CN113071672A - Multi-view-field target reconnaissance system and missile-type unmanned aerial vehicle carrying same - Google Patents
Multi-view-field target reconnaissance system and missile-type unmanned aerial vehicle carrying same Download PDFInfo
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Abstract
A multi-view-field target reconnaissance system and a missile-type unmanned aerial vehicle carrying the same are disclosed, the target reconnaissance system comprises a large-view-field visible light module, a small-view-field visible light module, a large-view-field infrared module and a small-view-field infrared module, an independent sensor board and an interface board are arranged behind each module, the sensor board and the interface board are connected through a connector, and the target reconnaissance system further comprises an FPGA core processing board and a high-definition image processing board which are arranged in the system; the large-view-field visible light module, the large-view-field infrared module and the small-view-field infrared module are connected with the FPGA core processing board, and the small-view-field visible light module is connected with the high-definition image processing board, so that the frame rate of the large-view-field visible light module can be improved, the small-view-field visible light module can be free from the influence of other modules, the image delay during target reconnaissance and tracking can be effectively reduced, and the reconnaissance real-time performance can be improved; big, little field of vision advantage is complementary, promotes reconnaissance effect distance, has accomplished the miniaturization of load spheroid size, better being applicable to ejection type unmanned aerial vehicle.
Description
Technical Field
The invention belongs to the technical field of unmanned aerial vehicles, and particularly relates to a multi-view-field target reconnaissance system and a missile type unmanned aerial vehicle carrying the same.
Background
At present, when a target is detected, a double-view-field imaging system combining a visible light camera and a thermal infrared imager is adopted. The visible light camera is responsible for visible light imaging and visible light image processing, and then carries out the object reconnaissance under daytime and the sufficient condition of light, and the thermal infrared imager is responsible for infrared imaging and infrared image processing to carry out the object reconnaissance under night and the dim condition of light. The target reconnaissance system is characterized in that the visible light camera is an independent camera and comprises an imaging part and an image processing part, the thermal infrared imager is an independent camera and comprises an imaging part and an image processing part, the two independent cameras are connected with the FPGA, and then the video image is output through the DSP/image processing module.
Traditional dual-field infrared optical systems fall into two categories: one type is a switching type, in which the focal length of an optical system is changed by switching lens groups in the system. The optical system is characterized in that no moving optical element is arranged in a narrow view field optical path, the optical axis stability of the optical system is good, the switching time of the system is short, and the transmittance is high; the existing problem is that a group of lenses are in an idle state outside an optical path, and the use efficiency of the lenses is not high. Moreover, a large space is required for lens switching, and thus the optical system has a large lateral size. The second type is an axial shift type in which the focal length of the optical system is changed by changing the axial interval of the lens groups, and although the axial dimension is controlled by the system optimization design, satisfactory imaging quality can be obtained with a shorter axial dimension, which has a disadvantage of a larger axial dimension.
On the whole, under limited load size, two independent small-field (long focus) camera modules lead to the load volume great, and bullet type unmanned aerial vehicle has strict requirement to the size of reconnaissance load, can only select for use the camera of big visual field (short focus or zoom) passively, can't satisfy bullet type unmanned aerial vehicle reconnaissance requirement, and small-field visible light module receives other modules influence simultaneously, and target reconnaissance efficiency is low, and there is the time delay in the image during tracking. And a large-view-field (short-focus) camera cannot find and track a long-distance target in time. On the other hand, the traditional optical zoom system is weak in emission impact resistance, and when the catapult unmanned aerial vehicle takes off, the optical focusing component is easy to damage, so that focusing cannot be achieved.
Disclosure of Invention
Therefore, the invention provides a multi-view-field target reconnaissance system and an ejection type unmanned aerial vehicle carrying the same, which realize multi-view-field imaging and image processing in one system and solve the problems of short action distance, small view field and low image processing delay reconnaissance efficiency.
In order to achieve the above purpose, the invention provides the following technical scheme: a multi-view-field target reconnaissance system comprises a large-view-field visible light module, a small-view-field visible light module, a large-view-field infrared module, a small-view-field infrared module, an FPGA core processing board and a high-definition image processing board;
the large-view-field visible light module is configured with a large-view-field visible light sensor board and a large-view-field visible light interface board, and the large-view-field visible light module is electrically connected with the FPGA core processing board through the large-view-field visible light sensor board and the large-view-field visible light interface board;
the small-field visible light module is configured with a small-field visible light sensor board and a small-field visible light interface board, and the small-field visible light module is electrically connected with the high-definition image processing board through the small-field visible light sensor board and the small-field visible light interface board;
the large-view-field infrared module is provided with a large-view-field infrared sensor board and a large-view-field infrared interface board, and is electrically connected with the FPGA core processing board through the large-view-field infrared sensor board and the large-view-field infrared interface board;
the small-field infrared module is provided with a small-field infrared sensor board and a small-field infrared interface board, and the small-field infrared module is electrically connected with the FPGA core processing board through the small-field infrared sensor board and the small-field infrared interface board;
the high-definition image processing board is electrically connected with the FPGA core processing board, the large-view-field visible light module and the large-view-field infrared module are used for searching targets in a close-range scene area, and the small-view-field visible light module and the small-view-field infrared module are used for detecting long-distance targets and carefully observing or amplifying the searched targets; the high-definition image processing board is used for processing images of the large-view-field visible light module and the small-view-field visible light module.
As a preferred scheme of the multi-view-field target reconnaissance system, the large-view-field visible light sensor board is connected with the large-view-field visible light interface board by a connector;
the small visual field visible light sensor board is connected with the small visual field visible light interface board by a connector;
the large-view-field infrared sensor board is connected with the large-view-field infrared interface board by a connector;
the small-field infrared sensor board is connected with the small-field infrared interface board through a connector.
As a preferred scheme of the multi-field target reconnaissance system, the large-field visible light interface board of the large-field visible light module, the large-field infrared interface board of the large-field infrared module, and the small-field infrared interface board of the small-field infrared module are all connected with the I2C communication interface of the FPGA core processing board through flexible coaxial lines, and the small-field visible light interface board of the small-field visible light module is connected with the high-definition image processing board through flexible coaxial lines;
the large-view-field infrared module and the small-view-field infrared module are connected with the FPGA core processing board through one-to-two flexible coaxial lines;
the FPGA core processing board is connected with the high-definition image processing board through a TTL serial port.
As a preferred scheme of the multi-view-field target reconnaissance system, the large-view-field visible light module further comprises a large-view-field visible light lens and a large-view-field visible light sensor integrated on the large-view-field visible light sensor plate, and the large-view-field visible light lens is connected with the large-view-field visible light sensor; the large-view-field visible light interface board provides a power supply for the large-view-field visible light sensor;
the small-view-field visible light module further comprises a small-view-field visible light lens and a small-view-field visible light sensor integrated on the small-view-field visible light sensor plate, and the small-view-field visible light lens is connected with the small-view-field visible light sensor; the small visual field visible light interface board provides a power supply for the small visual field visible light sensor;
the large-view-field infrared module further comprises a large-view-field infrared lens and a large-view-field infrared sensor integrated on the large-view-field infrared sensor plate, and the large-view-field infrared lens is connected with the large-view-field infrared sensor; the large-view-field infrared interface board provides a power supply for the large-view-field infrared sensor;
the small-view-field infrared module further comprises a small-view-field infrared lens and a small-view-field infrared sensor integrated on the small-view-field infrared sensor plate, and the small-view-field infrared lens is connected with the small-view-field infrared sensor; the small-view-field infrared interface board provides a power supply for the small-view-field infrared sensor;
the large-view-field visible light module, the small-view-field visible light module and the large-view-field infrared module are connected through a three-support type integrated structural member, and the three-support type integrated structural member is simultaneously connected with a large-view-field visible light lens, a large-view-field visible light sensor plate, a large-view-field visible light interface plate, a small-view-field visible light lens, a small-view-field visible light sensor plate, a small-view-field visible light interface plate, a large-view-field infrared lens, a large-view-field infrared sensor plate and a large-view-field infrared;
the small-view-field infrared module is connected with a small-view-field infrared lens, a small-view-field infrared sensor plate and a small-view-field infrared interface plate of the small-view-field infrared module through an independent integrated structural member.
As a preferred scheme of the multi-view-field target reconnaissance system, the large-view-field visible light sensor plate and the large-view-field visible light interface plate are of a two-layer overlapping structure;
the small-field visible light sensor plate and the small-field visible light interface plate are of a two-layer superposed structure;
the large-view-field infrared sensor board and the large-view-field infrared interface board are of a two-layer superposed structure;
the small visual field infrared sensor board and the small visual field infrared interface board are in a single-layer parallel structure.
As a preferred scheme of the multi-view-field target reconnaissance system, the FPGA core processing board performs image processing, target tracking and character superposition on the large-view-field visible light module at a high frame frequency of 120 HZ; the FPGA core processing board converts the 120HZ image into a 60HZ image and transmits the 60HZ image to the high-definition image processing board for dimming processing.
As a preferred scheme of the multi-view-field target reconnaissance system, the FPGA core processing board adjusts the integration time, the analog gain and the digital gain parameters of the large-view-field visible light module in real time through an I2C communication interface;
the FPGA core processing board carries out initialization configuration on the parameters of integration time, integration capacitance and bias voltage of the large-view-field infrared module and the small-view-field infrared module through an I2C communication interface;
the high-definition image processing board adjusts the integration time, the analog gain and the digital gain parameter of the small-field visible light module in real time through the I2C communication interface.
As a preferred scheme of the multi-view-field target reconnaissance system, an original image of the large-view-field visible light module is analyzed by the FPGA and then is transmitted to a high-definition image processing board for dead pixel replacement, non-uniform correction, dimming, color restoration and automatic white balance;
the small visual field visible light module carries out dead pixel replacement, non-uniform correction, dimming, color restoration and automatic white balance in the high-definition image processing board, and transmits the processed image to the FPGA core processing board for tracking processing;
and the large-view-field infrared module and the small-view-field infrared module simultaneously carry out links of dead pixel replacement, non-uniform correction and dimming on the FPGA core processing board.
As a preferred scheme of the multi-view-field target reconnaissance system, the FPGA core processing board comprises a video tracking function, and the video tracking function is used for tracking targets and overlapping characters of the large-view-field infrared module, the small-view-field infrared module, the large-view-field visible light module and the small-view-field visible light module.
The invention further provides a projectile type unmanned aerial vehicle which is provided with the multi-view-field target reconnaissance system.
The invention has the following advantages: the target reconnaissance system comprises a large-view-field visible light module, a small-view-field visible light module, a large-view-field infrared module and a small-view-field infrared module, wherein an independent sensor board and an interface board are arranged behind each module, the sensor board and the interface board are connected through a connector, and the target reconnaissance system also comprises an FPGA core processing board and a high-definition image processing board which are arranged in the system; the large-view-field visible light module, the large-view-field infrared module and the small-view-field infrared module are connected with the FPGA core processing board, and the small-view-field visible light module is connected with the high-definition image processing board, so that the frame rate of the large-view-field visible light module can be improved, the small-view-field visible light module can be free from the influence of other modules, the image delay during target reconnaissance and tracking can be effectively reduced, and the reconnaissance real-time performance can be improved; the advantages of the large and small visual fields are complementary, the reconnaissance action distance is increased, and the search range is expanded; the invention also reduces the focal length of the camera, reduces the size of the load, effectively saves the internal space of the load, realizes the miniaturization of the size of the load sphere, and is better suitable for the ejection type unmanned aerial vehicle; meanwhile, the problem that the zoom camera is easy to damage when the catapult unmanned aerial vehicle takes off is avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so that those skilled in the art can understand and read the present invention, and do not limit the conditions for implementing the present invention, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the functions and purposes of the present invention, should still fall within the scope of the present invention.
Fig. 1 is a schematic view of a multi-view-field target reconnaissance system according to an embodiment of the present invention;
fig. 2 is a schematic view of a loading sphere structure of a multi-field target reconnaissance system provided in an embodiment of the present invention;
fig. 3 is a schematic view of a loading sphere structure of a multi-view target reconnaissance system at another view angle provided in an embodiment of the present invention;
fig. 4 is a schematic view illustrating a connection of a large-view-field visible light module, a small-view-field visible light module, and a large-view-field infrared module provided in an embodiment of the present invention through a three-support integrated structural member;
fig. 5 is a schematic view of the small-field infrared module provided in the embodiment of the present invention connected to the small-field infrared module through an independent integrated structural member.
In the figure: 1. a large field of view visible light module; 2. a small field-of-view visible light module; 3. a large field of view infrared module; 4. a small field of view infrared module; 5. an FPGA core processing board; 6. a high-definition image processing board; 7. a large field of view visible light sensor plate; 8. a large-field visible light interface board; 9. a small field of view visible light sensor plate; 10. a small visual field visible light interface board; 11. a large field of view infrared sensor plate; 12. a large-field-of-view infrared interface board; 13. a small field of view infrared sensor plate; 14. a small field of view infrared interface board; 15. a three-support type integrated structural member; 16. an independent integrated structure.
Detailed Description
The present invention is described in terms of particular embodiments, other advantages and features of the invention will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the invention and that it is not intended to limit the invention to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be emphasized that the terms "large", "small", "large field of view", "small field of view", "far", "near" and "high definition" used in the present invention are commonly used expressions known to those skilled in the art of cameras, and do not cause ambiguity of the technical solutions and the protection ranges of the present application.
The processing methods and algorithms involved in integrating time, analog gain, digital gain parameter adjustment, dead-spot replacement, non-uniformity correction, dimming, color reduction, and auto white balance, etc. per se, in this application are well known to those skilled in the art.
Referring to fig. 1, 2 and 3, a multi-view-field object reconnaissance system is provided, which comprises a large-view-field visible light module 1, a small-view-field visible light module 2, a large-view-field infrared module 3, a small-view-field infrared module 4, an FPGA core processing board 5 and a high-definition image processing board 6;
the large-view-field visible light module 1 is configured with a large-view-field visible light sensor plate 7 and a large-view-field visible light interface plate 8, and the large-view-field visible light module 1 is electrically connected with the FPGA core processing board 5 through the large-view-field visible light sensor plate 7 and the large-view-field visible light interface plate 8;
the small-field visible light module 2 is configured with a small-field visible light sensor plate 9 and a small-field visible light interface plate 10, and the small-field visible light module 2 is electrically connected with the high-definition image processing plate 6 through the small-field visible light sensor plate 9 and the small-field visible light interface plate 10;
the large-view-field infrared module 3 is configured with a large-view-field infrared sensor board 11 and a large-view-field infrared interface board 12, and the large-view-field infrared module 3 is electrically connected with the FPGA core processing board 5 through the large-view-field infrared sensor board 11 and the large-view-field infrared interface board 12;
the small-field infrared module 4 is provided with a small-field infrared sensor board 13 and a small-field infrared interface board 14, and the small-field infrared module 4 is electrically connected with the FPGA core processing board 5 through the small-field infrared sensor board 13 and the small-field infrared interface board 14;
the high-definition image processing board 6 is electrically connected with the FPGA core processing board 5, the large-view-field visible light module 1 and the large-view-field infrared module 3 are used for searching targets in a close-range scene area, and the small-view-field visible light module 2 and the small-view-field infrared module 4 are used for detecting long-distance targets and carefully observing or amplifying the searched targets; the high-definition image processing board 6 is used for processing images of the large-view-field visible light module 1 and the small-view-field visible light module 2.
In this embodiment, the large-view field visible light sensor board 7 and the large-view field visible light interface board 8 are connected by a connector;
the small-field visible light sensor board 9 is connected with the small-field visible light interface board 10 by a connector;
the large-view-field infrared sensor board 11 is connected with the large-view-field infrared interface board 12 by a connector;
the small-field infrared sensor board 13 is connected with the small-field infrared interface board 14 by a connector.
The large-view field visible light sensor plate 7 and the large-view field visible light interface plate 8 are of a two-layer overlapping structure;
the small-field visible light sensor board 9 and the small-field visible light interface board 10 are of a two-layer superposed structure;
the large-view-field infrared sensor board 11 and the large-view-field infrared interface board 12 are of a two-layer superposed structure;
the small-field infrared sensor board 13 and the small-field infrared interface board 14 are in a single-layer parallel structure.
Specifically, the large-field visible light sensor plate 7 and the large-field visible light interface plate 8, the small-field visible light sensor plate 9 and the small-field visible light interface plate 10, and the large-field infrared sensor plate 11 and the large-field infrared interface plate 12 are of two-layer structures and are connected through connectors, so that the internal space of the load can be saved, and the size of the load can be reduced. The small-field infrared sensor plate 13 and the small-field infrared interface plate 14 are designed into a single-layer large-area structure, the small-field infrared module 4 is large, the front space of a load is occupied more, the rear position of the load corresponding to the small-field infrared module 4 needs to be provided with the FPGA core processing plate 5 and the high-definition image processing plate 6 at the same time, and therefore the sensor plate and the interface plate of the small-field infrared module 4 are designed into a single-layer plate integrated into a whole, the internal space of the load is effectively saved, the size of a load sphere is miniaturized, and the small-field infrared sensor plate and the small-field infrared interface plate are better suitable for the catap.
In this embodiment, the large-field visible light interface board 8 of the large-field visible light module 1, the large-field infrared interface board 12 of the large-field infrared module 3, and the small-field infrared interface board 14 of the small-field infrared module 4 are all connected to the I2C communication interface of the FPGA core processing board 5 through flexible coaxial lines, and the small-field visible light interface board 10 of the small-field visible light module 2 is connected to the high-definition image processing board 6 through flexible coaxial lines; the FPGA core processing board 5 is connected with the high-definition image processing board 6 through a TTL serial port, and transmits original image signals according to the SUBLVDS protocol.
In this embodiment, the large-view-field infrared module 3 and the small-view-field infrared module 4 are connected with the FPGA core processing board through one-to-two flexible coaxial lines. Two sub-lines of one-to-two coaxial lines are respectively connected with the large-view-field infrared module 3 and the small-view-field infrared module 4, and the other end of one-to-two coaxial lines is connected with the FPGA core processing board 5 through a bus.
Specifically, the FPGA core processing board 5 adjusts the integration time, the analog gain and the digital gain parameter of the large-view-field visible light module 1 in real time through the I2C communication interface; therefore, the large-view-field visible light module 1 is driven, and real-time parameter adjustment is realized. The FPGA core processing board 5 performs initialization configuration on parameters of integration time, integration capacitance and bias voltage on the large-view-field infrared module 3 and the small-view-field infrared module 4 through an I2C communication interface; thereby generate the infrared module 3 of big visual field, the infrared module 4 required drive signal of little visual field, realize the drive to the infrared module 3 of big visual field, the infrared module 4 of little visual field. The high-definition image processing board 6 adjusts the integration time, the analog gain and the digital gain parameter of the small-field-of-view visible light module 2 in real time through the I2C communication interface. Thereby drive little visual field visible light module 2, realize real-time parameter adjustment.
Specifically, the FPGA core processing board 5 is connected with four video channels, the large-view-field infrared module 3, the small-view-field infrared module 4, the large-view-field visible light module 1 and the high-definition image processing board 6. The FPGA core processing board 5 has the functions of controlling and switching four video channels, and can inform the high-definition image processing board 6 which video stream is output through a serial port protocol; the high-definition image processing board 6 selects different processing modes according to different video streams.
Specifically, the FPGA core processing board 5 is connected with the high-definition image processing board 6 through a TTL serial port; the cable is a flexible superfine coaxial cable, has high flexibility, and can change the position shape along with the appearance.
In this embodiment, the large-view-field visible light module 1 further includes a large-view-field visible light lens and a large-view-field visible light sensor integrated on the large-view-field visible light sensor board 7, and the large-view-field visible light lens is connected to the large-view-field visible light sensor; the large-view-field visible light interface board 8 provides a power supply for the large-view-field visible light sensor;
the small-view-field visible light module 2 further comprises a small-view-field visible light lens and a small-view-field visible light sensor integrated on the small-view-field visible light sensor plate 9, and the small-view-field visible light lens is connected with the small-view-field visible light sensor; the small visual field visible light interface board 10 provides power for the small visual field visible light sensor;
the large-view-field infrared module 3 further comprises a large-view-field infrared lens and a large-view-field infrared sensor integrated on the large-view-field infrared sensor plate 11, and the large-view-field infrared lens is connected with the large-view-field infrared sensor; the large-view-field infrared interface board 12 provides power for the large-view-field infrared sensor;
the small-view-field infrared module 4 further comprises a small-view-field infrared lens and a small-view-field infrared sensor integrated on the small-view-field infrared sensor plate 13, and the small-view-field infrared lens is connected with the small-view-field infrared sensor; the small-field-of-view infrared interface board 14 provides power for the small-field-of-view infrared sensor.
With reference to fig. 4, in this embodiment, the large-view-field visible light module 1, the small-view-field visible light module 2, and the large-view-field infrared module 3 are connected by a three-bracket integrated structural member 15, and the three-bracket integrated structural member 15 is simultaneously connected to the large-view-field visible light lens, the large-view-field visible light sensor plate 7, the large-view-field visible light interface plate 8, the small-view-field visible light lens, the small-view-field visible light sensor plate 9, the small-view-field visible light interface plate 10, the large-view-field infrared lens, the large-view-field infrared sensor plate 11, and the large-.
With reference to fig. 5, in this embodiment, the small-field infrared module 4 is connected to the small-field infrared lens, the small-field infrared sensor board 13 and the small-field infrared interface board 14 of the small-field infrared module 4 through an independent integrated structural member 16.
In this embodiment, the FPGA core processing board 5 performs image processing, target tracking and character superposition on the large-view-field visible light module 1 at a high frame frequency of 120 HZ; the FPGA core processing board 5 converts the 120HZ image into a 60HZ image and transmits the 60HZ image to the high-definition image processing board 6 for dimming processing.
Specifically, under the condition of high resolution, the high-definition image processing board 6 can receive a frame rate of 30-60 HZ, the large-view-field visible light module 1 is connected with the FPGA core processing board 5, and the FPGA core processing board 5 performs image processing, target tracking and character superposition on the large-view-field visible light module 1 at a high frame rate of 120HZ, so that the frame rate of the large-view-field visible light module 1 is improved, the image delay when the large-view-field visible light module 1 tracks a target is reduced, and the real-time performance of target tracking is improved; meanwhile, the 120HZ image is converted into a 60HZ image and transmitted to the high-definition image processing board 6 for dimming processing, so that a good image processing effect is guaranteed.
In this embodiment, the large-field visible light module 1 and the small-field visible light module 2 perform dead pixel replacement, non-uniform correction, dimming, color restoration, and automatic white balance in the high-definition image processing board 6; the large-view-field infrared module 3 and the small-view-field infrared module 4 perform links of dead pixel replacement, non-uniform correction and dimming (color restoration and automatic white balance are not required in infrared) on the FPGA core processing board 5.
In this embodiment, the FPGA core processing board 5 includes a video tracking function, and the video tracking function is used to perform target tracking and character superposition on the large-view-field infrared module 3, the small-view-field infrared module 4, the large-view-field visible light module 1, and the small-view-field visible light module 2.
Specifically, the FPGA core processing board 5 comprises a video tracking function, and the video tracking function realizes the target tracking and character superposition functions of the large-view-field infrared module 3, the small-view-field infrared module 4 and the large-view-field visible light module 1 through software algorithm and hardware cooperation. And the high-definition image processing board 6 outputs the video stream to the FPGA core processing board 5 through the BT1120 protocol, and the FPGA core processing board 5 performs target tracking and character superposition processing on the video stream, thereby realizing the target tracking and character superposition functions of the small visual field visible light module 2.
The embodiment of the invention also provides a catapult type unmanned aerial vehicle which is provided with the multi-view-field target reconnaissance system. Concretely, launch unmanned aerial vehicle includes the fuselage to and carry in inside many visual fields of unmanned aerial vehicle object reconnaissance system. The multi-view-field target reconnaissance system comprises a large-view-field visible light module 1, a small-view-field visible light module 2, a large-view-field infrared module 3 and a small-view-field infrared module 4, wherein an independent sensor board and an interface board are arranged behind each module, the sensor board and the interface board are connected through a connector, and the multi-view-field target reconnaissance system further comprises an FPGA core processing board 5 and a high-definition image processing board 6 which are arranged in the system; the large-view-field visible light module 1, the large-view-field infrared module 3 and the small-view-field infrared module 4 are connected with the FPGA core processing board 5 through the flexible superfine coaxial cable, and the small-view-field visible light module 2 is connected with the high-definition image processing board 6.
In the conventional art, two independent cameras: the system comprises a visible light camera and a thermal infrared imager. The infrared thermal imager is responsible for infrared imaging and infrared image processing; according to the embodiment of the invention, two independent cameras are designed into a visible light module and an infrared module, the visible light module is used for visible light imaging, the infrared module is used for infrared imaging, an image processing part of the visible light module is realized in a high-definition image processing board 6, and an image processing part of the infrared module is realized in an FPGA core processing board 5.
The traditional target reconnaissance system is characterized in that the visible light camera is an independent camera and comprises an imaging part and an image processing part, the thermal infrared imager is an independent camera and comprises an imaging part and an image processing part, the two independent cameras are connected with the FPGA, and then the video image is output through the DSP/image processing module. According to the embodiment of the invention, the traditional visible light camera is designed into the visible light module which is only used for visible light imaging, and the image processing parts of the large-view-field visible light module 1 and the small-view-field visible light module 2 are realized in the high-definition image processing board 6, so that the modules with smaller view fields and longer focal lengths are adopted as far as possible under the condition that the load size of the ejection type unmanned aerial vehicle is met.
According to the embodiment of the invention, the traditional thermal infrared imager is designed into an infrared module, the large-view-field infrared module 3 and the small-view-field infrared module 4 are only used for infrared imaging, and the image processing part of the infrared module is realized in the FPGA core processing board 5, so that the module with smaller view field and longer focal length is adopted as far as possible under the condition that the load size of the ejection type unmanned aerial vehicle is met. The FPGA core processing board 5 has the characteristics of multiple pins and strong expandability, and can be connected with multiple sensors. According to the embodiment of the invention, the large-view-field infrared module 3, the small-view-field infrared module 4 and the large-view-field visible light module 1 are connected with the FPGA core processing board 5, so that multi-view-field imaging and image processing in one system are realized; according to the embodiment of the invention, the small visual field visible light module 2 is connected with the high-definition image processing board 6, and the high-definition image processing board 6 directly processes the image of the small visual field visible light module 2, so that the image processing delay is reduced, and the small visual field visible light module is not influenced by other modules;
the traditional target reconnaissance system consists of an independent visible light camera with imaging and image processing functions and an independent thermal imager with imaging and image processing functions. Since both imaging and image processing functions are implemented inside the camera, the camera module is large, resulting in a large load. The missile-type unmanned aerial vehicle has strict requirements on the size of a reconnaissance load, and only a large-view-field (short-focus or zoom) camera can be selected passively. On the other hand, the traditional optical zoom camera is weak in emission impact resistance, and when the catapult unmanned aerial vehicle takes off, an optical focusing component is easy to damage, so that focusing cannot be achieved. According to the invention, the traditional small view field (long-focus camera or zoom camera) is designed into the large view field visible light module 1 and the small view field visible light module 2 which comprise two fixed-focus cameras with large and small view fields, so that the focal length of the cameras is reduced, and the load size is reduced, thereby meeting the load requirement of the ejection type unmanned aerial vehicle; meanwhile, the problem that the zoom camera is easy to damage when the catapult unmanned aerial vehicle takes off is avoided.
The embodiment of the invention adopts a large visual field visible light module 1, a small visual field visible light module 2, a large visual field infrared module 3 and a small visual field infrared module 4. The large-view-field visible light module 1 and the large-view-field infrared module 3 are used for observing and searching suspected targets in a large range in a close-range scene area, and the small-view-field visible light module 2 and the small-view-field infrared module 4 are used for detecting long-distance targets and carefully observing or amplifying the searched targets, so that the details of the targets are clearly seen. The large visual field and the small visual field are matched with each other, so that the failure distance is reduced under the condition of limited size of a load, and the working distance of the reconnaissance system is effectively increased.
In the embodiment of the invention, the infrared module uses the uncooled double-field thermal infrared imager, and compared with a method for changing an infrared optical system in a traditional mode, the method has the following advantages: 1, small volume, light weight and low cost, wherein the volume, the weight and the cost are about 1/2 of the traditional optical system mode; 2, the acquisition process is simple, the fixed-focus lens is subjected to athermal treatment, and the imaging is stable; 3, the power consumption is low, and the fixed focus lens does not need to be driven by a motor; 4, the visual field switching is fast, the traditional switching mode generally adopts a motor-driven machine to carry out conversion, about 10s is needed, and the switching can be realized only by 1s in the invention.
Although the invention has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.
Claims (10)
1. A multi-view-field target reconnaissance system is characterized by comprising a large-view-field visible light module (1), a small-view-field visible light module (2), a large-view-field infrared module (3), a small-view-field infrared module (4), an FPGA core processing board (5) and a high-definition image processing board (6);
the large-view-field visible light module (1) is provided with a large-view-field visible light sensor plate (7) and a large-view-field visible light interface plate (8), and the large-view-field visible light module (1) is electrically connected with the FPGA core processing plate (5) through the large-view-field visible light sensor plate (7) and the large-view-field visible light interface plate (8);
the small-field visible light module (2) is provided with a small-field visible light sensor board (9) and a small-field visible light interface board (10), and the small-field visible light module (2) is electrically connected with the high-definition image processing board (6) through the small-field visible light sensor board (9) and the small-field visible light interface board (10);
the large-view-field infrared module (3) is provided with a large-view-field infrared sensor board (11) and a large-view-field infrared interface board (12), and the large-view-field infrared module (3) is electrically connected with the FPGA core processing board (5) through the large-view-field infrared sensor board (11) and the large-view-field infrared interface board (12);
the small-field infrared module (4) is provided with a small-field infrared sensor board (13) and a small-field infrared interface board (14), and the small-field infrared module (4) is electrically connected with the FPGA core processing board (5) through the small-field infrared sensor board (13) and the small-field infrared interface board (14);
the high-definition image processing board (6) is electrically connected with the FPGA core processing board (5), the large-view-field visible light module (1) and the large-view-field infrared module (3) are used for searching targets in a short-distance scene area, and the small-view-field visible light module (2) and the small-view-field infrared module (4) are used for detecting long-distance targets and carefully observing or amplifying the searched targets; the high-definition image processing board (6) is used for carrying out image processing on the large-view-field visible light module (1) and the small-view-field visible light module (2).
2. The multi-view-field object reconnaissance system according to claim 1, wherein the large-view-field visible light sensor board (7) is connected with the large-view-field visible light interface board (8) by a connector;
the small-field visible light sensor board (9) is connected with the small-field visible light interface board (10) by a connector;
the large-view-field infrared sensor board (11) is connected with the large-view-field infrared interface board (12) by a connector;
the small-field infrared sensor board (13) is connected with the small-field infrared interface board (14) through a connector.
3. The multi-view-field object reconnaissance system according to claim 1, wherein the large-view-field visible light interface board (8) of the large-view-field visible light module (1), the large-view-field infrared interface board (12) of the large-view-field infrared module (3), and the small-view-field infrared interface board (14) of the small-view-field infrared module (4) are all connected with the I2C communication interface of the FPGA core processing board (5) through flexible coaxial lines, and the small-view-field visible light interface board (10) of the small-view-field visible light module (2) is connected with the high-definition image processing board (6) through flexible coaxial lines;
the large-view-field infrared module (3) and the small-view-field infrared module (4) are connected with the FPGA core processing board (5) through one-to-two flexible coaxial lines;
the FPGA core processing board (5) is connected with the high-definition image processing board (6) through a TTL serial port.
4. The multi-field target reconnaissance system of claim 1, wherein the large-field visible light module (1) further comprises a large-field visible light lens and a large-field visible light sensor integrated on a large-field visible light sensor board (7), the large-field visible light lens being connected with the large-field visible light sensor; the large-view-field visible light interface board (8) provides a power supply for the large-view-field visible light sensor;
the small-visual-field visible light module (2) further comprises a small-visual-field visible light lens and a small-visual-field visible light sensor integrated on the small-visual-field visible light sensor plate (9), and the small-visual-field visible light lens is connected with the small-visual-field visible light sensor; the small visual field visible light interface board (10) provides power for the small visual field visible light sensor;
the large-view-field infrared module (3) further comprises a large-view-field infrared lens and a large-view-field infrared sensor integrated on the large-view-field infrared sensor plate (11), and the large-view-field infrared lens is connected with the large-view-field infrared sensor; the large-view-field infrared interface board (12) provides power for the large-view-field infrared sensor;
the small-view-field infrared module (4) further comprises a small-view-field infrared lens and a small-view-field infrared sensor integrated on the small-view-field infrared sensor plate (13), and the small-view-field infrared lens is connected with the small-view-field infrared sensor; the small-field infrared interface board (14) provides power for the small-field infrared sensor;
the large-view-field visible light module (1), the small-view-field visible light module (2) and the large-view-field infrared module (3) are connected through a three-support type integrated structural member (15), and the three-support type integrated structural member (15) is simultaneously connected with a large-view-field visible light lens, a large-view-field visible light sensor plate (7), a large-view-field visible light interface plate (8), a small-view-field visible light lens, a small-view-field visible light sensor plate (9), a small-view-field visible light interface plate (10), a large-view-field infrared lens, a large-view-field infrared sensor plate (11) and a large-view-field infrared interface plate;
the small-view-field infrared module (4) is connected with a small-view-field infrared lens, a small-view-field infrared sensor plate (13) and a small-view-field infrared interface plate (14) of the small-view-field infrared module (4) through an independent integrated structural member (16).
5. The multi-field target reconnaissance system of claim 1, wherein the large-field visible light sensor board (7) and the large-field visible light interface board (8) are of a two-layer superimposed structure;
the small-field visible light sensor board (9) and the small-field visible light interface board (10) are of a two-layer superposed structure;
the large-view-field infrared sensor board (11) and the large-view-field infrared interface board (12) are of a two-layer superposed structure;
the small-field infrared sensor board (13) and the small-field infrared interface board (14) are of a single-layer parallel structure.
6. The multi-view-field target reconnaissance system according to claim 1, wherein the FPGA core processing board (5) performs image processing, target tracking and character superposition on the large-view-field visible light module (1) at a high frame frequency of 120 HZ; the FPGA core processing board (5) converts the 120HZ image into a 60HZ image and transmits the 60HZ image to the high-definition image processing board (6) for dimming processing.
7. The multi-view-field object reconnaissance system according to claim 3, wherein the FPGA core processing board (5) adjusts the integration time, the analog gain and the digital gain parameters of the large-view-field visible light module (1) in real time through an I2C communication interface;
the FPGA core processing board (5) performs initialization configuration on parameters of integration time, integration capacitance and bias voltage on the large-view-field infrared module (3) and the small-view-field infrared module (4) through an I2C communication interface;
the high-definition image processing board (6) adjusts the integration time, the analog gain and the digital gain parameters of the small-field visible light module (2) in real time through an I2C communication interface.
8. The multi-view-field object reconnaissance system according to claim 6, wherein the original image of the large-view-field visible light module (1) is analyzed by the FPGA and then transmitted to the high-definition image processing board (6) for dead pixel replacement, non-uniform correction, dimming, color restoration and automatic white balance;
the small visual field visible light module (2) performs dead pixel replacement, non-uniform correction, dimming, color restoration and automatic white balance in the high-definition image processing board (6), and transmits the processed image to the FPGA core processing board (5) for tracking processing;
and the large-view-field infrared module (3) and the small-view-field infrared module (4) carry out dead pixel replacement, non-uniform correction and dimming links on the FPGA core processing board (5) simultaneously.
9. The multi-view-field object reconnaissance system according to claim 1, wherein the FPGA core processing board (5) comprises a video tracking function, and the video tracking function is used for tracking objects and superimposing characters on the large-view-field infrared module (3), the small-view-field infrared module (4), the large-view-field visible light module (1), and the small-view-field visible light module (2).
10. A missile-type unmanned aerial vehicle equipped with the multi-view-field target reconnaissance system according to any one of claims 1 to 9.
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