CN112995375B - Electronic equipment - Google Patents

Electronic equipment Download PDF

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Publication number
CN112995375B
CN112995375B CN202110178045.8A CN202110178045A CN112995375B CN 112995375 B CN112995375 B CN 112995375B CN 202110178045 A CN202110178045 A CN 202110178045A CN 112995375 B CN112995375 B CN 112995375B
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CN
China
Prior art keywords
antenna
electronic device
light
antenna unit
substrate
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Active
Application number
CN202110178045.8A
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Chinese (zh)
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CN112995375A (en
Inventor
王义金
简宪静
邾志民
马荣杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Priority to CN202110178045.8A priority Critical patent/CN112995375B/en
Publication of CN112995375A publication Critical patent/CN112995375A/en
Application granted granted Critical
Publication of CN112995375B publication Critical patent/CN112995375B/en
Active legal-status Critical Current
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0264Details of the structure or mounting of specific components for a camera module assembly
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

The application discloses electronic equipment includes: shell structure, antenna substrate and camera module. Wherein, the shell structure is provided with a first through hole; the antenna substrate is provided with a first antenna unit, the antenna substrate is arranged on the shell structure, and the first antenna unit and the first through hole are arranged oppositely; wherein the first antenna unit has a light-transmitting region; the camera module is arranged in the shell structure, and the lens in the camera module and the light-transmitting area are arranged oppositely. According to the antenna module, under the condition that the camera module works normally, independent design between the first antenna unit on the antenna substrate and other antennas in the electronic equipment is achieved, so that the antenna performance can be guaranteed, and the increase of the overall size of the electronic equipment can be reduced.

Description

Electronic equipment
Technical Field
The present application relates to the field of communications technologies, and in particular, to an electronic device.
Background
With the development of the fifth generation mobile communication technology (5th generation mobile networks,5G), all-metal, high-screen-ratio, ultra-thin body, multi-camera and multi-antenna communication have become the current mainstream and future trend of the terminal, and the effective radiation space of each antenna is reduced more under the condition of keeping the overall competitive size of the system, so that the antenna performance is reduced; or to accommodate multiple discrete antennas, the overall size of the system is increased, resulting in reduced product competitiveness.
Disclosure of Invention
The embodiment of the application provides electronic equipment, which aims to solve the problem that the antenna performance of multiple antennas cannot be met under the condition of reducing the increase of the overall size of the electronic equipment.
In order to solve the technical problems, the application is realized as follows:
the embodiment of the application provides electronic equipment, which comprises:
the shell structure is provided with a first through hole;
the antenna comprises a shell structure, a transparent antenna substrate, a first antenna unit and a second antenna unit, wherein the transparent antenna substrate is provided with the first antenna unit, the antenna substrate is arranged on the shell structure, and the first antenna unit and the first through hole are oppositely arranged; wherein the first antenna unit has a light-transmitting region;
the camera module is arranged in the shell structure, and the lens in the camera module and the light-transmitting area are arranged oppositely.
In this way, in the above scheme of the application, the antenna substrate is arranged at the position corresponding to the camera module on the shell structure, so that the independent design between the first antenna unit in the antenna substrate and other antennas in the electronic equipment is realized, the antenna performance can be ensured, and the increase of the overall size of the electronic equipment can be reduced; and through adopting but printing opacity antenna substrate and setting up the printing opacity region on first antenna element to guarantee the printing opacity performance of camera lens in the camera module, and then guarantee that the camera module can normally work.
Drawings
FIG. 1 shows one of the schematic diagrams of an electronic device of an embodiment of the present application;
FIG. 2 shows a second schematic diagram of an electronic device according to an embodiment of the present application;
FIG. 3 illustrates a partially exploded schematic view of an electronic device according to an embodiment of the present application;
FIG. 4 shows a third schematic diagram of an electronic device according to an embodiment of the present application;
FIG. 5 shows a fourth schematic diagram of an electronic device according to an embodiment of the present application;
FIG. 6 shows a fifth schematic diagram of an electronic device according to an embodiment of the present application;
FIG. 7 shows a schematic cross-sectional view of an electronic device according to an embodiment of the present application;
fig. 8 shows a sixth schematic diagram of an electronic device according to an embodiment of the present application.
Reference numerals illustrate:
10. a housing structure;
11. a housing body; 12. a protective cover; 101. a first through hole; 102. a slit;
20. an antenna substrate; 21. a first antenna element, 22, a second antenna element; 23. a third antenna unit; 24. spacing;
30. a light-transmitting cover plate;
40. a flexible circuit board; 41. a connector.
Detailed Description
Exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
As shown in fig. 1 to 3, an embodiment of the present application provides an electronic device, including: the camera module comprises a shell structure 10, a light-permeable antenna substrate 20 and a camera module.
Wherein, the shell structure 10 is provided with a first through hole 101; the antenna substrate 20 is provided with a first antenna unit 21, the antenna substrate 20 is arranged on the housing structure 10, and the first antenna unit 21 is arranged opposite to the first through hole 101; wherein the first antenna element 21 has a light-transmitting region; the camera module is disposed inside the housing structure 10, and the lens in the camera module is disposed opposite to the light-transmitting area.
Optionally, the camera module may include a plurality of lenses, where the plurality of lenses may correspond to a light-transmitting area; or, in the case that the camera module includes a plurality of lenses, the light-transmitting area may include a plurality of sub-areas, and one lens corresponds to one sub-area; or, in the case that the number of the light-transmitting areas is plural, the number of the first through holes 101 may be plural, and one light-transmitting area corresponds to one first through hole 101, so that light emitted or reflected by an external object may pass through the first through hole and the light-transmitting area and be projected onto the lens of the camera module, that is, the light-transmitting performance of the lens is ensured, so that the camera module is ensured to work normally.
In this embodiment, by arranging the antenna substrate 20 at a position on the housing structure corresponding to the camera module, an independent design between the antenna substrate 20 and other antennas in the electronic device is realized, so that the antenna performance can be ensured, and the increase of the overall size of the electronic device can be reduced; and through adopting but the antenna substrate 20 of printing opacity and setting up the printing opacity region on first antenna element 21 to guarantee the printing opacity performance of camera lens in the camera module, and then guarantee that the camera module can normally work.
Optionally, the antenna substrate 20 may be disposed inside the housing structure 10, for example, the antenna substrate 20 is located between the camera module and the housing structure 10, where, to ensure antenna performance, a portion of the housing structure 10 where the antenna substrate 20 is disposed may be made of a non-conductive material (for example, a first portion of a housing in the housing structure 10 is made of a non-conductive material, the first portion of the housing is used for disposing the antenna substrate 20, a second portion of the housing may be made of a conductive material, and the antenna substrate 20 is not in contact with the second portion of the housing); alternatively, the antenna substrate 20 may be disposed outside the housing structure 10.
Optionally, the housing structure 10 may include: a housing body 11 and a protective cover 12.
The shell body 11 is provided with a second through hole, the camera module is positioned in the shell body 11, and the lens and the second through hole are arranged oppositely; the protection cover 12 is provided with the first through hole 101, and the protection cover 12 is arranged on the shell body 11 and covers the second through hole; wherein the antenna substrate 20 is disposed on the protective cover 12.
Optionally, the camera module is disposed inside the housing body 11, and the protective cover 12 may be disposed outside the housing body 11, or the protective cover 12 may be embedded in the second through hole. For example: the protective cover 12 may be adhered to the housing body 11, or the protective cover 12 may be integrally formed with the housing body 11, and the protective cover 12 protrudes from the outer surface of the housing body 11, so as to protect the lens of the camera.
Optionally, the electronic device may further include: a light transmissive cover plate 30. For example, the light-transmitting cover plate can be a glass lens with light-transmitting performance.
The antenna substrate 20 is located between the transparent cover plate 30 and the protective cover 12, and the transparent cover plate 30 covers the antenna substrate 20.
Alternatively, the housing body 11 may be a battery rear case, the camera module may be a rear camera module in an electronic device, the protective cover 12 and the light-transmitting cover 30 are disposed on the battery rear case, and the antenna substrate 20 is disposed between the protective cover 12 and the light-transmitting cover 30; the protective cover 12 and the light-transmitting cover plate 30 can protect the rear camera module, and the protective cover 12 can also serve as a decorative ring for decoration.
Optionally, as shown in fig. 3, the housing structure 10 is further provided with a slot 102, and the electronic device may further include: a motherboard and a flexible circuit board 40.
The main board is positioned inside the shell structure 10; when the antenna substrate 20 is located outside the housing structure 10, the connection between the antenna substrate 20 and the motherboard may be achieved by connecting one end of the flexible circuit board 40 to the first antenna unit 21 on the antenna substrate 20 and connecting the other end of the flexible circuit board 40 to the motherboard through the slit 102.
Alternatively, the flexible circuit board 40 may be located at an edge of the antenna substrate 20 opposite the slot 102. In this way, the size of the flexible circuit board 40 can be reduced as much as possible and the space layout is facilitated on the basis of avoiding the gap 102 formed on the protective cover 12 from affecting the performance of the camera module.
Alternatively, in the case that the number of the first through holes 101 is plural, and the number of the first antenna units 21 is plural, one first antenna unit 21 may be disposed corresponding to one first through hole 101, and the first through holes 101 are arranged in an array.
The first surface of the antenna substrate 20 is provided with a first metal layer, and the first metal layer is disposed opposite to the housing structure 10, and the first metal layer is formed into the first antenna unit 21. For example: the antenna base 20 may be disposed outside the housing structure 10, and the first metal layer is disposed toward the outside of the housing structure 10.
As one implementation: an interval exists between the first metal portion and the second metal portion in the first metal layer, and the interval is formed as the light-transmitting area, which may be specifically designed according to the required working frequency band, antenna structure, etc. of the first antenna unit 21, and the embodiment of the present application is not specifically limited.
As another implementation: the light-transmitting region may be formed by a light-transmitting metal portion in the first metal layer. The light-transmitting metal part can be made of metal with light-transmitting property, such as nano silver wire, etc.
Alternatively, the number of the first antenna elements 21 may be plural, for example, four examples of the first antenna elements 21 are given in fig. 3. Accordingly, the number of the first through holes 101 may be 4, and one first antenna unit 21 corresponds to one first through hole 101.
For example: the first antenna unit 21 may be a millimeter wave antenna, and the first antenna unit 21 in fig. 3 may be antenna input interfaces ant.1, ant.2, ant.3, ant.4 of 4 millimeter wave antennas disposed on the antenna substrate 20 to form a millimeter wave array.
The wiring of the millimeter wave antenna may be made of a metal material with light transmission performance, such as a nano silver wire, so that the antenna substrate 20 and the millimeter wave antenna disposed on the antenna substrate 20 can ensure the light transmission performance of the camera module. The millimeter wave antennas may be disposed above the first through holes 101 and are disposed in one-to-one correspondence with the first through holes 101, where each millimeter wave antenna is provided with a feeding signal line extending to an edge of the antenna substrate 20, for example, the signal line may be extended into the flexible circuit board 40 through a Bonding (Bonding) process, and multiple transmission lines may be disposed in the flexible circuit board 40 for feeding millimeter wave signals.
Alternatively, a connector 41, such as a board-to-board (BTB) connector, may be provided on the flexible circuit board 40 at an end remote from the antenna substrate 20; the flexible circuit board 40 may pass through the slot 102 provided on the protective cover 12 and be connected to the radio frequency signal in the motherboard through the connector, that is, the connection between the antenna unit on the antenna substrate 20 and the motherboard is achieved.
In this embodiment, by reasonably utilizing the space occupied by the camera module with multiple cameras in the electronic device, the millimeter wave antenna is arranged below the light-transmitting cover plate 30 of the camera module, the space of the camera module with multiple cameras can be fully utilized, the formation of the millimeter wave array antenna is achieved, and the appearance of the electronic device is not damaged.
In addition, the antenna substrate 20 in the embodiment of the application adopts a substrate capable of transmitting light, and the wiring of the millimeter wave antenna arranged on the antenna substrate 20 is formed by adopting a metal material with a light transmission characteristic, so that the lighting effect of the lens in the camera module can not be influenced.
As shown in fig. 4, when the camera module includes a plurality of lenses, the plurality of lenses may be arranged in a manner of multiple rows and multiple columns, and the first through holes 101 may also be arranged in a manner of multiple corresponding rows and multiple columns, so that the first antenna units 21 (such as millimeter wave antennas) on the antenna substrate 20 may also be arranged in a one-to-one correspondence with the first through holes 101, thereby forming a millimeter wave antenna array with multiple rows and multiple columns.
As shown in fig. 5, when the camera module includes a plurality of lenses, the plurality of cameras may be distributed in a ring form to form a plurality of rows and columns of camera arrays arranged around a circumference, and the first through holes 101 may also be arranged in a corresponding plurality of rows and columns, so that the first antenna units 21 (such as millimeter wave antennas) on the antenna substrate 20 may also be arranged in a one-to-one correspondence with the first through holes 101, so as to form a plurality of rows and columns of millimeter wave antenna arrays.
In addition to the technical effects of the corresponding embodiments of fig. 1 to 3, the beam scanning coverage of the millimeter wave antenna can be further improved, and the millimeter wave antenna can scan around an angle θ or an angle Φ.
Alternatively, the protective cover 12 may be a protective cover of non-conductive material. For example, the non-conductive material may be ceramic, sapphire, etc., which has metallic luster and texture, and has wear resistance.
As one implementation: the first antenna unit 21 is disposed on the first surface of the antenna substrate 20, the second surface of the antenna substrate 20 is provided with a second metal layer, and the second metal layer is grounded; wherein the first surface is disposed opposite the second surface.
For example: the upper surface of the antenna substrate 20 (i.e., the side facing the outside of the case structure 10) is provided with a plurality of millimeter wave antennas to form a millimeter wave antenna array, and the lower surface of the antenna substrate 20 is provided with a layer of reference ground (e.g., realized by providing a second metal layer to ground) as the ground of the millimeter wave antennas.
Alternatively, the reference ground can also be used as a reflector of the millimeter wave antenna by designing the area of the reference ground, the position of the reference ground and the millimeter wave antenna, and the like; the second metal layer serving as the reference ground and the millimeter wave antenna wire are made of light-transmitting metal materials, such as nano silver wires, so that the light-transmitting effect of the camera module is guaranteed.
Optionally, as shown in fig. 6 and fig. 7, the second surface of the antenna substrate 20 is further provided with a second antenna unit 22, and a space exists between the second antenna unit 22 and the second metal layer.
For example: two metal layers isolated from each other may be designed on the second surface of the antenna substrate 20, i.e. the two metal layers are located on the same surface of the antenna substrate 20; one of the metal layers is grounded to serve as a reference ground of the millimeter wave antenna; the other metal layer can be fed through an RF1 (the frequency range of the FR1 frequency band is 450MHz-6GHz, also called sub 6GHz frequency band) antenna to be connected to a signal transmission line of the flexible circuit board 40, as shown in fig. 7, and further connected to a radio frequency signal of the FR1 antenna of the electronic device. Alternatively, the size or shape of the metal layer can be adjusted to enable the antenna to work in a frequency band required by the antenna.
Alternatively, as another implementation: the first antenna unit 21 is disposed on the first surface of the antenna substrate 20, the second surface of the antenna substrate 20 is provided with a second metal layer, and the second metal layer is used as a second antenna unit; wherein the first surface is disposed opposite the second surface.
For example: a millimeter wave array antenna is disposed on a first surface of the antenna substrate 20, and an FR1 antenna is disposed on a second surface of the antenna substrate 20, which can be connected with a radio frequency signal of the FR1 antenna of the electronic device through a signal transmission line of the flexible circuit board 40, and can be made to work in a frequency band required by the antenna by adjusting the size or shape of the metal layer.
The wires of the FR1 antenna are made of light-transmitting metal materials, such as nano silver wires, so as to ensure the light-transmitting effect of the camera module.
According to the embodiment, the space occupied by the camera module with multiple cameras in the electronic equipment is reasonably utilized, the millimeter wave antenna is arranged below the light-transmitting cover plate 30 of the camera module, the space of the camera module with multiple cameras can be fully utilized, the formation of the millimeter wave array antenna is achieved, and the appearance of the electronic equipment is not damaged.
In addition, the antenna substrate 20 in the embodiment of the application adopts a light-transmitting substrate, and the wiring of the millimeter wave antenna arranged on the antenna substrate 20 adopts a metal material with light-transmitting characteristics, so that the lighting effect of the lens in the camera module can not be affected. And the housing part (such as the protective cover 12) for arranging the antenna substrate 20 in the housing structure 10 is formed by adopting nonmetallic materials, so that the FR1 antenna and the millimeter wave antenna can be simultaneously arranged below the light-transmitting cover plate 30 of the camera module, and space multiplexing is realized.
Optionally, as shown in fig. 8, the first antenna unit 21 is disposed on the first surface of the antenna substrate 20, the first surface of the antenna substrate 20 is further provided with a third antenna unit 23, and the third antenna unit 23 is provided with a clearance area; wherein the first antenna unit 21 is located in the void area, and a space 24 exists between the first antenna unit 21 and the third antenna unit 23.
For example: the millimeter wave antenna and the FR1 antenna can be simultaneously arranged on the upper surface or the lower surface of the antenna substrate 20, meanwhile, a plurality of clearance areas are arranged in the wiring where the FR1 antenna is arranged, the millimeter wave antenna is arranged in the clearance areas, and a certain interval 24 exists between the millimeter wave antenna and the FR1 antenna so as to ensure the antenna performance of the millimeter wave antenna and the FR1 antenna.
According to the embodiment, the space occupied by the camera module with multiple cameras in the electronic equipment is reasonably utilized, the millimeter wave antenna is arranged below the light-transmitting cover plate 30 of the camera module, the space of the camera module with multiple cameras can be fully utilized, the formation of the millimeter wave array antenna is achieved, and the appearance of the electronic equipment is not damaged.
In addition, the antenna substrate 20 in the embodiment of the application adopts a light-transmitting substrate, and the wiring of the millimeter wave antenna arranged on the antenna substrate 20 adopts a metal material with light-transmitting characteristics, so that the lighting effect of the lens in the camera module can not be affected. And the housing part (such as the protective cover 12) for arranging the antenna substrate 20 in the housing structure 10 is formed by adopting nonmetallic materials, so that the FR1 antenna and the millimeter wave antenna can be simultaneously arranged below the light-transmitting cover plate 30 of the camera module, and space multiplexing is realized.
Optionally, in the embodiment of the present application, when the first antenna unit 21 is a millimeter wave antenna, a radio frequency chip of the millimeter wave antenna may be disposed on a flexible circuit board, so as to reduce loss of a millimeter wave signal transmission line.
It should be noted that, the millimeter wave antenna shape in the above embodiment is only exemplary, and may be any antenna in other forms, which is not limited in this embodiment; the number of cameras in the above embodiments is merely exemplary, and the arrangement manner thereof may be any other manner, which is not limited to this embodiment of the present application; the number of the antenna units in the above embodiment may be the same as or different from the number of the first through holes, or may not be one-to-one correspondence, for example, one first through hole corresponds to two first antenna units, which is not limited in this embodiment.
In this specification, each embodiment is described in a progressive manner, and each embodiment is mainly described by differences from other embodiments, and identical and similar parts between the embodiments are all enough to be referred to each other.
While preferred embodiments of the present embodiments have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the embodiments of the present application.
Finally, it is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article or terminal device comprising the element.
While the foregoing is directed to the preferred embodiments of the present application, it should be noted that modifications and adaptations to those embodiments may be made by one of ordinary skill in the art without departing from the principles set forth herein and are intended to be within the scope of the present application.

Claims (10)

1. An electronic device, comprising:
the shell structure is provided with a first through hole;
the antenna comprises a shell structure, a transparent antenna substrate, a first antenna unit and a second antenna unit, wherein the transparent antenna substrate is provided with the first antenna unit, the antenna substrate is arranged on the shell structure, and the first antenna unit and the first through hole are oppositely arranged; wherein the first antenna unit has a light-transmitting region;
the camera module is arranged in the shell structure, and a lens in the camera module and the light-transmitting area are arranged oppositely;
a first metal layer is arranged on the first surface of the antenna substrate, the first metal layer is arranged back to the shell structure, and the first metal layer is formed into the first antenna unit;
wherein a space exists between the first metal part and the second metal part in the first metal layer, and the space is formed as the light-transmitting area; alternatively, the light-transmitting metal portion in the first metal layer is formed as the light-transmitting region.
2. The electronic device of claim 1, wherein the housing structure is further provided with a slot, and the antenna substrate is located outside the housing structure;
the electronic device further includes:
the main board is positioned in the shell structure;
and one end of the flexible circuit board is connected with the first antenna unit, and the other end of the flexible circuit board passes through the gap and is connected with the main board.
3. The electronic device of claim 1, wherein the housing structure comprises:
the camera module is positioned in the shell body, and the lens and the second through hole are oppositely arranged;
the protection cover is provided with the first through hole, is arranged on the shell body and covers the second through hole; the antenna substrate is arranged on the protective cover.
4. The electronic device of claim 3, wherein the electronic device further comprises: a light-transmitting cover plate;
the antenna substrate is located between the light-transmitting cover plate and the protective cover, and the light-transmitting cover plate covers the antenna substrate.
5. The electronic device of claim 3, wherein the protective cover is a protective cover of a non-conductive material.
6. The electronic device of claim 5, wherein the first antenna unit is disposed on a first surface of the antenna substrate, a second metal layer is disposed on a second surface of the antenna substrate, and the second metal layer is grounded;
wherein the first surface is disposed opposite the second surface.
7. The electronic device of claim 6, wherein the second surface of the antenna substrate is further provided with a second antenna element, the second antenna element being spaced from the second metal layer.
8. The electronic device of claim 5, wherein the first antenna unit is disposed on a first surface of the antenna substrate, the first surface of the antenna substrate further including a third antenna unit, the third antenna unit including a clearance area;
the first antenna unit is located in the clearance area, and a space exists between the first antenna unit and the third antenna unit.
9. The electronic device of claim 1, wherein the first antenna element is a millimeter wave antenna.
10. The electronic device of claim 1, wherein the number of first vias is a plurality and the number of first antenna elements is a plurality;
the first antenna units are arranged corresponding to the first through holes, and the first through holes are arranged in an array.
CN202110178045.8A 2021-02-09 2021-02-09 Electronic equipment Active CN112995375B (en)

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Application Number Priority Date Filing Date Title
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CN112995375B true CN112995375B (en) 2023-07-11

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Citations (4)

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Publication number Priority date Publication date Assignee Title
CN111525238A (en) * 2020-04-30 2020-08-11 维沃移动通信有限公司 Electronic equipment
CN211556118U (en) * 2020-02-20 2020-09-22 Oppo广东移动通信有限公司 Electronic device
CN112117524A (en) * 2020-09-22 2020-12-22 维沃移动通信有限公司 Electronic equipment
KR20210004805A (en) * 2019-07-05 2021-01-13 코닝 인코포레이티드 Communication device and portable terminal

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Publication number Priority date Publication date Assignee Title
US20130222613A1 (en) * 2012-02-24 2013-08-29 Wilocity, Ltd. Webcam module having a millimeter-wave receiver and transmitter
CN204614924U (en) * 2015-03-10 2015-09-02 上海艺时网络科技有限公司 Near-field communication aerial assembly and wireless terminal
CN208433997U (en) * 2018-06-04 2019-01-25 Oppo广东移动通信有限公司 Display screen component and electronic equipment
CN111725605B (en) * 2019-03-20 2022-03-15 Oppo广东移动通信有限公司 Millimeter wave module and electronic equipment

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Publication number Priority date Publication date Assignee Title
KR20210004805A (en) * 2019-07-05 2021-01-13 코닝 인코포레이티드 Communication device and portable terminal
CN211556118U (en) * 2020-02-20 2020-09-22 Oppo广东移动通信有限公司 Electronic device
CN111525238A (en) * 2020-04-30 2020-08-11 维沃移动通信有限公司 Electronic equipment
CN112117524A (en) * 2020-09-22 2020-12-22 维沃移动通信有限公司 Electronic equipment

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