CN113059295A - Tin-bismuth solder strip and continuous production process thereof - Google Patents
Tin-bismuth solder strip and continuous production process thereof Download PDFInfo
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- CN113059295A CN113059295A CN202110207576.5A CN202110207576A CN113059295A CN 113059295 A CN113059295 A CN 113059295A CN 202110207576 A CN202110207576 A CN 202110207576A CN 113059295 A CN113059295 A CN 113059295A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Abstract
The invention discloses a tin bismuth solder strip and a continuous production process thereof, wherein the continuous production process of the tin bismuth solder strip comprises the following steps: (1) preheating a tin-bismuth alloy ingot blank, and then carrying out hot extrusion; (2) carrying out secondary heating on the hot-extruded discard, then shearing, and then adding the next preheated tin-bismuth alloy ingot blank for hot extrusion treatment to obtain the tin-bismuth solder strip; in the step (2), the temperature of the secondary heating is 60-200 ℃. The continuous production process is realized by adopting a mode of secondary heating excess pressure and shearing excess pressure, so that the ingot blank is softened, the pressure requirement of shearing excess pressure is reduced, the balance of the excess pressure temperature and the temperature of the next ingot blank is realized, and the internal temperature field is homogenized when the next ingot blank is extruded. And on the other hand, the tail part of the discard is sheared, so that the discard is smoothly combined with the surface of the next ingot blank. Meanwhile, the technical points in the production process are regulated and controlled to achieve the purposes of refining the material structure and improving the processing performance of the material.
Description
Technical Field
The invention belongs to the technical field of material processing, and particularly relates to a tin bismuth solder strip and a continuous production process thereof.
Background
Because of the requirement of environmental protection, most of the packaging of civil electronic product components and parts gradually replace tin-lead solder containing lead element by lead-free solder. Due to the requirements of different welding conditions, lead-free solders are generally divided into three types of high-temperature solders, medium-temperature solders and low-temperature solders according to different welding temperatures, and tin-bismuth alloys are considered as a typical representative of low-temperature solders because of having a melting point of 138 ℃, and are increasingly used in secondary welding and vacuum sealing welding.
One of the great problems when the tin-bismuth alloy is used as a low-temperature solder is that the tin-bismuth alloy has poor processability, presents obvious brittle cracking during cold processing, and cannot meet the requirements of the electronic industry on small and thin solder size. At present, the tin-bismuth alloy is processed by adopting a hot rolling process, but even if the hot rolling process is adopted, the allowable pass deformability of the tin-bismuth alloy is still small, a thin strip with the thickness of 0.05mm required by a customer is generally rolled by more than twenty passes, and the rolling can be smoothly finished at a very low rolling speed, so the production cost is high. Meanwhile, due to the brittleness of the tin-bismuth alloy, the plate strip is directly cast in general actual production, and then the plate strip is subjected to hot rolling processing.
Therefore, the problem to be solved in the field is to find a process method for producing the tin bismuth solder ribbon with low cost and high efficiency.
Disclosure of Invention
The invention aims to provide the tin bismuth solder strip and the continuous production process thereof aiming at the defects of the prior art, and the aims of refining the tin bismuth alloy structure and improving the processing performance of the tin bismuth solder strip are achieved by controlling the process key points in the production process, so that the effects of reducing the production cost and improving the production efficiency are achieved.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows: a continuous production process of a tin bismuth solder strip comprises the following steps:
(1) preheating a tin-bismuth alloy ingot blank, and then carrying out hot extrusion;
(2) carrying out secondary heating on the hot-extruded discard, then shearing, and then adding the next preheated tin-bismuth alloy ingot blank for hot extrusion treatment to obtain the tin-bismuth solder strip;
in the step (2), the temperature of the secondary heating is 60-200 ℃.
After the last tin-bismuth alloy ingot blank is subjected to hot extrusion, hot air at the temperature of 60-200 ℃ is adopted to blow and heat the discard, so that the material can be softened, the pressure requirement on a shearing mechanism during shearing discard is reduced, and the balance between the discard temperature and the temperature of the next ingot blank can be realized, so that the internal temperature field is more uniform during the extrusion of the next ingot blank.
Because the discard bears the pressure of the extrusion process, causing deformation, the discard tail does not generally exhibit flat, regular shape characteristics after the extrusion barrel is retracted, which may cause a large amount of air and voids between the discard and the next ingot, and in order to eliminate these undesirable phenomena, the discard tail needs to be sheared to smoothly join the discard in the extrusion die with the surface of the next ingot.
As a preferred embodiment of the present invention, in the step (2), the temperature of the secondary heating is 120-140 ℃.
According to the invention, the hot air blowing device is adopted to carry out secondary heating on the residual pressure in the extrusion cylinder, and a large number of experiments prove that the secondary heating temperature is in the range of 120-140 ℃, and the temperature distribution in the ingot blank is most uniform when the tin-bismuth alloy is continuously extruded.
As a preferred embodiment of the present invention, in the step (2), the secondary heating is maintained during the shearing treatment.
The material can be softened by keeping secondary heating in the process of the residual pressure shearing treatment, so that the brittleness of the material is reduced, and the shearing process is easier.
As a preferred embodiment of the invention, the tin-bismuth alloy ingot blank is preheated after being turned; preheating the turned tin-bismuth alloy ingot blank in an extrusion cylinder of an extruder; the height of the orifice of the extrusion die fitted in the extruder is 0.5 to 5mm, and more preferably, the height of the orifice of the extrusion die fitted in the extruder is 0.5 to 1 mm.
An extrusion die with the die hole width of 0.5-5mm is assembled in an extruder, so that the solder strip with the thickness as close as possible to the thickness of a finished product can be obtained, the requirement on subsequent processing of brittle materials such as tin-bismuth alloy is reduced, and the overall production cost of the product is reduced.
As a preferred embodiment of the present invention, in the step (1), the preheating temperature of the Sn-Bi alloy ingot blank is 60-120 ℃.
The invention fully utilizes the plasticity of the tin-bismuth alloy at high temperature (60-120 ℃), reduces the extrusion force, simultaneously ensures that the extruded solder strip has certain strength, and is convenient for the smooth realization of the subsequent curling process.
As a preferred embodiment of the present invention, in the step (1), the extrusion ratio of the hot extrusion is 50 to 300.
The invention adopts 50-300 of large extrusion ratio to carry out hot extrusion on the tin-bismuth alloy, can crush coarse crystalline phase and dendritic crystal phase caused by tissue segregation during casting, makes the internal tissue distribution of the whole solder strip more uniform, and can also improve the processing performance of the material.
As a preferred embodiment of the invention, in the step (1), the preheating temperature of the tin bismuth alloy ingot blank is 80-100 ℃; the extrusion ratio of the hot extrusion is 80-120.
The preheating temperature of the tin-bismuth alloy is controlled to be 80-100 ℃, so that smooth extrusion of the tin-bismuth alloy is most favorably realized, and the extrusion force is small. And the extrusion ratio is adopted, so that the structure of the tin-bismuth alloy strip can be refined, the extrusion force required in the extrusion process can be reduced, and the load of the extruder is reduced.
As a preferred embodiment of the continuous production process of the tin-bismuth solder strip, the method further comprises the following steps: cooling and drying the tin bismuth solder strip subjected to the hot extrusion treatment in the step (2) to obtain a tin bismuth solder strip; the cooling mode is 0.5-3 kg of pressure cold water spray, and more preferably, the cooling mode is 0.1-2 kg of pressure cold water spray.
And (3) spraying and cooling the thin strip which is just subjected to hot extrusion by adopting cold water with the pressure of 0.5-3 kilograms, so that the surface temperature of the solder strip can be reduced, the oxidation degree of the surface of the solder strip in a high-temperature state is reduced, and the surface smoothness of the solder strip is improved. On the other hand, the solder strip after hot extrusion is prevented from being too soft to bend and cannot smoothly flow out of the flow guide groove. At the same time, the temperature cannot be too low, otherwise the brittle tin-bismuth alloy can be directly cracked during the curling. The invention adopts a drying mode of drying by an air knife, takes away the moisture on the surface of the tin bismuth solder strip which is subjected to spray cooling, and prevents the residual moisture on the surface from influencing the service performance of the solder.
As a preferred embodiment of the continuous production process of the tin-bismuth lead-free solder strip, the method further comprises the following steps: and rolling the tin-bismuth solder strip at a rolling speed of 0.1-10 m/min.
The invention arranges a continuously controllable rolling mechanism with a speed of 0.1-10 m/min in front of the tin-bismuth solder strip dried by the air knife, which is beneficial to reducing the wave phenomenon generated during the extrusion of the solder strip and improving the flatness of the product, but can not cause the strip to be forcibly pulled out of the extrusion die because of too fast rolling, reduce the precision control requirement of the solder strip in the aspect of width, and realize the continuous traction type curling of the large-roll solder thin strip.
More preferably, the tin bismuth solder strip is coiled at a coiling speed of 5-8 m/min.
The invention also claims a tin bismuth solder strip produced by adopting the continuous production process of the tin bismuth solder strip.
As a preferred embodiment of the invention, the tin bismuth solder strip has a thickness of 0.5 to 5 mm.
Compared with the prior art, the invention has the beneficial effects that:
(1) according to the invention, a mode of secondary heating residual pressure and shearing residual pressure is adopted for realizing the continuous production process of the tin bismuth solder strip, on one hand, the secondary heating can soften the tin bismuth alloy residual pressure, reduce the pressure requirement during shearing residual pressure, realize the balance between the residual pressure temperature and the temperature of the next ingot blank, and enable the internal temperature field to be more uniform during the extrusion of the next ingot blank. On the other hand, the tail part of the extrusion residue is sheared, so that the extrusion residue in the extrusion die is smoothly combined with the surface of the next ingot blank.
(2) The hot extrusion process of the invention ensures that the temperature field distribution of the tin bismuth alloy ingot blank is uniform, and reduces the risk of quality problems of the tin bismuth solder strip caused by abnormal metal flow in the hot extrusion process.
(3) The invention realizes the large-roll continuous production of the tin-bismuth solder strip, the product size can be as close as possible to the requirement of a finished product, and the burden of subsequent processing procedures is reduced, thereby reducing the production cost.
(4) The invention achieves the purposes of controlling and refining the microstructure of the tin-bismuth alloy and improving the processing performance of the tin-bismuth solder strip by controlling the technological key points in the production process, thereby playing the roles of reducing the production cost and improving the production efficiency.
Drawings
FIG. 1 is a flow chart of the production process of the tin bismuth solder strip.
Fig. 2 is a diagram of a tin bismuth solder strip prepared in example 1 of the present invention.
Fig. 3 is a scanning electron microscope image of the internal microstructure of the tin bismuth solder strip prepared in example 1 of the present invention.
Fig. 4 is a diagram of a tin bismuth solder strip prepared in comparative example 1 of the present invention.
Fig. 5 is a scanning electron microscope image of the internal microstructure of the tin bismuth solder strip prepared in comparative example 3 of the invention.
Fig. 6 is a surface state diagram of a tin bismuth solder strip prepared by comparative example 5 of the present invention.
Fig. 7 is a diagram of a tin bismuth solder strip prepared according to comparative example 6 of the present invention.
Fig. 8 is a diagram of a tin bismuth solder strip prepared according to comparative example 7 of the present invention.
Detailed Description
To better illustrate the objects, aspects and advantages of the present invention, the present invention will be further described with reference to specific examples.
FIG. 1 is a flow chart of the production process of the tin bismuth solder strip. The specific steps of the continuous production process of the tin bismuth solder strip described in the examples 1 to 4 and the comparative examples 2 to 7 are as follows: (1) casting; (2) turning; (3) preheating; (4) hot extrusion; (5) blowing by hot air; (6) shearing residual pressure; (7) repeatedly extruding; (8) cooling; (9) drying; (10) and (6) rolling.
Example 1
The invention relates to an embodiment of a continuous production process of a tin-bismuth solder strip, which comprises the following specific steps:
(1) casting: and obtaining 10 phi 80X 350mm tin bismuth alloy ingot blanks by casting, wherein the total weight of the batches is 150 kg.
(2) Turning: turning the surface of the ingot blank to enable the ingot blank to be smoothly filled into an extrusion cylinder of an extruder.
(3) Preheating: all ingots were preheated in a 100 ℃ furnace and fitted with an extrusion die having a die hole height of 0.5mm in an extruder.
(4) Extruding: and filling the tin-bismuth alloy ingot blank into an extrusion cylinder, and then carrying out hot extrusion with the extrusion ratio of 120.
(5) Hot air blowing: after finishing the extrusion of an ingot blank, after the extrusion cylinder returns to the original position, the hot air blowing device is aligned to the extrusion residual pressure for secondary heating, and the temperature is set at 120 ℃.
(6) Shearing and pressing: and (3) shearing and removing the residual pressure outside the extrusion die by adopting a shearing mechanism of the extruder, wherein the hot air blowing device keeps a heating state all the time in the process.
(7) And (3) repeatedly extruding: and after the action of shearing the discard is finished, stopping heating the discard, filling the next preheated ingot blank in the extrusion cylinder, and continuing to perform hot extrusion on the next ingot blank.
(8) Cooling and blow-drying: and (3) carrying out spray cooling on the tin-bismuth alloy thin strip which is extruded and comes out of the die hole by adopting 1 kilogram of cold water, and drying the moisture on the surface of the strip by adopting an air knife after the temperature of the tin-bismuth alloy thin strip is reduced.
(9) Winding: a continuous winding mechanism with the speed of 3 m/min is arranged in front of the material belt for drying moisture by an air knife, so that the continuous traction type curling of the tin-bismuth lead-free solder thin belt is realized, and finally, the continuous production of about 150 kg of tin-bismuth solder strip is finished.
Fig. 2 is a tin bismuth solder band diagram prepared in example 1 of the present invention. As can be seen from FIG. 2, the tin bismuth solder strip has smooth, compact and defect-free surface, and uniform and controllable thickness and width. Fig. 3 is a scanning electron microscope image of the internal microstructure of the tin bismuth solder strip prepared in example 1 of the present invention. As can be seen from FIG. 3, the structure of the tin bismuth solder strip is uniform, and a segregation structure which is not completely broken does not appear.
Example 2
The invention relates to an embodiment of a continuous production process of a tin-bismuth solder strip, which comprises the following specific steps:
(1) casting: and obtaining 10 phi 80X 350mm tin bismuth alloy ingot blanks by casting, wherein the total weight of the batches is 150 kg.
(2) Turning: turning the surface of the ingot blank to enable the ingot blank to be smoothly filled into an extrusion cylinder of an extruder.
(3) Preheating: all ingots were preheated in a 60 ℃ furnace and fitted with an extrusion die having a die hole height of 1mm in an extruder.
(4) Extruding: and filling the tin-bismuth alloy ingot blank into an extrusion cylinder, and then carrying out hot extrusion with the extrusion ratio of 50.
(5) Hot air blowing: after finishing the extrusion of an ingot blank, after the extrusion cylinder returns to the original position, the hot air blowing device is aligned to the extrusion residual pressure for secondary heating, and the temperature is set at 60 ℃.
(6) Shearing and pressing: and (3) shearing and removing the residual pressure outside the extrusion die by adopting a shearing mechanism of the extruder, wherein the hot air blowing device keeps a heating state all the time in the process.
(7) And (3) repeatedly extruding: and after the action of shearing the discard is finished, stopping heating the discard, filling the next preheated ingot blank in the extrusion cylinder, and continuing to perform hot extrusion on the next ingot blank.
(8) Cooling and blow-drying: and (3) carrying out spray cooling on the tin-bismuth alloy thin strip which is extruded and comes out of the die hole by adopting cold water with the pressure of 0.5 kilogram, and drying the moisture on the surface of the strip by adopting an air knife after the temperature of the tin-bismuth alloy thin strip is reduced.
(9) Winding: a continuous winding mechanism with the speed of 10 m/min is arranged in front of the thin strip dried by the air knife to realize the continuous traction type curling of the tin bismuth lead-free solder thin strip, and finally the continuous production of about 150 kg of tin bismuth solder strip is finished.
The tin bismuth solder strip prepared in the embodiment 2 has a smooth and compact surface, is free from defects, and is uniform and controllable in thickness and width.
Example 3
The invention relates to an embodiment of a continuous production process of a tin-bismuth solder strip, which comprises the following specific steps:
(1) casting: and obtaining 10 phi 80X 350mm tin bismuth alloy ingot blanks by casting, wherein the total weight of the batches is 150 kg.
(2) Turning: turning the surface of the ingot blank to enable the ingot blank to be smoothly filled into an extrusion cylinder of an extruder.
(3) Preheating: all ingots were preheated in a 80 ℃ furnace and fitted with an extrusion die having a die hole height of 5mm in an extruder.
(4) Extruding: and filling the tin-bismuth alloy ingot blank into an extrusion cylinder, and then carrying out hot extrusion with the extrusion ratio of 80.
(5) Hot air blowing: after the extrusion of an ingot blank is finished, after the extrusion barrel returns to the original position, the hot air blowing device is aligned to the extrusion pressure and carries out secondary heating, and the temperature is set at 140 ℃.
(6) Shearing and pressing: and (3) shearing and removing the residual pressure outside the extrusion die by adopting a shearing mechanism of the extruder, wherein the hot air blowing device keeps a heating state all the time in the process.
(7) And (3) repeatedly extruding: and after the action of shearing the discard is finished, stopping heating the discard, filling the next preheated ingot blank in the extrusion cylinder, and continuing to perform hot extrusion on the next ingot blank.
(8) Cooling and blow-drying: and (3) carrying out spray cooling on the tin-bismuth alloy thin strip which is extruded and comes out of the die hole by adopting cold water with the pressure of 2 kilograms, and drying the moisture on the surface of the strip by adopting an air knife after the temperature of the tin-bismuth alloy thin strip is reduced.
(9) Winding: a continuous winding mechanism with the speed of 5 m/min is arranged in front of the thin strip dried by the air knife to realize the continuous traction type curling of the tin bismuth lead-free solder thin strip, and finally the continuous production of about 150 kg of tin bismuth solder strip is finished.
The tin bismuth solder strip prepared in the embodiment 3 has a smooth and compact surface, is free from defects, and is uniform and controllable in thickness and width.
Example 4
The invention relates to an embodiment of a continuous production process of a tin-bismuth solder strip, which comprises the following specific steps:
(1) casting: and obtaining 10 phi 80X 350mm tin bismuth alloy ingot blanks by casting, wherein the total weight of the batches is 150 kg.
(2) Turning: turning the surface of the ingot blank to enable the ingot blank to be smoothly filled into an extrusion cylinder of an extruder.
(3) Preheating: all ingots were preheated in a 120 ℃ furnace and fitted with an extrusion die having a die hole height of 0.8mm in an extruder.
(4) Extruding: and filling the tin-bismuth alloy ingot blank into an extrusion cylinder, and then carrying out hot extrusion with the extrusion ratio of 300.
(5) Hot air blowing: after finishing the extrusion of an ingot blank, after the extrusion cylinder returns to the original position, the hot air blowing device is aligned to the extrusion residual pressure for secondary heating, and the temperature is set at 200 ℃.
(6) Shearing and pressing: and (3) shearing and removing the residual pressure outside the extrusion die by adopting a shearing mechanism of the extruder, wherein the hot air blowing device keeps a heating state all the time in the process.
(7) And (3) repeatedly extruding: and after the action of shearing the discard is finished, stopping heating the discard, filling the next preheated ingot blank in the extrusion cylinder, and continuing to perform hot extrusion on the next ingot blank.
(8) Cooling and blow-drying: and (3) carrying out spray cooling on the tin-bismuth alloy thin strip which is extruded and comes out from the die hole by adopting cold water with the pressure of 3 kilograms, and drying the moisture on the surface of the strip by adopting an air knife after the temperature of the tin-bismuth alloy thin strip is reduced.
(9) Winding: a continuous winding mechanism with the speed of 8 m/min is arranged in front of the thin strip dried by the air knife to realize the continuous traction type curling of the tin bismuth lead-free solder thin strip, and finally the continuous production of about 150 kg of tin bismuth solder strip is finished.
The tin bismuth solder strip prepared in the embodiment 4 has a smooth, compact and defect-free surface, and is uniform and controllable in thickness and width.
Comparative example 1
The invention relates to a comparative example of a continuous production process of a tin-bismuth solder strip, which comprises the following specific steps:
(1) casting: and obtaining 10 phi 80X 350mm tin bismuth alloy ingot blanks by casting, wherein the total weight of the batches is 150 kg.
(2) Turning: turning the surface of the ingot blank to enable the ingot blank to be smoothly filled into a extruding cylinder of an extruding machine.
(3) Preheating: all ingots were preheated in a 100 ℃ furnace and fitted with an extrusion die having a die hole height of 0.5mm in an extruder.
(4) Extruding: and filling the tin-bismuth alloy ingot blank into an extrusion cylinder, and then carrying out hot extrusion with the extrusion ratio of 120.
(5) Shearing and pressing: and shearing and removing the residual pressure outside the extrusion die by using a shearing mechanism of the extruder.
(6) And (4) repeatedly extruding, filling the next preheated ingot blank in the extrusion cylinder after the shearing and residual pressing actions are finished, and continuously carrying out hot extrusion on the next ingot blank.
(7) Cooling and blow-drying: and (3) carrying out spray cooling on the tin-bismuth alloy thin strip which is extruded and comes out of the die hole by adopting 1 kilogram of cold water, and drying the moisture on the surface of the strip by adopting an air knife after the temperature of the tin-bismuth alloy thin strip is reduced.
(8) Winding: a continuous winding mechanism with the speed of 3 m/min is arranged in front of the thin strip dried by the air knife to realize the continuous traction type curling of the tin bismuth lead-free solder thin strip, and finally the continuous production of about 150 kg of tin bismuth solder strip is finished.
In the process of preparing the tin bismuth solder strip in the comparative example 1, the secondary heating is not carried out, so that the residual extrusion temperature in the extrusion die is seriously low, the extrusion cannot be finished, and the phenomenon of serious brittle fracture can occur even if the strip is extruded. Fig. 4 is a tin bismuth solder strip prepared according to comparative example 1 of the present invention, which shows edge crack phenomenon.
Comparative example 2
The invention relates to a comparative example of a continuous production process of a tin-bismuth solder strip, which comprises the following specific steps:
(1) casting: and obtaining 10 phi 80X 350mm tin bismuth alloy ingot blanks by casting, wherein the total weight of the batches is 150 kg.
(2) Turning: turning the surface of the ingot blank to enable the ingot blank to be smoothly filled into an extrusion cylinder of an extruder.
(3) Preheating: all ingots were preheated in a 50 ℃ furnace and fitted with an extrusion die having a die hole height of 0.5mm in an extruder.
(4) Extruding: and filling the tin-bismuth alloy ingot blank into an extrusion cylinder, and then carrying out hot extrusion with the extrusion ratio of 120.
(5) Hot air blowing: after finishing the extrusion of an ingot blank, after the extrusion cylinder returns to the original position, the hot air blowing device is aligned to the extrusion residual pressure for secondary heating, and the temperature is set at 120 ℃.
(6) Shearing and pressing: and (3) shearing and removing the residual pressure outside the extrusion die by adopting a shearing mechanism of the extruder, wherein the hot air blowing device keeps a heating state all the time in the process.
(7) And (3) repeatedly extruding: after the action of shearing the discard is finished, the hot air blowing device is removed, the heating of the discard is stopped, meanwhile, the next preheated ingot blank is filled in the extrusion cylinder, and the hot extrusion of the next ingot blank is continued.
(8) Cooling and blow-drying: and (3) carrying out spray cooling on the tin-bismuth alloy thin strip which is extruded and comes out of the die hole by adopting 1 kilogram of cold water, and drying the moisture on the surface of the strip by adopting an air knife after the temperature of the tin-bismuth alloy thin strip is reduced.
(9) Winding: a continuous winding mechanism with the speed of 3 m/min is arranged in front of the thin strip dried by the air knife to realize the continuous traction type curling of the tin bismuth lead-free solder thin strip, and finally the continuous production of about 150 kg of tin bismuth solder strip is finished.
The preheating temperature of the tin bismuth solder strip prepared in the comparative example 2 is too low, so that the breakthrough pressure of the extruder is increased to 180MPa, the used pressure is far higher than 100MPa in normal production, and the long-term implementation of the extrusion at the pressure value can seriously reduce the service life of the extruder.
Comparative example 3
The invention relates to a comparative example of a continuous production process of a tin-bismuth solder strip, which comprises the following specific steps:
(1) casting: and obtaining 10 phi 80X 350mm tin bismuth alloy ingot blanks by casting, wherein the total weight of the batches is 150 kg.
(2) Turning: turning the surface of the ingot blank to enable the ingot blank to be smoothly filled into a extruding cylinder of an extruding machine.
(3) Preheating; all ingots were preheated in a 100 ℃ furnace and fitted with an extrusion die having a die hole height of 0.5mm in an extruder.
(4) Extruding: and filling the tin-bismuth alloy ingot blank into an extrusion cylinder, and then carrying out hot extrusion with the extrusion ratio of 30.
(5) Hot air blowing: after finishing the extrusion of an ingot blank, after the extrusion cylinder returns to the original position, a special hot air blowing device is aligned to the extrusion residual pressure for secondary heating, and the temperature is set at 120 ℃.
(6) Shearing and pressing: and (3) shearing and removing the residual pressure outside the extrusion die by adopting a shearing mechanism of the extruder, wherein the hot air blowing device keeps a heating state all the time in the process.
(7) And (3) repeatedly extruding: after the action of shearing the discard is finished, the hot air blowing device is removed, the heating of the discard is stopped, meanwhile, the next preheated ingot blank is filled in the extrusion cylinder, and the hot extrusion of the next ingot blank is continued.
(8) Cooling and blow-drying: and (3) carrying out spray cooling on the tin-bismuth alloy thin strip which is extruded and comes out of the die hole by adopting 1 kilogram of cold water, and drying the moisture on the surface of the strip by adopting an air knife after the temperature of the tin-bismuth alloy thin strip is reduced.
(9) Winding: a continuous winding mechanism with the speed of 3 m/min is arranged in front of the thin strip dried by the air knife to realize the continuous traction type curling of the tin bismuth lead-free solder thin strip, and finally the continuous production of about 150 kg of tin bismuth solder strip is finished.
The tin bismuth solder strip prepared in comparative example 3 has too small extrusion ratio, so that the coarse crystalline phase and the dendritic crystalline phase caused by the structure segregation during the melt casting can not be completely broken, as shown in fig. 5, the distribution of the internal structure of the tin bismuth solder strip prepared in comparative example 3 is disordered.
Comparative example 4
The invention relates to a comparative example of a continuous production process of a tin-bismuth solder strip, which comprises the following specific steps:
(1) casting: and obtaining 10 phi 80X 350mm tin bismuth alloy ingot blanks by casting, wherein the total weight of the batches is 150 kg.
(2) Turning: turning the surface of the ingot blank to enable the ingot blank to be smoothly filled into an extrusion cylinder of an extruder.
(3) Preheating: all ingots were preheated in a 100 ℃ furnace and fitted with an extrusion die having a die hole height of 0.5mm in an extruder.
(4) Extruding: and filling the tin-bismuth alloy ingot blank into an extrusion cylinder, and then carrying out hot extrusion with the extrusion ratio of 120.
(5) Hot air blowing: after finishing the extrusion of an ingot blank, after the extrusion cylinder returns to the original position, a special hot air blowing device is aligned to the extrusion residual pressure for secondary heating, and the temperature is set at 50 ℃.
(6) Shearing and pressing: and (3) shearing and removing the residual pressure outside the extrusion die by adopting a shearing mechanism of the extruder, wherein the hot air blowing device keeps a heating state all the time in the process.
(7) And (3) repeatedly extruding: after the action of shearing the discard is finished, the hot air blowing device is removed, the heating of the discard is stopped, meanwhile, the next preheated ingot blank is filled in the extrusion cylinder, and the hot extrusion of the next ingot blank is continued.
(8) Cooling and blow-drying: and (3) carrying out spray cooling on the tin-bismuth alloy thin strip which is extruded and comes out of the die hole by adopting 1 kilogram of cold water, and drying the moisture on the surface of the strip by adopting an air knife after the temperature of the tin-bismuth alloy thin strip is reduced.
(9) Winding: a continuous winding mechanism with the speed of 3 m/min is arranged in front of the thin strip dried by the air knife to realize the continuous traction type curling of the tin bismuth lead-free solder thin strip, and finally the continuous production of about 150 kg of tin bismuth solder strip is finished.
Comparative example 4 when preparing tin bismuth solder strip, because the secondary heating temperature is too low, cause the breakthrough pressure of the extruder to rise to 150MPa, the pressure used is far higher than the 100MPa when the invention is normally produced, implement the extrusion of this kind of pressure value for a long time and seriously reduce the service life of the extruder.
Comparative example 5
The invention relates to a comparative example of a continuous production process of a tin-bismuth solder strip, which comprises the following specific steps:
(1) casting: and obtaining 10 phi 80X 350mm tin bismuth alloy ingot blanks by casting, wherein the total weight of the batches is 150 kg.
(2) Turning: turning the surface of the ingot blank to enable the ingot blank to be smoothly filled into an extrusion cylinder of an extruder.
(3) Preheating: all ingots were preheated in a 100 ℃ furnace and fitted with an extrusion die having a die hole height of 0.5mm in an extruder.
(4) Extruding: and filling the tin-bismuth alloy ingot blank into an extrusion cylinder, and then carrying out hot extrusion with the extrusion ratio of 120.
(5) Hot air blowing: after finishing the extrusion of an ingot blank, after the extrusion cylinder returns to the original position, the hot air blowing device is aligned to the extrusion residual pressure for secondary heating, and the temperature is set at 120 ℃.
(6) Shearing and pressing: and (3) shearing and removing the residual pressure outside the extrusion die by adopting a shearing mechanism of the extruder, wherein the hot air blowing device keeps a heating state all the time in the process.
(7) And (3) repeatedly extruding: after the action of shearing the discard is finished, the hot air blowing device is removed, the heating of the discard is stopped, meanwhile, the next preheated ingot blank is filled in the extrusion cylinder, and the hot extrusion of the next ingot blank is continued.
(8) Cooling and blow-drying: and (3) carrying out spray cooling on the tin-bismuth alloy thin strip which is extruded and comes out of the die hole by adopting cold water with the pressure of 0.1 kilogram, and drying the moisture on the surface of the strip by adopting an air knife after the temperature of the tin-bismuth alloy thin strip is reduced.
(9) Winding: a continuous winding mechanism with the speed of 3 m/min is arranged in front of the thin strip dried by the air knife to realize the continuous traction type curling of the tin bismuth lead-free solder thin strip, and finally the continuous production of about 150 kg of tin bismuth solder strip is finished.
The surface of the tin-bismuth solder strip prepared in the comparative example 5 has long cooling time and black spots due to small cold water pressure. As shown in fig. 6, black spots were present on the surface of the tin bismuth solder strip prepared in comparative example 5.
Comparative example 6
The invention relates to a comparative example of a continuous production process of a tin-bismuth solder strip, which comprises the following specific steps:
(1) casting: and obtaining 10 phi 80X 350mm tin bismuth alloy ingot blanks by casting, wherein the total weight of the batches is 150 kg.
(2) Turning: turning the surface of the ingot blank to enable the ingot blank to be smoothly filled into a extruding cylinder of an extruding machine.
(3) Preheating: all ingots were preheated in a 100 ℃ furnace and fitted with an extrusion die having a die hole height of 0.5mm in an extruder.
(4) Extruding: and filling the tin-bismuth alloy ingot blank into an extrusion cylinder, and then carrying out hot extrusion with the extrusion ratio of 120.
(5) Hot air blowing: after extrusion of an ingot blank is finished, after the extrusion barrel returns to the original position, the hot air blowing device is aligned to the extrusion pressure residue to carry out secondary heating, and the temperature is set at 210 ℃.
(6) Shearing and pressing: and (3) shearing and removing the residual pressure outside the extrusion die by adopting a shearing mechanism of the extruder, wherein the hot air blowing device keeps a heating state all the time in the process.
(7) And (3) repeatedly extruding: after the action of shearing the discard is finished, the hot air blowing device is removed, the heating of the discard is stopped, meanwhile, the next preheated ingot blank is filled in the extrusion cylinder, and the hot extrusion of the next ingot blank is continued.
(8) Cooling and blow-drying: and (3) carrying out spray cooling on the tin-bismuth alloy thin strip which is extruded and comes out of the die hole by adopting 1 kilogram of cold water, and drying the moisture on the surface of the strip by adopting an air knife after the temperature of the tin-bismuth alloy thin strip is reduced.
(9) Winding: a continuous winding mechanism with the speed of 3 m/min is arranged in front of the thin strip dried by the air knife to realize the continuous traction type curling of the tin bismuth lead-free solder thin strip, and finally the continuous production of about 150 kg of tin bismuth solder strip is finished.
The tin bismuth solder strip prepared in comparative example 6 has a severe wave defect on the surface and poor flatness due to excessively high secondary heating temperature. As shown in fig. 7.
Comparative example 7
The invention relates to a comparative example of a continuous production process of a tin-bismuth solder strip, which comprises the following specific steps:
(1) casting: and obtaining 10 phi 80X 350mm tin bismuth alloy ingot blanks by casting, wherein the total weight of the batches is 150 kg.
(2) Turning: turning the surface of the ingot blank to enable the ingot blank to be smoothly filled into a extruding cylinder of an extruding machine.
(3) Preheating: all ingots were preheated in a 100 ℃ furnace and fitted with an extrusion die having a die hole height of 0.5mm in an extruder.
(4) Extruding: and filling the tin-bismuth alloy ingot blank into an extrusion cylinder, and then carrying out hot extrusion with the extrusion ratio of 120.
(5) Hot air blowing: after extrusion of an ingot blank is finished, after the extrusion barrel returns to the original position, the hot air blowing device is aligned to the extrusion pressure residue to carry out secondary heating, and the temperature is set at 210 ℃.
(6) Shearing and pressing: and (3) shearing and removing the residual pressure outside the extrusion die by adopting a shearing mechanism of the extruder, wherein the hot air blowing device keeps a heating state all the time in the process.
(7) And (3) repeatedly extruding: after the action of shearing the discard is finished, the hot air blowing device is removed, the heating of the discard is stopped, meanwhile, the next preheated ingot blank is filled in the extrusion cylinder, and the hot extrusion of the next ingot blank is continued.
(8) Cooling and blow-drying: and (3) carrying out spray cooling on the tin-bismuth alloy thin strip which is extruded and comes out of the die hole by adopting 1 kilogram of cold water, and drying the moisture on the surface of the strip by adopting an air knife after the temperature of the tin-bismuth alloy thin strip is reduced.
(9) Winding: and manually rolling the casting under the action of no tension force, and finally completing the continuous production of about 150 kg of tin-bismuth solder strip.
The tin bismuth solder strip prepared in comparative example 7 has a severe wave defect on the surface due to no tension during rolling, and has poor flatness. As shown in fig. 8.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the protection scope of the present invention, and although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (10)
1. A continuous production process of a tin bismuth solder strip is characterized by comprising the following steps:
(1) preheating a tin-bismuth alloy ingot blank, and then carrying out hot extrusion;
(2) carrying out secondary heating on the hot-extruded discard, then carrying out shearing treatment, and then adding the next preheated tin-bismuth alloy ingot blank for carrying out hot extrusion treatment to obtain the tin-bismuth solder strip;
in the step (2), the temperature of the secondary heating is 60-200 ℃.
2. The continuous production process of tin-bismuth solder strip as claimed in claim 1, wherein in the step (2), the temperature of the secondary heating is 120-140 ℃.
3. The continuous production process of tin-bismuth solder strip according to claim 1, characterized in that in the step (2), secondary heating is maintained during the shearing treatment.
4. The continuous production process of tin-bismuth solder strip according to claim 1, wherein in the step (1), the preheating temperature of the tin-bismuth alloy ingot blank is 60-120 ℃.
5. The continuous production process of tin-bismuth solder strip according to claim 4, characterized in that in the step (1), the extrusion ratio of the hot extrusion is 50-300.
6. The continuous production process of the tin-bismuth solder strip according to claim 5, characterized in that in the step (1), the preheating temperature of the tin-bismuth alloy ingot blank is 80-100 ℃; the extrusion ratio of the hot extrusion is 80-120.
7. The continuous tin-bismuth solder strip production process of claim 1, further comprising the steps of: cooling and drying the tin bismuth solder strip subjected to the hot extrusion treatment in the step (2) to obtain a tin bismuth solder strip; the cooling mode is 0.5-3 kg of pressure cold water spraying.
8. The continuous tin-bismuth solder strip production process of claim 1, further comprising the steps of: and rolling the tin-bismuth solder strip at a rolling speed of 0.1-10 m/min.
9. A tin-bismuth solder strip produced by a continuous process for producing a tin-bismuth solder strip according to any one of claims 1 to 8.
10. The tin-bismuth solder strip of claim 9, wherein the tin-bismuth solder strip has a thickness of 0.5-5 mm.
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