CN113013306A - Wide lamp belt manufactured by flip chip and manufacturing method - Google Patents

Wide lamp belt manufactured by flip chip and manufacturing method Download PDF

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Publication number
CN113013306A
CN113013306A CN201911387425.1A CN201911387425A CN113013306A CN 113013306 A CN113013306 A CN 113013306A CN 201911387425 A CN201911387425 A CN 201911387425A CN 113013306 A CN113013306 A CN 113013306A
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China
Prior art keywords
wide
narrow
glue
lamp
flip chip
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CN201911387425.1A
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Chinese (zh)
Inventor
王定锋
徐文红
冉崇友
徐磊
宋健
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Individual
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Priority to CN201911387425.1A priority Critical patent/CN113013306A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

The invention relates to a wide lamp strip manufactured by a flip chip and a manufacturing method thereof, in particular to a wide lamp strip manufactured by welding the flip chip or welding the flip chip and a control element on a conjoined circuit board containing a plurality of flexible circuit boards, cutting the wide lamp strip into a plurality of narrow lamp strips, welding the narrow lamp strips on a welding spot of a conjoined flat cable containing a plurality of flat cables, or gluing the narrow lamp strips on the conjoined flat cable containing the plurality of flat cables by using glue, welding the conjoined flat cable on the flat cable, applying light blocking glue between two adjacent narrow lamp strips, forming a groove after the glue is cured, applying packaging glue in the groove to seal the chip and the circuit board, and cutting the wide lamp strip into single flip chip after the packaging glue is cured.

Description

Wide lamp belt manufactured by flip chip and manufacturing method
Technical Field
The invention relates to the field of LED lamp belts, in particular to a wide lamp belt manufactured by a flip chip and a manufacturing method thereof.
Background
The flip-chip lamp area of prior art directly welds a line flip-chip on wide circuit board, then glues the point with the encapsulation that does not flow and form a line in the centre and glue, seals the chip and seals the mid portion position of circuit board, and prior art has following problem:
1. when the wide circuit board is used for chip bonding by using a die bonder, the number of chips in unit area is small, so that the die bonding efficiency is too low.
2. The packaging glue is not flowed and is not uniformly dispensed in a line by a glue dispenser, so that the luminous colors of all positions of the lamp strip are inconsistent, and the packaging glue dispensing efficiency of the glue dispenser is too low.
3. The circuit board is too wide, and light blocking glue is not made on two sides of the circuit board, so that the appearance is not attractive, water is not prevented, and light emitted towards the front is weak.
In order to overcome the above drawbacks and deficiencies, the present invention is solved by:
1. the integrated circuit board containing a plurality of narrow lamp belt circuit boards is used for welding the flip chip on the circuit board, the chip per unit area on the circuit board is increased by more than one time, the chip fixing efficiency of a die bonder is improved, and the die bonder is cut into narrow lamp belts after die bonding and then assembled into a wide belt.
2. The packaging glue is high-flowing glue, the whole plate is placed on the horizontal platform during the packaging glue, a certain amount of packaging glue is poured on the groove, the natural leveling is realized, the thickness of the formed glue layer at all positions is uniform, the efficiency is high, and the color is uniform when the glue layer is lightened.
3. The narrow lamp strips are assembled on the connected wide row line, then light blocking glue is applied to the gap between the two narrow lamp strips, the light blocking glue forms a reflection groove with the upper size and the lower size, the chip is arranged at the bottom of the groove, the lighting effect of light emitted towards the front side is improved, then packaging glue is applied to the groove, and then the groove is cut into single strips, the manufacturing efficiency of the connecting plate is high, and the appearance grade is high.
Disclosure of Invention
The invention relates to a wide lamp strip manufactured by a flip chip and a manufacturing method thereof, in particular to a wide lamp strip manufactured by welding the flip chip or welding the flip chip and a control element on a conjoined circuit board containing a plurality of flexible circuit boards, cutting the wide lamp strip into a plurality of narrow lamp strips, welding the narrow lamp strips on a welding spot of a conjoined flat cable containing a plurality of flat cables, or gluing the narrow lamp strips on the conjoined flat cable containing the plurality of flat cables by using glue, welding the conjoined flat cable on the flat cable, applying light blocking glue between two adjacent narrow lamp strips, forming a groove after the glue is cured, applying packaging glue in the groove to seal the chip and the circuit board, and cutting the wide lamp strip into single flip chip after the packaging glue is cured.
The invention provides a method for manufacturing a wide lamp strip manufactured by a flip chip, which comprises the steps of welding the flip chip or welding the flip chip and a control element on a connected circuit board comprising a plurality of flexible circuit boards, cutting the connected circuit board into a plurality of narrow lamp strips, welding the narrow lamp strips on welding points of a connected flat cable comprising a plurality of wide flat cables, or gluing the narrow lamp strips on the connected flat cable comprising the wide flat cables by using glue, welding the narrow lamp strips on the flat cables, applying light blocking glue between adjacent narrow lamp strips to form grooves, arranging packaging glue in the grooves after the light blocking glue is solidified on the bottoms of the grooves by using a slitting machine, and slitting the packaging glue into single flip wide lamp strips by using a slitting machine after the packaging glue is solidified, wherein the two side surfaces of the long wide lamp strip, the two side surfaces of the light blocking glue on the wide lamp strip and the two side surfaces of the flat cables are respectively arranged on the same slitting machine surface, after the lamp strip is electrified, light emitted by the chip penetrates through the packaging adhesive and is emitted outwards.
According to the present invention, there is also provided a wide lamp strip manufactured by using a flip chip, comprising: a narrow circuit board; a flip chip or a flip chip and a control element; packaging glue; wide flat cables; light blocking glue; the light-blocking LED lamp is characterized in that a flip chip or the flip chip and a control element are welded on a narrow circuit board, the narrow circuit board is welded on a wide row line, or the narrow circuit board is glued on the wide row line and the wide row line, a light-blocking glue blocks two edges in the length direction of the lamp strip to form grooves, the formed grooves are narrow at the bottom and wide at the top, the light-blocking glue is glued on the row line or glued on the row line and the circuit board, a packaging glue is a translucent glue or a transparent glue containing fluorescent powder, two side faces of the light-blocking glue on the wide lamp strip and two side faces of the row line are respectively arranged on the same cutting tool face in the length direction of the wide lamp strip, and light emitted by the chip penetrates through the packaging glue to be emitted outwards after the lamp strip is electrified.
The invention also provides a method for manufacturing the wide lamp strip made of the flip chip, in particular to a method for manufacturing the wide lamp strip made of the flip chip by welding the flip chip or welding the flip chip and the control element on the circuit board by a plurality of conjoined circuit boards containing a plurality of flexible circuit boards, and then cutting the conjoined circuit boards into a plurality of narrow lamp strips, wherein the narrow lamp strips are arranged in parallel and arranged end to end and are directly welded on a welding point of the conjoined flat cable containing a plurality of wide flat cables, or the narrow lamp strips are arranged in parallel and arranged end to end and are firstly glued on the conjoined flat cable containing a plurality of wide flat cables and then welded on the welding point of the conjoined flat cable, light blocking glue is applied to the gap between two adjacent narrow lamp strips to form a groove after curing, the chip is applied to the bottom of the groove by encapsulation glue, the encapsulation glue is cured and then is cut into the flip wide lamp strip made of a single strip by a slitting machine, and the wide lamp strip is characterized, two side faces of the light blocking glue on the wide lamp strip and two side faces of the flat cable are respectively arranged on the same cutting tool face, a plurality of narrow lamp strips arranged end to end are arranged in the wide lamp strip, and light emitted by the chips passes through the packaging glue to be emitted outwards after the lamp strips are electrified.
According to the present invention, there is also provided a wide lamp strip manufactured by using a flip chip, comprising: a narrow circuit board; a flip chip or a flip chip and a control element; packaging glue; wide flat cables; light blocking glue; it is characterized in that the flip chip or the flip chip and the control element are welded on a plurality of narrow circuit boards to form a plurality of narrow lamp strips, the packaging adhesive is sealed on the narrow circuit boards and the flip chip, or the packaging glue is sealed on the narrow circuit board, the flip chip and the control element, a plurality of narrow lamp strips are arranged end to end and are directly welded on the wide arrangement line, or a plurality of narrow lamp belts are arranged end to end and are welded on the wide arrangement line by glue, the light-blocking glue blocks two sides of the lamp belt to form grooves, the grooves with narrow bottoms and wide tops are formed, the packaging glue is arranged in the grooves, two side surfaces in the length direction of the wide lamp strip, two side surfaces of the light blocking glue on the wide lamp strip and two side surfaces of the flat cable are respectively arranged on the same cutting tool surface, the wide lamp strip is provided with a plurality of narrow lamp strips which are arranged end to end, and light emitted by the chip after the lamp strips are electrified penetrates through the packaging glue and is emitted outwards.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
Fig. 1 is a schematic plan view of a strip of narrow strips of two-layer circuit boards with components.
Fig. 2 is a schematic plan view of a single narrow strip of tape for a two layer circuit board with components.
Fig. 3 is a schematic cross-sectional view of a single narrow strip of tape for a two-layer circuit board with components.
Fig. 4 is a schematic plan view of a conjoined long and wide flat cable.
Fig. 5 is a schematic plan view of a single segment assembly of a narrow light strip.
Fig. 6 is a schematic cross-sectional view of a single segment assembly of a narrow light strip.
Fig. 7 is a schematic plan view of a narrow strip assembled end-to-end to a long strip.
Fig. 8 is a schematic cross-sectional view of a narrow strip assembled end-to-end to a long strip.
Fig. 9 is a schematic cross-sectional view of a flip-chip wide light strip.
Fig. 10 is a schematic cross-sectional view of a single flip-chip wide strip of light.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Examples
1. Single narrow lamp strip production
A circuit board 1.1 of a connected double-layer circuit containing a plurality of narrow circuit boards is used, a connecting bonding pad 1.1a is arranged on each bottom layer of the connected double-layer circuit board containing a plurality of narrow circuit boards, a flip chip and a small resistor are fixed on the circuit board by using tin paste, and a single narrow lamp strip 2.1 (shown in figures 1, 2 and 3) of the double-layer circuit board with elements is cut for standby after reflow soldering.
2. Manufacturing of long and wide flat cable
And (3) clamping and adhering a plurality of wires to one layer of PET film with glue and the other layer of PET film with glue to prepare a connected wide flat cable, and then cutting off the thin film and the glue by using a laser machine to expose welding points 3.1a to prepare a connected long wide flat cable 3.1 (shown in figure 4) for later use.
3. Assembly
3.1 Single-stage Assembly
Solder paste is printed on the welding spots 3.1a of the connected wide flat cable, the single narrow lamp strip 2.1 is attached to the flat cable in an aligned mode, meanwhile, the two ends of the narrow lamp strip are heated by soldering iron, the bottom welding pads are welded to the flat cable, or the solder paste is printed on the flat cable, after the double-sided adhesive tape 4.1 is attached to the back of the narrow lamp strip, one narrow lamp strip is attached to the flat cable in an aligned mode, the two ends of the narrow lamp strip are heated by the soldering iron, and the bottom welding pads 1.1a of the narrow lamp strip and the welding spots 3.1a of the wide flat cable are welded together 5.1 (shown in figures 5 and 6.
3.2 narrow lamp strip is arranged end to end and assembled
One section of solder paste is printed on the connected long and wide flat cable 3.1, a plurality of narrow lamps are arranged in a row and arranged end to end, and the two ends of each narrow lamp are welded on the long and wide flat cable by heating with a soldering iron. Or printing solder paste on the long and wide row lines, after pasting the double faced adhesive tape 4.1 on the back of each narrow lamp strip 1.1, arranging one row from head to tail and pasting the row on the long and wide row lines, and then heating by using a soldering iron to weld the welding spots on the back of the narrow lamp strips and the long and wide row lines together (shown in fig. 7 and 8).
4. Glue dripping device
Dripping non-flowing light blocking glue 6.1 at the gap of the narrow lamp strip by using a glue dripping machine to ensure that the light blocking glue is arranged at the gap of the narrow lamp strip, standing and curing, forming a groove by the non-flowing light blocking glue at the gap, dripping fluorescent powder glue 7.1 at the bottom of the groove on the flip chip on the narrow lamp strip, naturally drying and curing, and cutting into single strips to prepare the wide flip chip lamp strip (shown in figures 9 and 10).
The invention has been described in detail with reference to the drawings and specific embodiments of a wide light strip manufactured by a flip chip and a manufacturing method thereof. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.

Claims (4)

1. A method for manufacturing wide lamp strip by flip chip includes welding flip chip or welding flip chip and control element on connected circuit board containing multiple flexible circuit board, cutting into multiple narrow lamp strips, welding multiple narrow lamp strips to welding point of connected cable containing multiple wide cables, adhering multiple narrow lamp strips to connected cable containing multiple wide cables, welding to cable, applying light-blocking glue between adjacent narrow lamp strips to form grooves, curing the light-blocking glue, applying packaging glue in the grooves, cutting into single wide lamp strip by slitting machine, and making wide lamp strip by cutting machine, the light emitted by the chip is emitted outwards through the packaging adhesive.
2. A wide light strip fabricated with flip chips, comprising:
a narrow circuit board;
a flip chip or a flip chip and a control element;
packaging glue;
wide flat cables;
light blocking glue;
the light-blocking LED lamp is characterized in that a flip chip or the flip chip and a control element are welded on a narrow circuit board, the narrow circuit board is welded on a wide row line, or the narrow circuit board is glued on the wide row line and the wide row line, a light-blocking glue blocks two edges in the length direction of the lamp strip to form grooves, the formed grooves are narrow at the bottom and wide at the top, the light-blocking glue is glued on the row line or glued on the row line and the circuit board, a packaging glue is a translucent glue or a transparent glue containing fluorescent powder, two side faces of the light-blocking glue on the wide lamp strip and two side faces of the row line are respectively arranged on the same cutting tool face in the length direction of the wide lamp strip, and light emitted by the chip penetrates through the packaging glue to be emitted outwards after the lamp strip is electrified.
3. A method for manufacturing a wide lamp strip by a flip chip comprises the steps of welding the flip chip or welding the flip chip and a control element on a circuit board by a plurality of connected circuit boards comprising a plurality of flexible circuit boards, cutting the circuit board into a plurality of narrow lamp strips, arranging the narrow lamp strips in parallel and in an end-to-end manner, directly welding the narrow lamp strips to welding points of connected flat cables comprising a plurality of wide flat cables, or arranging the narrow lamp strips in parallel and in an end-to-end manner, firstly gluing the narrow lamp strips to the connected flat cables comprising a plurality of wide flat cables, then welding the narrow lamp strips to the welding points of the connected flat cables, applying light blocking glue to gaps between two adjacent narrow lamp strips, solidifying the light blocking glue to form grooves, applying packaging glue to the bottoms of the grooves by chips, cutting the packaging glue into the flip single wide lamp strip by a slitting machine after the packaging glue is solidified, wherein the two side faces of the long wide lamp strip, the two side faces of the light blocking glue on the wide lamp strip and the two, and a plurality of narrow lamp belts arranged end to end are arranged in the wide lamp belts on the same cutter surface respectively, and light emitted by the chips passes through the packaging adhesive to be emitted outwards after the lamp belts are electrified.
4. A wide light strip fabricated with flip chips, comprising:
a narrow circuit board;
a flip chip or a flip chip and a control element;
packaging glue;
wide flat cables;
light blocking glue;
it is characterized in that the flip chip or the flip chip and the control element are welded on a plurality of narrow circuit boards to form a plurality of narrow lamp strips, the packaging adhesive is sealed on the narrow circuit boards and the flip chip, or the packaging glue is sealed on the narrow circuit board, the flip chip and the control element, a plurality of narrow lamp strips are arranged end to end and are directly welded on the wide arrangement line, or a plurality of narrow lamp belts are arranged end to end and are welded on the wide arrangement line by glue, the light-blocking glue blocks two sides of the lamp belt to form grooves, the grooves with narrow bottoms and wide tops are formed, the packaging glue is arranged in the grooves, two side surfaces in the length direction of the wide lamp strip, two side surfaces of the light blocking glue on the wide lamp strip and two side surfaces of the flat cable are respectively arranged on the same cutting tool surface, the wide lamp strip is provided with a plurality of narrow lamp strips which are arranged end to end, and light emitted by the chip after the lamp strips are electrified penetrates through the packaging glue and is emitted outwards.
CN201911387425.1A 2019-12-21 2019-12-21 Wide lamp belt manufactured by flip chip and manufacturing method Pending CN113013306A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911387425.1A CN113013306A (en) 2019-12-21 2019-12-21 Wide lamp belt manufactured by flip chip and manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911387425.1A CN113013306A (en) 2019-12-21 2019-12-21 Wide lamp belt manufactured by flip chip and manufacturing method

Publications (1)

Publication Number Publication Date
CN113013306A true CN113013306A (en) 2021-06-22

Family

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Family Applications (1)

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CN201911387425.1A Pending CN113013306A (en) 2019-12-21 2019-12-21 Wide lamp belt manufactured by flip chip and manufacturing method

Country Status (1)

Country Link
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