CN113004676A - Low-dielectric thermosetting resin composition with low cost - Google Patents
Low-dielectric thermosetting resin composition with low cost Download PDFInfo
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- CN113004676A CN113004676A CN202110338503.XA CN202110338503A CN113004676A CN 113004676 A CN113004676 A CN 113004676A CN 202110338503 A CN202110338503 A CN 202110338503A CN 113004676 A CN113004676 A CN 113004676A
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- 239000011342 resin composition Substances 0.000 title claims abstract description 30
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 44
- 239000011347 resin Substances 0.000 claims abstract description 44
- 239000002904 solvent Substances 0.000 claims abstract description 23
- 229920013636 polyphenyl ether polymer Polymers 0.000 claims abstract description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 15
- 239000010703 silicon Substances 0.000 claims abstract description 15
- 239000002994 raw material Substances 0.000 claims abstract description 12
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000007767 bonding agent Substances 0.000 claims abstract description 11
- 239000000945 filler Substances 0.000 claims abstract description 11
- 239000003063 flame retardant Substances 0.000 claims abstract description 11
- 239000003999 initiator Substances 0.000 claims abstract description 11
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 10
- 229920003192 poly(bis maleimide) Polymers 0.000 claims abstract description 10
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 11
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 7
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 5
- 239000008096 xylene Substances 0.000 claims description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 4
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims description 4
- 229910000077 silane Inorganic materials 0.000 claims description 4
- -1 -tert-butyl dicumyl peroxide Chemical compound 0.000 claims description 3
- BZQKBFHEWDPQHD-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2-(2,3,4,5,6-pentabromophenyl)ethyl]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BZQKBFHEWDPQHD-UHFFFAOYSA-N 0.000 claims description 3
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 3
- DYIZJUDNMOIZQO-UHFFFAOYSA-N 4,5,6,7-tetrabromo-2-[2-(4,5,6,7-tetrabromo-1,3-dioxoisoindol-2-yl)ethyl]isoindole-1,3-dione Chemical compound O=C1C(C(=C(Br)C(Br)=C2Br)Br)=C2C(=O)N1CCN1C(=O)C2=C(Br)C(Br)=C(Br)C(Br)=C2C1=O DYIZJUDNMOIZQO-UHFFFAOYSA-N 0.000 claims description 3
- 239000004342 Benzoyl peroxide Substances 0.000 claims description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 150000004645 aluminates Chemical class 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 claims description 3
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- YKTNISGZEGZHIS-UHFFFAOYSA-N 2-$l^{1}-oxidanyloxy-2-methylpropane Chemical group CC(C)(C)O[O] YKTNISGZEGZHIS-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 229920001955 polyphenylene ether Polymers 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 238000011161 development Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- IKWKJIWDLVYZIY-UHFFFAOYSA-M butyl(triphenyl)phosphanium;bromide Chemical compound [Br-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CCCC)C1=CC=CC=C1 IKWKJIWDLVYZIY-UHFFFAOYSA-M 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000000113 differential scanning calorimetry Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- MPJPKEMZYOAIRN-UHFFFAOYSA-N 1,3,5-tris(2-methylprop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound CC(=C)CN1C(=O)N(CC(C)=C)C(=O)N(CC(C)=C)C1=O MPJPKEMZYOAIRN-UHFFFAOYSA-N 0.000 description 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000519995 Stachys sylvatica Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- JDZSWRCOINFOQI-UHFFFAOYSA-M methyl(triphenyl)azanium;bromide Chemical compound [Br-].C=1C=CC=CC=1[N+](C=1C=CC=CC=1)(C)C1=CC=CC=C1 JDZSWRCOINFOQI-UHFFFAOYSA-M 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 1
- 238000004227 thermal cracking Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention provides a low-dielectric thermosetting resin composition with low cost, which is prepared from the following raw materials in parts by weight: 70-120 parts of vinyl-terminated polyphenyl ether resin, 1-30 parts of silicon-containing polyphenyl ether resin, 28-38 parts of bismaleimide resin, 3-16 parts of polystyrene-butadiene resin, 30-60 parts of cross-linking agent, 1-5 parts of initiator, 10-20 parts of flame retardant, 100-150 parts of filler, 0.01-0.5 part of interface bonding agent, 1100-120 parts of solvent and 250-100 parts of solvent. According to the thermosetting resin composition with low cost and low dielectric property, the silicon-containing polyphenyl ether resin with higher heat resistance and flexibility is adopted, and the silicon-containing polyphenyl ether resin is matched with other components for use, so that the production cost can be obviously reduced, and the copper-clad plate with low cost and low dielectric property is obtained.
Description
Technical Field
The invention relates to the field of electronic materials, in particular to a low-dielectric-property thermosetting resin composition with low cost.
Background
With the development of miniaturization and multi-functionalization of electronic products, printed circuit boards are developed in the directions of light, thin, small, high-speed and high-frequency, and the development of new technologies brings technical difficulties such as product heat dissipation, precise layout, packaging design, low signal transmission loss and the like, and the problems also provide more severe requirements for technical innovation of the copper-clad plate industry. The copper-clad plate has high glass transition temperature, high modulus, low dielectric constant and dielectric loss, and meets the development requirements of high frequency and high speed of signal transmission.
Low dielectric resin materials have become the main development direction of high frequency high transmission rate substrates to meet the requirement of high speed information transmission. Compared with other resin materials, polyphenylene ether resin (PPE resin or PPO resin for short) has been gradually becoming a more ideal material in present high-frequency low-dielectric printed circuit boards because of its characteristics of low dielectric constant and dielectric loss. At present, the price of the manufactured copper-clad plate is high, and the copper-clad plate has low significance for practical application.
Therefore, it is an urgent problem to develop a thermosetting resin composition with low dielectric property which meets the requirements of new technology development by using raw materials with higher cost.
Disclosure of Invention
The invention aims to provide a thermosetting resin composition with low dielectric property, which has the advantages of low cost and low dielectric property.
In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:
according to a first aspect of embodiments of the present invention, there is provided a low-dielectric thermosetting resin composition with low cost, wherein raw materials for preparing the thermosetting resin composition comprise the following components in parts by weight: 70-120 parts of vinyl-terminated polyphenyl ether resin, 1-30 parts of silicon-containing polyphenyl ether resin, 28-38 parts of bismaleimide resin, 3-16 parts of polystyrene-butadiene resin, 30-60 parts of cross-linking agent, 1-5 parts of initiator, 10-20 parts of flame retardant, 100-150 parts of filler, 0.01-0.5 part of interface bonding agent, 1100-120 parts of solvent and 250-100 parts of solvent.
Further, the vinyl-terminated polyphenylene ether resin has a chemical formula:
further, the bismaleimide resin comprises any one of BMI-5100 and BMI-4000, but is not limited thereto.
Further, the polystyrene-butadiene resin includes any one of Ricon 100 and Ricon 257, but is not limited thereto.
Further, the crosslinking agent is any one or a combination of two or more of triallyl triisocyanate and methyl triallyl triisocyanate.
Further, the initiator includes at least one of benzoyl peroxide, dicumyl peroxide, di-t-butylperoxydicumyl peroxide, 2, 5-dimethyl-2, 5-bis (t-butylperoxy) hexyne-3, but is not limited thereto.
Further, the flame retardant includes at least one of decabromodiphenylethane, ethylenebistetrabromophthalimide, but is not limited thereto.
Further, the filler includes at least one of magnesium hydroxide, aluminum hydroxide, spherical silica powder, soft silica powder, and talc powder, but is not limited thereto.
Further, the interface binder includes at least one of silane, titanate and aluminate coupling agent, but is not limited thereto.
Further, the solvent 1 and the solvent 2 respectively include at least one of cyclohexanone, butanone, acetone, toluene and xylene, but are not limited thereto.
The embodiment of the invention has the following advantages: the embodiment of the invention provides a low-dielectric thermosetting resin composition with low cost, which comprises vinyl-terminated polyphenyl ether resin, silicon-containing polyphenyl ether resin, bismaleimide resin, polystyrene-butadiene resin, a cross-linking agent, an initiator, a flame retardant, a filler, an interface bonding agent, a solvent 1 and a solvent 2.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
The embodiment provides a thermosetting resin composition with low dielectric property and low cost, and raw materials for preparing the thermosetting resin composition comprise the following components in parts by weight: 70 parts of vinyl-terminated polyphenyl ether resin, 1 part of silicon-containing polyphenyl ether resin, 28 parts of bismaleimide resin, 3 parts of polystyrene-butadiene resin, 30 parts of cross-linking agent, 1 part of initiator, 10 parts of flame retardant, 100 parts of filler, 0.01 part of interface bonding agent, 1100 parts of solvent and 250 parts of solvent.
Example 2
The embodiment provides a thermosetting resin composition with low dielectric property and low cost, and raw materials for preparing the thermosetting resin composition comprise the following components in parts by weight: 120 parts of vinyl-terminated polyphenylene ether resin, 30 parts of silicon-containing polyphenylene ether resin, 38 parts of bismaleimide resin, 16 parts of polystyrene-butadiene resin, 60 parts of cross-linking agent, 5 parts of initiator, 20 parts of flame retardant, 150 parts of filler, 0.5 part of interface bonding agent, 1120 parts of solvent and 2100 parts of solvent.
Example 3
The embodiment provides a thermosetting resin composition with low dielectric property and low cost, and raw materials for preparing the thermosetting resin composition comprise the following components in parts by weight: 95 parts of vinyl-terminated polyphenyl ether resin, 15.5 parts of silicon-containing polyphenyl ether resin, 33 parts of bismaleimide resin, 9.5 parts of polystyrene-butadiene resin, 45 parts of cross-linking agent, 3 parts of initiator, 15 parts of flame retardant, 125 parts of filler, 0.255 part of interface bonding agent, 1110 parts of solvent and 275 parts of solvent.
Example 4
On the basis of the technical solutions provided in examples 1 to 3, there is provided a method for synthesizing a silicon-containing polyphenylene ether resin, comprising: adding 10 parts of hydroxyl-terminated polyphenylene oxide resin and 10 parts of anhydrous xylene into a four-neck flask with stirring, starting stirring, introducing nitrogen for protection, heating to 150 ℃, stirring until the mixture is dissolved, adding 0.01 part of catalyst and 0.005 part of hydroquinone, dripping 76 parts of vinyltriethoxysilane by using a dropping funnel, and preserving heat for 4 hours at 150 ℃. And then distilling under reduced pressure to remove ethanol and xylene, and finally diluting with toluene to obtain the silicon-containing polyphenylene ether resin with the solid content of 50% and the vinyl-terminated modified polyphenylene ether resin.
The catalyst is selected from one of butyltriphenylphosphonium bromide, triphenylphosphine, tetrabutylammonium bromide and methyltriphenylammonium bromide, and is preferably butyltriphenylphosphonium bromide.
The resin has the advantages that silane with vinyl at the end reacts with hydroxyl-terminated polyphenyl ether resin, the reaction time is short under a high-boiling point solvent, and the yield is high; the tail end in the molecular structure of the prepared product contains double bonds, so that free radical reaction is easy to occur; organic silicon is introduced into a molecular structure, so that the heat resistance and the flexibility can be improved; the cost performance of this resin is higher than that of SA 9000.
It should be noted that, based on the technical solutions of examples 1 to 4, the chemical formula of the vinyl-terminated polyphenylene ether resin is:
preferably, the bismaleimide resin includes any one of BMI-5100 and BMI-4000, but is not limited thereto.
Preferably, the polystyrene-butadiene resin includes any one of Ricon 100 and Ricon 257, but is not limited thereto.
Preferably, the crosslinking agent is any one of triallyl triisocyanate and methyl triallyl triisocyanate or a combination of two or more of them.
Preferably, the initiator includes at least one of benzoyl peroxide, dicumyl peroxide, di-t-butylperoxy-dicumyl peroxide, 2, 5-dimethyl-2, 5-bis (t-butylperoxy) hexyne-3, but is not limited thereto.
Preferably, the flame retardant includes at least one of decabromodiphenylethane and ethylenebistetrabromophthalimide, but is not limited thereto.
Preferably, the filler includes at least one of magnesium hydroxide, aluminum hydroxide, spherical silica powder, soft silica powder, and talc powder, but is not limited thereto.
Preferably, the interfacial bonding agent includes at least one of silane, titanate, and aluminate coupling agents, but is not limited thereto.
Preferably, the solvent 1 and the solvent 2 respectively include at least one of cyclohexanone, butanone, acetone, toluene and xylene, but are not limited thereto.
The present invention will be described in detail below with reference to specific examples.
Experimental example 1
Weighing raw materials in parts by weight in the components in the table 1;
cleaning a glue mixing tank by using acetone, adding a solvent 1, a solvent 2 and an interface bonding agent, adding a solid raw material, stirring to completely dissolve the solid raw material, sequentially adding the rest raw materials, stirring at the rotating speed of 1000rpm for 3 hours, stirring at the rotating speed of 600rpm for 2 hours, and testing the qualification of glue SG to obtain the thermosetting resin composition;
and (3) dipping the thermosetting resin composition according to a established process of a vertical gluing machine, and baking to prepare a prepreg. The main technical control points of the prepreg are as follows: controlling the content of the glue to be 40-50%, the fluidity to be 15-50%, the gelling time, and the volatile matter to be less than 0.5%;
and (4) covering 1OZ copper foils on the upper and lower 8 prepregs respectively to form a stacked structure, putting the stacked structure into a hot press, pressing the stacked structure after a certain time, temperature and pressure to obtain a composite laminated board, and performing characteristic test on the laminated board. The results of the test according to IPC-650 are shown in Table 2 below.
TABLE 1
| Raw materials | Example 1 | Example 2 | Example 3 | Example 4 | Comparative example 1 | Comparative example 2 | Comparative example 3 |
| MEK | 90 | 90 | 90 | 90 | 90 | 90 | 90 |
| Toluene | 65 | 65 | 65 | 65 | 65 | 65 | 65 |
| Interfacial bonding agent | 0.026 | 0.026 | 0.026 | 0.026 | 0.026 | 0.026 | 0.026 |
| SA9000 | 95 | 90 | 85 | 80 | 30 | 50 | |
| Silicon-containing polyphenylene ether resin | 5 | 10 | 15 | 20 | 100 | 70 | 50 |
| RICON 100 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| RICON 257 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| BMI | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| TAIC | 50 | 50 | 50 | 50 | 0 | 0 | 0 |
| TMAIC | 50 | 50 | 50 | ||||
| Flame retardant | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| Filler material | 125 | 125 | 125 | 125 | 125 | 125 | 125 |
| Initiator | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
TABLE 2
It should be noted that, in table 2:
1. glass transition temperature (Tg): the measurement was carried out by Differential Scanning Calorimetry (DSC) according to the DSC method defined by IPC-TM-6502.4.25.
2. Thermal stratification time T-288: the measurement was carried out according to the IPC-TM-6502.4.24.1 method.
3. Thermal cracking temperature (Td): the measurement was carried out according to the method defined in IPC-TM-6502.4.25.6.
4. Flame retardancy: measured according to the UL 94 vertical burning method.
5. PCT + wicking: the pressure cooker is steamed and boiled for 2 hours and then put into a tin furnace with the temperature of 288 ℃ to test whether the substrate has white spots, delamination and blistering.
The above results show that: according to the thermosetting resin composition with low cost and low dielectric property, the silicon-containing polyphenyl ether resin with higher heat resistance and flexibility is adopted, and the silicon-containing polyphenyl ether resin is matched with other components for use, so that the production cost can be obviously reduced, and the copper-clad plate with low cost and low dielectric property is obtained.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. The thermosetting resin composition with low dielectric property is characterized in that raw materials for preparing the thermosetting resin composition comprise the following components in parts by weight: 70-120 parts of vinyl-terminated polyphenyl ether resin, 1-30 parts of silicon-containing polyphenyl ether resin, 28-38 parts of bismaleimide resin, 3-16 parts of polystyrene-butadiene resin, 30-60 parts of cross-linking agent, 1-5 parts of initiator, 10-20 parts of flame retardant, 100-150 parts of filler, 0.01-0.5 part of interface bonding agent, 1100-120 parts of solvent and 250-100 parts of solvent.
2. The thermosetting resin composition according to claim 1, characterized in that: the chemical formula of the vinyl-terminated polyphenyl ether resin is as follows:
3. the thermosetting resin composition according to claim 1, characterized in that: the bismaleimide resin comprises any one of BMI-5100 and BMI-4000.
4. The thermosetting resin composition according to claim 1, characterized in that: the polystyrene-butadiene resin includes any one of Ricon 100 and Ricon 257.
5. The thermosetting resin composition according to claim 1, characterized in that: the cross-linking agent is any one or the combination of more than two of triallyl triisocyanate and methyl triallyl triisocyanate.
6. The thermosetting resin composition according to claim 1, characterized in that: the initiator comprises at least one of benzoyl peroxide, dicumyl peroxide, di-tert-butyl dicumyl peroxide and 2, 5-dimethyl-2, 5-bis (tert-butylperoxy) hexyne-3.
7. The thermosetting resin composition according to claim 1, characterized in that: the flame retardant comprises at least one of decabromodiphenylethane and ethylene bistetrabromophthalimide.
8. The thermosetting resin composition according to claim 1, characterized in that: the filler comprises at least one of magnesium hydroxide, aluminum hydroxide, spherical silica micropowder, soft silica micropowder and talcum powder.
9. The thermosetting resin composition according to claim 1, characterized in that: the interface bonding agent comprises at least one of silane, titanate and aluminate coupling agent.
10. The thermosetting resin composition according to claim 1, characterized in that: the solvent 1 and the solvent 2 respectively comprise at least one of cyclohexanone, butanone, acetone, toluene and xylene.
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| JP7209070B1 (en) | 2021-08-02 | 2023-01-19 | 南亞塑膠工業股▲分▼有限公司 | Low dielectric rubber resin material and low dielectric metal substrate |
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Application publication date: 20210622 |