CN113068305A

CN113068305A - Power supply device

Info

Publication number: CN113068305A
Application number: CN202010619311.1A
Authority: CN
Inventors: 张志隆; 黄文政
Original assignee: Giga Byte Technology Co Ltd
Current assignee: Giga Byte Technology Co Ltd
Priority date: 2019-12-31
Filing date: 2020-06-30
Publication date: 2021-07-02
Anticipated expiration: 2040-06-30
Also published as: TWI719790B; CN113068305B; TW202127740A

Abstract

The invention provides a power supply device. The power supply device comprises a circuit board, a plurality of electric connectors and a plurality of power converters. The circuit board has a first plane and a second plane opposite to the first plane. The plurality of electrical connectors are respectively arranged on the first plane by a surface adhesion technology. The plurality of power converters are respectively arranged on the second plane through a surface adhesion technology. The plurality of power converters provide a plurality of first power sources to at least one of the plurality of electrical connectors via the circuit board.

Description

Power supply device

Technical Field

The present invention relates to a power supply device, and more particularly, to a power supply device formed by a surface mounting technique.

Background

Generally, a power supply device uses a plurality of electrical connectors in the form of DIP (dual in-line package) packages. The DIP type of electrical connector is disposed on a first plane of the circuit board. However, in the case of the DIP type electrical connector, the second plane of the circuit board with respect to the first plane may have a large number of solder joints. The available area of the second plane will be very limited. Therefore, the circuit board must be connected to the electrical connector through a wire, another circuit board, or other connection interface. Thus, the transmission loss of the power supply is increased.

Disclosure of Invention

The invention provides a power supply device formed by a surface adhesion technology.

The power supply device comprises a circuit board, a plurality of electric connectors and a plurality of power converters. The circuit board has a first plane and a second plane opposite to the first plane. The plurality of electrical connectors are disposed on the first plane by a surface mount technology. The plurality of power converters are disposed on the second plane by a surface mount technology. The power converters are electrically coupled with the electrical connectors through the circuit board. The plurality of power converters are configured to provide a first plurality of power sources to at least one of the plurality of electrical connectors via the circuit board.

In an embodiment of the invention, at least one of the plurality of electrical connectors includes a plurality of connection pins, respectively. The plurality of connecting pins are bent. The bent portions of the plurality of connecting pins are fixed to the first plane by a surface adhesion technique.

In an embodiment of the invention, the power supply device covers the bent portions of the plurality of connecting pins by using an adhesive layer.

In an embodiment of the invention, at least one of the plurality of electrical connectors includes a plurality of connection pads, respectively. The plurality of connecting pads are fixed to the first plane by a surface adhesion technique.

In an embodiment of the invention, the contact areas between the contact areas of the plurality of connection pads and the first plane are amplified according to the current specifications of the plurality of first power sources.

In an embodiment of the invention, the power supply device further includes a housing. The plurality of electrical connectors each include a plurality of electrical connection terminals and a housing. The shell is used for fixing the shells of the electric connectors and exposing the electric connection terminals to the power supply device.

In an embodiment of the invention, the power supply device further includes at least one electrical connection structure. The power supply device receives a second power supply through the at least one electrical connection structure and provides the second power supply to at least one of the plurality of electrical connectors. The power of the second power source is greater than the power of the plurality of first power sources.

In an embodiment of the invention, the circuit board electrically couples the plurality of electrical connectors and the plurality of power converters through at least one of the plurality of conductive via structures and the plurality of metal interconnection structures.

In an embodiment of the invention, the power supply device further includes a plurality of passive components. The passive elements are arranged on at least one of the first plane and the second plane through a surface adhesion technology.

In an embodiment of the invention, at least one of the plurality of passive elements is a capacitor.

Based on the above, the electrical connector is disposed on the first plane by the surface mount technology. Compared with the DIP type electric connector, the available area of the second plane of the circuit board is obviously increased. In addition, the power converter is disposed on the second plane by surface mount technology. The converted power, i.e., the first power, of the power converter can be provided to at least one of the electrical connectors. Therefore, the invention can effectively reduce the transmission loss of the power supply and reduce the volume of the power supply device.

In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

Fig. 1 is a schematic configuration diagram of a power supply device according to an embodiment of the invention.

Fig. 2 is an electrical coupling diagram of the electrical connector and the power converter according to the first embodiment of the invention.

Fig. 3 is a schematic view of the arrangement of the electrical connector according to fig. 2.

Fig. 4 is an electrical coupling diagram of an electrical connector and a power converter according to a second embodiment of the invention.

Fig. 5 is a schematic view of the arrangement of the electrical connector according to fig. 4.

Description of reference numerals:

100: power supply device

110: circuit board

120_1 to 120_ 9: electrical connector

130_1 to 130_ 4: power converter

140: electric connection structure

C1-C10: capacitor with a capacitor element

GU: glue layer

M1, M2: metal layer

P11, P12, P21, P22: stitch portion

PD1, PD2, PD5, PD 6: connection foot pad of power converter

PD3, PD 4: connecting foot pad of electric connector

PL 1: first plane

PL 2: second plane

PN1, PN 2: connecting pin

PO 1-PO 4: electrical connection terminal

SH 1: outer casing

SH 2: shell body

V1, V4: conductive via structure

V2, V3, V5, V6: conductive vias

Detailed Description

Referring to fig. 1, fig. 1 is a schematic configuration diagram of a power supply device according to an embodiment of the invention. In the present embodiment, the power supply apparatus 100 includes a circuit board 110, electrical connectors 120_1 to 120_9, and power converters 130_1 to 130_ 4. The circuit board 110 has a first plane PL1 and a second plane PL 2. The first plane PL1 is opposite to the second plane PL 2. The electrical connectors 120_1 to 120_9 are disposed on the first plane PL1 by Surface Mount Technology (SMT). The power converters 130_1 to 130_4 are disposed on the second plane PL2 by surface mount technology. The power converters 130_1 to 130_4 are electrically coupled to the electrical connectors 120_1 to 120_9 through the circuit board 110, respectively. The power converters 130_1 to 130_4 respectively provide a plurality of first power sources to at least one of the electrical connectors 120_1 to 120_9 through the circuit board 110. The electrical connectors 120_1 to 120_9 respectively receive the first power and output the first power. The number of the electrical connectors and the number of the power converters of the present invention may be plural, and are not limited to this embodiment.

In this embodiment, the power specifications of the plurality of first power sources are not completely the same. The first power source of the present embodiment may be any power source with a voltage value lower than 12 volts, for example (the invention is not limited thereto).

For example, the power converter 130_1 converts the input power into a first power having a voltage of 5 volts, and provides the first power to the first part of the pins of the electrical connectors 120_1 to 120_6 through the circuit board 110. The power converter 130_2 converts the input power into a first power with a voltage value of 3.3 volts, and provides the first power to the second part of pins of the electrical connectors 120_1 to 120_7 through the circuit board 110. Therefore, the electrical connectors 120_1 to 120_6 can output the first power source with a voltage value of 3.3 volts and the first power source with a voltage value of 5 volts. The electrical connector 120_7 is capable of outputting the first power having a voltage value of 3.3 volts.

In the present embodiment, the power supply apparatus 100 further includes an electrical connection structure 140. The power supply device 100 receives a second power through the electrical connection structure 140 and provides the second power to at least one of the electrical connectors 120_1 to 120_ 9. The power of the second power source is greater than the power of the first power source. The second power source of the present embodiment can be any power source with a voltage value higher than or equal to 12 volts, for example (the invention is not limited thereto). For example, the second power source with a voltage of 12 volts is provided to the first part of pins of the electrical connectors 120_8 and 120_9 through the electrical connection structure 140 and the circuit board 110. Therefore, the electrical connectors 120_8 and 120_9 can output the second power source with a voltage value of 12 volts. In the present embodiment, the electrical connection structure 140 may be disposed on the second plane PL2 by a surface mount technology, for example, but the present invention is not limited by the manner in which the electrical connection structure 140 may be disposed. In some embodiments, the electrical connection structure 140 may be disposed on the first plane PL1, for example, by a surface mount technology.

It should be noted that in the power supply apparatus 100, the electrical connectors 120_1 to 120_9 are disposed on the first plane PL1 by surface mount technology. In contrast to the DIP electrical connector, the second plane PL2 of the present embodiment does not have the solder joints generated by the installation of the DIP electrical connector. Therefore, the usable area of the second plane PL2 of the present embodiment is significantly increased. In addition, the power converters 130_1 to 130_4 are disposed on the second plane PL2 by surface mount technology. The converted power of the power converters 130_1 to 130_4, i.e. the first power, can be provided to at least one of the electrical connectors 120_1 to 120_ 9. As such, the present embodiment can effectively reduce the transmission loss of the power supply and reduce the size of the power supply apparatus 100.

The power supply device 100 also includes a plurality of passive components. The passive element is disposed on at least one of the first plane PL1 and the second plane PL2 by a surface mount technology. The partial passive elements of the present embodiment are exemplified by capacitors C1 to C10. The capacitors C1-C10 are disposed on the first plane PL1 by surface mount technology, respectively, but the invention is not limited thereto. The passive elements of this embodiment may include resistors, inductors, diodes, etc. (not shown). The resistor, the inductor, the diode, and the like are disposed on at least one of the first plane PL1 and the second plane PL2 by surface mount technology, respectively.

Referring to fig. 2, fig. 2 is a schematic diagram illustrating an electrical coupling between an electrical connector and a power converter according to a first embodiment of the invention. For convenience of illustration, the electrical connector 120_1 and the power converter 130_1 are only used as an example in the embodiment, but the invention is not limited thereto. Unlike the electrical connector that can be mounted by the surface mount technology in the above embodiment, in the present embodiment, the electrical connector 120_1 includes a plurality of connection pins. Taking the connecting pins PN1 and PN2 of the electrical connector 120_1 as an example, the connecting pin PN1 is bent to form pin portions P11 and P12. The connecting pin PN2 is bent to form pin portions P21, P22. When the electrical connector 120_1 is disposed on the first plane PL1, the first extending direction of the pin portions P11 and P21 is substantially equal to the normal direction of the first plane PL 1. The second direction of extension of the stitch portions P12, P22 is substantially any direction perpendicular to the first direction of extension. The pin portion P12 is considered to be a bent portion of the connecting pin PN 1. The pin portion P22 is considered to be a bent portion of the connecting pin PN 2. Thus, the connecting pins PN1, PN2 may be bent, and the pin portions P12, P22 (i.e., the bent portions of the connecting pins PN1, PN 2) are fixed to the first plane PL1 by the surface mount technique. Therefore, in the case of at least one of the electrical connectors 120_1 to 120_9 having a connection pin, the connection pin can be bent, and the bent portion of the connection pin is fixed to the first plane PL1 by the surface mount technology.

In the present embodiment, the power converter 130_1 includes a plurality of connection pads. Taking the connection pads PD1, PD2 of the power converter 130_1 as an example, the connection pads PD1, PD2 are fixed to the second plane PL2 by surface mount technology. The power converter 130_1 may provide the first power via the connection pads PD1, PD 2.

In the present embodiment, the circuit board 110 includes a conductive via structure V1, and a metal interconnect structure formed by conductive vias V2, V3 and a metal layer M1. The circuit board 110 electrically couples the electrical connector 120_1 and the power converter 130_1 through at least one of the conductive via structure V1 and the metal interconnect structure. For example, the circuit board 110 electrically couples the pin portion P12 of the electrical connector 120_1 with the connection pad PD1 of the power converter 130_1 through the conductive via structure V1. The circuit board 110 electrically couples the pin portion P22 of the electrical connector 120_1 to the connection pad PD2 of the power converter 130_1 through the conductive vias V2 and V3 of the metal interconnect structure and the metal layer M1.

In some embodiments, at least one of the power converters 130_1 to 130_4 has a connection pin. The connection pins can be bent and the bent portions of the connection pins are fixed to the second plane PL2 by a surface adhesive technique.

Referring to fig. 3, fig. 3 is a schematic diagram illustrating an arrangement of the electrical connector shown in fig. 2. In the present embodiment, the power supply apparatus 100 covers the pin portions P12 and P22 (i.e., the bent portions of the connection pins PN1 and PN 2) of the electrical connector 120_1 with the glue layer GU. In the embodiment, the adhesive layer GU has an electrically insulating material characteristic. The material of the adhesive layer GU may be a polymer material such as epoxy resin (epoxy) or Polyurethane (PU) (the present invention is not limited thereto). In the present embodiment, after the electrical connector 120_1 is disposed on the first plane PL1 by the surface mount technology, the glue layer GU is formed on the first plane PL1 and covers the pin portions P12, P22 of the connecting pins PN1, PN 2. Therefore, the covering of the glue layer GU can increase the fixing strength of the stitch portions P12, P22 to the first plane PL 1. The adhesion strength of the electrical connector 120_1 disposed on the first plane PL1 can be increased. As such, when the external device connected to the power supply apparatus 100 via the electrical connector 120_1 is removed from the power supply apparatus 100, the possibility of the electrical connector 120_1 being loosened can be greatly reduced.

Referring to fig. 4, fig. 4 is a schematic diagram illustrating an electrical coupling between an electrical connector and a power converter according to a second embodiment of the invention. In the embodiment, for convenience of description, the electrical connector 120_2 and the power converter 130_2 are only used as an example in the embodiment, but the invention is not limited thereto. In the present embodiment, the electrical connector 120_2 includes a plurality of connection pads. Taking the connection pads PD3, PD4 of the electrical connector 120_1 as an example, the connection pads PD3, PD4 are fixed on the first plane PL1 by surface mount technology.

In the present embodiment, in the design of the connection pads PD3, PD4, the contact area between the connection pads PD3, PD4 and the first plane PL1 is enlarged according to the current specification of the first power source. For example, the connection pad PD3 is configured to receive a first power source having a first current value. The connection pad PD4 is configured to receive a first power source having a second current value. The first current value is greater than the second current value. Therefore, the contact area between the connection pad PD3 and the first plane PL1 is designed to be larger than the contact area between the connection pad PD4 and the first plane PL1, thereby making the connection pad PD3 suitable for transmitting the first power having a higher current value.

In the present embodiment, the power converter 130_2 includes a plurality of connection pads. Taking the connection pads PD5, PD6 of the power converter 130_2 as an example, the connection pads PD5, PD6 are fixed to the second plane PL2 by surface mount technology. The power converter 130_2 may provide the first power via the connection pads PD5, PD 6.

In the present embodiment, the circuit board 110 includes a conductive via structure V4, and a metal interconnect structure formed by conductive vias V5, V6 and a metal layer M2. The circuit board 110 electrically couples the electrical connector 120_2 and the power converter 130_2 through the conductive via structure V4 and the metal interconnect structure. For example, the circuit board 110 electrically couples the connection pad PD3 of the electrical connector 120_2 and the connection pad PD5 of the power converter 130_2 through the conductive via structure V4. The circuit board 110 electrically couples the connection pad PD4 of the electrical connector 120_2 and the connection pad PD6 of the power converter 130_2 through the conductive vias V5 and V6 and the metal layer M2 of the metal interconnect structure.

Referring to fig. 5, fig. 5 is a schematic diagram illustrating an arrangement of the electrical connector shown in fig. 4. In the present embodiment, the power supply device 100 further includes a housing SH 1. The electrical connector 120_2 includes electrical connection terminals PO 1-PO 4 and a housing SH 2. The housing SH1 is designed to fix the housing SH2 of the electrical connector 120_2 and expose the electrical connection terminals PO 1-PO 4 to the power supply device 100. For example, circuit board 110 is locked to housing SH1 (not shown). The housing SH1 is designed to fix the upper edge of the housing SH2 of the electrical connector 120_ 2. Therefore, the housing SH1 and the circuit board 110 provide a structure for clamping the housing SH2 of the electrical connector 120_ 2. In addition, housing SH1 has an opening OD. The housing SH1 does not cover the electrical connection terminals PO 1-PO 4. Therefore, the electrical connection terminals PO 1-PO 4 are exposed to the power supply device 100. As a result, when the external device connected to the power supply apparatus 100 via the electrical connector 120_2 is removed from the power supply apparatus 100, the possibility of the electrical connector 120_2 being loosened can be greatly reduced. Therefore, the electrical connector having the connection pads can be fixed by the housing SH 1.

In some embodiments, the connection pads PD3, PD4 of the electrical connector 120_2 can be covered by a glue layer (e.g., glue layer GU locked in fig. 4), thereby improving the adhesion of the connection pads PD3, PD 4.

Based on the teachings of the present embodiment, it can be understood that the housing SH1 of the present embodiment can also be adapted to fix an electrical connector having connection pins.

In summary, the electrical connector of the present invention is disposed on the first plane by a surface mount technology. Compared with the DIP type electric connector, the available area of the second plane of the circuit board is obviously increased. In addition, the power converter is disposed on the second plane by surface mount technology. The power converter is capable of providing the converted power to at least one of the electrical connectors. Therefore, the invention can effectively reduce the transmission loss of the power supply and reduce the volume of the power supply device. The invention also prevents the electric connector from loosening through the design of the shell of the power converter and the glue layer.

Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.

Claims

1. A power supply device, comprising:

the circuit board is provided with a first plane and a second plane opposite to the first plane;

a plurality of electrical connectors disposed on the first plane by a surface mount technology; and

a plurality of power converters, each disposed on the second plane by a surface mount technology, electrically coupled to the plurality of electrical connectors via the circuit board, and configured to provide a plurality of first power sources to at least one of the plurality of electrical connectors via the circuit board.

2. The power supply device according to claim 1, wherein:

at least one of the plurality of electrical connectors includes a plurality of connection pins,

the plurality of connecting pins are bent, and the bent portions of the plurality of connecting pins are fixed to the first plane by a surface adhesion technique.

3. The power supply device according to claim 2, wherein the power supply device covers the bent portions of the plurality of connecting pins with an adhesive layer.

4. The power supply device according to claim 1, wherein at least one of the plurality of electrical connectors comprises a plurality of connecting pads, respectively, wherein the plurality of connecting pads are fixed to the first plane by a surface adhesion technique.

5. The power supply device according to claim 4, wherein a contact area between the plurality of connection pads and the first plane is enlarged according to a current specification of the plurality of first power sources.

6. The power supply device according to claim 1, wherein:

the power supply device also comprises a shell,

the electric connectors respectively comprise a plurality of electric connecting terminals and a shell,

the housing is designed to fix the housings of the plurality of electrical connectors and expose the plurality of electrical connection terminals to the power supply device.

7. The power supply device according to claim 1, wherein:

the power supply device also comprises at least one electric connection structure,

the power supply device receives a second power supply through at least one electric connection structure and provides the second power supply to at least one of the plurality of electric connectors, wherein the power of the second power supply is larger than that of the plurality of first power supplies.

8. The power supply device as claimed in claim 1, wherein the circuit board electrically couples the plurality of electrical connectors and the plurality of power converters through at least one of a plurality of conductive via structures and a plurality of metal interconnect structures.

9. The power supply device of claim 1, further comprising a plurality of passive components, wherein the plurality of passive components are disposed on at least one of the first plane and the second plane by surface mount technology.

10. The power supply of claim 9 wherein at least one of the plurality of passive components is a capacitor.