CN112993066B - Refrigeration system for photoelectric device and manufacturing method thereof - Google Patents
Refrigeration system for photoelectric device and manufacturing method thereof Download PDFInfo
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 71
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000000919 ceramic Substances 0.000 claims abstract description 99
- 239000000758 substrate Substances 0.000 claims abstract description 97
- 239000013078 crystal Substances 0.000 claims abstract description 66
- 229910052802 copper Inorganic materials 0.000 claims abstract description 62
- 239000010949 copper Substances 0.000 claims abstract description 62
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 61
- 238000000034 method Methods 0.000 claims abstract description 14
- 238000009826 distribution Methods 0.000 claims abstract description 10
- 230000005693 optoelectronics Effects 0.000 claims description 33
- 238000003825 pressing Methods 0.000 claims description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 21
- 229910052782 aluminium Inorganic materials 0.000 claims description 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 14
- 238000003491 array Methods 0.000 claims description 12
- 238000012545 processing Methods 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 7
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- 239000011248 coating agent Substances 0.000 claims description 3
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- 239000002131 composite material Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- 238000012163 sequencing technique Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
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- 238000010438 heat treatment Methods 0.000 description 1
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- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
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- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
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- H01L31/02—Details
- H01L31/024—Arrangements for cooling, heating, ventilating or temperature compensation
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/041—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00
- H01L25/042—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00 the devices being arranged next to each other
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- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
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Abstract
The invention discloses a refrigeration system for photoelectric devices, which comprises a refrigeration device and a plurality of photoelectric devices, wherein a first refrigeration module to a second refrigeration module are sequentially arranged together from top to bottom, the first refrigeration module comprises a first crystal grain array and a heat sink, the first crystal grain array is fixedly arranged on the lower surface of the heat sink through a copper electrode array arranged on the lower surface of the heat sink, the first crystal grain array and the heat sink are integrally formed, the distribution state of the first crystal grain array is consistent with that of the copper electrode array, the second refrigeration module comprises a first ceramic substrate and a second crystal grain array, and the like, the Nth refrigeration module comprises an Nth ceramic substrate, an Nth crystal grain array and an Nth ceramic substrate, wherein the Nth crystal grain array is fixedly arranged between the Nth ceramic substrate and the Nth ceramic substrate, so that the refrigeration effect of the refrigeration device is improved, Stability and applicability. In addition, the invention also discloses a method for manufacturing the refrigerating device for the photoelectric device.
Description
Technical Field
The invention relates to the field of quantum communication, in particular to a refrigerating system for a photoelectric device and a manufacturing method thereof.
Background
In the field of quantum communication, a thermoelectric Cooler (TEC for short) is often used TO reduce the temperature of a photoelectric device (such as a single-photon detector) during operation, and such devices are mostly in a Transistor outline package (TO for short), so the devices are collectively referred TO as TO photoelectric devices.
Since the performance of the TO photoelectric device has a large relationship with the ambient temperature, the lower the temperature, the better the performance. Therefore, the temperature of the TO photoelectric device during working needs TO be detected in real time, the temperature of the TO photoelectric device during working needs TO be regulated and controlled in real time according TO the detected temperature, and when the temperature of the TO photoelectric device during working exceeds a certain numerical value, the TO photoelectric device is refrigerated, so that the TO photoelectric device is guaranteed TO maintain a stable working state.
As shown in fig. 1, currently, a ceramic heat sink and a ceramic substrate of a thermoelectric cooler TEC are generally sintered into a whole TO refrigerate a TO optoelectronic device, but the solution has the following defects:
(1) the manufacturing process is complex, the productivity is low, the yield is poor due TO the limitation of processing equipment, and the heat conduction effect is poor due TO the low heat conductivity coefficient of the ceramic medium, so that the refrigeration effect on the TO photoelectric device is poor;
(2) the TO photoelectric devices in the existing market are more in specification and model, and more types of pipe clamps and heat sinks are needed for refrigerating the TO photoelectric devices, so that the cost is high, and the applicability is not strong.
Therefore, how to provide a refrigeration system for photoelectric devices with strong stability, strong applicability and good refrigeration effect becomes a problem to be solved urgently.
Disclosure of Invention
The embodiment of the invention provides a refrigeration system for a photoelectric device and a manufacturing method thereof, which are used for solving the defects of poor refrigeration effect, poor stability and poor applicability in the prior art.
In order to achieve the above object, in a first aspect, embodiments of the present invention provide a refrigeration system for optoelectronic devices, including a refrigeration apparatus and a plurality of optoelectronic devices, where the refrigeration apparatus includes N refrigeration modules, N is a natural number greater than 2,
the first refrigeration module to the Nth refrigeration module are sequentially arranged together from top to bottom.
The first refrigeration module comprises a first crystal grain array and a heat sink, wherein the first crystal grain array is fixedly arranged on the lower surface of the heat sink through a copper electrode array arranged on the lower surface of the heat sink.
The first die array is integrally formed with the heat sink.
The distribution state of the first crystal grain array is consistent with the distribution state of the copper electrode array.
The second refrigeration module comprises a first ceramic substrate and a second crystal grain array, wherein the second crystal grain array is fixedly arranged on the lower surface of the first ceramic substrate.
By analogy, the Nth refrigeration module comprises an Nth-1 ceramic substrate, an Nth crystal grain array and an Nth ceramic substrate, wherein the Nth crystal grain array is fixedly arranged between the Nth-1 ceramic substrate and the Nth ceramic substrate.
As a preferred embodiment of the present invention, a plurality of hollow and mutually symmetrical clamping holes are arranged inside the heat sink, and a plurality of optoelectronic devices are respectively placed in the plurality of clamping holes and are in close contact with the heat sink, wherein one clamping hole corresponds to one optoelectronic device.
As a preferred embodiment of the present invention, elastic pressing blocks formed by wire cutting are disposed on inner surfaces of the plurality of clamping holes, wherein one end of each elastic pressing block is fixedly disposed on an inner surface corresponding to one clamping hole, and one elastic pressing block corresponds to one clamping hole.
As a preferred embodiment of the present invention, the electronic device further includes a plurality of screws, wherein each of the screws respectively fixes a corresponding optoelectronic device through a plurality of threaded holes provided on an outer surface of the heat sink and an elastic pressing block corresponding to the threaded holes, and one elastic pressing block corresponds to at least one threaded hole.
As a preferred embodiment of the present invention, the heat sink is made of aluminum.
As a preferred embodiment of the present invention, each of the refrigeration modules is a thermoelectric refrigerator TEC.
As a preferred embodiment of the present invention, each of said optoelectronic devices is a transistor outline TO optoelectronic device.
In a second aspect, an embodiment of the present invention provides a manufacturing method for a refrigeration system for optoelectronic devices disclosed in the first aspect, including the following steps:
s101, selecting a plurality of ceramic substrates with different areas as required, and sequencing the ceramic substrates according to the sequence of the areas from small to large to obtain N ceramic substrates, wherein the N ceramic substrates comprise a first ceramic substrate and a second ceramic substrate … Nth ceramic substrate, and N is a natural number greater than 2;
s102, respectively arranging copper electrode arrays on the surface area parts of the ceramic substrates and covering a layer of tin on the surface of each copper sheet of each copper electrode array;
s103, selecting an aluminum block blank, and processing the surface of the aluminum block blank by adopting a turning and milling composite processing means until the smoothness of the surface of the aluminum block blank meets a preset requirement to obtain a heat sink;
s104, arranging an array copper electrode array manufactured by adopting a PCB manufacturing process on the area part of the bottom surface of the heat sink, and covering a layer of tin on the surface of the copper electrode array;
s105, connecting the heat sink with one end of the first crystal grain array through the copper electrode array on the bottom surface of the heat sink;
s106, connecting the other end of the first crystal grain array with the upper surface of the first ceramic substrate through a copper electrode array preset on the upper surface of the first ceramic substrate;
s107, connecting the lower surface of the first ceramic substrate with one end of a second crystal grain array through a copper electrode array preset on the lower surface of the first ceramic substrate;
s108, connecting the other end of the second crystal grain array with the upper surface of the second ceramic substrate through a copper electrode array preset on the upper surface of the second ceramic substrate;
s109, repeating the steps S107-S108 until all the ceramic substrates are used up, and forming a tower-shaped refrigeration device;
s1010, fixing the refrigerating device by using a clamping device, loading the refrigerating device into a welding furnace together with a tool for soldering, cooling the molten tin paste layer, recovering the furnace to be cooled to normal temperature, and unloading the refrigerating device with the tower-shaped structure from the tool;
s1011, welding an electrode lead to the refrigerating device with the tower-shaped structure, and testing the conductivity of the refrigerating device by using a universal meter;
s1012, after the TO photoelectric device is arranged in a preset holding hole in a heat sink, and a temperature detector with the surface coated with heat conducting glue is arranged in a preset temperature control detection hole in the heat sink, the refrigerating device is horizontally placed in a normal temperature environment within a preset time period TO solidify the heat conducting glue on the surface of the temperature detector, and a refrigerating system for the TO photoelectric device is formed.
As a preferred embodiment of the present invention, after step S103, the method further comprises:
and a plurality of hollow and mutually symmetrical clamping holes are arranged in the heat sink.
As a preferred embodiment of the present invention, after step S103, the method further comprises:
and a plurality of threaded holes are arranged on the outer surface of the heat sink.
As a preferred embodiment of the present invention, after a plurality of hollow and mutually symmetrical clamping holes are provided inside the heat sink, the method further includes:
and a plurality of elastic jacking blocks are formed by respectively performing linear cutting on the inner surfaces of the clamping holes, wherein each elastic jacking block is respectively arranged in the corresponding clamping hole, one end of each elastic jacking block is respectively and fixedly arranged on the inner surface of the corresponding clamping hole, and one elastic jacking block corresponds to one clamping hole.
The refrigeration system for the photoelectric device and the manufacturing method thereof provided by the embodiment of the invention have the following beneficial effects:
(1) the heat sink and the crystal grain array of the thermoelectric refrigerator TEC are directly connected together, so that the heat sink and the crystal grain array of the thermoelectric refrigerator TEC are integrally formed, the refrigerating capacity generated by the thermoelectric refrigerator TEC is directly transmitted to the heat sink through the copper electrode array, and the refrigerating effect is improved;
(2) by arranging the elastic top pressing block, the TO photoelectric device is prevented from being separated from the heat sink, and the stability is improved;
(3) by adopting the aluminum heat sink, the process manufacturing flow is simplified, the cost is reduced, the large-scale mass production is easy, and the applicability is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, a brief description will be given below of the drawings required for the embodiments or the technical solutions in the prior art, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic perspective view of a prior art refrigeration system for photovoltaic devices;
FIG. 2 is a schematic plan view of a refrigeration system for photovoltaic devices according to an embodiment of the present invention;
fig. 3 is a schematic perspective view of a refrigeration system for optoelectronic devices according to an embodiment of the present invention;
FIG. 4 is an exploded view of a refrigeration system for a photovoltaic device according to an embodiment of the present invention;
fig. 5 is a schematic plan view of a copper electrode array of a refrigeration system for optoelectronic devices according to an embodiment of the present invention.
Reference numerals:
1-heat sink, 2-first crystal grain array, 3-elastic top pressing block, 4-holding hole, 5-first ceramic substrate, 6-second ceramic substrate, 7-second crystal grain array, 8-third ceramic substrate, 9-third crystal grain array, 10-columnar through hole and 11-copper electrode array.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
The following describes a refrigeration system for optoelectronic devices provided by an embodiment of the present invention:
as a specific embodiment of the present invention, as shown in fig. 2, a refrigeration system for an optoelectronic device according to an embodiment of the present invention includes: heat sink 1, first crystalline grain array 2, elasticity top briquetting 3, add hold hole 4, first ceramic substrate 5, second ceramic substrate 6, second crystalline grain array 7, third ceramic substrate 8, third crystalline grain array 9, columnar through-hole 10 (temperature detection hole), wherein:
the heat sink 1 and the first crystal grain array 2 form a first layer of thermoelectric cooler TEC.
The first ceramic substrate 5 and the second crystal grain array 7 form a second layer of thermoelectric cooler TEC.
The second ceramic substrate 6, the third grain array 9 and the third ceramic substrate 8 form a third layer of thermoelectric cooler TEC.
The first die array 2 is fixedly disposed on the lower surface of the heat sink 1 through the copper electrode array 11 disposed on the lower surface of the heat sink 1, and the first die array 2 and the copper electrode array 11 may be fixedly connected by welding (e.g., soldering), or may be fixedly connected by other methods.
In particular, the number of layers of the TEC in the refrigeration system for optoelectronic devices provided by the embodiment of the present invention is generally four to five, but the present invention is not limited to this.
The first layer of thermoelectric cooler TEC, the second layer of thermoelectric cooler TEC and the third layer of thermoelectric cooler TEC are sequentially arranged from top to bottom.
The distribution state of the first crystal grain array 2 is consistent with the distribution state of the copper electrode array 11 arranged on the lower surface of the heat sink 1, and the first crystal grain array 2 and the heat sink 1 are integrally formed. Further, the copper electrode array 11 is manufactured by using a PCB process (copper-clad method). The distribution of the copper electrode array 11 is shown in fig. 5.
The second crystal grain array 7 is fixedly disposed on the lower surface of the first ceramic substrate 5.
The third grain array 9 is fixedly arranged between the second ceramic substrate 6 and the third ceramic substrate 8.
The upper surface and the lower surface of the first ceramic substrate 5 and the upper surface and the lower surface of the second ceramic substrate 6 are both provided with copper electrode arrays, wherein the copper electrode arrays arranged on the surfaces of the ceramic substrates can be generated in a copper plating mode, and the crystal grain arrays and the ceramic substrates can be fixedly connected in a welding (such as tin soldering) mode or in other modes.
As an alternative embodiment of the present invention, further, two clamping holes 4 are hollow and symmetrically disposed in the heat sink 1, and two TO photoelectric devices are disposed in the heat sink 1 through the two clamping holes 4.
The number of the holding holes 4 can be increased or decreased according TO actual needs, and one TO photoelectric device is placed in one holding hole 4.
As an alternative embodiment of the present invention, further, the refrigeration system for optoelectronic devices provided by the present invention further includes two elastic pressing top blocks 3, the two elastic pressing top blocks 3 are symmetrically disposed in the two holding holes 4, and one end of each of the two elastic pressing top blocks 3 is respectively and fixedly disposed on the inner surface of the two holding holes 4.
As an optional embodiment of the present invention, further, the refrigeration system for optoelectronic devices provided in the embodiment of the present invention further includes screws, where the screws respectively fix each transistor outline TO optoelectronic device through two threaded holes symmetrically disposed on the outer surface of the heat sink 1 and the elastic top pressing block 3.
As an optional embodiment of the present invention, further, the refrigeration system for an optoelectronic device provided in the embodiment of the present invention further includes a temperature detector, which is disposed in the column-shaped through hole 10 preset in the heat sink 1 and is in close contact with the heat sink 1. The columnar through hole 10 may be hollow or non-hollow.
As a specific embodiment of the present invention, the temperature detector is a platinum resistor, which is called platinum resistor for short, wherein the resistance of the platinum resistor changes with the temperature change.
Wherein, the two ends of the temperature detector and the inner surface of the columnar through hole 10 are coated with heat-conducting glue to improve the sensitivity of the temperature detector.
As an alternative embodiment of the present invention, further, the material of the heat sink 1 is aluminum.
Firstly, the surface of the copper heat sink is not suitable for arranging the copper electrode array due to the strong conductivity of copper, and the surface of the aluminum heat sink can be provided with the copper electrode array by carrying out oxidation treatment on the surface of the aluminum heat sink; secondly, as the heat conductivity coefficient of copper is 383.8W/m.K, and the heat conductivity coefficient of aluminum is 202W/m.K, for the heat sink with the same volume, the temperature is reduced by 1 degree, the refrigerating capacity required TO be absorbed by the copper heat sink is 40% more than that of the aluminum heat sink, the size of the inner diameter of the holding hole in the aluminum heat sink can be changed through simple processing, and the aluminum heat sink is suitable for clamping TO photoelectric devices with different specifications and models and is compared with the combination of the traditional aluminum oxide ceramic plate and the copper heat sink, so the aluminum heat sink is preferably used. Compared with a copper heat sink, the temperature controllability of the aluminum heat sink is better, the TO photoelectric device is easily refrigerated efficiently and accurately, and the applicability is stronger.
The bottom surface of the heat sink 1 is connected with the cold surface of the first crystal grain array 2 in a soldering mode, the hot surface of the second crystal grain array 7 is connected with the first ceramic substrate 5 in a soldering mode, and the hot surface of the third crystal grain array 9 is connected with the second ceramic substrate 6 in a soldering mode.
As a specific example of the present invention, as shown in fig. 2, the first ceramic substrate 5, the second ceramic substrate 6, and the third ceramic substrate 8 are all square, and the areas of the first ceramic substrate 5, the second ceramic substrate 6, and the third ceramic substrate 8 are sequentially increased. The refrigeration system for the photoelectric device provided by the embodiment of the invention is pyramid-shaped and comprises a plurality of ceramic substrates which are arranged in parallel, and crystal grain arrays are welded among the ceramic substrates. The connection part of the ceramic substrate and the crystal grain array is metalized. Specifically, the surface of the joint of each ceramic substrate and the corresponding crystal grain array is provided with a copper electrode array 11, and the positions of the copper sheets of the copper electrode array 11 correspond to the positions of the crystal grains of the crystal grain array one by one.
As an alternative embodiment of the present invention, as shown in fig. 2, two clamping holes 4 are symmetrically arranged on both sides of the longitudinal axis of the heat sink 1, and the inner diameters of the two clamping holes 4 are matched with the inner diameter of the TO photoelectric device in the shape of the transistor, so that the TO photoelectric device in the shape of the transistor and the heat sink 1 are kept in close contact.
As an alternative embodiment of the present invention, as shown in fig. 2, the elastic pressing blocks 3 are symmetrically disposed on two sides of the longitudinal axis of the heat sink 1, and the elastic pressing blocks 3 can be pressed or extended along with the change of temperature, so as TO cause the inner diameter of the clamping hole 4 TO be reduced or increased, so that the transistor outline TO optoelectronic device is not affected by the change of temperature, and the transistor outline TO optoelectronic device is kept in close contact with the heat sink 1.
As an alternative embodiment of the present invention, as shown in fig. 2, the elastic constant pressure device 3 is located obliquely above the holding hole 4 and near the outer surface of the heat sink 1.
As an alternative embodiment of the present invention, two threaded holes are axisymmetrically formed in the side surface of the heat sink 1, and the threaded holes are used in cooperation with the elastic pressing block 3.
Specifically, a screw can penetrate through the outer surface of the heat sink 1 and is in contact with the elastic pressing block 3 through a threaded hole, so that the screw can be matched with the clamping hole 4 TO ensure that the TO photoelectric device in the transistor outline is kept in a close contact state with the heat sink 1.
As an alternative embodiment of the present invention, the columnar through hole 10 is disposed on the axis of the heat sink 1, and its shape and inner diameter are matched with the temperature detector, so that the temperature detector and the heat sink 1 are kept in close contact.
The following provides a brief description of a method for fabricating a refrigeration system for optoelectronic devices according to embodiments of the present invention:
and step 12, placing the TO photoelectric device in the shape of the transistor into a preset holding hole in a heat sink, placing a temperature detector with the surface coated with heat-conducting glue into a preset temperature-control detection hole in the heat sink, and horizontally placing the refrigerating device for a period of time (2 hours) in a normal-temperature environment TO solidify the heat-conducting glue on the surface of the temperature detector, so as TO form a refrigerating system for the photoelectric device.
The technical solution involved in the refrigeration system for optoelectronic devices provided by the embodiment of the present invention is further described with reference to fig. 2.
The TO photoelectric device is placed in the clamping hole 4, nuts are screwed into the two threaded holes 7 respectively TO make up for device adaptation errors caused by machining tolerance or thermal deformation, the TO photoelectric device in the transistor shape is locked and fixed, and the stability of the refrigerating device is improved.
When the temperature of the TO photoelectric device rises during working, the heat sink 1 is heated TO expand, and the elastic top pressing block 3 also expands TO accommodate the TO photoelectric device which slightly expands after heating; when the temperature of the TO photoelectric device is reduced during working, the heat sink 1 is cooled TO shrink, the elastic top pressing block 6 also shrinks along with the heat sink, the temperature detector is ensured TO be in close contact with the heat sink, and the stability of the refrigerating device is improved.
The refrigeration system for the photoelectric device comprises a refrigeration device and a plurality of photoelectric devices, wherein the plurality of refrigeration modules comprise N refrigeration modules, N is a natural number larger than 2, the first refrigeration module to the N refrigeration modules are sequentially placed together from top to bottom, the first refrigeration module comprises a first crystal grain array and a heat sink, the first crystal grain array is fixedly arranged on the lower surface of the heat sink through a copper electrode array arranged on the lower surface of the heat sink, the first crystal grain array and the heat sink are integrally formed, the distribution state of the first crystal grain array is consistent with the distribution state of the first crystal grain array, the second refrigeration module comprises a first ceramic substrate and a second crystal grain array, the second crystal grain array is fixedly arranged on the lower surface of the first ceramic substrate, and the like, the Nth refrigeration module comprises an Nth ceramic substrate, an Nth crystal grain array, a second ceramic substrate, a third crystal grain array and a fourth crystal grain array, The N-th ceramic substrate is fixedly arranged between the N-1-th ceramic substrate and the N-th ceramic substrate, so that the refrigerating effect, the stability and the applicability of the refrigerating device are improved.
It will be appreciated that the relevant features of the method and apparatus described above are referred to one another. In addition, "first", "second", and the like in the above embodiments are for distinguishing the embodiments, and do not represent merits of the embodiments.
The above are merely examples of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
It should be noted that the above-mentioned embodiments do not limit the present invention in any way, and all technical solutions obtained by using equivalent alternatives or equivalent variations fall within the protection scope of the present invention.
Claims (11)
1. A refrigeration system for optoelectronic devices, comprising a refrigeration device and a plurality of optoelectronic devices, wherein the refrigeration device comprises N refrigeration modules, N being a natural number greater than 2, characterized in that:
the first to Nth refrigeration modules are sequentially arranged together from top to bottom;
the first refrigeration module comprises a first crystal grain array (2) and a heat sink (1), wherein the first crystal grain array (2) is fixedly arranged on the lower surface of the heat sink (1) through a copper electrode array (11) arranged on the lower surface of the heat sink (1), and a layer of tin is coated on the surface of the copper electrode array (11);
the first crystal grain array (2) and the heat sink (1) are integrally formed;
the distribution state of the first crystal grain array (2) is consistent with the distribution state of the copper electrode array (11);
the second refrigeration module comprises a first ceramic substrate (5) and a second crystal grain array (7), wherein the second crystal grain array (7) is fixedly arranged on the lower surface of the first ceramic substrate (5);
by analogy, the Nth refrigeration module comprises an Nth-1 ceramic substrate, an Nth crystal grain array and an Nth ceramic substrate, wherein the Nth crystal grain array is fixedly arranged between the Nth-1 ceramic substrate and the Nth ceramic substrate;
copper electrode arrays (11) are arranged on the surfaces of the connecting parts of the ceramic substrates and the corresponding crystal grain arrays, the positions of copper sheets of the copper electrode arrays correspond to the positions of crystal grains of the crystal grain arrays one by one, and a layer of tin is coated on the surfaces of the copper sheets of the copper electrode arrays (11).
2. A refrigerating system for photoelectric devices as claimed in claim 1, wherein the heat sink (1) is internally provided with a plurality of hollow and mutually symmetrical clamping holes (4), a plurality of photoelectric devices are respectively arranged in the plurality of clamping holes (4) and are in close contact with the heat sink (1), and one clamping hole (4) corresponds to one photoelectric device.
3. The refrigerating system for the photoelectric device according to claim 2, wherein a plurality of the holding holes are provided on the inner surface thereof with elastic pressing blocks (3) formed by wire cutting, wherein one end of each of the elastic pressing blocks (3) is fixedly provided on the inner surface of the corresponding holding hole (4), and wherein one elastic pressing block (3) corresponds to one holding hole (4).
4. A refrigeration system for photoelectric devices according to claim 3, further comprising a plurality of screws, wherein each screw is used for fixing the corresponding photoelectric device through a plurality of threaded holes arranged on the outer surface of the heat sink (1) and the elastic pressing block (3) corresponding to the threaded holes, and one elastic pressing block (3) corresponds to at least one threaded hole.
5. A refrigeration system for optoelectronic devices according to claim 1, wherein the heat sink (1) is made of aluminum.
6. The refrigeration system for optoelectronic devices as set forth in claim 1, wherein each of said refrigeration modules is a thermoelectric cooler TEC.
7. A refrigeration system for optoelectronic devices as claimed in claim 1, wherein each of said optoelectronic devices is a transistor outline TO optoelectronic device.
8. A method of manufacturing a refrigeration system for optoelectronic devices according to any one of claims 1 to 7, comprising the steps of:
s101, selecting a plurality of ceramic substrates with different areas as required, and sequencing the ceramic substrates according to the sequence of the areas from small to large to obtain N ceramic substrates, wherein the N ceramic substrates comprise a first ceramic substrate (5) and a second ceramic substrate (6) … Nth ceramic substrate, and N is a natural number greater than 2;
s102, respectively arranging copper electrode arrays (11) in the area parts of the surfaces of the ceramic substrates, and coating a layer of tin on the surface of each copper sheet of each copper electrode array (11);
s103, selecting an aluminum block blank, and processing the surface of the aluminum block blank by adopting a turning and milling composite processing means until the smoothness of the surface of the aluminum block blank meets a preset requirement to obtain a heat sink (1);
s104, arranging an array copper electrode array (11) manufactured by adopting a PCB manufacturing process on the area part of the bottom surface of the heat sink (1), and coating a layer of tin on the surface of the copper electrode array (11);
s105, connecting the heat sink (1) with one end of the first crystal grain array (2) through the copper electrode array (11) on the bottom surface of the heat sink (1);
s106, connecting the other end of the first crystal grain array (2) with the upper surface of the first ceramic substrate (5) through a copper electrode array (11) preset on the upper surface of the first ceramic substrate (5);
s107, connecting the lower surface of the first ceramic substrate (5) with one end of a second crystal grain array (7) through a copper electrode array (11) preset on the lower surface of the first ceramic substrate (5);
s108, connecting the other end of the second crystal grain array with the upper surface of the second ceramic substrate (6) through a copper electrode array (11) preset on the upper surface of the second ceramic substrate (6);
s109, repeating the steps S107-S108 until all the ceramic substrates are used up, and forming a tower-shaped refrigeration device;
s1010, fixing the refrigerating device by using a clamping device, loading the refrigerating device into a welding furnace together with a tool for soldering, cooling the molten tin paste layer, recovering the furnace to be cooled to normal temperature, and unloading the refrigerating device with the tower-shaped structure from the tool;
s1011, welding an electrode lead to the refrigerating device with the tower-shaped structure, and testing the conductivity of the refrigerating device by using a universal meter;
s1012, after the photoelectric device is arranged in a clamping hole (4) which is preset in the heat sink (1), and the temperature detector with the surface coated with the heat-conducting glue is arranged in a temperature control detection hole which is preset in the heat sink (1), the refrigerating device is horizontally placed in a normal temperature environment within a preset time period to solidify the heat-conducting glue on the surface of the temperature detector, and a refrigerating system for the photoelectric device is formed.
9. The method of fabricating a refrigeration system for optoelectronic devices as set forth in claim 8, wherein after step S103, the method further includes:
a plurality of hollow and mutually symmetrical clamping holes (4) are arranged in the heat sink (1).
10. The method of fabricating a refrigeration system for optoelectronic devices as set forth in claim 8, wherein after step S103, the method further includes:
and a plurality of threaded holes are arranged on the outer surface of the heat sink (1).
11. The method for making a refrigeration system for optoelectronic devices according to claim 9, characterized in that, after providing a plurality of hollow and mutually symmetrical clamping holes (4) inside said heat sink (1), said method further comprises:
the elastic jacking blocks (3) are formed by respectively performing linear cutting on the inner surfaces of the clamping holes, wherein each elastic jacking block (3) is respectively arranged in the corresponding clamping hole (4), one end of each elastic jacking block (3) is respectively and fixedly arranged on the inner surface of the corresponding clamping hole (4), and one elastic jacking block (3) corresponds to one clamping hole (4).
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106024732A (en) * | 2016-05-31 | 2016-10-12 | 科大国盾量子技术股份有限公司 | Device for temperature control and manufacturing method of device |
| CN205645796U (en) * | 2016-05-31 | 2016-10-12 | 科大国盾量子技术股份有限公司 | A device for control by temperature change |
| CN207458923U (en) * | 2017-11-23 | 2018-06-05 | 科大国盾量子技术股份有限公司 | A kind of diode pipe clamp and temperature control device applied to quantum communications equipment |
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| JP4858538B2 (en) * | 2006-02-14 | 2012-01-18 | 株式会社村田製作所 | Multilayer ceramic electronic component, multilayer ceramic substrate, and method of manufacturing multilayer ceramic electronic component |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106024732A (en) * | 2016-05-31 | 2016-10-12 | 科大国盾量子技术股份有限公司 | Device for temperature control and manufacturing method of device |
| CN205645796U (en) * | 2016-05-31 | 2016-10-12 | 科大国盾量子技术股份有限公司 | A device for control by temperature change |
| CN207458923U (en) * | 2017-11-23 | 2018-06-05 | 科大国盾量子技术股份有限公司 | A kind of diode pipe clamp and temperature control device applied to quantum communications equipment |
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