.
The shell shape structure which is appointed to be jointed is placed into two conductive substrates, specific voltage and pressure are applied, the voltage is generally configured at 1-5V, the current is configured at 1-10A, and the vacuum environment state is realized.
The technological process is to perform wet electroforming jointing reaction, and the joint between two workpieces is maintained effectively by means of jointing the two workpieces in electrolyte and the joint between two workpieces is held in contact by means of replenishing certain amount of metal ion concentration in electrolyte.
Claims (5)
1. A chemical bonding method suitable for an endoscope structure, comprising the steps of:
(1) Surface treatment
Pretreating the joint surface of the heterogeneous materials to be joined to expose the materials of the joint surface;
(2) Microstructure array fabrication
Etching the exposed joint surface to generate a microstructure array pattern densely arranged on the surface; then making nano-scale micropores on the surface of the pattern;
(3) Preparation of composite coating
Sequentially performing replacement layer growth, seed crystal layer replacement and intermediate layer plating on the microstructure array patterns of the heterogeneous materials to be bonded to obtain a composite plating layer;
the replacement layer growth comprises the following steps:
Immersing the joint surface into catalytic electrolysis metal complex liquid to enable the metal complex to form a catalytic ion layer on the surface of the microstructure array; the complex solution is a complex solution of SnCl 2 and glycine, cysteine, arginine or serine;
the seed layer replacement comprises the steps of:
Immersing the joint surface into chloride solution of gold, silver, palladium or platinum, carrying out catalytic substitution by the catalytic ion layer, and carrying out adsorption substitution on the catalytic ion layer on the surface of the microstructure array to form a metal coating;
the intermediate layer plating layer comprises the following steps:
electroplating and preparing nickel, copper, zinc, chromium or titanium on the metal coating on the surface of the microstructure array through three electrodes to obtain an intermediate layer coating;
(4) Wet electrochemical bonding
The materials to be joined are respectively connected with the positive electrode and the negative electrode, an ion source is supplemented by electrolyte under the action of high-voltage current, the composite coating generates a transfer ion reaction, and a continuous junction surface is directly formed on the junction surface to achieve the effect of joining;
the electrolyte solution is mainly prepared from a nickel ion source and comprises nickel sulfate, nickel chloride, hydrochloric acid and an additive; wherein nickel sulfate is 0.5-1M; nickel chloride 0.5-1M; hydrochloric acid 0.1-0.2M; the additive is glycine, polyvinyl alcohol or glacial acetic acid;
The other scheme of the electrolyte is mainly a chromium ion source and comprises chromium sulfate, chromium chloride, hydrochloric acid, sulfuric acid and an additive; wherein, the chromium sulfate is 0.5-1M; 0.5-1M of chromium chloride; hydrochloric acid and sulfuric acid 0.1-0.2M; the additive is glycine, polyvinyl alcohol or glacial acetic acid.
2. The method of chemical bonding for an endoscope structure according to claim 1, wherein said hetero material comprises a metal material, a semiconductor material or a polymer material.
3. The method of chemical bonding for an endoscopic structure as defined in claim 1, wherein said surface treatment process of step 1 comprises etching or cleaning or etching plus cleaning.
4. The method of claim 1, wherein the micro-structure array is prepared by wet etching to imprint an array pattern in step 2, and the method comprises the following steps:
preparing a mould with a microstructure array, carrying out catalytic corrosion by utilizing electrolytic reaction suitable for the material of the joint surface, and reversely etching and copying the microstructure array pattern of the mould on the joint surface.
5. The method of claim 1, wherein the microstructure array is prepared by dry imprinting the transfer array pattern in step 2 by the following steps:
A mold with a microstructure array is prepared, and a microstructure array pattern of the mold is formed on the joint surface by dry electrolytic imprinting applied to the joint surface material.
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| CN103989450A (en) * | 2013-02-18 | 2014-08-20 | 奥林匹斯冬季和Ibe有限公司 | Method for manufacturing endoscope and endoscope |
| CN112399908A (en) * | 2018-06-25 | 2021-02-23 | 考里安公司 | Hybrid method of forming a microstructure array mold, method of making a microstructure array, and method of use |
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| US20020045028A1 (en) * | 2000-10-10 | 2002-04-18 | Takayuki Teshima | Microstructure array, mold for forming a microstructure array, and method of fabricating the same |
| US7282298B2 (en) * | 2002-08-29 | 2007-10-16 | Matsushita Electric Industrial Co., Ltd. | Electrochemical device |
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| CN112399908A (en) * | 2018-06-25 | 2021-02-23 | 考里安公司 | Hybrid method of forming a microstructure array mold, method of making a microstructure array, and method of use |
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