CN112987820B - Constant temperature control system for digital power supply module - Google Patents
Constant temperature control system for digital power supply module Download PDFInfo
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- CN112987820B CN112987820B CN202110223344.9A CN202110223344A CN112987820B CN 112987820 B CN112987820 B CN 112987820B CN 202110223344 A CN202110223344 A CN 202110223344A CN 112987820 B CN112987820 B CN 112987820B
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
- G05D23/24—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
Abstract
The invention discloses a constant temperature control system of a digital power supply module, which comprises an upper computer, a singlechip, a temperature acquisition circuit, a logic control circuit, an H-bridge circuit and a semiconductor refrigerator, wherein the temperature acquisition circuit finishes the temperature acquisition of the digital power supply module through a thermistor, the upper computer finishes the temperature setting of the digital power supply module, the singlechip calculates the deviation value of the acquired digital power supply module temperature and a set value through PID to obtain the duty ratio value of a PWM signal, and the PWM signal, an enabling signal and an H-bridge conduction switching signal are sent to HIP2101 to drive an H-bridge to heat and cool a semiconductor TEC refrigerator through signals generated after the logic control circuit. The temperature can stably and accurately reach the set temperature in the temperature control process of the temperature control system, and the temperature control box assists the digital power supply module to dissipate heat and preserve heat, so that the temperature regulation and control effect of the constant temperature control system is improved.
Description
Technical Field
The invention relates to the field of digital power supplies, in particular to a constant temperature control system of a digital power supply module.
Background
The digital power supply takes a Digital Signal Processor (DSP) or a Microcontroller (MCU) as a core, takes a digital power supply driver, a PWM controller and the like as control objects, and can realize power supply products with control, management and monitoring functions. The external characteristics of the switching power supply are changed by setting internal parameters of the switching power supply, and power supply management is added on the basis of power supply control. Power management refers to the efficient distribution of power to the various components of the system to minimize losses. Digital power management (e.g., power sequencing) must all employ digital technology. The main difference of digital power supplies compared to conventional analog power supplies is the control and communication part. The analog power supply product has more advantages in application occasions with simplicity and easiness in use and low requirement on parameter change, because the application pertinence can be realized by hardware solidification, and the digital power supply has advantages in complex high-performance system application with more controllable factors, higher real-time response speed and the need of power supply management of a plurality of analog systems.
Besides the need of successful realization of the functions of the product, the digital power supply product must also fully consider the indexes of the product such as stability, service life, environmental adaptability and the like. The heat flux density of a digital power supply product is increased, a large amount of heat can not be distributed in time to greatly influence the work of equipment, high temperature is the most important fault factor influencing the long-time stable work of a power supply, and the high temperature becomes a stumbling block for the stable work and performance promotion of a system. The main heating components in the digital power supply are semiconductor switch tubes, high-power diodes, high-frequency transformers, filter inductors and other magnetic elements, dummy loads and the like. The excessive temperature rise in the digital power supply equipment can cause the failure of temperature-sensitive semiconductor devices, electrolytic capacitors and other components, and when the temperature exceeds a certain value, the failure rate is increased exponentially. The digital power supply, a kind of equipment with a high-power heating device, has the most important factor influencing the reliability thereof due to temperature, and has strict requirements on the overall thermal design, and the thermal design mainly comprises two aspects: controlling heat productivity and heat dissipation.
The existing digital power supply usually adopts a shell radiating fin for radiating or adopts a built-in radiating fan for auxiliary radiating, the radiating effect is general, the temperature of the power supply still can slowly rise when the power supply works for a long time, meanwhile, the existing digital power supply does not have a heat preservation function, and functional faults are easy to occur in extreme environments (such as polar mountains and the like) with ultra-low temperature, so that the digital power supply module has a certain heat preservation function while having good radiating performance, and the digital power supply module can have a wider application scene. Therefore, there is a need to develop a thermostatic control system that can accurately control the temperature of a digital power supply.
Disclosure of Invention
In order to solve the defects mentioned in the background technology, the invention aims to provide a digital power supply module constant temperature control system, a logic control circuit is used for replacing a special full-bridge rectifier chip, a PWM signal generated by a singlechip, an enabling signal of a temperature control plate and an H-bridge conduction switching signal are matched with the logic circuit to realize the heating and refrigeration of a control semiconductor refrigerator, a variable speed integral separation PID algorithm is adopted to ensure that the temperature can stably reach the set temperature with high precision in the temperature control process, and a constant temperature control box is used for assisting the digital power supply module to dissipate heat and preserve heat, so that the temperature regulation and control effect of the digital power supply module constant temperature control system is improved.
The purpose of the invention can be realized by the following technical scheme:
a digital power module constant temperature control system comprises an upper computer, a single chip microcomputer, a temperature acquisition circuit, a logic control circuit, an H-bridge circuit and a semiconductor refrigerator, wherein the temperature acquisition circuit finishes the temperature acquisition of a digital power module through a thermistor, the temperature setting of the digital power module is finished through the upper computer, the acquired digital power module temperature and a set value deviation value are calculated through the single chip microcomputer through PID to obtain a duty ratio value of a PWM signal, and the PWM signal, an enable signal and a H-bridge conduction switching signal are sent to a HIP2101 to drive the H-bridge to heat and cool a TEC of the semiconductor refrigerator through signals generated after passing through the logic control circuit.
Further preferably, the digital power module constant temperature control system further comprises a constant temperature control box, the constant temperature control box comprises a heat dissipation module and a heat preservation module, the heat dissipation module and the heat preservation module are both electrically connected with the single chip microcomputer, the heat preservation module works when the semiconductor cooler TEC is heated up, and the single chip microcomputer controls the heat dissipation module to work when the semiconductor cooler TEC is cooled down.
Further preferably, the temperature acquisition circuit divides the voltage of the analog power supply VDDA by adopting a 10K omega resistor and a thermistor RT, obtains the voltage of the thermistor RT at the current temperature through the internal A/D conversion of the singlechip, and obtains the measured temperature through the query of a temperature and voltage comparison table of the thermistor RT.
Further preferably, the single chip microcomputer is a minimization system based on STM32F103 RCT.
Further preferably, the H-bridge conduction switching signal in the logic control circuit controls conduction of the H-bridge in different directions to realize heating and cooling of the semiconductor refrigerator, the enable signal controls the semiconductor refrigerator to operate, and the duty ratio of the PWM signal determines the heating and cooling time of the semiconductor refrigerator.
Further preferably, the constant temperature control system controls the temperature through a variable integral PID algorithm, so that the accumulation speed of an integral term is changed, when the temperature deviation is larger, the integral is slowed down, the integral action is weakened, and when the temperature deviation is smaller, the integral is quickened and the integral action is strengthened; the expression of the variable integral PID algorithm is as follows:
in the formulae (I) and (II), e (k) is a deviation.
Further preferably, the constant temperature control box comprises a base, a digital power supply module is fixedly installed in the middle of the top of the base, protective covers are symmetrically arranged above the base, the outer walls of the sides, away from each other, of the protective covers are hinged with the base through hinges, heat preservation layers are arranged on the inner walls of the protective covers, ventilation openings are formed in the front side wall and the rear side wall of each protective cover, air inlet grids are fixedly installed at the positions, corresponding to the ventilation openings, of the outer walls of the front side of each protective cover, exhaust fans are fixedly installed at the positions, corresponding to the ventilation openings, of the outer walls of the rear side of each protective cover, heat preservation plates are symmetrically and fixedly installed at the positions, corresponding to the ventilation openings, of the inner walls of the front side and the rear side of each protective cover, a circulating water tank is fixedly installed in the base, a liquid outlet of the circulating water tank is connected with a liquid inlet end of a booster pump through a pipeline, a liquid outlet end of the booster pump is connected with a liquid inlet end of the heat exchanger through a pipeline, the heat exchanger is fixedly installed in the top plate of the base, and a three-way electromagnetic valve is connected with the liquid outlet end of the heat exchanger, one end of the three-way electromagnetic valve is connected with a liquid inlet of the circulating water tank through a pipeline, the rest one end of the three-way electromagnetic valve is connected with a liquid inlet end of the radiating tube, the radiating tube is fixedly installed on one side below the base, and a liquid outlet end of the radiating tube is connected with the circulating water tank through a pipeline.
Further preferably, the base bottom fixed mounting stabilizer blade, the stabilizer blade is elastic rubber pad, base top fixed mounting ring baffle, and ring baffle sets up between digital power module and protection casing, and the draw-in groove has all been seted up to the close one side edge in protection casing, the equal fixed mounting handle in the close one side in protection casing top.
Further preferably, the size of the heat preservation plate agrees with the lateral wall around the protection casing, the first fixing base of protection casing one side edge fixed mounting and second fixing base are kept away from to the heat preservation plate, fixed mounting gyro wheel on the first fixing base, the protection casing is close to first fixing base one side inner wall fixed mounting deflector, the deflector slope sets up, the domatic roll of gyro wheel along the deflector, articulated L type pole on the second fixing base, corner fixed mounting axis of rotation in the middle of the L type pole, the axis of rotation of L type pole runs through the protection casing lateral wall, L type pole passes through the axis of rotation and is connected with the protection casing lateral wall rotation, second fixing base one end fixed mounting gag lever post is kept away from to the L type pole, protection casing inner wall fixed mounting dead lever of deflector below, pass through spring coupling between dead lever and the gag lever, the spring is couple formula spring.
Further preferably, the motor is fixedly installed in the middle of the outer wall of the side, away from the protective cover, of the protective cover, driving wheels are symmetrically arranged on two sides of the motor and rotatably connected with the side wall of the protective cover, the driving wheels are meshed with an output shaft of the motor through gears, and the driving wheels are connected with a rotating shaft of the L-shaped rod on the same side through a belt.
Further preferably, circulating water tank inner wall fixed mounting heating pipe, heat exchanger are including the heat exchange tube that is the array and arranges, and the heat exchange tube passes through the arc pipe end to end, and the cooling tube is the diameter and is less than mm' S tubular metal resonator, and the base below corresponds cooling tube department and has seted up the radiating groove, and the cooling tube is the S type and encircles the setting in the radiating groove.
The invention has the beneficial effects that:
1. the digital power module constant temperature control system uses the logic control circuit to replace a special full-bridge rectifier chip, and controls the heating and the refrigeration of the semiconductor refrigerator by matching the PWM signal generated by the singlechip, the enabling signal of the temperature control plate and the H-bridge conduction switching signal with the logic circuit, so that only one half bridge of the H-bridge works in the working process of the circuit, the power consumption of the system circuit is reduced, and the efficiency is improved. In the PID algorithm, because the integral separation PID algorithm can generate temperature jitter in the temperature control process when the temperature is controlled in the system, the variable speed integral separation PID algorithm is adopted to ensure that the temperature can stably and accurately reach the set temperature in the temperature control process;
2. the constant temperature control system of the digital power supply module provided by the invention can be used for assisting the digital power supply module in heat dissipation and heat preservation through the constant temperature control box, so that the temperature regulation and control effect of the constant temperature control system of the digital power supply module is improved. Wherein, the vent has been seted up to the protection casing lateral wall, and vent department fixed mounting exhaust fan and air inlet grille take out digital power module surface radiating fin's heat through the exhaust fan, and the effect is better than built-in radiator fan. The protection casing inner wall is provided with the heated board, can slide to vent department by the protection casing top through motor drive heated board when needs keep warm and plug up the vent, improves the heat preservation effect of protection casing. The inside heat exchanger that is equipped with of base roof, the inside circulating water tank that is equipped with of base, pour the circulating liquid in the circulating water tank into the heat exchanger through the booster pump and carry out the heat transfer bottom the digital power module, the circulating liquid after the heat transfer can the diameter reflux through three solenoid valve in circulating water tank also accessible cooling tube cooling hole flows back to circulating water tank to heat dissipation or the heat preservation needs nimble selection according to digital power module, improve digital power module's control by temperature change effect.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
FIG. 1 is an overall block diagram of the digital power module thermostat control system of the present invention;
FIG. 2 is a flow chart of the variable speed integral PID algorithm control of the present invention;
FIG. 3 is a schematic view of the overall construction of the thermostatic control cartridge of the present invention;
FIG. 4 is a front view of the thermostatic control cartridge of the present invention;
FIG. 5 is a left side view of the thermostatic control cartridge of the present invention;
FIG. 6 is a schematic view of the thermostatic control cartridge of the present invention with the protective cover open;
FIG. 7 is a schematic view of the construction of the shield of the present invention;
FIG. 8 is an enlarged schematic view of the invention at position A of FIG. 7;
FIG. 9 is a schematic structural view of the insulation board of the present invention;
fig. 10 is a schematic sectional view of the base of the present invention.
In the figure:
1-base, 2-digital power supply module, 3-protective cover, 301-ventilation opening, 302-clamping groove, 5-air inlet grille, 6-exhaust fan, 7-heat preservation plate, 8-circulating water tank, 9-booster pump, 10-heat exchanger, 11-three-way electromagnetic valve, 12-radiating pipe, 14-supporting foot, 15-annular baffle, 16-handle, 17-first fixing seat, 18-second fixing seat, 19-roller, 20-guide plate, 21-L-shaped rod, 22-limiting rod, 23-fixing rod, 24-spring, 25-motor, 26-driving wheel, 27-heating pipe, 28-heat exchanging pipe, 29-arc pipe and 30-radiating groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "opening," "upper," "lower," "thickness," "top," "middle," "length," "inner," "peripheral," and the like are used in an orientation or positional relationship that is merely for convenience in describing and simplifying the description, and do not indicate or imply that the referenced component or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present invention.
As shown in fig. 1, a digital power module constant temperature control system includes an upper computer, a single chip microcomputer, a temperature acquisition circuit, a logic control circuit, an H-bridge circuit and a semiconductor refrigerator, wherein the temperature acquisition circuit finishes temperature acquisition of a digital power module through a thermistor, finishes temperature setting of the digital power module through the upper computer, obtains a value of duty ratio of a PWM signal by calculating deviation value of acquired digital power module temperature and a set value through PID through the single chip microcomputer, and sends the PWM signal, an enable signal and a H-bridge conduction switching signal to HIP2101 to drive an H-bridge to heat and cool a semiconductor TEC through HIP 2101;
the digital power supply module constant temperature control system further comprises a constant temperature control box, the constant temperature control box comprises a heat dissipation module and a heat preservation module, the heat dissipation module and the heat preservation module are both electrically connected with the single chip microcomputer, the single chip microcomputer works in the heat preservation module when the semiconductor cooler TEC is heated up, and the single chip microcomputer controls the heat dissipation module to work when the semiconductor cooler TEC is cooled down.
The temperature acquisition circuit adopts a 10K omega resistor and a thermistor RT to divide the voltage of an analog power supply VDDA, obtains the voltage of the thermistor RT at the current temperature through the internal A/D conversion of the singlechip, and obtains the measured temperature through inquiring according to a temperature voltage comparison table of the thermistor RT.
The single chip microcomputer is a minimizing system based on STM32F103 RCT.
The H bridge conduction switching signal in the logic control circuit controls conduction of the H bridge in different directions so as to realize heating and refrigeration of the semiconductor refrigerator, the enable signal controls the semiconductor refrigerator to work, and the duty ratio of the PWM signal determines the heating and refrigeration time of the semiconductor refrigerator.
The constant temperature control system controls the temperature through a variable integral PID algorithm (shown in figure 2), so that the accumulation speed of an integral term is changed, when the temperature deviation is large, the integral is slowed, the integral effect is weakened, when the temperature deviation is small, the integral is quickened, and the integral effect is strengthened; the expression of the variable integral PID algorithm is as follows:
in the formulae (I) and (II), e (k) is a deviation.
As shown in fig. 3-6, the constant temperature control box comprises a base 1, a digital power module 2 is fixedly installed in the middle of the top of the base 1, a protective cover 3 is symmetrically arranged above the base 1, the outer wall of one side, away from the protective cover 3, of the protective cover is hinged with the base 1 through a hinge, the inner wall of the protective cover 3 is provided with a heat insulation layer, the front side wall and the rear side wall of the protective cover 3 are respectively provided with a vent 301, the outer wall of the front side of the protective cover 3 is fixedly provided with an air inlet grille 5 corresponding to the vent 301, the outer wall of the rear side of the protective cover 3 is fixedly provided with an exhaust fan 6 corresponding to the vent 301, the inner walls of the front side and the rear side of the protective cover 3 are symmetrically and fixedly provided with a heat insulation plate 7 corresponding to the vent 301, the heat insulation plate 7 is connected with the inner wall of the protective cover 3 in a sliding manner, a circulating water tank 8 is fixedly installed inside the base 1, the liquid outlet of the circulating water tank 8 is connected with the liquid inlet end of a booster pump 9 through a pipeline, inside heat exchanger 10 fixed mounting was in base 1's roof, the play liquid end of heat exchanger 10 was connected with three solenoid valve 11, and 11 one end of three solenoid valve are passed through the pipeline and are connected with 8 inlet of circulation tank, and the remaining one end of three solenoid valve 11 is connected with the inlet end of cooling tube 12, and cooling tube 12 fixed mounting is in base 1 below one side, and the play liquid end of cooling tube 12 is passed through the pipeline and is connected with circulation tank 8.
As shown in figure 7 of the drawings, 8 it is shown, the size of heated board 7 agrees with 3 preceding back side walls of protection casing, 3 one side edge fixed mounting first fixing base 17 and second fixing base 18 of protection casing are kept away from to heated board 7, fixed mounting gyro wheel 19 on the first fixing base 17, protection casing 3 is close to first fixing base 17 one side inner wall fixed mounting deflector 20, the slope setting of deflector 20, gyro wheel 19 rolls along the domatic of deflector 20, articulated L type pole 21 on the second fixing base 18, corner fixed mounting axis of rotation in the middle of the L type pole 21, 3 lateral walls of protection casing are run through to the axis of rotation of L type pole 21, L type pole 21 rotates with 3 lateral walls of protection casing through the axis of rotation and is connected, second fixing base 18 one end fixed mounting gag lever post 22 is kept away from to L type pole 21, 3 inner wall fixed mounting dead levers 23 of protection casing of deflector 20 below, connect through spring 24 between dead lever 23 and the gag lever post 22, spring 24 is couple spring type spring.
As shown in fig. 9, a motor 25 is fixedly installed in the middle of the outer wall of the opposite side of the protective cover 3, driving wheels 26 are symmetrically arranged on two sides of the motor 25, the driving wheels 26 are rotatably connected with the side wall of the protective cover 3, the driving wheels 26 are all meshed with the output shaft of the motor 25 through gears, and the driving wheels 26 are connected with the rotating shaft of the L-shaped rod 21 on the same side through a belt.
As shown in fig. 10, a heating pipe 27 is fixedly installed on the inner wall of the circulating water tank 8, the heat exchanger 10 includes heat exchange pipes 28 arranged in an array, the heat exchange pipes 28 are connected end to end through arc pipes 29, the cooling pipe 12 is a metal pipe with a diameter smaller than 5mm, a heat dissipation groove 30 is formed in a position below the base 1 corresponding to the cooling pipe 12, and the cooling pipe 12 is arranged in the heat dissipation groove 30 in an S-shaped surrounding manner.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.
Claims (8)
1. A digital power module constant temperature control system is characterized by comprising an upper computer, a single chip microcomputer, a temperature acquisition circuit, a logic control circuit, an H-bridge circuit and a semiconductor refrigerator, wherein the temperature acquisition circuit finishes the temperature acquisition of a digital power module through a thermistor, finishes the temperature setting of the digital power module through the upper computer, obtains the duty ratio value of a PWM (pulse width modulation) signal after PID (proportion integration differentiation) calculation of the acquired digital power module temperature and a set value deviation value through the single chip microcomputer, and sends the PWM signal, an enabling signal and an H-bridge conduction switching signal to an HIP2101 to drive an H-bridge to heat and cool a semiconductor TEC;
the digital power supply module constant temperature control system further comprises a constant temperature control box, the constant temperature control box comprises a heat dissipation module and a heat preservation module, the heat dissipation module and the heat preservation module are both electrically connected with the single chip microcomputer, the heat preservation module works when the semiconductor refrigerator TEC is heated up, and the single chip microcomputer controls the heat dissipation module to work when the semiconductor refrigerator TEC is cooled down;
the thermostatic control box comprises a base (1), a digital power supply module (2) is fixedly installed in the middle of the top of the base (1), a protective cover (3) is symmetrically arranged above the base (1), the protective cover (3) is hinged to the base (1) through a hinge from one outer wall, a heat preservation layer is arranged on the inner wall of the protective cover (3), vents (301) are formed in the front side wall and the rear side wall of the protective cover (3), air inlet grids (5) are fixedly installed at positions, corresponding to the vents (301), of the outer wall of the front side of the protective cover (3), exhaust fans (6) are fixedly installed at positions, corresponding to the vents (301), of the outer wall of the rear side of the protective cover (3), insulation boards (7) are symmetrically and fixedly installed at positions, corresponding to the vents (301), of the inner wall of the front side and the rear side of the insulation boards (3), the insulation boards (7) are connected with the inner wall of the protective cover (3) in a sliding mode, a circulating water tank (8) is fixedly installed inside the base (1), the liquid outlet of the circulating water tank (8) is connected with the liquid inlet end of the booster pump (9) through a pipeline, the liquid outlet end of the booster pump (9) is connected with the liquid inlet end of the heat exchanger (10) through a pipeline, the heat exchanger (10) is fixedly installed inside the top plate of the base (1), the liquid outlet end of the heat exchanger (10) is connected with the three-way electromagnetic valve (11), one end of the three-way electromagnetic valve (11) is connected with the liquid inlet of the circulating water tank (8) through a pipeline, the rest end of the three-way electromagnetic valve (11) is connected with the liquid inlet end of the radiating pipe (12), the radiating pipe (12) is fixedly installed on one side below the base (1), and the liquid outlet end of the radiating pipe (12) is connected with the circulating water tank (8) through a pipeline;
the size of the heat insulation board (7) is matched with the front side wall and the rear side wall of the protective cover (3), the heat insulation board (7) is far away from the edge of one side of the protective cover (3) and is fixedly provided with a first fixing seat (17) and a second fixing seat (18), a roller (19) is fixedly arranged on the first fixing seat (17), the protective cover (3) is close to the inner wall of one side of the first fixing seat (17) and is fixedly provided with a guide plate (20), the guide plate (20) is obliquely arranged, the roller (19) rolls along the slope surface of the guide plate (20), the second fixing seat (18) is hinged with an L-shaped rod (21), the middle corner of the L-shaped rod (21) is fixedly provided with a rotating shaft, the rotating shaft of the L-shaped rod (21) penetrates through the side wall of the protective cover (3), the L-shaped rod (21) is rotatably connected with the side wall of the protective cover (3) through the rotating shaft, and one end, far away from the second fixing seat (18), of the L-shaped rod (21), is fixedly provided with a limiting rod (22), the safety guard is characterized in that a fixing rod (23) is fixedly installed on the inner wall of the protective guard (3) below the guide plate (20), the fixing rod (23) is connected with a limiting rod (22) through a spring (24), and the spring (24) is a hook type spring.
2. The constant temperature control system of the digital power supply module according to claim 1, wherein the temperature acquisition circuit divides the voltage of the analog power supply VDDA by using a 10K Ω resistor and a thermistor RT, obtains the voltage of the thermistor RT at the current temperature through a/D conversion in a single chip microcomputer, and obtains the measured temperature through a lookup table of the temperature and the voltage of the thermistor RT.
3. The digital power supply module thermostatic control system of claim 1, wherein the single chip microcomputer is a minimization system based on STM32F103 RCT.
4. The thermostatic control system of claim 1, wherein the H bridge conduction switching signal in the logic control circuit controls conduction of the H bridge in different directions to realize heating and cooling of the semiconductor refrigerator, the enable signal controls the semiconductor refrigerator to work, and the duty ratio of the PWM signal determines the heating and cooling time of the semiconductor refrigerator.
5. The thermostatic control system of the digital power supply module according to claim 1, characterized in that the thermostatic control system controls the temperature through a variable integral PID algorithm, so as to change the accumulation speed of an integral term, when the temperature deviation is large, the integral becomes slow, the integral action becomes weak, when the temperature deviation is small, the integral becomes fast, and the integral action becomes strong; the expression of the variable integral PID algorithm is as follows:
in the formulae (I) and (II), e (k) is a deviation.
6. The thermostatic control system for the digital power supply module according to claim 1, characterized in that support legs (14) are fixedly installed at the bottom of the base (1), the support legs (14) are elastic rubber pads, an annular baffle (15) is fixedly installed at the top of the base (1), the annular baffle (15) is arranged between the digital power supply module (2) and the protective cover (3), clamping grooves (302) are formed in the edges of the protective cover (3) close to one side, and a handle (16) is fixedly installed at the edges of the protective cover (3) close to one side.
7. The digital power supply module constant temperature control system according to claim 1, wherein a motor (25) is fixedly installed in the middle of the outer wall of the opposite side of the protection cover (3), driving wheels (26) are symmetrically arranged on two sides of the motor (25), the driving wheels (26) are rotatably connected with the side wall of the protection cover (3), the driving wheels (26) are respectively meshed with an output shaft of the motor (25) through gears, and the driving wheels (26) are connected with the rotating shaft of the L-shaped rod (21) on the same side through belts.
8. The thermostatic control system of the digital power supply module according to claim 1, characterized in that a heating pipe (27) is fixedly installed on the inner wall of the circulating water tank (8), the heat exchanger (10) comprises heat exchange pipes (28) arranged in an array, the heat exchange pipes (28) are connected end to end through arc pipes (29), the cooling pipe (12) is a metal pipe with a diameter smaller than 5mm, a heat dissipation groove (30) is formed below the base (1) corresponding to the cooling pipe (12), and the cooling pipe (12) is arranged in the heat dissipation groove (30) in an S-shaped surrounding manner.
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