CN113064000A - Method for evaluating welding heat resistance of sealed component - Google Patents
Method for evaluating welding heat resistance of sealed component Download PDFInfo
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- CN113064000A CN113064000A CN202110278971.2A CN202110278971A CN113064000A CN 113064000 A CN113064000 A CN 113064000A CN 202110278971 A CN202110278971 A CN 202110278971A CN 113064000 A CN113064000 A CN 113064000A
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- 238000003466 welding Methods 0.000 title claims abstract description 139
- 238000000034 method Methods 0.000 title claims abstract description 56
- 238000012360 testing method Methods 0.000 claims abstract description 180
- 238000007689 inspection Methods 0.000 claims abstract description 87
- 238000011156 evaluation Methods 0.000 claims abstract description 55
- 238000005070 sampling Methods 0.000 claims abstract description 15
- 238000012952 Resampling Methods 0.000 claims abstract description 11
- 238000007789 sealing Methods 0.000 claims description 36
- 238000011179 visual inspection Methods 0.000 claims description 26
- 102000005717 Myeloma Proteins Human genes 0.000 claims description 19
- 108010045503 Myeloma Proteins Proteins 0.000 claims description 19
- 239000010953 base metal Substances 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 15
- 230000008569 process Effects 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- 238000004088 simulation Methods 0.000 description 5
- 238000010998 test method Methods 0.000 description 5
- 238000004377 microelectronic Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000010008 shearing Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010183 spectrum analysis Methods 0.000 description 2
- 238000010561 standard procedure Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000012956 testing procedure Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M3/00—Investigating fluid-tightness of structures
- G01M3/02—Investigating fluid-tightness of structures by using fluid or vacuum
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8803—Visual inspection
Abstract
An embodiment of the application discloses a method for evaluating welding heat resistance of a sealed component, which comprises the following steps: s10, sampling the N components to be tested to obtain M sampled components; s20, checking the first performance state, judging whether unqualified components exist, and if so, executing S30; if not, executing S40; s30, rejecting unqualified components, resampling, performing first performance state inspection on the resampled components until the first performance state inspection of all the sampled components is qualified, and executing S40; s40, carrying out a simulated welding test to obtain M simulated welding components; s50, performing second performance state inspection, judging whether unqualified components exist, if so, judging that the welding heat resistance performance evaluation test is unqualified, and if not, executing S60; s60, carrying out welding heat influence evaluation, and if all the welding heat influence evaluation tests are qualified, judging that the welding heat resistance evaluation test is qualified; if not, determining that the welding heat resistance evaluation test is not qualified.
Description
Technical Field
The invention relates to the technical field of military component reliability. More particularly, the invention relates to a method for evaluating welding heat resistance of a sealed component.
Background
The electronic components are used as the core and the foundation of the equipment, and the quality of the electronic components directly influences the reliability of the equipment system. The sealing device has high reliability and high price, and is generally applied to the military high-reliability field. With the increasing demand for miniaturization and high integration of the sealing device, the size of the sealing device is smaller and smaller, and the leads are denser and denser. In the process of assembling and connecting components, the components with small size and dense leads are more easily affected by welding heat, air leakage of the sealed components is caused, and the welded parts inside the components are re-melted, so that the reliability of the components is reduced and even the components are failed.
In the existing national military standard GJB360B-2009 method 210 clause welding heat resistance evaluation test, the problems of the packaging form of the device, the existence of lead in pins, the re-melting of internal solder and the like are not considered in the component test method, the test conditions are not refined enough, and along with the technical development of the sealed device and the expansion of the domestic requirements of military components, the existing standard method is more and more difficult to comprehensively and accurately evaluate the welding heat resistance of the sealed component at the present stage.
Disclosure of Invention
The present application provides a method for evaluating solder heat resistance of a sealed component to solve at least one of the problems mentioned in the background section above.
In order to achieve the purpose, the invention adopts the following technical scheme:
the application provides a method for evaluating welding heat resistance of a sealed component, which comprises the following steps:
s10, sampling the N components to be tested according to the worst condition principle to obtain M sampled components, wherein M is a natural number which is more than or equal to 2 and less than or equal to N;
s20, performing first performance state inspection on the M sampling components, judging whether unqualified components exist in the M sampling components, and if yes, executing S30; if not, executing S40;
s30, rejecting unqualified components, resampling, performing first performance state inspection on the resampled components until the first performance state inspection of all the sampled components is qualified, obtaining M components with qualified first performance state inspection, and executing S40, wherein the number of the resampled components is equal to that of the unqualified components;
s40, performing a simulated welding test on the M components qualified by the first performance state inspection to obtain M simulated welding components;
s50, performing second performance state inspection on the M simulated welding components, judging whether unqualified components exist in the M simulated welding components, if so, judging that the welding heat resistance performance evaluation test of the N components to be tested is unqualified, if not, obtaining M components qualified by the second performance state inspection, and executing S60;
s60, performing welding heat influence evaluation on the M components qualified in the second performance state inspection, and if all the welding heat influence evaluations of the M components qualified in the second performance state inspection are qualified, judging that the welding heat resistance performance evaluation test of the N components to be tested is qualified; and if not, judging that the welding heat resistance evaluation test of the N components to be tested is unqualified.
In a specific embodiment, the first performance state check comprises: a first visual inspection, a first electrical test, and a first leak tightness inspection.
In a specific embodiment, the S20 includes:
s200, performing first appearance inspection for inspecting whether the leads of the M sampling components meet a first preset unqualified standard, and if so, executing S30; if not, executing S202;
s202, a first electrical test is carried out for checking whether the electrical function of the component qualified by the first appearance check is intact, if yes, S204 is executed; if not, executing S30;
s204, first tightness inspection, which is used for inspecting whether the sealing area of the component which is qualified by the first appearance inspection and the first electrical test meets a second preset unqualified standard, if yes, S30 is executed; if not, go to S40.
In one embodiment, the simulated welding test comprises a lead simulated welding test and a lead-free simulated welding test; the simulated welding components comprise lead simulated welding components and lead-free simulated welding components.
In a specific embodiment, the S40 includes:
s400, conducting lead component analysis on the M components qualified by the first performance state inspection, judging whether the components contain lead or not, and if yes, judging that the components contain lead; if not, judging as a lead-free component;
s402, conducting the lead-containing simulated welding test on the lead-containing component to obtain the lead-containing simulated welding component; and carrying out the lead-free simulated welding test on the lead-free components to obtain the lead-free simulated welding components, wherein the sum of the number of the lead-containing simulated welding components and the number of the lead-free simulated welding components is M.
In a specific embodiment, the second performance state check comprises: a second visual inspection, a second electrical test, and a second leak tightness inspection.
In a specific embodiment, the S50 includes:
s500, second appearance inspection, which is used for inspecting whether the leads of the M simulated welding components meet a first preset unqualified standard, and if yes, judging that the welding heat resistance evaluation test of the N components to be tested is unqualified; if not, executing S502;
s502, a second electrical test is carried out for checking whether the electrical functions of the components qualified by the second appearance check are intact, if yes, S504 is executed; if not, determining that the welding heat resistance evaluation test of the N components to be tested is unqualified;
s504, second tightness inspection, which is used for inspecting whether the sealing area of the component which is qualified through the second appearance inspection and the second electrical test meets a second preset unqualified standard, if so, the welding heat resistance performance evaluation test of the N components to be tested is judged to be unqualified; if not, go to S60.
In a specific embodiment, the first preset unqualified standard is any one of a first condition, a second condition, a third condition and a fourth condition, wherein the first condition is a broken lead of a component; the second condition is that a gap is formed between the root of the lead of the component and the sealing shell; the third condition is that the diameter of a pit on a lead of the component or the width of the pit exceeds 25% of the width of the lead, and the depth of the pit is more than 50% of the thickness; the fourth condition is that scratches on the component enable the exposed base metal area of the lead to be more than 5% of the surface area of the lead;
the second pre-defined disqualification criteria is any of the conditions under clause GJB548B-2005 method 1014.2.
In a particular embodiment, the weld heat impact assessment includes: internal visual inspection test, bonding strength test and shear strength test.
In a specific embodiment, the S60 includes:
s600, an internal visual inspection test is carried out, wherein the internal visual inspection test is used for checking whether the internal structure of any one component qualified by the second performance state inspection meets a third preset unqualified standard, and if yes, the welding heat resistance performance evaluation test of the N components to be tested is judged to be unqualified; if not, go to 602;
s602, a bonding strength test is carried out, wherein the bonding strength test is used for checking whether the bonding strength of any one component qualified in the internal visual inspection test meets a fourth preset unqualified standard, and if yes, the welding heat resistance evaluation test of the N components to be tested is judged to be unqualified; if not, executing S604;
s604, a shear strength test is carried out, and the shear strength test is used for checking whether the bonding strength of the internal chip of any one component which is qualified in the internal visual inspection test and the bonding strength test meets a fifth preset unqualified standard, if so, the welding heat resistance evaluation test of the N components to be tested is judged to be unqualified; and if not, judging that the welding heat resistance evaluation test of the N components to be tested is qualified.
In a specific embodiment, the third predetermined unqualified standard is any one of GJB548B-2005 method 2020.1; the fourth preset unqualified standard is any one of GJB548B-2005 method 2011.1; the fifth default unqualified standard is any one of GJB548B-2005 method 2019.2.
The invention has the following beneficial effects:
aiming at the existing problems, the method for evaluating the welding heat resistance of the sealed component is formulated, the external appearance, the electrical performance, the internal structure and other aspects of the sealed component are compared before and after a welding test, the internal chip, the bonding strength, the shearing strength and other aspects of the sealed component are checked, the reliability of welding heat on the sealed component can be comprehensively analyzed, the welding heat resistance of the sealed component can be accurately evaluated, and support is provided for user decision making.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic flow chart illustrating a method for evaluating solder heat resistance of a sealed component according to an embodiment of the present application.
Fig. 2 is a schematic flow chart of a method for evaluating solder heat resistance of a sealed component according to an embodiment of the present application.
FIG. 3 illustrates a weld condition diagram of a simulated weld test according to one embodiment of the present application.
FIG. 4 shows a graphical representation of weld time versus weld temperature in accordance with one embodiment of the present application.
Detailed Description
In order to more clearly illustrate the present application, the present application is further described below in conjunction with the preferred embodiments and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not intended to limit the scope of the present application.
The electronic components are used as the core and the foundation of the equipment, and the quality of the electronic components directly influences the reliability of the equipment system. The sealing device has high reliability and high price, and is generally applied to the military high-reliability field. With the increasing demand for miniaturization and high integration of the sealing device, the size of the sealing device is smaller and smaller, and the leads are denser and denser. In the process of assembling and connecting components, the components with small size and dense leads are more easily affected by welding heat, air leakage of the sealed components is caused, and the welded parts inside the components are re-melted, so that the reliability of the components is reduced and even the components are failed.
In the existing national military standard GJB360B-2009 method 210 clause welding heat resistance evaluation test, the problems of the packaging form of the device, the existence of lead in pins, the re-melting of internal solder and the like are not considered in the component test method, the test conditions are not refined enough, and along with the technical development of the sealed device and the expansion of the domestic requirements of military components, the existing standard method is more and more difficult to comprehensively and accurately evaluate the welding heat resistance of the sealed component at the present stage.
Therefore, in order to solve the above technical problems, the design idea of the technical solution described in the present application is as shown in fig. 1, M devices are randomly extracted from all samples, appearance inspection, electrical test and sealing inspection are performed first, the initial appearance, electrical property and sealing state of the test sample are determined, and the test is qualified. And judging whether the lead of the component contains lead or not through the surface identification or related certification materials of the component, if the lead of the component cannot be judged, performing energy spectrum analysis on the lead of the component to confirm whether the lead contains lead or not, and then selecting the lead-containing or lead-free condition to perform a simulation welding test on M components. After the test, performing appearance inspection, electrical test and sealing inspection on the M devices again, determining whether the test result is qualified, comparing the test result with the initial state of the device, and observing the change trend. Finally, unsealing M devices to expose the internal chip structure, carrying out an internal visual inspection test to observe whether the internal welding part is remelted, carrying out a bonding strength test to check whether the bonding strength is qualified, and carrying out a shear strength test to check whether the chip shear strength is qualified.
Specifically, as shown in fig. 2, the present application proposes a method for evaluating solder heat resistance of a sealed component suitable for small size and dense leads, the method including:
s10, sampling the N components to be tested according to the worst condition principle to obtain M sampled components, wherein M is a natural number which is more than or equal to 2 and less than or equal to N;
the "worst case condition rule" is that the worst values of the power supply voltage, input signal, load and environmental conditions (depending on the function of the device, but within a specified range) are applied to the device under test at the same time, and thus constitute the worst case condition. The worst case for testing different parameters may be different, e.g., the minimum values of the supply voltage, input signal level and ambient temperature and the maximum value of the load may constitute the "worst case condition principle" for measuring the gate output voltage.
In this example, N is set to 100, and M is set to 2 in order to reduce the test cost, that is, 2 components are randomly extracted according to the "worst case condition principle" from 100 samples of the components to be tested.
It should be noted that the value of M or N depends on the actual situation, and the above values are merely exemplary and do not constitute an improper limitation on the value of M or N.
S20, performing first performance state inspection on the M sampling components, judging whether unqualified components exist in the M sampling components, and if yes, executing S30; if not, executing S40;
s30, rejecting unqualified components, resampling, performing first performance state inspection on the resampled components until the first performance state inspection of all the sampled components is qualified, obtaining M components with qualified first performance state inspection, and executing S40, wherein the number of the resampled components is equal to that of the unqualified components;
taking M ═ 2 and N ═ 100 as an example, a first performance check, i.e., a pre-test performance check, was performed on the 2 components sampled at S10, where the first performance check included: a first visual inspection, a first electrical test, and a first leak tightness inspection.
In a specific example, the S20 includes:
s200, performing first appearance inspection for inspecting whether the leads of the M sampling components meet a first preset unqualified standard, and if so, executing S30; if not, executing S202;
in one specific example, the leads of 2 components are inspected under a magnifier or microscope within a range of 1-100 times. And when any one of the broken lead wire of the sealing component, a gap between the root part of the lead wire and the sealing shell, the diameter of a pit or the width of a depression on the lead wire exceeds 25% of the width of the lead wire, the depth of the pit or the width of the depression exceeds 50% of the thickness of the lead wire, and the area of the base metal exposed by the lead wire is larger than 5% of the surface area of the lead wire due to scratches, the first appearance inspection is judged to be unqua.
And eliminating the devices which are unqualified in the appearance inspection, and sampling again to perform the appearance inspection. The number of the components obtained by resampling is equal to the number of unqualified components, that is, if 1 component is unqualified, resampling is performed on the remaining non-sampled components to be tested, and the number of the components obtained by resampling is 1; if the 2 components are not qualified, resampling is carried out on the remaining non-sampled components to be tested, the number of the resampled components is 2, and S202 is executed until the first appearance inspection of all the sampled components is qualified.
S202, a first electrical test is carried out for checking whether the electrical function of the component qualified by the first appearance check is intact, if yes, S204 is executed; if not, executing S30;
and (4) carrying out electrical test on the 2 qualified components subjected to the first appearance inspection according to a component manual, and verifying whether the electrical functions of the 2 qualified components are intact. And similarly, rejecting the components which are unqualified in the electrical test, resampling, and performing first appearance inspection and first electrical test on the resampled components until the first appearance inspection and the first electrical test of all the sampled components are qualified, and executing S204.
S204, first tightness inspection, which is used for inspecting whether the sealing area of the component which is qualified by the first appearance inspection and the first electrical test meets a second preset unqualified standard, if yes, S30 is executed; if not, go to S40.
And performing first tightness inspection on the 2 components which are qualified in the first appearance inspection and the first electrical test, and inspecting whether the components are sealed poorly or have phenomena such as air leakage. The test method for inspecting the sealing property of the sealed component and the failure determination standard (second predetermined failure standard) refer to GJB548B-2005 method 1014.2.
And similarly, rejecting the components with unqualified sealing, resampling, performing first appearance inspection, first electrical inspection and first tightness inspection on the resampled components until all the first appearance inspection, the first electrical inspection and the first tightness inspection of all the sampled components are qualified, and executing S40.
The GJB548B-2005 method is a national military standard GJB548B-2005 microelectronic test method and program of the people's republic of China. The present standard specifies environmental, mechanical, electrical testing methods and procedures for military microelectronic devices, as well as the control and limiting measures necessary to ensure that the microelectronic device meets the quality and reliability requirements for its intended use. The present standard is applicable to microelectronic devices for military and space applications.
In a specific example, unqualified components are removed, sampling is performed again, the components obtained by resampling are subjected to first performance state inspection until the first performance state inspection of all the sampled components is qualified, and 2 components qualified by first performance state inspection are obtained.
And S40, performing a simulated welding test on the M components qualified by the first performance state inspection to obtain M simulated welding components.
The simulation welding test comprises a lead simulation welding test and a lead-free simulation welding test; the simulated welding components comprise lead simulated welding components and lead-free simulated welding components.
In a specific embodiment, the S40 includes:
s400, conducting lead component analysis on the M components qualified by the first performance state inspection, judging whether the components contain lead or not, and if yes, judging that the components contain lead; if not, judging as a lead-free component;
the purpose of conducting component analysis on the lead is to judge whether the lead of the sealed component contains lead or not so as to select different welding conditions to conduct a simulation welding test. The method comprises the following steps of judging whether a lead contains lead or not, wherein firstly, the lead of the component is identified through the surface of a component packaging material, the surface of a real object or a certification material, and if the PBF and other characters are marked, the lead of the component does not contain lead; and secondly, performing energy spectrum analysis on the lead of the component and judging whether the analysis result contains lead element.
S402, conducting the lead-containing simulated welding test on the lead-containing component to obtain the lead-containing simulated welding component; and carrying out the lead-free simulated welding test on the lead-free components to obtain the lead-free simulated welding components, wherein the sum of the number of the lead-containing simulated welding components and the number of the lead-free simulated welding components is M.
In a specific example, according to whether a lead of a component contains lead, the thickness of the component or the packaging volume (obtained by measuring and calculating with a vernier caliper), a corresponding welding condition shown in fig. 3 is selected to perform a lead-containing simulated welding test or a lead-free simulated welding test, wherein a relation between welding time and welding temperature is shown in fig. 4, and it can be understood by those skilled in the art with reference to fig. 3 and 4, and the detailed process of the simulated welding test is not described again in the present application.
S50, performing second performance state inspection on the M simulated welding components, judging whether unqualified components exist in the M simulated welding components, if so, judging that the welding heat resistance performance evaluation test of the N components to be tested is unqualified, if not, obtaining M components qualified by the second performance state inspection, and executing S60;
in one specific example, the components after the simulated soldering test are subjected to a second performance state check, namely a post-test performance check, wherein the second performance check comprises a second appearance check, a second electrical test and a second tightness check. The S50 includes:
s500, second appearance inspection, which is used for inspecting whether the leads of the M simulated welding components meet a first preset unqualified standard, and if yes, judging that the welding heat resistance evaluation test of the N components to be tested is unqualified; if not, executing S502;
in one specific example, the leads of 2 components are inspected under a magnifier or microscope within a range of 1-100 times. And when any one of the broken lead wire of the sealed component, a gap between the root part of the lead wire and the sealed shell, the diameter of a pit or the width of a recess on the lead wire exceeds 25% of the width of the lead wire, the depth of the pit or the recess is more than 50% of the thickness of the lead wire, and the area of the base metal exposed by the lead wire is more than 5% of the surface area of the lead wire due to scratches, judging the lead wire to be unqualified by.
If unqualified components exist in the second appearance inspection, the welding resistance thermal property evaluation test of the batch of sealed devices (namely N components to be tested) is unqualified, and the subsequent test is stopped, namely the second electrical test and the second tightness inspection are not carried out any more; if the components in the second appearance inspection are all qualified, S502 is executed.
S502, a second electrical test is carried out for checking whether the electrical functions of the components qualified by the second appearance check are intact, if yes, S504 is executed; if not, determining that the welding heat resistance evaluation test of the N components to be tested is unqualified;
and (4) carrying out electrical test on 2 components qualified by the second appearance inspection according to a device manual, and verifying whether the electrical functions of the 2 components are intact. If unqualified components exist in the second electrical test, the welding resistance thermal property evaluation test of the sealed components is unqualified, and the subsequent test is stopped, namely the second sealing performance check is not carried out; if the components in the second electrical test are qualified, executing S504;
s504, second tightness inspection, which is used for inspecting whether the sealing area of the component which is qualified through the second appearance inspection and the second electrical test meets a second preset unqualified standard, if so, the welding heat resistance performance evaluation test of the N components to be tested is judged to be unqualified; if not, go to S60.
And (4) carrying out tightness inspection on the components which are qualified in the second appearance inspection and the second electrical test, and inspecting whether the components are sealed badly or have air leakage and the like. The test method for inspecting the sealing property of the sealed component and the failure determination standard (second predetermined failure standard) refer to GJB548B-2005 method 1014.2.
If unqualified components exist in the second sealing performance check, the welding heat resistance performance evaluation test of the batch of sealing components is unqualified; if all the components in the second sealing performance check are qualified, S60 is executed.
S60, performing welding heat influence evaluation on the M components qualified in the second performance state inspection, and if all the welding heat influence evaluations of the M components qualified in the second performance state inspection are qualified, judging that the welding heat resistance performance evaluation test of the N components to be tested is qualified; and if not, judging that the welding heat resistance evaluation test of the N components to be tested is unqualified.
It will be understood by those skilled in the art that the second performance check and the qualified result of the sealed device after the simulated soldering are completed indicate that the thermal stress in the soldering process does not cause fatal defects or influence on the device, but may cause potential damage to the chip, the bonding strength or the shear strength inside the device, thereby reducing the reliability of the device, and therefore further evaluation of the soldering heat influence is needed.
Wherein, the evaluation of welding heat influence comprises an internal visual inspection test, a bonding strength test and a shearing strength test.
It should be noted that in the test for evaluating the welding heat resistance of the sealed component, only all the tests in the evaluation of the welding heat influence are qualified, and the overall result of the test for evaluating the welding heat resistance is qualified; if any test fails, the welding heat resistance evaluation test fails.
In a specific example, the S60 includes:
s600, an internal visual inspection test is carried out, wherein the internal visual inspection test is used for checking whether the inner sheet structure of any one component qualified by the second performance state inspection meets a third preset unqualified standard, and if yes, the welding heat resistance performance evaluation test of the N components to be tested is judged to be unqualified; if not, go to 602;
in this example, the analog soldered device is unsealed, exposing the internal die and bonding structures. And observing by using a body type microscope and a metallographic microscope within a range of 50-1000 times, and checking whether damage is caused to the internal bonding of the sealing device and the chip structure in the simulated welding process. The internal visual inspection test failure criterion refers to the GJB548B-2005 method 2020.1 (namely the third preset failure standard), and it should be noted that the damage in the internal visual inspection test does not include the damage to the components caused by acid corrosion in the unsealing process.
If the internal visual inspection test is unqualified, the welding heat resistance evaluation test of the batch of sealing devices is unqualified, and the subsequent test is stopped, namely the bonding strength test and the shearing strength test are not carried out any more; if no unqualified condition appears in the internal visual inspection test, S602 is executed.
S602, a bonding strength test is carried out, wherein the bonding strength test is used for checking whether the bonding strength of any one component qualified in the internal visual inspection test meets a fourth preset unqualified standard, and if yes, the welding heat resistance evaluation test of the N components to be tested is judged to be unqualified; if not, executing S604;
in this example, the bonding strength test is performed on the device after the internal visual inspection, and whether the internal bonding strength of the sealed device is damaged in the simulated welding process is checked. Wherein the failure criterion of the bonding strength test is referenced to GJB548B-2005 method 2011.1 (i.e., the fourth predetermined failure criterion).
If the bonding strength test has unqualified condition, the welding heat resistance evaluation test of the batch of sealing devices is unqualified, and the subsequent test is stopped, namely the shear strength test is not carried out any more; if no failure occurs in the bonding strength test, S604 is executed.
S604, a shear strength test is carried out, and the shear strength test is used for checking whether the bonding strength of the internal chip of any one component which is qualified in the internal visual inspection test and the bonding strength test meets a fifth preset unqualified standard, if so, the welding heat resistance evaluation test of the N components to be tested is judged to be unqualified; and if not, judging that the welding heat resistance evaluation test of the N components to be tested is qualified.
And carrying out a chip shear strength test on the device subjected to the bonding strength test, and checking whether the bonding strength of the chip in the sealing device is damaged in the simulated welding process. Wherein the failure criterion of the shear strength test refers to GJB548B-2005 method 2019.2 (i.e. the fifth preset failure standard).
If the shear strength test is unqualified, the welding heat resistance evaluation test of the batch of sealing devices is unqualified; and if the shear strength test does not have the unqualified condition, the welding heat resistance performance evaluation test of the sealed devices is qualified.
The qualification of the welding heat resistance evaluation test shows that the materials, the structures, the electrical performance parameters and the reliability of the sealed devices of the batch are not obviously damaged and influenced in the simulated welding process.
The method comprehensively and comprehensively evaluates the soldering heat resistance of the sealed device, particularly the sealed device with small size and dense leads, compares the external appearance, the electrical property, the internal structure and the like before and after the test, inspects the internal chip, the bonding shear strength and the like of the device, comprehensively analyzes the influence of soldering heat on the reliability of the device, and can accurately evaluate the soldering heat resistance of the sealed device.
By the method, the problems of sealing air leakage, internal solder re-melting and the like caused by welding heat can be analyzed, the difference of the test conditions of the lead-containing sealing device and the lead-free sealing device is considered, the problem that the sealing device with small size and dense leads cannot be comprehensively evaluated in terms of welding heat resistance can be solved, and the inherent reliability of the sealing device is promoted to be improved.
It is noted that, in the description of the present application, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.
Claims (11)
1. A method for evaluating welding heat resistance of a sealed component is characterized by comprising the following steps:
s10, sampling the N components to be tested according to the worst condition principle to obtain M sampled components, wherein M is a natural number which is more than or equal to 2 and less than or equal to N;
s20, performing first performance state inspection on the M sampling components, judging whether unqualified components exist in the M sampling components, and if yes, executing S30; if not, executing S40;
s30, rejecting unqualified components, resampling, performing first performance state inspection on the resampled components until the first performance state inspection of all the sampled components is qualified, obtaining M components with qualified first performance state inspection, and executing S40, wherein the number of the resampled components is equal to that of the unqualified components;
s40, performing a simulated welding test on the M components qualified by the first performance state inspection to obtain M simulated welding components;
s50, performing second performance state inspection on the M simulated welding components, judging whether unqualified components exist in the M simulated welding components, if so, judging that the welding heat resistance performance evaluation test of the N components to be tested is unqualified, if not, obtaining M components qualified by the second performance state inspection, and executing S60;
s60, performing welding heat influence evaluation on the M components qualified in the second performance state inspection, and if all the welding heat influence evaluations of the M components qualified in the second performance state inspection are qualified, judging that the welding heat resistance performance evaluation test of the N components to be tested is qualified; and if not, judging that the welding heat resistance evaluation test of the N components to be tested is unqualified.
2. The method of claim 1, wherein the first performance state check comprises: a first visual inspection, a first electrical test, and a first leak tightness inspection.
3. The method according to claim 2, wherein the S20 includes:
s200, performing first appearance inspection for inspecting whether the leads of the M sampling components meet a first preset unqualified standard, and if so, executing S30; if not, executing S202;
s202, a first electrical test is carried out for checking whether the electrical function of the component qualified by the first appearance check is intact, if yes, S204 is executed; if not, executing S30;
s204, first tightness inspection, which is used for inspecting whether the sealing area of the component which is qualified by the first appearance inspection and the first electrical test meets a second preset unqualified standard, if yes, S30 is executed; if not, go to S40.
4. The method of claim 1, wherein the simulated welding tests include a lead simulated welding test and a lead-free simulated welding test; the simulated welding components comprise lead simulated welding components and lead-free simulated welding components.
5. The method according to claim 4, wherein the S40 includes:
s400, conducting lead component analysis on the M components qualified by the first performance state inspection, judging whether the components contain lead or not, and if yes, judging that the components contain lead; if not, judging as a lead-free component;
s402, conducting the lead-containing simulated welding test on the lead-containing component to obtain the lead-containing simulated welding component; and carrying out the lead-free simulated welding test on the lead-free components to obtain the lead-free simulated welding components, wherein the sum of the number of the lead-containing simulated welding components and the number of the lead-free simulated welding components is M.
6. The method of claim 1, wherein the second performance state check comprises: a second visual inspection, a second electrical test, and a second leak tightness inspection.
7. The method according to claim 6, wherein the S50 includes:
s500, second appearance inspection, which is used for inspecting whether the leads of the M simulated welding components meet a first preset unqualified standard, and if yes, judging that the welding heat resistance evaluation test of the N components to be tested is unqualified; if not, executing S502;
s502, a second electrical test is carried out for checking whether the electrical functions of the components qualified by the second appearance check are intact, if yes, S504 is executed; if not, determining that the welding heat resistance evaluation test of the N components to be tested is unqualified;
s504, second tightness inspection, which is used for inspecting whether the sealing area of the component which is qualified through the second appearance inspection and the second electrical test meets a second preset unqualified standard, if so, the welding heat resistance performance evaluation test of the N components to be tested is judged to be unqualified; if not, go to S60.
8. The method according to claim 3 or 7,
the first preset unqualified standard is any one of a first condition, a second condition, a third condition and a fourth condition, wherein the first condition is the disconnection of a lead of a component; the second condition is that a gap is formed between the root of the lead of the component and the sealing shell; the third condition is that the diameter of a pit on a lead of the component or the width of the pit exceeds 25% of the width of the lead, and the depth of the pit is more than 50% of the thickness; the fourth condition is that scratches on the component enable the exposed base metal area of the lead to be more than 5% of the surface area of the lead;
the second pre-defined disqualification criteria is any of the conditions under clause GJB548B-2005 method 1014.2.
9. The method of claim 1, wherein the weld heat influence assessment comprises: internal visual inspection test, bonding strength test and shear strength test.
10. The method according to claim 9, wherein the S60 includes:
s600, an internal visual inspection test is carried out, wherein the internal visual inspection test is used for checking whether the internal structure of any one component qualified by the second performance state inspection meets a third preset unqualified standard, and if yes, the welding heat resistance performance evaluation test of the N components to be tested is judged to be unqualified; if not, go to 602;
s602, a bonding strength test is carried out, wherein the bonding strength test is used for checking whether the bonding strength of any one component qualified in the internal visual inspection test meets a fourth preset unqualified standard, and if yes, the welding heat resistance evaluation test of the N components to be tested is judged to be unqualified; if not, executing S604;
s604, a shear strength test is carried out, and the shear strength test is used for checking whether the bonding strength of the internal chip of any one component which is qualified in the internal visual inspection test and the bonding strength test meets a fifth preset unqualified standard, if so, the welding heat resistance evaluation test of the N components to be tested is judged to be unqualified; and if not, judging that the welding heat resistance evaluation test of the N components to be tested is qualified.
11. The method of claim 10,
the third preset unqualified standard is any one of GJB548B-2005 method 2020.1 in the state army standard;
the fourth preset unqualified standard is any one of GJB548B-2005 method 2011.1 in the state army standard;
the fifth default unqualified standard is any one of GJB548B-2005 method 2019.2.
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| CN114769828A (en) * | 2022-04-13 | 2022-07-22 | 江苏诺森特电子科技有限公司 | Welding method, welding device, and storage medium |
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