CN113009994A - Temperature control system - Google Patents

Temperature control system Download PDF

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Publication number
CN113009994A
CN113009994A CN202110326217.1A CN202110326217A CN113009994A CN 113009994 A CN113009994 A CN 113009994A CN 202110326217 A CN202110326217 A CN 202110326217A CN 113009994 A CN113009994 A CN 113009994A
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CN
China
Prior art keywords
control system
cold source
box body
heat exchange
source box
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Pending
Application number
CN202110326217.1A
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Chinese (zh)
Inventor
谷风宝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shandong Yingxin Computer Technology Co Ltd
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Shandong Yingxin Computer Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shandong Yingxin Computer Technology Co Ltd filed Critical Shandong Yingxin Computer Technology Co Ltd
Priority to CN202110326217.1A priority Critical patent/CN113009994A/en
Publication of CN113009994A publication Critical patent/CN113009994A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The application discloses a temperature control system, which comprises a cold source box body, an equipment box body, an atomizer and a control system; the cold source box body is used for cooling the gas through a heat exchange medium and is provided with a cold source box air inlet and a cold source box air outlet; the equipment box body is provided with an equipment box air inlet and an equipment box air outlet, and the equipment box air inlet of the equipment box body is connected with the cold source box air outlet of the cold source box body; the atomizer is used for spraying atomized liquid drops into the equipment box body; the control system is electrically connected with the atomizer. The application provides a temperature control system cools down the electronic component of equipment box inside through the mode of convective heat transfer and liquid drop phase transition, and heat exchange efficiency is higher, and occupation space is less.

Description

Temperature control system
Technical Field
The application relates to the technical field of server heat dissipation, in particular to a temperature control system.
Background
The traditional server is often provided with a plurality of groups of fan modules to accelerate heat convection to carry out heat exchange on electronic components and reduce the temperature of high-temperature elements in the server.
In the prior art, the heat dissipation efficiency is generally improved by increasing the power or increasing the number of fans, but the increase of the number of fans or the increase of the power can cause the fans to occupy the space for arranging electronic components inside the server, which results in the increase of the total volume and the weight of the server.
In summary, how to improve the heat exchange efficiency of the server and avoid the increase of the whole volume and the weight of the server is a problem to be solved urgently by those skilled in the art.
Disclosure of Invention
In view of this, the present application aims at providing a temperature control system, it cools down the electronic component of equipment box inside through the mode of convection heat transfer and liquid drop phase transition, and heat exchange efficiency is higher, and occupation space is less.
In order to achieve the above purpose, the present application provides the following technical solutions:
a temperature control system comprising:
the cold source box body is used for cooling the gas through a heat exchange medium and is provided with a cold source box air inlet and a cold source box air outlet;
the equipment box body is provided with an equipment box air inlet and an equipment box air outlet, and the equipment box air inlet of the equipment box body is connected with the cold source box air outlet of the cold source box body;
the atomizer is used for spraying atomized liquid drops into the equipment box body;
and the control system is electrically connected with the atomizer.
Optionally, a fan is arranged inside the equipment box.
Optionally, the control system is electrically connected to the fan and controls the rotation speed and the blowing direction of the fan.
Optionally, the cold source box is located at the top of the equipment box.
Optionally, the cold source box body comprises a cold source box body and a gas pipeline arranged inside the cold source box body, a heat exchange medium channel for flowing of a heat exchange medium is formed between the cold source box body and the gas pipeline, and the heat exchange medium channel is provided with a heat exchange medium inlet and a heat exchange medium outlet.
Optionally, an adjusting valve is arranged in the gas pipeline, and the control system is electrically connected with the adjusting valve and controls the opening degree of the adjusting valve.
Optionally, the number of the gas pipelines is at least two, and each gas pipeline is provided with the regulating valve.
Optionally, a baffle plate is arranged in the heat exchange medium flow channel.
Optionally, the gas pipeline is a straight pipe, the baffle plate is sleeved outside the gas pipeline through a through hole, and the baffle plate is in sliding fit with the gas pipeline; the cold source box body is provided with a driving part, and the driving part is connected with the baffle plate and controls the baffle plate to move.
Optionally, the number of the baffle plates is at least two, and the driving part is connected with each baffle plate.
Through above-mentioned scheme, the beneficial effect of the temperature control system that this application provided lies in:
the temperature control system comprises a cold source box body, an equipment box body, an atomizer and a control system; the cold source box body is used for cooling the gas through a heat exchange medium; an air inlet of the equipment box body is connected with an air outlet of the cold source box body; the atomizer is used for spraying atomized liquid drops into the equipment box body; the control system is electrically connected with the atomizer.
In the working process, the atomizing device atomizes the low-temperature refrigerant into liquid drops, the cold source box body converts gas into low-temperature gas through the heat exchange medium, the low-temperature gas and the atomized liquid are mixed in the equipment box body and flow in the equipment box body, and finally the low-temperature gas is discharged from an equipment box gas outlet of the equipment box body.
The heat exchange process of the working process comprises the following steps: the temperature of the gas is reduced after the gas passes through the cold source box body; the low-temperature gas and the atomized liquid drops flow in the equipment box body to carry out heat convection; the atomized liquid will undergo a phase change and absorb heat. Therefore, the temperature control system cools the high-temperature electronic element in the equipment box body through the combined action of convection heat exchange and liquid drop phase change, and compared with an air cooling mode in the prior art, the temperature control system can obtain higher equipment heat exchange efficiency, higher energy efficiency ratio and lower chip surface temperature, greatly improves the calculation density and performance, ensures the safe operation of the electronic element in the equipment box body and prolongs the service life of the electronic element; meanwhile, the volume and the weight of the equipment box body are not increased.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a top view of a temperature control system according to an embodiment of the present disclosure;
fig. 2 is a front view of a temperature control system according to an embodiment of the present disclosure.
The reference numbers in the figures are:
1-cold source box body, 11-cold source box body and 12-gas pipeline; 2-hard disk, 3-fan, 4-memory card, 5-main chip, 6-network card, 7-equipment box, 71-mixing cavity, 8-baffle plate and 9-optical module;
1 a-heat exchange medium inlet, 1 b-heat exchange medium outlet, 1 c-cold source box air inlet and 7 a-equipment box air outlet.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1 and fig. 2, the temperature control system provided in the present application is applied to an electronic product, and the electronic product may be embodied as a server product. The temperature control system comprises a cold source box body 1, an equipment box body 7, an atomizer and a control system.
The cold source box body 1 is used for cooling gas through a heat exchange medium, and a heat exchange medium flow passage and a gas flow passage which are distributed in an isolated manner are arranged in the cold source box body 1; the heat exchange medium channel is used for flowing a heat exchange medium and is provided with a heat exchange medium inlet 1a and a heat exchange medium outlet 1 b; the gas flow channel is used for gas flowing and is provided with a cold source box gas inlet 1c and a cold source box gas outlet.
The equipment box 7 is configured to accommodate electronic components, and when the electronic product is specifically a server product, each electronic component of the server is installed in the equipment box 7, for example, the hard disk 2, the memory card 4, the main chip 5, the network card 6, the optical module 9, and the like are installed. The equipment box body 7 is provided with an equipment box air inlet and an equipment box air outlet 7a, and the equipment box air inlet of the equipment box body 7 is connected with a cold source box air outlet of the cold source box body 1.
The atomizer is used for atomizing the refrigerant into liquid drops and spraying the atomized liquid drops into the equipment box 7. In actual arrangement, the atomizer can be arranged outside the equipment box body 7, and the equipment box body 7 is provided with an atomized liquid drop inlet connected with an atomizer outlet; the atomizer can also be arranged directly inside the device housing 7.
The control system is electrically connected with the atomizer. The control system can control the starting and stopping of the atomizer and can also control the flow of atomized liquid drops at the outlet of the atomizer according to requirements.
The temperature control system with the structure has the beneficial effects that: in the working process, the temperature of the gas is reduced after the gas passes through the cold source box body 1; the low-temperature gas and the atomized liquid drops flow in the equipment box body 7 to carry out heat convection; the atomized liquid will undergo a phase change and absorb heat. Therefore, the temperature control system cools the high-temperature electronic element in the equipment box body 7 through the combined action of convection heat exchange and liquid drop phase change, and compared with an air cooling mode in the prior art, the temperature control system can obtain higher equipment heat exchange efficiency, higher energy efficiency ratio and lower chip surface temperature, greatly improves the calculation density and performance, ensures the safe operation of the electronic element in the equipment box body 7 and prolongs the service life of the electronic element; without causing the volume and weight of the apparatus case 7 to increase.
Alternatively, in one embodiment, the spray position of the atomizer can be located near the inlet of the equipment cabinet in order to better mix the atomized liquid with the gas exhausted from the cold source cabinet 1.
Optionally, in an embodiment, the apparatus box 7 has a mixing chamber 71 inside, the mixing chamber 71 is not provided with the original electronic components of the server, and both the spraying position of the atomizer and the air inlet of the apparatus box are disposed in the mixing chamber 71, so as to ensure that the low-temperature gas and the atomized liquid droplets are fully mixed in the mixing chamber 71.
Further, in one embodiment, in order to detect the temperature inside the equipment cabinet 7, especially the temperature of the position of the sensitive component of the board card, a plurality of temperature sensors may be arranged in the equipment cabinet 7, and each temperature sensor is electrically connected with the control system.
Optionally, the temperature control system includes a display, the display is electrically connected to the control system, the temperature sensor sends the detected temperature information to the control system, and the control system sends a display instruction to the display, so that the display generates a temperature value corresponding to the temperature information.
Further, in one embodiment, the inside of the apparatus case 7 is provided with the fan 3. Cooling the electronic elements in the equipment box 7 in an air cooling mode; the fan 3 can also promote the mixing of low temperature air and atomized liquid drops, increase the convection current of the heat transfer medium after mixing and the inside electronic component of the equipment box 7, improve the phase change heat transfer efficiency, realize high-efficient heat transfer to guarantee that the inside electronic component of the equipment box 7 works in the design temperature.
Further, in one embodiment, the control system is electrically connected to the fan 3 and controls the speed of the fan and the direction of the air flow. Specifically, when the internal temperature of the equipment box 7 exceeds a preset value, the current heat exchange amount is insufficient, and the rotating speed of the fan can be increased; the fan 3 can be controlled to swing, so that the fan 3 supplies air towards a position with higher temperature, and the aim of cooling is fulfilled.
Further, in one embodiment, the cold source enclosure 1 is located on top of the equipment enclosure 7. Specifically, when actually designing, both the cold source box 1 and the equipment box 7 can adopt square structures, and the two are stacked up and down, so that the occupied space is smaller. It will be appreciated that other arrangements of the two may be used.
Further, in an embodiment, the cold source box 1 adopts a shell-and-tube heat exchanger structure, and specifically, the cold source box 1 includes a cold source box body 11 and a gas pipeline 12. The gas pipeline 12 is positioned inside the cold source box body 11, a gas flow channel for gas to flow is arranged inside the gas pipeline 12, and the two ends of the gas pipeline 12 are respectively a cold source box gas inlet 1c and a cold source box gas outlet; the flow channel between the cold source box body 11 and the gas pipeline 12 is a heat exchange medium flow channel for flowing of a heat exchange medium, the heat exchange medium flow channel is provided with a heat exchange medium inlet 1a and a heat exchange medium outlet 1b, and the heat exchange medium can be cooling liquid.
Optionally, the heat exchange medium and the gas inside the cold source box body 1 can exchange heat in a counter-flow mode, namely the gas and the heat exchange medium flow in opposite directions, so that the heat exchange efficiency is improved. Of course, the heat exchange medium and the gas inside the cold source box body 1 can also exchange heat in a downstream mode.
Further, in one embodiment, a regulating valve is disposed in the gas pipeline 12, and the control system is electrically connected to the regulating valve and controls the opening of the regulating valve. Specifically, the opening degree includes a full opening, a full closing, and a plurality of preset opening degrees between the full opening and the full closing, and the gas inflow amount can be controlled by adjusting the opening degree of the gas pipeline 12.
Further, in one embodiment, there are at least two gas lines 12, and each gas line 12 is provided with a regulating valve. Specifically, the plurality of gas pipelines 12 can improve the heat exchange efficiency and improve the air inflow; and when there are a plurality of gas lines 12, the number of gas lines 12 through which gas flows can be changed by individually controlling the opening degree of the regulating valve in the gas lines 12, particularly the opening and closing state of the regulating valve. In addition, the equipment cabinet 7 may be provided with equipment cabinet inlets corresponding to the gas pipes 12 one by one, and by controlling the flow rate of each gas pipe 12, the flow rate values of different electronic components entering the equipment cabinet 7 may be adjusted, for example, the gas flow rate of the corresponding gas pipe 12 is appropriately increased in a region with a higher temperature, so as to avoid local over-temperature of the equipment cabinet 7.
Optionally, in an embodiment, a heat exchange medium control valve is disposed at the heat exchange medium inlet 1a of the cold source box 1, the control system is electrically connected to the heat exchange medium control valve and controls an opening degree of the heat exchange medium control valve, and the temperature of the gas entering the equipment box 7 is adjusted by adjusting the flow rate of the heat exchange medium.
Further, in one embodiment, baffles 8 are provided in the heat exchange medium flow channels. Specifically, the baffle plate 8 can increase the flow stroke of the heat exchange medium, increase the internal liquid disturbance and improve the heat exchange efficiency of the heat exchange medium and the gas.
Further, in one embodiment, the gas pipeline 12 is a straight pipe, the baffle plate 8 is provided with a through hole, the gas pipeline 12 penetrates through the through hole of the baffle plate 8, and the baffle plate 8 is in sliding fit with the gas pipeline 12; the cold source box body 1 is provided with a driving part, and the driving part is connected with the baffle plate 8 and controls the baffle plate 8 to move. Specifically, the control system may be electrically connected to the driving unit, and control the driving unit to operate according to a control command. The driving part can adopt a linear driving part such as an air cylinder, an expansion rod, a screw motor and the like, and can control the baffle plate 8 to move horizontally or vertically, for example, the baffle plate 8 moves axially along the gas pipeline 12 to adjust the position of the baffle plate 8. In order to facilitate the linear movement of the baffle plate 8, a guide rail which is matched with the baffle plate 8 can be arranged inside the equipment box body 7.
Further, in one embodiment, there are at least two baffles 8 and a drive is coupled to each baffle 8. Specifically, the baffle plates 8 are sequentially distributed along the length direction of the gas pipeline 12, and the distance between the baffle plates 8 can be adjusted by controlling the movement of each baffle plate 8, so that the heat exchange effect in the cold source box body 1 is improved.
Further, in an embodiment, when the temperature value detected by the temperature sensor exceeds the preset temperature, the control system controls the display to generate a prompt message to prompt the user to increase the heat exchange amount, and the manner of adjusting the heat exchange amount may include any one or a combination of the following: the flow of the heat exchange medium of the cold source box body 1, the gas flow of the cold source box body 1, the position of the baffle plate 8, the flow of atomized liquid drops, the wind speed of the fan 3 and the blowing position of the fan 3.
Further, in an embodiment, the temperature control system further comprises a control cabinet, and a manual button is arranged on the control cabinet and electrically connected with the control system, so that a user can conveniently control and adjust the temperature control system manually.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The temperature control system provided by the present application is described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.

Claims (10)

1. A temperature control system, comprising:
the cold source box body (1) is used for cooling gas through a heat exchange medium, and the cold source box body (1) is provided with a cold source box air inlet (1c) and a cold source box air outlet;
the equipment box body (7) is provided with an equipment box air inlet and an equipment box air outlet (7a), and the equipment box air inlet of the equipment box body (7) is connected with the cold source box air outlet of the cold source box body (1);
an atomizer for spraying atomized liquid droplets into the interior of the apparatus case (7);
and the control system is electrically connected with the atomizer.
2. Temperature control system according to claim 1, characterized in that the interior of the equipment cabinet (7) is provided with a fan (3).
3. A temperature control system according to claim 2, wherein the control system is electrically connected to the fan (3) and controls the speed of rotation and the blowing direction of the fan.
4. Temperature control system according to claim 1, characterized in that the cold source cabinet (1) is located on top of the equipment cabinet (7).
5. The temperature control system according to any one of claims 1 to 4, wherein the cold source box (1) comprises a cold source box body (11) and a gas pipeline (12) arranged inside the cold source box body (11), a heat exchange medium channel for flowing a heat exchange medium is formed between the cold source box body (11) and the gas pipeline (12), and the heat exchange medium channel is provided with a heat exchange medium inlet (1a) and a heat exchange medium outlet (1 b).
6. The temperature control system according to claim 5, wherein a regulating valve is arranged in the gas pipeline (12), and the control system is electrically connected with the regulating valve and controls the opening degree of the regulating valve.
7. Temperature control system according to claim 6, characterized in that there are at least two of said gas lines (12), each of said gas lines (12) being provided with said regulating valve.
8. A temperature control system according to claim 5, characterized in that baffles (8) are provided in the heat exchange medium flow channels.
9. The temperature control system according to claim 8, wherein the gas pipeline (12) is a straight pipe, the baffle plate (8) is sleeved outside the gas pipeline (12) through a through hole, and the baffle plate (8) is in sliding fit with the gas pipeline (12); the cold source box body (1) is provided with a driving part, and the driving part is connected with the baffle plate (8) and controls the baffle plate (8) to move.
10. A temperature control system according to claim 9, wherein there are at least two baffles (8), and wherein the drive is connected to each of the baffles (8).
CN202110326217.1A 2021-03-26 2021-03-26 Temperature control system Pending CN113009994A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110326217.1A CN113009994A (en) 2021-03-26 2021-03-26 Temperature control system

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Application Number Priority Date Filing Date Title
CN202110326217.1A CN113009994A (en) 2021-03-26 2021-03-26 Temperature control system

Publications (1)

Publication Number Publication Date
CN113009994A true CN113009994A (en) 2021-06-22

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113703551A (en) * 2021-07-30 2021-11-26 苏州浪潮智能科技有限公司 Refrigerating system and server
WO2023213160A1 (en) * 2022-05-05 2023-11-09 天津商业大学 Novel highly-efficient data center server liquid-cooling heat dissipation cabinet

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CN201413489Y (en) * 2009-04-21 2010-02-24 联想(北京)有限公司 Cooling system and a computer provided with same
CN206788696U (en) * 2017-03-22 2017-12-22 连江大农环保科技有限公司 A kind of Evapotranspiration heat type computer motherboard
CN108664091A (en) * 2018-03-22 2018-10-16 苏州晨霞美合智能科技有限公司 A kind of computer cabinet of good heat dissipation effect
CN209184929U (en) * 2018-10-11 2019-07-30 贵州师范学院 A kind of temperature control device of high-performance cloud computing server
CN111457763A (en) * 2020-05-22 2020-07-28 中国科学院工程热物理研究所 Capillary heat exchanger for cooling variable-property fluid
CN212515585U (en) * 2020-06-28 2021-02-09 重庆电子工程职业学院 Computer heat dissipation case
CN212786475U (en) * 2020-10-16 2021-03-23 冯海军 PLC electrical automation control device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201413489Y (en) * 2009-04-21 2010-02-24 联想(北京)有限公司 Cooling system and a computer provided with same
CN206788696U (en) * 2017-03-22 2017-12-22 连江大农环保科技有限公司 A kind of Evapotranspiration heat type computer motherboard
CN108664091A (en) * 2018-03-22 2018-10-16 苏州晨霞美合智能科技有限公司 A kind of computer cabinet of good heat dissipation effect
CN209184929U (en) * 2018-10-11 2019-07-30 贵州师范学院 A kind of temperature control device of high-performance cloud computing server
CN111457763A (en) * 2020-05-22 2020-07-28 中国科学院工程热物理研究所 Capillary heat exchanger for cooling variable-property fluid
CN212515585U (en) * 2020-06-28 2021-02-09 重庆电子工程职业学院 Computer heat dissipation case
CN212786475U (en) * 2020-10-16 2021-03-23 冯海军 PLC electrical automation control device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113703551A (en) * 2021-07-30 2021-11-26 苏州浪潮智能科技有限公司 Refrigerating system and server
WO2023213160A1 (en) * 2022-05-05 2023-11-09 天津商业大学 Novel highly-efficient data center server liquid-cooling heat dissipation cabinet

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