CN113001116A - Processing technology of semiconductor PVD equipment part WELDMENT HOOP - Google Patents

Processing technology of semiconductor PVD equipment part WELDMENT HOOP Download PDF

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Publication number
CN113001116A
CN113001116A CN202110237018.3A CN202110237018A CN113001116A CN 113001116 A CN113001116 A CN 113001116A CN 202110237018 A CN202110237018 A CN 202110237018A CN 113001116 A CN113001116 A CN 113001116A
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CN
China
Prior art keywords
workpiece
processing
reference surface
side top
steps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110237018.3A
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Chinese (zh)
Inventor
李俊男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenyang Fortune Precision Equipment Co Ltd
Original Assignee
Shenyang Fortune Precision Equipment Co Ltd
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Filing date
Publication date
Application filed by Shenyang Fortune Precision Equipment Co Ltd filed Critical Shenyang Fortune Precision Equipment Co Ltd
Priority to CN202110237018.3A priority Critical patent/CN113001116A/en
Publication of CN113001116A publication Critical patent/CN113001116A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

Abstract

The invention relates to a processing technology for a part WELDMENTHOOP of a semiconductor PVD device, wherein the part is a welded part, and the parallelism, the position degree and the profile degree of a functional area relative to the reference of the part are the core sizes of the part.

Description

Processing technology of semiconductor PVD equipment part WELDMENT HOOP
Technical Field
The invention belongs to the field of IC equipment and precision part manufacturing, aims at the processing of 304 stainless steel WELDMENT HOOP of semiconductor PVD equipment parts and parts, and is also suitable for stainless steel welding parts with similar structures.
Background
The PVD equipment is physical vapor deposition coating equipment in a semiconductor and is widely applied to the field of semiconductors, wherein the WELDMENT HOOP of an internal part is a 304 stainless steel welding part, a welded workpiece is deformed and difficult to clamp and process, the structural strength of four small welding stand columns of the workpiece is low, the inclined planes and the planes at the tops of the stand columns are functional areas of the workpiece, the core sizes of parallelism, position and profile of the stand columns relative to the reference of the workpiece are 0.076mm and difficult to guarantee, the reference surface is small, the stand columns belong to small-reference large-measurement, measurement errors exist, the PVD equipment is processed by a conventional method, the rejection rate of the workpiece is high, and the volume production is unstable.
Disclosure of Invention
Aiming at the technical problems, the invention provides a processing technology of a semiconductor PVD equipment part WELDMENT HOOP, which ensures the flatness of a reference surface, the parallelism of the reference surface and a conversion reference, controls clamping deformation to ensure the controllability of a processing process, and ensures the qualification of a final size through the early process control.
The technical scheme adopted by the invention is as follows:
a processing technology of a semiconductor PVD equipment part WELDMENT HOOP comprises the following steps:
processing a reference surface and a depression by a milling machine;
converting the reference surface, namely selecting the large surface of the bottom surface of the part as a processing reference surface, and transferring the reference from the small surface to the large surface during processing;
step (3), a special tool is used for processing the reference surface and sinking, the side top of the pressure plate is pressed, and the side top of the side top plate cannot be used;
step (4), heating molten glue around the inner shape of the workpiece when the datum plane is machined and the workpiece sinks, and preventing the workpiece from vibrating during machining to influence the flatness;
step (5), air cooling is used for processing the reference surface and sinking;
and (6) processing the reference surface and using a dial indicator to find the center of the reference circle to determine the processing origin when the reference surface sinks.
Machining the functional surface by adopting a lathe;
adopting a special tool when the functional surface is processed in the step (8);
and (9) when the functional surface is machined and clamped in the step (9), the pressure plate needs to be pressed tightly under the condition that the variable quantity is confirmed by the dial indicator, and the deformation is controlled.
The invention has the advantages that:
1. starting at details, a special process scheme is formulated, the final dimension is ensured to be qualified through stable process control, and the qualification rate of workpieces is improved.
2. And a special tool is used, so that the workpiece is stably clamped.
3. The template of the process scheme is provided for processing the similar workpieces, and the waste of time and cost of the similar products is avoided.
Detailed Description
The present invention is described in further detail below.
A processing technology of a semiconductor PVD equipment part WELDMENT HOOP comprises the following steps:
processing a reference surface and a depression by a milling machine;
converting the reference surface, namely selecting the large surface of the bottom surface of the part as a processing reference surface, and transferring the reference from the small surface to the large surface during processing;
step (3), a special tool is used for processing the reference surface and sinking, the side top of the pressure plate is pressed, and the side top of the side top plate cannot be used;
step (4), heating molten glue around the inner shape of the workpiece when the datum plane is machined and the workpiece sinks, and preventing the workpiece from vibrating during machining to influence the flatness;
step (5), air cooling is used for processing the reference surface and sinking;
and (6) processing the reference surface and using a dial indicator to find the center of the reference circle to determine the processing origin when the reference surface sinks.
Machining the functional surface by adopting a lathe;
adopting a special tool when the functional surface is processed in the step (8);
and (9) when the functional surface is machined and clamped in the step (9), the pressure plate needs to be pressed tightly under the condition that the variable quantity is confirmed by the dial indicator, and the deformation is controlled.
And (2) converting the reference surface, selecting the large surface of the bottom surface of the part as a processing reference surface, and transferring the reference from the small surface to the large surface during processing, so that the problems of small reference surface, large positioning error and difficulty in ensuring the key size are solved, and when the reference surface is processed, the same cutter is used for processing in the same sequence, so that the processing reference of the next sequence is ensured to be within 0.01mm parallel to the design reference.
The reference surface is machined in the step (3), a special tool is used when the reference surface sinks, the side top of the pressure plate is pressed, and the side top of the side top plate cannot be used; if the side top plate is used, the workpiece can deform if the force is large, and if the force is small, the side top screw cannot be locked, so that the workpiece can be loosened due to vibration in the machining process; in addition, other media are not placed between the workpiece and the pressing plate, so that the workpiece is prevented from loosening due to the change of a contact surface caused by vibration in the machining process
Heating molten glue around the inner appearance of the workpiece when the reference surface is machined and the workpiece sinks, so that the influence on the flatness caused by vibration in the machining of the workpiece is avoided; the flatness of the welded workpiece is poor, hot melt adhesive is used for assisting in fixing, and the situation that the cutter quivers due to the fact that the bottom surface of the workpiece is not tightly contacted with a tool is avoided.
The step (5) is to use air cooling when the reference surface is processed and sinks; the hot melt adhesive is prevented from falling off due to the use of the cooling liquid.
The reference surface is machined in the step (6), and a dial indicator is used for finding the center of a reference circle to determine a machining origin when the reference surface sinks; the workpiece is deformed after being welded, and the circle center of the reference circle is more accurately found by using the dial indicator.
And (5) adopting a special tool when the functional surface is processed in the step (8). The clamping deformation is controlled, and the stable processing is ensured.
When the functional surface is machined and clamped in the step (9), the pressure plate needs to be pressed under the condition that the variable quantity is confirmed by the dial indicator, and the deformation is controlled; and controlling the clamping deformation within 0.01 mm.

Claims (8)

1. A processing technology of a semiconductor PVD equipment part WELDMENT HOOP is characterized in that:
the method comprises the following steps:
processing a reference surface and a depression by a milling machine;
converting the reference surface, namely selecting the large surface of the bottom surface of the part as a processing reference surface, and transferring the reference from the small surface to the large surface during processing;
step (3), a special tool is used for processing the reference surface and sinking, the side top of the pressure plate is pressed, and the side top of the side top plate cannot be used;
step (4), heating molten glue around the inner shape of the workpiece when the datum plane is machined and the workpiece sinks, and preventing the workpiece from vibrating during machining to influence the flatness;
step (5), air cooling is used for processing the reference surface and sinking;
and (6) processing the reference surface and using a dial indicator to find the center of the reference circle to determine the processing origin when the reference surface sinks.
Machining the functional surface by adopting a lathe;
adopting a special tool when the functional surface is processed in the step (8);
and (9) when the functional surface is machined and clamped in the step (9), the pressure plate needs to be pressed tightly under the condition that the variable quantity is confirmed by the dial indicator, and the deformation is controlled.
2. The process of claim 1, wherein the process comprises the steps of: and (2) converting the reference surface, selecting the large surface of the bottom surface of the part as a processing reference surface, and transferring the reference from the small surface to the large surface during processing, so that the problems of small reference surface, large positioning error and difficulty in ensuring the key size are solved, and when the reference surface is processed, the same cutter is used for processing in the same sequence, so that the processing reference of the next sequence is ensured to be within 0.01mm parallel to the design reference.
3. The process of claim 1, wherein the process comprises the steps of: the reference surface is machined in the step (3), a special tool is used when the reference surface sinks, the side top of the pressure plate is pressed, and the side top of the side top plate cannot be used; if the side top plate is used, the workpiece can deform if the force is large, and if the force is small, the side top screw cannot be locked, so that the workpiece can be loosened due to vibration in the machining process; in addition, other media are not placed between the workpiece and the pressing plate, so that the workpiece is prevented from loosening due to the change of a contact surface caused by vibration in the machining process.
4. The process of claim 1, wherein the process comprises the steps of: heating molten glue around the inner appearance of the workpiece when the reference surface is machined and the workpiece sinks, so that the influence on the flatness caused by vibration in the machining of the workpiece is avoided; the flatness of the welded workpiece is poor, hot melt adhesive is used for assisting in fixing, and the situation that the cutter quivers due to the fact that the bottom surface of the workpiece is not tightly contacted with a tool is avoided.
5. The process of claim 1, wherein the process comprises the steps of: the step (5) is to use air cooling when the reference surface is processed and sinks; the hot melt adhesive is prevented from falling off due to the use of the cooling liquid.
6. The process of claim 1, wherein the process comprises the steps of: the reference surface is machined in the step (6), and a dial indicator is used for finding the center of a reference circle to determine a machining origin when the reference surface sinks; the workpiece is deformed after being welded, and the circle center of the reference circle is more accurately found by using the dial indicator.
7. The process of claim 1, wherein the process comprises the steps of: and (5) adopting a special tool when the functional surface is processed in the step (8). The clamping deformation is controlled, and the stable processing is ensured.
8. The process of claim 1, wherein the process comprises the steps of: when the functional surface is machined and clamped in the step (9), the pressure plate needs to be pressed under the condition that the variable quantity is confirmed by the dial indicator, and the deformation is controlled; and controlling the clamping deformation within 0.01 mm.
CN202110237018.3A 2021-03-03 2021-03-03 Processing technology of semiconductor PVD equipment part WELDMENT HOOP Pending CN113001116A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110237018.3A CN113001116A (en) 2021-03-03 2021-03-03 Processing technology of semiconductor PVD equipment part WELDMENT HOOP

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110237018.3A CN113001116A (en) 2021-03-03 2021-03-03 Processing technology of semiconductor PVD equipment part WELDMENT HOOP

Publications (1)

Publication Number Publication Date
CN113001116A true CN113001116A (en) 2021-06-22

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102363258A (en) * 2011-07-01 2012-02-29 哈尔滨电机厂有限责任公司 Technological method for assembling and welding seat ring of water turbine with stainless steel fixed guide blade
CN103008987A (en) * 2012-12-05 2013-04-03 哈尔滨电机厂有限责任公司 Manufacturing method for producing mixed-flow-type water turbine bottom ring wear-resistant layer through strip surfacing
US20180178270A1 (en) * 2015-07-31 2018-06-28 Otto Fuchs Kommanditgesellschaft Method for Producing a Contoured Ring Rolling Product
CN110397302A (en) * 2019-07-17 2019-11-01 中建八局第三建设有限公司 A kind of hoop reinforcement of weld method of round tube steel structure member
CN112276602A (en) * 2020-10-08 2021-01-29 沈阳富创精密设备股份有限公司 Annular adjustable positioning tool

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102363258A (en) * 2011-07-01 2012-02-29 哈尔滨电机厂有限责任公司 Technological method for assembling and welding seat ring of water turbine with stainless steel fixed guide blade
CN103008987A (en) * 2012-12-05 2013-04-03 哈尔滨电机厂有限责任公司 Manufacturing method for producing mixed-flow-type water turbine bottom ring wear-resistant layer through strip surfacing
US20180178270A1 (en) * 2015-07-31 2018-06-28 Otto Fuchs Kommanditgesellschaft Method for Producing a Contoured Ring Rolling Product
CN110397302A (en) * 2019-07-17 2019-11-01 中建八局第三建设有限公司 A kind of hoop reinforcement of weld method of round tube steel structure member
CN112276602A (en) * 2020-10-08 2021-01-29 沈阳富创精密设备股份有限公司 Annular adjustable positioning tool

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