CN113025026A - Resin glue solution for preparing copper-clad plate - Google Patents
Resin glue solution for preparing copper-clad plate Download PDFInfo
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- CN113025026A CN113025026A CN202110331436.9A CN202110331436A CN113025026A CN 113025026 A CN113025026 A CN 113025026A CN 202110331436 A CN202110331436 A CN 202110331436A CN 113025026 A CN113025026 A CN 113025026A
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- Prior art keywords
- resin
- silicon oxide
- aluminum oxide
- copper
- clad plate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/05—Polymer mixtures characterised by other features containing polymer components which can react with one another
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a resin glue solution for preparing a copper-clad plate, which is based on a polyphenyl ether resin system, but is modified, so that the resin glue solution has better thermosetting property and tin soldering resistance and improves dielectric property; a resin glue solution for preparing a copper-clad plate comprises the following components: a resin composition, an initiator, a curing agent, a reinforcing agent and a solvent; wherein the mass percentages of the components are as follows: 20-40% of a resin composition; 5-10% of an initiator; 10-20% of a curing agent; 10-20% of a reinforcing agent; the balance of solvent. Wherein the resin composition comprises 4: 1-2: 1 of polyphenylene ether resin and epoxy resin; the initiator comprises dicumyl peroxide, the curing agent comprises dicyandiamide and long-chain flexible aromatic diamine, and the weight ratio of the dicyandiamide to the long-chain flexible aromatic diamine is 3: 1-1: 1; the reinforcing agent is silicon oxide and aluminum oxide, and the weight ratio of the silicon oxide to the aluminum oxide is 3: 1-1: 1; the solvent is xylene. The silicon oxide and the aluminum oxide are gas phase silicon oxide and gas phase aluminum oxide.
Description
Technical Field
The invention relates to the technical field of copper-clad plates, in particular to a resin glue solution for preparing a copper-clad plate.
Background
The polyphenyl ether is an engineering plastic with excellent performance, has the characteristics of excellent electrical property, thermal property, boiling water resistance, radiation resistance, good dimensional stability, flame retardance, excellent bonding property with copper foil and the like, and is widely applied to high-performance printed circuit boards. However, polyphenylene ether resins are thermoplastic resins and have disadvantages such as poor solder resistance, poor solvent resistance to halogenated hydrocarbons and aromatic hydrocarbons, and poor film forming properties. Therefore, there is a need for a thermosetting resin obtained by modifying a polyphenylene ether resin to be cured by angular-stroke crosslinking, and having improved soldering resistance, solvent resistance and dielectric properties.
Disclosure of Invention
The invention aims to provide a resin glue solution for preparing a copper-clad plate, which is based on a polyphenyl ether resin system and is modified, so that the resin glue solution has better thermosetting property and tin soldering resistance and improves dielectric property.
A resin glue solution for preparing a copper-clad plate comprises the following components: a resin composition, an initiator, a curing agent, a reinforcing agent and a solvent; wherein the mass percentages of the components are as follows:
20-40% of a resin composition;
5 to 10 percent of initiator
10 to 20 percent of curing agent
10 to 20 percent of reinforcing agent
The balance of solvent.
Wherein the resin composition comprises 4: 1 to 2:1 of polyphenylene ether resin and epoxy resin; the initiator comprises dicumyl peroxide, the curing agent comprises dicyandiamide and long-chain flexible aromatic diamine, and the weight ratio of the dicyandiamide to the long-chain flexible aromatic diamine is 3: 1-1: 1; the reinforcing agent is silicon oxide and aluminum oxide, and the weight ratio of the silicon oxide to the aluminum oxide is 3: 1-1: 1; the solvent is xylene. The silicon oxide and the aluminum oxide are gas phase silicon oxide and gas phase aluminum oxide.
The preparation method of the resin glue solution comprises the following steps: adding polyphenyl ether resin and epoxy resin into dimethylbenzene, stirring at 85 ℃ until a uniform liquid phase is formed, then respectively adding dicumyl peroxide, dicyandiamide and long-chain flexible aromatic diamine, continuously stirring at 70 ℃ until the uniform liquid phase is formed, then adding silicon oxide and aluminum oxide, keeping the temperature and stirring to obtain a milky mixed glue solution.
The invention has the following action principle: the free radicals generated under the heating action of the initiator react with the hydroxyl groups of the polyphenyl ether resin and the epoxy resin, so that the crosslinking degree is improved; dicyandiamide and long-chain flexible aromatic diamine also react with hydroxyl to improve the crosslinking degree; the silicon oxide and the aluminum oxide reinforce the resin, so that the resin has better mechanical property and dielectric property.
Detailed Description
The invention aims to overcome the defects of the prior art and provides a resin glue solution for preparing a copper-clad plate, and the invention is further described in detail by combining the embodiment.
Example 1
A resin glue solution for preparing a copper-clad plate comprises the following components: a resin composition, an initiator, a curing agent, a reinforcing agent and a solvent; wherein the mass percentages of the components are as follows:
20% of a resin composition;
initiator 10%
20 percent of curing agent
20 percent of reinforcing agent
The balance of solvent.
Wherein the resin composition comprises a polyphenylene ether resin and an epoxy resin in a weight ratio of 3: 1; the initiator comprises dicumyl peroxide, the curing agent comprises dicyandiamide and long-chain flexible aromatic diamine, and the weight ratio of the dicyandiamide to the long-chain flexible aromatic diamine is 2: 1; the reinforcing agent is silicon oxide and aluminum oxide, and the weight ratio of the silicon oxide to the aluminum oxide is 2: 1; the solvent is xylene. The silicon oxide and the aluminum oxide are gas phase silicon oxide and gas phase aluminum oxide.
Example 2
A resin glue solution for preparing a copper-clad plate comprises the following components: a resin composition, an initiator, a curing agent, a reinforcing agent and a solvent; wherein the mass percentages of the components are as follows:
40% of a resin composition;
initiator 5%
10 percent of curing agent
10 percent of reinforcing agent
The balance of solvent.
Wherein the resin composition comprises a polyphenylene ether resin and an epoxy resin in a weight ratio of 3: 1; the initiator comprises dicumyl peroxide, the curing agent comprises dicyandiamide and long-chain flexible aromatic diamine, and the weight ratio of the dicyandiamide to the long-chain flexible aromatic diamine is 2: 1; the reinforcing agent is silicon oxide and aluminum oxide, and the weight ratio of the silicon oxide to the aluminum oxide is 2: 1; the solvent is xylene. The silicon oxide and the aluminum oxide are gas phase silicon oxide and gas phase aluminum oxide.
Example 3
A resin glue solution for preparing a copper-clad plate comprises the following components: a resin composition, an initiator, a curing agent, a reinforcing agent and a solvent; wherein the mass percentages of the components are as follows:
30% of a resin composition;
initiator 8%
15 percent of curing agent
18 percent of reinforcing agent
The balance of solvent.
Wherein the resin composition comprises a polyphenylene ether resin and an epoxy resin in a weight ratio of 3: 1; the initiator comprises dicumyl peroxide, the curing agent comprises dicyandiamide and long-chain flexible aromatic diamine, and the weight ratio of the dicyandiamide to the long-chain flexible aromatic diamine is 2: 1; the reinforcing agent is silicon oxide and aluminum oxide, and the weight ratio of the silicon oxide to the aluminum oxide is 2: 1; the solvent is xylene. The silicon oxide and the aluminum oxide are gas phase silicon oxide and gas phase aluminum oxide.
Example 4
A resin glue solution for preparing a copper-clad plate comprises the following components: a resin composition, an initiator, a curing agent, a reinforcing agent and a solvent; wherein the mass percentages of the components are as follows:
15% of a resin composition;
initiator 8%
15 percent of curing agent
18 percent of reinforcing agent
The balance of solvent.
Wherein the resin composition comprises a polyphenylene ether resin and an epoxy resin in a weight ratio of 3: 1; the initiator comprises dicumyl peroxide, the curing agent comprises dicyandiamide and long-chain flexible aromatic diamine, and the weight ratio of the dicyandiamide to the long-chain flexible aromatic diamine is 2: 1; the reinforcing agent is silicon oxide and aluminum oxide, and the weight ratio of the silicon oxide to the aluminum oxide is 2: 1; the solvent is xylene. The silicon oxide and the aluminum oxide are gas phase silicon oxide and gas phase aluminum oxide.
Example 5
A resin glue solution for preparing a copper-clad plate comprises the following components: a resin composition, an initiator, a curing agent, a reinforcing agent and a solvent; wherein the mass percentages of the components are as follows:
45% of a resin composition;
initiator 8%
15 percent of curing agent
18 percent of reinforcing agent
The balance of solvent.
Wherein the resin composition comprises a polyphenylene ether resin and an epoxy resin in a weight ratio of 3: 1; the initiator comprises dicumyl peroxide, the curing agent comprises dicyandiamide and long-chain flexible aromatic diamine, and the weight ratio of the dicyandiamide to the long-chain flexible aromatic diamine is 2: 1; the reinforcing agent is silicon oxide and aluminum oxide, and the weight ratio of the silicon oxide to the aluminum oxide is 2: 1; the solvent is xylene. The silicon oxide and the aluminum oxide are gas phase silicon oxide and gas phase aluminum oxide.
Example 6
A resin glue solution for preparing a copper-clad plate comprises the following components: a resin composition, an initiator, a curing agent, a reinforcing agent and a solvent; wherein the mass percentages of the components are as follows:
30% of a resin composition;
initiator 8%
15 percent of curing agent
18 percent of reinforcing agent
The balance of solvent.
Wherein the resin composition comprises 4: 1 of polyphenylene ether resins and epoxy resins; the initiator comprises dicumyl peroxide, the curing agent comprises dicyandiamide and long-chain flexible aromatic diamine, and the weight ratio of the dicyandiamide to the long-chain flexible aromatic diamine is 3: 1; the reinforcing agent is silicon oxide and aluminum oxide, and the weight ratio of the silicon oxide to the aluminum oxide is 3: 1; the solvent is xylene. The silicon oxide and the aluminum oxide are gas phase silicon oxide and gas phase aluminum oxide.
Example 7
A resin glue solution for preparing a copper-clad plate comprises the following components: a resin composition, an initiator, a curing agent, a reinforcing agent and a solvent; wherein the mass percentages of the components are as follows:
30% of a resin composition;
initiator 8%
15 percent of curing agent
18 percent of reinforcing agent
The balance of solvent.
Wherein the resin composition comprises a polyphenylene ether resin and an epoxy resin in a weight ratio of 2: 1; the initiator comprises dicumyl peroxide, the curing agent comprises dicyandiamide and long-chain flexible aromatic diamine, and the weight ratio of the dicyandiamide to the long-chain flexible aromatic diamine is 1: 1; the reinforcing agent is silicon oxide and aluminum oxide, and the weight ratio of the silicon oxide to the aluminum oxide is 1: 1; the solvent is xylene. The silicon oxide and the aluminum oxide are gas phase silicon oxide and gas phase aluminum oxide.
Example 8
A resin glue solution for preparing a copper-clad plate comprises the following components: a resin composition, an initiator, a curing agent, a reinforcing agent and a solvent; wherein the mass percentages of the components are as follows:
30% of a resin composition;
initiator 8%
15 percent of curing agent
18 percent of reinforcing agent
The balance of solvent.
Wherein the resin composition comprises polyphenyl ether resin and epoxy resin in a weight ratio of 1: 1; the initiator comprises dicumyl peroxide, the curing agent comprises dicyandiamide and long-chain flexible aromatic diamine, and the weight ratio of the dicyandiamide to the long-chain flexible aromatic diamine is 2: 1; the reinforcing agent is silicon oxide and aluminum oxide, and the weight ratio of the silicon oxide to the aluminum oxide is 2: 1; the solvent is xylene. The silicon oxide and the aluminum oxide are gas phase silicon oxide and gas phase aluminum oxide.
Example 9
A resin glue solution for preparing a copper-clad plate comprises the following components: a resin composition, an initiator, a curing agent, a reinforcing agent and a solvent; wherein the mass percentages of the components are as follows:
30% of a resin composition;
initiator 8%
15 percent of curing agent
18 percent of reinforcing agent
The balance of solvent.
Wherein the resin composition comprises polyphenylene oxide resin and epoxy resin in a weight ratio of 5: 1; the initiator comprises dicumyl peroxide, the curing agent comprises dicyandiamide and long-chain flexible aromatic diamine, and the weight ratio of the dicyandiamide to the long-chain flexible aromatic diamine is 2: 1; the reinforcing agent is silicon oxide and aluminum oxide, and the weight ratio of the silicon oxide to the aluminum oxide is 2: 1; the solvent is xylene. The silicon oxide and the aluminum oxide are gas phase silicon oxide and gas phase aluminum oxide.
Performing performance test on the products obtained in the embodiments, wherein the tensile property is tested according to GB/T3354-; the bending performance is in accordance with GB/T9341-2008; the water absorption rate is tested according to GB/T1462-1978; the solvent resistance was tested according to GB/T3857-; the dielectric constant and the dielectric loss factor are tested according to GB/T1409-.
It should be noted that, based on the above-mentioned structural design, in order to solve the same technical problems, even if some insubstantial modifications or tints are made on the invention, the essence of the adopted technical solution is the same as the invention, and therefore, the technical solution should be within the protection scope of the invention.
Claims (10)
1. A resin glue solution for preparing a copper-clad plate is characterized by comprising the following components: a resin composition, an initiator, a curing agent, a reinforcing agent and a solvent; wherein the mass percentages of the components are as follows:
20-40% of a resin composition;
5 to 10 percent of initiator
10 to 20 percent of curing agent
10 to 20 percent of reinforcing agent
The balance of solvent.
2. The resin glue solution for preparing the copper-clad plate according to claim 1 is characterized by comprising the following components in percentage by mass:
30% of a resin composition;
initiator 8%
15 percent of curing agent
18 percent of reinforcing agent
The balance of solvent.
3. The resin glue solution for preparing the copper-clad plate according to any one of claims 1 to 2, wherein the resin composition comprises the following components in a weight ratio of 4: 1 to 2:1 of polyphenylene ether resin and epoxy resin.
4. The resin adhesive solution for preparing the copper-clad plate according to any one of claims 1 to 2, wherein the initiator is dicumyl peroxide.
5. The resin glue solution for preparing the copper-clad plate according to any one of claims 1 to 2, wherein the curing agent is dicyandiamide and long-chain flexible aromatic diamine, and the weight ratio of dicyandiamide to long-chain flexible aromatic diamine is 3: 1-1: 1.
6. The resin glue solution for preparing the copper-clad plate according to any one of claims 1 to 2, wherein the reinforcing agent is silicon oxide and aluminum oxide, and the weight ratio of the silicon oxide to the aluminum oxide is 3: 1-1: 1; the silicon oxide and the aluminum oxide are gas phase silicon oxide and gas phase aluminum oxide.
7. The resin glue solution for preparing the copper-clad plate according to claim 1, wherein the solvent is xylene.
8. The resin glue solution for preparing the copper-clad plate according to claim 3, wherein the resin composition comprises the polyphenylene ether resin and the epoxy resin in a weight ratio of 3: 1.
9. The resin adhesive solution for preparing the copper-clad plate according to claim 5, wherein the curing agent is dicyandiamide and long-chain flexible aromatic diamine, and the weight ratio of dicyandiamide to long-chain flexible aromatic diamine is 2: 1.
10. The resin glue solution for preparing the copper-clad plate according to claim 6, wherein the reinforcing agent is silicon oxide and aluminum oxide, and the weight ratio of the silicon oxide to the aluminum oxide is 2: 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110331436.9A CN113025026A (en) | 2021-03-29 | 2021-03-29 | Resin glue solution for preparing copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110331436.9A CN113025026A (en) | 2021-03-29 | 2021-03-29 | Resin glue solution for preparing copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113025026A true CN113025026A (en) | 2021-06-25 |
Family
ID=76474309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110331436.9A Pending CN113025026A (en) | 2021-03-29 | 2021-03-29 | Resin glue solution for preparing copper-clad plate |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110143618A1 (en) * | 2009-12-11 | 2011-06-16 | Guangdong Shengyi Sci.Tech Co., Ltd. | Epoxy resin compound, preparation method thereof, prepreg made therefrom, and copper cladded laminate made therefrom |
| CN103467967A (en) * | 2013-09-16 | 2013-12-25 | 广东生益科技股份有限公司 | Thermosetting resin composition and use thereof |
| WO2014104742A1 (en) * | 2012-12-26 | 2014-07-03 | 주식회사 두산 | Resin composition, and metal foil laminate comprising same |
| CN106084654A (en) * | 2016-06-13 | 2016-11-09 | 电子科技大学中山学院 | Copper-clad plate resin glue solution and method for preparing copper-clad plate by applying resin glue solution |
-
2021
- 2021-03-29 CN CN202110331436.9A patent/CN113025026A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110143618A1 (en) * | 2009-12-11 | 2011-06-16 | Guangdong Shengyi Sci.Tech Co., Ltd. | Epoxy resin compound, preparation method thereof, prepreg made therefrom, and copper cladded laminate made therefrom |
| WO2014104742A1 (en) * | 2012-12-26 | 2014-07-03 | 주식회사 두산 | Resin composition, and metal foil laminate comprising same |
| CN103467967A (en) * | 2013-09-16 | 2013-12-25 | 广东生益科技股份有限公司 | Thermosetting resin composition and use thereof |
| CN106084654A (en) * | 2016-06-13 | 2016-11-09 | 电子科技大学中山学院 | Copper-clad plate resin glue solution and method for preparing copper-clad plate by applying resin glue solution |
Non-Patent Citations (2)
| Title |
|---|
| 孟季茹等: "聚苯醚/环氧树脂体系在覆铜板中的应用", 《热固性树脂》 * |
| 许可等: "低分子量聚苯醚的制备与表征", 《广东化工》 * |
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Application publication date: 20210625 |
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