CN113038714A - Multilayer circuit board positive pitting process and aerospace high-reliability high-temperature-resistant multilayer circuit board - Google Patents
Multilayer circuit board positive pitting process and aerospace high-reliability high-temperature-resistant multilayer circuit board Download PDFInfo
- Publication number
- CN113038714A CN113038714A CN202110250819.3A CN202110250819A CN113038714A CN 113038714 A CN113038714 A CN 113038714A CN 202110250819 A CN202110250819 A CN 202110250819A CN 113038714 A CN113038714 A CN 113038714A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- hole
- multilayer circuit
- aerospace
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052802 copper Inorganic materials 0.000 claims abstract description 34
- 239000010949 copper Substances 0.000 claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 238000005530 etching Methods 0.000 claims abstract description 19
- 239000003365 glass fiber Substances 0.000 claims abstract description 19
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- 239000003822 epoxy resin Substances 0.000 claims abstract description 11
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 11
- MIMUSZHMZBJBPO-UHFFFAOYSA-N 6-methoxy-8-nitroquinoline Chemical compound N1=CC=CC2=CC(OC)=CC([N+]([O-])=O)=C21 MIMUSZHMZBJBPO-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000009832 plasma treatment Methods 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A multilayer circuit board positive recess etching process comprises the following steps: step S1: adopting a plasma treatment process to bite the epoxy resin layer of the substrate on the inner wall of the through hole of the multilayer circuit board by 5-60 microns; step S2: 2.5g/L of ammonium bifluoride and 50% sulfuric acid are combined into a glass fiber etching agent in a concentration of 3.5 ml/L; step S3: and pouring a glass fiber etching agent into the through hole, so that the glass fiber layer of the substrate on the inner wall of the through hole is bitten by 5-60 microns, and the line copper layer protrudes from the through hole by 5-60 microns. Thus, the connection reliability is improved and the service life is prolonged. The invention also provides a high-reliability high-temperature-resistant multi-layer circuit board for spaceflight.
Description
Technical Field
The invention relates to the technical field of high-frequency circuit board products, in particular to a multilayer circuit board positive pitting process and an aerospace high-reliability high-temperature-resistant multilayer circuit board.
Background
With the rapid development of the electronic information industry, electronic products are developing in the directions of integration, miniaturization and multi-functionalization, which puts higher requirements on technologies, processes and materials for the circuit board industry. The existing through hole treatment is generally a negative-pitting process, namely, a copper etching solution is used for etching a circuit copper layer, so that the circuit copper layer is sunken inwards. Therefore, the connection reliability is not high, and the service life is not long.
Disclosure of Invention
In view of the above, the present invention provides a multilayer circuit board front concave etching process and an aerospace high-reliability high-temperature resistant multilayer circuit board, which improve the connection reliability and prolong the service life, so as to solve the above problems.
A multilayer circuit board positive pitting process comprises the following steps: step S1: adopting a plasma treatment process to bite the epoxy resin layer of the substrate on the inner wall of the through hole of the multilayer circuit board by 5-60 microns; step S2: 2.5g/L of ammonium bifluoride and 50% sulfuric acid are combined into a glass fiber etching agent in a concentration of 3.5 ml/L; step S3: and pouring a glass fiber etching agent into the through hole, so that the glass fiber layer of the substrate on the inner wall of the through hole is bitten by 5-60 microns, and the line copper layer protrudes from the through hole by 5-60 microns.
The aerospace high-reliability high-temperature-resistant multilayer circuit board is manufactured by the process and comprises a plurality of stacked multilayer substrates, a first through hole penetrating through the middle parts of the multilayer substrates and a resin filling strip filled in the first through hole; the top surface or/and the bottom surface of each substrate is/are provided with a circuit copper layer; in the first through hole, the circuit copper layer protrudes 5-60 microns.
Further, a second through hole penetrating through an edge portion of the multi-layered substrate is also included.
Furthermore, the middle part of the aerospace high-reliability high-temperature-resistant multilayer circuit board is provided with a controller mounting area, a component mounting area and an integrated circuit mounting area, at least two lateral edges are provided with fixing areas, the first through holes and the resin filling strips are distributed in the controller mounting area, the component mounting area or the integrated circuit mounting area, and the second through holes are distributed in the fixing areas.
Furthermore, a plug-in part is protrudingly arranged on one side, which is not provided with the fixing area, of the aerospace high-reliability high-temperature-resistant multilayer circuit board.
Furthermore, the inserting part is a golden finger.
Further, the resin filling strip is an epoxy resin bonding sheet curing strip.
Furthermore, hole wall copper is arranged on the inner side wall of the first through hole, and the circuit copper layer covers two ends of the resin filling strip.
Compared with the prior art, the multilayer circuit board positive pitting process comprises the following steps: step S1: adopting a plasma treatment process to bite the epoxy resin layer of the substrate on the inner wall of the through hole of the multilayer circuit board by 5-60 microns; step S2: 2.5g/L of ammonium bifluoride and 50% sulfuric acid are combined into a glass fiber etching agent in a concentration of 3.5 ml/L; step S3: and pouring a glass fiber etching agent into the through hole, so that the glass fiber layer of the substrate on the inner wall of the through hole is bitten by 5-60 microns, and the line copper layer protrudes from the through hole by 5-60 microns. Thus, the connection reliability is improved and the service life is prolonged. The invention also provides a high-reliability high-temperature-resistant multi-layer circuit board for spaceflight.
Drawings
Embodiments of the invention are described below with reference to the accompanying drawings, in which:
fig. 1 is a schematic top view of the aerospace high-reliability high-temperature-resistant multilayer circuit board provided by the invention.
Fig. 2 is a schematic side view of the aerospace high-reliability high-temperature-resistant multilayer circuit board provided by the invention.
Detailed Description
Specific embodiments of the present invention will be described in further detail below based on the drawings. It should be understood that the description herein of embodiments of the invention is not intended to limit the scope of the invention.
Referring to fig. 1 and fig. 2, the aerospace high-reliability high-temperature-resistant multilayer circuit board provided by the present invention includes a multilayer substrate 10, a first through hole 20 penetrating through a middle portion of the multilayer substrate 10, a second through hole 40 penetrating through an edge portion of the multilayer substrate 10, and a resin filling bar 30 filled in the first through hole 20. The second through-hole 40 may not be filled with the resin filling bar 30.
Each substrate 10 is provided with a circuit copper layer on the top surface or/and the bottom surface, and the circuit copper layer is etched to form a circuit. Thus, a multilayer circuit arrangement is realized.
The high-reliability high-temperature-resistant multi-layer circuit board for spaceflight is characterized in that a controller mounting area 11, a component mounting area 12 and an integrated circuit mounting area 13 are arranged in the middle of the high-reliability high-temperature-resistant multi-layer circuit board, fixing areas 14 are arranged on at least two lateral edges of the high-reliability high-temperature-resistant multi-layer circuit board, first through holes 20 and resin filling strips 30 are distributed in the controller mounting area 11, the component mounting area 12 or the integrated circuit mounting area 13, and second through holes 40 are distributed in the.
The adjacent substrates 10 are bonded to each other by an epoxy resin bonding sheet.
Each layer of the substrate 10 is coated with a heating copper layer on the top surface or/and the bottom surface of the fixing area 14, and the heating copper layer can perform self-heating under the action of a magnetic field in the pressing process, so that the epoxy resin bonding sheets between the adjacent substrates 10 are softened and uniformly distributed, the adhesion between the adjacent substrates 10 is more uniform, the bonding is more reliable, and the product thickness is more consistent.
The controller installation area 11 is used for installing a controller; the component mounting section 12 is used for mounting electronic components such as resistors, capacitors, and the like; the ic mounting area 13 is used for mounting an ic chip. The fixing area 14 is used for fixing with an outer housing by means of screws.
The aerospace high-reliability high-temperature-resistant multilayer circuit board provided by the invention is also provided with a plug-in part 50 in a protruding manner on one side without the fixing area 14, and in the embodiment, the plug-in part 50 is a golden finger. Therefore, the aerospace high-reliability high-temperature-resistant multilayer circuit board provided by the invention realizes quick plug connection, and is convenient and reliable to mount.
Hole wall copper is arranged on the inner side walls of the first through hole 20 and the second through hole 40.
The resin-filled strip 30 is an epoxy cured strip formed by pressing an epoxy adhesive sheet powder.
The wiring copper layer covers both ends of the resin filler strip 30.
The existing through hole treatment is generally a negative-pitting process, namely, a copper etching solution is used for etching a circuit copper layer, so that the circuit copper layer is sunken inwards. In order to further improve the reliability, after the first through hole 20 or the second through hole 40 is formed, the hole wall of the first through hole 20 or the second through hole 40 is processed by adopting a forward etching process of the aerospace high-reliability high-temperature-resistant multilayer circuit board, so that a part of the substrate 10 in the first through hole 20 or the second through hole 40 is etched away, and a circuit copper layer protrudes.
The substrate 10 has an epoxy resin layer and a glass fiber layer.
The multilayer circuit board positive pitting process provided by the invention comprises the following steps:
step S1: adopting a plasma treatment process to bite off the epoxy resin layer of the substrate 10 on the inner wall of the first through hole 20 or the second through hole 40 by 5-60 microns;
step S2: 2.5g/L of ammonium bifluoride and 50% sulfuric acid are combined into a glass fiber etching agent in a concentration of 3.5 ml/L;
step S3: and pouring a glass fiber etchant into the first through hole 20 or the second through hole 40, so that the glass fiber layer of the substrate 10 on the inner wall of the first through hole 20 or the second through hole 40 is bitten off by 5-60 microns. The wiring copper layer is correspondingly made to protrude 5-60 microns from the first via 20 or the second via 40.
And then, carrying out copper deposition and copper electroplating on the first through hole 20 or the second through hole 40 to form hole wall copper, wherein the hole wall copper is in three-dimensional connection with the circuit copper layer, namely the hole wall copper is connected with the top surface and the bottom surface of the circuit copper layer, so that the connection reliability is improved.
After filling the resin filling bar 30, the resin filling bar 30 is compressed from both ends of the resin filling bar 30, and then baked, and then the portion of the resin filling bar 30 protruding from the first through hole 20 or the second through hole 40 is ground flat, so that both ends of the resin filling bar 30 are flush with the surface of the outermost substrate 10.
Compared with the prior art, the multilayer circuit board positive pitting process comprises the following steps: step S1: adopting a plasma treatment process to bite the epoxy resin layer of the substrate on the inner wall of the through hole of the multilayer circuit board by 5-60 microns; step S2: 2.5g/L of ammonium bifluoride and 50% sulfuric acid are combined into a glass fiber etching agent in a concentration of 3.5 ml/L; step S3: and pouring a glass fiber etching agent into the through hole, so that the glass fiber layer of the substrate on the inner wall of the through hole is bitten by 5-60 microns, and the line copper layer protrudes from the through hole by 5-60 microns. Thus, the connection reliability is improved and the service life is prolonged. The invention also provides a high-reliability high-temperature-resistant multi-layer circuit board for spaceflight.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, and any modifications, equivalents or improvements that are within the spirit of the present invention are intended to be covered by the following claims.
Claims (8)
1. A multilayer circuit board positive pitting process is characterized in that: the method comprises the following steps:
step S1: adopting a plasma treatment process to bite the epoxy resin layer of the substrate on the inner wall of the through hole of the multilayer circuit board by 5-60 microns;
step S2: 2.5g/L of ammonium bifluoride and 50% sulfuric acid are combined into a glass fiber etching agent in a concentration of 3.5 ml/L;
step S3: and pouring a glass fiber etching agent into the through hole, so that the glass fiber layer of the substrate on the inner wall of the through hole is bitten by 5-60 microns, and the line copper layer protrudes from the through hole by 5-60 microns.
2. An aerospace high-reliability high-temperature-resistant multilayer circuit board, which is prepared by the multilayer circuit board positive recess etching process according to claim 1, and is characterized in that: the multilayer substrate comprises a multilayer substrate, a first through hole penetrating through the middle part of the multilayer substrate and a resin filling strip filled in the first through hole, wherein the multilayer substrate is stacked; the top surface or/and the bottom surface of each substrate is/are provided with a circuit copper layer; in the first through hole, the circuit copper layer protrudes 5-60 microns.
3. The aerospace highly reliable high temperature resistant multilayer circuit board of claim 2, wherein: a second via is also included through an edge portion of the multi-layer substrate.
4. The aerospace highly reliable high temperature resistant multilayer circuit board of claim 3, wherein: the middle part of the high-reliability high-temperature-resistant multi-layer circuit board for spaceflight is provided with a controller mounting area, a component mounting area and an integrated circuit mounting area, at least two lateral edges are provided with fixing areas, the first through holes and the resin filling strips are distributed in the controller mounting area, the component mounting area or the integrated circuit mounting area, and the second through holes are distributed in the fixing areas.
5. The aerospace highly reliable high temperature resistant multilayer circuit board of claim 4, wherein: and a plug-in part is convexly arranged on one side of the aerospace high-reliability high-temperature-resistant multilayer circuit board, which is not provided with the fixed area.
6. The aerospace highly reliable high temperature resistant multilayer circuit board of claim 5, wherein: the insertion part is a golden finger.
7. The aerospace highly reliable high temperature resistant multilayer circuit board of claim 2, wherein: the resin filling strip is an epoxy resin bonding sheet curing strip.
8. The aerospace highly reliable high temperature resistant multilayer circuit board of claim 2, wherein: and hole wall copper is arranged on the inner side wall of the first through hole, and the circuit copper layer covers two ends of the resin filling strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110250819.3A CN113038714A (en) | 2021-03-08 | 2021-03-08 | Multilayer circuit board positive pitting process and aerospace high-reliability high-temperature-resistant multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110250819.3A CN113038714A (en) | 2021-03-08 | 2021-03-08 | Multilayer circuit board positive pitting process and aerospace high-reliability high-temperature-resistant multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113038714A true CN113038714A (en) | 2021-06-25 |
Family
ID=76466828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110250819.3A Pending CN113038714A (en) | 2021-03-08 | 2021-03-08 | Multilayer circuit board positive pitting process and aerospace high-reliability high-temperature-resistant multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113038714A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63261736A (en) * | 1987-04-20 | 1988-10-28 | Matsushita Electric Ind Co Ltd | Printed wiring board |
| CN108449889A (en) * | 2018-03-23 | 2018-08-24 | 深圳崇达多层线路板有限公司 | Production method is just recessed in a kind of wiring board |
| CN209731706U (en) * | 2019-01-04 | 2019-12-03 | 东莞兴强线路板有限公司 | A kind of multilayer golden finger printed circuit board |
-
2021
- 2021-03-08 CN CN202110250819.3A patent/CN113038714A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63261736A (en) * | 1987-04-20 | 1988-10-28 | Matsushita Electric Ind Co Ltd | Printed wiring board |
| CN108449889A (en) * | 2018-03-23 | 2018-08-24 | 深圳崇达多层线路板有限公司 | Production method is just recessed in a kind of wiring board |
| CN209731706U (en) * | 2019-01-04 | 2019-12-03 | 东莞兴强线路板有限公司 | A kind of multilayer golden finger printed circuit board |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210625 |
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| RJ01 | Rejection of invention patent application after publication |