CN112998730A - CT detector module and CT detector - Google Patents
CT detector module and CT detector Download PDFInfo
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Abstract
The application provides a CT detector module and CT detector, signal detection module with signal conversion module direct fixed sets up on the detector mainboard, can directly realize from receiving ray and converting into optical signal, optical signal converts the signal of telecommunication and accomplishes data processing and transmit to the image reconstruction system, carries out image reconstruction and obtains the CT image. The CT detector module reduces components such as a connecting structure and a supporting structure in the traditional CT detector module, so that the CT detector module is more compact in structure, high in integration level and capable of improving expandability and reliability. Through this application detector mainboard directly carry out signal acquisition, processing and transmission, do not need the transmission line to realize, reduced the loss in the signal transmission process, improved signal quality, shortened transmission time to the detection efficiency of CT equipment has been improved. By the CT detector module, the complexity of the preparation process can be reduced, quick batch production can be realized, and the cost is reduced.
Description
Technical Field
The present application relates to the field of medical imaging technology, and in particular, to a CT detector module and a CT detector.
Background
Computed Tomography (CT) devices are a fully functional disease detection instrument. The main components of the CT equipment comprise a transmission source, a detector, a frame, a bed body, a data acquisition and processing system and the like. When the CT imaging system works, an emitting source emits X-rays which can penetrate a human body or an object to be measured, a detector receives the X-rays and converts the X-rays into electric signals, and a data acquisition and processing system transmits the electric signals to an image reconstruction system for image reconstruction, so that a CT image is obtained. Among them, the CT detector module is an important component.
The traditional CT detector module realizes the completion process of signal acquisition to signal processing by a plurality of parts through a complex and fussy stacking structure, and then the complex and fussy stacking structure makes the structure of the traditional CT detector module complex and high in cost.
Disclosure of Invention
In view of this, it is necessary to provide a CT detector module and a CT detector with compact and simple structure and low cost, aiming at the problems of complex structure and high cost of the conventional CT detector module.
The application provides a CT detector module, which is applied to computed tomography imaging equipment and comprises a signal detection module, a signal conversion module and a detector main board. The signal detection module is used for receiving rays which are emitted by a transmitting source of the computed tomography imaging equipment and penetrate through human tissues, and converting the rays into optical signals. The signal conversion module is connected with the signal detection module and used for receiving the optical signal and converting the optical signal into an electric signal. The signal detection module is arranged on the detector mainboard. The signal conversion module is arranged on the detector mainboard. The detector mainboard comprises a signal processing module. The signal processing module is connected with the signal conversion module and used for receiving the electric signal and transmitting the electric signal after being processed to an image reconstruction system of the computer tomography equipment for image reconstruction so as to obtain a CT image.
In one embodiment, the signal detection module includes a plurality of scintillation crystals. The plurality of scintillation crystals are arranged on the detector main board. Each scintillation crystal is connected with the signal conversion module.
In one embodiment, the signal conversion module includes a plurality of photoelectric conversion devices. The plurality of photoelectric conversion devices are arranged on the detector main board. One of the scintillation crystals is connected to one of the photoelectric conversion devices. Each photoelectric conversion device is connected with the signal processing module.
In one embodiment, the plurality of scintillation crystals are arranged on the detector main board in sequence. The plurality of photoelectric conversion devices are disposed on both sides of the plurality of scintillation crystals. One of the scintillator crystals is disposed corresponding to one of the photoelectric conversion devices.
In one embodiment, the CT detector module further includes a plurality of positioning holes. The positioning holes are formed in the detector main board and used for positioning the installation position of the detector main board. The positioning holes are respectively arranged on one sides of the photoelectric conversion devices far away from the scintillation crystals.
In one embodiment, the CT detector module further includes a plurality of mounting holes. The mounting holes are formed in the detector main board. The plurality of mounting holes are respectively arranged on two sides of the plurality of photoelectric conversion devices. The mounting holes and the positioning holes are arranged on the same straight line at intervals.
In one embodiment, the signal processing module is disposed remotely from the plurality of photoelectric conversion devices. The mounting holes and the positioning holes are arranged between the signal processing module and the plurality of photoelectric conversion devices.
In one embodiment, the CT detector module further comprises an anti-scatter grid. The anti-scattering grid is provided with a plurality of grid positioning holes and a plurality of grid mounting holes. The anti-scatter grid is arranged on the surface of the plurality of scintillation crystals far away from the detector main board. The grid positioning holes and the positioning holes are arranged in a one-to-one correspondence mode. The grid mounting holes and the mounting holes are arranged in a one-to-one correspondence mode.
In one embodiment, the probe motherboard further comprises a heat dissipation structure. The heat dissipation structure is arranged on the surface of the detector mainboard opposite to the signal detection module and used for dissipating heat of the detector mainboard. The heat dissipation structure is provided with a plurality of heat dissipation mounting holes, and the plurality of heat dissipation mounting holes and the plurality of mounting holes are arranged in a one-to-one correspondence mode.
In one embodiment, the present application provides a CT detector. The CT detector comprises the CT detector module and a detector base body. The detector base body is provided with a plurality of base body positioning holes and a plurality of base body mounting holes. And the plurality of base body positioning holes and the plurality of positioning holes are arranged in a one-to-one correspondence manner. The plurality of base body mounting holes and the plurality of mounting holes are arranged in a one-to-one correspondence mode.
The application provides an above-mentioned CT detector module, the detector mainboard is Printed Circuit Board (Printed Circuit Board, PCB), as signal detection module signal conversion module and signal processing module's supporter realizes signal detection module signal conversion module and electrical connection between the signal processing module. The signal detection module and the signal conversion module are directly and fixedly arranged on the detector mainboard. At the moment, the purpose of receiving rays and converting the rays into optical signals can be directly realized on the detector mainboard, the optical signals are converted into electric signals, data processing is completed, the electric signals are transmitted to an image reconstruction system, and image reconstruction is carried out to obtain a CT image. Through directly set up on the detector mainboard the signal detection module signal conversion module and signal processing module has reduced parts such as connection structure, bearing structure among the traditional CT detector module, makes the structure of CT detector module is compacter, and the integrated level is high, and has improved the scalability and the reliability of CT detector module.
Meanwhile, the signal detection module, the signal conversion module and the signal processing module are directly arranged on the detector mainboard, collected signals can directly pass through the detector mainboard for signal processing and transmission, and the signal processing and transmission are not required to be realized through a transmission line, so that the loss in the signal transmission process is reduced, the signal quality is improved, the transmission time is shortened, and the detection efficiency of the CT equipment is improved. Meanwhile, the signal detection module, the signal conversion module and the signal processing module are directly arranged on the detector mainboard, so that the process complexity of the CT detector module is reduced, the realization of rapid batch production is facilitated, and the cost is reduced.
Drawings
FIG. 1 is a schematic structural diagram of a CT detector module according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural view of a first surface, a second surface and a side of the embodiment shown in FIG. 1 provided herein;
FIG. 3 is a schematic structural diagram of a first surface of a CT detector module according to an embodiment of the present disclosure;
FIG. 4 is a cross-sectional view of a CT detector module of FIG. 3 according to an embodiment of the present disclosure;
FIG. 5 is a top view of an anti-scatter grid provided herein;
FIG. 6 is a schematic structural diagram of a second surface of a CT detector module according to an embodiment of the present disclosure;
FIG. 7 is a schematic structural diagram of a CT detector according to an embodiment of the present disclosure;
FIG. 8 is a partial schematic structural view of the CT detector shown in FIG. 6 provided herein;
fig. 9 is a schematic structural diagram of a CT detector according to an embodiment of the present disclosure.
Description of the reference numerals
The detector comprises a CT detector module 100, a signal detection module 10, a signal conversion module 20, a detector main board 30, a signal processing module 310, a scintillation crystal 110, a photoelectric conversion device 210, a positioning hole 40, a mounting hole 50, a heat dissipation structure 320, a heat dissipation mounting hole 321, a heat conduction pad 322, a first surface 610, a second surface 620, a first screw mounting region 630, a heat dissipation region 640, a second screw mounting region 650, a signal processing region 660, an anti-scatter grid 70, a grid positioning hole 701, a grid mounting hole 702, a CT detector 200, a detector base 80, a base positioning hole 801, a base mounting hole 802, a positioning pin 910 and a mounting screw 920.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is further described in detail below by way of embodiments and with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings). In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be considered as limiting the present application.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Referring to fig. 1-2, the present application provides a CT detector module 100 applied to a computed tomography imaging apparatus, which includes a signal detection module 10, a signal conversion module 20, and a detector main board 30. The signal detection module 10 is configured to receive a ray emitted from a radiation source of the computed tomography apparatus and penetrating through a human tissue, and convert the ray into an optical signal. The signal conversion module 20 is connected to the signal detection module 10, and is configured to receive the optical signal and convert the optical signal into an electrical signal. The signal detection module 10 is disposed on the detector main board 30. The signal conversion module 20 is disposed on the detector main board 30. The probe main board 30 includes a signal processing module 310. The signal processing module 310 is connected to the signal conversion module 20, and configured to receive the electrical signal, process the electrical signal, and transmit the processed electrical signal to an image reconstruction system of the computed tomography apparatus for image reconstruction, so as to obtain a CT image.
The present application provides an above-mentioned CT detector module, the detector mainboard 30 is Printed Circuit Board (PCB), as the signal detection module 10 the signal conversion module 20 and the support body of the signal processing module 310 realizes the signal detection module 10 the signal conversion module 20 and the electrical connection between the signal processing modules 310. The signal detection module 10 and the signal conversion module 20 are directly fixed on the detector main board 30. The signal processing module 310 includes a plurality of electronic devices, and is configured to obtain the electrical signal (analog signal) sent by the signal conversion module 20, convert the analog signal into a digital signal, and transmit the digital signal to an image reconstruction system of a CT apparatus for image reconstruction, so as to obtain a CT image.
At this time, the receiving of the rays and the conversion into optical signals can be directly realized on the detector main board 30, and the optical signals are converted into electrical signals and data processing and transmission are completed to the image reconstruction system for image reconstruction to obtain the CT image. By directly arranging the signal detection module 10, the signal conversion module 20 and the signal processing module 310 on the detector main board 30, components such as a connection structure and a support structure in a traditional CT detector module are reduced, so that the structure of the CT detector module 100 is more compact, the integration level is high, and the expandability and the reliability of the CT detector module 100 are improved.
Meanwhile, the signal detection module 10, the signal conversion module 20 and the signal processing module 310 are directly arranged on the detector main board 30, and the collected signals can be directly processed and transmitted through the detector main board 30 without being transmitted through a transmission line, so that the loss in the signal transmission process is reduced, the signal quality is improved, the transmission time is shortened, and the detection efficiency of the CT equipment is improved. Meanwhile, the signal detection module 10, the signal conversion module 20 and the signal processing module 310 are directly arranged on the detector main board 30, so that the process complexity of preparing the CT detector module 100 is reduced, the rapid batch production is more favorably realized, and the cost is reduced.
In one embodiment, the signal detection module 10 includes a plurality of scintillation crystals 110. The plurality of scintillation crystals 110 are disposed on the detector main board 30. Each of the scintillation crystals 110 is connected to the signal conversion module 20.
The scintillation crystal 110 has a receiving surface facing a radiation source for receiving radiation emitted by the radiation source of the computed tomography imaging apparatus and transmitted through the body tissue. When a ray strikes the scintillation crystal 110, the scintillation crystal 110 can convert the kinetic energy of the high energy particle into light energy to produce a flash of light. At this time, the scintillation crystal 110 converts the radiation into an optical signal. The electrical connection between the plurality of scintillation crystals 110 and the signal conversion module 20 is realized through the detector main board 30, and components such as a connection structure, a support structure, a transmission line and the like in the conventional CT detector module are reduced, so that the structure of the CT detector module 100 is more compact, and the integration level is high. Therefore, the plurality of scintillation crystals 110 are arranged on the detector main board 30, so that the receiving, transmission and conversion of optical signals can be realized, the loss in the signal transmission process is reduced, the signal quality is improved, the transmission time is shortened, and the detection efficiency of the CT device is improved.
In one embodiment, the signal conversion module 20 includes a plurality of photoelectric conversion devices 210. The plurality of photoelectric conversion devices 210 are disposed on the detector main board 30. One of the scintillation crystals 110 is connected to one of the photoelectric conversion devices 210. Each of the photoelectric conversion devices 210 is connected to the signal processing module 310.
Each of the photoelectric conversion devices 210 includes a photodiode and a read chip. The photodiode is electrically connected to the scintillation crystal 110 on the detector motherboard 30 to convert the optical signal into an electrical signal. The read chip is electrically connected to the photodiode on the detector main board 30 to collect the electrical signal. The read chip is electrically connected to the signal processing module 310 on the detector main board 30, and is configured to transmit the electrical signal to the signal processing module 310. One of the scintillation crystals 110 and one of the photoelectric conversion devices 210 are electrically connected to the detector main board 30 in a one-to-one correspondence.
The electrical connection among the plurality of scintillation crystals 110, the plurality of photoelectric conversion devices 210 and the signal processing module 310 is realized through the detector main board 30, and components such as a connection structure, a support structure and a transmission line in a traditional CT detector module are reduced, so that the structure of the CT detector module 100 is more compact and the integration level is high. Moreover, by arranging the plurality of scintillation crystals 110 and the plurality of photoelectric conversion devices 210 on the detector main board 30, the whole process of receiving rays and converting the rays into optical signals, converting the optical signals into electrical signals, processing data and transmitting the electrical signals to an image reconstruction system to obtain a CT image can be directly realized. Therefore, in the whole signal transmission process, the influence of components such as a connecting structure, a supporting structure and a transmission line in the traditional CT detector module on the signal transmission is reduced, the loss in the signal transmission process is reduced, the signal quality is improved, the transmission time is shortened, and the detection efficiency of the CT equipment is improved.
Referring to fig. 2, in one embodiment, the plurality of photoelectric conversion devices 210 are disposed on two sides of the plurality of scintillation crystals 110. One of the scintillator crystals 110 is disposed corresponding to one of the photoelectric conversion devices 210.
The plurality of scintillation crystals 110 are sequentially arranged on the detector main board 30 in a plurality of rows. The plurality of photoelectric conversion devices 210 are disposed on both sides of the plurality of scintillation crystals 110, and surround the plurality of scintillation crystals 110. At this time, the plurality of scintillation crystals 110 can be collectively disposed in the radiation collecting area of the detector main board 30. Therefore, the plurality of scintillation crystals 110 are intensively arranged at a certain position of the detector main board 30, so that more rays emitted by the emission source and penetrating through human tissues can be better received, the detection of the CT detector module 100 is more accurate, and the reconstruction of a CT image is facilitated.
Meanwhile, the plurality of photoelectric conversion devices 210 are disposed on two sides of the plurality of scintillation crystals 110 and are connected in a one-to-one correspondence manner, so that the distance of signal transmission is shortened, the loss in the transmission process is reduced, centralized control is facilitated, and the signal quality is improved.
Referring to fig. 2, in one embodiment, the CT detector module 100 further includes a plurality of positioning holes 40. The plurality of positioning holes 40 are disposed on the detector main board 30, and are used for positioning the installation position of the detector main board 30.
The number of the positioning holes 40 is at least two, and may be 2, 4, etc. The plurality of positioning holes 40 can mechanically connect the detector main board 30 with a detector base body in the CT apparatus for positioning, so as to facilitate subsequent installation. And, the positioning mechanism is arranged on the detector base body through the plurality of positioning holes 40, so that the receiving surfaces of the plurality of scintillation crystals 110 face the emission source, and the rays emitted by the emission source and penetrating through the human tissue can be received.
In one embodiment, the positioning holes 40 are respectively disposed on the sides of the photoelectric conversion devices 210 away from the scintillation crystals 110.
The plurality of positioning holes 40 are respectively and uniformly disposed on both sides of the plurality of photoelectric conversion devices 210. At this time, the plurality of photoelectric conversion devices 210 and the plurality of scintillation crystals 110 can be fixed by the plurality of positioning holes 40 according to actual requirements such that the receiving surfaces of the plurality of scintillation crystals 110 face the emission source. Moreover, the positioning holes 40 are formed at different positions of the probe main board 30, so that the probe main board 30 can be mechanically connected to the probe base body more firmly. When the CT device works, the CT detector module 100 can be firmly arranged on the detector base body, and is not easily strained by the centrifugal force.
In one embodiment, the CT detector module 100 also includes a plurality of mounting holes 50. The plurality of mounting holes 50 are provided in the probe main board 30. The plurality of mounting holes 50 are respectively disposed at both sides of the plurality of photoelectric conversion devices 210. The mounting holes 50 and the positioning holes 40 are arranged on a straight line at intervals.
The plurality of mounting holes 50 are uniformly distributed on the straight line where the plurality of positioning holes 40 are arranged, and at this time, the plurality of mounting holes 50 and the plurality of positioning holes 40 may be uniformly distributed on both sides of the plurality of photoelectric conversion devices 210.
In this embodiment, the plurality of mounting holes 50 on the same straight line are symmetrically disposed about the positioning hole 40. At this time, the positioning hole 40 is disposed at the center of the straight line, which is beneficial for being mechanically disposed on the detector base body, so as to realize the positioning of the CT detector module 100.
Meanwhile, the plurality of mounting holes 50 and the plurality of positioning holes 40 are disposed on the probe main board 30 at equal intervals. And, a part of the mounting hole 50 and the positioning hole 40 are disposed at the geometric center position of the probe main board 30. When the CT device works, the CT detector module 100 can be firmly arranged on the detector base body, and is not easily strained by the centrifugal force.
Therefore, the detector main board 30 can be mechanically connected to the anti-scatter grid 70 and the detector base in the CT apparatus through the plurality of mounting holes 50 and the plurality of positioning holes 40. Wherein, the detector base member is the support frame of circular arc shape. The detector main boards 30 in the CT apparatus are sequentially arranged on the detector substrate along the same direction, so that the receiving surfaces of the plurality of scintillation crystals 110 are arranged toward the emission source, and are used for receiving the radiation emitted by the emission source of the CT apparatus and penetrating through the human tissue. In this case, the plurality of detector main boards 30 are sequentially arranged, so that the plurality of scintillation crystals 110 form an arc surface facing the emission source. The central line of the arc surface passes through the focal point of the emission source, and when the radiation emitted by the emission source can be incident to the plurality of scintillation crystals 110 perpendicular to the receiving surface, the detection efficiency and accuracy of the CT detector module 100 can be improved.
In one embodiment, the signal processing module 310 is disposed remotely from the plurality of photoelectric conversion devices 210. The mounting hole 50 and the positioning hole 40 are disposed between the signal processing module 310 and the plurality of photoelectric conversion devices 210.
A portion of the mounting holes 50 and a portion of the positioning holes 40 are disposed on the same straight line and between the signal processing module 310 and the plurality of photoelectric conversion devices 210. At this time, the positioning holes 40 and the mounting holes 50 can make the main detector board 30 mechanically connected to the detector base 80 and the anti-scatter grid 70 more firmly. When the CT device works, the CT detector module 100 can be firmly arranged on the detector base body, and is not easily strained by the centrifugal force.
Referring to fig. 3-6, in one embodiment, the CT detector module further includes an anti-scatter grid 70. The anti-scatter grid 70 is provided with a plurality of grid positioning holes 701 and a plurality of grid mounting holes 702. The anti-scatter grid 70 is disposed on a surface of the plurality of scintillation crystals 110 away from the detector main board 30. The grid positioning holes 701 and the positioning holes 40 are arranged in a one-to-one correspondence. The plurality of grid mounting holes 702 are arranged in one-to-one correspondence with the plurality of mounting holes 50.
The anti-scatter grid 70 is installed above the detector main board 30, and a plurality of grid positioning holes 701 and a plurality of grid mounting holes 702 are respectively formed in two sides of the anti-scatter grid 70. The anti-scatter grid 70 is disposed in one-to-one correspondence with the positioning holes 40 on the detector main board 30 through the grid positioning holes 701. At this time, the detector main board 30 and the anti-scatter grid 70 may be positioned by pins according to the plurality of grid positioning holes 701 and the plurality of positioning holes 40.
Referring to fig. 7-9, in one embodiment, the present application provides a CT detector 200. The CT detector 200 includes the above-described CT detector module 100 and the detector base 80. The probe base 80 is provided with a plurality of base positioning holes 801 and a plurality of base mounting holes 802. And the plurality of base positioning holes 801 and the plurality of positioning holes 40 are arranged in one-to-one correspondence. The plurality of substrate mounting holes 802 and the plurality of mounting holes 50 are arranged in one-to-one correspondence.
The substrate positioning holes 801, the grid positioning holes 701 and the positioning holes 40 are uniformly arranged in a corresponding manner. By positioning the detector main board 30 and the anti-scatter grid 70 and matching the substrate positioning holes 801 on the module mounting surface of the detector substrate 80 for positioning, a positioning pin 910 can connect the substrate positioning holes 801, the grid positioning holes 701 and the substrate positioning holes 801 simultaneously. Thereby, a simultaneous positioning of the detector main board 30, the anti-scatter grid 70 and the detector base 80 is achieved.
Meanwhile, the grid mounting holes 702, the mounting holes 50, and the substrate mounting holes 802 are arranged in a one-to-one correspondence. At this time, the grid mounting holes 702, the mounting holes 50, and the base mounting holes 802 may be simultaneously fixed by mounting screws 920, thereby making the mounting between each other more compact and stable.
Among them, the most important thing in the assembly of the CT detector is to ensure the alignment relationship of the scintillator of the detector to the anti-scatter grid and the scintillator to the detector matrix. How to reduce the size chain length during the installation of the detector is an important means to improve the performance of the detector. Therefore, the high-precision positioning holes 40 on the detector main board 30 are connected with the positioning pins 910, so that the positioning pins 910 position the scintillation crystal 110 to be connected with the anti-scatter grid 70 and the detector base body 80 at high precision, the length of the size chain in the assembling process of the CT detector is reduced, and the alignment precision of the CT detector is improved.
In one embodiment, the CT detector module 100 further includes a heat dissipation structure 320. The heat dissipation structure 320 is disposed on a surface of the detector main board 30 opposite to the signal detection module 10, and is used for dissipating heat of the detector main board 30. The heat dissipation structure 320 is provided with a plurality of heat dissipation mounting holes 321, and the plurality of heat dissipation mounting holes 321 and the plurality of mounting holes 50 are arranged in a one-to-one correspondence manner. The heat conducting pad 322 is disposed near the heat dissipating structure 320 and far away from the detector main board 30 for dissipating heat.
When the CT detector module 100 operates, a large amount of heat is generated, and the heat generated by the detector main board 30 can be dissipated through the heat dissipation structure 320. The heat dissipation structure 320 may be a heat sink or a heat pipe, or a fan may be added to enhance the heat dissipation effect.
In this embodiment, the heat dissipation structure 320 is a heat conductor, and the heat conductor is used for dissipating heat through heat transfer. The heat conductor may be a copper plate, and some copper pillars are designed on the probe motherboard 30, so that heat on the probe motherboard 30 is transmitted to the heat conductor through the copper pillars to achieve a heat dissipation function. The heat dissipation structure 320 is disposed at a heat concentration position of the detector main board 30, for example, at a position of a heat dissipation area 640 of a surface of the detector main board 30 opposite to the signal detection module 10, that is, the second surface 620 in fig. 2.
In one embodiment, the probe card 30 includes a first surface 610 and a second surface 620. The first surface 610 is disposed opposite to the second surface 620. The plurality of scintillator crystals 110 and the plurality of photoelectric conversion devices 210 are disposed on the first surface 610. The second surface 620 includes a first screw mounting area 630, a heat dissipation area 640, a second screw mounting area 650, and a signal processing area 660. The first screw mounting region 630 and the second screw mounting region 650 are used for detachably mounting the detector main board 30 to the detector base and the anti-scatter grid through a plurality of screws, the positioning holes 40 and the mounting holes 50. The heat dissipation area 640 is used for placing the thermal conductor. The signal processing region 660 is a mounting region of each electronic device in the signal processing module 310.
At this time, the plurality of scintillator crystals 110 and the plurality of photoelectric conversion devices 210 are disposed on the first surface 610, and the respective electronic devices of the signal processing module 310 are disposed in the signal processing region 660 of the second surface 620. By disposing the plurality of scintillation crystals 110, the plurality of photoelectric conversion devices 210, and the signal processing module 310 on the first surface 610 and the second surface 620, respectively, the detector motherboard 30 can be more conveniently mounted.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A CT detector module for use in a computed tomography imaging apparatus, comprising:
the signal detection module (10) is used for receiving rays which are emitted by a transmitting source of the computed tomography imaging equipment and penetrate through human tissues and converting the rays into optical signals;
the signal conversion module (20) is connected with the signal detection module (10) and is used for receiving the optical signal and converting the optical signal into an electrical signal;
the signal detection module (10) is arranged on the detector main board (30), and the signal conversion module (20) is arranged on the detector main board (30);
the detector main board (30) comprises a signal processing module (310), and the signal processing module (310) is connected with the signal conversion module (20) and is used for receiving the electric signal and transmitting the electric signal after being processed to an image reconstruction system of the computed tomography imaging device for image reconstruction so as to obtain a CT image.
2. The CT detector module as claimed in claim 1, characterized in that the signal detection module (10) comprises:
the scintillation crystals (110) are arranged on the detector main board (30), and each scintillation crystal (110) is connected with the signal conversion module (20).
3. The CT detector module as recited in claim 2, wherein the signal conversion module (20) includes:
the photoelectric conversion devices (210) are arranged on the detector main board (30), one scintillation crystal (110) is connected with one photoelectric conversion device (210), and each photoelectric conversion device (210) is connected with the signal processing module (310).
4. The CT detector module as recited in claim 3, wherein the plurality of scintillation crystals (110) are arranged in sequence on the detector main board (30), the plurality of photoelectric conversion devices (210) are arranged on two sides of the plurality of scintillation crystals (110), and one scintillation crystal (110) is arranged corresponding to one photoelectric conversion device (210).
5. The CT detector module of claim 4, further comprising:
and the positioning holes (40) are arranged on the detector main board (30), and the positioning holes (40) are respectively arranged on one sides of the photoelectric conversion devices (210) far away from the scintillation crystals (110).
6. The CT detector module of claim 5, further comprising:
the mounting holes (50) are arranged on the detector main board (30), the mounting holes (50) are respectively arranged on two sides of the photoelectric conversion devices (210), and the mounting holes (50) and the positioning holes (40) are arranged on the same straight line at intervals.
7. The CT detector module of claim 6, wherein the signal processing module (310) is disposed remotely from the plurality of photoelectric conversion devices (210), and the mounting hole (50) and the positioning hole (40) are disposed between the signal processing module (310) and the plurality of photoelectric conversion devices (210).
8. The CT detector module of claim 7, further comprising an anti-scatter grid (70), the anti-scatter grid (70) being provided with a plurality of grid positioning holes (701) and a plurality of grid mounting holes (702);
the anti-scatter grid (70) is arranged on the surface of the plurality of scintillation crystals (110) far away from the detector main board (30);
the grid positioning holes (701) and the grid positioning holes (40) are arranged in a one-to-one correspondence manner, and the grid mounting holes (702) and the grid mounting holes (50) are arranged in a one-to-one correspondence manner.
9. The CT detector module of claim 8, further comprising:
the heat dissipation structure (320) is arranged on the surface, opposite to the signal detection module (10), of the detector main board (30), the heat dissipation structure (320) is provided with a plurality of heat dissipation mounting holes (321), and the heat dissipation mounting holes (321) and the mounting holes (50) are arranged in a one-to-one correspondence mode.
10. A CT detector, comprising a CT detector module according to claim 8 and a detector base (80);
the detector base body (80) is provided with a plurality of base body positioning holes (801) and a plurality of base body mounting holes (802), the base body positioning holes (801) and the base body mounting holes (40) are arranged in a one-to-one correspondence mode, and the base body mounting holes (802) and the base body mounting holes (50) are arranged in a one-to-one correspondence mode.
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| CN201911312986.5A CN112998730A (en) | 2019-12-18 | 2019-12-18 | CT detector module and CT detector |
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| CN201911312986.5A CN112998730A (en) | 2019-12-18 | 2019-12-18 | CT detector module and CT detector |
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| CN209122261U (en) * | 2018-10-12 | 2019-07-19 | 上海联影医疗科技有限公司 | A kind of CT detector module and CT detector |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2001215281A (en) * | 2000-02-02 | 2001-08-10 | Toshiba Corp | Two-dimensional detector for x-ray ct |
| US20060113483A1 (en) * | 2004-11-26 | 2006-06-01 | Kabushiki Kaisha Toshiba | X-ray computed tomography scanner and x-ray detecting system |
| JP2011226902A (en) * | 2010-04-20 | 2011-11-10 | Nec Tohoku Ltd | X-ray data acquisition device |
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