CN1129893C - Magnetic head for recording with ultra low force - Google Patents
Magnetic head for recording with ultra low force Download PDFInfo
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- CN1129893C CN1129893C CN93118811A CN93118811A CN1129893C CN 1129893 C CN1129893 C CN 1129893C CN 93118811 A CN93118811 A CN 93118811A CN 93118811 A CN93118811 A CN 93118811A CN 1129893 C CN1129893 C CN 1129893C
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Abstract
The present invention relates to a disk drive assembly, wherein a supporting piece and a read / record sensor are integrated into a combined assembly which is made by adopting a film deposition technique, so a light weight assembly with contact sound recording permission is produced. In one embodiment, a sensor is deposited on a strippable supporting layer used for covering the base sheet of a wafer in a row and column structure; the thickness of the base sheet is equal to the length of the required supporting piece; the wafer is divided into multiple row parts, and a second strippable layer is formed on one separated side in each row part; proper materials are deposited into multilayer thin layers to form a supporting layer which extends to a conducting wire of a film sensor.
Description
The present invention relates to movable magnetic memory apparatus and recording element thereof, more particularly is combination sensor carrier arrangement that is suitable for being produced in batches and the method for making this device.
Seek a kind of effective record scheme that is used for magnetic disk memory and still be one of problem that override need consider.The needs that increase the density of data storage and prolong equipment life impel and carry out this research.
Magnetic disk memory is an information-storing device, and it adopts at least one rotating data storage disk, and this disk has the concentric data track that holds data message; A sensor, be used for from reading of data on the different tracks or with data recording to different tracks; A slide block is used for making sensor to be fixed near the track place with the form that is suspended on this medium usually; A supporting member is used for the sensor and the slide block of the top of trapped orbit flexibly; And a positioning stop that is connected to this subassembly, so that when reading or write down, movable sensor makes this sensor remain on the center line top of this track to the track place that will arrive simultaneously.Sensor is connected on the air-supported slide block, and they all contact the air cushion that produces by the disk that rotates or with disk again and are supported on the track of disk.Supporting mass provides high resiliency rigidity and spatial stability between slide block and brake toggle.Require this supporting member to keep the data surface of sensor and the close disk of slide block with alap load forces.Read in service, detent make sensor according to desired data stationary above correct track, the record run duration, detent makes sensor be positioned at the correct path place of data ordering.So the control brake device promptly usually to come mobile combination support spare---sensor---slide block assembly parts transverse to orbital motion, makes sensor be in the correct path top.
In conventional disk set, sensor and slide block are to separate manufacturing with supporting member, and the controller by an in check accurate operation connects then.These parts are very little, and their mutual positions must be accurately.Sensor must accurately be arranged to the related track place, and this just means that supporting member must accurately be arranged to slide block.Supporting member is necessary for slide block and provides flexible, gradient and rolling movement with respect to the direction of motion of rotating disk, and anti-swing performance also is provided simultaneously.Supporting member exists any error all can cause the breaking-up of these parts with respect to the orientation of slide block.The amplifier that is placed on the supporting member or on the detent drawn and is connected to by lead along supporting member.Lead must not increase the elastic stiffness of slide block when good electrical connection is provided.Usually lead is welded by scolder, for example is welded to sensor output lead and amplifier.In addition, error can cause that whole subassembly damages.
Chinese patent publication CN1004036B discloses a kind of disc driver, it comprises a plurality of disks that vertically separate on the main shaft and mutual that are installed in, spindle motor by pulley and belt rotating disk, a plurality of head arms, each head arm supports a magnetic head by universal joint, the support that head arm is connected thereto by the magnetic head pin, a supporting bracket is so that the piece that can rotate around the axis, a voice coil motor that makes that support sways, a pedestal, a lid, and an annular filter.Head arm, support, piece and voice coil motor constitute actuator.
The United States Patent (USP) 4670804 that transfers assignee of the present invention's people such as Kant has been described a kind of slide block---the supporting member assembly parts, it comprises the supporting member of flexible material sheet, deposit the conductor that is used for sensor thereon, supporting member is being supported slide block and sensor module.The flexible strip that stainless steel supporting member of the prior art is deposited conductor is replaced.In this patent, polyimide flexible strip and slide block/sensor pack are made respectively, with for example bonding method they are connected to each other then.Here do not show a kind of like this combination sensor/slide block/supporting member assembly parts, these assembly parts do not need other Connection Step between supporting member and slide block.
Known supporting member arm can be made by polyimide material, and it has many leads, and these leads are connected to the sensor that directly is deposited on the polyimide supporting member.Transfer assignee of the present invention's people's such as Ainslie United States Patent (USP) 4789914, disclose and to have welded the direct technology that is connected with slide block of the supporting member that will contain lead in enough contacts.This sensor has been deposited on this slide block.This slide block comprises the lead seat and is arranged at connection wire on the slide block between lead seat and sensor.In addition, this slide block and sensor also are to separate manufacturing with the supporting member arm, then by with the disclosed contact welding of this patent they being interconnected.Disclosed as other known technology, the combination of this slide block and Sensor section is to separate to produce with the supporting assembly parts that comprise internal connecting line.Do not show combination sensor/slide block/the have supporting member of lead, the yet undeclared method that makes up.
Contact is read technology and has been shown very big development prospect in recent years.Slide block device with supporting member made from active material adopts and to make the cycle sensor sex work realize that contact reads, that is, only just contact when requiring to read/write down operation, and all the other times, this slide block floats on the disk contact one and highly locates.The scheme that another kind of contact is read is to adopt " flexible " magnetic head magnetic disk surface that nuzzles up.Used magnetic head is by forming a film on substrate, separating this film then and make in this scheme.For example, Censtor Corp, United States Patent (USP) 5041932 (Hamilton), disclose a kind of be used for contact history and read information lightweight, combination sensor/flexible head/conductor structure.Yet " flexible " magnetic head scheme needs an elaborate mechanism, with that realize suiting and control precision.
Have been found that vertical sensor head realized several advantages; The most significant advantage is to make this magnetic head winding along wafer length.This structure is applicable to the situation of the big variation of electrode tip length that the super life-span mechanical wear of storer causes, thereby has prolonged the life-span of whole device.
Regrettably, related some drawbacks limit of all these design proposals their application and enforcement.Surpassing typical products under the life-span, estimating that head wear is 400 microinchs.This a large amount of wearing and tearing have limited the application of many this schemes, and the top of electrodes of conventional head approximately only is 1 micron long usually, wears away soon in this application.
In addition, although film-forming method allows magnetic head to be combined on the supporting member, the wafer area that this structural requirement is a large amount of so just makes the magnetic head output of each wafer be significantly less than the level of conventional head production run, also is lower than admissible level.
Therefore, the purpose of this invention is to provide a kind of disk system, particularly a kind of sensor and support system, this system has overcome the defective of prior art.
Another object of the present invention provides a kind of supporting member and sensor element of enhancing.
Another object of the present invention provides a kind of lightweight supporting member---sensor that reduces head wear.
A further object of the present invention provides and a kind of useful supporting member is read in contact---the sensor assembly parts.
A further object of the invention is to produce a kind of film supports part---the sensor that can control its startup.
Have a purpose to provide a kind of record drive unit again, this device has adopted film supports part of the present invention---sensor.
The invention provides a kind of disk drive Equipment Part, wherein supporting system and sensor are combined into one, and adopting the film deposition techniques manufacturing, the assembly parts that thin film technique is produced have very little weight, therefore allow to select between suspension or contact history.Sensor that is combined into one and supporting system are to make by produce a plurality of sensors in batches with row or array structure on substrate.These sensors of one row's part are further by forming slide block on each sensor---and the supporting member assembly comes batch machining, forms the lead of supporting part and each sensor on each sensor of substrate row part together.By etching or cutting, or, remove the structure of support bearing part by removing the strippable coating that before forming supporting part, deposits.This supporting part has flexible, and maintenance simultaneously is connected with slide block and its sensor.Cut or cut into individual unit by arranging part, can be made into single-sensor---support system.
Specifically, technical scheme of the present invention is as follows.
A kind of method of processing combination sensor and supporting member assembly is characterized in that may further comprise the steps:
Provide a thickness to equal the wafer substrate of required supporting member length;
Pattern with row and column on described wafer substrate first type surface forms a plurality of sensors and sensor conductor lead-in wire;
Isolate a capable part from described wafer substrate, make each row part have a plurality of sensors, wherein every row are got a sensor;
By at the separation side deposit of the row part of being separated one deck resilient material at least, on described separation side, form a supporting member part;
The conductive component that formation is extended to the opposite end of described supporting member part from sensor;
Remove unwanted part on the wafer substrate;
Described row part is separated into single sensor, and each sensor has the relevant portion of described supporting member part.
A kind of integrated tongue supporting member and method of sensor made may further comprise the steps:
A substrate that has the plane in fact is set;
Construct described sensor by on described plane, forming thin layer;
Formation has the substrate of substrate edge and has the sensor at sensor edge, make substrate edge near described plane and with described sensor edge coplane in fact;
On substrate edge and sensor edge, form described tongue supporting member; And
Remove the described substrate of at least a portion.
A kind of integrated tongue supporting member and method of sensor pack made is characterized in that comprising:
A wafer substrate that has the plane in fact is set;
The a plurality of thin layers of deposit on described plane form and press a plurality of sensing systems of delegation's arrangement at least;
The cut crystal substrate, so that the sensing system of at least one separate rows is provided on a substrate sections, the sensing system of this separate rows comprises a plurality of sensing systems of arranging with described delegation at least, this sensing system and the substrate sections that is cut into each separate rows provides corresponding cut edge, wherein the cut edge of the sensing system of separate rows and substrate coplane in fact each other;
At least one thin layer of deposit on the cut edge of the sensing system of separate rows and substrate sections is that each sensing system in the sensing system of described separate rows forms a tongue supporting member; And
The sensing system of described substrate sections and described separate rows is cut into independent tongue supporting member and sensing system subassembly.
In the manufacturing of a kind of embodiment, equal at thickness to form first strippable coating on the wafer substrate of required supporting member length.Then, on first strippable coating, form supporting layer, then on this supporting layer, form a plurality of thin film sensors with the layout of row and column.Wafer is separated into a plurality of row's parts, and each row who has a sensor simultaneously separates from each row, and these row form this row's part of the thin film sensor that has been shaped.Second strippable coating forms in the separation side of row's part of separating from the resulting wafer substrate that has thin film sensor.Then, on second strippable coating, by the thin layer formation supporting course of deposition resilient material.Lead is that two coil-end from thin film sensor extend to the opposite end (free end) of supporting course and form.At last, with the dissolving of first and second strippable coatings, it is standby to stay supporting/sensor assembly parts.Resulting device allows the integrated slide block in very little weight---adopt conventional sensor on the supporting assembly parts.This device can adopt the slide block technology and the high-density film magnetic head product of generally acknowledging to make.In second embodiment, the thickness of substrate equals the needed width of supporting part.This thin film sensor is deposited on the substrate with strippable coating subsequently, and it also is the structure deposition with row and column.Yet in row's part, sensor is cut apart at a certain distance, and this distance will become the length of slide block.Row's part is separated from wafer substrate, and supporting course deposits to the suitable side of this row's part.To arrange part then and be separated into single sensor---supporting member, with the strippable coating dissolving, make it and substrate separation subsequently by incision, etching, cutting or mechanical method.
Sensor and supporting course can replace strippable coating directly to deposit on the substrate.Substrate is removed by etching or sawing on request.In this case, can the reserve part substrate, with slide block holder as sensor.
Aforesaid and other purpose of the present invention, feature and advantage will show from the more specific description of the preferred embodiments of the present invention of doing below in conjunction with accompanying drawing.
Fig. 1 is the skeleton view by the magnetic disk surface sensing relation of the combine and assemble part of the present invention of detent connection location and magnetic disk memory;
Fig. 2 is the top view that has swing brake and adopt magnetic recording of the present invention mechanism;
Fig. 3 A is the combination sensor of the present invention that is used for magnetic disk memory combine and assemble part shown in Figure 1---the skeleton view of an embodiment of supporting member;
Fig. 3 B is used in the process of combine and assemble part shown in the shop drawings 3A, forms the skeleton view of substrate of a plurality of Magnetic Sensors of row and column structure thereon;
Fig. 4 A is the top view of the wafer substrate of row or the sensor of array structure layout on the circular wafer that is presented at shown in Fig. 3 B;
Fig. 4 B is the substrate cut-open view along 4B-4B line among Fig. 4 A;
Fig. 5 A is used for second of magnetic disk memory shown in Figure 2 combine and assemble part of the present invention
The skeleton view of embodiment;
Fig. 5 B is used in the process of combine and assemble part shown in the shop drawings 5A, forms the skeleton view of substrate of a plurality of Magnetic Sensors of row and column thereon;
Fig. 6 is a skeleton view of arranging that takes off from wafer shown in Fig. 5 B.
Fig. 7 A is the top view that deposits the row shown in Figure 6 who forms support layering of the present invention;
Fig. 7 B is the row's with supporting part sensor that takes off along 7B-7B line among Fig. 7 A a cut-open view;
Fig. 8 be when with substrate when the supporting of Fig. 7 A and 7B and sensor element are removed, the side view of row's combine and assemble part is described.
Supporting system of the present invention, slide block and sensor are combined into one, and adopt the film deposition techniques manufacturing, and the assembly parts of thin film technique manufacturing have very little weight.The preferred embodiments of the present invention are generally used in the large-scale multiple media drive, but also find to be used for single media drive, generally use in slim calculator.Said medium can be an also disk of band shape.
A kind of sensor of standard, obtained in adopting the embodiment of supporting member length as the determinative of origination wafer thickness.In addition, choose wantonly with this textural association all-in-one-piece arm, and can be improved to movable, therefore only when for reading/write down when needing to contact, permission dynamic loading and unload from coiling.
In this embodiment, the conventional sensors of well-known structures is fabricated on the wafer substrate.To this example that implements usefulness is the technology of making sensor on the above-mentioned United States Patent (USP) 4624048 described wafer substrate.In this technology, sensor and the mechanism that is associated are known.Sensor is deposited over quite thick aluminium or other can rise on the material layer that is fit to that stops etching action, and this layer also may be as Slipper.Row's part is cut off from wafer, and is ground to as the needed size of induction pick-up, for example critical cross-section height.Another kind method is to determine this size with photoetching technique.The top of this row's part grinds to form a smooth surface.
Deposition stops etched material layer on this row's part top.This step provides a last crooked thick material as supporting member.The deposits conductive material layer is as the part of supporting member, and the electrode effect that sensor element is connected with its electric part of control that provides is provided.
Among another embodiment, allow before introducing conductor, to deposit earlier first ground plane layer.One deck top ground plane layer provides bigger scattered field isolation, makes the symmetrical stressed reduction that produces owing to thermal mismatching simultaneously, and in some applications, the two all needs.
Etch process can be used for making substrate from cunning---and the support body part is removed, and only stays supporting material and the sensing element with related lead.An extremely light supporting---sensor assembly parts so just are provided.Removing of substrate can be finished by adopting strippable coating.At the beginning, on substrate, apply and cover a strippable coating, so that the film of deposition as discussed above is in the end peeled off in the operation easily.Also having a kind of scheme is the material that grinds off or corrode suitable thickness from row's part, stays required structure.Being suitable for the lead that " bending " is connected on the sensor around the turning can realize with various technology.A kind of scheme is the termination electrode, so that this side is exposed in grinding steps, and allows to deposit from the top so that connect so far subsequently.If the top lateral margin on sensor head surface is made to circle, then this processing becomes more convenient.Supporting part is with any reinforcement of selecting in several technology.The reinforcement of supporting member is needs in special applications or for adapting to dynamic system.
This reinforcement is preferably finished by the thickness distribution that changes supporting member itself.The variation of thickness is little to the increase of whole weight, and provides high control to add powerful feature.Anisotropic rigidity adopts the groove line to realize.
In order automatically partly to aim at analogous shape, on-chip groove also is used to determine area.Utilization by tiny chip increases with regard to the number of the sensing element that allows to make on single wafer for this, these little chips are adhered on the bigger supporting member, in these little chip form, provide a groove, simultaneously so that this chip is aimed at automatically with supporting member.
The low rigidity of supporting assembly parts allows it easily to be attached on the brake toggle.Any problem that causes for fear of static friction, zero load when arm made from active material or supporting part can make slide block contact with disk with sensor usually.By activating active material, slide block is contacted under gratifying acting force with disk with its sensor.
With reference to Fig. 1, a kind of magnetic disk memory of the present invention system that embodies is described, it comprises linear brake 10 and the part of the disk 12 of the data logging magnetic disk memory that matches.This linear brake 10 comprises a sound (sound line) coil motor 14, this voice coil motor 14 comprises a coil that can move in the magnetic field of fixing permanent magnetism assembly parts (not shown), these fixing permanent magnetism assembly parts have a magnetic core and an external structure of being supported by shell 16.A brake toggle 20 is connected to movable coil 14.Be connected to brake arm 20 the other end be a plurality of arms 21, they each is being supported a combination sensor---slide block---supporting assembly parts 22, it is the explained hereafter that proposed below this paper.Assembly parts 22 comprise sensor---slide block 24 and supporting part 26.This supporting part 26 can be supported sensor on the air-supported or pad that is produced by disk 12 rotations---slide block 24 is on the surface of disk 12.If desired, supporting part 26 can be supported sensor---slide block 24 contacts with magnetic disk media.Air-supported surface refers to the shoe surface of parallel and close magnetic disk surface.It comprises two aspect structures, and promptly She Ji slider suspension is on disk and at run duration, and the surface of the slide block of design and recording medium---disk 12 contacts.
---slide block assembly parts 24 provide a load to slide block---supporting part 26 of supporting assembly parts 22 is to sensor---to combination sensor, normally perpendicular to the surface of disk 12, this normal load makes sensor for it---and slide block assembly parts 24 keep contacting with the data surface of disk 12 when disk 12 does not rotate.Normal load when disk 12 rotation, at sensor on---produce between slide block assembly parts 24 and the disk 12 air-supported be applied to sensor by supporting part 26---slide block assembly parts 24 resists mutually.
At run duration, making sensor by starting voice coil motor 14---slide block assembly parts 24 move on the disk 12 data faces in the concentric data track on the needed track.In order to read or record, requiring sensor---the slide block assembly parts promptly move on on another track from a track.The sensor of assembly parts 24 must be fixed on the suitable position, required track top, and in the shortest time, reach this track.The detent 10 that Fig. 1 described is linear brakes, and it moves combine and assemble part 22 on accurately transverse to the direction of track.The magnetic disk memory of the routine of other type adopts swing brake, as in the above-mentioned United States Patent (USP) 3849800 and as shown in Fig. 2.Swing brake usually only moves combine and assemble part of the present invention on arching trajectory radially, and as the alternative part of linear brake 10.
When combine and assemble part 22 on disk 12, be suspended in air-supported on the time, it must provide radial rigidity and tilt and rotating direction on tangible elasticity is arranged.If desired, on the supporting part 26 of combine and assemble part 22, also can make an integrated circuit package 28.This integrated amplifier is represented with label 28, and will be described as another embodiment of the present invention.
Fig. 2 depicts a data disc memory of the record, it comprises swing brake 32 that is contained in the shell 36 and the disk that matches 34 that is rotated by drive unit 35, swing brake 32 moves combine and assemble part of the present invention with arching trajectory above disk 34, swing brake comprises a voice coil motor, and it is a coil 37 that can move in the magnetic field of the fixing permanent-magnet component with magnetic core 38.Brake toggle 33 is connected with movable coil 37, the other end of brake toggle 33 and combination sensor of the present invention---and the supporting assembly parts link, and the technology manufacturing that proposes below according to this paper.
The combine and assemble part 22 of an amplification on the magnetic disk memory that is used for Fig. 1 has been shown among Fig. 3 A.On the supporting part 26 whole surface that is deposited over wafer like that as described later.The part of wafer becomes sensor---the slide block 23 of slide block assembly parts 24.Though only show a sensor 25 that on slide block 23, forms, be appreciated that more sensor also can form and be used for to match with the track of disk 12.Usually, deposit two or more sensors 25 in order to increase output, because only need a sensor 25 to produce a suitable combine and assemble part 22 at work.
Supporting part 26 can comprise an insulation course 40, a circuit layer 42, a dielectric layer 44 and a supporting structure layer 46.Supporting structure layer may be a dielectric layer 44 for example made of aluminum, maybe may be the medium of an individual layer, for example also is aluminum.Supporting structure layer also can be by nickel plating---and iron alloy layer, spraying plating copper alloy-plated layer or spraying plating stainless steel layer form.Lead 43 interconnects sensor 25 and circuit layer 42.Terminal at circuit layer 42 is equipped with the electric mortiser joint chair, so that be connected with external amplifier, external amplifier can be an integrated amplifier, and as integrated amplifier 28 (see figure 1)s, it can be deposited with other layer that is used for supporting part 26.Insulation course 40 provides electrical isolation between the substrate that may conduct electricity of conductive layer 42 and slide block 23, dielectric layer 44 makes circuit 42 and 46 insulation of metal support structure layer, also one or more ground plane layer can be set if desired.Or independent dielectric layer 44, or dielectric layer provides support to supporting member with arbitrary supporting structure layer 46, so that combine and assemble part 22 remains on the track top of disk 12.Picture is noted earlier, and sensor---Slipper 24 is in the position of disk 12 tops in supporting part 26 necessary maintenances.Supporting part allows and rolling movement, so that sensor---and Slipper 24 can be followed the surface of disk 12, stops simultaneously to swing, and this swing can make sensor 25 break away from from the lateral attitude with respect to track.
Fig. 3 B illustrates the first step according to the manufacture method of the combine and assemble part 22 of first embodiment of the magnetic disk memory that is used for Fig. 1, by preparing a non-magnetocrystalline sheet substrate 50, realizes the batch manufacturing of thin film sensor 25.The thickness of substrate 50 is T, and when the thickness of the thin film sensor 25 that adds deposition, it will equal to support the length of the width and the slide block 23 of assembly parts 26.Sensor 25 can be the film induction pick-up, as described above shown in the United States Patent (USP) 4190872, or magnetoresistive transducer, United States Patent (USP) 3975772 is shown as described above.Sensor 25 is drawn together lead 52 and 54, so that for magnetic medium reads and writes down sensor is started, sensing/device 25 is deposited on the substrate 50 with the row and column structure shown in Fig. 4 A.Before being described further, the row and column structure can well be described with reference to figure 4A according to technology of the present invention.
In Fig. 4 A, shown circular wafer substrate 100 has a plurality of sensors 25, for example, and many rows 102 of deposition and multiple row 104 on this substrate.Shown in wafer 100 have a plurality of squares, as square 106 and 108, each square is represented a sensor, and is known on single wafer substrate 100, can make the row 102 of arbitrary quantity and the size that row 104 these quantity depend on wafer size and single combine and assemble part.Shown in Fig. 4 B, substrate comprises a strippable layer 109, and it is formed between substrate 100 and the layer 110.In this embodiment, those layers of layer 110 representative formation sensor 25.
Therefore, refer again to Fig. 3 B, on substrate 50, each sensor constitutes a square.After having deposited those layers that form sensor 25, with cutting or other cutting method is separated in a row substrate 50, under a shown row 56 separates from substrate 50 by kerf 58.In this program back, this row 56 is by the kerf 60 separated squares 62 that comprise a transducing part 25 with generation.64 of another kerfs make this row 56 be separated into single square 66 and 68 fully, and three squares have been shown in every row of Fig. 3 B.Show kerf 58 corresponding to kerf 64.Single square also can with for example etching, machine cut or cut separated, in the method according to the invention, before forming the layer 110 of sensor 25 on the substrate 100, deposition one strippable coating 109 earlier.The purposes of strippable coating 109 will be below with reference to Fig. 7 B explanation.
Fig. 5 A expresses the combine and assemble part 30 of an amplification, and it is to use with the swing brake 32 of the magnetic disk memory of Fig. 2, and supporting part 70 is deposited on a row's the whole surface, and the erect image back will illustrate in Fig. 5 B.The part of wafer can become the slide block 72 of combine and assemble part 30.Although only shown a sensor 74 that on slide block 72, forms, be appreciated that more sensor can be formed, and be used for cooperating with the track of disk 34.
Supporting part 70 can comprise an insulation course 76, a conductor layer 78, a dielectric layer 80 and a supporting structure layer 82, and this supporting structure layer can be the copper beryllium alloy layer of spraying plating, or the stainless steel layer of spraying plating.Lead 84 and 86 interconnects sensor 74 and circuit layer 78, and electric connection socket 88 is placed in conductor layer 78 terminals, joins with an amplifier.This amplifier can be the integrated amplifier of those layers deposition in the supporting part 26 that is used in Fig. 7 B.Insulation course 76 provides electrical isolation between the substrate that may conduct electricity of conductor layer 78 and slide block 72.If desired, dielectric layer 80 can provide insulation to conductive layer 78.If need, also one or more ground plane layer can be set, dielectric layer 80 mainly is to be used for support bearing spare with arbitrary supporting structure layer 82, is in the position of the track top of disk 34 to keep combine and assemble part 30.
Fig. 5 B illustrates the first step according to combine and assemble part 30 manufacture methods of first embodiment of the magnetic disk memory structure that is used for Fig. 2.By preparing a non-magnetocrystalline sheet substrate 90, realize the batch manufacturing of thin film sensor 74.The thickness of this substrate 90 is T, when the thickness of the thin film sensor 74 that adds deposition, then equals the length of supporting part 70.Each sensor 74 can be the film induction pick-up, United States Patent (USP) 4190872 is described as described above, or magnetoresistive transducer, United States Patent (USP) 3975772 is shown as previously mentioned, each sensor 74 comprises lead 84 and 86, so that for magnetic medium is read and writes down sensor is started.Sensor 74 is deposited on the substrate 90 with the structure of the row and column shown in Fig. 4 A, and row is described no longer explanation herein with the structure of row with reference to Fig. 4 A.
Continue to discuss the formation of combine and assemble part 30 of the present invention with Fig. 5 B.After having deposited sensor 74, substrate 90 is divided into a plurality of row's parts, expresses by score 94 and separates down one from wafer substrate 90 and arrange part 92.A plurality of sensors 74 are drawn together in every package.Fig. 6 has represented the further skeleton view of this row's part 92.
With reference to Fig. 6, to make sensor 74 and going between 84 and at 86 o'clock, a strippable coating 94 at first is deposited, so that the layer of sensor 74 is isolated with wafer substrate.The row 92 of Fig. 6 is processed to the shape shown in Fig. 5 A then.The top of the substrate sections of the layer row of being deposited over 92 of supporting part 70 to form a preferred embodiment of supporting part 70 on row 92 and sensor 74, has provided more detailed description below in conjunction with Fig. 7 A and 7B.
With reference to Fig. 7 A and 7B, in this embodiment, supporting part 70 is isolated by the strippable coating 96 and the substrate sections 93 of row's part 92.The used material of the material of strippable coating 96 and strippable coating 94 is same or similar.Desirable strippable coating is the Rhometal of electroplating, and other material that can be used as strippable coating comprises copper or chromium.
On strippable coating 96, form the layer of supporting part 70.These layers can be the layers shown in Fig. 5 A.Binding post 97 is connected with 86 lead 84 with 98 with the conductor of conductive layer.If desired, can comprise ground plane shown in Fig. 7 B.In Fig. 7 B, insulation course 76 is deposited on the strippable coating 96.First ground plane layer 99 can be deposited on this insulation course 76.Another insulation course 76A is deposited on the ground plane layer 99 then.Back deposited conductor layer 78 again, and obviously, conductor layer 78 comprises that each sensor of a plurality of conductors has two at least as conductor 78A and 78B among Fig. 7 A.81 pairs of combine and assemble parts of supporting supporting layer provide the support of class sheet spring, and can comprise the layer 80 and 82 of Fig. 5 A.Another ground plane (not shown) can deposit on the top that is deposited on another insulation course on the conductor layer 78.Top ground plane provides good insulation and stress symmetric, and dealing with thermal mismatching, and in some applications, the two all needs.Binding post 89 is connected to the gang socket 88 of Fig. 5 A with the conductor of conductive layer 78, only expresses two in Fig. 7 A.
Notice that supporting part 70 and Sensor section 72 are overlapping and bonding mutually under the situation of not inserting strippable coating.This step provides the thick material of a bending.Utilize strippable coating 94 and 96, permission will be arranged the substrate 93 of part 92 and be removed from the combine and assemble part, only stay supporting part 70 and any supporting layer of supporting to have the sensor 72 that is connected lead.Thus, produce the extremely light supporting system that has sensor.
Strippable coating is divesting of Rhometal layer for example, as for example adopt that ammonium persulfate is to be easy to realize, but it does not play destruction to the aluminium that is generally used for making in the sensor step.
The reinforcement of supporting system can realize that in the state shown in Fig. 7 A and the 7B, the thickness of supporting part 70 is uniformly, but in some applications, requires this thickness distribution to change for adapting to concrete application by the thickness distribution that for example changes supporting part 70.Incorgruous rigidity can assign to realize by for example making corrugated part along the length of supporting part 70.
Fig. 8 represents to have complete row's part of not wishing the unnecessary substrate sections wanting and will remove, kerf 112 makes a combine and assemble part 30 separate from row's part, and this combine and assemble part reservation comprises the supporting part 114 of itself, the Slipper 116 of self and the combine and assemble part of the sensor of self 118.Other kerf then makes remaining combine and assemble part separate, in case made such combine and assemble part, it is introduced the rigid disks reader is to realize easily, also is conspicuous to those of ordinary skills, and such disk reader has been described in United States Patent (USP) 3849800.
When only needing, guarantee among the embodiment of sensor near the supporting member of medium, form an active material devices on the supporting member, this active material can be to comprise piezo-electric device, send a telegraph a kind of in several known devices of retractor device or well heater, but is not limited only to these devices.Active material devices control supporting member itself, thus be easy to the contact that sensor was read/write down in realization, also have other embodiment to adopt and contain the supporting member of electric strip line so that be connected with sensor.By changing the thickness of supporting member, the selectivity reinforcement of supporting member is to realize easily.This characteristic allows supporting member to be retrofited, to adapt to the needs of concrete application.
Another removes the scheme that contains the substrate that has deposited the rows of sensors part is to remove substrate by the etching of grinding or other method.With the example of Fig. 7 B as this scheme, wherein, do not adopt strippable coating 94, be unnecessary substrate 93 to be removed on the contrary by grinding or other suitable excision technology.By this technology, the part of substrate can stay as the matrix of sensor 72 and support Slipper.If require sensor to be suspended on the magnetic medium of disk by the air cushion supporting, then this method is useful especially.
Said here scheme has been created condition for production has very the supporting member of high yield---slide block---sensor combinations assembly parts product.Adjacent system can carry out photoetching composition by the film to deposition and come separately, has therefore eliminated the kerf gap, and same, thin-film head depth height is determined by lithographic printing, because have only the thickness of supporting system material just need grind or etch into required length.
Although the present invention shows particularly and illustrate by having done with reference to some preferred embodiments, should be appreciated that for a person skilled in the art and under the situation that does not break away from the spirit and scope of the present invention, can make the change of various forms and details.For example, a kind of sensor is made on wafer can be in the United States Patent (USP) 4190872 that transfers the assignee of the present invention said.The preparation material of this wafer is the theme of the United States Patent (USP) 4251841 of Jacobs.In accordance with the preferred embodiment, supporting part can be any in several structures such as the bilayer that is formed by the metal level on polyimide material and its, supports needed enough elasticity of assembly parts and rigidity to provide.Should be noted that supporting assembly parts also can make with individual layer, as long as this individual layer has correct thickness and rigidity.Know clearly that also many conductive materials can be used for making circuit and sensor conductor.Copper or gold are preferable material, but many other materials also generally acknowledged being suitable in this technology.Though at this air-supported surperficial slide block has been discussed, the present invention also comprises the contact history slide block, wherein the air-supported surface of slide block is any surface that is suitable for, and it can contact with medium at run duration.A horizon sensor has been shown, yet the present invention also can use vertical reference in the preferred embodiment, wherein this slide block except that sensor---the set of bearings component is by disclosed technology manufacturing.The only product of vertical-type sensor coverlet adheres to slide block then---on the set of bearings component.
Claims (48)
1. method of processing combination sensor and supporting member assembly is characterized in that may further comprise the steps:
Provide a thickness to equal the wafer substrate of required supporting member length;
Pattern with row and column on described wafer substrate first type surface forms a plurality of sensors and sensor conductor lead-in wire;
Isolate a capable part from described wafer substrate, make each row part have a plurality of sensors, wherein every row are got a sensor;
By at the separation side deposit of the row part of being separated one deck resilient material at least, on described separation side, form a supporting member part;
The conductive component that formation is extended to the opposite end of described supporting member part from sensor;
Remove unwanted part on the wafer substrate;
Described row part is separated into single sensor, and each sensor has the relevant portion of described supporting member part.
2. according to the method for claim 1, it is characterized in that the step that forms conductive component comprises that electrical conductor material thin layer of deposit is to be provided with the step of electric connecting part, these electric connecting parts are formed in the deposition materials of one deck at least of described supporting member part, and extend to described sensor conductor lead-in wire from the described opposite end of described supporting member part, thereby link is electrically coupled to described sensor.
3. according to the method for claim 2, it is characterized in that also comprising after the step that forms the supporting member part: form an integrated amplifier near place, described opposite end on described supporting member part, it is electrically connected with described electric connecting part.
4. according to the method for claim 1, it is characterized in that removing do not need part on the wafer substrate step for each sensor stays next slider support part.
5. according to the method for claim 1, it is characterized in that:
The step that forms a plurality of sensors and sensor conductor lead-in wire may further comprise the steps:
On a first type surface of described substrate, form first peel ply;
On described first peel ply, form a supporting layer; And
The a plurality of thin film sensors of formation that on described supporting layer, have the sensor conductor lead-in wire with the pattern of row and column;
The step that forms the supporting member part may further comprise the steps:
Forming second peel ply on the side with the separating of row part of first type surface being separated of facing mutually, described second peel ply extends to the opposite end of this row part of separating from first peel ply; And
By at least one thin layer resilient material of deposit on second peel ply, form a supporting member part;
Removing does not need the step of part to comprise the step of dissolving first and second peel plies.
6. according to the method for claim 5, it is characterized in that the step that forms conductive component comprises that electrical conductor material thin layer of deposit is to be provided with the step of electric connecting part, these electric connecting parts are formed in the deposition materials of one deck at least of described supporting member part, and extend to described sensor conductor lead-in wire from the described opposite end of described supporting member part.
7. according to the method for claim 6, it is characterized in that also being included in the step that forms an integrated amplifier on the described supporting member part near place, described opposite end after the step that forms the supporting member part, this amplifier is electrically connected with described electric connecting part.
8. according to the method for claim 5, before dissolving first and second peel plies, also be included in and form an active material devices on the supporting course.
9. make the integrated tongue supporting member and the method for sensor for one kind, may further comprise the steps:
Substrate with plane is set;
Construct described sensor by on described plane, forming thin layer;
Formation has the substrate of substrate edge and has the sensor at sensor edge, make substrate edge near described plane and with described sensor edge coplane in fact;
On substrate edge and sensor edge, form described tongue supporting member; And
Remove the described substrate of at least a portion.
10. method of making disc driver is characterized in that may further comprise the steps:
Make integrated tongue supporting member and sensor according to following steps:
Substrate with plane is set;
Construct described sensor by on described plane, forming thin layer;
Formation has the substrate of substrate edge and has the sensing at sensor edge
Device makes substrate edge near described plane and real with described sensor edge
Coplane on the matter;
On substrate edge and sensor edge, form described tongue supporting member; With
And
Remove the described substrate of at least a portion;
This method of making disc driver is further comprising the steps of:
Disk by main shaft support is set, and is provided for the device of rotating spindle and institute's supporting disk;
An actuator is set, and actuator has an actuator arm; And
Integrated tongue supporting member and sensor are installed on the actuator arm feasible sensor can being navigated near the loop turn on the disk.
11., it is characterized in that comprising step according to the method for claim 9:
Substrate thickness is set to and tongue supporting member equal in length.
12., it is characterized in that comprising step according to the method for claim 9:
A wafer substrate that comprises a plurality of described substrates is set;
Structure is embarked on journey into the sensor of row on described wafer substrate;
Wafer substrate is cut into the sensor row of separation, thereby a delegation's substrate edge and a line sensor edge are provided, this row substrate edge comprises a plurality of described substrate edges, and this line sensor edge comprises a plurality of described sensors edge;
Form delegation's tongue supporting member, this row tongue supporting member is included in a plurality of described tongue supporting member on this row substrate edge and this line sensor edge; And
With capable each substrate that is cut into of substrate, make each substrate support described integrated tongue supporting member and sensor.
13., it is characterized in that may further comprise the steps according to the method for claim 12:
Substrate thickness is set to and tongue supporting member equal in length.
14., it is characterized in that may further comprise the steps according to the method for claim 9:
Before the described sensor of structure, on substrate plane, form a sensor peel ply, structure sensor on the sensor peel ply then;
Before forming described tongue supporting member, on substrate edge, form the supporting member peel ply so that be connected with the sensor peel ply, on the supporting member peel ply, form the tongue supporting member then; And
Dissolving supporting member peel ply and sensor peel ply are isolated tongue supporting member and sensor from substrate.
15. the method according to claim 9 is characterized in that:
The step of structure sensor comprises: at least one thin layer of deposit on the sensor peel ply, so that form the sensor lead that extends to the sensor edge; And
The step that forms the tongue supporting member comprises: at least one thin layer of deposit on the supporting member layer, so that form the lead wire of conductor that extends and be connected with described sensor lead along the tongue supporting member at described sensor edge.
16., it is characterized in that may further comprise the steps according to the method for claim 15:
A wafer substrate that comprises a plurality of described substrates is set;
Structure is embarked on journey into the sensor of row on described wafer substrate;
Wafer substrate is cut into the sensor row of separation, thereby a delegation's substrate edge and a line sensor edge are provided, this row substrate edge comprises a plurality of described substrate edges, and this line sensor edge comprises a plurality of described sensors edge;
Form delegation's tongue supporting member, this row tongue supporting member is included in a plurality of described tongue supporting member on this row substrate edge and this line sensor edge; And
With capable each substrate that is cut into of substrate, make each substrate support described integrated tongue supporting member and sensor.
17. the method according to claim 15 is characterized in that:
The step that forms the lead wire of conductor that is connected with sensor lead comprises: form binding post, binding post makes lead wire of conductor and sensor lead interconnection.
18., it is characterized in that may further comprise the steps according to the method for claim 15:
Form the contact on the tongue supporting member, each contact has one and is embedded in the tongue supporting member and the end that contacts with corresponding lead wire of conductor, and an exposed ends that is exposed to external environment condition.
19., it is characterized in that may further comprise the steps according to the method for claim 18:
Integrated circuit is installed on the tongue supporting member, contacts with the exposed ends of described contact.
20. the method according to claim 9 is characterized in that:
The step that forms the tongue supporting member comprises: form a plurality of vertical thin retes, these vertical thin retes are perpendicular to the thin layer of sensor, and an end of vertical thin rete covers described sensor edge and mechanical connection with it.
21., it is characterized in that may further comprise the steps according to the method for claim 20:
Form one or more vertical thin retes, as the supporting layer that supports sensor.
22. the method according to claim 20 is characterized in that:
The step of structure sensor comprises: at least one thin layer of deposit on the sensor peel ply, so that form the sensor lead that extends to the sensor edge; And
The step that forms the tongue supporting member comprises: at least one thin layer of deposit on the supporting member layer, so that form the lead wire of conductor that extends and be connected with described sensor lead along the tongue supporting member at described sensor edge.
23., it is characterized in that may further comprise the steps according to the method for claim 22:
Form the ground floor in the vertical thin rete, as on-chip insulation support layer;
Form the second layer in the vertical thin rete, as the described lead wire of conductor on the described insulation support layer; And
Form the 3rd layer in the vertical thin rete, as the insulation support layer on the described lead wire of conductor.
24., it is characterized in that may further comprise the steps according to the method for claim 22:
Before the described sensor of structure, on substrate plane, form a sensor peel ply, structure sensor on the sensor peel ply then;
Before forming described tongue supporting member, on substrate edge, form the supporting member peel ply so that be connected with the sensor peel ply, on the supporting member peel ply, form the tongue supporting member then; And
Dissolving supporting member peel ply and sensor peel ply are isolated tongue supporting member and sensor from substrate.
25., it is characterized in that comprising step according to the method for claim 24:
A wafer substrate that comprises a plurality of described substrates is set;
Structure is embarked on journey into the sensor of row on described wafer substrate;
Wafer substrate is cut into the sensor row of separation, thereby a delegation's substrate edge and a line sensor edge are provided, this row substrate edge comprises a plurality of described substrate edges, and this line sensor edge comprises a plurality of described sensors edge;
Form delegation's tongue supporting member, this row tongue supporting member is included in a plurality of described tongue supporting member on this row substrate edge and this line sensor edge; And
With capable each substrate that is cut into of substrate, make each substrate support described integrated tongue supporting member and sensor.
26., it is characterized in that may further comprise the steps according to the method for claim 25:
Substrate thickness is set to and tongue supporting member equal in length.
27., it is characterized in that may further comprise the steps according to the method for claim 24:
On substrate, form the ground floor in the vertical thin rete, as insulation support layer;
On described insulation support layer, form the second layer in the vertical thin rete, as described lead wire of conductor; And
On described lead wire of conductor, form the 3rd layer in the vertical thin rete, as insulation support layer.
28., it is characterized in that may further comprise the steps according to the method for claim 27:
Integrated circuit is installed on the tongue supporting member, contacts with the exposed ends of described contact.
29. the method according to claim 28 is characterized in that:
The step that forms the lead wire of conductor that is connected with sensor lead comprises: form binding post, binding post makes lead wire of conductor and sensor lead interconnection.
30. make the integrated tongue supporting member and the method for sensor pack, it is characterized in that comprising for one kind:
Wafer substrate with plane is set;
The a plurality of thin layers of deposit on described plane form and press a plurality of sensing systems of delegation's arrangement at least;
The cut crystal substrate, so that the sensing system of at least one separate rows is provided on a substrate sections, the sensing system of this separate rows comprises a plurality of sensing systems of arranging with described delegation at least, this sensing system and the substrate sections that is cut into each separate rows provides corresponding cut edge, wherein the cut edge of the sensing system of separate rows and substrate coplane in fact each other;
At least one thin layer of deposit on the cut edge of the sensing system of separate rows and substrate sections is that each sensing system in the sensing system of described separate rows forms a tongue supporting member; And
The sensing system of described substrate sections and described separate rows is cut into independent tongue supporting member and sensing system subassembly.
31., it is characterized in that comprising the step of removing the described substrate sections of at least a portion according to the method for claim 30.
32. a method of making disc driver is characterized in that may further comprise the steps:
Make integrated tongue supporting member and sensor pack according to the following steps:
Wafer substrate with plane is set;
The a plurality of thin layers of deposit on described plane form by delegation's arrangement at least
A plurality of sensing systems;
The cut crystal substrate is so that provide at least one on a substrate sections
The sensing system of separate rows, the sensing system of this separate rows comprises with described
At least a plurality of sensing systems of arranging of delegation, this each separate rows that is cut into
Sensing system and substrate sections corresponding cut edge is provided, wherein divide
The coplane each other from the sensing system of row and the cut edge of substrate;
Deposit on the cut edge of the sensing system of separate rows and substrate sections
At least one thin layer is each biography in the sensing system of described separate rows
The sensor system forms a tongue supporting member;
The sensing system of described substrate sections and described separate rows is cut into list
Only tongue supporting member and sensing system subassembly; And
Remove the described substrate sections of at least a portion;
This method of making disc driver is further comprising the steps of:
Disk by main shaft support is set, and is provided for the device of rotating spindle and institute's supporting disk;
An actuator is set, and actuator has an actuator arm; And
Integrated tongue supporting member and sensor pack are installed on the actuator arm feasible sensor can being navigated near the loop turn on the disk.
33. according to the method for claim 31, it is characterized in that the step of a plurality of thin layers of deposit comprises thin layer of deposit, for described a plurality of sensing systems form sensor lead.
34. the method according to claim 31 is characterized in that:
The step of structure sensor system comprises: at least one thin layer of deposit on the sensor peel ply, so that form the sensor lead at the edge of the sensing system that extends to separate rows; And
The step that forms the tongue supporting member for each sensing system comprises: at least one thin layer of deposit on the supporting member peel ply, so that form the lead wire of conductor that extends and be connected with described sensor lead along each tongue supporting member at the edge of the sensing system of separate rows.
35. the method according to claim 31 is characterized in that:
The step that forms the tongue supporting member for each sensing system comprises: form a plurality of vertical thin retes, these vertical thin retes are perpendicular to the thin layer of sensing system, and an end of vertical thin rete covers the cut edge and the mechanical connection with it of the sensing system of separate rows.
36., it is characterized in that may further comprise the steps according to the method for claim 31:
Wafer substrate thickness is set to and tongue supporting member equal in length.
37. the method according to claim 31 is characterized in that:
The step that forms the lead wire of conductor that is connected with sensor lead comprises: form binding post, binding post makes lead wire of conductor and sensor lead interconnection.
38., it is characterized in that may further comprise the steps according to the method for claim 37:
Form the contact in each tongue supporting member, each contact has one and is embedded in the corresponding tongue supporting member and the end that contacts with corresponding lead wire of conductor, and an exposed ends that is exposed to external environment condition.
39., it is characterized in that may further comprise the steps according to the method for claim 38:
Integrated circuit is installed on each tongue supporting member, contacts with the exposed ends of described contact.
40., it is characterized in that may further comprise the steps according to the method for claim 31:
On wafer substrate, form the ground floor in the vertical thin rete, as insulation support layer;
On described insulation support layer, form the second layer in the vertical thin rete, as described lead wire of conductor; And
On described lead wire of conductor, form the 3rd layer in the vertical thin rete, as insulation support layer.
41., it is characterized in that may further comprise the steps according to the method for claim 31:
Before the described sensing system of structure, on the wafer substrate plane, form a sensor peel ply, on the sensor peel ply, form sensing system then;
Before forming described tongue supporting member for each sensing system, only on the edge of substrate sections, form the supporting member peel ply, so that the supporting member peel ply is connected with the sensor peel ply, on the supporting member peel ply, form the tongue supporting member then for each sensing system; And
Dissolving supporting member peel ply and sensor peel ply are isolated tongue supporting member and sensing system subassembly from substrate sections.
42. the method according to claim 41 is characterized in that:
The step of structure sensor system comprises: at least one thin layer of deposit on the sensor peel ply, so that form the sensor lead at the edge of the sensing system that extends to separate rows; And
The step that forms the tongue supporting member for each sensing system comprises: at least one thin layer of deposit on the supporting member peel ply, so that form the lead wire of conductor that extends and be connected with described sensor lead along each tongue supporting member at the edge of the sensing system of separate rows.
43. the method according to claim 42 is characterized in that:
The step that forms the tongue supporting member for each sensing system comprises: form a plurality of vertical thin retes, these vertical thin retes are perpendicular to the thin layer of sensing system, and an end of vertical thin rete covers the cut edge and the mechanical connection with it of the sensing system of separate rows.
44., it is characterized in that may further comprise the steps according to the method for claim 43:
Wafer substrate thickness is set to and tongue supporting member equal in length.
45. the method according to claim 44 is characterized in that:
The step that forms the lead wire of conductor that is connected with sensor lead comprises: form binding post, binding post makes lead wire of conductor and sensor lead interconnection.
46., it is characterized in that may further comprise the steps according to the method for claim 45:
Form the contact in each tongue supporting member, each contact has one and is embedded in the corresponding tongue supporting member and the end that contacts with corresponding lead wire of conductor, and an exposed ends that is exposed to external environment condition.
47., it is characterized in that may further comprise the steps according to the method for claim 46:
On wafer substrate, form the ground floor in the vertical thin rete, as insulation support layer;
On described insulation support layer, form the second layer in the vertical thin rete, as described lead wire of conductor; And
On described lead wire of conductor, form the 3rd layer in the vertical thin rete, as insulation support layer.
48., it is characterized in that may further comprise the steps according to the method for claim 47:
Integrated circuit is installed on each tongue supporting member, contacts with the exposed ends of described contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN93118811A CN1129893C (en) | 1993-08-28 | 1993-08-28 | Magnetic head for recording with ultra low force |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN93118811A CN1129893C (en) | 1993-08-28 | 1993-08-28 | Magnetic head for recording with ultra low force |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1099894A CN1099894A (en) | 1995-03-08 |
| CN1129893C true CN1129893C (en) | 2003-12-03 |
Family
ID=4992661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN93118811A Expired - Fee Related CN1129893C (en) | 1993-08-28 | 1993-08-28 | Magnetic head for recording with ultra low force |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1129893C (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1004036B (en) * | 1985-12-23 | 1989-04-26 | 株式会社日立制作所 | For the gearing of disk drive |
| CN1012114B (en) * | 1985-10-15 | 1991-03-20 | 国际商用机器公司 | Expandable suspension for supporting a slider and moving it to the disk in a data recording disk file |
-
1993
- 1993-08-28 CN CN93118811A patent/CN1129893C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1012114B (en) * | 1985-10-15 | 1991-03-20 | 国际商用机器公司 | Expandable suspension for supporting a slider and moving it to the disk in a data recording disk file |
| CN1004036B (en) * | 1985-12-23 | 1989-04-26 | 株式会社日立制作所 | For the gearing of disk drive |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1099894A (en) | 1995-03-08 |
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