CN113046702A - Preparation method for improving oxidation resistance of bonding layer of thermal barrier coating - Google Patents
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C23C14/5846—Reactive treatment
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Abstract
The invention relates to a preparation process of a thermal barrier coating of an aeroengine blade, in particular to a preparation method for improving the oxidation resistance of a bonding layer of the thermal barrier coating. Preparing a NiCoCrAlYSiHf bonding layer on a high-temperature alloy substrate by adopting an arc ion plating method, forming a regularly distributed groove type array structure on the surface of the thermal barrier coating bonding layer by utilizing a laser etching method, and plating a nano-scale Al film on the surface of the etched bonding layer by combining a magnetron sputtering method. The bonding layer prepared by the method can effectively improve the Al content of the surface, can also enhance the contact area between the Al film and the bonding layer, is beneficial to the generation of alumina in the high-temperature oxidation process, and can also enhance the interface bonding force between the bonding layer and thermally grown oxide, thereby improving the oxidation resistance of the bonding layer of the thermal barrier coating.
Description
Technical Field
The invention relates to a preparation process of a thermal barrier coating of an aeroengine blade, in particular to a preparation method for improving the oxidation resistance of a bonding layer of the thermal barrier coating.
Background
With the continuous development of the aerospace industry, the service temperature of a turbine engine is continuously increased, the gas temperature borne by a turbine blade is also continuously increased, the extreme high-temperature environment exceeds the temperature limit which can be borne by a high-temperature alloy, and the development of the turbine engine with a high thrust-weight ratio is limited under the condition, so that a thermal barrier coating is generated. Through the development of several generations, the thermal barrier coating forms a more perfect system. The thermal barrier coating widely used at present mainly has a double-layer structure. Namely, MCrAlY (M is Ni, Co or Ni + Co) is taken as a bonding layer, and ZrO is covered on the bonding layer2As a ceramic layer. The MCrAlY bonding layer has higher plasticity and higher high-temperature oxidation resistance, and is widely applied to hot end parts of turbine engines and gas turbines in aerospace, ships and the like at present.
In the high-temperature service process of the MCrAlY bonding layer, protective alpha-Al can be generated on the surface of the bonding layer2O3Oxide film, i.e. Thermally Grown Oxide (TGO), alpha-Al which is continuous and dense in early stage2O3The formation of the oxide layer can block the diffusion of oxygen element to the alloy matrix, and delay the oxidation reaction of the oxygen element and other alloy elements, thereby achieving the effect of high-temperature oxidation resistance. However, as the high temperature oxidation proceeds, the aluminum element is gradually consumed, the oxygen element and elements such as chromium, cobalt and the like are selectively oxidized, and spinel phase oxides with high brittleness and a porous loose structure are generated inside the TGO, the form composition of the thermal barrier coating is changed due to the generation of the spinel phase oxides, and particularly, the thermal barrier coating is generated due to the problems of thermal stress mismatch and the like caused by thermally grown oxides during the thermal cycle processThe premature failure such as cracking, peeling and the like is generated, so that the oxidation resistance of the coating is reduced, and the service life of the thermal barrier coating is seriously shortened. Many experts and scholars have conducted a series of studies in order to solve the related problems. Chinese patent CN102888605A discloses a method for preparing a composite coating by aluminizing on a CoNiCrAlY coating, which can increase the content of aluminum in the coating, but as the oxidation proceeds, the thickness of the oxide layer will gradually increase and generate growth stress, so that the thermal barrier coating bonding layer and the high-temperature alloy substrate will peel off and fail. Chinese patent CN107841704A discloses a method for regulating and controlling the interface structure of a thermal barrier coating by forming regularly distributed pit structures on the surface of the bonding layer of the thermal barrier coating through laser shock, which can enhance the bonding force between the sections, but the aluminum element is gradually consumed in the bonding layer after the oxidation time is too long, so that an aluminum poor region is formed in the bonding layer, and the oxidation resistance is reduced.
Disclosure of Invention
The invention aims to provide a preparation method for improving the aluminum content of the surface of a thermal barrier coating bonding layer, improving the distribution of aluminum elements and enhancing the bonding force between the bonding layer and thermal growth oxidation so as to improve the high-temperature oxidation resistance of the thermal barrier coating bonding layer, aiming at solving the problems of low aluminum content and weak oxidation resistance of the conventional thermal barrier coating bonding layer.
The technical scheme of the invention is as follows: preparing a NiCoCrAlYSiHf bonding layer on a high-temperature alloy substrate by adopting an arc ion plating method, forming a regularly distributed groove type array structure on the surface of the thermal barrier coating bonding layer by utilizing a laser etching method, and plating a nano-scale Al film on the surface of the etched bonding layer by combining a magnetron sputtering method. The bonding layer prepared by the method can effectively improve the Al content of the surface, can also enhance the contact area between the Al film and the bonding layer, is beneficial to the generation of alumina in the high-temperature oxidation process, and can also enhance the interface bonding force between the bonding layer and thermally grown oxide, thereby improving the oxidation resistance of the bonding layer of the thermal barrier coating.
The specific implementation steps are as follows:
the method comprises the following steps: and grinding, polishing and sand blasting the surface of the high-temperature alloy sample to be processed.
Step two: and depositing a NiCoCrAlYSiHf bonding layer on the high-temperature alloy matrix by adopting an arc ion plating technology. By optimizing the process parameters, the coating thickness is controlled to be: 40-50 μm; the process parameters of the arc ion plating are as follows: arc current 100A, arc voltage 40V, substrate bias voltage-150V, duty ratio 40%, target and substrate distance are: 180 mm.
Step three: carrying out vacuum heat treatment on the sample sprayed with the bonding layer, wherein the vacuum heat treatment parameters are as follows: 900 ℃, vacuum degree: 10-3Pa, time: and 4 h.
Step four: and grinding and polishing the sample subjected to vacuum heat treatment to remove surface debris impurities.
Step five: processing a groove type array structure which is regularly distributed on the surface of the sample after the step is finished by utilizing a picosecond laser etching method, wherein the length of the groove type structure is 10mm, the width of the groove type structure is 20 mu m, the height of the groove type structure is 10 mu m, and the center distance between adjacent grooves is 0.5 mm; the parameters of picosecond laser etching are that the wavelength is 1064nm, the repetition frequency is 50kHz, the scanning speed is 500mm/s, the power is 8.0W, and the repetition times are as follows: 2 times.
Step six: and (3) cleaning the sample after the step is finished by using acetone soaking treatment to remove surface oil contamination impurities.
Step seven: depositing a layer of Al film on the sample after the sixth step by using a magnetron sputtering technology, wherein the thickness of the aluminizer is 600-800nm, and the technological parameters of magnetron sputtering are as follows: ar gas pressure is 0.4pa, bias voltage is-150V, target current: 20A, duty ratio: 50 percent, and the magnetron sputtering time is 30-50 min.
Step eight: the prepared coating was placed in a high temperature oxidation furnace and oxidation experiments were performed at a temperature of 1150 ℃.
The invention has the advantages that:
1. the regularly distributed groove type array structure on the surface of the bonding layer increases the contact area of the aluminum film and the bonding layer, is beneficial to the generation of aluminum oxide in the high-temperature oxidation process, and can effectively regulate and control the growth behavior of Thermally Grown Oxide (TGO) generated in a high-temperature service environment and prolong the service time of the coating.
2. The groove-shaped structures which are regularly distributed are carved on the surface of the bonding layer by means of laser etching, so that the bonding force between the bonding layer and the TGO oxide layer generated in a high-temperature service environment can be increased, and the stripping failure of the TGO oxide layer is delayed.
3. An aluminum film is deposited on the surface of the bonding layer after etching by adopting a magnetron sputtering method, so that the aluminum content in the bonding layer is effectively increased, and the distribution of aluminum elements is improved.
Drawings
FIG. 1 is a schematic diagram of the structure of the inventive preparation.
Detailed Description
The embodiments of the present invention will now be described, but the present invention should not be construed as being limited thereto.
Example 1
(1) The surface of a high-temperature alloy GH4169 sample is respectively ground by 100-mesh, 300-mesh, 600-mesh, 1000-mesh and 1500-mesh sandpaper to remove surface scratches, then a diamond polishing agent is used for polishing the surface to a mirror surface, and then surface sand blasting is carried out to form roughness on the surface.
(2) The NiCoCrAlYSiHf bonding layer is prepared by adopting an arc ion plating method, process parameters are optimized, and the thickness of the NiCoCrAlYSiHf bonding layer is controlled to be 45 mu m.
(3) And carrying out vacuum heat treatment on the prepared bonding layer by using a vacuum heat treatment furnace at the temperature of: 900 ℃, vacuum degree: 10-3Pa, time: and 4 h.
(4) And grinding and polishing the bonding layer sample subjected to vacuum heat treatment to remove surface debris impurities.
(5) And processing a groove type array structure which is regularly distributed on the surface of the sample after the vacuum heat treatment by using a picosecond laser etching method, wherein the length of the groove type structure is 10mm, the width of the groove type structure is 20 micrometers, the height of the groove type structure is 10 micrometers, and the center distance between adjacent grooves is 0.5 mm. The parameters of picosecond laser etching are that the wavelength is 1064nm, the repetition frequency is 50kHz, the scanning speed is 500mm/s, the power is 8.0W, and the repetition times are as follows: 2 times.
(6) And (3) cleaning the sample after the step is finished by using acetone soaking treatment to remove surface oil contamination impurities.
(7) Depositing an Al film on the etched sample by utilizing a magnetron sputtering technology, wherein the thickness of the aluminizer is 600nm, and the technological parameters of magnetron sputtering are as follows: ar gas pressure 0.4pa, bias: -150V, duty cycle: 50%, target current: 20A, and the magnetron sputtering time is 30 min.
(8) The samples are respectively oxidized for 5h, 10h, 20h, 50h and 100h in the environment of 1150 ℃ and are weighed, then an oxidation kinetic curve is drawn, and the average growth rate of the TGO oxide layer of the coating prepared in the way under the environment of 1150 ℃ is about 4.753mg/cm2. The growth rate of the oxide layer is reduced by 10.36 percent compared with the original sample.
Example 2
(1) The surface of a high-temperature alloy GH4169 sample is respectively ground by 100-mesh, 300-mesh, 600-mesh, 1000-mesh and 1500-mesh sandpaper to remove surface scratches, then a diamond polishing agent is used for polishing the surface to a mirror surface, and then surface sand blasting is carried out to form roughness on the surface.
(2) The NiCoCrAlYSiHf bonding layer is prepared by adopting an arc ion plating method, process parameters are optimized, and the thickness of the NiCoCrAlYSiHf bonding layer is controlled to be 45 mu m.
(3) And carrying out vacuum heat treatment on the prepared bonding layer by using a vacuum heat treatment furnace at the temperature of: 900 ℃, vacuum degree: 10-3Pa, time: and 4 h.
(4) And grinding and polishing the bonding layer sample subjected to vacuum heat treatment to remove surface debris impurities.
(5) Regularly distributed groove-type structures are processed on the surface of the sample after vacuum heat treatment by using a picosecond laser etching method, the length of each groove-type structure is 10mm, the width of each groove-type structure is 20 micrometers, the height of each groove-type structure is 10 micrometers, and the center distance between every two adjacent grooves is 0.5 mm. The parameters of picosecond laser etching are that the wavelength is 1064nm, the repetition frequency is 50kHz, the scanning speed is 500mm/s, the power is 8.0W, and the repetition times are as follows: 2 times.
(6) And (3) cleaning the sample after the step is finished by using acetone soaking treatment to remove surface oil contamination impurities.
(7) Depositing an Al film on the etched sample by utilizing a magnetron sputtering technology, wherein the thickness of the aluminizer is 600nm, and the technological parameters of magnetron sputtering are as follows: ar gas pressure is 0.4pa, bias voltage is-150V, target current: 20A, duty ratio: 50 percent, and the magnetron sputtering time is 40 min.
(8) The samples are respectively oxidized for 5h, 10h, 20h, 50h and 100h in the environment of 1150 ℃ and are weighed, then an oxidation kinetic curve is drawn, and the average growth rate of the TGO oxide layer of the coating prepared in the way under the environment of 1150 ℃ is about 4.518mg/cm2. The growth rate of the oxide layer is reduced by 14.78% compared with the original sample.
Example 3
(1) The surface of a high-temperature alloy GH4169 sample is respectively ground by 100-mesh, 300-mesh, 600-mesh, 1000-mesh and 1500-mesh sandpaper to remove surface scratches, then a diamond polishing agent is used for polishing the surface to a mirror surface, and then surface sand blasting is carried out to form roughness on the surface.
(2) The NiCoCrAlYSiHf bonding layer is prepared by adopting an arc ion plating method, process parameters are optimized, and the thickness of the NiCoCrAlYSiHf bonding layer is controlled to be 45 mu m.
(3) And carrying out vacuum heat treatment on the prepared bonding layer by using a vacuum heat treatment furnace at the temperature of: 900 ℃, vacuum degree: 10-3Pa, time: and 4 h.
(4) Grinding and polishing the bonding layer sample subjected to vacuum heat treatment to remove surface debris impurities
(5) Regularly distributed groove-type structures are processed on the surface of the sample after vacuum heat treatment by using a picosecond laser etching method, the length of each groove-type structure is 10mm, the width of each groove-type structure is 20 micrometers, the height of each groove-type structure is 10 micrometers, and the center distance between every two adjacent grooves is 0.5 mm. The parameters of picosecond laser etching are that the wavelength is 1064nm, the repetition frequency is 50kHz, the scanning speed is 500mm/s, the power is 8.0W, and the repetition times are as follows: 2 times.
(6) And (3) cleaning the sample after the step is finished by using acetone soaking treatment to remove surface oil contamination impurities.
(7) Depositing an Al film on the etched sample by utilizing a magnetron sputtering technology, wherein the thickness of the aluminizer is 600nm, and the technological parameters of magnetron sputtering are as follows: ar gas pressure is 0.4pa, bias voltage is-150V, target current: 20A, duty ratio: 50 percent, and the magnetron sputtering time is 50 min.
(8) The samples are respectively oxidized for 5h, 10h, 20h, 50h and 100h in the environment of 1150 ℃ and are weighed, then an oxidation kinetic curve is drawn, and the average growth rate of the TGO oxide layer of the coating prepared in the way under the environment of 1150 ℃ is about 4.632mg/cm2. The growth rate of the oxide layer is reduced by 12.63 percent compared with the original sample.
Claims (6)
1. A preparation method for improving the oxidation resistance of a bonding layer of a thermal barrier coating is characterized by comprising the following specific steps:
the method comprises the following steps: grinding, polishing and sand blasting the surface of a high-temperature alloy sample to be processed;
step two: depositing a NiCoCrAlYSiHf bonding layer on the high-temperature alloy matrix by adopting an arc ion plating technology;
step three: carrying out vacuum heat treatment on the sample sprayed with the bonding layer;
step four: grinding and polishing the sample subjected to vacuum heat treatment to remove surface debris impurities;
step five: processing regularly distributed groove-shaped structures on the surface of the sample after the step is finished by using a picosecond laser etching method;
step six: cleaning the sample after the step is finished by using acetone soaking treatment to remove surface oil contamination impurities;
step seven: depositing an Al film on the sample obtained in the sixth step by utilizing a magnetron sputtering technology;
step eight: and putting the prepared coating into a high-temperature oxidation furnace for oxidation experiments.
2. The method for improving the oxidation resistance of the bonding layer of the thermal barrier coating as claimed in claim 1, wherein in the second step, the thickness of the bonding layer is controlled by optimizing process parameters as follows: 40-50 μm; the process parameters of the arc ion plating are as follows: arc current 100A, arc voltage 40V, substrate bias voltage-150V, duty ratio 40%, target and substrate distance are: 180 mm.
3. The method for improving the oxidation resistance of the bonding layer of the thermal barrier coating as claimed in claim 1, wherein in the third step, the vacuum heat treatment parameters are as follows, wherein the temperature is 900 ℃, the vacuum degree is as follows: 10-3Pa, time: and 4 h.
4. The method as claimed in claim 1, wherein in the step five, the groove structure has a length of 10mm, a width of 20 μm and a height of 10 μm, and a center distance between adjacent grooves is 0.5 mm; the parameters of picosecond laser etching are that the wavelength is 1064nm, the repetition frequency is 50kHz, the scanning speed is 500mm/s, the power is 8.0W, and the repetition times are as follows: 2 times.
5. The method as claimed in claim 1, wherein in the seventh step, the thickness of the aluminum film is 600-800 nm; the technological parameters of magnetron sputtering are as follows: ar gas pressure is 0.4pa, bias voltage is-150V, target current: 20A, duty ratio: 50 percent, and the magnetron sputtering time is 30-50 min.
6. The method as claimed in claim 1, wherein in the eighth step, the temperature of the oxidation is 1150 ℃, and the time of the oxidation is 5h, 10h, 20h, 50h, and 100 h.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113652687A (en) * | 2021-08-16 | 2021-11-16 | 西南交通大学 | Thermal barrier coating textured anti-sticking surface and preparation method thereof |
| CN113802087A (en) * | 2021-09-15 | 2021-12-17 | 科汇纳米技术（深圳）有限公司 | Method for plating diamond-like coating on surface of automobile transmission part and automobile transmission part |
| CN116288207A (en) * | 2023-03-21 | 2023-06-23 | 浙江大学 | Thermal barrier coating, preparation method thereof and application thereof in high-temperature alloy |
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| CN103668191A (en) * | 2013-12-09 | 2014-03-26 | 广州有色金属研究院 | Preparation method for thermal-barrier coating |
| CN108342676A (en) * | 2018-02-28 | 2018-07-31 | 江苏大学 | A kind of preparation process of blade of aviation engine thermal barrier coating |
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2021
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| CN103668191A (en) * | 2013-12-09 | 2014-03-26 | 广州有色金属研究院 | Preparation method for thermal-barrier coating |
| CN108342676A (en) * | 2018-02-28 | 2018-07-31 | 江苏大学 | A kind of preparation process of blade of aviation engine thermal barrier coating |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113652687A (en) * | 2021-08-16 | 2021-11-16 | 西南交通大学 | Thermal barrier coating textured anti-sticking surface and preparation method thereof |
| CN113802087A (en) * | 2021-09-15 | 2021-12-17 | 科汇纳米技术（深圳）有限公司 | Method for plating diamond-like coating on surface of automobile transmission part and automobile transmission part |
| CN113802087B (en) * | 2021-09-15 | 2023-08-11 | 科汇纳米技术（深圳）有限公司 | Method for plating diamond-like carbon coating on surface of automobile transmission part and automobile transmission part |
| CN116288207A (en) * | 2023-03-21 | 2023-06-23 | 浙江大学 | Thermal barrier coating, preparation method thereof and application thereof in high-temperature alloy |
| CN116288207B (en) * | 2023-03-21 | 2024-04-05 | 浙江大学 | Thermal barrier coating, preparation method thereof and application thereof in high-temperature alloy |
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