CN112992425A - Preparation method of copper-based composite electric contact material with gradient structure - Google Patents

Preparation method of copper-based composite electric contact material with gradient structure Download PDF

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CN112992425A
CN112992425A CN202110202469.3A CN202110202469A CN112992425A CN 112992425 A CN112992425 A CN 112992425A CN 202110202469 A CN202110202469 A CN 202110202469A CN 112992425 A CN112992425 A CN 112992425A
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target
sputtering
matrix
copper
power supply
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CN112992425B (en
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王鲁宁
汤德林
王肇飞
崔华春
宋涛
林才
曲德猛
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Yantai Wanlong Vacuum Metallurgy Co ltd
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Yantai Wanlong Vacuum Metallurgy Co ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/048Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by powder-metallurgical processes

Abstract

The invention discloses a preparation method of a copper-based composite electric contact material with a gradient structure, which comprises the steps of pretreatment of a substrate, sputtering copper plating treatment, reactive co-sputtering treatment and the like. The invention prepares the Cu/TiN/Ni-Cu-Re composite coating on the QTi3.5 surface by utilizing the magnetron sputtering method, and the TiN coating with good chemical stability and conductivity and the Ni-Cu-Re particles with good self-lubricating property are combined to obtain the wear-resistant composite coating with controllable thickness and good conductivity, and simultaneously the excellent performance of the QTi3.5 substrate is kept, and the interface stress between different coatings is effectively slowed down by preparing the pure copper transition coating, the binding force between the coating and the substrate and between different coatings is improved, and the electric contact material with good comprehensive performance is obtained, thereby improving the service life of the electric contact material.

Description

Preparation method of copper-based composite electric contact material with gradient structure
Technical Field
The invention relates to a gradient composite coating material, in particular to a preparation method of a copper-based composite electric contact material with a gradient structure.
Background
The electric contact material is often used under the interaction of electricity, heat, force and different environments, and due to different contact loads, different contact forms and different use environments, when the performance is insufficient, the problem of electric contact failure is easy to occur, so that a major accident or disaster is caused, and a high requirement is put forward on the use reliability of the electric contact material.
Titanium bronze is a copper alloy made of pure copper with the addition of titanium and the like, and the material has high strength, high hardness, excellent wear resistance, fatigue resistance, corrosion resistance and heat resistance. The titanium bronze also has the advantages of no spark during impact, no magnetism and high elasticity limit, and can be used for manufacturing various elements with high strength, high elasticity and high wear resistance. On the other hand, the titanium element is widely distributed, the content of the titanium element exceeds 0.4 percent of the crust quality, and the part prepared by adopting the titanium bronze can replace Cu-Be alloy in the field of high strength and high elasticity, thereby improving the labor environment, saving the use of beryllium cobalt strategic resources and creating economic benefits for society and enterprises. The prior methods for preparing conductive elastic components such as titanium copper alloy wires, titanium copper alloy rods and titanium copper alloy belts describe a process for obtaining high-conductivity and high-elasticity components by using different raw materials and combining vacuum smelting and plastic deformation processing with a subsequent heat treatment process.
Titanium nitride is a material with many excellent properties, such as low coefficient of friction, high hardness (coating hardness up to 2200HV), good corrosion and wear resistance, and good thermal and electrical conductivity. On the other hand, titanium nitride has better chemical stability, generally does not react with water, water vapor, hydrochloric acid, sulfuric acid and the like, and can be stably used in a fretting contact corrosion environment. According to the research results of the predecessors, the Ni-Cu-Re alloy can generate a self-generated lubricating film during friction so as to play a role in lubricating and reducing friction, and the Ni-Cu-Re alloy containing Re and Cu forms a composite compound containing Re and Cu during friction, and has the performance characteristics of low melting point, small hardness and easiness in shearing. In the friction process, because a lubricating interface film formed by a compound containing Re and Cu exists at the friction interface, the friction coefficient is maintained at a lower value, and the formation and the loss of the lubricating film belong to dynamic processes, so that the lubricating film has a self-repairing function and effectively slows down the loss of materials in the friction environment.
Disclosure of Invention
Aiming at the problems, the invention provides a preparation method of a copper-based composite electric contact material with a gradient structure, which comprises the following steps:
(1) carrying out mechanical polishing treatment on the QTi3.5 matrix and sequentially carrying out ultrasonic cleaning in an acetone solution and an absolute ethyl alcohol solution;
(2) placing the QTi3.5 matrix pretreated in the step (1) on the top of a closed vacuum cavity, placing zirconia balls at the bottom of the closed vacuum cavity, and mechanically grinding the QTi3.5 matrix;
(3) putting the QTi3.5 matrix treated in the step (2) into an acetone solution for ultrasonic cleaning, and then putting the cleaned matrix into a mixed acid solution for cleaning;
(4) clamping the QTi3.5 matrix processed in the step (3) on a sample table of a magnetron co-sputtering system, and adjusting the included angles and the distances between the center of the QTi3.5 matrix and the centers of the surfaces of an industrial pure titanium TA1 target, an industrial pure copper T1 target and a Ni-Cu-Re target to be equal;
(5) a three-target magnetron sputtering system is adopted, a sputtering chamber is vacuumized, a heating power supply is turned on to heat a sample platform to start heating, a control valve is turned on to fill argon, a copper target direct current power supply is turned on to carry out sputtering treatment on a copper target with the purity not lower than 99.95 wt%, and a pure copper transition coating is formed on the surface of a QTi3.5 matrix;
(6) closing an industrial pure copper T1 target direct current power supply and an upper baffle, closing a QTi3.5 substrate sample table baffle device, opening an industrial pure titanium TA1 target and an upper baffle of a Ni-Cu-Re target, adjusting argon pressure, opening an industrial pure titanium TA1 target radio frequency power supply and a Ni-Cu-Re target radio frequency power supply, adjusting the power of an industrial pure titanium TA1 target radio frequency power supply and the power of a Ni-Cu-Re target radio frequency power supply, carrying out sputtering cleaning, opening a valve to fill nitrogen, opening a QTi3.5 substrate sample table baffle device, adjusting the power of an industrial pure titanium TA1 target radio frequency power supply and the power of a Ni-Cu-Re target radio frequency power supply, carrying out reactive co-sputtering, and preparing a QTi3.5/Cu/TiN/Ni-Cu-Re composite coating;
(7) and (4) placing the QTi3.5/Cu/TiN/Ni-Cu-Re gradient composite coating prepared in the step (6) in a vacuum furnace for annealing treatment to obtain the QTi3.5/Cu/TiN/Ni-Cu-Re gradient composite coating.
The method can prepare the copper-based composite electric contact material with excellent performance by accurately controlling the process parameters, and specifically controls the process parameters such as time, temperature, size, efficiency and the like as follows:
in the step (1), ultrasonic cleaning is carried out in an acetone solution for 10-15min, and ultrasonic cleaning is carried out in an absolute ethyl alcohol solution for 5-10 min; in the step (2), the surface mechanical grinding treatment time is 20-60 min; in the step (3), the QTi3.5 matrix is ultrasonically cleaned in an acetone solution for 10-15min and in a mixed acid solution for 5-10s, and the mass ratio of the mixed acid cleaning solution is H2SO4:HNO3The ultrapure water is 5:3: 2; in the step (5), the sputtering treatment time is 3-5 min; in the step (6), the sputtering cleaning time is 8-15min, and the reaction co-sputtering time is 40-80 min; in the step (7), the annealing time is 90-150 min.
In the step (2), the number of the zirconia balls is 180-220, and the diameter of the zirconia balls is 4-6 mm; in the step (4), the included angle is 50-75 degrees, and the distance is 60-90 mm.
In the step (5), the temperature is raised to 100-150 ℃; in the step (7), the annealing temperature is 300-.
In the step (2), the vibration frequency of the mechanical grinding treatment is 40-60 Hz; in the step (5), the power of the copper target direct current power supply is 150-; in the step (6), during sputtering cleaning, the RF power of the industrial pure titanium TA1 target is 150-250W, the RF power of the Ni-Cu-Re target is 120-160W, during reactive co-sputtering, the RF power of the industrial pure titanium TA1 target is 180-250W, and the RF power of the Ni-Cu-Re target is 140-180W.
In the step (5), the vacuum degree of the sputtering chamber is less than or equal to 6 multiplied by 10-3Pa, argon pressure is 3-5 Pa; in the step (6), the argon pressure is 0.5-1.8Pa, and the nitrogen flow is 20-50 sccm; in step (7), trueVacuum degree of the empty furnace is less than or equal to 3 multiplied by 10-2Pa。
The invention has the beneficial effects that:
(1) according to the invention, the surface residual compressive stress is generated by processing the QTi3.5 matrix through surface mechanical grinding, the surface layer crystal grains are refined, and then a pure copper transition layer is prepared through magnetron sputtering, so that the difference of thermal expansion coefficients and the residual stress between different interface layers are reduced, and the diffusion bonding between the interface layers is promoted, thereby improving the bonding force between the Cu/TiN/Ni-Cu-Re composite coating and the QTi3.5 base material; (2) the Cu/TiN/Ni-Cu-Re gradient composite coating is prepared on the surface of the QTi3.5 matrix by a magnetron reaction co-sputtering method, the TiN coating has high hardness, good chemical stability and excellent wear resistance, and Ni-Cu-Re particles form a boundary lubricating film in a friction state, so that the friction coefficient is reduced, and the composite coating has a self-lubricating effect. After annealing treatment, Ni-Cu-Re particles are uniformly distributed in the TiN coating, so that a large number of interfaces are increased, columnar crystal gaps of the TiN are filled, the oxidation resistance and toughness of the TiN coating are improved, and the comprehensive performance of the composite coating is improved; (3) the QTi3.5/Cu/TiN/Ni-Cu-Re gradient composite coating prepared by the invention has good oxidation resistance and antifriction wear resistance, has stable performance under long-time work, can realize artificial regulation of the thickness of the coating, and can meet the use requirements under the condition of working condition change.
Drawings
FIG. 1 is the scanning electron microscope image of the QTi3.5/Cu/TiN/Ni-Cu-Re gradient composite coating obtained in example 1.
FIG. 2 is a scanning electron microscope photograph of the QTi3.5/Cu/TiN/Ni-Cu-Re gradient composite coating obtained in example 1 after friction and wear.
FIG. 3 is the scanning electron microscope image of the QTi3.5/Cu/TiN/Ni-Cu-Re gradient composite coating obtained in example 2.
FIG. 4 is a scanning electron micrograph of the QTi3.5 matrix obtained in comparative example 1 after frictional wear.
Detailed Description
The present invention is described below with reference to examples, which are provided for illustration only and are not intended to limit the scope of the present invention.
Example 1
A preparation method of a copper-based composite electric contact material with a gradient structure comprises the following steps: selecting a QTi3.5 matrix (Ti3.5-4.0 wt%, total impurity content less than or equal to 0.5% and balance Cu) of copper alloy, carrying out mechanical polishing treatment on the QTi3.5 matrix, carrying out ultrasonic cleaning in an acetone solution for 10min, carrying out ultrasonic cleaning in an absolute ethyl alcohol solution for 10min, placing the pretreated QTi3.5 matrix at the top of a closed cavity for mechanical grinding treatment, placing 180 zirconia balls at the bottom, wherein the diameter of each steel ball is 4mm, the treatment time is 30min, the vibration frequency is 45Hz, placing the mechanically ground QTi3.5 matrix in an acetone solution for ultrasonic cleaning for 10min, cleaning for 5s in a mixed acid solution, and matching the mass ratio of the mixed acid solution to H2SO4:HNO3The ultrapure water is 5:3: 2; clamping the processed QTi3.5 matrix on a sample table of a reaction magnetron co-sputtering system, adjusting the included angle between the center of the QTi3.5 matrix and the centers of an industrial pure titanium TA1 target, an industrial pure copper T1 target and a Ni-Cu-Re target to 65 degrees and the distance to 72mm, and pumping the vacuum degree of a magnetron sputtering chamber to 1 multiplied by 10-3Pa, turning on a heating power supply to increase the temperature of a sample table to 110 ℃, filling high-purity argon and adjusting the air pressure to 3.2Pa, setting the power of a direct-current power supply of an industrial pure copper T1 target to 160W, closing an industrial pure titanium TA1 target and a Ni-Cu-Re target baffle, opening an industrial pure copper T1 target baffle, sputtering the industrial pure copper T1 target for 5min, closing the copper target baffle and a QTi3.5 matrix sample table baffle device, opening the industrial pure titanium TA1 target and the Ni-Cu-Re target baffle, respectively setting the power of radio frequency power supplies to 160W and 140W, sputtering and cleaning for 10min, filling nitrogen, adjusting the gas flow to 35sccm, opening the QTi3.5 matrix sample table baffle device, setting the power of the industrial pure titanium TA1 target sample to 200W, setting the power of the Ni-Cu-Re target to 160W, sputtering and the working time to 60min, putting the prepared QTi3.5/Cu/TiN/Ni-Cu-Re composite coating in a vacuum furnace for gradient annealing, vacuum degree of 1X 10-2Pa, the annealing temperature is set to be 400 ℃, and the annealing time is 90 min.
The QTi3.5 surface is a gradient composite structure layer consisting of a pure Cu transition layer and TiN/Ni-Cu-Re, gaps are not left between columnar crystals, the structure is compact, the transition pure copper layer is well combined with the upper TiN/Ni-Cu-Re composite layer and the lower QTi3.5 base material without cracking, and the thicknesses of the transition layer and the composite layer are about 1.5 mu m. The surface TiN/Ni-Cu-Re composite layer, the pure copper transition layer, the QTi3.5 surface fine grain layer and the QTi3.5 coarse grain matrix are arranged from the surface to the core of the matrix in sequence.
Adopting a multifunctional friction and wear instrument, wherein the friction condition is dry friction, the wear mode is one-way circular sliding, the friction pair is a 4mm G10 steel ball, under the 5N load, the linear speed is 10mm/s, the total movement distance is 18m, the measured average friction coefficient is 0.35, and the wear rate is 0.33mm3/(N·m)。
Example 2
A preparation method of a copper-based composite electric contact material with a gradient structure adopts the same raw materials and preparation process as those in example 1, and changes the sputtering time of an industrial pure titanium TA1 target radio frequency power supply and a Ni-Cu-Re target radio frequency power supply during working to 100 min; the gradient composite coating was analyzed in cross section and had a thickness of 3 μm.
Adopting a multifunctional friction and wear instrument, wherein the friction condition is dry friction, the wear mode is one-way circular sliding, the friction pair is a 4mm G10 steel ball, under the 5N load, the linear speed is 10mm/s, the total movement distance is 18m, the measured average friction coefficient is 0.37, and the wear rate is 0.42mm3/(N·m)。
Comparative example 1
A QTi3.5 matrix material comprises the following steps: selecting copper alloy with QTi3.5(Ti3.5-4.0 wt%, total impurity less than or equal to 0.5 wt%, and Cu as the rest), ultrasonic cleaning in acetone solution for 10min, and ultrasonic cleaning in absolute ethanol solution for 10 min.
Adopting a multifunctional friction and wear instrument, wherein the friction condition is dry friction, the wear mode is one-way circular sliding, the friction pair is a 4mm G10 steel ball, under the 5N load, the linear speed is 10mm/s, the total movement distance is 18m, the measured average friction coefficient is 0.51, and the wear rate is 1.92mm3/(N·m)。
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims (6)

1. The preparation method of the copper-based composite electric contact material with the gradient structure is characterized by comprising the following steps of:
(1) carrying out mechanical polishing treatment on the QTi3.5 matrix and sequentially carrying out ultrasonic cleaning in an acetone solution and an absolute ethyl alcohol solution;
(2) placing the QTi3.5 matrix pretreated in the step (1) on the top of a closed vacuum cavity, placing zirconia balls at the bottom of the closed vacuum cavity, and mechanically grinding the QTi3.5 matrix;
(3) putting the QTi3.5 matrix treated in the step (2) into an acetone solution for ultrasonic cleaning, and then putting the cleaned matrix into a mixed acid solution for cleaning;
(4) clamping the QTi3.5 matrix processed in the step (3) on a sample table of a magnetron co-sputtering system, and adjusting the included angles and the distances between the center of the QTi3.5 matrix and the centers of the surfaces of an industrial pure titanium TA1 target, an industrial pure copper T1 target and a Ni-Cu-Re target to be equal;
(5) a three-target magnetron sputtering system is adopted, a sputtering chamber is vacuumized, a heating power supply is turned on to heat a sample platform to start heating, a control valve is turned on to fill argon, a copper target direct current power supply is turned on to carry out sputtering treatment on a copper target with the purity not lower than 99.95 wt%, and a pure copper transition coating is formed on the surface of a QTi3.5 matrix;
(6) closing a direct-current power supply and an upper baffle of an industrial pure copper T1 target, closing a QTi3.5 substrate sample table baffle device, opening baffles above an industrial pure titanium TA1 target and a Ni-Cu-Re target, adjusting argon pressure, opening a radio-frequency power supply of an industrial pure titanium TA1 target and a radio-frequency power supply of a Ni-Cu-Re target, adjusting the radio-frequency power supply power of an industrial pure titanium TA1 target and the radio-frequency power supply power of a Ni-Cu-Re target, carrying out sputtering cleaning, opening a valve to fill nitrogen, opening a QTi3.5 substrate sample table baffle device, adjusting the radio-frequency power supply power of the industrial pure titanium TA1 target and the radio-frequency power supply power of the Ni-Cu-Re target, carrying out reactive co-sputtering, and preparing a QTi3.5/Cu/TiN/Ni-Cu-Re gradient composite;
(7) and (4) placing the QTi3.5/Cu/TiN/Ni-Cu-Re gradient composite coating prepared in the step (6) in a vacuum furnace for annealing treatment to obtain the QTi3.5/Cu/TiN/Ni-Cu-Re gradient composite coating.
2. The method of claim 1, wherein in step (1), the ultrasonic cleaning 10 is performed in an acetone solutionUltrasonic cleaning in absolute ethanol solution for 5-10min after-15 min; in the step (2), the surface mechanical grinding treatment time is 20-60 min; in the step (3), the QTi3.5 matrix is ultrasonically cleaned in an acetone solution for 10-15min and in a mixed acid solution for 5-10s, and the mass ratio of the mixed acid cleaning solution is H2SO4:HNO3The ultrapure water is 5:3: 2; in the step (5), the sputtering treatment time is 3-5 min; in the step (6), the sputtering cleaning time is 8-15min, and the reaction co-sputtering time is 40-80 min; in the step (7), the annealing time is 90-150 min.
3. The method as claimed in claim 1, wherein in the step (2), the number of zirconia balls is 180-220, and the diameter of the balls is 4-6 mm; in the step (4), the included angle is 50-75 degrees, and the distance is 60-90 mm.
4. The method as claimed in claim 1, wherein in step (5), the temperature is raised to 100-150 ℃; in the step (7), the annealing temperature is 300-.
5. The method according to claim 1, wherein in the step (2), the vibration frequency of the mechanical grinding treatment is 40-60 Hz; in the step (5), the power of the copper target direct current power supply is 150-; in the step (6), during sputtering cleaning, the RF power of the industrial pure titanium TA1 target is 150-250W, the RF power of the Ni-Cu-Re target is 120-160W, during reactive co-sputtering, the RF power of the industrial pure titanium TA1 target is 180-250W, and the RF power of the Ni-Cu-Re target is 140-180W.
6. The method of claim 1, wherein in step (5), the sputtering chamber vacuum is ≦ 6 x 10-3Pa, argon pressure is 3-5 Pa; in the step (6), the argon pressure is 0.5-1.8Pa, and the nitrogen flow is 20-50 sccm; in the step (7), the vacuum degree of the vacuum furnace is less than or equal to 3 multiplied by 10-2Pa。
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Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08330694A (en) * 1995-06-05 1996-12-13 Mitsui Toatsu Chem Inc Heat resistant flexible circuit board
US20030085260A1 (en) * 2001-10-01 2003-05-08 Toshihisa Hatano Bonded body comprising beryllium member and copper or copper alloy member, and method of manufacturing the same
US20070251819A1 (en) * 2006-05-01 2007-11-01 Kardokus Janine K Hollow cathode magnetron sputtering targets and methods of forming hollow cathode magnetron sputtering targets
US20100012359A1 (en) * 2006-09-13 2010-01-21 Ormecon Gmbh Article with a Coating of Electrically Conductive Polymer and Precious/Semiprecious Metal and Process for Production Thereof
CN101930804A (en) * 2008-12-01 2010-12-29 日立电线株式会社 Surface-treated metal material and manufacturing method of the same
CN102017217A (en) * 2008-04-28 2011-04-13 大日本印刷株式会社 Device having hole injection transport layer, method for production thereof, and ink for formation of hole injection transport layer
JP2015045053A (en) * 2013-08-27 2015-03-12 Jx日鉱日石金属株式会社 Metallic material for electronic component, method for producing the same, and connector terminal, connector and electronic component using the same
JP2015056423A (en) * 2013-09-10 2015-03-23 Hoya株式会社 Substrate with multilayer reflection film, reflection type mask blank for euv lithography, reflection type mask for euv lithography, and manufacturing method thereof, and manufacturing method for semiconductor device
WO2015045469A1 (en) * 2013-09-27 2015-04-02 富士フイルム株式会社 Multilayer structure, interposer and method for producing interposer
CN105290407A (en) * 2015-11-17 2016-02-03 中国科学院兰州化学物理研究所 Tin bronze-steel backing self-lubricating wear-resisting bi-metal material and preparation method thereof
WO2016171627A1 (en) * 2015-04-24 2016-10-27 Wangi Industrial Company (Private) Ltd A substantially transparent coating
CN107012437A (en) * 2017-03-22 2017-08-04 刘金财 High performance Ti/TiN/ (AlTiCuSi are prepared using reactive magnetron sputtering method)The method of N coatings
WO2017136971A1 (en) * 2016-02-11 2017-08-17 广东工业大学 (ti, al, zr)n multi-component composite coating, graded structure ultrafine hard alloy cutting tool with the composite coating, and method for manufacturing same
CN111733417A (en) * 2020-06-11 2020-10-02 华东交通大学 Method for low-temperature copper infiltration on surface of titanium or titanium alloy

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08330694A (en) * 1995-06-05 1996-12-13 Mitsui Toatsu Chem Inc Heat resistant flexible circuit board
US20030085260A1 (en) * 2001-10-01 2003-05-08 Toshihisa Hatano Bonded body comprising beryllium member and copper or copper alloy member, and method of manufacturing the same
US20070251819A1 (en) * 2006-05-01 2007-11-01 Kardokus Janine K Hollow cathode magnetron sputtering targets and methods of forming hollow cathode magnetron sputtering targets
US20100012359A1 (en) * 2006-09-13 2010-01-21 Ormecon Gmbh Article with a Coating of Electrically Conductive Polymer and Precious/Semiprecious Metal and Process for Production Thereof
CN102017217A (en) * 2008-04-28 2011-04-13 大日本印刷株式会社 Device having hole injection transport layer, method for production thereof, and ink for formation of hole injection transport layer
CN101930804A (en) * 2008-12-01 2010-12-29 日立电线株式会社 Surface-treated metal material and manufacturing method of the same
JP2015045053A (en) * 2013-08-27 2015-03-12 Jx日鉱日石金属株式会社 Metallic material for electronic component, method for producing the same, and connector terminal, connector and electronic component using the same
JP2015056423A (en) * 2013-09-10 2015-03-23 Hoya株式会社 Substrate with multilayer reflection film, reflection type mask blank for euv lithography, reflection type mask for euv lithography, and manufacturing method thereof, and manufacturing method for semiconductor device
WO2015045469A1 (en) * 2013-09-27 2015-04-02 富士フイルム株式会社 Multilayer structure, interposer and method for producing interposer
WO2016171627A1 (en) * 2015-04-24 2016-10-27 Wangi Industrial Company (Private) Ltd A substantially transparent coating
CN105290407A (en) * 2015-11-17 2016-02-03 中国科学院兰州化学物理研究所 Tin bronze-steel backing self-lubricating wear-resisting bi-metal material and preparation method thereof
WO2017136971A1 (en) * 2016-02-11 2017-08-17 广东工业大学 (ti, al, zr)n multi-component composite coating, graded structure ultrafine hard alloy cutting tool with the composite coating, and method for manufacturing same
CN107012437A (en) * 2017-03-22 2017-08-04 刘金财 High performance Ti/TiN/ (AlTiCuSi are prepared using reactive magnetron sputtering method)The method of N coatings
CN111733417A (en) * 2020-06-11 2020-10-02 华东交通大学 Method for low-temperature copper infiltration on surface of titanium or titanium alloy

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
XIU LINGWANG: "《Research and Development of Self-Lubricating Bearing Materials》", 《ADVANCED MATERIALS RESEARCH》 *
周嘉悦;李晓鹏;陈海瑞;彭勇;王克鸿: "《钛铜异种金属CMT熔覆成形特性研究》", 《机械制造文摘(焊接分册)》 *

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