CN113050390A - Micro-nano three-dimensional structure preparation system and method based on multi-scale multi-photon lithography technology - Google Patents
Micro-nano three-dimensional structure preparation system and method based on multi-scale multi-photon lithography technology Download PDFInfo
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Abstract
The invention discloses a micro-nano three-dimensional structure preparation system and method based on a multi-scale multi-photon lithography technology, and belongs to the technical field of optical micro-nano structure preparation. The system comprises a support structure, a substrate, a photopolymer reservoir, an objective lens, a first optical structure, a second optical structure, an optical imaging device, and a controller; the controller is used for controlling the opening and closing of the first optical structure and the second optical structure and working parameters, and the optical imaging device is used for acquiring imaging information of the objective lens; the first optical structure emits light with a first wavelength, and the light is focused in the photosensitive polymer through an objective lens to initiate single photon polymerization; the second optical structure emits light of a second wavelength, which is focused in the photopolymer by the objective lens to initiate multiphoton polymerization. The printing data of the micro-nano three-dimensional structure to be printed is subjected to high-resolution and low-resolution segmentation, and the micro-nano three-dimensional structure is printed layer by layer, so that the printing speed is improved on the basis of ensuring the printing precision.
Description
Technical Field
The invention belongs to the technical field of optical micro-nano structure preparation, and particularly relates to a micro-nano three-dimensional structure preparation system and method based on a multi-scale multi-photon lithography technology.
Background
With the development of micro-nano optics, micro-nano photonic devices gradually tend to be miniaturized, have diversified structures and are highly integrated. How to further improve the preparation of the micro-nano structure is always a difficult problem.
At present, a plurality of micro-nano photonic device preparation technologies are presented, such as a two-photon polymerization technology based on femtosecond laser, a single-photon polymerization technology based on a micro-mirror array structure, an electron beam lithography technology and other advanced preparation technologies. Among them, the electron beam lithography has extremely high precision but the processing is time-consuming and costly; the method is characterized in that the layer-by-layer preparation is realized through software control based on the single photon polymerization technology of the micro-mirror array structure, the processing speed is high, and the micron-sized precision is realized; the two-photon polymerization technology based on femtosecond laser is one of laser processing technologies developed in recent years, can break through the optical diffraction limit to realize three-dimensional processing of any complex structure in submicron scale, and has incomparable advantages compared with other similar technologies. By optimizing control and improving parameters of photosensitive polymers, the resolution of nanometer scale has been successfully realized when femtosecond laser multiphoton polymerization is used for micro-nano processing at present. However, the machining size thereof is limited. If a millimeter-scale or centimeter-scale device with micro-nano precision is prepared, the processing of the technology is time-consuming, and can be completed in hours or days, which seriously restricts the performance of a system for processing a high-performance optical device.
Disclosure of Invention
The invention provides a micro-nano three-dimensional structure preparation system and method based on a multi-scale multi-photon lithography technology, and aims to solve the problems that the processing technology in the prior art is high in precision but limited in processing size, and large in processing size but relatively low in precision. The invention utilizes multi-scale multi-photon photoetching technology, adopts two optical structures, wherein the first optical structure is used for providing light with a first wavelength so as to initiate a single photon polymerization process in a photosensitive polymer; the second optical structure is used to provide light at a second wavelength to initiate a two-photon polymerization process in the photopolymer. The printing data of the micro-nano three-dimensional structure to be printed is subjected to high-resolution and low-resolution segmentation, and the micro-nano three-dimensional structure is printed layer by layer, so that the printing speed is improved on the basis of ensuring the printing precision.
In order to achieve the purpose, the invention adopts the following technical scheme:
one of the purposes of the invention is to provide a micro-nano three-dimensional structure preparation system based on multi-scale multi-photon lithography, which comprises a supporting structure, a substrate, a photopolymer container pool, an objective lens, a first optical structure, a second optical structure, an optical imaging device and a controller, wherein the supporting structure is provided with a plurality of support grooves; the controller is used for controlling the opening and closing of the first optical structure and the second optical structure and working parameters, and the optical imaging device is used for acquiring imaging information of the objective lens;
the photosensitive polymer container pool is fixed on the supporting structure, the substrate is suspended right above the photosensitive polymer container pool through the multi-axis workbench, and the objective lens is arranged right below the photosensitive polymer container pool and can move in the vertical direction; the first optical structure emits light with a first wavelength, and the light is focused in the photosensitive polymer through an objective lens to initiate single photon polymerization; the second optical structure emits light of a second wavelength, which is focused in the photopolymer by the objective lens to initiate multiphoton polymerization.
The second purpose of the invention is to provide a micro-nano three-dimensional structure preparation method based on the system, which comprises the following steps:
1) starting a system, filling a photopolymer in a photopolymer container pool, immersing the substrate into the photopolymer container pool through a multi-axis workbench, and leaving a gap to be printed between the lower bottom surface of the substrate and the lower bottom surface of the photopolymer container pool; acquiring imaging information of an objective lens in real time through an optical imaging device;
2) obtaining model data of a micro-nano three-dimensional structure to be printed, putting low-resolution structural feature data in the model data into a first data set, and putting high-resolution structural feature data in the model data into a second data set;
3) slicing the three-dimensional data of the two data groups according to the direction from the bottom layer to the top layer, and converting the low-resolution structural feature data in the first data group into image patterns and corresponding layer values to be used as single photon lithography data; the image pattern corresponds to a light pattern for forming a low resolution structure;
converting the high-resolution structural feature data in the second data set into a writing sequence and corresponding layer values as multi-photon photoetching data; said writing sequence corresponding to a profile for forming a high resolution structure;
4) controlling a first optical structure to be opened, transmitting a light pattern corresponding to the image pattern at the bottommost layer according to single photon lithography data, adjusting the position of an objective lens in the vertical direction through imaging information of an optical imaging device, wherein the light pattern passes through the objective lens and then is focused on an oxygen permeable film at the bottom of a photopolymer container pool, a focusing area is an area to be printed, so that a photopolymer in a gap to be printed reserved between a substrate and the photopolymer container pool is polymerized in the focusing area, a low-resolution structure corresponding to the layer is printed and formed, and the first optical structure is closed;
5) controlling the second optical structure to be opened, emitting two-photon light corresponding to a writing sequence at the bottommost layer according to multi-photon photoetching data, printing point by point according to a track corresponding to the writing sequence, wherein the two-photon light passes through an objective lens and then is focused on an oxygen permeable film at the bottom of a photopolymer container pool, a focusing point is a point to be printed, so that photopolymer in a space to be printed reserved between a substrate and the photopolymer container pool is polymerized at the focusing point, the focusing point is moved until a high-resolution structure corresponding to the layer is printed and formed, and the second optical structure is closed;
6) moving the substrate upwards through a multi-axis workbench, and reserving a gap to be printed between the lower bottom surface of the substrate and the lower bottom surface of the photopolymer container pool; and repeating the step 5) and the step 6) until all data in the two data sets are traversed, completing the preparation of the micro-nano three-dimensional structure, moving the substrate out of the photosensitive polymer container pool through the multi-axis workbench, taking out the printing piece, and closing the system.
Compared with the prior art, the invention has the advantages that: the invention combines the multi-scale multi-photon photoetching technology, adopts two optical structures, wherein the first optical structure is used for providing light with a first wavelength so as to initiate a single photon polymerization process in a photosensitive polymer; the second optical structure is used to provide light at a second wavelength to initiate a two-photon polymerization process in the photopolymer. The printing data of the micro-nano three-dimensional structure to be printed is subjected to high-resolution and low-resolution segmentation, and the micro-nano three-dimensional structure is printed layer by layer, so that the printing speed is improved on the basis of ensuring the printing precision.
The invention also provides a further processing method of the high-resolution structure data, which is characterized in that the high-resolution structure data larger than a certain length scale is further divided, the shell data after the shelling processing is put into a high-resolution data group, and the data (namely volume data) related to the remainder is put into a low-resolution data group. This method ensures the reproduction of high resolution structural features of three-dimensional objects while maintaining the same faster printing speed as single photon lithography.
The invention soaks the base plate in the photopolymer container pool, can be used for executing the manufacturing process of a continuous liquid interface, and is matched with an optical imaging device to accurately find the interface between the photopolymer and the oxygen permeable film in the container pool, thereby ensuring the printing accuracy and continuity.
Drawings
Fig. 1 is a schematic diagram of a micro-nano three-dimensional structure preparation system based on a multi-scale multi-photon lithography technology in an embodiment of the present invention;
fig. 2 is a schematic flow chart of a micro-nano three-dimensional structure preparation method based on a multi-scale multi-photon lithography technology in an embodiment of the present invention;
FIG. 3 is a schematic diagram of a controller according to an embodiment of the present invention;
FIG. 4(a) is a schematic flow chart illustrating the generation of lithography data according to an embodiment of the present invention;
FIG. 4(b) is a schematic flow chart of some additional operations in generating lithographic data in an embodiment of the present invention;
FIG. 5 is a flowchart illustrating operation of the controller shown in FIG. 3 to control an optical structure based on lithographic data;
FIG. 6 is a microscopic image of a sub-waveguide connector prepared in an example of the present invention;
FIG. 7 is a microscopic image of a mini-pen with a body support prepared in an example of the present invention;
FIG. 8 is a microscopic image of a microcantilever prepared in an example of the invention;
FIG. 9 is a microscopic image of a micro hemispherical lens fabricated in an example of the present invention;
FIG. 10 is a microscopic image of a curved waveguide connector prepared in an example of the present invention;
FIG. 11 is a microscopic image of a tapered waveguide with microrings prepared in an example of the present invention;
in the figure: the system comprises a visible light source 1, a beam splitter 2, a first dichroic mirror 3, a second dichroic mirror 4, a photodetector 5, a digital micro-mirror device 6, a two-dimensional vibrating mirror 7, a femtosecond laser 8, an objective lens 9, a photopolymer container pool 10, a substrate 11, a multi-axis workbench 12, a microscope Z platform 13 and a visible light beam 14.
Detailed Description
This is further illustrated by the following detailed description.
The invention provides a system and a method for preparing a micro-nano three-dimensional structure based on a multi-scale multi-photon photoetching technology, which integrate single photon and multi-photon polymerization technologies and simultaneously prepare a multi-resolution multi-scale three-dimensional object within limited time.
It is noted that the three-dimensional object to be produced may have multi-scale structural features, wherein high-resolution structural features include structural features having length dimensions in the range of about 100 nanometers to 1 micron, and low-resolution structural features include structural features having length dimensions in the range of about 1 micron to about 100 microns. The three-dimensional object may have a third, different length scale of structural features, such as medium resolution features, characterized by a length scale intermediate between the low resolution and high resolution structural features. Three-dimensional objects having multi-scale structural features may be referred to as "multi-scale three-dimensional objects".
The invention provides a micro-nano three-dimensional structure preparation system based on a multi-scale multi-photon lithography technology, which comprises a supporting structure, a substrate 11, a photopolymer container pool 10, an objective lens 9, a first optical structure, a second optical structure, an optical imaging device and a controller, wherein the first optical structure is arranged on the substrate; the controller is used for controlling the opening and closing of the first optical structure and the second optical structure and working parameters, and the optical imaging device is used for acquiring imaging information of the objective lens 9.
The photosensitive polymer container pool 10 is fixed on a supporting structure, the substrate 11 is suspended right above the photosensitive polymer container pool 10 through the multi-axis workbench 12, and the objective lens 9 is installed right below the photosensitive polymer container pool 10 and can move in the vertical direction; the first optical structure emits light with a first wavelength, and the light is focused in the photosensitive polymer through an objective lens 9 to initiate single photon polymerization; the second optical structure emits light of a second wavelength, which is focused in the photopolymer by the objective lens 9, initiating multiphoton polymerization.
The support structure is used to support a substrate on which a three-dimensional object is to be fabricated, and the substrate in this embodiment may be a transparent wafer or a microscope slide. The support structure is provided with a multi-axis table, for example, an XYZ three-axis displacement table and an angular rotation table, which are configured to move in a three-dimensional space. For small three-dimensional objects, a single axis Z-stage may be used to control the height of the three-dimensional object. For larger three-dimensional objects, fabrication can be done with an XY-axis displacement stage. In addition, the position of the substrate may be adjusted by tilting or rotating the stage.
The system focuses light to a light curing area through a single objective lens, wherein the first optical structure adopts light with one single wavelength to realize light curing through objective lens focusing and single photon absorption, and the second optical structure adopts light with another single wavelength to realize light curing through objective lens focusing and multi-photon absorption. The photosensitive polymer realizes a single photon cured three-dimensional structure through the first optical structure, realizes a multi-photon cured three-dimensional structure through the second optical structure, and finally completes the preparation of the three-dimensional structure by repeating the steps.
In the embodiment, the bottom of the photopolymer container pool is made of an oxygen permeable film, the photopolymer forming the three-dimensional object is placed in the container pool containing the oxygen permeable film, and the substrate is immersed in the photopolymer container pool in an immersion mode; the photopolymerization process is only carried out over a certain depth range (approximately 300 microns) due to the action of the uv absorber, ensuring that the substrate is within the depth range of the cure. The present embodiments may be used to perform a continuous liquid interface manufacturing (CLIP) process. The photopolymer comprises negative and positive photopolymer materials and can also include other materials such as glass, ceramics, metals, semiconductor particles, nanoparticles, and the like depending on the material from which the desired three-dimensional object is made.
The system can include a microscope objective that can focus light onto the photopolymer to induce single-photon and multi-photon (e.g., two-photon) processes therein. The system further includes two optical structures, a first optical structure for providing light at a first wavelength for inducing single photon processes in the photopolymer; the second optical structure is configured to provide light at a second wavelength for inducing a multiphoton process in the photopolymer. Light of both wavelengths may pass through the illuminating photopolymer along the same optical path to print the three-dimensional object simultaneously.
It is noted that the wavelengths of the two lights are not particularly limited as long as they can induce single-photon and multi-photon processes in the selected photopolymer, respectively. The first wavelength of light may be in the ultraviolet portion of the spectrum and the second wavelength may be in the visible or near infrared portion of the spectrum. Also, both optical structures are not particularly limited, but need to include a light source for generating light, optical components (dichroic mirrors, lenses, etc.) for directing light, and electrical components associated with the light source and optical components. Optical and electrical components may be shared between the two optical structures.
For example, as shown in fig. 1 and 2, the microscope objective (e.g., a 10-fold or 20-fold objective) of the system focuses light onto a substrate at a field angle of about 200 × 200 microns. A first dichroic mirror 3, a second dichroic mirror 4 and a two-dimensional vibrating mirror 7 are further arranged on the light path among the first optical structure, the second optical structure and the objective lens 9; the pattern light with the first wavelength emitted by the first optical structure sequentially passes through the first dichroic mirror 3 and the second dichroic mirror 4 and then is incident into the objective lens 9, and the light with the second wavelength emitted by the second optical structure sequentially passes through the two-dimensional vibrating mirror 7 and the second dichroic mirror 4 and then is incident into the objective lens 9.
The first optical configuration employs a digital micromirror device (DLP4500EVM) for generating light of a first wavelength (390 nm) to produce an adjustable two-dimensional pattern of light, which is directed onto an objective lens by first and second dichroic mirrors 3, 4. The second optical configuration employs a femtosecond laser to generate two-photon light of a second wavelength (780 nm), and a two-dimensional galvanometer 7(GalvoX, GalvoY) to direct the light onto the objective lens and allow the focused light to scan along two dimensions of the substrate, the position of the focal point being capable of being changed by adjusting the angle of the two-dimensional galvanometer. The microscope objective focuses a first wavelength of patterned light to induce a single photon process and a second wavelength of light to a focus to induce a two photon process.
The system also includes other component structures. For example, as shown in fig. 1 and 2, an optical imaging apparatus for imaging a substrate during the manufacture of a three-dimensional object includes a visible light source 1, a photodetector 5, and a beam splitter 2; visible light beams emitted by the visible light source 1 are incident into the objective lens 9 after passing through the beam splitter 2, and are irradiated into the photopolymer container pool 10 through the objective lens 9, and the returned light is reflected to the photoelectric detector 5 for imaging after passing through the beam splitter 2. The visible light source can be a low-coherence red (633 nm) LED, and the photoelectric detector can be a CCD camera. The objective 9 is mounted on a microscope Z stage which is used to align the objective along the Z-axis, and by scanning the microscope objective in the Z-direction and monitoring the interference fringes from the visible light source 1, the Z-axis position can be accurately determined, which is useful in the continuous liquid interface manufacturing process to find the interface between the photopolymer and the oxygen permeable membrane in the container cell.
The system also includes a controller for controlling one or more structures of the system. The controller may also be used to generate lithographic data to be used during the manufacture of the three-dimensional object. The controller may be integrated into the system as part of a single device or distributed among multiple devices for certain functions, which may be wired or wireless network connected to other structures. The controller may also include a database (not shown) for system data storage. As shown in the illustrative embodiment of fig. 3, the controller includes an input interface, an output interface, a communication interface, a computer readable medium, a processor, and an application program. The controller may be any form of computer, including a circuit board.
The input interface provides an interface for inputting information to the controller. The input interface may be connected to various input devices, such as a keyboard, a display, a mouse, a keyboard, etc., to allow a user to input information into the controller or to operate in a user interface displayed on the display. The input interface also supports electrical connections for connections between the controller and other structures of the system.
The output interface provides an interface for outputting information from the controller. The output interface may be connected to various output devices, such as for outputting information to a display or a printer. The output interface also supports the output of information to other structures of the system.
The communication interface supports interfaces for receiving and transmitting data between devices using various protocols, transmission techniques, and the communication interface supports wired or wireless transmission for communication, and data and information may be transmitted between controllers, databases, other structures of the system, and/or other external devices through the communication interface.
A computer readable medium is an electrical storage location or memory for information so that the processor can access the information. The computer-readable medium may include any type of random access memory, read only memory, flash memory, etc., such as magnetic storage devices, optical disks, smart cards, flash memory devices, etc.
The processor executes the instructions. The instructions may be executed by a computer, logic circuits, or hardware circuits. Thus, a processor may be implemented in hardware, firmware, or any combination of these methods and/or in combination with software. The term "executing" is the process of running an application or performing the operations required by instructions. The instructions may be written in one or more programming languages, scripting languages, assembly languages, the processor executes an instruction, which means that it performs/controls the operations required by the instruction. The processor is coupled to the input interface, the output interface, the computer readable medium, and the communication interface to receive, transmit, and process information.
The application program performs operations associated with other configurations of the control system. These operations include generating lithographic data for use during the manufacture of the three-dimensional object, controlling the structure of a lithography-based data system, and the like. The operations described in this disclosure may be controlled by instructions contained in this patent. These operations may be implemented using hardware, firmware, software, or any combination of these methods. With reference to the illustrative embodiment of FIG. 3, an application may be implemented in software (comprised of computer-readable and/or computer-executable instructions) stored on a computer-readable medium and accessible by a processor to execute instructions that comprise the operation of the application. The application program may be written using one or more programming languages, assembly languages, scripting languages, etc.
Fig. 2 is a schematic flow chart of a method for preparing a micro-nano three-dimensional structure based on a multi-scale multi-photon lithography technology, which includes:
1) starting a system, filling a photopolymer material in a photopolymer container pool 10, and immersing a substrate 11 into the photopolymer container pool 10 through a multi-shaft workbench 12, wherein a gap to be printed is left between the lower bottom surface of the substrate 11 and the lower bottom surface of the photopolymer container pool 10; the imaging information of the objective lens 9 is acquired in real time by the optical imaging device, and the printing process can be observed using the imaging information, and the printing interface can be identified.
It should be noted here that prior to fabrication of the structure, the microscope Z stage can adjust the position of the objective lens to find the interface between the photopolymer and the oxygen permeable membrane.
2) Obtaining model data (STL file model) of a micro-nano three-dimensional structure to be printed, putting low-resolution structural feature data in the model data into a first data group, and putting high-resolution structural feature data in the model data into a second data group.
3) Slicing the three-dimensional data of the two data groups according to the direction from the bottom layer to the top layer, and converting the low-resolution structural feature data in the first data group into image patterns and corresponding layer values to be used as single photon lithography data; the image pattern corresponds to a light pattern for forming a low resolution structure.
Converting the high-resolution structural feature data in the second data set into a writing sequence and corresponding layer values as multi-photon photoetching data; the writing sequence corresponds to the contours for forming the high resolution structures.
4) Controlling the first optical structure to be opened, emitting a light pattern corresponding to the image pattern at the bottommost layer according to single photon lithography data, adjusting the position of the objective lens 9 in the vertical direction through imaging information of an optical imaging device, focusing the light pattern on an oxygen permeable film at the bottom of the photopolymer container pool 10 after passing through the objective lens 9, wherein a focusing area is an area to be printed, so that a photopolymer material in a gap to be printed reserved between the substrate 11 and the photopolymer container pool 10 is polymerized in the focusing area, and a low-resolution structure corresponding to the layer is printed and formed, and the first optical structure is closed. In this embodiment, a DMD chip in the digital micromirror device is controlled by Labview software to generate projected pattern light.
5) Controlling a second optical structure to be opened, emitting two-photon light corresponding to a writing sequence at the bottommost layer according to multi-photon photoetching data, printing point by point according to a track corresponding to the writing sequence, wherein the two-photon light is focused on an oxygen permeable film at the bottom of the photopolymer container pool 10 after passing through an objective lens 9, a focusing point is a point to be printed, so that a photopolymer material in a gap to be printed reserved between the substrate 11 and the photopolymer container pool 10 is polymerized at the focusing point, moving the focusing point until a high-resolution structure corresponding to the layer is printed and molded, and closing the second optical structure; in the embodiment, the switch of the femtosecond laser is controlled by the acousto-optic controller to realize the function of the second optical structure; the position of the focusing point can be changed by adjusting the angle of the two-dimensional galvanometer through an analog signal.
6) Moving the substrate 11 upwards through the multi-axis workbench 12, and reserving a gap to be printed between the lower bottom surface of the substrate 11 and the lower bottom surface of the photopolymer container pool 10; and (5) repeating the step 5) and the step 6) until all data in the two data sets are traversed, the micro-nano three-dimensional structure is prepared, the substrate 11 is moved out of the photopolymer container pool 10 through the multi-axis workbench 12, a printed piece is taken out, and the system is closed.
The system of the present invention may include more or less structure than that of fig. 1 and 2, and the overall manufacturing process is further described with reference to fig. 4(a), 4(b), and 5, operating as described in accordance with illustrative embodiments. In these figures, operational steps may be added or subtracted depending on the actual circumstances of the embodiment. Further, the order of the operations is not limited. Thus, while some of the operational flows are presented in a sequential order, various operations may be performed in a different, repeated, concurrent order.
Referring to fig. 4(a), in a first operation, a CAD file containing data of a three-dimensional object to be manufactured is received. The data of the CAD file includes data representing various structural features in three dimensions, such as high resolution structural features and low resolution features, which may be input by a user through an input interface or received by reading from a computer readable medium or database.
In the second operation of fig. 4(a), the data of the CAD file is divided into two data sets, with lithographic data containing low-resolution structural features of the three-dimensional object being placed in the first data set and lithographic data containing high-resolution structural features of the three-dimensional object being placed in the second data set.
As shown in fig. 4(b), dividing the data of the CAD file into a first data set and a second data set requires processing the data representing the high resolution structural features prior to the division. Specifically, in the first operation, it is determined whether the data representing the high-resolution structural feature is less than a predetermined length scale. If the determination is "yes," the data is placed into a second data set. If the determination is "no," then in a second operation, the data is subjected to shelling, which may be performed using commercially available software. The shell data after the shelling is placed in the second data set and the data associated with the remainder (i.e., the volume data) is placed in the first data set. This method ensures the reproduction of high resolution structural features of three-dimensional objects while maintaining the same faster printing speed as single photon lithography.
Returning to fig. 4(a), in a third operation, data of the first data set is sliced along the z-axis to provide a first plurality of layers and data of the second data set is sliced along the z-axis to provide a second plurality of layers. Slicing may be performed using commercially available software. Before slicing, the data of the two data sets represent voxels.
In a fourth operation, each slice of the first plurality of layers of the first data set is converted into an image pattern (e.g., a 24-bit image pattern), each image pattern corresponding to a light pattern used to form the low resolution features. The plurality of image patterns are referred to as single photon lithography data, which includes a set of image patterns and associated layer values (i.e., layer 1, layer 2 … … nth layer).
In a fifth operation, single photon lithography data is output to a first optical structure providing light for single photon lithography, which data can be used to control the operation of various optical structures during the fabrication of the three-dimensional object.
In a sixth operation, each layer of the second plurality of layers of the second data set is converted into a write sequence. Each write sequence corresponds to lithographic data for a high resolution feature. The plurality of write sequences may be referred to as multiphoton lithography data, which includes a set of write sequences and associated layer values.
In a seventh operation, multiphoton lithography data is output to a second optical structure that provides light for multiphoton lithography, which data may be used to control the operation of the various optical structures during the fabrication of the three-dimensional object.
As described above, the controller may control the two optical structures to fabricate the three-dimensional object based on the lithography data. The lithography data may be generated by the controller described above or may be generated by an external device.
FIG. 5, in accordance with an illustrative embodiment, illustrates an operation for fabricating a three-dimensional object based on lithographic data. In a first operation, a first optical structure receives single photon lithography data comprising a set of image patterns and associated layer values, and a second optical structure receives multi-photon lithography data comprising a set of write sequences and associated layer values.
In a second operation, the photopolymer is illuminated with light of a first wavelength according to a first image pattern, and the illumination forms low resolution features in a first layer of the three-dimensional object by single photon lithography.
In a third operation, the photopolymer is illuminated with light of a second wavelength according to the first writing sequence, the illumination forming high resolution structural features in the first layer of the three-dimensional object by multiphoton lithography.
In the fourth operation, it is determined whether the lithographic data also contains other image patterns or writing sequences and associated layer values. If the determination is yes, the second and third steps are repeated, and if the determination is no, the three-dimensional object manufacturing is completed. The fabrication process also includes the operation of turning off the light source for the first wavelength of light during illumination with light of the second wavelength (and vice versa) and the operation of moving the substrate along the z-axis according to the layer values.
Correspondingly, the present embodiment further provides an electronic device, including: one or more processors;
a memory for storing one or more programs;
when the one or more programs are executed by the one or more processors, the one or more processors realize the micro-nano three-dimensional structure preparation method.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
In the above embodiments of the present invention, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
Figures 6 through 11 illustrate images of a multi-scale three-dimensional object manufactured using the above-described system and method. Fig. 6 is a sub-waveguide connector, fig. 7 is a micro-fence with a body support, fig. 8 is a micro-mount, fig. 9 is a micro-hemispherical lens, fig. 10 is a curved waveguide connector, and fig. 11 is a tapered waveguide with a micro-ring. In these figures, "lPP" denotes a portion produced by single photon lithography, and "2 PP" denotes a portion produced by multiphoton lithography.
By the above method, the following types of structures can be manufactured: polymer photon sensors (ultra high frequency ultrasound detection, chemical sensing); optical fluid and microfluidic sensors for gas and liquid sensing; a polymer biosensor; a biomedical device; an integrated optical circuit; active/functional lasers, etc.
For purposes of illustration and description, the present invention provides the foregoing illustrative examples pertaining to the present invention. It is not intended to be exhaustive or to limit the invention to the precise form disclosed, and modifications and variations are possible in light of the above teachings. The embodiments were chosen and described in order to explain the principles of the invention and as practical applications of the invention to enable one skilled in the art to utilize the invention in various embodiments and with various modifications as are suited to the particular use contemplated. All modifications which can be derived or suggested by a person skilled in the art from the disclosure of the present invention are to be considered within the scope of the invention.
Claims (9)
1. A micro-nano three-dimensional structure preparation system based on a multi-scale multi-photon lithography technology is characterized by comprising a supporting structure, a substrate (11), a photopolymer container pool (10), an objective lens (9), a first optical structure, a second optical structure, an optical imaging device and a controller; the controller is used for controlling the opening and closing of the first optical structure and the second optical structure and working parameters, and the optical imaging device is used for acquiring imaging information of the objective lens (9);
the photosensitive polymer container pool (10) is fixed on a supporting structure, the substrate (11) is suspended right above the photosensitive polymer container pool (10) through the multi-axis workbench (12), and the objective lens (9) is installed right below the photosensitive polymer container pool (10) and can move in the vertical direction; the first optical structure emits light with a first wavelength, and the light is focused in the photosensitive polymer through an objective lens (9) to initiate single photon polymerization; the second optical structure emits light of a second wavelength, which is focused in the photopolymer by an objective lens (9) to initiate multiphoton polymerization.
2. The system for preparing the micro-nano three-dimensional structure based on the multi-scale multi-photon lithography technology according to claim 1, wherein the bottom of the photopolymer container pool is made of an oxygen permeable film.
3. The system for preparing micro-nano three-dimensional structures based on multi-scale multi-photon lithography according to claim 2, wherein the first optical structure generates pattern light by using a digital micro-mirror device (6), and the second optical structure generates two-photon light by using a femtosecond laser (8).
4. The system for preparing the micro-nano three-dimensional structure based on the multi-scale multi-photon lithography technology according to claim 1, wherein the optical imaging device comprises a visible light source (1), a photoelectric detector (5) and a beam splitter (2); visible light beams emitted by the visible light source (1) enter the objective lens (9) after passing through the beam splitter (2), the visible light beams irradiate the photosensitive polymer container pool (10) through the objective lens (9), and the returned light beams are reflected to the photoelectric detector (5) to be imaged after passing through the beam splitter (2).
5. The micro-nano three-dimensional structure preparation system based on the multi-scale multi-photon lithography technology according to claim 1, characterized in that a first dichroic mirror (3), a second dichroic mirror (4) and a two-dimensional vibrating mirror (7) are further arranged on the light path between the first optical structure, the second optical structure and the objective lens (9); light with a first wavelength emitted by the first optical structure sequentially passes through the first dichroic mirror (3) and the second dichroic mirror (4) and then is incident into the objective lens (9), and light with a second wavelength emitted by the second optical structure sequentially passes through the two-dimensional vibrating mirror (7) and the second dichroic mirror (4) and then is incident into the objective lens (9).
6. The system for preparing micro-nano three-dimensional structures based on multi-scale multi-photon lithography according to claim 1, wherein the multi-axis worktable (12) is composed of a three-axis displacement table and an angle rotating table.
7. A micro-nano three-dimensional structure preparation method based on the system of claim 2 is characterized by comprising the following steps:
1) starting a system, filling the photopolymer container pool (10) with photopolymer, and immersing the substrate (11) into the photopolymer container pool (10) through a multi-axis workbench (12), wherein a gap to be printed is left between the lower bottom surface of the substrate (11) and the lower bottom surface of the photopolymer container pool (10); acquiring imaging information of an objective lens (9) in real time through an optical imaging device;
2) obtaining model data of a micro-nano three-dimensional structure to be printed, putting low-resolution structural feature data in the model data into a first data set, and putting high-resolution structural feature data in the model data into a second data set;
3) slicing the three-dimensional data of the two data groups according to the direction from the bottom layer to the top layer, and converting the low-resolution structural feature data in the first data group into image patterns and corresponding layer values to be used as single photon lithography data; the image pattern corresponds to a light pattern for forming a low resolution structure;
converting the high-resolution structural feature data in the second data set into a writing sequence and corresponding layer values as multi-photon photoetching data; said writing sequence corresponding to a profile for forming a high resolution structure;
4) controlling a first optical structure to be opened, emitting a light pattern corresponding to the image pattern at the bottommost layer according to single photon lithography data, adjusting the position of an objective lens (9) in the vertical direction through imaging information of an optical imaging device, focusing the light pattern on an oxygen permeable film at the bottom of a photopolymer container pool (10) after passing through the objective lens (9), wherein a focusing area is an area to be printed, so that a photopolymer in a gap to be printed reserved between a substrate (11) and the photopolymer container pool (10) is polymerized in the focusing area, a low-resolution structure corresponding to the layer is printed and molded, and the first optical structure is closed;
5) controlling a second optical structure to be opened, emitting two-photon light corresponding to a writing sequence at the bottommost layer according to multi-photon photoetching data, and printing point by point according to a track corresponding to the writing sequence, wherein the two-photon light is focused on an oxygen permeable film at the bottom of a photopolymer container pool (10) after passing through an objective lens (9), a focusing point is a point to be printed, so that photopolymer in a gap to be printed reserved between a substrate (11) and the photopolymer container pool (10) is polymerized at the focusing point, the focusing point is moved until a high-resolution structure corresponding to the layer is printed and molded, and the second optical structure is closed;
6) moving the substrate (11) upwards through a multi-axis workbench (12), and leaving a gap to be printed between the lower bottom surface of the substrate (11) and the lower bottom surface of the photopolymer container pool (10); and (5) repeating the step (5) and the step (6) until all data in the two data sets are traversed, the micro-nano three-dimensional structure is prepared, the substrate (11) is moved out of the photopolymer container pool (10) through the multi-axis workbench (12), the printed piece is taken out, and the system is closed.
8. The method for preparing the micro-nano three-dimensional structure according to claim 7, further comprising the step of processing high-resolution structure characteristic data between the step 1) and the step 2):
judging whether the high-resolution structural feature data in the second data group is smaller than a preset length scale or not, and if so, keeping the data in the second data group; if not, the data is subjected to shelling processing to generate shell data and volume data, the shell data is kept in a second data set, and the volume data is transferred to the first data set.
9. The method for preparing the micro-nano three-dimensional structure according to claim 7, wherein in the step 5), the position of the focusing point is changed by adjusting the angle of the two-dimensional galvanometer.
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