CN113025117A - Solder resist ink, preparation method and use method thereof, and printed circuit board - Google Patents
Solder resist ink, preparation method and use method thereof, and printed circuit board Download PDFInfo
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- CN113025117A CN113025117A CN202010842793.7A CN202010842793A CN113025117A CN 113025117 A CN113025117 A CN 113025117A CN 202010842793 A CN202010842793 A CN 202010842793A CN 113025117 A CN113025117 A CN 113025117A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
Abstract
The application belongs to the technical field of electronic materials, and particularly relates to solder resist ink, which comprises the following raw material components in percentage by mass based on the total mass of the solder resist ink being 100 percent: 10-40% of polymer resin, 60-82% of low-dielectric-loss filler, 1-5% of curing agent and 0.1-3% of auxiliary agent; wherein the polymer resin is selected from: dielectric constant less than 3.5 and dielectric loss less than 8X 10‑3The polymer resin of (4). The solder resist ink and the non-exposure development type low dielectric loss solder resist ink do not need to pass through the procedures of exposure, development and the like, so that the environmental pollution is reduced; and the solid content reaches 100%, the ink does not contain VOC, and the ink has good thixotropy and printability and is convenient to apply and construct. Meanwhile, the solder resist ink has low dielectric constant and low dielectric loss, meets the requirements of high frequency and high speed transmission, and ensures that the signal transmission is more stable5G communication can be applied.
Description
Technical Field
The application belongs to the technical field of electronic materials, and particularly relates to solder resist ink, a preparation method and a use method thereof, and a printed circuit board for 5G communication.
Background
With the advent of the 5G high-frequency communication era, the material industry has also come to a new era. The 5G communication has extremely high speed, extremely low time delay and extremely high attenuation. The loss of 5G communication signal propagation is proportional to the frequency, dielectric constant Dk and dielectric loss Df of the material, and the higher the frequency, the higher the Dk and Df values, the higher the signal loss.
In combination, 5G communication puts higher demands on the dielectric constant Dk and dielectric loss Df of the material, i.e. the material is required to have a lower dielectric constant and a lower dielectric loss. The characteristics of 5G high frequency and high speed require that the PCB can also realize high frequency and high speed, namely, the PCB has the three characteristics: low transmission loss, low transmission delay, and high accuracy control of characteristic impedance. The factors influencing the characteristics of the PCB are more, besides the performance of the high-frequency copper clad plate material, the high polymer material (solder resist ink) playing a role in protecting the surface of the copper clad plate also has great influence on the signal transmission characteristics of the PCB, and the lower the Dk and Df values of the solder resist ink are, the more stable the signal transmission of the PCB is.
At present, most of solder mask ink in the market is common photosensitive solder mask green oil, the photosensitive solder mask green oil does not consider the influence on the signal transmission characteristic of the PCB, and the Dk and Df values of the conventional photosensitive solder mask ink are higher, so that the requirement of 5G communication on the PCB cannot be met. Meanwhile, the photosensitive solder resist ink is exposed, developed and the like in the using process, so that a large amount of waste water and sewage are generated, and environmental pollution is easily caused.
Disclosure of Invention
The application aims to provide solder resist ink and a preparation method thereof, and a use method of the solder resist ink, namely a printed circuit board for 5G communication, and aims to solve the problems that the existing photosensitive solder resist ink is high in dielectric constant and dielectric loss, cannot meet the requirement of the 5G communication on a PCB, and is large in environmental pollution due to exposure, development and other processes.
In order to achieve the purpose of the application, the technical scheme adopted by the application is as follows:
in a first aspect, the application provides a solder mask ink, which comprises the following raw material components in percentage by mass based on the total mass of the solder mask ink as 100%:
wherein the polymer resin is selected from: dielectric constant less than 3.5 and dielectric loss less than 8X 10-3The polymer resin of (4).
In a second aspect, the present application provides a method for preparing solder resist ink, comprising the steps of:
and mixing and grinding the low-dielectric-loss polymer resin, the low-dielectric-loss filler, the curing agent and the auxiliary agent according to the formula ratio to obtain the solder resist ink.
In a third aspect, the application provides a method for using solder resist ink, wherein the solder resist ink or the solder resist ink prepared by the method is obtained, deposited on a printed circuit board, dried and cured to complete the use of the solder resist ink.
In a fourth aspect, the present application provides a printed circuit board for 5G communication, where the printed circuit board uses the solder resist ink described above, or the solder resist ink prepared by the above method.
The solder resist ink provided by the first aspect of the application belongs to the non-exposure development type low dielectric loss solder resist ink, does not need to pass through the procedures of exposure, development and the like, reduces the environmental pollution, has solid content reaching 100%, does not contain VOC organic volatile components, has good thixotropy and printability, can be directly attached to the surfaces of electronic components such as PCBs (printed Circuit boards) and the like through printing, and meets the precision requirements of the electronic components such as PCBs and the like. And the solder resist ink has low dielectric constant and dielectric loss, meets the requirements of high frequency and high speed transmission, ensures more stable signal transmission and can be suitable for 5G communication.
The preparation method of the solder resist ink provided by the second aspect of the application is simple in process and suitable for industrial large-scale production and application. The solder resist ink prepared by the application has low dielectric constant and low dielectric loss, meets the requirements of high frequency and high speed transmission, enables signal transmission to be more stable, and can be suitable for 5G communication. In addition, the solder resist ink has good thixotropy and printability under the combined action of all components, is convenient to apply and construct, does not need procedures such as exposure, development and the like, simplifies application and construction conditions and operation, and reduces environmental pollution.
According to the application method of the solder resist ink provided by the third aspect of the application, the solder resist ink belongs to non-exposure development type solder resist ink with low dielectric loss, is deposited on the surfaces of electronic components such as PCBs (printed Circuit boards) through processes such as screen printing and the like, can be directly formed into a film through baking, drying and curing, does not need procedures such as exposure, development and the like, does not generate wastewater, sewage and the like which affect the environment, simplifies application and construction conditions and operation, reduces environmental pollution, and is green and environment-friendly.
The printed circuit board for 5G communication that this application fourth aspect provided owing to adopted above-mentioned low dielectric constant and low dielectric loss to hinder the solder resist printing ink, makes it satisfy the requirement of transmission high frequency ization, high-speed, makes signal transmission more stable, can be suitable for 5G communication, satisfies the requirement of 5G communication to printed circuit board material, promotes the development of printed circuit board trade.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic flow chart of a method for preparing solder resist ink provided in the embodiments of the present application.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application more clearly apparent, the present application is further described in detail below with reference to the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In the present invention, the term "and/or" describes the association relationship of the associated objects, and means that there may be three relationships, for example, a and/or B, which may mean: a is present alone, A and B are present simultaneously, and B is present alone. Wherein A and B can be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.
In the present invention, "at least one" means one or more, "a plurality" means two or more. "at least one of the following" or similar expressions refer to any combination of these items, including any combination of the singular or plural items. For example, "at least one (one) of a, b, or c," or "at least one (one) of a, b, and c," may each represent: a, b, c, a-b (i.e., a and b), a-c, b-c, or a-b-c, wherein a, b, and c may be single or plural, respectively.
It should be understood that, in various embodiments of the present invention, the sequence numbers of the above-mentioned processes do not mean the execution sequence, some or all of the steps may be executed in parallel or executed sequentially, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
The weight of the related components mentioned in the description of the embodiments of the present invention may not only refer to the specific content of each component, but also represent the proportional relationship of the weight among the components, and therefore, the content of the related components is scaled up or down within the scope disclosed in the description of the embodiments of the present invention as long as it is in accordance with the description of the embodiments of the present invention. Specifically, the mass described in the description of the embodiments of the present invention may be a mass unit known in the chemical industry field, such as μ g, mg, g, and kg.
The terms "first" and "second" are used for descriptive purposes only and are used for distinguishing purposes such as substances from one another, and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. For example, a first XX may also be referred to as a second XX, and similarly, a second XX may also be referred to as a first XX, without departing from the scope of embodiments of the invention. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
The solder resist ink comprises the following raw material components in percentage by mass based on 100% of the total mass of the solder resist ink:
wherein the polymer resin is selected from: dielectric constant less than 3.5 and dielectric loss less than 8X 10-3The polymer resin of (4).
On one hand, the solder resist ink provided by the first aspect of the application contains 10-40% of high polymer resin, the dielectric constant is less than 3.5, and the dielectric loss is less than 8 multiplied by 10-3The low dielectric loss high polymer resin and the low dielectric loss filler effectively reduce the dielectric constant and the dielectric loss of the solder resist ink, so that the solder resist ink meets the requirements of high frequency and high speed transmission, ensures more stable signal transmission and can be suitable for 5G communication. On the other hand, the better cross-linking polymerization curing effect can be realized between the low dielectric loss polymer resin and the curing agent in the solder resist ink under the heating condition, the non-exposure development type low dielectric loss solder resist ink does not need to pass through the procedures of exposure, development and the like, waste water, sewage and the like which influence the environment can not be generated, the application and construction conditions and operation are simplified, the environmental pollution is reduced, and the environment is protected. On the other hand, the solid content of the solder resist ink reaches 100% through the combined action of 10-40% of the low dielectric loss polymer resin, 60-82% of the low dielectric loss filler, 1-5% of the curing agent and 0.1-3% of the auxiliary agent, the solder resist ink is good in stability, does not contain VOC (volatile organic compounds), has good thixotropy and printability, can be directly attached to the surfaces of electronic components such as PCBs (printed Circuit boards), and meets the precision requirements of the electronic components such as PCBs.
In some embodiments, the polymeric resin is selected from: at least one of alkyl modified epoxy resin, alicyclic modified epoxy resin and cyanate ester modified epoxy resin. These are adopted in the embodiments of the present applicationThe modified epoxy resin has improved dielectric performance, high adhesion strength, high chemical stability, high mechanical performance, high electric performance, low shrinkage, low dielectric constant (less than 3.5) and dielectric loss (less than 8 x 10)-3Therefore, the dielectric constant and the dielectric loss of the solder resist ink are effectively reduced, and the solder resist ink is suitable for high-frequency and high-speed transmission of 5G communication.
In some embodiments, the polymeric resin in the solder resist ink is selected from: at least two of alkyl-modified epoxy resin, alicyclic-modified epoxy resin and cyanate ester-modified epoxy resin; through the combined action of more than two polymer resins, the advantages of the two polymer resins are exerted, the curing film-forming formation of the solder resist ink can be better optimized, and the dielectric constant and the dielectric loss of the solder resist ink are further reduced.
In some embodiments, the low dielectric loss filler is selected from: the filler is not only suitable for various high-fluidity and high-filling requirements, but also can be easily dispersed in high polymer resin, can effectively improve the material performance of the solder resist ink, and has the effects of increasing the capacity, increasing the weight, reducing the shrinkage rate and the like; and the dielectric constant and the dielectric loss are ultralow, so that the dielectric constant and the dielectric loss of the solder resist ink can be effectively reduced. Wherein Dk of boron carbide and silicon carbide is less than 3.2, Df is less than 5 multiplied by 10-3(ii) a Dk of the high-purity spherical silicon dioxide is less than 3.5, Df is less than 5 multiplied by 10-4。
In some embodiments, the low dielectric loss filler has a dielectric constant of < 3.5 and a dielectric loss of < 5 × 10-3The filler with dielectric constant and dielectric loss is adopted, so that the dielectric constant and dielectric loss of the solder resist ink can be better reduced, and the solder resist ink is more suitable for transmission of high-frequency and high-speed 5G communication.
In some embodiments, the D90 of the low-loss filler is less than or equal to 15 μm, namely the particle sizes of 90% of the fillers are less than or equal to 15 micrometers, and the fillers with small particle sizes and uniform particle size distribution have better dispersion stability and better filling effect in the solder resist ink; and the method is beneficial to the subsequent printing and other deposition processes of the ink, so that the thickness of the film layer after the ink film is formed is uniform, the surface of the film layer is smooth, and the method has better application prospect.
In some embodiments, the low dielectric loss filler is selected from: at least one of boron carbide, silicon carbide and high-purity spherical silicon dioxide; the dielectric constant of the low dielectric loss filler is less than 3.5, and the dielectric loss is less than 5 multiplied by 10-3(ii) a The D90 of the low dielectric loss filler is less than or equal to 15 mu m.
In some embodiments, the low dielectric loss filler in the solder resist ink is selected from: at least two of boron carbide, silicon carbide and high-purity spherical silicon dioxide; more than two kinds of low-dielectric-loss fillers are added, so that respective advantages are exerted, the performance of the solder resist ink can be better filled and optimized, the film-forming performance of the ink is further improved, and the film stability, the mechanical property and other characteristics of the formed film are further improved.
In some embodiments, the curing agent is selected from: at least one of benzoxazine resin and latent curing agent for epoxy resin; the curing agents not only have lower dielectric properties, but also have better crosslinking curing effect with low dielectric loss polymer resin, can be effectively cured to form a film layer with excellent physical and mechanical properties under proper baking conditions, have simple curing conditions, do not need procedures such as exposure, development and the like, simplify the process flow, reduce the discharge of waste water, waste residue and other wastes, reduce the environmental pollution, and are more environment-friendly. Wherein, the benzoxazine resin and the modified epoxy resin are subjected to ring-opening polymerization under the action of heating and/or a catalyst to generate a network polymer. The reticular polymer has the heat resistance and the flame retardance of common thermosetting phenolic resin or thermoplastic phenolic resin, and simultaneously, no micromolecule is released in the forming and curing process, the porosity of the product is low, the shrinkage is close to zero, the stress is small, and microcracks are avoided. The epoxy resin latent curing agent can be quickly subjected to curing reaction with the high polymer resin under the conditions of heating, illumination, moisture, pressurization and the like, and has good storage stability. In some embodiments, the epoxy latent curing agent is selected from: at least one of imidazoles, organic acid anhydrides, and dicyandiamide. Imidazole curing agents such as imidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole and the like are high-activity curing agents, and the epoxy resin can be cured at a medium temperature in a short time. The organic acid anhydride curing agent has better storage stability, and the mechanical property, the dielectric property and the heat resistance of a cured product can be better although the curing temperature is higher. The dicyandiamide curing agent has the function of a catalytic curing agent, and the product is high in stability, non-combustible and low in toxicity after being cured with the high polymer resin.
In some embodiments, the curing agent in the solder resist ink is selected from: at least two of the benzoxazine resin and the latent curing agent of the epoxy resin play a more comprehensive curing effect through the synergistic effect of more than two curing agents and the high polymer resin, and the curing film-forming property of the solder resist ink is improved.
In some embodiments, the adjuvant comprises: at least one of defoaming agent, wetting dispersant and flatting agent, and the assistants can further optimize the comprehensive performance of the solder resist ink, improve the dispersion stability and facilitate the application and construction.
In some embodiments, the defoaming agent is selected from polyether modified polysiloxane compounds, and the defoaming agent has strong defoaming capability and low dosage; does not affect the basic properties of the system and does not react with the system to be defoamed; the surface tension is small; the heat resistance is good; the diffusivity and the permeability are good; the chemical stability and the oxidation resistance are strong; and has high safety.
In some embodiments, the wetting dispersant is selected from: the modified polysiloxane and/or polyurethane compound has excellent wetting and dispersing capacity, can further improve the compatibility between the low dielectric loss filler and other components in the solder resist ink, improves the storage stability of the solder resist ink, and is more beneficial to the uniformity and stability of a film layer during printing and deposition.
In some embodiments, the leveling agent is selected from: the leveling agent can promote the solder resist ink to form a flat, smooth and uniform coating film in the drying film-forming process; the surface tension of the solder resist ink can be effectively reduced, the leveling property and uniformity of the solder resist ink are improved, the permeability of the ink can be improved, the possibility of generating spots and stains during brushing is reduced, the coverage is improved, and the formed film is uniform and natural.
In some embodiments, the polymeric resin in the solder resist ink is selected from: at least two of alkyl-modified epoxy resin, alicyclic-modified epoxy resin and cyanate ester-modified epoxy resin; the low dielectric loss filler is selected from: at least two of boron carbide, silicon carbide and high-purity spherical silicon dioxide; the curing agent is selected from: at least two of benzoxazine resin and latent curing agent for epoxy resin. The solder resist ink provided by the embodiment of the application has better comprehensive performance through interaction among various high polymer resins, curing agents and low-dielectric-loss fillers.
The solder resist ink provided by the embodiment of the application belongs to non-exposure development type low dielectric loss solder resist ink, and can protect the circuit pattern of a circuit board for a long time; and the dielectric constant and the loss factor are lower, the stability of PCB signal transmission is ensured, and the requirements of 5G high-frequency communication on PCB materials are met. In addition, the high-frequency antenna can be applied to circuit boards in the fields of 5G high-frequency communication such as antennas, power amplifiers, low-noise amplifiers, filters and other communication base stations, automobile auxiliary systems, aerospace technology, satellite communication, satellite televisions, military radars and the like.
The solder resist ink provided by the embodiment of the application can be prepared by the following method.
The second aspect of the embodiments of the present application provides a method for preparing solder resist ink, including the steps of:
and mixing and grinding the low-dielectric-loss polymer resin, the low-dielectric-loss filler, the curing agent and the auxiliary agent according to the formula ratio to obtain the solder resist ink.
According to the preparation method of the solder resist ink provided by the second aspect of the application, the solder resist ink can be obtained by mixing and grinding the low-dielectric-loss high-molecular resin, the low-dielectric-loss filler, the curing agent and the auxiliary agent according to the formula amount, and the preparation method is simple and is suitable for industrial large-scale production and application. The solder resist ink prepared by the embodiment of the application has low dielectric constant and low dielectric loss, meets the requirements of high frequency and high speed transmission, enables signal transmission to be more stable, and can be suitable for 5G communication. In addition, the solder resist ink has good thixotropy and printability under the combined action of all components, is convenient to apply and construct, does not need procedures such as exposure, development and the like, simplifies application and construction conditions and operation, and reduces environmental pollution.
In some embodiments, as shown in fig. 1, the step of mixing and grinding comprises: stirring and mixing the low dielectric loss polymer resin, the curing agent and the auxiliary agent according to the formula amount, grinding and dispersing to obtain a low dielectric loss resin base material, stirring and mixing with the low dielectric loss filler, grinding and dispersing to obtain the uniformly mixed solder resist ink. According to the embodiment of the application, the low dielectric loss polymer resin with the formula amount is mixed with the curing agent and the auxiliary agent, and then is mixed with the low dielectric loss filler, so that the components can be well mixed uniformly, the solder resist ink is more stable in dispersion, the storage is facilitated, and the construction and the application are more convenient.
In some embodiments, after the mixing and grinding treatment, the fineness of the non-exposure developing type solder resist ink is not higher than 15 microns, and the solder resist ink with small and uniform fineness has better dispersion stability, so that the subsequent deposition processes of printing and the like of the ink are facilitated, the thickness of a film layer after the ink film forming is uniform, the surface of the film layer is smooth, and the application prospect is better.
The third aspect of the embodiments of the present application provides a method for using solder resist ink, in which the solder resist ink or the solder resist ink prepared by the above method is obtained, and then deposited on a printed circuit board, and dried and cured to complete the use of the solder resist ink.
According to the application method of the solder resist ink provided by the third aspect of the application, the solder resist ink belongs to non-exposure development type solder resist ink with low dielectric loss, is deposited on the surfaces of electronic components such as PCBs (printed Circuit boards) through processes such as screen printing and the like, can be directly formed into a film through baking, drying and curing, does not need procedures such as exposure, development and the like, does not generate wastewater, sewage and the like which affect the environment, simplifies application and construction conditions and operation, reduces environmental pollution, and is green and environment-friendly.
In a fourth aspect of the embodiments of the present application, a printed circuit board for 5G communication is provided, where the printed circuit board uses the above solder resist ink, or uses a solder resist ink prepared by a method described in the foregoing spilt girl.
The printed circuit board for 5G communication that this application fourth aspect provided owing to adopted above-mentioned low dielectric constant and low dielectric loss to hinder the solder resist printing ink, makes it satisfy the requirement of transmission high frequency ization, high-speed, makes signal transmission more stable, can be suitable for 5G communication, satisfies the requirement of 5G communication to printed circuit board material, promotes the development of printed circuit board trade.
In order to make the details and operations of the above-mentioned embodiments of the present invention clearly understood by those skilled in the art and to make the performance of the solder resist ink and the method for preparing the same more obvious, the above-mentioned technical solutions are illustrated by the following examples.
Example 1
A solder resist ink comprises the following components: 10 parts of liquid alicyclic epoxy resin (Xinzheng star CY184), 16 parts of special alicyclic epoxy resin (Xinzheng star S-60), 2 parts of benzoxazine resin (new sunward material), 3 parts of modified imidazole latent curing agent (Japanese gourmet PN-23), 10 parts of boron carbide, 58 parts of spherical silicon dioxide, 0.9 part of wetting dispersant (moderate 903) and 0.1 part of modified polysiloxane defoamer (moderate 6500).
The preparation process comprises the following steps:
1. stirring and mixing liquid alicyclic epoxy resin, special alicyclic epoxy resin, benzoxazine resin, modified imidazole latent curing agent and wetting dispersant, and then dispersing and grinding the mixture by a three-roll grinder until the fineness is less than or equal to 15 mu m, namely the low-dielectric-loss resin base material;
2. mixing and stirring the low dielectric loss resin base material with the defoaming agent, the boron carbide and the spherical silicon dioxide, and then dispersing and grinding the mixture by using a three-roll grinder until the fineness is less than or equal to 15 mu m to obtain the non-exposure developing type low dielectric loss solder resist ink.
Example 2
A solder resist ink comprises the following components: 10 parts of liquid alicyclic epoxy resin (Xinzheng star CY184), 16 parts of special alicyclic epoxy resin (Xinzheng star S-60), 2 parts of benzoxazine resin (new sunward material), 3 parts of modified imidazole latent curing agent (Japanese gourmet PN-23), 20 parts of silicon carbide, 48 parts of spherical silicon dioxide, 0.9 part of wetting dispersant (moderate 903) and 0.1 part of modified polysiloxane defoamer (moderate 6500).
The preparation process comprises the following steps:
1. stirring and mixing liquid alicyclic epoxy resin, special alicyclic epoxy resin, benzoxazine resin, modified imidazole latent curing agent and wetting dispersant, and then dispersing and grinding the mixture by a three-roll grinder until the fineness is less than or equal to 15 mu m, namely the low-dielectric-loss resin base material;
2. mixing and stirring the low dielectric loss resin base material with the defoaming agent, the boron carbide silicon and the spherical silicon dioxide, and then dispersing and grinding the mixture by using a three-roll grinder until the fineness is less than or equal to 15 mu m to obtain the non-exposure developing type low dielectric loss solder resist ink.
Example 3
A solder resist ink comprises the following components: 10 parts of liquid alicyclic epoxy resin (Xinzheng star CY184), 16 parts of special alicyclic epoxy resin (Xinzheng star S-60), 2 parts of benzoxazine resin (New sunward material), 3 parts of modified imidazole latent curing agent (Japanese gourmet PN-23), 68 parts of spherical silica, 0.9 part of wetting dispersant (moderate 903) and 0.1 part of modified polysiloxane defoaming agent (moderate 6500).
The preparation process comprises the following steps:
1. stirring and mixing liquid alicyclic epoxy resin, special alicyclic epoxy resin, benzoxazine resin, modified imidazole latent curing agent and wetting dispersant, and then dispersing and grinding the mixture by a three-roll grinder until the fineness is less than or equal to 15 mu m;
2. mixing and stirring the low dielectric loss resin base material, the defoaming agent and the spherical silicon dioxide, and then dispersing and grinding the mixture by using a three-roll grinder until the fineness is less than or equal to 15 mu m to obtain the non-exposure developing type low dielectric loss solder resist ink.
Further, in order to verify the progress of the solder resist ink and the preparation method thereof in the embodiments of the present application, the following performance tests were performed on the solder resist inks prepared in embodiments 1 to 3 in the present application:
1. the solder resist ink prepared in the embodiments 1 to 3 is respectively subjected to screen printing (43T screen printing) by a high-precision screen printer, the solder resist ink is printed on a copper-clad plate, baking is performed at 120 ℃ x 1h and 150 ℃ x 1h, performance verification experiments such as solder resistance, acid and alkali resistance and the like are performed after baking and curing, and the test conditions and the test results are shown in the following table 1:
2. the solder resist inks prepared in examples 1 to 3 were poured into plastic boxes with a specification of 30 × 30 × 30mm, subjected to vacuum defoaming treatment, baked at 120 × 1h and 150 × 1h, sample bars with a specification of 25 × 25 × 3mm were prepared, and subjected to a dielectric constant and dissipation factor test (frequency of 10GHZ) using a high-frequency (microwave) dielectric loss analyzer, with the test results shown in table 1 below:
TABLE 1
From the test results, it can be seen that after the solder resist ink prepared in embodiments 1 to 3 is formed into a film, the film has good solder resistance, acid resistance, alkali resistance and the like, the stability of the film is good, the dielectric constant and the dielectric loss are low, the requirements of high frequency and high speed of 5G transmission are met, and the signal transmission is more stable.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. The solder resist ink is characterized by comprising the following raw material components in percentage by mass based on 100% of the total mass of the solder resist ink:
wherein the polymer resin is selected from: dielectric constant less than 3.5 and dielectric loss less than 8X 10-3The polymer resin of (4).
2. Solder resist ink according to claim 1, characterized in that the polymeric resin is selected from: at least one of alkyl modified epoxy resin, alicyclic modified epoxy resin and cyanate ester modified epoxy resin.
3. Solder resist ink according to claim 1 or 2, characterized in that the low dielectric loss filler is selected from: at least one of boron carbide, silicon carbide and high-purity spherical silicon dioxide;
and/or the dielectric constant of the low dielectric loss filler is less than 3.5, and the dielectric loss is less than 5 multiplied by 10-3；
And/or the D90 of the low dielectric loss filler is less than or equal to 15 mu m.
4. Solder resist ink according to claim 3, characterized in that the curing agent is selected from: at least one of benzoxazine resin and latent curing agent for epoxy resin;
and/or the auxiliary agent comprises: at least one of a defoaming agent, a wetting dispersant and a flatting agent.
5. The solder resist ink of claim 4, wherein the latent curing agent for epoxy resin is selected from the group consisting of: at least one of imidazoles, organic acid anhydrides, and dicyandiamide;
and/or, the defoamer is selected from polyether modified polysiloxane compounds;
and/or, the wetting and dispersing agent is selected from: modified polysiloxane and/or polyurethane compounds;
and/or the leveling agent is selected from: modified polysiloxanes and/or acrylate copolymers.
6. Solder resist ink according to claim 5, characterized in that the polymeric resin is selected from: at least two of alkyl-modified epoxy resin, alicyclic-modified epoxy resin and cyanate ester-modified epoxy resin;
and/or, the low dielectric loss filler is selected from: at least two of boron carbide, silicon carbide and high-purity spherical silicon dioxide;
and/or, the curing agent is selected from: at least two of benzoxazine resin and latent curing agent for epoxy resin.
7. A method for preparing solder resist ink according to any one of claims 1 to 6, characterized by comprising the steps of:
and mixing and grinding the low-dielectric-loss polymer resin, the low-dielectric-loss filler, the curing agent and the auxiliary agent according to the formula ratio to obtain the solder resist ink.
8. The method for preparing solder resist ink according to claim 7, wherein the step of the mixed grinding treatment comprises: mixing and grinding the low-dielectric-loss polymer resin, the curing agent and the auxiliary agent according to the formula ratio, and then mixing and grinding the mixture with the low-dielectric-loss filler;
and/or the fineness of the solder resist ink is not higher than 15 microns.
9. A method for using solder mask ink is characterized in that the solder mask ink as claimed in any one of claims 1 to 6 or the solder mask ink prepared by the method as claimed in any one of claims 7 to 8 is obtained, then the obtained solder mask ink is deposited on a printed circuit board, and the obtained solder mask ink is dried and cured to complete the use of the solder mask ink.
10. A printed circuit board for 5G communication, which is characterized in that the solder mask ink as claimed in any one of claims 1 to 6 or the solder mask ink prepared by the method as claimed in any one of claims 7 to 8 is adopted.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113604099A (en) * | 2021-07-08 | 2021-11-05 | 江苏海田电子材料有限公司 | Low-dielectric-constant solder resist ink and preparation method thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1544550A (en) * | 2003-11-21 | 2004-11-10 | 大化集团有限责任公司 | Hot curing solder resistant printing-ink composition |
| CN1914246A (en) * | 2004-02-25 | 2007-02-14 | 株式会社钟化 | Thermosetting resin composition and use thereof |
| CN104974520A (en) * | 2014-04-02 | 2015-10-14 | 广东生益科技股份有限公司 | Halogen-free resin composition and application thereof |
| CN106832226A (en) * | 2015-12-04 | 2017-06-13 | 广东生益科技股份有限公司 | A kind of halogen-free epoxy resin composition and the prepreg containing it, laminate and printed circuit board |
| CN107540816A (en) * | 2016-06-23 | 2018-01-05 | 南亚塑胶工业股份有限公司 | The preparation and application of the copolymer epoxy resin of bicyclopentadiene phenol and 2,6 xylenols |
| CN109923176A (en) * | 2016-11-24 | 2019-06-21 | 纳美仕有限公司 | Resin combination, thermosetting property film, resin cured matter, plywood, printed circuit board and semiconductor device using it |
| CN110079054A (en) * | 2019-05-28 | 2019-08-02 | 江苏扬农锦湖化工有限公司 | A kind of high-fire resistance resin and its preparation method and application |
| CN110922720A (en) * | 2019-12-05 | 2020-03-27 | 江南大学 | Ternary thermosetting resin composition for semiconductor device packaging |
-
2020
- 2020-08-20 CN CN202010842793.7A patent/CN113025117A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1544550A (en) * | 2003-11-21 | 2004-11-10 | 大化集团有限责任公司 | Hot curing solder resistant printing-ink composition |
| CN1914246A (en) * | 2004-02-25 | 2007-02-14 | 株式会社钟化 | Thermosetting resin composition and use thereof |
| CN104974520A (en) * | 2014-04-02 | 2015-10-14 | 广东生益科技股份有限公司 | Halogen-free resin composition and application thereof |
| CN106832226A (en) * | 2015-12-04 | 2017-06-13 | 广东生益科技股份有限公司 | A kind of halogen-free epoxy resin composition and the prepreg containing it, laminate and printed circuit board |
| CN107540816A (en) * | 2016-06-23 | 2018-01-05 | 南亚塑胶工业股份有限公司 | The preparation and application of the copolymer epoxy resin of bicyclopentadiene phenol and 2,6 xylenols |
| CN109923176A (en) * | 2016-11-24 | 2019-06-21 | 纳美仕有限公司 | Resin combination, thermosetting property film, resin cured matter, plywood, printed circuit board and semiconductor device using it |
| CN110079054A (en) * | 2019-05-28 | 2019-08-02 | 江苏扬农锦湖化工有限公司 | A kind of high-fire resistance resin and its preparation method and application |
| CN110922720A (en) * | 2019-12-05 | 2020-03-27 | 江南大学 | Ternary thermosetting resin composition for semiconductor device packaging |
Non-Patent Citations (3)
| Title |
|---|
| 《稀有金属应用》编写组: "《自然科学与高新技术》", vol. 1, 北京理工大学出版社, pages: 258 * |
| 孙忠贤: "《电子化学品》", vol. 1, 31 March 2001, 化学工业出版社, pages: 304 - 305 * |
| 车剑飞等: "《复合材料及其工程应用》", vol. 1, 31 August 2006, 机械工业出版社, pages: 81 - 82 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113604099A (en) * | 2021-07-08 | 2021-11-05 | 江苏海田电子材料有限公司 | Low-dielectric-constant solder resist ink and preparation method thereof |
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