CN113002109B - Thermoplastic laminating method, preforming method thereof, light-transmitting structural part and electronic equipment - Google Patents
Thermoplastic laminating method, preforming method thereof, light-transmitting structural part and electronic equipment Download PDFInfo
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- CN113002109B CN113002109B CN202110261338.2A CN202110261338A CN113002109B CN 113002109 B CN113002109 B CN 113002109B CN 202110261338 A CN202110261338 A CN 202110261338A CN 113002109 B CN113002109 B CN 113002109B
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- 238000000034 method Methods 0.000 title claims abstract description 153
- 229920001169 thermoplastic Polymers 0.000 title claims abstract description 82
- 239000004416 thermosoftening plastic Substances 0.000 title claims abstract description 82
- 238000010030 laminating Methods 0.000 title claims abstract description 30
- 238000010438 heat treatment Methods 0.000 claims abstract description 187
- 230000008569 process Effects 0.000 claims abstract description 70
- 238000007493 shaping process Methods 0.000 claims abstract description 44
- 238000003825 pressing Methods 0.000 claims abstract description 40
- 230000003287 optical effect Effects 0.000 claims abstract description 22
- 239000010408 film Substances 0.000 claims description 245
- 239000010409 thin film Substances 0.000 claims description 69
- 239000000758 substrate Substances 0.000 claims description 54
- 238000003475 lamination Methods 0.000 claims description 51
- 239000012790 adhesive layer Substances 0.000 claims description 16
- 239000002131 composite material Substances 0.000 claims description 16
- 239000010410 layer Substances 0.000 claims description 11
- 230000000295 complement effect Effects 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 3
- 230000001360 synchronised effect Effects 0.000 claims description 2
- 239000003054 catalyst Substances 0.000 claims 1
- 239000011541 reaction mixture Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 6
- 230000001070 adhesive effect Effects 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 230000035882 stress Effects 0.000 description 50
- 238000002203 pretreatment Methods 0.000 description 15
- 238000013461 design Methods 0.000 description 13
- 238000007781 pre-processing Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 230000002349 favourable effect Effects 0.000 description 6
- 238000003856 thermoforming Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000003190 viscoelastic substance Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000009757 thermoplastic moulding Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
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- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The application relates to a thermoplastic laminating preforming method, a thermoplastic laminating method, a light-transmitting structural member and electronic equipment; setting a pretreatment jig according to the attaching shape of the base body, wherein the pretreatment jig is provided with a preset end part, and the shape of the preset end part corresponds to the attaching shape; heating the film structure, and enabling the pretreatment jig to be close to the film structure to be in contact with the film structure, so that the film structure deforms according to the attaching shape; keeping the position of the pretreatment jig and heating the film structure, and applying pressure to the film structure for shaping the film structure so as to enable part of the structure of the film structure to be matched with the attaching shape; and continuously applying pressure within a preset time period after the shaping is finished, and keeping the position of the pretreatment jig and the heating film structure. The method has the advantages of simple process and high execution speed, is beneficial to eliminating stress and avoiding bubbles, does not need to adopt a heat treatment mode of workpiece heating, avoids the deformation of the laminated optical transparent adhesive, and does not need to be placed for a long time so as to improve the output efficiency.
Description
Technical Field
The application relates to the field of thermoplastic lamination of films, in particular to a preforming method for thermoplastic lamination, a thermoplastic lamination method, a light-transmitting structural member and electronic equipment.
Background
When a non-planar surface, such as a concave surface, is formed in a present thermoplastic molding process for a Film (Film), a stretching amount at the middle is large due to a low middle and a high periphery of a Substrate (Substrate), as shown in fig. 1, a holding structure 300 holds a Film structure 200 and maintains a position of the Film structure 200, the Film structure 200 includes a composite Film layer 210 and an optical adhesive layer 220, and a gap 110 is formed between a heating device 100 and the Film structure 200; the substrate 500 is disposed on the mounting base 400, and the thin-film structure 200 is located between the heating device 100 and the substrate 500. As shown in fig. 2, the heating apparatus 100 heats the film structure 200 in the heating direction 120 to bond the film structure 200 to the substrate 500, but the place with a large middle deformation has a large internal residual stress after bonding, and since bubbles are likely to be generated at the place with a large internal stress, there is a risk that the film structure is likely to fail even after passing a Reliability Test (Reliability Test).
Conventionally, there are two methods for relieving internal stress.
And (3) heat treatment: heating the workpiece to a certain temperature, preserving heat for a certain time, and cooling to recover the workpiece, thereby eliminating residual internal stress. The disadvantage is that the required temperature is too high, which may cause deformation of the applied Optically Clear Adhesive (OCA).
And (3) natural aging: and (5) placing the material under a natural condition for internal stress relief. The disadvantage is that it takes too long.
The polymer film is a viscoelastic material, which has viscosity and elasticity, and the basic characteristic of the viscoelastic material is that stress changes with temperature and time, so that stress relaxation occurs after stress deformation.
Stress relaxation, i.e., the viscoelastic material has no change in pressure under the condition of constant total strain as shown in fig. 3, i.e., the pressure-time relationship line 610 is flat, and the sub-chains in the material will slip each other, so that the internal stress gradually decreases until the internal stress is eliminated, and the corresponding stress-time relationship line 620 gradually decreases as shown in fig. 4. The reason is that when the temperature is high, the friction force in the material is small, and the stress is relaxed quickly; when the temperature is too low, the friction is large, and the stress relaxation is extremely slow. Therefore, the stress relaxation phenomenon is most remarkable only in the vicinity of the glass transition temperature (Tg) point.
Disclosure of Invention
In view of the above, it is desirable to provide a preforming method for thermoplastic bonding, a thermoplastic bonding method, a light-transmitting structural member, and an electronic device.
A method of preforming a thermoplastic fit, comprising the steps of: setting a pretreatment jig according to the attaching shape of the base body, wherein the pretreatment jig is provided with a preset end part, and the shape of the preset end part corresponds to the attaching shape; approaching the pretreatment jig to a thin film structure until the pretreatment jig is contacted with the thin film structure, so that the thin film structure deforms according to the attaching shape; keeping the position of the pretreatment jig and heating the film structure, and applying pressure to the film structure for shaping the film structure so as to enable part of the structure of the film structure to be matched with the attaching shape; and continuously applying pressure within a preset time period after the shaping is finished, keeping the position of the pretreatment jig, and heating the film structure. The preforming method for thermoplastic lamination has the advantages of simple process and high execution speed by shaping the film structure through the pretreatment jig, almost does not interfere with the follow-up thermoplastic lamination process, is favorable for eliminating stress and avoiding bubbles on the one hand, does not need to adopt a heat treatment mode of workpiece heating on the other hand, avoids the deformation of the laminated optical clear adhesive, and does not need to be placed for a long time on the other hand to improve the output efficiency.
In one embodiment, the conformable shape is a non-planar shape. In one embodiment, the conformable shape includes a convex surface, a combination of a convex surface and a flat surface, a combination of a convex surface and a concave surface, a combination of a concave surface and a flat surface, and a combination of a convex surface and a concave surface and a flat surface. In one embodiment, the preset time period is 20 seconds to 60 seconds. In one embodiment, the substrate comprises transparent glass and plastic. In one embodiment, the thin film structure includes a composite film layer and an optical adhesive layer, which are stacked, and the composite film layer is located between the optical adhesive layer and the pretreatment fixture. In one embodiment, the predetermined end portion has a shape corresponding to the conforming shape. In one embodiment, the preset end part is complementary to the fitting shape in shape, and a gap exists between the preset end part and the fitting shape in a fitting state. In one embodiment, when the pre-processing jig is brought into contact with the film structure, or before the pre-processing jig is brought into contact with the film structure, the pre-forming method for thermoplastic lamination further includes the steps of: heating the thin film structure; and/or when the pretreatment jig is close to the film structure to be in contact with the film structure, the thermoplastic laminating preforming method further comprises the following steps: and applying pressure to the film structure from one surface of the film structure, which is deviated from the pretreatment jig. In one embodiment, the thin film structure is heated by infrared heating. In one embodiment, the thin film structure is heated by infrared planar heating. In one embodiment, a projection of the shape to be fitted on a heating plane of the infrared plane heating manner has an area smaller than that of the heating plane, or is covered by the heating plane.
In one embodiment, a thermoplastic coating method comprises the following steps: setting a pretreatment jig according to the attaching shape of the base body, wherein the pretreatment jig is provided with a preset end part, and the shape of the preset end part corresponds to the attaching shape; approaching the pretreatment jig to a thin film structure until the pretreatment jig is contacted with the thin film structure, so that the thin film structure deforms according to the attaching shape; keeping the position of the pretreatment jig and heating the film structure, and applying pressure to the film structure for shaping the film structure so as to enable part of the structure of the film structure to be matched with the attaching shape; continuously applying pressure within a preset time period after the shaping is finished, keeping the position of the pretreatment jig and heating the film structure; stopping pressurizing and heating, and removing the pretreatment jig; and carrying out a bonding process by adopting the substrate.
In one embodiment, the light-transmitting structural member is manufactured by a thermoplastic laminating method; the thermoplastic laminating method comprises the following steps: setting a pretreatment jig according to the attaching shape of the base body, wherein the pretreatment jig is provided with a preset end part, and the shape of the preset end part corresponds to the attaching shape; approaching the pretreatment jig to a thin film structure until the pretreatment jig is contacted with the thin film structure, so that the thin film structure deforms according to the attaching shape; keeping the position of the pretreatment jig and heating the film structure, and applying pressure to the film structure for shaping the film structure so as to enable part of the structure of the film structure to be matched with the attaching shape; continuously applying pressure within a preset time period after the shaping is finished, keeping the position of the pretreatment jig and heating the film structure; stopping pressurizing and heating, and removing the pretreatment jig; and carrying out a bonding process by adopting the substrate.
In one embodiment, the electronic device is provided with a light-transmitting structural part, wherein the light-transmitting structural part is manufactured by adopting a thermoplastic laminating method; the thermoplastic laminating method comprises the following steps: setting a pretreatment jig according to the attaching shape of the base body, wherein the pretreatment jig is provided with a preset end part, and the shape of the preset end part corresponds to the attaching shape; approaching the pretreatment jig to a thin film structure until the pretreatment jig is contacted with the thin film structure, so that the thin film structure deforms according to the attaching shape; keeping the position of the pretreatment jig and heating the film structure, and applying pressure to the film structure for shaping the film structure so as to enable part of the structure of the film structure to be matched with the attaching shape; continuously applying pressure within a preset time period after the shaping is finished, keeping the position of the pretreatment jig and heating the film structure; stopping pressurizing and heating, and removing the pretreatment jig; and carrying out a bonding process by adopting the substrate.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of a conventional film thermoforming process. FIG. 2 is a schematic view of the bonding process of FIG. 1. FIG. 3 is a schematic pressure-time relationship of a conventional film thermoforming process. FIG. 4 is a graph illustrating stress versus time for the film thermoforming process shown in FIG. 3. FIG. 5 is a schematic flow chart diagram illustrating an embodiment of a preforming method for thermoplastic lamination according to the present application. FIG. 6 is a schematic diagram illustrating a comparison between the shapes of the pre-processing jig and the substrate according to another embodiment of the pre-forming method for thermoplastic lamination of the present application. FIG. 7 is a schematic diagram illustrating a comparison between the shapes of the pre-processing jig and the substrate according to another embodiment of the pre-forming method for thermoplastic lamination of the present application. FIG. 8 is a schematic diagram illustrating a comparison between the shapes of the pre-processing jig and the substrate according to another embodiment of the pre-forming method for thermoplastic lamination of the present application. Fig. 9, fig. 10 and fig. 11 are partial process schematic views of another embodiment of the preforming method for thermoplastic lamination according to the present application. FIG. 12 is a schematic view of a portion of a thermoplastic laminating method according to an embodiment of the present application. FIG. 13 is a schematic illustration comparing the shape of a substrate and a film structure after molding according to another embodiment of the present invention. FIG. 14 is a schematic diagram showing the comparison between the shape of the base and the film structure after molding according to another embodiment of the method for preforming thermoplastic lamination according to the present invention. FIG. 15 is a graph illustrating the original in-process stress curve of a conventional film thermoforming process. FIG. 16 is a stress curve diagram of an embodiment of the thermoplastic bonding method of the present application. Fig. 17, fig. 18 and fig. 19 are partial process schematic views of another embodiment of the preforming method of thermoplastic lamination according to the present invention. Fig. 20 and 21 are partial process diagrams of another embodiment of the thermoplastic lamination method according to the present application, respectively.
Reference numerals are as follows: the device comprises a heating device 100, a film structure 200, a clamping structure 300, a mounting seat 400, a base 500, a pretreatment fixture 700, a driving device 800 and an infrared heating device 900; the gap 110, the heating direction 120, the composite film layer 210, the optical adhesive layer 220, the reserved gap 230, the convex portion 240, and the concave portion 250; a pressure-time relationship line 610, a stress-time relationship line 620, a recess bonding process stage 630, a stress relaxation stage 640, a pre-forming process stage 650; body 710, preset end 720, groove 730, mounting structure 810, moving structure 820, chamber 830, and space 910.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The use of the terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like in the description of the present application is for purposes of illustration only and is not intended to represent the only embodiment.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact via an intermediate. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or may simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature. Unless defined otherwise, all technical and scientific terms used in the specification of the present application have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the description of the present application, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Before non-flat surfaces such as concave surfaces are attached, a Preforming process is added, a convex surface jig is used for forming a thin film, a pre-processing (pre-processing) jig is ejected out by using a telescopic mechanism, the distance between the pre-processing jig and the thin film structure is shortened, and then the stretching amount of the thin film structure can be reduced when pressure is applied. The film structure is stamped into a shape similar to a concave substrate, and then a concave bonding process is carried out, namely, the film is stamped into a shape similar to the substrate by a convex jig, so that the stretching amount of subsequent concave bonding is reduced. And for convex surface bonding and vice versa, a preforming process can be added before the convex surface bonding, the concave surface jig is used for carrying out the forming process of the film, the film is stamped into the shape similar to the concave surface substrate, and then the convex surface bonding process is carried out. The embodiments of the present application are suitable for non-planar thermoplastic bonding to eliminate stress effects, and can be used for concave or convex thermoplastic molding processes.
Specifically, in one embodiment of the present application, a method of preforming thermoplastic conforming, as shown in fig. 5, includes the steps of: setting a pretreatment jig according to the attaching shape of the base body, wherein the pretreatment jig is provided with a preset end part, and the shape of the preset end part corresponds to the attaching shape; approaching the pretreatment jig to the thin film structure until the pretreatment jig is contacted with the thin film structure, so that the thin film structure deforms according to the attaching shape; keeping the position of the pretreatment jig and heating the film structure, and applying pressure to the film structure for shaping the film structure so as to enable part of the structure to be matched with the attaching shape; and continuously applying pressure within a preset time period after the shaping is finished, and keeping the position of the pretreatment jig and the heating film structure. The preforming method for thermoplastic lamination has the advantages of simple process and high execution speed by shaping the film structure through the pretreatment jig, almost does not interfere with the follow-up thermoplastic lamination process, is favorable for eliminating stress and avoiding bubbles on the one hand, does not need to adopt a heat treatment mode of workpiece heating on the other hand, avoids the deformation of the laminated optical clear adhesive, and does not need to be placed for a long time on the other hand to improve the output efficiency.
In one embodiment, a method for preforming thermoplastic lamination includes some or all of the steps of the following embodiments; namely, the preforming method of thermoplastic lamination includes some or all of the following technical features. Further, in one embodiment, the film structure deforms according to the fitting shape and forms a non-planar shape; in various embodiments, the conformable shape is a non-planar shape, i.e., the side of the substrate that conforms to the film structure is non-planar, resulting in non-uniform amounts of stretch in the film structure. Considering that the glass transition temperature point of the polymer film is above 100 ℃, if the deformed film can be placed in the glass transition temperature point environment for a period of time, the stress relaxation phenomenon can occur more obviously, and the value of the internal stress of the material can be rapidly reduced. Because the overall shape of the film is similar to that of the substrate after the pre-forming process, the distance between the film and the substrate is very close. After the thermoplastic lamination preforming method is finished, a certain time difference exists between the steps of adopting the base body to perform the lamination process, so that the stress can be further eliminated; therefore, the stretching amount in the bonding process is less than that in the original process, and the residual stress value generated inside is lower than that in the original process, thereby being beneficial to improving the product yield and ensuring the design life of the product.
In order to enable the film structure processed by the pre-forming method to adapt to a subsequent thermoplastic laminating process and reduce the placing time for relieving stress, in each embodiment, a pre-processing jig is arranged according to the laminating shape of the base body, the pre-processing jig is provided with a preset end part, and the shape of the preset end part corresponds to the laminating shape; the pre-forming process is added before the formal bonding process, and the shape of the preset end part of the jig is opposite to the bonding shape of the formally bonded substrate. In various embodiments, the shape of the predetermined end portion corresponds to the shape of the engaging portion, that is, the predetermined end portion and the engaging portion complement each other to form a complementary shape, which can be completely engaged without any gap therebetween, or can have a partial gap therebetween, and the outer shape substantially forms an integral shape without any gap when completely engaged, and the integral shape has no overlapping portion when the partial gap exists. Further, in one embodiment, the overall shape has no overlapping part and has gaps, and the total area of the gaps is less than 2% to 5% of the area of the overall shape, so that partial adjustment positions can be formed, and the thin film structure is allowed to have a certain deformation space in the subsequent process. In one embodiment, the conformable shape is concave and the film structure is convex, or vice versa; in one embodiment, as shown in fig. 6, the predetermined end portion 720 has a shape matching the shape of the substrate 400, i.e., there is no gap or gap between the predetermined end portion and the substrate. Alternatively, in one embodiment, as shown in fig. 7, the shape of the preset end portion 720 is complementary to the fitting shape of the base 400 and a gap exists between the two in the fitting state.
In order to achieve the light transmitting function, in one embodiment, the substrate comprises transparent glass and plastic. In one embodiment, the substrate comprises glass in the shape of a convex lens or a concave lens. Such a design is advantageous for achieving a light transmissive structure suitable for optical applications.
To accommodate substrates of various surfaces, in one embodiment, the conformable shape includes a part spherical surface, a part ellipsoidal surface, and combinations thereof; in one embodiment, the fitting shape further comprises a partial spherical surface with the same or different specification, a partial ellipsoid with the same or different specification and a combination shape thereof; in one embodiment, the conformable shape includes a convex surface, a combination of a convex surface and a flat surface, a combination of a convex surface and a concave surface, a combination of a concave surface and a flat surface, i.e., the conformable shape includes a convex surface, a concave surface and a combination thereof, and further includes a combination of a flat surface and a convex surface and a concave surface. By the design, after the film structure is processed by the pre-forming method, the shape of the substrate, namely the fitting shape, can be well matched, the influence of stress is well eliminated, the product structure is enhanced, and the design life of the product is prolonged or ensured.
In order to cooperate with the subsequent shaping process, in each embodiment, the pretreatment jig is close to the film structure to be in contact with the film structure, so that the film structure deforms according to the fitting shape; in one embodiment, the method for preforming thermoplastic lamination when bringing the pretreatment fixture into contact with the film structure while the pretreatment fixture is brought into proximity with the film structure further comprises the steps of: heating the thin film structure; alternatively, in one embodiment, the method for preforming thermoplastic lamination before bringing the pre-treatment tool into contact with the film structure comprises the steps of: heating the thin film structure; i.e. heating the film structure may take place while the pre-treatment tool is in contact with the film structure or before it is in contact with the film structure. In one embodiment, the film structure is made of polymer material, and one surface of the film structure is made of adhesive material. In one embodiment, the film structure includes a composite film layer and an optical adhesive layer, which are stacked, and the composite film layer is located between the optical adhesive layer and the pretreatment fixture. Further, in one embodiment, the thin film structure is heated to be heated before contacting the pre-treatment tool; or the part of the film structure contacting with the pretreatment fixture is heated before contacting with the pretreatment fixture. Such design, in whole process, the position of film structure is unchangeable, and the position of preliminary treatment tool changes, and the film structure receives certain pressure after contacting the preliminary treatment tool, makes it take place to deform, and the purpose of deformation tends to the laminating shape.
In order to enhance the shaping effectiveness, in one embodiment, the preforming method for thermoplastic lamination includes the following steps when the pretreatment fixture is close to the film structure and is contacted with the film structure: the pressing of the film structure and the pre-treatment tool can also be understood as the pressing of the film structure from the side of the film structure facing away from the pre-treatment tool to the film structure. The specific pressure applied can be set according to the bonding process or adjusted according to actual operation.
To avoid contact of the heating device with the thin-film structure, further, in one embodiment, the heating mode for heating the thin-film structure is a non-contact heating mode; in one embodiment, the heating of the thin film structure is achieved by infrared heating or other non-contact heaters. In one embodiment, the film structure is heated by infrared heating. In one embodiment, the thin film structure is heated by infrared planar heating. In one embodiment, the projection of the fitting shape in the heating plane of the infrared plane heating mode is smaller than the area of the heating plane or covered by the heating plane. Further, in one embodiment, in the infrared planar heating mode, the infrared heating device may present a heating plane as a whole with respect to the thin film structure, and in one embodiment, the heating plane may have an undulating structure, i.e., macroscopically a plane, and microscopically a non-planar shape, which only needs to present a heating plane as a whole. In order to achieve more accurate uniform heating, further, in one embodiment, the heating surface of the infrared heating device in the pre-forming method for thermoplastic lamination is configured to be different from the heating surface of the infrared heating device in the subsequent thermoplastic lamination process, that is, the heating surface of the infrared heating device in the pre-forming method for thermoplastic lamination is configured to be different from the heating surface of the infrared heating device used in the lamination process of the thermoplastic lamination method. Further, in one embodiment, the heating surface of the infrared heating device in the pre-forming method of thermoplastic lamination and the heating surface of the infrared heating device used in the lamination process of the thermoplastic lamination method complement each other in shape, that is, the two heating surfaces form a complementary shape. In one embodiment, for the preforming method of thermoplastic lamination, the heating surface of the infrared heating device is arranged according to the lamination shape of the base body, and the heating surface of the infrared heating device is arranged in the same or similar way to the lamination shape, that is, the heating surface of the infrared heating device corresponds to the shape of the preset end part and is matched with the lamination shape, so that when the film structure is heated to deform according to the lamination shape and the film structure is shaped, the deformation position of the film structure is heated in a balanced and non-contact manner, the shaping of the film structure is effectively controlled, and uneven heating is avoided. Correspondingly, for the thermoplastic laminating method, in the step of adopting the base body to carry out the laminating process, namely, the heating surface of the infrared heating equipment adopted by the laminating process is the same as or similar to the shape of the preset end part, so that the accurate heating control effect on the film structure and the base body is realized during the thermoplastic laminating. The design has the advantages of simple process and quick execution, is favorable for providing uniform non-contact heating, and ensures the structural stability of the film structure or the inner film layer thereof.
In order to realize effective shaping of the film structure, for the preforming method of thermoplastic lamination, further, in one embodiment, the heating surface of the infrared heating device is changed according to the shape of the film structure, and when the film structure is not deformed, the heating surface of the infrared heating device is in the same plane as the film structure; when the film structure deforms, the heating surface of the infrared heating equipment deforms accordingly, so that the heating surface of the infrared heating equipment keeps consistent distances with the film structure, namely the heating surface of the infrared heating equipment and the film structure keep synchronous deformation in the heating process; the design is favorable for realizing balanced and non-contact heating for the deformation position of the film structure, and the accurate heating mode is favorable for controlling the uniformity of the stress at each position when the film structure is deformed, so that the generation of an abrupt change area is avoided, and the design service life of a product is ensured.
In order to realize effective shaping of the film structure, in each embodiment, the position of the pretreatment jig and the heating of the film structure are kept, and pressure is applied to the film structure for shaping the film structure so as to enable part of the structure of the film structure to be matched with the fitting shape; further, in one of the embodiments, the film structure is pressed from a side of the film structure facing away from the pre-treatment tool. The film structure is shaped by heating and pressing, so that the shape of the film structure is changed at the position contacting with the pretreatment jig, and the shape change aims to be matched with the attaching shape so that the film structure and the attaching shape of the film attaching position of the substrate form the same or similar shape, namely the attaching shape is positioned at the film attaching position of the substrate. In one embodiment, macroscopically, a complete fit, an approximately complete fit, or an approximately fit may be understood, and microscopically, some gaps may be present. The design is beneficial to simply and quickly shaping the film structure through the pretreatment jig, almost has no interference on the subsequent thermoplastic lamination process, effectively eliminates stress, and greatly avoids the probability of generating current or later bubbles.
In order to eliminate stress and avoid influencing subsequent processes, in each embodiment, after the shaping is completed, the pressure is continuously applied within a preset time period, and the position of the pretreatment jig and the film structure are kept heated. In one embodiment, the predetermined time period is 20 seconds to 60 seconds. Namely, after the shaping is finished, the pressing and heating are continued for 20 to 60 seconds, and the position of the pretreatment jig is kept unchanged in the process. Further, in one embodiment, the predetermined time period is 25 seconds to 36 seconds. In one embodiment, the predetermined time period is 28 seconds, 30 seconds, 33 seconds, or 35 seconds. In one embodiment, pressure is applied to shape the film material, and after shaping, the film material is held at a temperature for 30 seconds, and residual stress is released and then the film material is cooled and decompressed. The rest of the embodiments are analogized and are not described in detail. By the design, the shaping and stress relief of the film structure can be realized rapidly in the process of the pre-forming method, a heat treatment mode of workpiece heating is not needed, the attached optical transparent adhesive is prevented from deforming, and the film structure does not need to be placed for a long time in the subsequent thermoplastic attaching process so as to improve the output efficiency.
In one embodiment, a thermoplastic conforming method includes the steps of: setting a pretreatment jig according to the attaching shape of the base body, wherein the pretreatment jig is provided with a preset end part, and the shape of the preset end part corresponds to the attaching shape; approaching the pretreatment jig to the thin film structure until the pretreatment jig is contacted with the thin film structure, so that the thin film structure deforms according to the attaching shape; keeping the position of the pretreatment jig and heating the film structure, and applying pressure to the film structure for shaping the film structure so as to enable part of the structure to be matched with the attaching shape; continuously applying pressure within a preset time period after the shaping is finished, and keeping the position of the pretreatment jig and the heating film structure; stopping applying pressure and heating, and removing the pretreatment jig; and carrying out a bonding process by adopting the substrate. In one embodiment, the thermoplastic coating method comprises any of the embodiments of the thermoplastic coating preforming method; the bonding process can be realized by referring to a traditional mode, and stress relieving measures such as heat treatment or long-time placement are not needed, so that the bonding process has the advantages of simple process and quick execution on the premise of ensuring the design life of a product.
In one embodiment, as shown in fig. 8, in the pre-forming method of thermoplastic lamination, the shape of the substrate 500 on the mounting base 400 at the position where the thermoplastic lamination is performed, i.e. the lamination film structure, i.e. the lamination shape, corresponds to the shape of the preset end of the pre-processing jig 700, and the two shapes complement each other to form an integral shape; referring to fig. 9, the attaching shape of the substrate 500 corresponds to the shape of the predetermined end portion 720 of the pre-treatment fixture 700. With such a design, after a thermoplastic laminating preforming method is adopted, a film structure matched with the laminating shape can be obtained, and partial stress is eliminated in advance, so that a film structure corresponding to the shape of the preset end of the pretreatment jig 700 is obtained. In this embodiment, the predetermined end 720 is convex to correspond to the concave shape of the substrate, so that after shaping the film structure, the same concave shape of the film structure can be formed to match the shape of the substrate.
In one embodiment, as shown in fig. 8, in the preforming method of thermoplastic lamination, the pre-processing jig 700 is mounted on the driving device 800, the driving device 800 includes a mounting structure 810 and a moving structure 820, and the driving device 800 has a cavity 830 formed in the mounting structure 810, the moving structure 820 is movably disposed on the mounting structure 810 and is partially located in the cavity 830, and the mounting structure 810 is used for being mounted outside; the pretreatment fixture 700 is installed at a position outside the installation structure 810 of the moving structure 820, and the moving structure 820 is used for driving the pretreatment fixture 700 to move relative to the installation structure 810 so as to adjust the position of the pretreatment fixture 700. In order to facilitate flexible use according to different fitting shapes, further, in one embodiment, the pretreatment fixture is detachably mounted on the driving device, so as to facilitate maintenance or replacement, particularly, the pretreatment fixture is replaced according to different fitting shapes of different substrates, thereby increasing the applicability.
In one embodiment, as shown in fig. 9, the film structure includes a composite film 210 and an optical adhesive layer 220 stacked on each other, the pre-treatment fixture 700 includes a body 710 and a predetermined end portion 720 mounted on the body 710, the body 710 is mounted on the moving structure 820 at a position outside the mounting structure 810, and the pre-treatment fixture 700 is disposed adjacent to the composite film 210 when the film structure is heated or before the film structure is heated.
In one embodiment, as shown in fig. 10, the relative distance between the preset end 720 of the pre-treatment fixture 700 and the film structure 200 is adjusted by the moving structure 820, so that the pre-treatment fixture 700 approaches the film structure 200 to contact with the composite film 210 of the film structure 200, and the composite film 210 and the optical adhesive layer 220 of the film structure 200 are deformed according to the fitting shape to form the convex portion 240 matching with the fitting shape; it can be understood that the deformation forms the convex portion 240 relative to the side far away from the pretreatment fixture, and the deformation forms the concave portion relative to the side contacting with the pretreatment fixture, but in any case, the shape of the convex portion 240 or the concave portion matches with the attaching shape, so that the film structure or a part of the film structure can be formed into a shape the same as or similar to the attaching shape of the film attaching position of the substrate before the attaching process, so as to avoid the deformation of the film structure during the attaching process, or reduce the deformation of the film structure during the attaching process, and avoid or reduce the stress problem caused thereby; at this point or prior to, the film structure may be heated; at this time, pressure may be applied to the film structure 200 from a side of the film structure 200 away from the pretreatment fixture 700, that is, a side of the optical adhesive layer 220.
In one embodiment, as shown in fig. 11, after the composite film 210 and the optical adhesive layer 220 of the film structure 200 are deformed together, the position of the pre-treatment jig 700 is maintained, the predetermined end 720 of the pre-treatment jig is continuously contacted with the composite film 210 of the film structure 200, the film structure 200 is heated or the heated film structure 200 is maintained, and the film structure 200 is shaped to match a part of the structure with the fitting shape. In this embodiment, the infrared heating device 900 is used to heat the film structure 200 in an infrared plane heating manner, the infrared heating device 900 heats the film structure 200 from one side of the optical adhesive layer 220 in a non-contact heating manner, and a space 910 is formed between the infrared heating device 900 and the optical adhesive layer 220. After the shaping is completed, the pressure is continuously applied and the position of the pre-treatment jig 700 and the heating of the film structure 200 are maintained for 20 to 60 seconds. In one embodiment, after the pre-forming and shaping are completed, the temperature and the pressure are maintained for more than 30 seconds to eliminate the internal stress of the film structure. Therefore, due to the characteristics of the sticky elastomer material of the film, after the convex surface is formed, the residual stress in the material of the film structure can be released firstly, so that the internal stress generated by the attachment deformation of the concave surface is reduced in the subsequent thermoplastic attaching process, and the optical cement is only needed to be arranged on the surface of the film structure, which is not contacted with the pretreatment jig, during the pre-forming.
In one embodiment, as shown in fig. 12, the pressing and heating are stopped, the pre-treatment tool is removed, and then the substrate 500 is used for a bonding process, which refers to a conventional thermoplastic bonding method, and it can be seen by contrast that the film structure 200 has a shape matching the bonding shape of the substrate 500 before the bonding process. In one embodiment, the shape of the substrate and the shaped film structure is matched as shown in fig. 13, before the lamination process, i.e. after the pre-forming method of thermoplastic lamination, the shaped film structure 200 has a shape substantially the same as the position of the substrate 500, and a gap 230 is reserved between the two, i.e. the partial structure of the shaped film structure 200 matches the shape of the substrate 500. Alternatively, in one embodiment, the shape of the base and the shaped film structure is the same as that of the base 500, and the shaped film structure 200 has the same shape as that of the base 500 before the lamination process, and the two are completely matched without a gap therebetween, as shown in fig. 14.
Further, in one embodiment, the direction of pressure application is perpendicular to the film structure prior to shaping. Further, in one embodiment, the pressing direction is the same as the heating direction. As shown in fig. 11, the pressing direction is close to the optical adhesive layer 220 of the film structure 200 and is perpendicular to the film structure 200 before molding; as shown in fig. 12, the pressing direction is close to the composite film layer 210 of the film structure 200 and is perpendicular to the film structure 200 before shaping; i.e. the pressing direction coincides with the heating direction 120. Compared to the embodiment shown in fig. 12, in which the original in-process stress curve of the conventional film thermoforming process is shown in fig. 15 corresponding to the shape of the substrate 500 of the embodiment shown in fig. 12, the stress-time relation line 620 can be divided into a concave surface fitting process stage 630 and a stress relaxation stage 640 according to the time progress of the fitting process, and the stress relaxation stage 640 is slowly decreased, so that the time required for stress relaxation is long, i.e., the substrate needs to be left for a long time to relieve the internal stress. By adopting the thermoplastic bonding method of the present application, the stress curve is as shown in fig. 16, due to the effect of the thermoplastic bonding preforming method, most of the stress is eliminated in the preforming process stage 650 by the stress-time relation line 620, and although the concave bonding process stage 630 still causes the partial rise of the stress, the rise is relatively small, so that the stress relaxation stage 640 can be quickly completed, and the corresponding process of reducing the stress relaxation stage 640 can be considered, that is, the placing time is saved, and the yield efficiency is improved. This is because the overall shape of the film structure is similar to that of the substrate after the preforming process, i.e., the preforming process, and the distance between the film and the substrate is also very similar. Therefore, the amount of stretching during the bonding process is less than that in the original process, and the residual stress value generated inside is lower than that in the original process.
In one embodiment, as shown in fig. 17, unlike the embodiment shown in fig. 9, 10 and 11, a groove 730 is formed in the shape of the predetermined end 720 of the pretreatment fixture 700 corresponding to the protruding shape of the base; then, the pretreatment jig 700 is brought close to the film structure 200 to be in contact with the composite film layer 210 of the film structure 200 as shown in fig. 18, so that the film structure 200 deforms according to the fitting shape as shown in fig. 19, then the position of the pretreatment jig 700 is maintained and the film structure 200 is heated, and pressure is applied to the film structure 200 from one surface of the optical adhesive layer 220, namely the film structure 200 is pressed to the film structure 200 from the direction deviating from the pretreatment jig 700, so as to shape the film structure 200 to enable part of the structure of the film structure 200 to be matched with the fitting shape; then, the pressing and heating are stopped, the pre-processing jig 700 is removed and the substrate 500 arranged on the mounting seat 400 is replaced as shown in fig. 20, and at this time, the thin-film structure 200 is formed with the concave part 250 matched with the fitting shape of the substrate due to the pre-forming method; as shown in fig. 21, the infrared heating device 900 is replaced or the position of the infrared heating device 900 is adjusted, and then the mount 400 and the substrate 500 are adjusted, and the film structure 200 is heated in the heating direction 120 by using the infrared heating device 900, so that the film structure 200 is attached to the substrate 500. In this embodiment, the base 500 has a convex shape in the fitting shape, and the predetermined end portion 720 has a concave shape to correspond to the fitting shape of the base.
In one embodiment, the light-transmitting structural member is manufactured by a thermoplastic laminating method; the thermoplastic laminating method comprises the following steps: setting a pretreatment jig according to the attaching shape of the base body, wherein the pretreatment jig is provided with a preset end part, and the shape of the preset end part corresponds to the attaching shape; approaching the pretreatment jig to the thin film structure until the pretreatment jig is contacted with the thin film structure, so that the thin film structure deforms according to the attaching shape; keeping the position of the pretreatment jig and heating the film structure, and applying pressure to the film structure for shaping the film structure so as to enable part of the structure of the film structure to be matched with the attaching shape; continuously applying pressure within a preset time period after the shaping is finished, and keeping the position of the pretreatment jig and the heating film structure; stopping pressurizing and heating, and removing the pretreatment jig; and carrying out a bonding process by adopting the substrate. The light-transmitting structural part comprises but is not limited to a lens, a transmission structure, a light sensor, a light sensing device, a photovoltaic cell, a fingerprint identification component and the like, and the design is favorable for avoiding the generation of bubbles caused by the stress problem of a product, so that the product is badly returned or the normal service life of the product is influenced.
In one embodiment, the electronic device is provided with a light-transmitting structural component, wherein the light-transmitting structural component is manufactured by adopting a thermoplastic laminating method; the thermoplastic laminating method comprises the following steps: setting a pretreatment jig according to the attaching shape of the base body, wherein the pretreatment jig is provided with a preset end part, and the shape of the preset end part corresponds to the attaching shape; approaching the pretreatment jig to the thin film structure until the pretreatment jig is contacted with the thin film structure, so that the thin film structure deforms according to the attaching shape; keeping the position of the pretreatment jig and heating the film structure, and applying pressure to the film structure for shaping the film structure so as to enable part of the structure to be matched with the attaching shape; continuously applying pressure within a preset time period after the shaping is finished, and keeping the position of the pretreatment jig and the heating film structure; stopping applying pressure and heating, and removing the pretreatment jig; and carrying out a bonding process by adopting the substrate. In various embodiments, the electronic device comprises a terminal, such as a mobile terminal; the automobile with the light-transmitting structural member is characterized by also comprising an automobile, an electric vehicle, display equipment and the like which adopt the light-transmitting structural member.
Other embodiments of the present application include a preforming method, a thermoplastic bonding method, a light-transmitting structural member, and an electronic device, in which technical features of the above embodiments are combined with each other to form a thermoplastic bonding that can be performed.
All possible combinations of the technical features in the above embodiments may not be described for the sake of brevity, but should be considered as being within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features. The above examples only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.
Claims (12)
1. A method of preforming for thermoplastic lamination, comprising the steps of:
setting a pretreatment jig according to the attaching shape of the base body, wherein the pretreatment jig is provided with a preset end part, and the shape of the preset end part corresponds to the attaching shape;
approaching the pretreatment jig to a thin film structure until the pretreatment jig is contacted with the thin film structure, so that the thin film structure deforms according to the attaching shape;
keeping the position of the pretreatment jig and heating the film structure, and applying pressure to the film structure for shaping the film structure so as to enable part of the structure of the film structure to be matched with the attaching shape;
continuously applying pressure within a preset time period after the shaping is finished, keeping the position of the pretreatment jig, and heating the film structure;
the heating surface of the infrared heating equipment and the film structure are synchronously deformed in the heating process, the heating surface of the infrared heating equipment is changed according to the shape of the film structure, and when the film structure is not deformed, the heating surface of the infrared heating equipment is in the same plane as the film structure; when the film structure deforms, the heating surface of the infrared heating equipment deforms accordingly, so that the distance between each part of the heating surface of the infrared heating equipment and each part of the film structure is kept consistent.
2. Preforming method according to claim 1, characterized in that the conforming shape is a non-planar shape.
3. The method of preforming thermoplastic fit according to claim 2, wherein the fit shapes include convex, a combination of convex and flat, a combination of convex and concave, a combination of concave and flat, a combination of convex and concave and flat.
4. The method of preforming thermoplastic fit according to claim 1, wherein the preset time period is 20 to 60 seconds; or the substrate comprises transparent glass and plastic; or the film structure comprises a composite film layer and an optical adhesive layer which are stacked, and the composite film layer is positioned between the optical adhesive layer and the pretreatment jig.
5. Preforming method for thermoplastic lamination according to claim 1, characterised in that the predetermined end portion has a shape that corresponds to the shape of the lamination; or the shape of the preset end part is complementary to the fitting shape, and a gap exists between the preset end part and the fitting shape in the fitting state.
6. The method of preforming thermoplastic lamination according to claim 1, wherein the method of preforming thermoplastic lamination further comprises the step of bringing the preliminary treatment tool into contact with the film structure while bringing the preliminary treatment tool into contact with the film structure or before bringing the preliminary treatment tool into contact with the film structure: heating the thin film structure; and/or the presence of a catalyst in the reaction mixture,
when the pretreatment jig is close to the film structure to be in contact with the film structure, the thermoplastic laminating preforming method further comprises the following steps: and pressing the thin film structure from one surface of the thin film structure, which is deviated from the pretreatment jig.
7. Preforming method according to any of the claims 1 to 6, characterized in that the film structure is heated with infrared heating.
8. Preforming method according to claim 7, characterized in that the film structure is heated by means of infrared planar heating.
9. Preforming method according to claim 8, characterized in that the conforming shape is projected in a heating plane of the infrared planar heating pattern with an area smaller than the area of the heating plane or covered by the heating plane.
10. A thermoplastic laminating method is characterized by comprising the following steps:
setting a pretreatment jig according to the attaching shape of the base body, wherein the pretreatment jig is provided with a preset end part, and the shape of the preset end part corresponds to the attaching shape;
approaching the pretreatment jig to a thin film structure until the pretreatment jig is contacted with the thin film structure, so that the thin film structure deforms according to the attaching shape;
keeping the position of the pretreatment jig, heating the thin film structure, and applying pressure to the thin film structure for shaping the thin film structure so as to enable part of the structure of the thin film structure to be matched with the fit shape;
continuously applying pressure within a preset time period after the shaping is finished, keeping the position of the pretreatment jig, and heating the film structure;
stopping pressurizing and heating, and removing the pretreatment jig;
carrying out a bonding process by adopting the substrate;
the heating surface of the infrared heating equipment and the film structure are synchronously deformed in the heating process, the heating surface of the infrared heating equipment is changed according to the shape of the film structure, and when the film structure is not deformed, the heating surface of the infrared heating equipment is in the same plane as the film structure; when the film structure deforms, the heating surface of the infrared heating equipment deforms accordingly, so that the distances between the heating surface of the infrared heating equipment and the film structure are kept consistent.
11. A light-transmitting structural member is characterized by being manufactured by a thermoplastic laminating method; the thermoplastic laminating method comprises the following steps:
setting a pretreatment jig according to the attaching shape of the base body, wherein the pretreatment jig is provided with a preset end part, and the shape of the preset end part corresponds to the attaching shape;
approaching the pretreatment jig to a thin film structure until the pretreatment jig is contacted with the thin film structure, so that the thin film structure deforms according to the attaching shape;
keeping the position of the pretreatment jig, heating the thin film structure, and applying pressure to the thin film structure for shaping the thin film structure so as to enable part of the structure of the thin film structure to be matched with the fit shape;
continuously applying pressure within a preset time period after the shaping is finished, keeping the position of the pretreatment jig, and heating the film structure;
stopping pressurizing and heating, and removing the pretreatment jig;
adopting the substrate to carry out a bonding process;
the heating surface of the infrared heating equipment and the film structure keep synchronous deformation in the heating process, the heating surface of the infrared heating equipment changes according to the shape of the film structure, and the heating surface of the infrared heating equipment is the same plane as the film structure when the film structure is not deformed; when the film structure deforms, the heating surface of the infrared heating equipment deforms accordingly, so that the distance between each part of the heating surface of the infrared heating equipment and each part of the film structure is kept consistent.
12. The electronic equipment is characterized by comprising a light-transmitting structural part, wherein the light-transmitting structural part is manufactured by adopting a thermoplastic laminating method; the thermoplastic laminating method comprises the following steps:
setting a pretreatment jig according to the attaching shape of the base body, wherein the pretreatment jig is provided with a preset end part, and the shape of the preset end part corresponds to the attaching shape;
approaching the pretreatment jig to a thin film structure until the pretreatment jig is contacted with the thin film structure, so that the thin film structure deforms according to the attaching shape;
keeping the position of the pretreatment jig, heating the thin film structure, and applying pressure to the thin film structure for shaping the thin film structure so as to enable part of the structure of the thin film structure to be matched with the fit shape;
continuously applying pressure within a preset time period after the shaping is finished, keeping the position of the pretreatment jig, and heating the film structure;
stopping pressurizing and heating, and removing the pretreatment jig;
carrying out a bonding process by adopting the substrate;
the heating surface of the infrared heating equipment and the film structure are synchronously deformed in the heating process, the heating surface of the infrared heating equipment is changed according to the shape of the film structure, and when the film structure is not deformed, the heating surface of the infrared heating equipment is in the same plane as the film structure; when the film structure deforms, the heating surface of the infrared heating equipment deforms accordingly, so that the distances between the heating surface of the infrared heating equipment and the film structure are kept consistent.
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| CN109571927A (en) * | 2018-11-30 | 2019-04-05 | Oppo（重庆）智能科技有限公司 | Method for adhering film and pad-pasting fixture |
| CN112092407B (en) * | 2020-09-02 | 2022-02-22 | 蓝思科技(东莞)有限公司 | Film pasting method and film pasting device |
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