CN113049151A - Temperature compensation system and method of pressure sensor and pressure sensor - Google Patents
Temperature compensation system and method of pressure sensor and pressure sensor Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2268—Arrangements for correcting or for compensating unwanted effects
- G01L1/2281—Arrangements for correcting or for compensating unwanted effects for temperature variations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/04—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges
- G01L9/045—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges with electric temperature compensating means
Abstract
The invention belongs to the technical field of sensors, and discloses a temperature compensation system and method of a pressure sensor and the pressure sensor. The temperature compensation system of the pressure sensor comprises a single chip microcomputer and an analog compensation module, wherein the single chip microcomputer collects an output signal and a temperature signal of the pressure sensor and sends the output signal and the temperature signal to the analog compensation module; the analog compensation module fits the output signal and the temperature signal to obtain a target output value, and sends the target output value to the single chip microcomputer; and the single chip microcomputer carries out temperature compensation on the pressure sensor according to the target output value. According to the invention, the simulation compensation module is used for rapidly calculating, online learning and weight value adjusting capacity to eliminate the influence of the external environment and fit the target output value, and the single chip microcomputer completes the temperature compensation process for the pressure sensor according to the target output value, so that the error of the pressure sensor is reduced, and the accuracy and the stability of the pressure sensor are improved.
Description
The present invention claims priority from the chinese patent application filed by the chinese patent office on 19/11/2020 and entitled "temperature compensation system for pressure sensor, method and pressure sensor" under the reference of 202011307341.5, the entire contents of which are incorporated herein by reference.
Technical Field
The invention relates to the technical field of sensors, in particular to a temperature compensation system and method of a pressure sensor and the pressure sensor.
Background
At present, a piezoresistive pressure sensor is based on the piezoresistive effect of a semiconductor piezoresistor, when the piezoresistive pressure sensor works, pressure directly acts on the front surface of a ceramic diaphragm to make the diaphragm generate tiny deformation, a thick film resistor is printed on the back surface of the ceramic diaphragm and connected into a Wheatstone bridge, and under the action of the pressure, the bridge generates voltage output which has a certain relation with the pressure. The piezoresistive pressure sensor has the outstanding characteristics of simple structure, small size and the like, is widely applied to scientific research, aerospace and industrial process control, and is also a basic element in the industries of automatic detection and instrument design.
With the wide application and development of the piezoresistive pressure sensor in various fields, higher requirements are put forward on the working temperature range and the precision of the piezoresistive pressure sensor. However, the wider the operating temperature range, the more difficult it is to solve the relationship between the silicon piezoresistive pressure sensor output and temperature. Due to the temperature characteristic of the semiconductor material, the temperature and time stability of the piezoresistive pressure sensor are influenced by the temperature, so that the zero point of the piezoresistive pressure sensor is shifted, the accuracy of the sensor for sensing the pressure is influenced, the accuracy is greatly reduced, and the bottleneck for improving the performance of the piezoresistive pressure sensor is formed.
The above is only for the purpose of assisting understanding of the technical aspects of the present invention, and does not represent an admission that the above is prior art.
Disclosure of Invention
The invention mainly aims to provide a temperature compensation system and method of a pressure sensor and the pressure sensor, and aims to solve the technical problem that the piezoresistive pressure sensor is easy to generate zero drift and influence the accuracy of pressure sensing of the sensor.
In order to achieve the purpose, the invention provides a temperature compensation system of a pressure sensor, which comprises a single chip microcomputer and an analog compensation module, wherein the single chip microcomputer is connected with the analog compensation module, and the single chip microcomputer is connected with the pressure sensor; wherein the content of the first and second substances,
the single chip microcomputer is used for collecting an output signal and a temperature signal of the pressure sensor and sending the output signal and the temperature signal to the analog compensation module;
the analog compensation module is used for fitting the output signal and the temperature signal to obtain a target output value and sending the target output value to the single chip microcomputer;
and the single chip microcomputer is also used for carrying out temperature compensation on the pressure sensor according to the target output value.
Optionally, the analog compensation module comprises: a forward analog neural network circuit and a reverse analog neural network circuit; wherein the content of the first and second substances,
the forward analog neural network circuit is used for fitting the output signal and the temperature signal to obtain an initial output value and sending the initial output value to the reverse analog neural network circuit;
the reverse simulation neural network circuit is used for determining an output error value according to the initial output value, determining a target output value according to the output error value and the initial output value, and sending the target output value to the single chip microcomputer.
Optionally, the forward analog neural network circuit comprises: an input layer circuit, a hidden layer circuit and an output layer circuit; wherein the content of the first and second substances,
the input layer circuit is used for receiving the output signal and the temperature signal and sending the output signal and the temperature signal to the hidden layer circuit;
the hidden layer circuit is used for fitting the output signal and the temperature signal to obtain a hidden layer operation result and sending the hidden layer operation result to the output layer circuit;
and the output layer circuit is used for converting the hidden layer operation result into an initial output value and sending the initial output value to the inverse simulation neural network circuit.
Optionally, the input layer circuitry comprises: a latch and an analog multiplier; wherein the content of the first and second substances,
the input end of the latch is connected with the signal output end of the single chip microcomputer, the input end of the analog multiplier is connected with the output end of the latch, and the output end of the analog multiplier is connected with the input end of the hidden layer circuit.
Optionally, the hidden layer circuit includes a first operational amplifier circuit, a second operational amplifier circuit, a third operational amplifier circuit, a fourth operational amplifier circuit, and a fifth operational amplifier circuit, which are connected in sequence, an input end of the first operational amplifier circuit is connected to an output end of the input layer circuit, and an output end of the fifth operational amplifier circuit is connected to an input end of the output layer circuit.
Optionally, the first operational amplifier circuit includes: the circuit comprises a first operational amplifier, a first resistor, a second resistor and a third resistor; wherein the content of the first and second substances,
the first end of the first resistor is connected with the output end of the input layer circuit, the second end of the first resistor is connected with the negative input end of the first operational amplifier, the second end of the first resistor is connected with the first end of the second resistor, the second end of the second resistor is connected with the output end of the first operational amplifier, the output end of the first operational amplifier is connected with the input end of the second operational amplifier circuit, the first end of the third resistor is connected with the positive input end of the first operational amplifier, and the second end of the third resistor is grounded.
In addition, in order to achieve the above object, the present invention also provides a temperature compensation method of a pressure sensor applied to the temperature compensation system of a pressure sensor as described above, the temperature compensation system of a pressure sensor including: the device comprises a singlechip and an analog compensation module; the temperature compensation method of the pressure sensor comprises the following steps:
the single chip microcomputer collects an output signal and a temperature signal of the pressure sensor and sends the output signal and the temperature signal to the analog compensation module;
the analog compensation module fits the output signal and the temperature signal to obtain a target output value, and sends the target output value to the single chip microcomputer;
and the single chip microcomputer performs temperature compensation on the pressure sensor according to the target output value.
Optionally, the analog compensation module comprises: a forward analog neural network circuit and a reverse analog neural network circuit;
the step that the analog compensation module fits the output signal and the temperature signal to obtain a target output value and sends the target output value to the single chip microcomputer comprises the following steps:
the forward simulation neural network circuit fits the output signal and the temperature signal to obtain an initial output value, and the initial output value is sent to the reverse simulation neural network circuit;
and the reverse simulation neural network circuit determines an output error value according to the initial output value, determines a target output value according to the output error value and the initial output value, and sends the target output value to the single chip microcomputer.
Optionally, the forward analog neural network circuit comprises: an input layer circuit, a hidden layer circuit and an output layer circuit;
the step of fitting the output signal and the temperature signal by the forward simulated neural network circuit to obtain an initial output value, and sending the initial output value to the reverse simulated neural network circuit includes:
the input layer circuit receives the output signal and the temperature signal and sends the output signal and the temperature signal to the hidden layer circuit;
the hidden layer circuit is used for fitting the output signal and the temperature signal to obtain a hidden layer operation result, and the hidden layer operation result is sent to the output layer circuit;
and the output layer circuit converts the hidden layer operation result into an initial output value and sends the initial output value to the inverse simulation neural network circuit.
In addition, in order to achieve the above object, the present invention also provides a pressure sensor including the temperature compensation system of the pressure sensor as described above, or a step of applying the temperature compensation method of the pressure sensor as described above.
The invention provides a temperature compensation system of a pressure sensor, which comprises a single chip microcomputer and an analog compensation module, wherein the single chip microcomputer is connected with the analog compensation module, and the single chip microcomputer is connected with the pressure sensor; the single chip microcomputer is used for collecting an output signal and a temperature signal of the pressure sensor and sending the output signal and the temperature signal to the analog compensation module; the analog compensation module is used for fitting the output signal and the temperature signal to obtain a target output value and sending the target output value to the single chip microcomputer; and the single chip microcomputer is also used for carrying out temperature compensation on the pressure sensor according to the target output value. According to the invention, the fitting result of the output signal and the temperature signal can be fitted by eliminating the influence of the external environment by utilizing the rapid calculation capability, the timely online learning, the weight value adjustment and the like of the analog compensation module, the target output value is obtained, the temperature compensation process of the pressure sensor is completed by the singlechip according to the target output value, the error of the pressure sensor is reduced, the accuracy and the stability of the pressure sensor are improved, and the technical problems that the zero drift of the piezoresistive pressure sensor is easy to occur and the pressure sensing accuracy of the sensor is influenced are solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a functional block diagram of an embodiment of a temperature compensation system for a pressure sensor according to the present invention;
FIG. 2 is a schematic circuit diagram of a temperature compensation system of a pressure sensor according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a hidden layer circuit structure of an embodiment of a temperature compensation system of a pressure sensor according to the present invention;
FIG. 4 is a schematic diagram of a first operational amplifier circuit according to an embodiment of the temperature compensation system of the pressure sensor of the present invention;
fig. 5 is a schematic flow chart of a temperature compensation method of the pressure sensor according to the first embodiment of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | Single chip microcomputer | AD | |
| 200 | |
20121 | First |
| 201 | Forward analog |
20122 | Second |
| 202 | Reverse analog |
20123 | Third |
| 2011 | |
20124 | Fourth |
| 2012 | |
20125 | Fifth |
| 2013 | Output layer circuit | R1～R3 | First to third resistors |
| L | Latch device | A1 | A first operational amplifier |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a temperature compensation system of a pressure sensor.
Referring to fig. 1, in the embodiment of the present invention, the temperature compensation system of the pressure sensor includes a single chip microcomputer 100 and an analog compensation module 200, the single chip microcomputer 100 is connected to the analog compensation module 200, and the single chip microcomputer 100 is connected to the pressure sensor; wherein the content of the first and second substances,
the single chip microcomputer 100 is configured to collect an output signal and a temperature signal of the pressure sensor, and send the output signal and the temperature signal to the analog compensation module 200. In this embodiment, one way for the single chip microcomputer 100 to acquire the output signal and the temperature signal of the pressure sensor may be: the pressure signal output end of the pressure sensor can be connected with the pressure signal input end of the data amplifier, the temperature signal output end of the pressure sensor can be connected with the temperature signal input end of the data amplifier, the pressure signal output end of the data amplifier can be connected with the analog signal input end of the A/D converter, the temperature signal output end of the data amplifier can be connected with the analog signal input end of the A/D converter, the digital signal output end of the A/D converter is connected with the pressure data signal input end of the single chip microcomputer 100, the digital signal output end of the A/D converter is connected with the temperature data signal input end of the single chip microcomputer 100, the single chip microcomputer 100 can also collect the output signal and the temperature signal of the pressure sensor in other modes.
The analog compensation module 200 is configured to fit the output signal and the temperature signal to obtain a target output value, and send the target output value to the single chip microcomputer 100. In this embodiment, the analog compensation module 200 may include a forward analog neural network circuit and a reverse analog neural network circuit, where the forward analog neural network circuit fits the output signal and the temperature signal to obtain an initial output value, and sends the initial output value to the reverse analog neural network circuit; and the reverse simulation neural network circuit determines an output error value according to the initial output value, determines a target output value according to the output error value and the initial output value, and sends the target output value to the single chip microcomputer.
The single chip microcomputer 100 is further configured to perform temperature compensation on the pressure sensor according to the target output value. In this embodiment, the forward analog neural network circuit and the reverse analog neural network circuit of the analog compensation module 200 are used to fit the temperature drift of the pressure sensor, wherein the single chip microcomputer 100 only receives and transmits data, the operation result of the analog compensation module 200, i.e., the target output value, is read by the single chip microcomputer 100 at regular time, and the temperature of the pressure sensor is compensated according to the target output value.
The embodiment provides a temperature compensation system of a pressure sensor, which comprises a single chip microcomputer and an analog compensation module, wherein the single chip microcomputer is connected with the analog compensation module, and the single chip microcomputer is connected with the pressure sensor; the single chip microcomputer is used for collecting an output signal and a temperature signal of the pressure sensor and sending the output signal and the temperature signal to the analog compensation module; the analog compensation module is used for fitting the output signal and the temperature signal to obtain a target output value and sending the target output value to the single chip microcomputer; and the single chip microcomputer is also used for carrying out temperature compensation on the pressure sensor according to the target output value. In the embodiment, the fitting result of the output signal and the temperature signal can be fitted by utilizing the quick calculation capability of the simulation compensation module, timely online learning, weight adjustment and the like to eliminate the influence of the external environment, the target output value is obtained, the temperature compensation process of the pressure sensor is completed by the single chip microcomputer according to the target output value, the error of the pressure sensor is reduced, the accuracy and the stability of the pressure sensor are improved, and the technical problems that the zero drift easily occurs to the piezoresistive pressure sensor and the pressure sensing accuracy of the sensor is influenced are solved.
Further, referring to fig. 2, the analog compensation module 200 includes: a forward analog neural network circuit 201 and a reverse analog neural network circuit 202; wherein the content of the first and second substances,
the forward analog neural network circuit 201 is configured to fit the output signal and the temperature signal to obtain an initial output value, and send the initial output value to the reverse analog neural network circuit 202;
the inverse simulated neural network circuit 202 is configured to determine an output error value according to the initial output value, determine a target output value according to the output error value and the initial output value, and send the target output value to the single chip microcomputer 100.
It should be noted that the analog compensation module 200 may include a forward analog neural network circuit 201 and a reverse analog neural network circuit 202, the forward analog neural network circuit 201 fits the output signal and the temperature signal to obtain an initial output value, and sends the initial output value to the reverse analog neural network circuit 202, and the reverse analog neural network circuit 202 determines an output error value according to the initial output value, determines a target output value according to the output error value and the initial output value, and sends the target output value to the single chip microcomputer 100.
Specifically, in the present embodiment, a digital circuit may be combined with an analog circuit to implement a neural network algorithm to perform zero temperature drift compensation on the pressure sensor, and the BP algorithm of the neural network algorithm may be divided into a forward propagation part and a backward propagation part. The forward propagation process is that the input sample is transmitted from the input layer to the output layer through the hidden layer, in the hidden layer processing process, the state of each layer of neurons only affects the next layer of neurons, the current output value is compared with the expected output value, and if the current output value is not equal to the expected output value, the backward propagation process is started. In the backward propagation process, the error signal is transmitted back in the reverse direction according to the original forward propagation path, and the weight coefficient of each neuron in the hidden layer is modified to make the error signal tend to be minimum.
Further, with continued reference to fig. 2, the forward analog neural network circuit 201 includes: input layer circuitry 2011, hidden layer circuitry 2012, and output layer circuitry 2013; wherein the content of the first and second substances,
the input layer circuit 2011 is configured to receive the output signal and the temperature signal, and send the output signal and the temperature signal to the hidden layer circuit 2012;
the hidden layer circuit 2012 is configured to fit the output signal and the temperature signal to obtain a hidden layer operation result, and send the hidden layer operation result to the output layer circuit 2013;
the output layer circuit 2013 is configured to convert the hidden layer operation result into an initial output value, and send the initial output value to the inverse artificial neural network circuit 202.
It should be noted that the forward analog neural network circuit 201 may include: the forward simulation neural network circuit 201 can transmit the input samples, namely the output signals and the temperature signals, from the input layer circuit 2011 to the output layer circuit 2013 through the hidden layer circuit 2012, and the input layer circuit 2011 of the forward simulation neural network circuit 201, in the signal processing process of the hidden layer circuit 2012, the state of each layer of neurons only affects the next layer of neurons, the current output value is compared with the expected output value, and if the current output value is not equal to the expected output value, the output layer circuit 2013 converts the hidden layer operation result into the initial output value and sends the initial output value to the reverse simulation neural network circuit 202.
Further, with continued reference to fig. 2, the input layer circuitry 2011 includes: a latch L and an analog multiplier AD; wherein the content of the first and second substances,
the input end of the latch L is connected to the signal output end of the single chip microcomputer 100, the input end of the analog multiplier AD is connected to the output end of the latch L, and the output end of the analog multiplier AD is connected to the input end of the hidden layer circuit 2012.
Note that the input layer circuit 2011 may include: in this embodiment, the forward propagation process of the BP algorithm can be realized by adopting the single chip microcomputer 100, the latch L and the digital-to-analog converter, the operation weight and the operation on the input sample, i.e., the output signal and the temperature signal, are obtained through the forward analog neural network circuit 201, and the operation circuit of the forward propagation process of the BP algorithm is realized by applying the analog multiplier AD.
Further, referring to fig. 3, the hidden layer circuit 2012 includes a first operational amplifier circuit 20121, a second operational amplifier circuit 20122, a third operational amplifier circuit 20123, a fourth operational amplifier circuit 20124 and a fifth operational amplifier circuit 20125 which are connected in sequence, an input end of the first operational amplifier circuit 20121 is connected to an output end of the input layer circuit 2011, and an output end of the fifth operational amplifier circuit 20125 is connected to an input end of the output layer circuit 2013.
It should be noted that the hidden layer circuit 2012 includes a first operational amplifier circuit 20121, a second operational amplifier circuit 20122, a third operational amplifier circuit 20123, a fourth operational amplifier circuit 20124, and a fifth operational amplifier circuit 20125, which are connected in sequence, in this embodiment, a simple exponential operational circuit, that is, the hidden layer circuit 2012, can be formed by using an exponential law of a pn junction volt-ampere characteristic of a triode, and the calculation accuracy of the hidden layer circuit 2012 is mainly affected by temperature, which is indicated that a temperature equivalent voltage and a triode reverse saturation current have a large change along with a change in temperature. The hidden layer circuit 2012 may also adopt other circuits, and the embodiment is not limited thereto.
Further, referring to fig. 4, the first operational amplifier circuit 20121 includes: a first operational amplifier A1, a first resistor R1, a second resistor R2, and a third resistor R3; wherein the content of the first and second substances,
the first end of the first resistor R1 is connected to the output terminal of the input layer circuit 2011, the second end of the first resistor R1 is connected to the negative input terminal of the first operational amplifier a1, the second end of the first resistor R1 is connected to the first end of the second resistor R2, the second end of the second resistor R2 is connected to the output terminal of the first operational amplifier a1, the output terminal of the first operational amplifier a1 is connected to the input terminal of the second operational amplifier 20122, the first end of the third resistor R3 is connected to the positive input terminal of the first operational amplifier a1, and the second end of the third resistor R3 is grounded.
The first operational amplifier circuit 20121 may include: the specific circuit structure of the first operational amplifier a1, the first resistor R1, the second resistor R2 and the third resistor R3, the second operational amplifier 20122, the third operational amplifier 20123 and the fifth operational amplifier 20125 refers to the first operational amplifier 20121, wherein the output end of the operational amplifier in the previous operational amplifier is connected with the input resistor in the next operational amplifier, and the resistors connected with the positive input ends of the operational amplifiers in the second operational amplifier 20122 and the third operational amplifier 20123 are connected in common; the input resistor of the fourth operational amplifier circuit 20124 is a triode, the base of which is connected to the collector of the triode, and the base of which is connected to the output terminal of the operational amplifier in the third operational amplifier circuit 20123.
In addition, in order to achieve the above object, the present invention also provides a temperature compensation method of a pressure sensor applied to the temperature compensation system of a pressure sensor as described above, the temperature compensation system of a pressure sensor including: the device comprises a singlechip and an analog compensation module; referring to fig. 5, fig. 5 is a schematic flow chart of a first embodiment of a temperature compensation method of a pressure sensor according to the present invention.
In this embodiment, the temperature compensation method for the pressure sensor includes the following steps:
step S10: the single chip microcomputer collects output signals and temperature signals of the pressure sensor and sends the output signals and the temperature signals to the analog compensation module.
It should be noted that, one way of the single chip microcomputer acquiring the output signal and the temperature signal of the pressure sensor may be: the pressure signal output end of the pressure sensor can be connected with the pressure signal input end of the data amplifier, the temperature signal output end of the pressure sensor can be connected with the temperature signal input end of the data amplifier, the pressure signal output end of the data amplifier can be connected with the analog signal input end of the A/D converter, the temperature signal output end of the data amplifier can be connected with the analog signal input end of the A/D converter, the digital signal output end of the A/D converter is connected with the pressure data signal input end of the single chip microcomputer, the digital signal output end of the A/D converter is connected with the temperature data signal input end of the single chip microcomputer, the single chip microcomputer can also collect the output signal and the temperature signal of the pressure sensor in other modes.
Step S20: and the analog compensation module fits the output signal and the temperature signal to obtain a target output value, and sends the target output value to the single chip microcomputer.
It is easy to understand that the analog compensation module may include a forward analog neural network circuit and a reverse analog neural network circuit, the forward analog neural network circuit fits the output signal and the temperature signal to obtain an initial output value, and sends the initial output value to the reverse analog neural network circuit; and the reverse simulation neural network circuit determines an output error value according to the initial output value, determines a target output value according to the output error value and the initial output value, and sends the target output value to the single chip microcomputer.
It should be understood that the analog compensation module may include: a forward analog neural network circuit and a reverse analog neural network circuit; the process that the analog compensation module fits the output signal and the temperature signal to obtain a target output value and sends the target output value to the single chip microcomputer can be as follows: the forward simulation neural network circuit fits the output signal and the temperature signal to obtain an initial output value, and the initial output value is sent to the reverse simulation neural network circuit; and the reverse simulation neural network circuit determines an output error value according to the initial output value, determines a target output value according to the output error value and the initial output value, and sends the target output value to the single chip microcomputer.
Specifically, the forward analog neural network circuit may include: an input layer circuit, a hidden layer circuit and an output layer circuit; the process of fitting the output signal and the temperature signal by the forward analog neural network circuit to obtain an initial output value and sending the initial output value to the reverse analog neural network circuit may be: the input layer circuit receives the output signal and the temperature signal and sends the output signal and the temperature signal to the hidden layer circuit; the hidden layer circuit is used for fitting the output signal and the temperature signal to obtain a hidden layer operation result, and the hidden layer operation result is sent to the output layer circuit; and the output layer circuit converts the hidden layer operation result into an initial output value and sends the initial output value to the inverse simulation neural network circuit.
Step S30: and the single chip microcomputer performs temperature compensation on the pressure sensor according to the target output value.
It should be understood that the temperature drift of the pressure sensor is fitted through the forward analog neural network circuit and the reverse analog neural network circuit of the analog compensation module, wherein the single chip microcomputer only receives and transmits data, the operation result of the analog compensation module, namely the target output value, is read by the single chip microcomputer at regular time, and the temperature of the pressure sensor is compensated according to the target output value.
In the embodiment, the single chip microcomputer is used for acquiring the output signal and the temperature signal of the pressure sensor and sending the output signal and the temperature signal to the analog compensation module; the analog compensation module fits the output signal and the temperature signal to obtain a target output value, and sends the target output value to the single chip microcomputer; and the single chip microcomputer performs temperature compensation on the pressure sensor according to the target output value. In the embodiment, the fitting result of the output signal and the temperature signal can be fitted by utilizing the quick calculation capability of the simulation compensation module, timely online learning, weight adjustment and the like to eliminate the influence of the external environment, the target output value is obtained, the temperature compensation process of the pressure sensor is completed by the single chip microcomputer according to the target output value, the error of the pressure sensor is reduced, the accuracy and the stability of the pressure sensor are improved, and the technical problems that the zero drift easily occurs to the piezoresistive pressure sensor and the pressure sensing accuracy of the sensor is influenced are solved.
In order to achieve the above object, the present invention also proposes a pressure sensor, which comprises the temperature compensation system of the pressure sensor as described above, or the steps of the temperature compensation method of applying the pressure sensor as described above. The specific structure of the temperature compensation system of the pressure sensor refers to the above-mentioned embodiments, and the specific flow of the temperature compensation method of the pressure sensor refers to the above-mentioned embodiments.
It should be understood that the above is only an example, and the technical solution of the present invention is not limited in any way, and in a specific application, a person skilled in the art may set the technical solution as needed, and the present invention is not limited thereto.
It should be noted that the above-described work flows are only exemplary, and do not limit the scope of the present invention, and in practical applications, a person skilled in the art may select some or all of them to achieve the purpose of the solution of the embodiment according to actual needs, and the present invention is not limited herein.
In addition, the technical details that are not elaborated in this embodiment may be referred to a temperature compensation system of the pressure sensor provided in any embodiment of the present invention, and are not described herein again.
Further, it is to be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solution of the present invention or portions thereof that contribute to the prior art may be embodied in the form of a software product, where the computer software product is stored in a storage medium (e.g. Read Only Memory (ROM)/RAM, magnetic disk, optical disk), and includes several instructions for enabling a terminal device (e.g. a mobile phone, a computer, a server, or a network device) to execute the method according to the embodiments of the present invention.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. The temperature compensation system of the pressure sensor is characterized by comprising a single chip microcomputer and an analog compensation module, wherein the single chip microcomputer is connected with the analog compensation module and is connected with the pressure sensor; wherein the content of the first and second substances,
the single chip microcomputer is used for collecting an output signal and a temperature signal of the pressure sensor and sending the output signal and the temperature signal to the analog compensation module;
the analog compensation module is used for fitting the output signal and the temperature signal to obtain a target output value and sending the target output value to the single chip microcomputer;
and the single chip microcomputer is also used for carrying out temperature compensation on the pressure sensor according to the target output value.
2. The system for temperature compensation of a pressure sensor of claim 1, wherein the analog compensation module comprises: a forward analog neural network circuit and a reverse analog neural network circuit; wherein the content of the first and second substances,
the forward analog neural network circuit is used for fitting the output signal and the temperature signal to obtain an initial output value and sending the initial output value to the reverse analog neural network circuit;
the reverse simulation neural network circuit is used for determining an output error value according to the initial output value, determining a target output value according to the output error value and the initial output value, and sending the target output value to the single chip microcomputer.
3. The system for temperature compensation of a pressure sensor of claim 2, wherein the forward analog neural network circuit comprises: an input layer circuit, a hidden layer circuit and an output layer circuit; wherein the content of the first and second substances,
the input layer circuit is used for receiving the output signal and the temperature signal and sending the output signal and the temperature signal to the hidden layer circuit;
the hidden layer circuit is used for fitting the output signal and the temperature signal to obtain a hidden layer operation result and sending the hidden layer operation result to the output layer circuit;
and the output layer circuit is used for converting the hidden layer operation result into an initial output value and sending the initial output value to the inverse simulation neural network circuit.
4. The temperature compensation system of a pressure sensor of claim 3, wherein the input layer circuitry comprises: a latch and an analog multiplier; wherein the content of the first and second substances,
the input end of the latch is connected with the signal output end of the single chip microcomputer, the input end of the analog multiplier is connected with the output end of the latch, and the output end of the analog multiplier is connected with the input end of the hidden layer circuit.
5. The temperature compensation system of claim 3, wherein the hidden layer circuit comprises a first operational amplifier circuit, a second operational amplifier circuit, a third operational amplifier circuit, a fourth operational amplifier circuit and a fifth operational amplifier circuit connected in sequence, wherein an input terminal of the first operational amplifier circuit is connected to an output terminal of the input layer circuit, and an output terminal of the fifth operational amplifier circuit is connected to an input terminal of the output layer circuit.
6. The temperature compensation system of a pressure sensor of claim 5, wherein the first operational amplifier circuit comprises: the circuit comprises a first operational amplifier, a first resistor, a second resistor and a third resistor; wherein the content of the first and second substances,
the first end of the first resistor is connected with the output end of the input layer circuit, the second end of the first resistor is connected with the negative input end of the first operational amplifier, the second end of the first resistor is connected with the first end of the second resistor, the second end of the second resistor is connected with the output end of the first operational amplifier, the output end of the first operational amplifier is connected with the input end of the second operational amplifier circuit, the first end of the third resistor is connected with the positive input end of the first operational amplifier, and the second end of the third resistor is grounded.
7. A temperature compensation method of a pressure sensor applied to the temperature compensation system of the pressure sensor according to any one of claims 1 to 6, wherein the temperature compensation system of the pressure sensor comprises: the device comprises a singlechip and an analog compensation module; the temperature compensation method of the pressure sensor comprises the following steps:
the single chip microcomputer collects an output signal and a temperature signal of the pressure sensor and sends the output signal and the temperature signal to the analog compensation module;
the analog compensation module fits the output signal and the temperature signal to obtain a target output value, and sends the target output value to the single chip microcomputer;
and the single chip microcomputer performs temperature compensation on the pressure sensor according to the target output value.
8. The method of temperature compensation of a pressure sensor of claim 7, wherein the analog compensation module comprises: a forward analog neural network circuit and a reverse analog neural network circuit;
the step that the analog compensation module fits the output signal and the temperature signal to obtain a target output value and sends the target output value to the single chip microcomputer comprises the following steps:
the forward simulation neural network circuit fits the output signal and the temperature signal to obtain an initial output value, and the initial output value is sent to the reverse simulation neural network circuit;
and the reverse simulation neural network circuit determines an output error value according to the initial output value, determines a target output value according to the output error value and the initial output value, and sends the target output value to the single chip microcomputer.
9. The method of temperature compensation for a pressure sensor of claim 8, wherein the forward analog neural network circuit comprises: an input layer circuit, a hidden layer circuit and an output layer circuit;
the step of fitting the output signal and the temperature signal by the forward simulated neural network circuit to obtain an initial output value, and sending the initial output value to the reverse simulated neural network circuit includes:
the input layer circuit receives the output signal and the temperature signal and sends the output signal and the temperature signal to the hidden layer circuit;
the hidden layer circuit is used for fitting the output signal and the temperature signal to obtain a hidden layer operation result, and the hidden layer operation result is sent to the output layer circuit;
and the output layer circuit converts the hidden layer operation result into an initial output value and sends the initial output value to the inverse simulation neural network circuit.
10. A pressure sensor, characterized in that it comprises a temperature compensation system of a pressure sensor according to any one of claims 1 to 6, or steps of a temperature compensation method applying a pressure sensor according to any one of claims 7 to 9.
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